NUC8I5BE [INTEL]

Intel NUC Products;
NUC8I5BE
型号: NUC8I5BE
厂家: INTEL    INTEL
描述:

Intel NUC Products

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Intel® NUC Products  
NUC8i3BE/NUC8i5BE/NUC8i7BE  
Technical Product Specification  
Regulatory Models: NUC8BEK (Slim Kit/Mini PC)  
NUC8BEH (Tall Kit/Mini PC)  
NUC8BEB (Board)  
February 2020  
Order Number: K15389-007  
Intel NUC Products NUC8i3BE, NUC8i5BE and NUC8i7BE may contain design defects or errors known as errata that may cause the product to  
deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Products NUC8i3BE/NUC8i5BE/NUC8i7BE  
Specification Update.  
i
Revision History  
Revision  
Revision History  
Date  
001  
First release of Intel NUC Products NUC8i3BE/NUC8i5BE/NUC8i7BE Technical  
Product Specification  
April 2018  
002  
First production release of the Intel NUC Products  
July 2018  
NUC8i3BE/NUC8i5BE/NUC8i7BE Technical Product Specification  
003  
004  
005  
006  
007  
Specification Clarification  
November 2018  
May 2019  
Specification Clarification  
Specification Clarification  
August 2019  
December 2019  
February 2020  
Add new Intel NUC Products NUC8i3BEHS/NUC8i5BEHS  
Update memory capacity for new processors  
Disclaimer  
This product specification applies to only the standard Intel NUC Board, Kit or System with BIOS identifier  
BECFL357.86A.  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR  
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.  
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO  
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR  
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,  
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR  
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL  
INJURY OR DEATH MAY OCCUR.  
All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for  
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC  
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.  
may not be supported without further evaluation by Intel.  
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property  
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does  
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or  
other intellectual property rights.  
Intel may make changes to specifications and product descriptions at any time, without notice.  
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or  
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or  
incompatibilities arising from future changes to them.  
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each  
processor family, not across different processor families: Go to:  
Learn About Intel® Processor Numbers  
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published  
specifications. Current characterized errata are available on request.  
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product  
order.  
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.  
* Other names and brands may be claimed as the property of others.  
Copyright © 2019 Intel Corporation. All rights reserved.  
ii  
 
 
Contents  
Note: For this Technical Product Specification, the use of Intel NUC Products  
NUC8i3BE/NUC8i5BE/NUC8i7BE refers to Intel NUC Kit NUC8i3BEH, Intel NUC Kit NUC8i5BEH, Intel  
NUC Kit NUC8i7BEH, Intel NUC Kit NUC8i3BEHS, Intel NUC Kit NUC8i5BEHS, Intel NUC Kit  
NUC8i3BEK, Intel NUC Kit NUC8i5BEK, Intel NUC Mini PC NUC8i3BEKx, Intel NUC Mini PC  
NUC8i5BEKx, Intel NUC Mini PC NUC8i3BEHx, Intel NUC Mini PC NUC8i5BEHx, Intel NUC Mini PC  
NUC8i7BEHx, and Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB.  
Board Identification Information  
Basic Intel® NUC Board NUC8i3BEB Identification Information  
AA Revision  
J72693-303  
K75955-300  
Notes:  
BIOS Revision  
Notes  
1,2  
BECFL357.86A.0038  
BECFL357.86A.0075  
1,3  
1. The AA number is found on a small label on the SO-DIMM sockets.  
2. The Intel® Core™ i3-8109U processor is used on this AA revision consisting of the following component:  
Device  
Stepping  
S-Spec Numbers  
Intel Core i3-8109U  
D0  
SRCKC  
3. The Intel® Core™ i3-8109U processor is used on this AA revision consisting of the following component:  
Device  
Stepping  
S-Spec Numbers  
Intel Core i3-8140U  
D0  
SRGMN  
Basic Intel® NUC Board NUC8i5BEB Identification Information  
AA Revision  
J72692-303  
K75953-301  
BIOS Revision  
Notes  
1,2  
BECFL357.86A.0038  
BECFL357.86A.0075  
1,3  
Notes:  
1. The AA number is found on a small label on the SO-DIMM sockets.  
2. The Intel® Core™ i5-8259U processor is used on this AA revision consisting of the following component:  
Device  
Stepping  
S-Spec Numbers  
Intel Core i5-8259U  
D0  
SRCKB  
3. The Intel® Core™ i5-8259U processor is used on this AA revision consisting of the following component:  
Device  
Stepping  
S-Spec Numbers  
Intel Core i5-8260U  
D0  
SRGMM  
iii  
 
 
Basic Intel® NUC Board NUC8i7BEB Identification Information  
AA Revision  
J72688-303  
Notes:  
BIOS Revision  
Notes  
BECFL357.86A.0038  
1,2  
1. The AA number is found on a small label on the SO-DIMM sockets.  
2. The Intel® Core™ i7-8559U processor is used on this AA revision consisting of the following component:  
Device  
Stepping  
S-Spec Numbers  
Intel Core i7-8559U  
D0  
SRCK5  
iv  
 
Contents  
Product Identification Information  
Intel® NUC Products NUC8i{x}BE{y}{z}1 Identification Information  
Product Name  
Intel® NUC  
Board  
Differentiating Features  
NUC8i3BEK  
NUC8i3BEH  
NUC8i3BEHXF  
Kit with power adapter  
HDD-capable kit with power adapter  
NUC8i3BEB  
J72693-303  
HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,  
4GB DDR4-2400 SDRAM[2], Microsoft Windows 10 Home, “Intel® NUC  
8 Home, a Mini PC with Windows 10”  
NUC8i5BEK  
NUC8i5BEH  
NUC8i5BEHXF  
Kit with power adapter  
HDD-capable kit with power adapter  
NUC8i5BEB  
J72692-303  
HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,  
4GB DDR4-2400 SDRAM[2], Microsoft Windows 10 Home, “Intel® NUC  
8 Home, a Mini PC with Windows 10”  
NUC8i7BEH  
HDD-capable kit with power adapter  
NUC8i7BEB  
J72688-303  
NUC8i7BEHXG  
32GB Intel® Optane™ Module, 2TB HDD, 8GB DDR4-2400 SDRAM[2]  
Microsoft* Windows* 10 Home, Intel® NUC 8 Enthusiast, a Mini PC  
with Windows 10”  
,
NUC8i3BEHS  
NUC8i5BEHS  
NUC8i3BEB  
K75955-300  
NUC8i5BEB  
K75953-301  
HDD-capable kit with power adapter  
HDD-capable kit with power adapter  
Notes:  
1. Where {x} = 3|5|7; {y} = “K” for “slim kit”, “H” for “tall kit”; and {z} = “XF” | “XG” for “Intel Optane system”  
2. The maximum supported memory speed of the Intel NUC Board NUC8i[x]BEB is 2400 MHz.  
Specification Changes or Clarifications  
The table below indicates the Specification Changes or Specification Clarifications that apply to  
the Intel NUC Products NUC8i3BE, NUC8i5BE and NUC8i7BE.  
Specification Changes or Clarifications  
Date  
Type of Change  
Description of Changes or Clarifications  
November 2018  
Specification  
Clarification  
Added a “Weights” section specifying product weights.  
May 2019  
Specification  
Clarification  
Corrected M.2 slot key designations; added kit dimensions.  
Clarified Board vs System environmental specifications.  
August 2019  
Specification  
Clarification  
December 2019  
February 2020  
Specification Update  
Specification Update  
Added two new processor offerings  
Added increased memory capacities for new processors  
Errata  
Current characterized errata, if any, are documented in a separate Specification Update. See  
http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.  
v
 
 
Preface  
This Technical Product Specification (TPS) specifies the board layout, components, connectors,  
power and environmental requirements, and the BIOS for Intel® NUC Board NUC8i3BEB, Intel®  
NUC Board NUC8i5BEB and Intel® NUC Board NUC8i7BEB.  
Intended Audience  
The TPS is intended to provide detailed, technical information about Intel® NUC Board  
NUC8i3BEB, Intel® NUC Board NUC8i5BEB and Intel® NUC Board NUC8i7BEB and its components  
to the vendors, system integrators, and other engineers and technicians who need this level of  
information. It is specifically not intended for general audiences.  
What This Document Contains  
Chapter  
Description  
1
A description of the features and hardware used on Intel NUC Board NUC8i3BEB, Intel NUC  
Board NUC8i5BEB and Intel NUC Board NUC8i7BEB  
2
3
4
5
A map of the resources of the Intel NUC Board  
The features supported by the BIOS Setup program  
A description of the BIOS error messages, beep codes, and POST codes  
A description of the Intel NUC kit NUC8i3BE[x], Intel NUC kit NUC8i5BE[x] and Intel NUC kit  
NUC8i7BEH features  
Typographical Conventions  
This section contains information about the conventions used in this specification. Not all of  
these symbols and abbreviations appear in all specifications of this type.  
Notes, Cautions, and Warnings  
NOTE  
Notes call attention to important information.  
CAUTION  
Cautions are included to help you avoid damaging hardware or losing data.  
vi  
 
 
 
 
Contents  
Other Common Notation  
#
Used after a signal name to identify an active-low signal (such as USBP0#)  
GB  
Gigabyte (1,073,741,824 bytes)  
Gigabytes per second  
GBps  
Gbps  
KB  
Gigabits per second  
Kilobyte (1024 bytes)  
Kb  
Kilobit (1024 bits)  
kbps  
MB  
1000 bits per second  
Megabyte (1,048,576 bytes)  
Megabytes per second  
MBps  
Mb  
Megabit (1,048,576 bits)  
Mbps  
TDP  
Xxh  
x.x V  
*
Megabits per second  
Thermal Design Power  
An address or data value ending with a lowercase h indicates a hexadecimal value.  
Volts. Voltages are DC unless otherwise specified.  
This symbol is used to indicate third-party brands and names that are the property of their respective  
owners.  
vii  
Contents  
Revision History...............................................................................................................ii  
Disclaimer .................................................................................................................................................................. ii  
Note: For this Technical Product Specification, the use of Intel NUC Products  
NUC8i3BE/NUC8i5BE/NUC8i7BE refers to Intel NUC Kit NUC8i3BEH, Intel NUC Kit  
NUC8i5BEH, Intel NUC Kit NUC8i7BEH, Intel NUC Kit NUC8i3BEK, Intel NUC Kit  
NUC8i5BEK, Intel NUC Mini PC NUC8i3BEKx, Intel NUC Mini PC NUC8i5BEKx, Intel  
NUC Mini PC NUC8i3BEHx, Intel NUC Mini PC NUC8i5BEHx, Intel NUC Mini PC  
NUC8i7BEHx, and Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB............ iii  
Board Identification Information..................................................................................................................... iii  
Product Identification Information.................................................................................................................. v  
Errata............................................................................................................................................................................ v  
Preface ..............................................................................................................................vi  
Intended Audience................................................................................................................................................vi  
What This Document Contains........................................................................................................................vi  
Typographical Conventions ..............................................................................................................................vi  
Contents .........................................................................................................................viii  
1 Product Description ..................................................................................................1  
1.1 Overview .........................................................................................................................................................1  
1.1.1  
1.1.2  
1.1.3  
1.1.4  
Feature Summary .....................................................................................................................1  
Board Layout (Top) ..................................................................................................................3  
Board Layout (Bottom)...........................................................................................................4  
Block Diagram............................................................................................................................6  
1.2 Online Support.............................................................................................................................................7  
1.3 Processor........................................................................................................................................................8  
1.4 System Memory...........................................................................................................................................9  
1.5 Processor Graphics Subsystem..........................................................................................................11  
1.5.1  
Integrated Graphics ..............................................................................................................11  
1.6 USB.................................................................................................................................................................14  
1.7 SATA Interface...........................................................................................................................................14  
1.7.1  
1.7.2  
1.7.3  
AHCI Mode................................................................................................................................15  
Intel® Rapid Storage Technology / SATA RAID .........................................................15  
Intel® Next Generation Storage Acceleration.............................................................15  
1.8 Thunderbolt 3............................................................................................................................................16  
1.9 Real-Time Clock Subsystem................................................................................................................16  
1.10 Audio Subsystem .....................................................................................................................................16  
1.10.1 Audio Subsystem Software ...............................................................................................17  
1.11 LAN Subsystem.........................................................................................................................................17  
viii  
 
Contents  
1.11.1 Intel® I219V Gigabit Ethernet Controller .....................................................................17  
1.11.2 LAN Subsystem Software...................................................................................................18  
1.11.3 RJ-45 LAN Connector with Integrated LEDs..............................................................18  
1.11.4 Wireless Network Module..................................................................................................19  
1.12 Hardware Management Subsystem .................................................................................................19  
1.12.1 Hardware Monitoring...........................................................................................................19  
1.12.2 Fan Monitoring........................................................................................................................19  
1.12.3 Thermal Solution...................................................................................................................19  
1.13 Power Management ................................................................................................................................20  
1.13.1 ACPI.............................................................................................................................................21  
1.13.2 Hardware Support.................................................................................................................23  
1.13.3 Microsoft Modern Standby Support..............................................................................26  
1.14 Intel Platform Security Technologies ..............................................................................................26  
1.14.1 Intel® Virtualization Technology......................................................................................26  
1.14.2 Intel® Platform Trust Technology...................................................................................27  
2 Technical Reference............................................................................................... 28  
2.1 Memory Resources..................................................................................................................................28  
2.1.1  
Addressable Memory...........................................................................................................28  
2.2 Connectors and Headers.......................................................................................................................28  
2.2.1  
2.2.2  
2.2.3  
2.2.4  
Front Panel Connectors......................................................................................................29  
Back Panel Connectors .......................................................................................................29  
Headers and Connectors (Top)........................................................................................30  
Connectors and Headers (Bottom).................................................................................31  
2.3 BIOS Security Jumper ............................................................................................................................41  
2.4 Mechanical Considerations..................................................................................................................43  
2.4.1  
2.4.2  
Form Factor..............................................................................................................................43  
Weights & Dimensions.........................................................................................................44  
2.5 Electrical Considerations ......................................................................................................................44  
2.5.1  
2.5.2  
Power Supply Considerations..........................................................................................44  
Fan Header Current Capability.........................................................................................44  
2.6 Thermal Considerations........................................................................................................................45  
2.7 Reliability .....................................................................................................................................................50  
2.8 Environmental ...........................................................................................................................................50  
3 Overview of BIOS Features................................................................................... 51  
3.1 Introduction................................................................................................................................................51  
3.2 BIOS Flash Memory Organization .....................................................................................................51  
3.3 System Management BIOS (SMBIOS)..............................................................................................51  
3.4 Legacy USB Support ...............................................................................................................................52  
3.5 BIOS Updates.............................................................................................................................................52  
3.5.1  
Language Support.................................................................................................................53  
3.6 BIOS Recovery...........................................................................................................................................53  
3.7 Boot Options..............................................................................................................................................54  
ix  
3.7.1  
3.7.2  
3.7.3  
3.7.4  
Network Boot...........................................................................................................................54  
Booting Without Attached Devices (Headless)..........................................................54  
Changing the Default Boot Device during POST......................................................54  
Power Button Menu..............................................................................................................55  
3.8 Hard Disk Drive Password Security Feature..................................................................................56  
3.9 BIOS Security Features ..........................................................................................................................57  
4 Error Messages and Blink Codes......................................................................... 58  
4.1 Front-panel Power LED Blink Codes................................................................................................58  
4.2 BIOS Error Messages...............................................................................................................................58  
5 Intel NUC Kit Features ........................................................................................... 59  
5.1 Chassis Front Panel Features..............................................................................................................59  
5.3 Chassis Rear Panel Features................................................................................................................61  
x
Contents  
Figures  
Figure 1. Major Board Components (Top) ..........................................................................................................3  
Figure 2. Major Board Components (Bottom)...................................................................................................4  
Figure 3. Block Diagram..............................................................................................................................................6  
Figure 4. Memory Channel and SO-DIMM Configuration..........................................................................10  
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ...............................................................................17  
Figure 6. LAN Connector LED Locations...........................................................................................................18  
Figure 7. Thermal Solution and Fan Header...................................................................................................20  
Figure 8. Location of the Standby Power LED ...............................................................................................25  
Figure 9. Front Panel Connectors........................................................................................................................29  
Figure 10. Back Panel Connectors......................................................................................................................29  
Figure 11. Headers and Connectors (Top).......................................................................................................30  
Figure 12. Connectors and Headers (Bottom) ...............................................................................................31  
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................37  
Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch)39  
Figure 15. Location of the CIR Sensor...............................................................................................................39  
Figure 16. Location of the BIOS Security Jumper ........................................................................................41  
Figure 17. Board Dimensions................................................................................................................................43  
Figure 18. Board Height Dimensions.................................................................................................................44  
Figure 19. Localized High Temperature Zones .............................................................................................46  
Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC8i3BEK/NUC8i5BEK.............47  
Figure 21. Installation area of Thermal Pad for Intel NUC Kit  
NUC8i3BEH/NUC8i5BEH/NUC8i7BEH......................................................................................................48  
Figure 22. Intel NUC Kit NUC8i3BEH/NUC8i5BEH/NUC8i7BEH Features Front...........................59  
Figure 23. Intel NUC Kit NUC8i3BEK/NUC8i5BEK Features Front......................................................60  
Figure 24. Intel NUC Kit NUC8i3BEH/NUC8i5BEH/NUC8i7BEH Features Rear.............................61  
Figure 25. Intel NUC Kit NUC8i3BEK/NUC8i5BEK Features Rear........................................................62  
Tables  
Table 1. Feature Summary........................................................................................................................................1  
Table 2. Components Shown in Figure 1............................................................................................................3  
Table 3. Components Shown in Figure 2............................................................................................................5  
Table 4. Supported Memory Configurations.....................................................................................................9  
Table 5. Unsupported Memory Configurations................................................................................................9  
Table 6. DisplayPort Multi-Streaming Resolutions......................................................................................12  
Table 7. Multiple Display Configuration Maximum Resolutions ............................................................13  
Table 8. Audio Formats Supported by the HDMI and USB Type C Interfaces..................................13  
Table 9. LAN Connector LED States...................................................................................................................18  
Table 10. Effects of Pressing the Power Switch............................................................................................21  
Table 11. Power States and Targeted System Power.................................................................................22  
Table 12. Wake-up Devices and Events...........................................................................................................23  
Table 13. Headers and Connectors Shown in Figure 11...........................................................................30  
Table 14. Connectors and Headers Shown in Figure 12...........................................................................32  
xi  
Table 15. SATA Power Connector (1.25 mm pitch).....................................................................................33  
Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch)...........................................................33  
Table 17. M.2 2280 Module (key type M) Connector..................................................................................33  
Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch)..........................................34  
Table 19. RGB LED Connector (1.25 mm Pitch) ............................................................................................35  
Table 20. CEC Header (1.25 mm pitch).............................................................................................................35  
Table 21. USB Type C Connector.........................................................................................................................36  
Table 22. Front Panel Header (2.0 mm Pitch)................................................................................................36  
Table 23. States for a One-Color Power LED.................................................................................................37  
Table 24. States for a Dual-Color Power LED ................................................................................................37  
Table 25. SDXC Card Reader Connector..........................................................................................................38  
Table 26. HDMI CEC expected behavior............................................................................................................40  
Table 27. RGB LED Options ...................................................................................................................................40  
Table 28. BIOS Security Jumper Settings........................................................................................................42  
Table 29. Select Weights .........................................................................................................................................44  
Table 30. Select Chassis Dimensions .................................................................................................................44  
Table 31. Fan Header Current Capability.........................................................................................................44  
Table 32. Thermal Considerations for Components...................................................................................49  
Table 33. Tcontrol Values for Components ...................................................................................................49  
Table 34. Environmental Specifications...........................................................................................................50  
Table 35. Acceptable Drives/Media Types for BIOS Recovery ...............................................................53  
Table 36. Boot Device Menu Options................................................................................................................54  
Table 37. Master Key and User Hard Drive Password Functions...........................................................56  
Table 38. Supervisor and User Password Functions...................................................................................57  
Table 39. Front-panel Power LED Blink Codes .............................................................................................58  
Table 40. BIOS Error Messages............................................................................................................................58  
Table 41. Components Shown in Figure 22 ...................................................................................................59  
Table 42. Components Shown in Figure 23 ...................................................................................................60  
Table 43. Components Shown in Figure 24 ...................................................................................................61  
Table 44. Components Shown in Figure 25 ...................................................................................................62  
xii  
1
Product Description  
1.1  
Overview  
1.1.1  
Feature Summary  
Table 1 summarizes the major features of Intel® NUC Board NUC8i3BEB, Intel® NUC Board  
NUC8i5BEB and Intel® NUC Board NUC8i7BEB.  
Table 1. Feature Summary  
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)  
Form Factor  
A soldered-down 8th generation Intel® Core™ i3-8109U dual-core processor with a  
maximum 28 W TDP, 3.0 GHz base, 3.6 GHz Turbo, 4 threads  
Intel® Iris™ Plus Graphics 655  
32 GB maximum supported system memory  
Integrated PCH  
Processor  
(one of 5 models)  
A soldered-down 8th generation Intel® Core™ i3-8140U dual-core processor with a  
maximum 25 W TDP, 2.1 GHz base, 3.9 GHz Turbo, 4 threads  
Intel® UHD Graphics 620  
64 GB maximum supported system memory  
Integrated PCH  
A soldered-down 8th generation Intel® Core™ i5-8259U quad-core processor with a  
maximum 28 W TDP, 2.3 GHz base, 3.8 GHz Turbo, 8 threads  
Intel® Iris™ Plus Graphics 655  
32 GB maximum supported system memory  
Integrated PCHA  
A soldered-down 8th generation Intel® Core™ i5-8260U quad-core processor with a  
maximum 25 W TDP, 1.6 GHz base, 3.9 GHz Turbo, 8 threads  
Intel® UHD Graphics 620  
64 GB maximum supported system memory  
Integrated PCHA  
A soldered-down 8th generation Intel® Core™ i7-8559U quad-core processor with a  
maximum 28 W TDP, 2.7 GHz base, 4.5 GHz Turbo, 8 threads  
Intel® Iris™ Plus Graphics 655  
32 GB maximum supported system memory  
Integrated PCH  
Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)  
sockets  
Memory  
Support for DDR4 2400 MHz SO-DIMMs  
Support for 4 Gb and 8 Gb memory technology  
Support for up to 32 GB or 64 GB of system memory (depending on processor; see  
Processor section above) with two SO-DIMMs using 8 Gb memory technology  
Support for non-ECC memory  
Support for 1.2 V low voltage JEDEC memory only  
Note: 2 Gb memory technology (SDRAM Density) is not compatible  
Integrated graphics support for processors with Intel® Graphics Technology:  
One High Definition Multimedia Interface* (HDMI*) back panel connector  
One DisplayPort signal via USB Type C back panel connector  
Graphics  
1
 
Intel® High Definition (Intel® HD) Audio via the HDMI v2.0 and USB Type C interfaces  
through the processor  
Audio  
Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel  
Digital microphone array (DMICS) connector (internal)  
SATA ports:  
Storage  
One SATA 6.0 Gbps port (black) for 2.5“ storage device  
One SATA 6.0 Gbps port is reserved for an M.2 storage module supporting M.2 2242  
and M.2 2280 (key type M) modules  
Note: Supports key type M (PCI Express* x4 and SATA)  
One USB 3.1 (Gen 2/10 Gbps) port implemented via the external back panel Type C  
connector  
Peripheral Interfaces  
USB 3.1 (Gen 2/10 Gbps) Type A ports:  
Two ports are implemented with external front panel connectors (one blue and one  
orange charging capable)  
Two ports are implemented with external back panel connectors (blue)  
USB 2.0 ports:  
Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)  
One port is reserved for the NGFF 1216 Wireless module Bluetooth capability  
Consumer Infrared (CIR)  
One M.2 connector supporting M.2 2242 and M.2 2280 (key type M) modules  
One Micro SDXC slot  
One Thunderbolt3 via back panel USB Type C connector  
Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device  
Expansion Capabilities  
BIOS  
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, System  
Management BIOS (SMBIOS), and Modern Standby  
Suspend to RAM support  
Instantly Available PC  
Technology  
Wake on PCI Express, LAN, front panel, CIR, and USB ports  
Gigabit (10/100/1000 Mbps) LAN subsystem using the Intel® I219V Gigabit Ethernet  
Controller  
LAN  
Hardware Monitor  
Subsystem  
Hardware monitoring subsystem, based on an ITE Tech. IT8987E-VG embedded controller,  
including:  
Voltage sense to detect out of range power supply voltages  
Thermal sense to detect out of range thermal values  
One processor fan header  
Fan sense input used to monitor fan activity  
Fan speed control  
Intel® Dual Band Wireless-AC 9560  
Wireless  
802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 5  
Maximum Transfer speed up to 1.73 Gbps  
Supports Intel® Smart Connect Technology  
Next Generation Form Factor (NGFF) 12x16 soldered-down package  
2
Intel NUC Kit Features  
1.1.2  
Board Layout (Top)  
Figure 1 shows the location of the major components on the top-side of Intel NUC Board  
NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel NUC Board NUC8i7BEB.  
Figure 1. Major Board Components (Top)  
Table 2 lists the components identified in Figure 1.  
Table 2. Components Shown in Figure 1  
Item from Figure 1  
Description  
A
B
C
Thermal solution  
Processor fan header  
Battery connector  
3
 
 
1.1.3  
Board Layout (Bottom)  
Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board  
NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel NUC Board NUC8i7BEB.  
Figure 2. Major Board Components (Bottom)  
4
 
Intel NUC Kit Features  
Table 3. Components Shown in Figure 2  
Item from Figure 2  
Description  
A
B
C
D
E
DC Input Jack  
HDMI connector  
LAN connector  
USB 3.1 ports (blue)  
Digital Microphones (DMICs) header  
Front Panel header  
F
G
H
I
Intel Dual Band Wireless AC + Bluetooth 9560 module  
RGB (HDD) LED header  
Micro SDXC slot  
J
SATA power connector (1.25 mm pitch)  
M.2 connector (key type M) for 2242 and 2280 modules  
Front panel single-port USB 2.0 header (1.25 mm pitch)  
HDD Activity LED  
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Front panel single-port USB 2.0 header (1.25 mm pitch)  
Front panel USB 3.1 connector (blue)  
Standby LED  
Front panel USB 3.1 connector (orange, charging)  
SATA 6.0 Gbps connector  
Front panel stereo microphone/headphone jack  
Consumer Infrared (CIR) sensor  
Front panel power button  
BIOS security header & jumper  
Consumer electronics control (CEC) header  
DDR4 SO-DIMM1 socket  
DDR4 SO-DIMM2 socket  
5
1.1.4  
Block Diagram  
Figure 3 is a block diagram of the major functional areas of the board.  
Figure 3. Block Diagram  
6
 
 
Intel NUC Kit Features  
1.2  
Online Support  
To find information about…  
Visit this Intel web site:  
Intel NUC Board NUC8i3BEB, Intel NUC Board  
NUC8i5BEB, and Intel NUC Board NUC8i7BEB  
http://www.intel.com/NUC  
Intel NUC Support  
http://www.intel.com/NUCSupport  
http://ark.intel.com  
Available configurations for Intel NUC Board  
NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel  
NUC Board NUC8i7BEB  
Product support page NUC8i3BEK  
Product support page NUC8i3BEH  
Product support page NUC8i5BEK  
Product support page NUC8i5BEH  
Product support page NUC8i7BEH  
https://www.intel.com/content/www/us/en/support  
/boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i3bek.html  
http://www.intel.com/content/www/us/en/support  
/boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i3beh.html  
https://www.intel.com/content/www/us/en/support/boards-and-  
kits/intel-nuc-boards/intel-nuc-board-nuc8i5bek.html  
http://www.intel.com/content/www/us/en/support  
/boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i5beh.html  
http://www.intel.com/content/www/us/en/support  
/boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i7beh.html  
BIOS and driver updates  
http://downloadcenter.intel.com  
BIOS and driver updates for NUC8i3BEK  
BIOS and driver updates for NUC8i3BEH  
BIOS and driver updates for NUC8i5BEK  
BIOS and driver updates for NUC8i5BEH  
BIOS and driver updates for NUC8i7BEH  
Tested memory  
https://downloadcenter.intel.com/product/126149  
https://downloadcenter.intel.com/product/126150  
https://downloadcenter.intel.com/product/126147  
https://downloadcenter.intel.com/product/126148  
https://downloadcenter.intel.com/product/126140  
http://www.intel.com/content/www/us/en/support/boards-and-  
kits/ 000027798.html  
Compatible peripherals and components  
https://www.intel.com/content/www/us/en/support/articles/000  
027966.html  
Integration information  
Processor datasheet  
http://www.intel.com/NUCSupport  
http://ark.intel.com  
Regulatory documentation  
https://www.intel.com/content/www/us/en/support/articles/000  
028043.html  
7
1.3  
Processor  
One of the following:  
A soldered-down 8th generation Intel® Core™ i3-8109U dual-core processor with up to a  
maximum 28 W TDP (if thermal margin is available).  
3.0 GHz base frequency, 3.6 GHz turbo frequency, 4 threads  
Intel® Iris™ Plus Graphics 655  
Integrated memory controller  
32 GB maximum supported system memory  
Integrated PCH  
A soldered-down 8th generation Intel® Core™ i3-8140U dual-core processor with up to a  
maximum 25 W TDP (if thermal margin is available).  
2.1 GHz base frequency, 3.9 GHz turbo frequency, 4 threads  
Intel® UHD Graphics 620  
Integrated memory controller  
64 GB maximum supported system memory  
Integrated PCH  
A soldered-down 8th generation Intel® Core™ i5-8259U quad-core processor with up to a  
maximum 28 W TDP (if thermal margin is available).  
2.3 GHz base frequency, 3.8 GHz turbo frequency, 8 threads  
Intel® Iris™ Plus Graphics 655  
Integrated memory controller  
32 GB maximum supported system memory  
Integrated PCH  
A soldered-down 8th generation Intel® Core™ i5-8260U quad-core processor with up to a  
maximum 25 W TDP (if thermal margin is available).  
1.6 GHz base frequency, 3.9 GHz turbo frequency, 8 threads  
Intel® UHD Graphics 620  
Integrated memory controller  
64 GB maximum supported system memory  
Integrated PCH  
A soldered-down 8th generation Intel® Core™ i7-8559U quad-core processor with up to a  
maximum 28 W TDP (if thermal margin is available).  
2.7 GHz base frequency, 4.5 GHz turbo frequency, 8 threads  
Intel® Iris™ Plus Graphics 655  
Integrated memory controller  
32 GB maximum supported system memory  
Integrated PCH  
NOTE  
There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on  
page 44 for information on power supply requirements.  
8
 
Intel NUC Kit Features  
1.4  
System Memory  
The board has two 260-pin SO-DIMM sockets and supports the following memory features:  
1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts  
Two independent memory channels with interleaved mode support  
Unbuffered, single-sided or double-sided SO-DIMMs  
32 GB or 64 GB maximum total system memory, using 8 Gb memory technology (depending  
on processor; see Section 1.3). Refer to Section 2.1.1 on page 28 for information on the total  
amount of addressable memory.  
Minimum recommended total system memory: 2048 MB  
Non-ECC SO-DIMMs  
Serial Presence Detect  
DDR4 2400 MHz SDRAM SO-DIMMs  
Supports 4 Gb and 8Gb memory technology (SDRAM density)  
NOTE  
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be  
populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This  
allows the BIOS to read the SPD data and program the chipset to accurately configure memory  
settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to  
correctly configure the memory settings, but performance and reliability may be impacted or the  
SO-DIMMs may not function under the determined frequency.  
NOTE  
Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB support only 4 Gb and 8 Gb memory  
technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM  
configurations. Table 5 lists the SO-DIMM configurations that are not supported.  
Table 4. Supported Memory Configurations  
SO-DIMM  
Capacity  
2048 MB  
4096 MB  
4096 MB  
8192 MB  
8192 MB  
16384 MB  
SDRAM  
Density  
4 Gbit  
4 Gbit  
8 Gbit  
4 Gbit  
8 Gbit  
8 Gbit  
SDRAM Organization  
Front-side/Back-side  
512 M x4/empty  
512 M x4/512 M x4  
1024 M x4/empty  
512 M x8/512 M x8  
1024 M x4/1024 M x4  
1024 M X8/1024 M x8  
Number of SDRAM  
Devices  
4
8
4
16  
8
Configuration (Note)  
SS  
DS  
SS  
DS  
DS  
DS  
16  
Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.  
Table 5. Unsupported Memory Configurations  
SO-DIMM  
Capacity  
1024 MB  
2048 MB  
2048 MB  
4096 MB  
SDRAM  
Density  
1 Gbit  
1 Gbit  
2 Gbit  
2 Gbit  
SDRAM Organization  
Front-side/Back-side  
128 M x8/empty  
128 M x8/128 M x8  
256 M x8/empty  
Number of SDRAM  
Devices  
8
16  
8
Configuration (Note)  
SS  
DS  
SS  
DS  
256 M x8/256 M x8  
16  
9
 
 
Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.  
For information about…  
Refer to:  
Tested Memory  
http://www.intel.com/content/www/us/en/support/boards-and-  
kits/ 000027798.html  
Figure 4 illustrates the memory channel and SO-DIMM configuration.  
Figure 4. Memory Channel and SO-DIMM Configuration  
10  
 
Intel NUC Kit Features  
1.5  
Processor Graphics Subsystem  
The Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB support graphics through Intel  
Iris™ Plus Graphics 655 or Intel UHD Graphics 620.  
1.5.1  
Integrated Graphics  
The board supports integrated graphics via the processor.  
1.5.1.1  
Intel Graphics Technology  
The Intel graphics controller features the following:  
API support  
Direct3D* 2015, Direct3D 11.2, Direct3D 11.1, Direct3D 9, Direct3D 10, Direct2D  
OpenGL* 4.5 support  
OpenCL* 2.1 , OpenCL 2.0, OpenCL 1.2 support  
Next Generation Intel® Clear Video Technology HD support is a collection of video playback  
and enhancement features that improve the end user’s viewing experience  
Encode/transcode HD content  
Playback of high definition content including Blu-ray* disc  
Superior image quality with sharper, more colorful images  
DirectX* Video Acceleration (DXVA2) support for accelerating video processing  
Full AVC/VC1/MPEG2/HEVC/VP8/VP9/JPEG hardware-accelerated video decode  
Full AVC/MPEG2/HEVC/VP8/JPEG hardware-accelerated video encode  
Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)  
NOTES  
Intel Quick Sync Video is enabled by an appropriate software application.  
HDMI 2.0a is enabled by LSPCON (DP 1.2 to HDMI 2.0a protocol converter); Stereo 3D (S3D)  
technology is not supported.  
HDMI 2.0a supports High Dynamic Range (HDR) and 10-bit sampling. HDR requires use of  
appropriate software and display hardware.  
1.5.1.2  
Video Memory Allocation  
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system  
memory for use as graphics memory to balance 2D/3D graphics and system performance. If your  
computer is configured to use DVMT, graphics memory is allocated based on system  
requirements and application demands (up to the configured maximum amount). When memory  
is no longer needed by an application, the dynamically allocated portion of memory is returned to  
the operating system for other uses.  
11  
1.5.1.3  
High Definition Multimedia Interface* (HDMI*)  
HDMI is supported through a MegaChips MCDP2800-BCT DisplayPort 1.2a to HDMI 2.0 Level  
Shifter/Protocol Converter (LSPCON). The HDMI port supports standard, enhanced, or high  
definition video, plus multi-channel digital audio on a single cable. The port is compatible with all  
ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/192 kHz audio of  
lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24bpp. The  
HDMI port is compliant with the HDMI 2.0a specification.  
For information about  
Refer to  
HDMI technology  
http://www.hdmi.org  
1.5.1.4  
DisplayPort* via USB Type-C  
DisplayPort is a digital communication interface that utilizes differential signaling to achieve a  
high bandwidth bus interface designed to support connections between PCs and monitors,  
projectors, and TV displays. DisplayPort is suitable for display connections between consumer  
electronics devices such as high definition optical disc players, set top boxes, and TV displays.  
The maximum supported resolution is 4096 x 2304 @ 60 Hz, 24bpp. DisplayPort via USB Type C  
connector is compliant with the DisplayPort 1.2 specification.  
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple  
independent video streams (daisy-chain connection with multiple monitors) over a single  
DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this  
feature.  
For information about  
Refer to  
DisplayPort technology  
http://www.displayport.org  
1.5.1.4.1  
DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining  
Table 6 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream  
Transport.  
Table 6. DisplayPort Multi-Streaming Resolutions  
DisplayPort Usage Models  
3 Monitors  
Monitor 1  
Monitor 2  
Monitor 3  
1920 x 1200 @ 60 Hz  
2560 x 1600 @ 60 Hz  
1920 x 1080 @ 60 Hz  
1920 x 1080 @ 60 Hz  
2560 x 1600 @ 60 Hz  
1920 x 1080 @ 60 Hz  
1920 x 1080 @ 60 Hz  
2 Monitors  
3 Monitors  
1920 x 1080 @ 60 Hz  
(with DisplayPort 1.2 hub)  
12  
 
Intel NUC Kit Features  
1.5.1.5  
Multiple DisplayPort and HDMI Configurations  
Multiple DisplayPort and HDMI configurations feature the following:  
Single HDMI 2.0a with 4K @ 60 Hz support  
Single DisplayPort 1.2 with 4K @ 60 Hz support via USB Type C connector  
Two independent displays with 4K @ 60 Hz support  
HDMI and DisplayPort via USB Type C  
Three independent displays with 4K support  
One HDMI 4096 x 2160 @ 60 Hz  
Two DisplayPort 4096 x 2304 @ 30 Hz via USB Type C using DisplayPort Multi-Stream  
Transport capability  
Table 7. Multiple Display Configuration Maximum Resolutions  
Single Display  
HDMI  
Single Display  
DisplayPort via  
USB Type C  
Dual Display  
USB Type C and HDMI  
Triple Display  
USB Type C and HDMI  
4096 x 2160 @ 60 Hz  
4096 x 2304 @ 60 Hz  
4096 x 2304 @ 60 Hz  
(USB Type C/DP)  
4096 x 2160 @ 60 Hz  
(HDMI)  
4096 x 2304 @ 30 Hz (USB Type C/DP MST)  
4096 x 2304 @ 30 Hz (USB Type C/DP MST)  
4096 x 2160 @ 60 Hz (HDMI)  
Note: Higher resolutions may be achievable but only at lower refresh rates  
For information about  
Refer to  
Multiple display maximum  
resolutions  
https://www-  
ssl.intel.com/content/www/us/en/processors/core/CoreTechnicalResources.html  
(Generic link)  
1.5.1.6  
High-bandwidth Digital Content Protection (HDCP)  
HDCP is the technology for protecting high definition content against unauthorized copy or  
interception between a source (computer, digital set top boxes, etc.) and the sink (panels,  
monitor, and TVs). The processor supports HDCP 2.2 for 4k Premium content protection over  
wired displays (USB Type C and HDMI).  
1.5.1.7  
Integrated Audio Provided by the HDMI and USB Type C Interfaces  
The HDMI and USB Type C interfaces from the processor support audio. The processor supports  
two High Definition audio streams on two digital ports simultaneously (the DMA controllers are in  
PCH). The integrated audio processing (DSP) is performed by the PCH.  
Table 8 shows the specific audio technologies supported by the processor.  
Table 8. Audio Formats Supported by the HDMI and USB Type C Interfaces  
Audio Formats  
AC3 Dolby* Digital  
Dolby Digital Plus  
DTS-HD*  
HDMI  
Yes  
USB Type C  
Yes  
Yes  
Yes  
Yes  
Yes  
13  
 
LPCM, 192kHz/24 bit, 8 channel  
Yes  
Yes  
Yes  
Yes  
Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc Audio  
Format)  
1.6  
USB  
The USB port arrangement is as follows:  
USB 3.1 Gen 2 (10 Gbps) Type C port implemented via the external back panel Type C  
connector (maximum current is 3A)  
USB 3.1 Gen 2 (10 Gbps) Type A ports (maximum current is 900 mA for each blue port, 1.5 A  
for the orange charging port):  
Two ports are implemented with external front panel connectors (one blue and one  
orange charging capable)  
Two ports are implemented with external back panel connectors (blue)  
USB 2.0 ports (maximum current is 500 mA for each port of the white header (1 A total):  
Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)  
One port is reserved for the M.2 2230 Wireless module  
All the USB ports are high-speed, full-speed, and low-speed capable.  
NOTE  
Computer systems that have an unshielded cable attached to a USB port may not meet FCC  
Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets  
the requirements for full-speed devices.  
For information about  
Refer to  
The location of the USB connectors on the back panel  
The location of the front panel USB headers  
Figure 9, page 29  
Figure 2, page 4  
1.7  
SATA Interface  
The board provides the following SATA interfaces:  
SATA ports:  
One SATA 6.0 Gbps port for 2.5storage device  
One SATA 6.0 Gbps port is reserved for an M.2 storage module supporting M.2 2242 and  
M.2 2280 (key type M) modules  
The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gbps. A  
point-to-point interface is used for host to device connections.  
14  
Intel NUC Kit Features  
1.7.1  
AHCI Mode  
The board supports AHCI storage mode.  
NOTE  
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 10 includes  
the necessary AHCI drivers without the need to install separate AHCI drivers during the operating  
system installation process; however, it is always good practice to update the AHCI drivers to the  
latest available by Intel.  
1.7.2  
Intel® Rapid Storage Technology / SATA RAID  
The PCH supports Intel® Rapid Storage Technology, providing both AHCI and integrated RAID  
functionality. The RAID capability provides high-performance RAID 0 and 1 functionality on all  
SATA ports. Other RAID features include hot spare support and SMART alerting. Software  
components include an Option ROM for pre-boot configuration and boot functionality, a  
Microsoft Windows compatible driver, and a user interface for configuration and management of  
the RAID capability of the PCH.  
NOTE  
Intel Rapid Storage Technology / SATA RAID is only supported if an M.2 SATA SSD module is used  
with the onboard SATA interface. RAID is not available when using M.2 PCIe SSD module and  
onboard SATA interface.  
1.7.3  
Intel® Next Generation Storage Acceleration  
Intel® Next Generation Storage Acceleration with Intel® Optane™ Technology is a disk caching  
solution that can provide improved computer system performance with improved power savings. It  
allows configuration of a computer system with the advantage of having HDDs for maximum  
storage capacity and with Intel® Optane™ Technology for improved system performance.  
For information about  
Refer to  
Intel® Optane™ Technology  
http://www.intel.com/content/www/us/en/architecture-and-  
technology/non-volatile-memory.html  
NOTE  
In order to use supported RAID and Intel Next Generation Storage Acceleration with Intel®  
Optane™ Technology features, you must first enable RAID in the BIOS.  
15  
1.8  
1.9  
Thunderbolt 3  
The boards support Thunderbolt3 with up to 40 Gbps of data throughput, one 4k (60Hz)  
monitor output, USB3.1 (Gen 2) connection and charging capabilities up to 5V at 3A via the back  
panel USB Type C connector. Item A in Figure 11 shows the location of the rear panel USB Type  
C port.  
For information about  
Refer to  
Compatible Thunderbolt™ 3 devices  
https://www.intel.com/content/www/us/en/support/article  
s/000027966.html  
Thunderbolt™ 3 information  
http://www.intel.com/Thunderbolt  
Real-Time Clock Subsystem  
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer  
is not plugged into a wall socket, the battery has an estimated life of three years. When the  
computer is plugged in, the standby current from the power supply extends the life of the battery.  
The clock is accurate to 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V  
STBY rail.  
NOTE  
If the battery and AC power fail, date and time values will be reset and the user will be notified  
during the POST.  
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS  
RAM (for example, the date and time) might not be accurate. Replace the battery with an  
equivalent one. Figure 1 on page 3 shows the location of the battery.  
CAUTION  
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled  
where possible. Disposal of used batteries must be in accordance with local environmental  
regulations.  
1.10 Audio Subsystem  
The audio subsystem supports the following features:  
Digital microphone array (DMICS) connectors (internal)  
Analog line-out/Analog Headphone/Analog Microphone (front panel jack)  
Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog inputs  
Front Panel Audio Jack Support (see Figure 5 for 3.5 mm audio jack pin out):  
Speakers only (Stereo)  
Headphones only (Stereo)  
Microphone only (mono)  
Combo Headphone (Stereo)/Microphone (mono)  
16  
Intel NUC Kit Features  
Pin Number  
Pin Name  
Tip  
Ring  
Ring  
Sleeve  
Description  
1
2
3
4
Left Audio Out  
Right Audio Out  
Common/Ground  
Audio In/MIC  
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out  
NOTE  
The analog circuit of the front panel audio connector is designed to power headphones or  
amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are  
connected to this output.  
1.10.1  
Audio Subsystem Software  
Audio software and drivers are available from Intel’s web site.  
For information about  
Refer to  
Obtaining Audio software and drivers  
http://downloadcenter.intel.com  
1.11 LAN Subsystem  
The LAN subsystem consists of the following:  
Intel I219V Gigabit Ethernet Controller (10/100/1000 Mbps)  
RJ-45 LAN connector with integrated status LEDs  
Additional features of the LAN subsystem include:  
CSMA/CD protocol engine  
LAN connect interface between the Processor and the LAN controller  
Power management capabilities  
ACPI technology support  
LAN wake capabilities  
LAN subsystem software  
1.11.1  
Intel® I219V Gigabit Ethernet Controller  
The Intel I219V Gigabit Ethernet Controller supports the following features:  
Compliant with the 1 Gbps Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications  
Multi-speed operation: 10/100/1000 Mbps  
Full-duplex operation at 10/100/1000 Mbps; Half-duplex operation at 10/100 Mbps  
17  
Flow control support compliant with the 802.3X specification as well as the specific operation  
of asymmetrical flow control defined by 802.3z  
VLAN support compliant with the 802.3q specification  
Supports Jumbo Frames (up to 9 kB)  
IEEE 1588 supports (Precision Time Protocol)  
MAC address filters: perfect match unicast filters, multicast hash filtering, broadcast filter, and  
promiscuous mode  
Preboot eXecution Environment (PXE): support in both Legacy and UEFI modes. Requires a  
preconfigured PXE server infrastructure.  
1.11.2  
LAN Subsystem Software  
LAN software and drivers are available from Intel’s web site.  
For information about  
Refer to  
Obtaining LAN software and drivers  
http://downloadcenter.intel.com  
1.11.3  
RJ-45 LAN Connector with Integrated LEDs  
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 6).  
Item  
Description  
A
B
Link LED (Green)  
Data Rate LED (Green/Yellow)  
Figure 6. LAN Connector LED Locations  
Table 9 describes the LED states when the board is powered up and the LAN subsystem is  
operating.  
Table 9. LAN Connector LED States  
LED  
LED Color  
LED State  
Off  
Condition  
LAN link is not established.  
LAN link is established.  
Link  
Green  
On  
Blinking  
Off  
LAN activity is occurring.  
10 Mbps data rate is selected.  
100 Mbps data rate is selected.  
1000 Mbps data rate is selected.  
Data Rate  
Green/Yellow  
Green  
Yellow  
18  
 
 
Intel NUC Kit Features  
1.11.4  
Wireless Network Module  
The Intel Dual Band Wireless-AC 9560 module provides hi-speed wireless connectivity with the  
following capabilities:  
Compliant with IEEE 802.11a/b/g/n/ac, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w,  
802.11r, 802.11k specifications  
Wi-Fi CERTIFIED* a/b/g/n/ac with wave 2 features, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*  
Maximum bandwidth of 1.73 Gbps  
Dual Mode Bluetooth® 5  
Downlink MU-MIMO  
2x2: two Transmit and two Receive streams  
160 MHz channels (2.4 GHz, 5 GHz)  
Seamless roaming between access points  
OS certified with Microsoft Windows* 10; limited feature support for Linux*  
Wi-Fi Direct* encryption and authentication (Microsoft Windows only): WPA2-PSK, AES-CCMP  
Wi-Fi Miracast* as Source, Protected Management Frames  
Security Features  
Authentication: WPA* and WPA2*, 802.1X (EAP-TLS, TTLS, PEAP, EAP-SIM, EAP-AKA  
Authentication protocols: PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2  
Encryption: 64-bit and 128-bit WEP, TKIP, 128-bit AES-CCMP  
For information about  
Obtaining WLAN software and drivers  
Full Specifications  
Refer to  
http://downloadcenter.intel.com  
http://intel.com/wireless  
1.12 Hardware Management Subsystem  
The board has several hardware management features, including thermal and voltage monitoring.  
1.12.1  
Hardware Monitoring  
The hardware monitoring and fan control subsystem is based on an ITE Tech. IT8987E-VG  
embedded controller, which supports the following:  
Processor and system ambient temperature monitoring  
Chassis fan speed monitoring  
Voltage monitoring of CPU IO Vcc (+Vccio), Memory Vcc (V_SM), CPU IN Vcc (+Vccp)  
SMBus interface  
1.12.2  
Fan Monitoring  
Fan monitoring can be implemented using third-party software.  
1.12.3  
Thermal Solution  
Figure 7 shows the location of the thermal solution and processor fan header.  
19  
Item  
Description  
A
B
Thermal solution  
Processor fan header  
Figure 7. Thermal Solution and Fan Header  
1.13 Power Management  
Power management is implemented at several levels, including:  
Software support through Advanced Configuration and Power Interface (ACPI)  
Hardware support:  
Power Input  
Instantly Available PC technology  
LAN wake capabilities  
Wake from USB  
WAKE# signal wake-up support  
Wake from S5  
Wake from CIR  
+5 V Standby Power Indicator LED  
Microsoft* Modern Standby* (ACPI Low Power S0 Idle) support  
20  
Intel NUC Kit Features  
1.13.1  
ACPI  
ACPI gives the operating system direct control over the power management and Plug and Play  
functions of a computer. The use of ACPI with this board requires an operating system that  
provides full ACPI support. ACPI features include:  
Plug and Play (including bus and device enumeration)  
Power management control of individual devices, add-in boards (some add-in boards may  
require an ACPI-aware driver), video displays, and hard disk drives  
Methods for achieving less than 15-watt system operation in the power-on/standby  
sleeping state  
A Soft-off feature that enables the operating system to power-off the computer  
Support for multiple wake-up events (see Table 12 on page 23)  
Support for a front panel power and sleep mode switch  
Table 10 lists the system states based on how long the power switch is pressed, depending on  
how ACPI is configured with an ACPI-aware operating system.  
Table 10. Effects of Pressing the Power Switch  
If the system is in this state…  
…and the power switch is pressed for  
…the system enters this state  
Off  
Less than four seconds  
Power-on  
(ACPI G2/G5 Soft off)  
(ACPI G0 working state)  
On  
Less than four seconds  
More than six seconds  
Less than four seconds  
More than six seconds  
Soft-off/Standby  
(ACPI G0 working state)  
(ACPI G1 sleeping state) Note  
On  
Fail safe power-off  
(ACPI G2/G5 Soft off)  
(ACPI G0 working state)  
Sleep  
Wake-up  
(ACPI G0 working state)  
(ACPI G1 sleeping state)  
Sleep  
Power-off  
(ACPI G1 sleeping state)  
(ACPI G2/G5 Soft off)  
Note: Depending on power management settings in the operating system.  
21  
 
1.13.1.1  
System States and Power States  
Under ACPI, the operating system directs all system and device power state transitions. The  
operating system puts devices in and out of low-power states based on user preferences and  
knowledge of how devices are being used by applications. Devices that are not being used can be  
turned off. The operating system uses information from applications and user settings to put the  
system as a whole into a low-power state.  
Table 11 lists the power states supported by the board along with the associated system power  
targets. See the ACPI specification for a complete description of the various system and power  
states.  
Table 11. Power States and Targeted System Power  
Processor  
States  
Targeted System  
Power (Note 1)  
Global States  
Sleeping States  
Device States  
G0 working  
S0 working  
C0 working  
D0 working state.  
Full power > 30 W  
state  
(Note 2)  
G1 sleeping  
state  
S3 Suspend to RAM. No power  
Context saved to  
RAM.  
D3 no power  
except for wake-up  
logic.  
Power < 5 W  
(Note 2)  
G1 sleeping  
state  
S4 Suspend to disk.  
Context saved to disk.  
No power  
No power  
No power  
D3 no power  
except for wake-up  
logic.  
Power < 5 W  
(Note 2)  
G2/S5  
S5 Soft off. Context  
not saved. Cold boot  
is required.  
D3 no power  
except for wake-up  
logic.  
Power < 5 W  
G3 mechanical  
off  
No power to the  
system.  
D3 no power for  
wake-up logic,  
except when  
provided by battery  
or external source.  
No power to the system.  
Service can be performed  
safely.  
AC power is  
disconnected  
from the  
computer.  
Notes:  
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by  
the system chassis’ power supply.  
2. Dependent on the standby power consumption of wake-up devices used in the system.  
22  
 
Intel NUC Kit Features  
1.13.1.2  
Wake-up Devices and Events  
Table 12 lists the devices or specific events that can wake the computer from specific states.  
Table 12. Wake-up Devices and Events  
Devices/events that wake up the system…  
…from this sleep state  
S3, S4, S51  
Comments  
Power switch  
RTC alarm  
LAN  
S3, S4, S51  
Monitor to remain in sleep state  
S3, S4, S51, 3  
“S5 WOL after G3” must be supported;  
monitor to remain in sleep state  
USB  
S3, S4, S51, 2, 3  
S3, S41  
Wake S4, S5 controlled by BIOS option  
(not after G3)  
WAKE#  
Via WAKE; monitor to remain in sleep  
state  
1, 3  
Consumer IR  
Bluetooth  
Will not wake when in Deep S4/S5 sleep  
state  
S3, S4, S5  
N/A  
Wake from Bluetooth is not supported  
Notes:  
1. S4 implies operating system support only.  
2. Will not wake from Deep S4/S5. USB S4/S5 Power is controlled by BIOS. USB S5 wake is controlled by BIOS. USB S4  
wake is controlled by OS driver, not just BIOS option.  
3. Windows 10 Fast startup will block wake from LAN, USB, and CIR from S5.  
NOTE  
The use of these wake-up events from an ACPI state requires an operating system that provides  
full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake  
events.  
1.13.2  
Hardware Support  
The boards provide several power management hardware features, including:  
Wake from Power Button signal  
Instantly Available PC technology  
LAN wake capabilities  
Wake from USB (not after G3)  
WAKE# signal wake-up support  
Wake from S5  
Wake from CIR  
+5 V Standby Power Indicator LED  
NOTE  
The use of Wake from USB from an ACPI state requires an operating system that provides full  
ACPI support.  
23  
 
1.13.2.1  
Power Input  
When resuming from an AC power failure, the computer returns to the power state it was in  
before power was interrupted (on or off). The computer’s response can be set using the Last  
Power State feature in the BIOS Setup program’s Boot menu.  
1.13.2.2  
Instantly Available PC Technology  
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)  
sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is  
only supplying Standby power, and the front panel LED will be amber or secondary color if dual  
colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly  
returns to its last known wake state. Table 12 on page 23 lists the devices and events that can  
wake the computer from the S3 state.  
The use of Instantly Available PC technology requires operating system support and drivers for  
any installed M.2 add-in card.  
1.13.2.3  
LAN Wake Capabilities  
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN  
subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic  
Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.  
1.13.2.4  
Wake from USB  
USB bus activity wakes the computer from an ACPI S3 state (not after G3).  
NOTE  
Wake from USB requires the use of a USB peripheral that supports Wake from USB.  
1.13.2.5  
WAKE# Signal Wake-up Support  
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3  
or S4 state.  
1.13.2.6  
Wake from S5  
When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an  
ACPI S5 state.  
1.13.2.7  
Wake from Consumer IR  
CIR activity wakes the computer from an ACPI S3, S4, or S5 state.  
1.13.2.8  
+5 V Standby Power Indicator LED  
The standby power indicator LED shows that power is still present even when the computer  
appears to be off. Figure 8 shows the location of the standby power LED.  
24  
Intel NUC Kit Features  
CAUTION  
If AC power has been switched off and the standby power indicator is still lit, disconnect the power  
cord before installing or removing any devices connected to the board. Failure to do so could  
damage the board and any attached devices.  
Figure 8. Location of the Standby Power LED  
25  
1.13.3  
Microsoft Modern Standby Support  
Intel NUC Products NUC8i3BE/NUC8i5BE/NUC8i7BE support Windows* 10 Modern Standby,  
Microsoft’s implementation of ACPI low power S0 idle. This allows the system to reduce power  
consumption and only wake when necessary, as for system maintenance tasks or user  
intervention. Modern Standby is required for Wake-on-Voice capability.  
NOTES  
You cannot switch between ACPI S3 and Modern Standby. Standby power model switching is only  
supported with a complete operating system reinstallation. Switching from one standby power  
model to another will prevent the proper functioning of sleep states.  
Updating BIOS or resetting BIOS to defaults will preserve the current standby power model.  
For information about  
Refer to  
Microsoft Modern Standby  
https://docs.microsoft.com/en-us/windows-  
hardware/design/device-experiences/modern-standby  
Intel ACPI Low Power S0 Idle  
http://www.uefi.org/sites/default/files/resources/Intel_ACPI_Low_  
Power_S0_Idle.pdf  
1.14 Intel Platform Security Technologies  
Intel platform security technologies provides tools and resources to help the user protect their  
information by creating a safer computing environment.  
NOTE  
Software with security capability is required to take advantage of Intel platform security  
technologies.  
1.14.1  
Intel® Virtualization Technology  
Intel Virtualization Technology (Intel® VT) is a hardware-assisted technology that, when  
combined with software-based virtualization solutions, provides maximum system utilization by  
consolidating multiple environments into a single server or client.  
NOTE  
A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT  
requires a computer system with a chipset, BIOS, enabling software and/or operating system,  
device drivers, and applications designed for this feature.  
For information about  
Refer to  
Intel Virtualization Technology  
http://www.intel.com/technology/virtualization/technology.htm  
26  
Intel NUC Kit Features  
1.14.2  
Intel® Platform Trust Technology  
Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and  
key management. Intel® PTT supports Microsoft* BitLocker* Drive Encryption for hard drive  
encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM)  
2.0 for client computers.  
NOTE  
Support for fTPM version 2.0 requires a UEFI-enabled operating system, such as Microsoft*  
Windows* 10.  
CAUTION  
BIOS recovery using the BIOS security jumper clears Intel® Platform Trust Technology (Intel® PTT)  
keys. These keys will not be restored after the BIOS recovery. Disable HDD encryption like  
BitLocker and other uses of data encryption and authentication before using BIOS recovery.  
For information about  
Refer to  
Intel Platform Trust Technology  
http://www.intel.com/content/dam/www/public/us/en/documents  
/white-papers/enterprise-security-platform-trust-technology-  
white-paper.pdf  
27  
2
Technical Reference  
2.1  
Memory Resources  
2.1.1  
Addressable Memory  
The board utilizes a maximum of 32 GB or 64 GB of addressable system memory (depending on  
processor). Typically, the address space that is allocated for PCI Conventional bus add-in cards,  
PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the  
top of DRAM (total system memory). On a system that has 32 GB or 64 GB of system memory  
installed, it is not possible to use all the installed memory due to system address space being  
allocated for other system critical functions. These functions include the following:  
BIOS/SPI Flash device (64 Mb)  
Local APIC (19 MB)  
Direct Media Interface (40 MB)  
PCI Express configuration space (256 MB)  
PCH base address registers PCI Express ports (up to 256 MB)  
Memory-mapped I/O that is dynamically allocated for M.2 add-in cards (256 MB)  
Integrated graphics shared memory (up to 512 MB; 64 MB by default)  
The board provides the capability to reclaim the physical memory overlapped by the memory  
mapped I/O logical address space. The board remaps physical memory from the top of usable  
DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just  
above the 4 GB boundary. All installed system memory can be used when there is no overlap of  
system addresses.  
2.2  
Connectors and Headers  
CAUTION  
Only the following connectors and headers have overcurrent protection: back panel and front  
panel USB.  
The other internal connectors and headers are not overcurrent protected and should connect only  
to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these  
connectors or headers to power devices external to the computer’s chassis. A fault in the load  
presented by the external devices could cause damage to the computer, the power cable, and the  
external devices themselves.  
Furthermore, improper connection of USB header single wire connectors may eventually overload  
the overcurrent protection and cause damage to the board.  
28  
Intel NUC Kit Features  
This section describes the board’s connectors and headers. The connectors and headers can be  
divided into these groups:  
Front panel I/O connectors  
Back panel I/O connectors  
2.2.1  
Front Panel Connectors  
Figure 9 shows the location of the front panel connectors for the board.  
Item  
Description  
A
B
C
Front panel power button  
CIR  
Front panel Stereo  
microphone/headphone jack  
D
USB 3.1 (Gen 2) ports (orange charging  
capable)  
E
F
USB 3.1 (Gen 2) (blue)  
HDD LED  
Figure 9. Front Panel Connectors  
2.2.2  
Back Panel Connectors  
Figure 10 shows the location of the back panel connectors for the board.  
Item  
Description  
A
USB Type C (Thunderbolt)  
connector  
B
C
D
E
USB 3.1 (Gen 2) ports (blue)  
LAN  
HDMI 2.0a connector  
12-19 V DC power input jack  
Figure 10. Back Panel Connectors  
29  
 
 
2.2.3  
Headers and Connectors (Top)  
Figure 11 shows the location of the headers and connectors on the top-side of the board.  
Figure 11. Headers and Connectors (Top)  
Table 13 lists the headers and connectors identified in Figure 11.  
Table 13. Headers and Connectors Shown in Figure 11  
Item from Figure 11  
Description  
A
B
Processor fan header  
Battery and header  
30  
 
 
Intel NUC Kit Features  
2.2.4  
Connectors and Headers (Bottom)  
Figure 12 shows the locations of the connectors and headers on the bottom-side of the board.  
Figure 12. Connectors and Headers (Bottom)  
31  
 
Table 14 lists the connectors and headers identified in Figure 12.  
Table 14. Connectors and Headers Shown in Figure 12  
Item from  
Figure 12  
Description  
A
B
C
D
E
F
G
H
I
Digital microphone array connector  
Front panel header  
RGB LED connector  
Micro SDXC slot  
SATA power connector (1.25 mm pitch)  
M.2 connector (key type M) for 2242 and 2280 modules  
Front panel single-port USB 2.0 header (1.25 mm pitch)  
Front panel single-port USB 2.0 header (1.25 mm pitch)  
SATA 6.0 Gbps connector  
J
BIOS security jumper  
K
Consumer electronics control (CEC) header  
32  
 
Intel NUC Kit Features  
2.2.4.1  
Signal Tables for the Connectors and Headers  
Table 15. SATA Power Connector (1.25 mm pitch)  
Pin  
1
Signal Name  
+5 V  
2
+5 V  
3
+3.3 V  
GND  
4
5
GND  
NOTE  
Connector is Molex* part number 53398-0571, 1.25 mm pitch PicoBlade* header, surface mount,  
vertical, lead-free, 5 circuits.  
Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch)  
Pin  
1
Signal Name  
+5 V DC  
D+  
Pin  
2
Signal Name  
D-  
3
4
Ground  
See section 2.2.4.7 for more information on USB 2.0 headers.  
NOTE  
Connector is Molex part number 53398-0471, 1.25 mm pitch PicoBlade header, surface mount,  
vertical, lead-free, 4 circuits.  
Table 17. M.2 2280 Module (key type M) Connector  
Pin  
74  
72  
70  
68  
66  
64  
62  
60  
58  
56  
Signal Name  
3.3V  
Pin  
75  
73  
71  
69  
67  
65  
63  
61  
59  
57  
Signal Name  
GND  
3.3V  
GND  
3.3V  
GND  
SUSCLK(32kHz) (O)(0/3.3V)  
Connector Key  
Connector Key  
Connector Key  
Connector Key  
N/C  
PEDET (NC-PCIe/GND-SATA)  
N/C  
Connector Key  
Connector Key  
Connector Key  
Connector Key  
GND  
N/C  
continued  
33  
Table 17. M.2 2280 Module (key type M) Connector (continued)  
Pin  
54  
52  
50  
48  
46  
44  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
Signal Name  
Pin  
55  
53  
51  
49  
47  
45  
43  
41  
39  
37  
35  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
13  
11  
9
Signal Name  
REFCLKP  
REFCLKN  
GND  
PEWAKE# (I/O)(0/3.3V) or N/C  
CLKREQ# (I/O)(0/3.3V) or N/C  
PERST# (O)(0/3.3V) or N/C  
N/C  
PETp0/SATA-A+  
PETn0/SATA-A-  
GND  
N/C  
N/C  
N/C  
PERp0/SATA-B-  
PERn0/SATA-B+  
GND  
N/C  
DEVSLP (O)  
N/C  
PETp1  
N/C  
PETn1  
N/C  
GND  
N/C  
PERp1  
N/C  
PERn1  
N/C  
GND  
N/C  
PETp2  
N/C  
PETn2  
N/C  
GND  
3.3V  
PERp2  
3.3V  
PERn2  
3.3V  
GND  
3.3V  
PETp3  
DAS/DSS# (I/O)/LED1# (I)(0/3.3V)  
PETn3  
N/C  
N/C  
3.3V  
3.3V  
GND  
6
7
PERp3  
4
5
PERn3  
2
3
GND  
1
GND  
See section 2.2.4.2 for more information on the M.2 connector.  
Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch)  
Pin  
1
Signal Name  
Ground  
2
+3.3 V DC (+3V3_DMIC)  
Clock (DMIC_CLK)  
Data (DMIC_DAT)  
3
4
See section 2.2.4.11 for more information on the DMIC Array connector.  
34  
 
Intel NUC Kit Features  
NOTE  
Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,  
lead-free, 4 circuits.  
Table 19. RGB LED Connector (1.25 mm Pitch)  
Pin  
1
Signal Name  
+5VSB  
2
Red HDD LED  
Green HDD LED  
Blue HDD LED  
3
4
See section 2.2.4.10 for more information on the RGB LED connector.  
NOTE  
Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,  
lead-free, 4 circuits.  
Table 20. CEC Header (1.25 mm pitch)  
Pin  
1
Signal Name  
5VSTBY  
2
GND  
3
PWR_SWITCH#  
HDMI_CEC  
4
See section 2.2.4.9 for more information on the CEC header.  
NOTE  
Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,  
lead-free, 4 circuits.  
35  
 
2.2.4.2 Add-in Card Connectors  
The board supports M.2 2242 and 2280 (key type M) modules.  
Supports M.2 SSD SATA drives  
Maximum bandwidth is approximately 540 MBps  
Supports M.2 SSD Gen 3 PCIe AHCI and NVMe drives (PCIe x1, x2, and x4)  
Using PCIe x4 M.2 SSD maximum bandwidth is approximately 4000 MBps  
2.2.4.3  
USB Type C connector  
The board has several features that are supported via the USB Type C connector.  
Supports USB 3.1 Gen 2.0  
Maximum bandwidth is approximately 10 Gbps  
Supports Display port 1.2  
Maximum bandwidth is approximately 17.28 Gbps  
Supports Thunderbolt 3 PCIe x4 connection  
Maximum bandwidth is approximately 40 Gbps  
Table 21. USB Type C Connector  
Pin  
A12  
A11  
A10  
A9  
Signal Name  
GND2  
Description  
Pin  
B1  
Signal Name  
GND3  
Description  
Ground  
Ground  
RX_P2  
RX_N2  
VBUS2  
SBU1  
High speed receive 2 +  
High speed receive 2 –  
USB bus power  
Sideband use 1  
USB 2.0 data 1 –  
USB 2.0 data 1 +  
Channel config 1  
USB bus power  
High speed transmit 1 +  
High speed transmit 1 –  
Ground  
B2  
TX_P2  
TX_N2  
VBUS3  
CC2  
High speed transmit 2 +  
High speed transmit 2 –  
USB bus power  
Channel config 2  
USB 2.0 data 2 +  
USB 2.0 data 2 –  
Sideband use 2  
USB bus power  
High speed receive 1 –  
High speed receive 1 +  
Ground  
B3  
B4  
A8  
B5  
A7  
DN1  
B6  
DP2  
A6  
DP1  
B7  
DN2  
A5  
CC1  
B8  
SBU2  
A4  
VBUS1  
TX_N1  
TX_P1  
GND1  
B9  
VBUS4  
RX_N1  
RX_P1  
GND4  
A3  
B10  
B11  
B12  
A2  
A1  
2.2.4.4  
Front Panel Header (2.0 mm Pitch)  
This section describes the functions of the front panel header. Table 22 lists the signal names of  
the front panel header. Figure 13 is a connection diagram for the front panel header.  
Table 22. Front Panel Header (2.0 mm Pitch)  
Pin Signal Name  
Description  
Pin Signal Name  
Description  
1
HDD_POWER_LED Pull-up resistor (750 Ω) to  
2
POWER_LED_MAIN [Out] Front panel LED (main  
color)  
+5V  
36  
 
Intel NUC Kit Features  
3
HDD_LED#  
[Out] Hard disk activity  
LED  
4
POWER_LED_ALT  
[Out] Front panel LED (alt color)  
5
7
9
GROUND  
Ground  
6
POWER_SWITCH#  
GROUND  
[In] Power switch  
Ground  
RESET_SWITCH#  
+5V_DC  
[In] Reset switch  
Power  
8
10  
Key  
No pin  
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch)  
Hard Drive Activity LED Pins  
2.2.4.4.1  
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from  
or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive  
connected to an onboard SATA connector.  
2.2.4.4.2  
Reset Switch Pins  
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is  
normally open. When the switch is closed, the board resets and runs the POST.  
2.2.4.4.3  
Power/Sleep LED Pins  
Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 and Table 24 show the  
possible LED states.  
Table 23. States for a One-Color Power LED  
LED State  
Off  
Description  
Power off  
Blinking  
Steady  
Standby  
Normal operation  
Table 24. States for a Dual-Color Power LED  
LED State  
Description  
Power off  
Standby  
Off  
Secondary color blinking  
(amber)  
37  
 
 
Primary color steady (Blue)  
Normal operation  
NOTE  
The LED behavior shown in Table 23 is default other patterns may be set via BIOS setup.  
2.2.4.4.4  
Power Switch Pins  
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch  
must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or  
off. (The time requirement is due to internal debounce circuitry on the board.) At least two  
seconds must pass before the power supply will recognize another on/off signal.  
2.2.4.5  
Micro SDXC Card Reader  
The board has a micro Secure Digital (Micro SD) card reader that supports the Secure Digital  
eXtended Capacity (SDXC) format, 3.01 specification.  
Table 25. SDXC Card Reader Connector  
Pin  
1
Signal Name  
CD  
Descriptive Name  
Card Detection  
Serial Data 1  
Serial Data 0  
Ground  
2
DATA1  
DATA0  
GND  
3
4
5
CLK  
Serial Clock  
Power (3.3 V)  
Command  
6
VDD  
7
CMD  
8
DATA3  
DATA2  
Serial Data 3  
Serial Data 2  
9
2.2.4.6  
Power Supply Connector  
The board has the following power supply connector:  
External Power Supply the board can be powered through a 12-19 V DC connector on the  
back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter)  
and 2.5 mm/ID (inner diameter) plug, where the inner contact is +12-19 (±10%) V DC and the  
shell is GND. The maximum current rating is 10 A.  
NOTE  
External power voltage, 12-19 V DC, is dependent on the type of power adapter used.  
2.2.4.6.1  
Power Sensing Circuit  
The board has a power sensing circuit that:  
Manages CPU power usage to maintain system power consumption below 90 W.  
Designed for use with 90 W AC-DC adapters.  
38  
Intel NUC Kit Features  
NOTE  
It is recommended that you disable this feature (via BIOS option) when using an AC-DC  
adapter greater than 90 W.  
2.2.4.7  
Internal USB 2.0 Single-Port Header (1.25 mm Pitch)  
Figure 14 is a connection diagram for the internal USB header.  
NOTE  
The +5 V DC power on the USB header is fused.  
Use only an internal USB connector that conforms to the USB 2.0 specification for high-speed  
USB devices.  
Figure 14. Connection Diagram for the Internal  
USB 2.0 Single-Port Header (1.25 mm Pitch)  
2.2.4.8  
Consumer Infrared (CIR) Sensor  
The Consumer Infrared (CIR) sensor on the front panel provides features that are designed to  
comply with Microsoft Consumer Infrared usage models (RC-6).  
The CIR feature is made up of the receiving sensor. The receiving sensor consists of a filtered  
translated infrared input compliant with Microsoft CIR specifications.  
Customers are required to provide their own media center compatible remote or smart phone  
application for use with the Intel NUC. Figure 15 shows the location of the CIR sensor.  
Item  
Description  
A
CIR Sensor  
Figure 15. Location of the CIR Sensor  
39  
 
2.2.4.9  
Consumer Electronics Control (CEC) Header  
The board contains two mutually-exclusive methods for controlling HDMI CEC devices:  
External CEC adaptor connected via CEC connector (item K in Figure 12; pinout in Table 20)  
Onboard CEC control from the embedded controller via HDMI cable and BIOS setup. Expected  
behavior is provided in Table 26 below.  
Table 26. HDMI CEC expected behavior  
Activity  
Current Status  
Action  
Expected Behavior  
PC1,2  
TV3  
Wake On TV  
Off  
Off  
TV on  
PC on  
Standby by TV  
On  
On  
Off  
On  
Off  
On  
On  
Off  
On  
Off  
TV Standby  
PC Shutdown  
PC On  
PC sleep or power off4  
TV standby3  
TV on3  
Auto Turn Off TV (S0 -> S5)  
Auto Turn On TV (S5 -> S0)  
Auto Turn Off TV (S0 -> S3)  
Auto Turn On TV (S3 -> S0)  
Notes:  
PC Sleep  
PC On  
TV standby3  
TV on3  
1. HDMI CEC Control enabled in BIOS Setup and in TV setup, if necessary. Please consult your TV’s documentation.  
2. Fast Boot and Deep S4/S5 disabled in BIOS Setup.  
3. Results seen with Panasonic LED TV VIERA TH-40A400W. Other TVs may have different results due to variable implementations of  
CEC features.  
4. PC power off behavior dependent upon power button setting in operating system.  
5. If using external CEC adaptor, onboard CEC control must be disabled in BIOS Setup.  
NOTE  
CEC Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount,  
vertical, lead-free, 4 circuits.  
For information about  
Refer to  
HDMI CEC technology  
http://www.hdmi.org/pdf/whitepaper/DesigningCECintoYourNextH  
DMIProduct.pdf  
2.2.4.10  
RGB LED  
The board supports an RGB LED which is connected through Item C shown in Figure 12. The RGB  
LED is configurable within the BIOS under the Power tab within Advanced settings. Table 22 lists  
the signal names of the RGB LED connector. Table 27 lists the available settings for the RGB LED  
within BIOS.  
Table 27. RGB LED Options  
BIOS Option  
Possible Configurations  
RGB LED Color  
Yellow, cyan, magenta, blue, red, green and white.  
RGB LED Brightness  
0%, 50% 100%  
RGB LED Activity Indicator  
None, Power indicator, HDD Activity or Software defined  
40  
 
 
Intel NUC Kit Features  
2.2.4.11  
Digital Microphone Array  
The digital microphone array consists of dual front facing digital microphones located on either  
side of the front panel to minimize acoustic interference. The digital microphone array is  
intended to be used with a digital assistant like Microsoft’s Cortana*. Item A in Figure 12 shows  
the location of the digital microphone array connector. Table 18 lists the signal names of the  
DMIC connector. See Chapter 5 for the physical location of the DMIC array on the Intel NUC Kit  
NUC8i[x]BEK and Intel NUC Kit NUC8i[x]BEH chassis.  
2.3  
BIOS Security Jumper  
CAUTION  
Do not move a jumper with the power on. Always turn off the power and unplug the power cord  
from the computer before changing a jumper setting. Otherwise, the board could be damaged.  
Figure 16 shows the location of the BIOS Security Jumper. The 3-pin jumper determines the  
BIOS Security program’s mode.  
Error! Reference source not found. describes the jumper settings for the three modes: normal, l  
ockdown, and configuration.  
Figure 16. Location of the BIOS Security Jumper  
41  
 
Table 28 lists the settings for the jumper.  
Table 28. BIOS Security Jumper Settings  
Function/Mode Jumper  
Setting  
Configuration  
Normal  
1-2  
2-3  
The BIOS uses current configuration information and passwords for booting.  
Lockdown  
The BIOS uses current configuration information and passwords for booting, except:  
All POST Hotkeys are suppressed (prompts are not displayed and keys are not accepted. For  
example, F2 for Setup, F10 for the Boot Menu).  
Power Button Menu is not available (see Section 3.7.4 Power Button Menu).  
BIOS updates are not available except for automatic Recovery due to flash corruption.  
Configuration  
None  
BIOS Recovery Update process if a matching *.bio file is found. Recovery Update can be cancelled  
by pressing the Esc key.  
If the Recovery Update was cancelled or a matching *.bio file was not found, a Config Menu will be  
displayed. The Config Menu consists of the following options:  
[1] Suppress this menu until the BIOS Security Jumper is replaced.  
[2] Clear BIOS User and Supervisor Passwords.  
[3] Clear Trusted Platform Module  
Warning: Data encrypted with the TPM will no longer be accessible if the TPM is cleared  
[4] Disable Privacy MSR Bit (Clear MSR C80[0] to 0)  
[5] Enable Privacy MSR Bit (Set MSR C80[0] to 1)  
[F2] Intel® Visual BIOS  
[F4] BIOS Recovery  
42  
Intel NUC Kit Features  
2.4  
Mechanical Considerations  
2.4.1  
Form Factor  
The board is designed to fit into a custom chassis. Figure 17 illustrates the mechanical form  
factor for the board. Dimensions are given in inches [millimeters].  
Figure 17. Board Dimensions  
43  
 
Figure 18 shows the height dimensions of the board.  
Figure 18. Board Height Dimensions  
2.4.2  
Weights & Dimensions  
Table 29 lists select weights of boards and kits and Table 30 lists kit dimensions.  
Table 29. Select Weights  
Item  
Weight (in kg)  
Board with Thermal Solution  
0.2  
Slim Kit (includes Board Assembly)  
Tall Kit (includes Board Assembly)  
0.47  
0.58  
Table 30. Select Chassis Dimensions  
Item  
Chassis Dimensions (WxDxH, in mm)  
117 x 112 x 36  
Slim Kit (includes chassis feet)  
Tall Kit (includes chassis feet)  
117 x 112 x 51  
2.5  
Electrical Considerations  
2.5.1  
Power Supply Considerations  
System power requirements will depend on actual system configurations chosen by the  
integrator, as well as end user expansion preferences. It is the system integrator’s responsibility  
to ensure an appropriate power budget for the system configuration is properly assessed based  
on the system-level components chosen.  
2.5.2  
Fan Header Current Capability  
Table 31 lists the current capability of the fan header.  
Table 31. Fan Header Current Capability  
Fan Header  
Maximum Available Current  
Processor fan  
0.5 A  
44  
 
 
 
 
Intel NUC Kit Features  
2.6  
Thermal Considerations  
CAUTION  
A chassis with a maximum temperature of 50 oC at the processor fan inlet is recommended. If the  
internal ambient temperature exceeds 50 oC, further thermal testing is required to ensure  
components do not exceed their maximum case temperature.  
CAUTION  
Failure to ensure appropriate airflow may result in reduced performance of both the processor  
and/or voltage regulator or, in some instances, damage to the board.  
All responsibility for determining the adequacy of any thermal or system design remains solely  
with the system integrator. Intel makes no warranties or representations that merely following the  
instructions presented in this document will result in a system with adequate thermal  
performance.  
CAUTION  
Ensure that the ambient temperature does not exceed the board’s maximum operating  
temperature. Failure to do so could cause components to exceed their maximum case  
temperature and malfunction. For information about the maximum operating temperature, see  
the environmental specifications in Section 2.8.  
CAUTION  
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do  
so may result in shorter than expected product lifetime.  
45  
Figure 19 shows the locations of the localized high temperature zones.  
Item  
A
Description  
Thermal solution  
B
Processor voltage regulator area  
Figure 19. Localized High Temperature Zones  
46  
 
Intel NUC Kit Features  
A thermal pad has been installed for the bottom of the chassis to improve the thermal  
performance when using M.2 devices that operate at higher temperatures. If the thermal pad  
ever needs to be replaced, Figure 20 shows the installation area of the thermal pad for Intel NUC  
Kit NUC8i3BEK and Intel NUC Kit NUC8i5BEK.  
Item  
A
Description  
Thermal Pad  
B
Thermal Pad Installation Area  
Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC8i3BEK/NUC8i5BEK  
47  
 
Figure 21 shows the installation area of the thermal pad for Intel NUC Kit NUC8i3BEH, Intel NUC  
Kit NUC8i5BEH and Intel NUC Kit NUC8i7BEH.  
Item  
A
Description  
Thermal Pad  
B
Thermal Pad Installation Area  
Figure 21. Installation area of Thermal Pad for Intel NUC Kit  
NUC8i3BEH/NUC8i5BEH/NUC8i7BEH  
48  
 
Intel NUC Kit Features  
Table 32 provides maximum case temperatures for the components that are sensitive to thermal  
changes. The operating temperature, current load, or operating frequency could affect case  
temperatures. Maximum case temperatures are important when considering proper airflow to  
cool the board.  
Table 32. Thermal Considerations for Components  
Component  
Maximum Case Temperature  
Processor  
For processor case temperature, see processor datasheets and processor  
specification updates  
To ensure functionality and reliability, the component is specified for proper operation when  
Case Temperature is maintained at or below the maximum temperature listed in Table 33. This is  
a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified  
as the maximum sustainable power to be dissipated by the components). When the component is  
dissipating less than TDP, the case temperature should be below the Maximum Case  
Temperature. The surface temperature at the geometric center of the component corresponds to  
Case Temperature.  
It is important to note that the temperature measurement in the system BIOS is a value reported  
by embedded thermal sensors in the components and does not directly correspond to the  
Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is  
Tcontrol.  
Table 33. Tcontrol Values for Components  
Component  
Tcontrol  
Processor  
For processor case temperature, see processor datasheets and processor  
specification updates  
For information about  
Refer to  
Processor datasheets and specification updates  
Section 1.2, page 7  
49  
 
 
2.7  
2.8  
Reliability  
The Mean Time between Failures (MTBF) predictions are calculated using component and  
subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2,  
Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare  
parts requirements. The MTBF for Intel NUC8i3BEB board is 62,994 hours. The MTBF for Intel  
NUC8i5BEB board is 63,369 hours. The MTBF for Intel NUC8i7BEB board is 64,998 hours.  
Environmental  
Table 34 lists select environmental specifications.  
Table 34. Environmental Specifications  
Parameter  
Specification  
Temperature  
Non-Operating  
-40 C to +60 C  
0 C to +50 C  
Operating (Board)  
The operating temperature of the board may be determined by measuring the air  
temperature from the junction of the heatsink fins and fan, next to the attachment screw,  
in a closed chassis, while the system is in operation.  
Operating (System)  
0 C to +35 C  
Shock (Board)  
Unpackaged  
50 g trapezoidal waveform  
Velocity change of 170 inches/s²  
Packaged  
Free fall package drop machine set to the height determined by the weight of the package.  
Product Weight (pounds)  
Free Fall (inches)  
<20  
36  
30  
24  
18  
21-40  
41-80  
81-100  
Vibration (System)  
Unpackaged  
5 Hz to 20 Hz: 0.001 g²/Hz sloping up to 20 Hz @ 0.01 g²/Hz  
20 Hz to 500 Hz: 0.01 g²/Hz (flat)  
Input acceleration is 2.20 g RMS  
Packaged  
5 Hz to 40 Hz: 0.015 g²/Hz (flat)  
40 Hz to 500 Hz: 0.015 g²/Hz sloping down to 0.00015 g²/Hz  
Input acceleration is 1.09 g RMS  
Acoustic  
Cool Setting  
4.5 BA (~35dBA)  
5.7BA (~47dBA)  
100% duty (@3400  
RPM)  
Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum  
operating temperature specified. It is recommended that the board temperature be at least room temperature  
50  
 
Intel NUC Kit Features  
before attempting to power on the board. The operating and non-operating environment must avoid condensing  
humidity.  
3
Overview of BIOS Features  
3.1  
Introduction  
The board uses Intel Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory  
(SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual  
BIOS Setup program, POST, the PCI auto-configuration utility, embedded controller (EC)  
firmware, LAN EEPROM information, and Plug and Play support.  
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The  
production BIOSes are identified as BECFL357.86A.  
The Visual BIOS Setup program can be used to view and change the BIOS settings for the  
computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On  
Self-Test (POST) memory test begins and before the operating system boot begins.  
3.2  
3.3  
BIOS Flash Memory Organization  
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb flash memory device.  
System Management BIOS (SMBIOS)  
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in  
a managed network.  
The main component of SMBIOS is the Management Information Format (MIF) database, which  
contains information about the computing system and its components. Using SMBIOS, a system  
administrator can obtain the system types, capabilities, operational status, and installation dates  
for system components. The MIF database defines the data and provides the method for  
accessing this information. The BIOS enables applications such as third-party management  
software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:  
BIOS data, such as the BIOS revision level  
Fixed-system data, such as peripherals, serial numbers, and asset tags  
Resource data, such as memory size, cache size, and processor speed  
Dynamic data, such as event detection and error logging  
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS  
information. The BIOS supports an SMBIOS table interface for such operating systems. Using  
this support, an SMBIOS service-level application running on a non-Plug and Play operating  
system can obtain the SMBIOS information. Additional board information can be found in the  
BIOS under the Additional Information header under the Main BIOS page.  
51  
3.4  
Legacy USB Support  
Legacy USB support enables USB devices to be used even when the operating system’s USB  
drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and  
to install an operating system that supports USB. By default, Legacy USB support is set to  
Enabled.  
Legacy USB support operates as follows:  
1. When you first apply power to the computer, legacy support is disabled.  
2. POST begins.  
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and  
configure the BIOS Setup program and the maintenance menu.  
4. POST completes.  
5. The operating system loads. While the operating system is loading, USB keyboards and mice  
are recognized and may be used to configure the operating system. (Keyboards and mice are  
not recognized during this period if Legacy USB support was set to Disabled in the BIOS  
Setup program.)  
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are  
recognized by the operating system, and Legacy USB support from the BIOS is no longer  
used.  
3.5  
BIOS Updates  
The BIOS can be updated using one of the following methods:  
Intel Express BIOS Update Utility, which enables automated updating while in the Windows  
environment. Using this utility, the BIOS can be updated from a file on a hard disk or a USB  
drive (a flash drive or a USB hard drive).  
Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the  
BIOS can be updated from a file on a hard disk or a USB drive (a flash drive or a USB hard  
drive).  
Pressing <F7> key during POST allows a user to select where the BIOS .bio file is located and  
perform the update from that location/device. Similar to performing a BIOS Recovery without  
removing the BIOS configuration jumper.  
Intel® Visual BIOS has an option to update the BIOS from a valid .bio file located on a hard  
disk or USB drive. Enter Intel Visual BIOS by pressing <F2> during POST.  
Using Front Panel power button menu option  
The update BIOS will be verified that it matches the target system to prevent accidentally  
installing an incompatible BIOS.  
NOTE  
Review the instructions distributed with the upgrade utility before attempting a BIOS update.  
For information about  
Refer to  
BIOS update utilities  
http://www.intel.com/content/www/us/en/support/boards-and-  
kits/000005636.html  
52  
Intel NUC Kit Features  
3.5.1  
Language Support  
The BIOS Setup program and help messages are supported in US English. Check the Intel web  
site for support.  
3.6  
BIOS Recovery  
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the  
BIOS could be damaged. Table 35 lists the drives and media types that can and cannot be used  
for BIOS recovery. The BIOS recovery media does not need to be made bootable.  
Table 35. Acceptable Drives/Media Types for BIOS Recovery  
Media Type (Note)  
Can be used for BIOS recovery?  
Hard disk drive (connected to SATA or USB)  
CD/DVD drive (connected to SATA or USB)  
USB flash drive  
Yes  
No  
Yes  
USB diskette drive (with a 1.4 MB diskette)  
No (BIOS update file is bigger than 1.4 MB size limit)  
NOTE  
Supported file systems for BIOS recovery:  
NTFS (sparse, compressed, or encrypted files are not supported)  
FAT32  
FAT16  
FAT12  
For information about  
Refer to  
BIOS recovery  
http://www.intel.com/support/motherboards/desktop/sb/cs-034524.htm  
53  
 
3.7  
Boot Options  
In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive,  
removable drive, or the network. The default setting is for the optical drive to be the first boot  
device, the hard drive second, removable drive third, and the network fourth.  
NOTE  
Optical drives are not supported by the onboard SATA connectors. Optical drives are supported  
only via the USB interfaces. If the optical drive is not bootable, it will be ignored during the POST  
process.  
3.7.1  
Network Boot  
The network can be selected as a boot device. This selection allows booting from the onboard  
LAN.  
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key  
during POST, the User Access Level in the BIOS Setup program's Security menu must be  
set to Full.”  
NOTE  
When no bootable disk or USB device is found, the system will default to network boot.  
3.7.2  
Booting Without Attached Devices (Headless)  
For use in embedded applications, the BIOS has been designed so that after passing the POST,  
the operating system loader is invoked even if the following devices are not present:  
Video monitor  
Keyboard  
Mouse  
3.7.3  
Changing the Default Boot Device during POST  
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu  
displays the list of available boot devices. Table 36 lists the boot device menu options.  
Table 36. Boot Device Menu Options  
Boot Device Menu Function Keys  
Description  
<> or <>  
<Enter>  
<Esc>  
Selects a default boot device  
Exits the menu, and boots from the selected device  
Exits the menu and boots according to the boot priority defined  
through BIOS setup  
54  
 
Intel NUC Kit Features  
3.7.4  
Power Button Menu  
As an alternative to normal POST Hotkeys, the user can use the power button to access a  
menu. The Power Button Menu is accessible via the following sequence:  
1. System is in S4/S5 (soft off); will not work if system is in G3 (after “no power” state)  
2. User pushes the power button and holds it down for 3 seconds  
3. The front panel power button LED will change from Blue to Amber then the user can release  
the power button.  
4. User releases the power button before the 4-second shutdown override can occur.  
If this path is taken, the BIOS will use default settings, ignoring settings in VPD where possible.  
The BIOS will display the following prompt and wait for a keystroke:  
[ESC] Normal Boot  
[F2]  
[F3]  
[F4]  
[F7]  
Intel Visual BIOS  
Disable Fast Boot†  
BIOS Recovery  
Update BIOS  
[F10] Enter Boot Menu  
[F12] Network Boot  
[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is enabled.  
If an unrecognized key is hit, then the BIOS will wait for another keystroke. If one of the listed  
hotkeys is hit, the BIOS will follow the indicated boot path. Password requirements must still be  
honored.  
If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and reset the  
system.  
55  
3.8  
Hard Disk Drive Password Security Feature  
The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk  
drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and  
are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will  
automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9.  
Passwords may be up to 19 characters in length.  
The User hard disk drive password, when installed, will be required upon each power-cycle until  
the Master Key or User hard disk drive password is submitted.  
The Master Key hard disk drive password, when installed, will not lock the drive. The Master Key  
hard disk drive password exists as an unlock override in the event that the User hard disk drive  
password is forgotten. Only the installation of the User hard disk drive password will cause a hard  
disk to be locked upon a system power-cycle.  
Table 37 shows the effects of setting the Hard Disk Drive Passwords.  
Table 37. Master Key and User Hard Drive Password Functions  
Password Set  
Neither  
Password During Boot  
None  
Master only  
User only  
None  
User only  
Master and User Set  
Master or User  
During every POST, if a User hard disk drive password is set, POST execution will pause with the  
following prompt to force the user to enter the Master Key or User hard disk drive password:  
Enter Hard Disk Drive Password:  
Upon successful entry of the Master Key or User hard disk drive password, the system will  
continue with normal POST.  
If the hard disk drive password is not correctly entered, the system will go back to the above  
prompt. The user will have three attempts to correctly enter the hard disk drive password. After  
the third unsuccessful hard disk drive password attempt, the system will halt with the message:  
Hard Disk Drive Password Entry Error  
A manual power cycle will be required to resume system operation.  
NOTE  
As implemented on Intel NUC Board NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel NUC  
Board NUC8i7BEB, Hard Disk Drive Password Security is only supported on either SATA port 0 (M.2  
) or SATA Port 1 (onboard SATA connector). The passwords are stored on the hard disk drive so if  
the drive is relocated to another computer that does not support Hard Disk Drive Password  
Security feature, the drive will not be accessible.  
Currently, there is no industry standard for implementing Hard Disk Drive Password Security on  
AHCI or NVME drives. Hard drive encryption can still be implemented and does not require Hard  
Disk Drive Password Security.  
56  
 
Intel NUC Kit Features  
3.9  
BIOS Security Features  
The BIOS includes security features that restrict access to the BIOS Setup program and who can  
boot the computer. A supervisor password and a user password can be set for the BIOS Setup  
program and for booting the computer, with the following restrictions:  
The supervisor password gives unrestricted access to view and change all the Setup options  
in the BIOS Setup program. This is the supervisor mode.  
The user password gives restricted access to view and change Setup options in the BIOS  
Setup program. This is the user mode.  
If only the supervisor password is set, pressing the <Enter> key at the password prompt of  
the BIOS Setup program allows the user restricted access to Setup.  
If both the supervisor and user passwords are set, users can enter either the supervisor  
password or the user password to access Setup. Users have access to Setup respective to  
which password is entered.  
Setting the user password restricts who can boot the computer. The password prompt will be  
displayed before the computer is booted. If only the supervisor password is set, the  
computer boots without asking for a password. If both passwords are set, the user can enter  
either password to boot the computer.  
For enhanced security, use different passwords for the supervisor and user passwords.  
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 20 characters in  
length.  
To clear a set password, enter a blank password after entering the existing password.  
Table 38 shows the effects of setting the supervisor password and user password. This table is  
for reference only and is not displayed on the screen.  
Table 38. Supervisor and User Password Functions  
Supervisor  
Password Set Mode  
Password to  
Enter Setup  
Password  
During Boot  
User Mode  
Setup Options  
Neither  
Can change all  
options  
Can change all  
options  
None  
None  
None  
None  
(Note)  
(Note)  
Supervisor only Can change all  
options  
Can change a  
limited number  
of options  
Supervisor Password  
Supervisor  
User only  
N/A  
Can change all  
options  
Enter Password  
Clear User Password  
User  
User  
Supervisor and  
user set  
Can change all  
options  
Can change a  
limited number  
of options  
Supervisor Password  
Enter Password  
Supervisor or  
user  
Supervisor or  
user  
Note:  
If no password is set, any user can change all Setup options.  
57  
 
4
Error Messages and Blink Codes  
4.1  
Front-panel Power LED Blink Codes  
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel  
power LED to blink an error message describing the problem (see Table 39).  
Table 39. Front-panel Power LED Blink Codes  
Type  
Pattern  
Note  
Power-on  
Solid on primary color. Indicates S0 state.  
Default to On; can be disabled  
via BIOS Setup  
S3 Standby  
Blink alternate color .25 seconds on, .25 seconds off,  
indefinitely. Indicates S3 state.  
Default behavior; can be  
changed via BIOS Setup  
Intel Ready Mode  
BIOS update in progress  
Blink primary color, 1 second on, 1 second off,  
indefinitely.  
Off when the update begins, then primary color on for  
0.5 seconds, then off for 0.5 seconds. The pattern  
repeats until the BIOS update is complete.  
Memory error  
On-off (1.0 second each) three times, then 2.5-second  
pause (off), entire pattern repeats (blinks and pause)  
until the system is powered off.  
Thermal trip warning  
Blink primary color .25 seconds on, .25 seconds off, .25  
seconds on, .25 seconds off. This will result in a total of  
16 blinks (blink for 8 seconds).  
4.2  
BIOS Error Messages  
Table 40 lists BIOS error messages and provides a brief description of each.  
Table 40. BIOS Error Messages  
Error Message  
Explanation  
CMOS Battery Low  
CMOS Checksum Bad  
The battery may be losing power. Replace the battery soon.  
The CMOS checksum is incorrect. CMOS memory may have been  
corrupted. Run Setup to reset values.  
Memory Size Decreased  
Memory size has decreased since the last boot. If no memory was  
removed, then memory may be bad.  
A bootable device has not been detected  
System did not find a device to boot.  
58  
 
 
Intel NUC Kit Features  
5
Intel NUC Kit Features  
5.1  
Chassis Front Panel Features  
See the Product Identification Information section on page v to identify Intel NUC Boards and  
their respective kit or system. Figure 22 and Figure 23 shows the location of the features located  
on or near the front of the chassis.  
Figure 22. Intel NUC Kit NUC8i3BEH/NUC8i5BEH/NUC8i7BEH Features Front  
Table 41 lists the components identified in Figure 22.  
Table 41. Components Shown in Figure 22  
Item from Figure 22  
Description  
Kensington* Anti-Theft Key Lock Hole  
Micro SDXC Card Reader  
Digital Microphone Array  
Power Switch and Power LED  
Consumer Infrared Sensor  
Speaker/Headset Jack  
USB 3.1 Type A Connectors  
59  
 
 
Figure 23. Intel NUC Kit NUC8i3BEK/NUC8i5BEK Features Front  
Table 42 lists the components identified in Figure 23.  
Table 42. Components Shown in Figure 23  
Item from Figure 23  
Description  
Kensington* Anti-Theft Key Lock Hole  
Micro SDXC Card Reader  
Digital Microphone Array  
Power Switch and Power LED  
Consumer Infrared Sensor  
Speaker/Headset Jack  
USB 3.1 Type A Connectors  
60  
 
 
Intel NUC Kit Features  
5.3  
Chassis Rear Panel Features  
Figure 24 shows the location of the features located on the rear of the chassis.  
Figure 24. Intel NUC Kit NUC8i3BEH/NUC8i5BEH/NUC8i7BEH Features Rear  
Table 43 lists the components identified in Figure 24.  
Table 43. Components Shown in Figure 24  
Item from Figure 24  
Description  
19V DC Power Inlet  
Cooling Vents  
Thunderbolt™ 3 via USB Type C connector  
USB 3.1 Type A connectors  
Ethernet Port  
High Definition Multimedia Interface Connector  
61  
 
 
Figure 25 shows the location of the features located on the rear of the chassis.  
Figure 25. Intel NUC Kit NUC8i3BEK/NUC8i5BEK Features Rear  
Table 44 lists the components identified in Figure 25.  
Table 44. Components Shown in Figure 25  
Item from Figure 25  
Description  
Cooling Vents  
Thunderbolt™ 3 via USB Type C connector  
USB 3.1 Type A Connectors  
Ethernet Port  
High Definition Multimedia Interface Connector  
19V DC Power Inlet  
62  
 
 

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