R1304WTXXX [INTEL]
Technical Product Specification;
| 型号： | R1304WTXXX |
| 厂家： | 
INTEL |
| 描述： | Technical Product Specification |
| 文件： | 总126页 (文件大小：7090K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Intel® Server System R1000WT Family
Intel® Storage System R1000WT Family
Technical Product Specification
A document providing an overview of product features, functions, architecture, and
support specifications
Revision 1.06
November 2016
Intel® Server Boards and Systems
Intel® R1000WT Server System TPS
Revision History
Revision
Number
1.0
Date
Modifications
September 2014
First External Public Release
•
•
Added packaging specs and system weight data
Added DIMM Slot population requirements to maintain system
thermals in Section 4.1
•
Added section 5.2 System Fan RVI and Hard Disk Drive Storage
Performance
•
•
•
•
•
Updated PCIe* SFF SSD (NVMe) feature support
Added support for dual RMFBU accessory kit
Updated System Status LED State Definition table
Added missing cable routing diagram in Appendix E
Updated Thermal Config Table data
November 2014
1.01
•
•
•
Updated Section 4.1 – Add-in card support requirements
Updated PCIe* SFF SSD (NVMe) feature support
Added Appendix F – Statement of Volatility
December 2014
May 2015
1.02
1.03
• Update document Legal Disclaimer statements
• Chapter 2 – added OS Support list and defined OS validation test levels
and technical support levels
• Section 2.12.1 - Updated product weight information
• Section 5.6.5 - Updated 8 x 2.5” Drive Combo SAS / PCIe* SFF (NVMe)
SSD Backplane Accessory Kit
• Updated to include “R” in product SKU names.
• Updated Rail kits.
March 2016
1.04
1.06
• Updated to include Intel® Storage Server R1000WT family
• Appendix F – Added the SOV for 750W power supply module
November 2016
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Intel® R1000WT Server System TPS
Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled
hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer.
You may not use or facilitate the use of this document in connection with any infringement or other legal
analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free
license to any patent claim thereafter drafted which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.
The products described may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of
performance, course of dealing, or usage in trade.
Intel, the Intel logo, Xeon, and Xeon Phi are trademarks of Intel Corporation in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2016 Intel Corporation. All Rights Reserved.
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Intel® R1000WT Server System TPS
Table of Contents
1. Introduction........................................................................................................................................1
1.1
1.2
1.3
Chapter Outline....................................................................................................................................1
Server Board Use Disclaimer..........................................................................................................2
Product Errata.......................................................................................................................................2
2. Product Family Overview.................................................................................................................3
2.1
2.1.1
2.1.2
2.2
Operating System Support .............................................................................................................5
OS Validation Levels..........................................................................................................................6
OS Technical Support Levels.........................................................................................................7
System Features Overview..............................................................................................................8
Server Board Features Overview..................................................................................................9
Back Panel Features........................................................................................................................ 12
Front Control Panel......................................................................................................................... 12
Front Drive Bay Options................................................................................................................ 12
Locking Front Bezel......................................................................................................................... 13
System Dimensions......................................................................................................................... 15
Chassis Dimensions......................................................................................................................... 15
Label Emboss Dimensions........................................................................................................... 16
Pull-out Tab Label Emboss Dimensions ................................................................................ 17
System Cable Routing Channels................................................................................................ 18
Available Rack and Cabinet Mounting Kit Options ............................................................ 19
System Level Environmental Limits......................................................................................... 20
System Packaging............................................................................................................................ 21
2.3
2.4
2.5
2.6
2.7
2.8
2.8.1
2.8.2
2.8.3
2.9
2.10
2.11
2.12
2.12.1 Intel Product Weight Information............................................................................................. 21
3. System Power.................................................................................................................................. 22
3.1
3.2
Power Supply Configurations ..................................................................................................... 22
Power Supply Module Options .................................................................................................. 23
Power Supply Module Efficiency............................................................................................... 23
Power Supply Module Mechanical Overview....................................................................... 23
Power Cord Specification Requirements ............................................................................... 24
AC Power Supply Input Specifications.................................................................................... 25
Power Factor...................................................................................................................................... 25
AC Input Voltage Specification................................................................................................... 25
AC Line Isolation Requirements................................................................................................. 26
AC Line Dropout / Holdup............................................................................................................ 26
AC Line Fuse....................................................................................................................................... 26
AC Inrush ............................................................................................................................................. 26
AC Line Transient Specification................................................................................................. 26
Susceptibility Requirements........................................................................................................ 27
Electrostatic Discharge Susceptibility..................................................................................... 27
3.2.1
3.2.2
3.2.3
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
3.3.9
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3.3.10 Fast Transient/Burst........................................................................................................................ 27
3.3.11 Radiated Immunity .......................................................................................................................... 27
3.3.12 Surge Immunity................................................................................................................................. 27
3.3.13 Power Recovery ................................................................................................................................ 28
3.3.14 Voltage Interruptions ..................................................................................................................... 28
3.3.15 Protection Circuits ........................................................................................................................... 28
3.3.16 Power Supply Status LED ............................................................................................................. 29
3.4
DC Power Supply Input Specifications.................................................................................... 29
DC Input Voltage .............................................................................................................................. 29
DC Input Fuse..................................................................................................................................... 29
DC Inrush Current ............................................................................................................................ 30
DC Input Under Voltage ................................................................................................................ 30
DC Holdup Time and Dropout.................................................................................................... 30
DC Line Surge Voltages (Line Transients).............................................................................. 30
Susceptibility Requirements........................................................................................................ 30
Protection Circuits ........................................................................................................................... 31
Cold Redundancy Support........................................................................................................... 32
Powering on Cold Standby supplies to maintain best efficiency ................................33
Powering on Cold Standby Supplies during a Fault or Over Current Condition...33
BMC Requirements.......................................................................................................................... 33
Power Supply Turn On Function............................................................................................... 33
Closed Loop System Throttling (CLST)................................................................................... 34
Smart Ride Through (SmaRT) ..................................................................................................... 34
Server Board Power Connectors ............................................................................................... 34
Power Supply Module Card Edge Connector....................................................................... 34
Hot Swap Backplane Power Connector.................................................................................. 35
Optical Drive and SSD Power Connector............................................................................... 35
3.4.1
3.4.2
3.4.3
3.4.4
3.4.5
3.4.6
3.4.7
3.4.8
3.5
3.5.1
3.5.2
3.5.3
3.5.4
3.6
3.7
3.8
3.8.1
3.8.2
3.8.3
4. Thermal Management ................................................................................................................... 36
4.1
4.2
Thermal Operation and Configuration Requirements...................................................... 37
Thermal Management Overview................................................................................................ 38
Fan Speed Control........................................................................................................................... 39
System Fans ....................................................................................................................................... 42
Power Supply Module Fans......................................................................................................... 44
FRUSDR Utility................................................................................................................................... 44
4.2.1
4.3
4.4
4.5
5. System Storage and Peripheral Drive Bay Overview.............................................................. 46
5.1
5.2
5.3
5.4
5.5
5.6
Front Mount Drive Support.......................................................................................................... 46
System Fan RVI and Hard Disk Drive Storage Performance .......................................... 47
Hot Swap Storage Device Carriers............................................................................................ 48
Peripheral Power Sources............................................................................................................ 50
Optical Drive Support..................................................................................................................... 51
Storage Backplane Options......................................................................................................... 52
SGPIO Functionality........................................................................................................................ 53
5.6.1
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Intel® R1000WT Server System TPS
5.6.2
5.6.3
5.6.4
5.6.5
I2C Functionality............................................................................................................................... 53
4 x 3.5” Drive Hot-Swap Backplane Overview...................................................................... 53
8 x 2.5” Drive SAS Backplane...................................................................................................... 54
8 x 2.5” Drive Combo SAS / PCIe* SFF (NVMe) SSD Backplane Accessory Kit.......56
Low Profile eUSB SSD Support.................................................................................................. 62
SATA DOM Support ........................................................................................................................ 63
5.7
5.8
6. Storage Controller Options Overview ....................................................................................... 65
6.1
6.1.1
6.2
6.2.1
6.2.2
6.3
6.3.1
Embedded SATA/SATA RAID Support.................................................................................... 65
Staggered Disk Spin-Up................................................................................................................ 67
Embedded SATA SW-RAID support......................................................................................... 67
Intel® Rapid Storage Technology (RSTe) 4.1 ......................................................................... 67
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41............................................ 68
Intel® Integrated RAID Module Support.................................................................................. 70
Intel® RAID Maintenance Free Backup Unit (RMFBU) Support....................................... 70
7. Front Control Panel and I/O Panel Overview........................................................................... 72
7.1
7.2
I/O Panel Features........................................................................................................................... 72
Control Panel Features.................................................................................................................. 73
8. Intel® Local Control Panel ............................................................................................................. 77
9. PCIe* Riser Card Support.............................................................................................................. 78
10. Intel® I/O Module Support............................................................................................................ 80
11. Basic and Advanced Server Management Features................................................................ 81
11.1.1 Dedicated Management Port ...................................................................................................... 82
11.1.2 Embedded Web Server.................................................................................................................. 82
11.1.3 Advanced Management Feature Support (RMM4 Lite).................................................... 84
Appendix A: Integration and Usage Tips.......................................................................................... 88
Appendix B: POST Code Diagnostic LED Decoder ......................................................................... 89
Appendix C: POST Code Errors........................................................................................................... 92
Appendix D: System Configuration Table for Thermal Compatibility....................................... 99
Appendix E: System Cable Routing Diagrams...............................................................................104
Appendix F: Statement of Volatility ................................................................................................106
Appendix G: Intel® Storage System R1000WT ..............................................................................109
Glossary .................................................................................................................................................113
Reference Documents.........................................................................................................................115
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List of Figures
Figure 1. System Components Overview.............................................................................................................8
Figure 2. Top Cover Features....................................................................................................................................8
Figure 3. Server Board Features...............................................................................................................................9
Figure 4. On-board Light Guided Diagnostics................................................................................................. 10
Figure 5. DIMM Fault LEDs....................................................................................................................................... 11
Figure 6. System Reset and Configuration Jumpers.................................................................................... 11
Figure 7. Back Panel Feature Identification...................................................................................................... 12
Figure 8. Front Control Panel Options ............................................................................................................... 12
Figure 9. 3.5" Drive Bay – 4 Drive Configuration (Model R1304WTxxxxx)........................................... 12
Figure 10. 2.5" Drive Bay – 8 Drive Configuration (Model R1208WTxxxxx)........................................ 12
Figure 11. Front Bezel ............................................................................................................................................... 13
Figure 12. Front Bezel accessory with optionally installed wave feature............................................ 13
Figure 13. Front Bezel accessory with optionally installed wave and ID badge (1) ........................13
Figure 14. Front Bezel accessory with optionally installed wave and ID badge (2) ........................14
Figure 15. Front Bezel accessory ID Badge mechanical drawings.......................................................... 14
Figure 16. Chassis Dimensions.............................................................................................................................. 15
Figure 17. Label Emboss Dimensions................................................................................................................. 16
Figure 18. Pull-out Tab Label Emboss Dimensions...................................................................................... 17
Figure 19. System Cable Routing Channels..................................................................................................... 18
Figure 20. 750W AC Power Supply...................................................................................................................... 22
Figure 21. Power Supply Module Overview..................................................................................................... 23
Figure 22. 750W AC Power Supply Module Mechanical Drawing.......................................................... 24
Figure 23. AC Power Cord........................................................................................................................................ 24
Figure 24. DC Power Cord Specification............................................................................................................ 25
Figure 25. System Air Flow and Fan Identification........................................................................................ 36
Figure 26. Fan Control Model ................................................................................................................................ 42
Figure 27. System Fan Assembly.......................................................................................................................... 43
Figure 28. System Fan Connector Locations on Server Board ................................................................ 43
Figure 29. 8x2.5" Drive Bay Configuration (Model R1208xxxxx)............................................................. 46
Figure 30. 4x3.5" Drive Bay Configuration (Model R1304WTxxxx)........................................................ 47
Figure 31. 2.5" SSD mounted to 3.5" Drive Tray............................................................................................ 48
Figure 32. Drive Tray LED Identification............................................................................................................ 49
Figure 33. Server Board Peripheral Power Connectors.............................................................................. 50
Figure 34. Optical Drive Support.......................................................................................................................... 51
Figure 35. Optical Drive Installation.................................................................................................................... 51
Figure 36. Backplane Installation......................................................................................................................... 52
Figure 37. 4 x 3.5” Drive Hot-Swap Backplane – front view...................................................................... 53
Figure 38. 4 x 3.5” Drive Hot-Swap Backplane – rear view........................................................................ 54
Figure 39. 8 x 2.5” Drive SAS/SATA Backplane – front view..................................................................... 54
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Intel® R1000WT Server System TPS
Figure 40. 8 x 2.5” Drive SAS/SATA Backplane – rear view....................................................................... 55
Figure 41. Combo Backplane Kit Device Carrier Identification................................................................ 56
Figure 42. 8 x 2.5" Combo SAS / PCIe* SFF (NVMe) Backplane – Front View ....................................57
Figure 43. Combo Backplane Rear Connector Identification.................................................................... 58
Figure 44. Combo Backplane Cable Routing – PCIe* SFF (NVMe) + SAS............................................. 59
Figure 45. Combo Backplane Cable Routing – PCIe* SFF (NVMe) + SATA......................................... 60
Figure 46. Low Profile eUSB SSD Support ....................................................................................................... 62
Figure 47. On-board SATA Features................................................................................................................... 65
Figure 48. SATA RAID 5 Upgrade Key................................................................................................................. 69
Figure 49. Intel® Integrated RAID Module......................................................................................................... 70
Figure 50. Support for single Intel® RAID Maintenance Free Backup Unit (Standard Option) ...70
Figure 51. Support for dual Intel® RAID Maintenance Free Backup Units (Optional Accessory)71
Figure 52. Front I/O Panel Features.................................................................................................................... 72
Figure 53. Front Control Panel Options............................................................................................................. 73
Figure 54. Intel Local Control Panel Option..................................................................................................... 77
Figure 55. Add-in Card Support............................................................................................................................ 79
Figure 56. Riser Card Assembly............................................................................................................................. 79
Figure 57. Intel® I/O Module Placement............................................................................................................ 80
Figure 58. Intel® RMM4 Lite Activation Key Installation.............................................................................. 82
Figure 59. POST Diagnostic LED Location........................................................................................................ 89
Figure 60. Intel® Storage Server R1000WT................................................................................................... 109
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Intel® R1000WT Server System TPS
List of Tables
Table 1. Intel® Server System R1000WT Product Family Feature Set ....................................................3
Table 2. Operating System Support List ..............................................................................................................5
Table 3. Operating System Validation Levels...................................................................................................6
Table 4. System Environmental Limits Summary.......................................................................................... 20
Table 5. 750 Watt AC Power Supply Efficiency (Platinum)........................................................................ 23
Table 6. 750 Watt DC Power Supply Efficiency (Gold)................................................................................ 23
Table 7. AC Power Cord Specifications.............................................................................................................. 24
Table 8. DC Power Cable Connector Pin-out .................................................................................................. 25
Table 9. AC Input Voltage Range – 750W Power Supply........................................................................... 25
Table 10. AC Line Holdup Time – 750W Power Supply.............................................................................. 26
Table 11. AC Line Sag Transient Performance............................................................................................... 27
Table 12. AC Line Surge Transient Performance........................................................................................... 27
Table 13. Performance Criteria ............................................................................................................................. 27
Table 14. Over Current Protection – 750 Watt Power Supply................................................................. 28
Table 15. Over Voltage Protection (OVP) Limits – 750W Power Supply............................................. 28
Table 16. LED Indicators.......................................................................................................................................... 29
Table 17. DC Input Rating........................................................................................................................................ 29
Table 18. Line Voltage Transient Limits............................................................................................................ 30
Table 19. Over Current Protection – 750 Watt Power Supply................................................................. 32
Table 20. Over Voltage Protection Limits – 750 Watt Power Supply ................................................... 32
Table 21. Example Load Share Threshold for Activating Supplies........................................................ 33
Table 22. Power Supply Module Output Power Connector Pin-out..................................................... 34
Table 23. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR") .......................................... 35
Table 24. Peripheral Drive Power Connector Pin-out (“Peripheral PWR”).......................................... 35
Table 25. System Volumetric Air Flow............................................................................................................... 36
Table 26. System Fan Connector Pin-out......................................................................................................... 44
Table 27. Drive Status LED States........................................................................................................................ 49
Table 28. Drive Activity LED States...................................................................................................................... 49
Table 29. Intel® Accessory Kit A2U44X25NVMEDK Operating System Support List.....................61
Table 30. SATA and sSATA Controller Feature Support............................................................................ 66
Table 31. SATA and sSATA Controller BIOS Utility Setup Options....................................................... 66
Table 32. System Status LED State Definitions.............................................................................................. 74
Table 33. Power/Sleep LED Functional States ............................................................................................... 76
Table 34. Riser Slot #1 – Riser Card Options................................................................................................... 78
Table 35. Riser Slot #2 – Riser Card Options................................................................................................... 78
Table 36. Supported Intel® I/O Modules........................................................................................................... 80
Table 37. Intel® Remote Management Module 4 (RMM4) Options......................................................... 81
Table 38. Basic and Advanced Server Management Features Overview............................................. 81
Table 39. POST Progress Code LED Example................................................................................................. 89
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Intel® R1000WT Server System TPS
Table 40. MRC Progress Codes............................................................................................................................. 90
Table 41. MRC Fatal Error Codes.......................................................................................................................... 91
Table 42. POST Error Messages and Handling............................................................................................... 92
Table 43. POST Error Beep Codes....................................................................................................................... 97
Table 44. Integrated BMC Beep Codes .............................................................................................................. 98
Table 45. Intel® Storage System R1000WT Feature List......................................................................... 110
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Intel® R1000WT Server System TPS
1. Introduction
This Technical Product Specification (TPS) provides system level information for the Intel® Server System
R1000WT product family.
This document describes the embedded functionality and available features of the integrated server system
which includes: the chassis layout, system boards, power subsystem, cooling subsystem, storage subsystem
options, and available installable options. Note that some system features are provided as configurable
options and may not be included standard in every system configuration offered. Please reference the Intel®
Server Board S2600WT Product Family Configuration Guide for a list of configured options for all system
SKUs made available.
Server board specific detail can be obtained by referencing the Intel® Server Board S2600WT Technical
Product Specification.
In addition, design-level information related to specific server board components/subsystems can be
obtained by ordering External Product Specifications (EPS) or External Design Specifications (EDS) related to
this server generation. EPS and EDS documents are made available under NDA with Intel and must be
ordered through your local Intel representative. See the Reference Documents section at the end of this
document for a list of available documents.
1.1 Chapter Outline
This document is divided into the following chapters:
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Chapter 1 – Introduction
Chapter 2 – Product Family Overview
Chapter 3 – System Power
Chapter 4 – Thermal Management
Chapter 5 – System Storage and Peripherals Drive Bay Overview
Chapter 6 – Storage Controller Options Overview
Chapter 7 – Front Control Panel and I/O Panel Overview
Chapter 8 – Intel® Local Control Panel
Chapter 9 – PCIe* Riser Card Support
Chapter 10 – Intel® I/O Module Support
Chapter 11 – Basic and Advanced Server Management Features
Appendix A – Integration and Usage Tips
Appendix B – POST Code Diagnostic LED Decoder
Appendix C – Post Code Errors
Appendix D – System Configuration Tables for Thermal Compatibility
Appendix E – System Cable Routing Diagrams
Appendix F – Statement of Volatility
Appendix G – Intel® Storage System R1000WT Family Overview
Glossary
Reference Documents
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1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully integrated
system will meet the intended thermal requirements of these components. It is the responsibility of the
system integrator who chooses not to use Intel-developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of airflow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if components fail
or the server board does not operate correctly when used outside any of their published operating or non-
operating limits.
1.3 Product Errata
Shipping product may have features or functionality that may deviate from published specifications. These
deviations are generally discovered after the product has gone into formal production. Intel terms these
deviations as product Errata. Known product Errata will be published in the Monthly Specification Update for
the given product family which can be downloaded from the following Intel web site:
http://www.intel.com/support
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Intel® R1000WT Server System TPS
2. Product Family Overview
This generation of Intel 1U server platforms offers a variety of system options to meet the varied
configuration requirements of high-density high-performance computing environments. The Intel® Server
System R1000WT product family includes several available 1U rack mount server systems. Each building
block option or L6 integrated system within this product family is configured around the following Intel
server board: Intel® Server Board S2600WT.
This chapter provides a high-level overview of the system features and available options as supported in
different system models within this product family. Greater detail for each major sub-system, feature, or
option is provided in the following chapters.
Note: Product information specific to the Intel® Storage System R1000WT family can be found in Appendix G
of this document.
Table 1. Intel® Server System R1000WT Product Family Feature Set
Feature
Description
Chassis Type
1U Rack Mount Chassis
. Intel® Server Board S2600WT w/Dual 1GbE ports – (Intel product code - S2600WT2R)
. Intel® Server Board S2600WT w/Dual 10GbE ports – (Intel product code - S2600WTTR)
. Two LGA2011-3 (Socket R3) processor sockets
Server Board
Processor Support
. Support for one or two Intel® Xeon® processors E5-2600 v3 and v4 product family
. Maximum supported Thermal Design Power (TDP) of up to 145 W.
. 24 DIMM slots – 3 DIMMs/Channel – 4 memory channels per processor
. Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
. Memory data transfer rates:
o
DDR4 RDIMM: 1600 MT/s (3DPC), 1866 MT/s (2DPC), 2133 MT/s (2DPC) and 2400 MT/s
(1DPC)
Memory
Chipset
o
o
o
DDR4 LRDIMM: 1866 Mt/s (3DPC), 2400 MT/s (2DPC)
DDR4 LRDIMM3DS: 1866 Mt/s (3DPC), 2400 MT/s (2DPC)
NVDIMM: 2133 Mt/s (1DPC)
. DDR4 standard I/O voltage of 1.2V
Intel® C612 chipset
. DB-15 Video connectors
o
Front and Back
. RJ-45 Serial Port A connector
. Dual RJ-45 Network Interface connectors supporting either :
External I/O
connections
o
10 GbE RJ-45 connectors (Intel Server Board Product Code – S2600WTTR)
or
o
1 GbE RJ-45 connectors (Intel Server Board Product Code – S2600WT2R)
. Dedicated RJ-45 server management NIC
. Three USB 2.0 / 3.0 connectors on back panel
. Two USB 2.0 / 3.0 connectors on front panel
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Intel® R1000WT Server System TPS
Description
Feature
. One Type-A USB 2.0 connector
. One 2x5 pin connector providing front panel support for two USB 2.0 ports
. One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports
. One 2x15 pin SSI-EEB compliant front panel header
Internal I/O connectors
/ headers
. One 2x7pin Front Panel Video connector
. One 1x7pin header for optional Intel® Local Control Panel (LCP) support
. One DH-10 Serial Port B connector
The server board includes a proprietary on-board connector allowing for the installation of a variety of
available Intel® I/O modules. An installed I/O module can be supported in addition to standard on-board
features and add-in PCIe cards.
. AXX4P1GBPWLIOM – Quad port RJ45 1 GbE based on Intel® Ethernet Controller I350
. AXX10GBTWLIOM3 – Dual port RJ-45 10GBase-T based on Intel® Ethernet Controller x540
. AXX10GBNIAIOM – Dual port SFP+ 10 GbE module based on Intel® 82599 10 GbE controller
. AXX1FDRIBIOM – Single port QSFP FDR 56 GT/S speed InfiniBand* module
. AXX2FDRIBIOM – Dual port QSFP FDR 56 GT/S speed infiniband* module
. AXX1P40FRTIOM – Single port QSFP+ 40 GbE module
Intel® I/O Module
Accessory Options
. AXX2P40FRTIOM – Dual port QSFP+ 40 GbE module
. Six managed 40mm dual rotor system fans
System Fans
Riser Card Support
Video
. One power supply fan for each installed power supply module
Support for two riser cards:
.
.
Riser #1 – PCIe* Gen3 x24 – 1 PCIe slot
Riser #2 – PCIe* Gen3 x24 – 1 PCIe slot
With two riser cards installed, up to 2 possible add-in cards can be supported:
2 Full Height / Half Length add-in cards via Risers #1 and #2
.
. Integrated 2D Video Controller
. 16 MB DDR3 Memory
. 10 x SATA 6Gbps ports (6Gb/s, 3 Gb/s and 1.5Gb/s transfer rates are supported)
o
o
Two single port SATA connectors capable of supporting up to 6 Gb/sec
Two 4-port mini-SAS HD (SFF-8643) connectors capable of supporting up to 6 Gb/sec /SATA
. One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices
. Optional SAS IOC/ROC support via on-board Intel® Integrated RAID module connector
. Embedded Software SATA RAID
On-board storage
controllers and options
o
o
Intel® Rapid Storage RAID Technology (RSTe) 4.1
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 with optional RAID 5 key support
. Intel® Trusted Platform Module (TPM) - AXXTPME5 (1.2), AXXTPME6 (v2.0) and AXXTPME7 (v2.0)
Security
(Accessory Option)
. Integrated Baseboard Management Controller, IPMI 2.0 compliant
. Support for Intel® Server Management Software
Server Management
. On-board RJ45 management port
. Advanced Server Management via an Intel® Remote Management Module 4 Lite (Accessory Option)
. The server system can have up to two power supply modules installed, providing support for the
following power configurations: 1+0, 1+1 Redundant Power, and 2+0 Combined Power
. Two power supply options:
Power Supply Options
o
o
AC 750W Platinum
DC 750W Gold
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Intel® R1000WT Server System TPS
Description
Feature
Hot Swap Backplane Options:
Note: All available backplane options have support for SAS 3.0 (12 Gb/sec)
o
o
o
4 x 3.5” SAS/SATA backplane
8 x 2.5” SAS/SATA backplane
Storage Bay Options
8 x 2.5” combo backplane – SAS/SATA + up to 4 x PCIe* SFF
Storage Bay Options:
o
o
4 x 3.5” SAS/SATA hot swap drive bays + front panel I/O and optical drive support
8 x 2.5” SAS/SATA hot swap drive bays + front panel I/O or optical drive support
. AXXPRAIL – Tool-less rack mount rail kit – 800mm max travel length
. AXXELVRAIL – Enhanced value rack mount rail kit - 424mm max travel length
. AXX1U2UCMA – Cable Management Arm – (*supported with AXXPRAIL only)
. AXX2POSTBRCKT – 2-post fixed mount bracket kit
Supported Rack Mount
Kit Accessory Options
. A1USHRTRAIL - 1U Premium quality rails with no CMA support
. A1UFULLRAIL - 1U Premium quality rails with CMA support
2.1 Operating System Support
As of this writing, Intel® Server System R1000WT product family provides support for the following operating
systems. This list will be updated as new operating systems are validated by Intel.
Table 2. Operating System Support List
Note: The * mark indicates it requires the drive driver to be recognize the drives during installation.
Operating
System
Validation
Level
SATA
ESRT2 SW
RAID
Support
(Y/N)
SATA RSTe SW
RAID
Operating System
Support
(Y/N)
(P)
Windows Server 2012* R2 w/Updated Datacenter x64, Legacy boot
Windows Server 2012* R2 w/Updated Datacenter x64, uEFI boot
Windows Hyper-V 2012* R2 x64, Legacy boot
Windows Hyper-V 2012 R2 x64, uEFI boot
Red Hat Enterprise Linux 7.0* x64, Legacy boot
P1
P1
P1
P1
P1
P1
Yes
Yes
No
No
No
Yes
No
No
No
Yes
No
Red Hat Enterprise Linux 7.0* x64, uEFI boot
No
Yes
Red Hat Enterprise Linux 6.5* x64, Legacy boot
Red Hat Enterprise Linux 6.5* x64, uEFI boot
Red Hat Enterprise Linux 6.5 * x86, Legacy boot
P1
P1
P1
Yes
No
1
(with LEDMon )
Yes
(with LEDMon1)
Yes
Yes
(with LEDMon1)
Red Hat Enterprise Linux 7.1* x64, Legacy Boot
Red Hat Enterprise Linux 7.1* x64, uEFI Boot
Red Hat Enterprise Linux 7.2* x64, Legacy Boot
Red Hat Enterprise Linux 7.2* x64, uEFI Boot
SuSE Linux Enterprise Server 11* SP3 x64, Legacy Boot
SuSE Linux Enterprise Server 11* SP3 x64, uEFI Boot
SuSE Linux Enterprise Server 11* SP3 x86, Legacy Boot
SuSE Linux Enterprise Server 12* SP1 SP4 x64, Legacy Boot
P1
P1
P1
P1
P1
P1
P1
P1
Yes
Yes
Yes
Yes
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
1
LEDmon version 0.79 has been tested and is supported by Intel. This version can can be downloaded from the following public web site
http://sourceforge.net/projects/ledmon/files/ledmon-0.79
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Operating
SATA
ESRT2 SW
RAID
Support
(Y/N)
Yes
SATA RSTe SW
RAID
System
Validation
Level
(P)
Operating System
Support
(Y/N)
SuSE Linux Enterprise Server 12* SP1 SP4 x64, uEFI Boot
Windows Server 2008* R2 sp1 x64, Legacy Boot
Windows Server 2008* R2 sp1 x64, uEFI Boot
Windows Server 2008* R2 sp1 x86, Legacy Boot
Windows 7* x64, Legacy boot
P1
P2
P2
P2
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
P2
Windows 7* x64, uEFI boot
P2
Yes
No
Windows 10* x64, uEFI Boot
Windows 10* x64, Legacy Boot
P2
P2
Yes
Yes
No
Yes
No
(AHCI mode
only. No RAID
support)
VMWare ESXi 5.5* U2
P2
No
VMWare ESXi 6.0* U2
P2
P2
P2
P2
P3
P3
P3
P3
P3
P3
P3
P3
P3
Ubuntu 14.04 Server* x64, Legacy Boot
Ubuntu 14.04 Server* x64, EFI Boot
Ubuntu 14.04 Server* x86, Legacy Boot
CentOS 6.5* x64, Legacy Boot
CentOS 6.5* x64, uEFI Boot
CentOS 6.5* x86, Legacy Boot
CentOS 7.1* x64, uEFI Boot
CentOS 7.1* x64, Legacy Boot
CentOS 7.2* x64, uEFI Boot
No
No
No
No
No
No
Yes
Yes
Yes
Yes
No
No
No
No
No
No
No
No
Yes
Yes
Yes
Yes
No
No
CentOS 7.2* x64, Legacy Boot
FreeBSD 10* x64 Legacy Boot
FreeBSD 10* x86 Legacy Boot
Table 3. Operating System Validation Levels
Operating System Validation Levels
P1
Yes
Yes
Yes
T1
P2
P3
Basic Installation testing
Yes
Yes
Test all on-board I/O features in all modes
Adapter\Peripheral Compatibility & Stress testing
Technical Support Level
T2
T3
See the following sections for additional information regarding validation levels and technical support levels
as referenced in Table 3.
2.1.1
OS Validation Levels
Basic installation testing is performed with each supported operating system. The testing validates that the
system can install the operating system and that the base hardware feature set is functional. A small set of
peripherals is used for installation purposes only. Add-in adapter cards are not tested.
Adapter compatibility validation (CV) testing uses test suites to gain an accurate view of how the server
performs with a wide variety of adapters under the primary supported operating systems. These tests are
designed to show hardware compatibility between the cards and the server platform and include functional
testing only. No heavy stressing of the systems or the cards is performed for CV testing.
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Stress Testing uses configurations that include add-in adapters in all available slots for a 48-hour (two days),
or a 72-hour (three days) test run without injecting errors. Each configuration passes an installation test and
a Network/Disk Stress test. Any fatal errors that occur require a complete test restart.
2.1.2
OS Technical Support Levels
T1: Intel will provide support for issues involving the installation and/or functionality of a specified
operating system as configured with or without supported adapters and/or peripherals.
T2: Intel will provide and test operating system drivers for each of the server board’s integrated controllers,
provided that the controller vendor has a driver available upon request. Vendors will not be required by Intel
to develop drivers for operating systems that they do not already support. Intel will NOT provide support for
issues related to the use of any add-in adapters or peripherals installed in the server system when an
operating system that received only basic installation testing is in use.
T3: Intel will not provide technical support for an open source operating system. All questions and issues
related to an open source operating system must be submitted to and supported by the open source
community supporting the given operating system.
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2.2 System Features Overview
Figure 1. System Components Overview
Top Cover
Removal
Thumb Pad
Captive Thumb
Screw Fasteners
240 VA UL
Safety Screw
Top Cover
Removal
Thumb Pad
Quick Reference
Figure 2. Top Cover Features
Note: The systems that includes a fastener screw towards on the front edge of the top cover is necessary to
comply with 240VA UL Safety requirements. Systems that come without screws along the front edge of the
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top cover, the thumbscrews at the rear must be torqued to ~5.5 in/lb (0.9 Nm) to comply with 240VA UL
safety requirements of some countries.
2.3 Server Board Features Overview
The following illustration provides a general overview of the server board, identifying key feature and
component locations. Please refer to Intel® Server Board S2600WT Technical Product Specification for more
information.
Figure 3. Server Board Features
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The server board includes several LEDs to identify system status and / or indicate a component fault. The
following illustrations define each Diagnostic LED and identify their location.
Figure 4. On-board Light Guided Diagnostics
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Figure 5. DIMM Fault LEDs
Figure 6. System Reset and Configuration Jumpers
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2.4 Back Panel Features
Figure 7. Back Panel Feature Identification
2.5 Front Control Panel
Label
Description
Label
Description
A
B
C
D
E
System ID Button w/Integrated LED
NMI Button (recessed, tool required for use)
NIC-1 Activity LED
F
Power Button w/Integrated LED
G
H
Hard Drive Activity LED
NIC-2 Activity LED
System Cold Reset Button (recessed, tool required for use)
System Status LED
Figure 8. Front Control Panel Options
2.6 Front Drive Bay Options
Figure 9. 3.5" Drive Bay – 4 Drive Configuration (Model R1304WTxxxxx)
Figure 10. 2.5" Drive Bay – 8 Drive Configuration (Model R1208WTxxxxx)
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2.7 Locking Front Bezel
The optional front bezel is made of Black molded plastic and uses a snap-on design. When installed, its
design allows for maximum airflow to maintain system cooling requirements. The front bezel includes a
keyed locking mechanism which can be used to prevent unauthorized access to installed storage devices
and front I/O ports.
Figure 11. Front Bezel
(Intel Product Order Code – A1UBEZEL)
The face of the bezel assembly includes snap-in identification badge options and a wave feature option to
allow for customization.
Figure 12. Front Bezel accessory with optionally installed wave feature
Figure 13. Front Bezel accessory with optionally installed wave and ID badge (1)
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Intel® R1000WT Server System TPS
Figure 14. Front Bezel accessory with optionally installed wave and ID badge (2)
Figure 15. Front Bezel accessory ID Badge mechanical drawings
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2.8 System Dimensions
2.8.1
Chassis Dimensions
750 W
Power
supply with
handle
rotated out
28”
712 mm
30.25”
769 mm
17.25”
1.7”
Figure 16. Chassis Dimensions
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Intel® R1000WT Server System TPS
2.8.2
Label Emboss Dimensions
51.8mm x 26mm
70mm x 13mm
189.60m
385.75m
45mm
93mm
Figure 17. Label Emboss Dimensions
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2.8.3
Pull-out Tab Label Emboss Dimensions
46mm x 26mm
Figure 18. Pull-out Tab Label Emboss Dimensions
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Intel® R1000WT Server System TPS
2.9 System Cable Routing Channels
The 1U system provides a cable routing channel (front-to-back / back–to-front) along each chassis sidewall.
No cables should be routed directly in front of the system fans or through the center of the server board
between the memory slots and CPU sockets. See Appendix E. for system cable routing diagrams.
Figure 19. System Cable Routing Channels
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2.10 Available Rack and Cabinet Mounting Kit Options
Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of the
server system while installed in a rack. If you chose to do so, Intel advises you verify your shipping
configuration with appropriate shock and vibration testing, before shipment. Intel does not perform shipping
tests which cover the complex combination of unique rack offerings and custom packaging options.
Caution: Exceeding the rail kit’s specified maximum weight limit or misalignment of the server in the rack
may result in failure of the rack rails, resulting in damage to the system or personal injury. Two people or the
use of a mechanical assist tool to install and align the server into the rack is highly recommended.
.
AXXPRAIL – Tool-less rack mount rail kit
-
1U and 2U compatible
-
-
-
-
-
-
800mm max travel length
54 lbs (24 Kgs) max support weight
Tool-less installation
Full extension from rack
Drop in system install
Optional cable management arm support
.
AXXELVRAIL – Enhanced Value rack mount rail kit
-
1U to 4U compatible
-
-
-
-
-
130 lbs (59 Kgs) max support weight
Tool-less chassis attach
Tools required to attach to rails to rack
2/3 extension from rack
Improved robustness over AXXVRAIL, same mechanical spec
.
.
AXX1U2UCMA – Cable Management Arm – *supported with AXXPRAIL only
AXX2POSTBRCKT – 2-Post Fixed mount bracket kit
-
1U and 2U compatible
-
Tools required to attach components to rack
.
A1USHRTRAIL - 1U Premium quality rails with no CMA support
-
Travel distance 780mm
-
-
Full extension from rack
Kit includes: Rails, screws, installation manual
.
A1UFULLRAIL - 1U Premium quality rails with CMA support.
-
Travel distance 780mm
-
-
-
Full extension from rack
Kit includes: Rails, screws, installation manual
For Cable Management arm support – order iPC AXX1U2UCMA
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Intel® R1000WT Server System TPS
2.11 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 4. System Environmental Limits Summary
Parameter
Limits
Temperature
Operating
ASHRAE Class A2 – Continuous Operation. 10º C to 35º C (50º F to 95º F) with the maximum
rate of change not to exceed 10°C per hour
ASHRAE Class A3 – Includes operation up to 40C for up to 900 hrs per year.
ASHRAE Class A4 – Includes operation up to 45C for up to 90 hrs per year.
-40º C to 70º C (-40º F to 158º F)
Shipping
Operating
Shipping
Altitude
Support operation up to 3050m with ASHRAE class deratings.
Humidity
50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from 25°
C to 35° C)
Shock
Operating
Unpackaged
Packaged
Half sine, 2g, 11 mSec
Trapezoidal, 25 g, velocity change is based on packaged weight
ISTA (International Safe Transit Association) Test Procedure 3A 2008
Vibration
AC-DC
Unpackaged
Packaged
5 Hz to 500 Hz 2.20 g RMS random
ISTA (International Safe Transit Association) Test Procedure 3A 2008
Voltage
90 Hz to 132 V and 180 V to 264 V
47 Hz to 63 Hz
Frequency
Source Interrupt
No loss of data for power line drop-out of 12 mSec
Unidirectional
Surge Non-
operating and
operating
Line to earth Only AC Leads
I/O Leads
2.0 kV
1.0 kV
0.5 kV
DC Leads
ESD
Air Discharged
12.0 kV
Contact Discharge 8.0 kV
Acoustics
Sound Power
Measured
Power in Watts
<300 W
7.0
≥300 W
7.0
≥600 W ≥1000 W
7.0 7.0
Servers/Rack
Mount Sound
Power Level (in
BA)
See Appendix D in this document or the Intel® Server Board S2600WT Product Family Power Budget and
Thermal Configuration Tool for system configuration requirements and limitations.
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2.12 System Packaging
The original Intel packaging, in which the server system is delivered, is designed to provide protection to a
fully configured system and was tested to meet ISTA (International Safe Transit Association) Test Procedure
3A (2008). The packaging was also designed to be re-used for shipment after system integration has been
completed.
The original packaging includes two layers of boxes – an inner box and the outer shipping box, and various
protective inner packaging components. The boxes and packaging components are designed to function
together as a protective packaging system. When reused, all of the original packaging material must be used,
including both boxes and each inner packaging component. In addition, all inner packaging components
MUST be reinstalled in the proper location to ensure adequate protection of the system for subsequent
shipment.
NOTE: The design of the inner packaging components does not prevent improper placement within the
packaging assembly. There is only one correct packaging assembly that will allow the package to meet the
ISTA (International Safe Transit Association) Test Procedure 3A (2008) limits. See the Intel® Server System
R1000WT Product Family System Integration and Service Guide for complete packaging assembly
instructions.
Failure to follow the specified packaging assembly instructions may result in damage to the system during
shipment.
Outer Shipping Box External Dimensions:
Length = 983mm
Breadth = 577mm
Height = 260mm
Inner Box Internal Dimensions:
Length = 956mm
Breadth = 550mm
Height = 202mm
2.12.1
Intel Product Weight Information
Packaged
Gross Weight
(Kg)
Packaged
Gross Weight
(Lbs)
Un-packaged
Net Weight
(Kg)
Un-packaged
Net Weight
(Lbs)
Product code
Product Type
R1304WTXXX
R1208WTXXX
R1304WTTGSR
R1304WT2GSR
R1208WTTGSR
R1208WT2GSR
Chassis Only
Chassis Only
L6 System
L6 System
L6 System
L6 System
19.0
41.9
10.3
22.7
19.0
21.3
21.3
21.1
21.1
41.9
47.0
47.0
46.5
46.5
10.3
12.3
12.3
12.9
12.9
22.7
27.1
27.1
28.4
28.4
Note: An L6 system does not include processors, memory, drives, or add-in cards. It is the system
configuration as shipped from Intel. Integrated system weights (System configurations that include the items
above) will vary depending on the final system configuration. For the 1U product family, a fully integrated
un-packaged system can weigh upwards of 40 Lbs (18+ Kg).
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Intel® R1000WT Server System TPS
3. System Power
This chapter provides a high level overview of the features and functions related to system power.
3.1 Power Supply Configurations
The server system can have up to two power supply modules installed, supporting the following power
supply configurations: 1+0 (single power supply), 1+1 Redundant Power, and 2+0 Combined Power (non-
redundant). 1+1 redundant power and 2+0 combined power configurations are automatically configured
depending on the total power draw of the system. If the total system power draw exceeds the power capacity
of a single power supply module, then power from the 2nd power supply module will be utilized. Should this
occur, power redundancy is lost. In a 2+0 power configuration, total power available maybe less then twice
the rated power of the installed power supply modules due to the amount of heat produced with both
supplies providing peak power. Should system thermals exceed programmed limits, platform management
will attempt to keep the system operational. See Closed Loop System Throttling (CLST) later in this chapter,
and Chapter 4 Thermal Management, for details.
Caution: Installing two Power Supply Units with different wattage ratings in a system is not supported.
Doing so will not provide Power Supply Redundancy and will result in multiple errors being logged by
the system.
The power supplies are modular, allowing for tool-less insertion and extraction from a bay in the back of the
chassis. When inserted, the card edge connector of the power supply mates blindly to a matching slot
connector on the server board.
Figure 20. 750W AC Power Supply
In the event of a power supply failure, redundant 1+1 power supply configurations have support for hot-
swap extraction and insertion. The AC input is auto-ranging and power factor corrected.
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3.2 Power Supply Module Options
There are two power supply options available for this server product family: 750W AC Platinum and 750W
DC Gold.
3.2.1
Power Supply Module Efficiency
The following tables provide the required minimum efficiency level at various loading conditions. These are
provided at three different load levels: 100%, 50%, and 20%.
The AC power supply efficiency is tested over an AC input voltage range of 115 VAC to 220 VAC.
Table 5. 750 Watt AC Power Supply Efficiency (Platinum)
Loading
Minimum Efficiency 91%
100% of maximum 50% of maximum 20% of maximum 10% of maximum
94% 90% 82%
The DC power supply efficiency is tested with a -53V DC input.
Table 6. 750 Watt DC Power Supply Efficiency (Gold)
Loading
Minimum Efficiency 88%
100% of maximum 50% of maximum 20% of maximum 10% of maximum
92% 88% 80%
3.2.2
Power Supply Module Mechanical Overview
750W AC Power Supply
module with single fan
750W DC Power Supply Module
AC and DC Power Cable Connectors
Figure 21. Power Supply Module Overview
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Intel® R1000WT Server System TPS
The physical size of the 750W AC power supply enclosure is 39mm x 74mm x 185mm. The power supply
contains a single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card edge
connector in the system. The AC plugs directly into the external face of the power supply.
Airflow direction
2mm
A25
Retention Latch
B25
185mm
FCI 2x25 card
74mm
edge connector
B1
A1
40x40x28mm fan
11mm
39mm
8.5mm
Figure 22. 750W AC Power Supply Module Mechanical Drawing
3.2.3
Power Cord Specification Requirements
The AC power cord used must meet the specification requirements listed in the following table.
Table 7. AC Power Cord Specifications
Cable Type
SJT
Wire Size
16 AWG
105ºC
13 A
Temperature Rating
Amperage Rating
Voltage Rating
125 V
Figure 23. AC Power Cord
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Intel® R1000WT Server System TPS
Figure 24. DC Power Cord Specification
Table 8. DC Power Cable Connector Pin-out
Pin
Definition
1
+ Return
2
3
Safety Ground
- 48V
3.3 AC Power Supply Input Specifications
The following sections provide the AC Input Specifications for systems configured with AC power supply
modules.
3.3.1
Power Factor
The power supply must meet the power factor requirements stated in the Energy Star* Program
Requirements for Computer Servers. These requirements are stated below.
Output power
Power factor
Tested at 230Vac, 50Hz and 60Hz and 115VAC, 60Hz.
10% load
> 0.65
20% load
> 0.80
50% load
> 0.90
100% load
> 0.95
3.3.2
AC Input Voltage Specification
The power supply must operate within all specified limits over the following input voltage range. Harmonic
distortion of up to 10% of the rated line voltage must not cause the power supply to go out of specified
limits. Application of an input voltage below 85VAC shall not cause damage to the power supply, including a
blown fuse.
Table 9. AC Input Voltage Range – 750W Power Supply
Start-up VAC
100-127 Vrms 140 Vrms 85VAC +/-4VAC 70VAC +/-5VAC
Voltage (220) 180 Vrms 200-240 Vrms 264 Vrms
Frequency 47 Hz 50/60 63 Hz
Power-off VAC
PARAMETER
MIN
RATED
VMAX
Voltage (110) 90 Vrms
1. Maximum input current at low input voltage range shall be measured at 90VAC, at max load.
2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
3. This requirement is not to be used for determining agency input current markings.
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Intel® R1000WT Server System TPS
3.3.3
AC Line Isolation Requirements
The power supply shall meet all safety agency requirements for dielectric strength. Transformers’ isolation
between primary and secondary windings must comply with the 3000Vac (4242Vdc) dielectric strength
criteria. If the working voltage between primary and secondary dictates a higher dielectric strength test
voltage the highest test voltage should be used. In addition the insulation system must comply with
reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits,
and primary to ground circuits, must comply with the IEC 950 spacing requirements.
3.3.4
AC Line Dropout / Holdup
An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any
length of time. During an AC dropout the power supply must meet dynamic voltage regulation requirements.
An AC line dropout of any duration shall not cause tripping of control signals or protection circuits. If the AC
dropout lasts longer than the holdup time the power supply should recover and meet all turn on
requirements. The power supply shall meet the AC dropout requirement over rated AC voltages and
frequencies. A dropout of the AC line for any duration shall not cause damage to the power supply.
Table 10. AC Line Holdup Time – 750W Power Supply
Loading
Holdup time
70%
12msec
3.3.4.1
AC Line 12VSBHoldup
The 12VSB output voltage should stay in regulation under its full load (static or dynamic) during an AC
dropout of 70ms min (=12VSB holdup time) whether the power supply is in ON or OFF state (PSON asserted
or de-asserted).
3.3.5
AC Line Fuse
The power supply shall have one line fused in the single line fuse on the line (Hot) wire of the AC input. The
line fusing shall be acceptable for all safety agency requirements. The input fuse shall be a slow blow type.
AC inrush current shall not cause the AC line fuse to blow under any conditions. All protection circuits in the
power supply shall not cause the AC fuse to blow unless a component in the power supply has failed. This
includes DC output load short conditions.
3.3.6
AC Inrush
AC line inrush current shall not exceed 55A peak, for up to one-quarter of the AC cycle, after which, the input
current should be no more than the specified maximum input current. The peak inrush current shall be less
than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device).
The power supply must meet the inrush requirements for any rated AC voltage, during turn on at any phase
of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any
duration, and over the specified temperature range (Top).
3.3.7
AC Line Transient Specification
AC line transient conditions shall be defined as “sag” and “surge” conditions. “Sag” conditions are also
commonly referred to as “brownout”, these conditions will be defined as the AC line voltage dropping below
nominal voltage conditions. “Surge” will be defined to refer to conditions when the AC line voltage rises
above nominal voltage.
The power supply shall meet the requirements under the following AC line sag and surge conditions.
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Intel® R1000WT Server System TPS
Table 11. AC Line Sag Transient Performance
AC Line Sag (10sec interval between each sagging)
Duration
0 to 1/2 AC cycle 95%
> 1 AC cycle >30% Nominal AC Voltage ranges 50/60Hz
Sag
Operating AC Voltage
Nominal AC Voltage ranges 50/60Hz
Line Frequency
Performance Criteria
No loss of function or performance
Loss of function acceptable, self-recoverable
Table 12. AC Line Surge Transient Performance
AC Line Surge
Operating AC Voltage Line Frequency
Nominal AC Voltages 50/60Hz
Mid-point of nominal AC Voltages 50/60Hz
Duration
Continuous
Surge
10%
Performance Criteria
No loss of function or performance
0 to ½ AC cycle 30%
No loss of function or performance
3.3.8
Susceptibility Requirements
The power supply shall meet the following electrical immunity requirements when connected to a cage with
an external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification.
For further information on Intel standards please request a copy of the Intel Environmental Standards
Handbook.
Table 13. Performance Criteria
Level
Description
A
The apparatus shall continue to operate as intended. No degradation of performance.
B
C
The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits.
Temporary loss of function is allowed provided the function is self-recoverable or can be restored by the
operation of the controls.
3.3.9
Electrostatic Discharge Susceptibility
The power supply shall comply with the limits defined in EN 55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-2: Edition 1.2: 2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.
3.3.10
Fast Transient/Burst
The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-4: Second edition: 2004-07 test standard and performance criteria B defined in Annex B of CISPR
24.
3.3.11
Radiated Immunity
The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-3: Edition 2.1: 2002-09 test standard and performance criteria A defined in Annex B of CISPR 24.
3.3.12
Surge Immunity
The power supply shall be tested with the system for immunity to the following for each power supply
option:
.
750W Power Supply – AC Unidirectional wave; 2kV line to ground and 1kV line to line, per EN
55024: 1998/A1: 2001/A2: 2003, EN 61000-4-5: Edition 1.1:2001-04 .
The pass criteria include: No unsafe operation is allowed under any condition; all power supply output
voltage levels to stay within proper spec levels; No change in operating state or loss of data during and after
the test profile; No component damage under any condition.
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The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-5: Edition 1.1:2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.
3.3.13
Power Recovery
The power supply shall recover automatically after an AC power failure. AC power failure is defined to be
any loss of AC power that exceeds the dropout criteria.
3.3.14
Voltage Interruptions
The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-11: Second Edition: 2004-03 test standard and performance criteria C defined in Annex B of CISPR
24.
3.3.15
Protection Circuits
Protection circuits inside the power supply cause only the power supply’s main outputs to shut down.If the
power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON#
cycle HIGH for one second reset the power supply.
3.3.15.1
Over-current Protection (OCP)
The power supply shall have current limit to prevent the outputs from exceeding the values shown in table
below. If the current limits are exceeded the power supply shall shutdown and latch off. The latch will be
cleared by toggling the PSON# signal or by an AC power interruption. The power supply shall not be
damaged from repeated power cycling in this condition. 12VSB will be auto-recovered after removing OCP
limit.
Table 14. Over Current Protection – 750 Watt Power Supply
Output Voltage Input voltage range Over Current Limits
+12V
90 – 264VAC
90 – 264VAC
72A min; 78A max
2.5A min; 3.5A max
12VSB
3.3.15.2
Over-voltage Protection (OVP)
The power supply over voltage protection shall be locally sensed. The power supply shall shutdown and
latch off after an over voltage condition occurs. This latch shall be cleared by an AC power interruption. The
values are measured at the output of the power supply’s connectors. The voltage shall never exceed the
maximum levels when measured at the power connectors of the power supply connector during any single
point of fail. The voltage shall never trip any lower than the minimum levels when measured at the power
connector. 12VSB will be auto-recovered after removing OVP limit.
Table 15. Over Voltage Protection (OVP) Limits – 750W Power Supply
Output Voltage
+12V
MIN (V)
13.3
MAX (V)
14.5
14.5
+12VSB
13.3
3.3.15.3
Over-temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply
temperature drops to within specified limits, the power supply shall restore power automatically, while the
12VSB remains always on. The OTP circuit must have built in margin such that the power supply will not
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Intel® R1000WT Server System TPS
oscillate on and off due to temperature recovering condition. The OTP trip level shall have a minimum of 4°C
of ambient temperature margin.
3.3.16
Power Supply Status LED
There is a single bi-color LED to indicate power supply status. The LED operation is defined in the following
table.
Table 16. LED Indicators
Power Supply Condition
Output ON and OK
LED State
GREEN
No AC power to all power supplies
OFF
AC present / Only 12VSB on (PS off) or PS in Cold
redundant state
1Hz Blink GREEN
AC cord unplugged or AC power lost; with a second
power supply in parallel still with AC input power.
AMBER
Power supply warning events where the power supply
continues to operate; high temp, high power, high
current, slow fan.
1Hz Blink Amber
AMBER
Power supply critical event causing a shutdown; failure,
OCP, OVP, Fan Fail
Power supply FW updating
2Hz Blink GREEN
3.4 DC Power Supply Input Specifications
The following sections provide the DC Input Specifications for systems configured with DC power supply
modules.
NOTE: Product Safety Regulations pertaining to the use of DC power supplies require that chassis grounding
studs be used for all DC power supply configurations. In the event that chassis grounding studs are not
available on a given server chassis, systems must be configured with two DC power supplies, with each
connected to separate ground wires while the system is operational.
3.4.1
DC Input Voltage
The power supply must operate within all specified limits over the following input voltage range.
Table 17. DC Input Rating
PARAMETER
MIN
RATED
MAX
DC Voltage
-40.5 VDC
-48VDC/-60VDC
-75VDC
Input Current
24A
12.5A
3.4.2
DC Input Fuse
The power supply shall have the -48VDC input fused. The fusing shall be acceptable for all safety agency
requirements. DC inrush current shall not cause the fuse to blow under any conditions. No protection circuits
in the power supply shall cause the DC fuse to blow unless a component in the power supply has failed. This
includes DC output load short conditions.
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Intel® R1000WT Server System TPS
3.4.3
DC Inrush Current
Maximum inrush current from power-on shall be limited to a level below the surge rating of the input line
cable; input diodes, fuse, and EMI filter components. To allow multiple power cycling events and DC line
transient conditions max I²t value shall not exceed 20% of the fuse max rating. Repetitive ON/OFF cycling of
the DC input line voltage should not damage the power supply or cause the input fuse to blow.
3.4.4
DC Input Under Voltage
The power supply shall contain protection circuitry (under-voltage lock-out) such that the application of an
input voltage below the specified minimum specified, shall not cause damage (overstress) to the power
supply unit (due to over-heating or otherwise).
3.4.5
DC Holdup Time and Dropout
Loading
750W (100%)
Holdup time
0.2msec
During a DC dropout of 0.2ms or less the power supply must meet dynamic voltage regulation requirements
for every rated load condition. A DC line dropout of 0.2ms or less shall not cause tripping of control signals
or protection circuits. Repeated every 10 seconds starting at the min input voltage DC line dropout shall not
damage the power supply under any specified load conditions. The PWOK signal shall not go to a low state
under these conditions. DC dropout transients in excess of 0.2 milliseconds may cause shutdown of the PS
or out of regulation conditions, but shall not damage the power supply. The power supply should recover
and meet all turn on requirements for DC dropouts that last longer than 0.2ms. The power supply must meet
the DC dropout requirement over rated DC voltages and output loading conditions.
3.4.6
DC Line Surge Voltages (Line Transients)
The Power Supply should demonstrate tolerance for transients in the input DC power line caused by
switching or lightning. The power supply shall be primarily tested and must be compliant with the
requirements of EN61000-4-5: “Electrical Fast transients / Burst Requirements and Surge Immunity
Requirements” for surge withstand capability. The test voltage surge levels are to be: 500Vpk for each Line
to Primary Earth Ground test (none required between the L1 and L2). The exact description can be found
in Intel Environmental Standards Handbook 2001.
Table 18. Line Voltage Transient Limits
Duration
Slope/Rate
Output
Performance criteria
-48V → -30V w/ +2V/µs
Rated DC Voltages
No loss of function or performance
200µs max
-30V → -48V w/ -2V/µs
Rated DC Voltages
No loss of function or performance
3.4.7
Susceptibility Requirements
The power supply shall meet the following electrical immunity requirements when connected to a cage with
an external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification.
For further information on Intel standards please request a copy of the Intel Environmental Standards
Handbook.
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Intel® R1000WT Server System TPS
Level
Description
A
B
The apparatus shall continue to operate as intended. No degradation of performance.
The apparatus shall continue to operate as intended. No degradation of performance
beyond spec limits.
C
Temporary loss of function is allowed provided the function is self-recoverable or can
be restored by the operation of the controls.
3.4.7.1
Electrostatic Discharge Susceptibility
The power supply shall comply with the limits defined in EN 55024: 1998 using the IEC 61000-4-2:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified
in the Intel Environmental Standards Handbook.
3.4.7.2
Fast Transient/Burst
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-4:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified
in the Intel Environmental Standards Handbook.
3.4.7.3
Radiated Immunity
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-3:1995 test
standard and performance criteria A defined in Annex B of CISPR 24. Limits shall comply with those specified
in the Intel Environmental Standards Handbook. Additionally, must also comply with field strength
requirements specified in GR 1089 (10V/meter).
3.4.7.4
Surge Immunity
The power supply shall be tested with the system for immunity, per EN 55024:1998, EN 61000-4-5:1995
and ANSI C62.45: 1992.
The pass criteria include: No unsafe operation is allowed under any condition; all power supply output
voltage levels to stay within proper spec levels; no change in operating state or loss of data during and after
the test profile; no component damage under any condition.
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-5:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified
in the Intel Environmental Standards Handbook.
3.4.8
Protection Circuits
Protection circuits inside the power supply shall cause only the power supply’s main outputs to shut down. If
the power supply latches off due to a protection circuit tripping, a DC cycle OFF for 15sec and a PSON# cycle
HIGH for 1sec shall be able to reset the power supply.
3.4.8.1
Current Limit (OCP)
The power supply shall have current limit to prevent the outputs from exceeding the values shown in table
below. If the current limits are exceeded the power supply shall shut down and latch off. The latch will be
cleared by toggling the PSON# signal or by a DC power interruption. The power supply shall not be damaged
from repeated power cycling in this condition. 12VSB will be auto-recovered after removing OCP limit.
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Intel® R1000WT Server System TPS
Table 19. Over Current Protection – 750 Watt Power Supply
Output VOLTAGE Input voltage range OVER CURRENT LIMITS
+12V
90 – 264VAC
72A min; 78A max
12VSB
90 – 264VAC
2.5A min; 3.5A max
3.4.8.2
Over Voltage Protection (OVP)
The power supply over voltage protection shall be locally sensed. The power supply shall shutdown and
latch off after an over voltage condition occurs. This latch shall be cleared by toggling the PSON# signal or
by a DC power interruption. The values are measured at the output of the power supply’s connectors. The
voltage shall never exceed the maximum levels when measured at the power connectors of the power
supply connector during any single point of fail. The voltage shall never trip any lower than the minimum
levels when measured at the power connector. 12VSBwill be auto-recovered after removing OVP limit.
Table 20. Over Voltage Protection Limits – 750 Watt Power Supply
Output Voltage
MIN (V)
MAX (V)
+12V
13.3
14.5
+12VSB
13.3
14.5
3.4.8.3
Over Temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply
temperature drops to within specified limits, the power supply shall restore power automatically, while the
12VSB remains always on. The OTP circuit must have built in margin such that the power supply will not
oscillate on and off due to temperature recovering condition. The OTP trip level shall have a minimum of 4°C
of ambient temperature margin.
3.5 Cold Redundancy Support
The power supplies support cold redundancy allowing them to go into a low-power state (that is, cold
redundant state) in order to provide increased power usage efficiency when system loads are such that both
power supplies are not needed. When the power subsystem is in Cold Redundant mode, only the needed
power supply to support the best power delivery efficiency is ON. Any additional power supplies; including
the redundant power supply, is in Cold Standby state
Each power supply has an additional signal that is dedicated to supporting Cold Redundancy; CR_BUS. This
signal is a common bus between all power supplies in the system. CR_BUS is asserted when there is a fault in
any power supply OR the power supplies output voltage falls below the Vfault threshold. Asserting the
CR_BUS signal causes all power supplies in Cold Standby state to power ON.
Enabling power supplies to maintain best efficiency is achieved by looking at the Load Share bus voltage and
comparing it to a programmed voltage level via a PMBus command.
Whenever there is no active power supply on the Cold Redundancy bus driving a HIGH level on the bus all
power supplies are ON no matter their defined Cold Redundant roll (active or Cold Standby). This guarantees
that incorrect programming of the Cold Redundancy states of the power supply will never cause the power
subsystem to shut down or become over loaded. The default state of the power subsystem is all power
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supplies ON. There needs to be at least one power supply in Cold Redundant Active state or Standard
Redundant state to allow the Cold Standby state power supplies to go into Cold Standby state.
3.5.1
Powering on Cold Standby supplies to maintain best efficiency
Power supplies in Cold Standby state shall monitor the shared voltage level of the load share signal to sense
when it needs to power on. Depending upon which position (1, 2, or 3) the system defines that power supply
to be in the cold standby configuration; will slightly change the load share threshold that the power supply
shall power on at.
Table 21. Example Load Share Threshold for Activating Supplies
Enable Threshold for
VCR_ON_EN
Disable Threshold for
VCR_ON_DIS
CR_BUS De-asserted / Asserted
States
Standard
NA; Ignore dc/dc_ active# signal; power supply is always ON
OK = High
Redundancy
Fault = Low
OK = High
Cold Redundant
Active
NA; Ignore dc/dc_ active# signal; power supply is always ON
Fault = Low
OK = Open
Fault = Low
OK = Open
Fault = Low
OK = Open
Fault = Low
Cold Standby 1 (02h)
Cold Standby 2 (03h)
Cold Standby 3 (04h)
3.2V (40% of max)
5.0V (62% of max)
6.7V (84% of max)
3.2V x 0.5 x 0.9 = 1.44V
5.0V x 0.67 x 0.9 = 3.01V
6.7V x 0.75 x 0.9 = 4.52V
Notes:
1. Maximum load share voltage = 8.0V at 100% of rated output power
2. These are example load share bus thresholds; for a given power supply, these shall be customized to maintain the best
efficiency curve for that specific model.
3.5.2
Powering on Cold Standby Supplies during a Fault or Over Current Condition
When an active power supply asserts its CR_BUS signal (pulling it low), all parallel power supplies in cold
standby mode shall power on within 100μsec.
3.5.3
BMC Requirements
The BMC uses the Cold_Redundancy_Config command to define or configure the power supply’s roll in cold
redundancy and to turn on/off cold redundancy.
The BMC shall schedule a rolling change for which PSU is the Active, Cold Stby1, Cold Stby 2, and Cold Stby
3 power supply. This allows for equal loading across power supply over their life.
Events that trigger a re-configuration of the power supplies using the Cold_Redundancy_Config command.
.
.
.
.
AC power ON
PSON power ON
Power Supply Failure
Power supply inserted into system
3.5.4
Power Supply Turn On Function
Powering on and off of the cold standby power supplies is only controlled by each PSU sensing the Vshare
bus. Once a power supply turns on after crossing the enable threshold; it lowers its threshold to the disable
threshold. The system defines the “position” of each power supply in the Cold Redundant operation. It will
do this each time the system is powered on, a power supply fails, or a power supply is added to the system.
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Intel® R1000WT Server System TPS
The system is relied upon to tell each power supply where it resides in the Cold Redundancy scheme.
3.6 Closed Loop System Throttling (CLST)
The server system has support for Closed Loop System Throttling (CLST). CLST prevents the system from
crashing if a power supply module is overloaded or insufficient cooled. Should system power reach a
pre-programmed power limit or power supply thermal sensor hit the threshold, CLST will throttle system
memory and/or processors to reduce power. System performance will be impacted should this occur.
3.7 Smart Ride Through (SmaRT)
The server system has support for Smart Ride through Throttling (SmaRT). This feature increases the
reliability for a system operating in a heavy power load condition, to remain operational during an AC line
dropout event. See section AC Line Dropout / Holdup for power supply hold up time requirements for AC
Line dropout events.
When AC voltage is too low, a fast AC loss detection circuit inside each installed power supply asserts an
SMBALERT# signal to initiate a throttle condition in the system. System throttling reduces the bandwidth to
both system memory and CPUs, which in turn reduces the power load during the AC line drop out event.
3.8 Server Board Power Connectors
The server board provides several connectors to provide power to various system options. The following
sub-sections will provide the pin-out definition; and a brief usage description for each.
3.8.1
Power Supply Module Card Edge Connector
Each power supply module has a single 2x25 card edge output connection that plugs directly into a
matching slot connector on the server board. The connector provides both power and communication
signals to the server board. The following table defines the connector pin-out.
Table 22. Power Supply Module Output Power Connector Pin-out
Pin
Name
Pin
Name
A1
GND
GND
GND
GND
GND
GND
GND
GND
GND
B1
GND
GND
GND
GND
GND
GND
GND
GND
GND
A2
A3
A4
A5
A6
A7
A8
A9
B2
B3
B4
B5
B6
B7
B8
B9
A10 +12V
A11 +12V
A12 +12V
A13 +12V
A14 +12V
A15 +12V
A16 +12V
A17 +12V
A18 +12V
B10 +12V
B11 +12V
B12 +12V
B13 +12V
B14 +12V
B15 +12V
B16 +12V
B17 +12V
B18 +12V
A19 PMBus SDA
B19 A0 (SMBus address)
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Name Pin Name
Pin
A20 PMBus SCL
B20 A1 (SMBus address)
A21 PSON
B21 12V stby
A22 SMBAlert#
A23 Return Sense
B22 Cold Redundancy Bus
B23 12V load share bus
A24 +12V remote Sense B24 No Connect
A25 PWOK
B25 Compatibility Check pin*
3.8.2
Hot Swap Backplane Power Connector
The server board includes one white 2x4-pin power connector that is cabled to provide power for hot swap
backplanes. On the server board, this connector is labeled as “HSBP PWR”. The following table provides the
pin-out for this connector.
Table 23. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR")
Signal Description Pin# Pin# Signal Description
P12V_240VA
P12V_240VA
P12V_240VA
P12V_240VA
5
6
7
8
1
2
3
4
GROUND
GROUND
GROUND
GROUND
3.8.3
Optical Drive and SSD Power Connector
The server board includes one brown 2x3-pin power connector intended to provide power to optionally
installed optical drive. On the server board this connector is labeled as “Peripheral PWR”. The following table
provides the pin-out for this connector.
Table 24. Peripheral Drive Power Connector Pin-out (“Peripheral PWR”)
Signal Description Pin# Pin# Signal Description
P12V
4
5
6
1
2
3
P5V
P3V3
P5V
GROUND
GROUND
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Intel® R1000WT Server System TPS
4. Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between 10°C and
35°C with limited excursion based operation up to 45°C, as specified in Table 2. System Environmental Limits
Summary. Working with integrated platform management, several features within the system are designed to
move air in a front to back direction, through the system and over critical components to prevent them from
overheating and allow the system to operate with best performance.
Figure 25. System Air Flow and Fan Identification
The following tables provide air flow data associated with the different system models within this 1U product
family, and are provided for reference purposes only. The data was derived from actual wind tunnel test
methods and measurements using fully configured (worst case) system configurations. Lesser system
configurations may produce slightly different data results. In addition, the CFM data was derived using server
management utilities that utilize platform sensor data, and may vary slightly from the data listed in the
tables.
Table 25. System Volumetric Air Flow
System airflow – R1304WTxxxx
System airflow – R1208WTxxxx
System Fan PSU Fan Total Airflow (CFM)
System Fan PSU Fan Total Airflow (CFM)
100%
80%
60%
40%
20%
100%
auto
auto
auto
auto
auto
100%
85.6
67.7
48.9
31.6
13.6
89.1
100%
80%
60%
40%
20%
100%
auto
auto
auto
auto
auto
100%
89.0
69.6
50.8
32.6
13.8
92.6
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Intel® R1000WT Server System TPS
The Intel® Server System R1000WT product family supports short-term, excursion-based, operation up to
45°C (ASHRAE A4) with limited performance impact. The configuration requirements and limitations are
described in the configuration matrix found in Appendix D of this document or in the Intel® Server Board
S2600WT Product Family Power Budget and Thermal Configuration Tool, available as a download online at
http://www.intel.com/support
The installation and functionality of several system components are used to maintain system thermals. They
include six managed 40mm dual rotor system fans, fans integrated into each installed power supply module,
an air duct, populated drive carriers, and installed CPU heats sinks. Drive carriers can be populated with a
storage device (SSD or Hard Disk Drive) or supplied drive blank. In addition, it may be necessary to have
specific DIMM slots populated with DIMMs or supplied DIMM blanks. Systems configurations that require
population of specific DIMM slots will ship from Intel with DIMM blanks pre-installed. Pre-installed DIMM
blanks should only be removed when installing a memory module in its place.
4.1 Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet the
following operating and configuration guidelines:
.
The system operating ambient is designed for sustained operation up to 35°C (ASHRAE Class A2)
with short term excursion based operation up to 45°C (ASHRAE Class A4).
-
The system can operate up to 40°C (ASHRAE Class A3) for up to 900 hours per year
The system can operate up to 45°C (ASHRAE Class A4) for up to 90 hours per year
-
-
System performance may be impacted when operating within the extended operating
temperature range
-
There is no long term system reliability impact when operating at the extended temperature
range within the documented limits.
.
Specific configuration requirements and limitations are documented in the configuration matrix
found in Appendix D of this document or in the Intel® Server Board S2600WT product family Power
Budget and Thermal Configuration Tool, available as a download online at
http://www.intel.com/support
.
.
The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be installed
at all times, with or without a processor installed
Thermally, a system supporting fan redundancy can support the following PCI add-in cards when the
system is operating at a maximum operating ambient temperature of 35°C (ASHRAE Class 2).
-
Add-in cards with a minimum 300 LFM (1.5 m/s) air flow requirement or lower can be installed in
available add-in card slots in Riser Card #1 and Riser Card #2
-
-
Add-in cards with an air flow requirement greater than 300 LFM cannot be supported in any PCIe
slot on any riser
Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s). Some
high power add-in cards have minimum air flow requirements of 300 LFM (1.5 m/s) or higher.
System integrators should verify PCI add-in card air flow requirements from vendor
specifications when integrating add-in cards into the system.
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Intel® R1000WT Server System TPS
.
.
Memory Slot population requirements –
NOTE: Some system configurations may come with pre-installed DIMM blanks in some memory slots.
DIMM blanks should only be removed when installing a DIMM in the same DIMM slot. Memory
population rules apply when installing DIMMs
-
DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C, and D. Start with the
1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3. Only remove factory installed DIMM
blanks when populating the slot with memory
-
-
DIMM Population Rules on CPU-2 – Install DIMMs in order; Channels E, F, G, and H. Start with the
1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3. Only remove factory installed DIMM
blanks when populating the slot with memory
The 3rd DIMM slot for each memory channel must be populated with a DIMM or supplied DIMM
blank for all R1304WTxxxx and R1208WTxxxx based system configurations
.
All externally accessed drive bays must be populated. Drive carriers can be populated with a storage
device (SSD or HDD) or supplied drive blank
.
.
With the system operating, the air duct must be installed at all times
In single power supply configurations, the 2nd power supply bay must have the supplied filler blank
installed at all times
.
The system must be configured with dual power supplies for the system to support system fan
redundancy
.
.
.
Fan redundancy is lost if more than one system fan rotor is in a failed state
System fan redundancy is not supported with systems operating at ASHRAE A3 or A4 thermal limits
The system top cover must be installed at all times when the system is in operation
4.2 Thermal Management Overview
In order to maintain the necessary airflow within the system, all of the previously listed components and top
cover need to be properly installed. For best system performance, the external ambient temperature should
remain below 35°C and all system fans (all rotors) should be operational. The system is designed for fan
redundancy when the system is configured with two power supplies, all system fans are present and
operational, and ambient air remains at or below ASHRAE class 2 limits (See table 2). In fan redundancy
mode, should a single system fan rotor failure occur, integrated platform management will: change the state
of the System Status LED to flashing Green, report an error to the system event log, and automatically adjust
remaining fan speeds as needed to maintain system temperatures below maximum thermal limits.
Note: All system fans are controlled independent of each other. The fan control system may adjust fan
speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the
chassis.
In the event that system temperatures should continue to increase with the system fans operating at their
maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or
the processors or both, in order to keep components from overheating and keep the system operational.
Throttling of these subsystems will continue until system temperatures are reduced below preprogrammed
limits.
The power supply will be protected against over temperature conditions caused by excessive ambient
temperature. In an over-temperature protection condition, the power supply module will shut down.
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Intel® R1000WT Server System TPS
Should system thermals increase to a point beyond the maximum thermal limits, the system will shut down,
the System Status LED will change to a solid Amber state, and the event will be logged to the system event
log. Should power supply thermals increase to a point beyond its maximum thermal limit or if a power
supply fan should fail, the power supply will shut down.
Note: For proper system thermal management, Sensor Data Records (SDRs) for any given system
configuration must be loaded by the system integrator as part of the initial system integration process. SDRs
are loaded using the FRUSDR utility which is part of the System Update Package (SUP) or One-boot Firmware
Update (OFU) package which can be downloaded from the following Intel website:
http://downloadcenter.intel.com
4.2.1
Fan Speed Control
The baseboard management controller (BMC) controls and monitors the system fans. Each fan is associated
with a fan speed sensor that detects fan failure. For redundant fan configurations, the fan failure and
presence status determines the fan redundancy sensor state.
The system fans are divided into fan domains, each of which has a separate fan speed control signal and a
separate configurable fan control policy. A fan domain can have a set of temperature and fan sensors
associated with it. These are used to determine the current fan domain state.
A fan domain has three states:
•
The sleep and boost states have fixed (but configurable through OEM SDRs) fan speeds associated
with them
•
The nominal state has a variable speed determined by the fan domain policy. An OEM SDR record is
used to configure the fan domain policy
The fan domain state is controlled by several factors. They are listed below in order of precedence, high to
low:
.
Boost
o
Associated fan is in a critical state or missing. The SDR describes which fan domains are boosted
in response to a fan failure or removal in each domain. If a fan is removed when the system is in
‘Fans-off’ mode it will not be detected and there will not be any fan boost till system comes out of
‘Fans-off; mode.
o
Any associated temperature sensor is in a critical state. The SDR describes which temperature
threshold violations cause fan boost for each fan domain.
o
o
The BMC is in firmware update mode, or the operational firmware is corrupted.
If any of the above conditions apply, the fans are set to a fixed boost state speed.
.
Nominal
A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the
state of one or more associated temperature sensors.
o
4.2.1.1 Programmable Fan PWM Offset
The system provides a BIOS Setup option to boost the system fan speed by a programmable positive offset
or a “Max” setting. Setting the programmable offset causes the BMC to add the offset to the fan speeds to
which it would otherwise be driving the fans. The Max setting causes the BMC to replace the domain
minimum speed with alternate domain minimums that also are programmable through SDRs.
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This capability is offered to provide system administrators the option to manually configure fan speeds in
instances where the fan speed optimized for a given platform may not be sufficient when a high end add-in
adapter is configured into the system. This enables easier usage of the fan speed control to support Intel as
well as third party chassis and better support of ambient temperatures higher than 35°C.
4.2.1.2 Fan Redundancy Detection
The BMC supports redundant fan monitoring and implements a fan redundancy sensor. A fan redundancy
sensor generates events when it is associated set of fans transitions between redundant and non-redundant
states, as determined by the number and health of the fans. The definition of fan redundancy is
configuration dependent. The BMC allows redundancy to be configured on a per fan redundancy sensor
basis through OEM SDR records.
A fan failure up to the number of redundant fans specified in the SDR in a fan configuration is a non-critical
failure and is reflected in the front panel status. A fan failure or removal that exceeds the number of
redundant fans is a non-fatal, insufficient-resources condition and is reflected in the front panel status as a
non-fatal error.
Redundancy is checked only when the system is in the DC-on state. Fan redundancy changes that occur
when the system is DC-off or when AC is removed will not be logged until the system is turned on.
4.2.1.3 Fan Domains
System fan speeds are controlled through pulse width modulation (PWM) signals, which are driven
separately for each domain by integrated PWM hardware. Fan speed is changed by adjusting the duty cycle,
which is the percentage of time the signal is driven high in each pulse.
The BMC controls the average duty cycle of each PWM signal through direct manipulation of the integrated
PWM control registers.
The same device may drive multiple PWM signals.
4.2.1.4 Nominal Fan Speed
A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state of one
or more associated temperature sensors.
OEM SDR records are used to configure which temperature sensors are associated with which fan control
domains and the algorithmic relationship between the temperature and fan speed. Multiple OEM SDRs can
reference or control the same fan control domain; and multiple OEM SDRs can reference the same
temperature sensors.
The PWM duty-cycle value for a domain is computed as a percentage using one or more instances of a
stepwise linear algorithm and a clamp algorithm. The transition from one computed nominal fan speed
(PWM value) to another is ramped over time to minimize audible transitions. The ramp rate is configurable by
means of the OEM SDR.
Multiple stepwise linear and clamp controls can be defined for each fan domain and used simultaneously.
For each domain, the BMC uses the maximum of the domain’s stepwise linear control contributions and the
sum of the domain’s clamp control contributions to compute the domain’s PWM value, except that a
stepwise linear instance can be configured to provide the domain maximum.
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Hysteresis can be specified to minimize fan speed oscillation and to smooth fan speed transitions. If a
Tcontrol SDR record does not contain a hysteresis definition, for example, an SDR adhering to a legacy
format, the BMC assumes a hysteresis value of zero.
4.2.1.5 Thermal and Acoustic Management
This feature refers to enhanced fan management to keep the system optimally cooled while reducing the
amount of noise generated by the system fans. Aggressive acoustics standards might require a trade-off
between fan speed and system performance parameters that contribute to the cooling requirements and
primarily memory bandwidth. The BIOS, BMC, and SDRs work together to provide control over how this
trade-off is determined.
This capability requires the BMC to access temperature sensors on the individual memory DIMMs.
Additionally, closed-loop thermal throttling is only supported with buffered DIMMs.
4.2.1.6 Thermal Sensor Input to Fan Speed Control
The BMC uses various IPMI sensors as input to the fan speed control. Some of the sensors are IPMI models
of actual physical sensors whereas some are “virtual” sensors whose values are derived from physical
sensors using calculations and/or tabular information.
The following IPMI thermal sensors are used as input to fan speed control:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Front Panel Temperature Sensor1
CPU Margin Sensors2,4,5
DIMM Thermal Margin Sensors2,4
Exit Air Temperature Sensor1, 7, 9
PCH Temperature Sensor3,5
On-board Ethernet Controller Temperature Sensors3, 5
Add-In Intel SAS Module Temperature Sensors3, 5
PSU Thermal Sensor3, 8
CPU VR Temperature Sensors3, 6
DIMM VR Temperature Sensors3, 6
BMC Temperature Sensor3, 6
Global Aggregate Thermal Margin Sensors 7
Hot Swap Backplane Temperature Sensors
I/O Module Temperature Sensor (With option installed)
Intel® SAS Module (With option installed)
Riser Card Temperature Sensors (2U system only)
Intel® Xeon Phi™ coprocessor (2U system only with option installed)
Notes:
1. For fan speed control in Intel chassis
2. Temperature margin from throttling threshold
3. Absolute temperature
4. PECI value or margin value
5. On-die sensor
6. On-board sensor
7. Virtual sensor
8. Available only when PSU has PMBus
9. Calculated estimate
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A simple model is shown in the following figure which gives a high level representation of how the fan speed
control structure creates the resulting fan speeds
Policy
Memory
Throttle
Settings
Events
Sensor
Policy: CLTT,
Acoustic/Performance,
Auto-Profile
System Behavior
Intrusion
configuration
Front Panel
Resulting
Fan Failure
Processor
Margin
Power Supply
Failure
Other Sensors
(Chipset, Temp,
etc..)
Figure 26. Fan Control Model
4.3 System Fans
Six dual rotor 40 x 56mm system fans and an embedded fan for each installed power supply provide the
primary airflow for the system.
The system is designed for fan redundancy when configured with two power supply modules, all system fan
rotors are operational, and ambient air remains at or below ASHRAE class 2 limits (See table 2). Should a
single system fan rotor fail, platform management will adjust air flow of the remaining system fans and
manage other platform features to maintain system thermals. Fan redundancy is lost if more than one
system fan rotor is in a failed state.
The system includes two system fan assemblies (three dual rotor fans each). The fan assemblies are held in
place by fitting them over mounting pins coming up from the chassis base.
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Figure 27. System Fan Assembly
.
.
System fans are NOT hot-swappable
Each fan and fan assembly is designed for tool-less insertion and extraction from the system. For
instructions on fan replacement, see the Intel® Server System R1000WT System Integration and
Service Guide
.
.
Each fan and fan assembly incorporates vibration dampening features used to minimize fan vibration
affects within the chassis
Fan speed for each fan is controlled by integrated platform management as controlled by the
integrated BMC on the server board. As system thermals fluctuate high and low, the integrated BMC
firmware will increase and decrease the speeds to specific fans to regulate system thermals.
.
Each fan has a tachometer signal for each rotor that allows the Integrated BMC to monitor their
status.
.
.
Each system fan includes a fault LED located near each system fan connector on the server board
Each fan has a 10-pin wire harness that connects to a matching connector on the server board.
On the server board , each system fan includes a pair of fan connectors; a 1x10 pin connector to support a
dual rotor cabled fan, typically used in 1U system configurations, and a 2x3 pin connector to support a single
rotor hot swap fan assembly, typically used in 2U system configurations. Concurrent use of both fan
connector types for any given system fan pair is not supported.
Pin 1
Pin 1
1U Cabled Fan
2U Hot Swap Fan – Not Used
Figure 28. System Fan Connector Locations on Server Board
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Table 26. System Fan Connector Pin-out
SYS_FAN 2
SYS_FAN 1
SYS_FAN 3
Signal Description
FAN_TACH1
Pin#
1
Signal Description
FAN_TACH3
Pin#
1
Signal Description
FAN_TACH5
Pin#
1
FAN_PWM0
2
FAN_PWM1
2
FAN_PWM2
2
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH0
3
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH2
3
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH4
3
4
4
4
5
5
5
GROUND
6
GROUND
6
GROUND
6
GROUND
7
GROUND
7
GROUND
7
FM_SYS_FAN0_PRSNT_N
LED_FAN_FAULT0_R
LED_FAN0
8
FM_SYS_FAN1_PRSNT_N
LED_FAN_FAULT1_R
LED_FAN1
8
FM_SYS_FAN2_PRSNT_N
LED_FAN_FAULT2_R
LED_FAN2
8
9
9
9
10
10
10
SYS_FAN 4
Signal Description
FAN_TACH7
SYS_FAN 5
Signal Description
FAN_TACH9
SYS_FAN 6
Signal Description
FAN_TACH11
Pin#
1
Pin#
1
Pin#
1
FAN_PWM3
2
FAN_PWM4
2
FAN_PWM5
2
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH6
3
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH8
3
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH10
3
4
4
4
5
5
5
GROUND
6
GROUND
6
GROUND
6
GROUND
7
GROUND
7
GROUND
7
FM_SYS_FAN3_PRSNT_N
LED_FAN_FAULT3_R
LED_FAN3
8
FM_SYS_FAN4_PRSNT_N
LED_FAN_FAULT4_R
LED_FAN4
8
FM_SYS_FAN5_PRSNT_N
LED_FAN_FAULT5_R
LED_FAN5
8
9
9
9
10
10
10
4.4 Power Supply Module Fans
Each installed power supply module includes embedded (non-removable) 40-mm fans. They are responsible
for airflow through the power supply module. These fans are managed by the fan control system. Should a
fan fail, the power supply will shut down.
4.5 FRUSDR Utility
The purpose of the embedded platform management and fan control systems is to monitor and control
various system features, and to maintain an efficient operating environment. Platform management is also
used to communicate system health to supported platform management software and support mechanisms.
The FRUSDR utility is used to program the server board with platform specific environmental limits,
configuration data, and the appropriate sensor data records (SDRs), for use by these management features.
The FRUSDR utility must be run as part of the initial platform integration process before it is deployed into a
live operating environment. Once the initial FRU and SDR data is loaded on to the system, all subsequent
system configuration changes will automatically update SDR data using the BMC auto configuration feature,
without having to run the FRUSDR utility again. However, to ensure the latest sensor data is installed, the
SDR data should be updated to the latest available as part of a planned system software update.
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The FRUSDR utility for the given server platform can be downloaded as part of the System Update Package
(SUP) or One-boot Firmware Update (OFU) package from the following Intel web site:
http://downloadcenter.intel.com
Note: The embedded platform management system may not operate as expected if the platform is not
updated with accurate system configuration data. The FRUSDR utility must be run with the system fully
configured during the initial system integration process for accurate system monitoring and event reporting.
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5. System Storage and Peripheral Drive Bay Overview
The Intel® Server System R1000WT product family has support for a variety of different storage options,
including:
.
.
.
Up to 8 x 2.5” hot swap SAS or SATA drives (hard disk or SSD)
Up to 4 x 3.5” hot swap SAS or SATA hard disk drives or 2.5” SSDs
Accessory Kit option to support up to 4 PCIe* SFF (NVMe) SSDs + up to 4 x 2.5” SAS drives (hard disk
or SSD)
.
.
.
SATA Slim-line Optical Drive support
Up to 2 internally mounted SATA DOMs
Internally mounted Low Profile (2mm) eUSB Solid State Device (eUSB SSD)
Support for different storage and peripheral options will vary depending on the system model and/or
available accessory options installed. This section will provide an overview of each available option.
5.1 Front Mount Drive Support
The 1U product family provides options to support either 8x2.5” or 4x3.5” front mounted drives. Both
system options provide front panel I/O and front control panel support.
Label
Description
A
System Label Pull-out
B
C
D
E
Video Connector
USB 3.0 Ports
Front Control Panel
2.5” Drive Bays
Figure 29. 8x2.5" Drive Bay Configuration (Model R1208xxxxx)
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Label
Description
A
System Label Pull-out Tab
B
C
D
E
F
SATA Optical Drive
Video Connector
USB 3.0 Ports
Front Control Panel
3.5” Drive Bays
Figure 30. 4x3.5" Drive Bay Configuration (Model R1304WTxxxx)
5.2 System Fan RVI and Hard Disk Drive Storage Performance
Hard disk drive storage technology, which utilizes the latest state-of-the-art track density architectures, are
susceptible to the effects of system fan rotational vibration interference (RVI) within the server system. As
system fan speeds increase to their upper limits (>80% PWM or > 19,320 RPM), hard disk drive performance
can be impacted.
Intel publishes a list of supported hard drives on its Tested Hardware and OS List (THOL). In general, unless
identified in the NOTES column in the THOL, all listed hard drives have been tested to meet Intel
performance targets when the systems fans are operating above 80% PWM and/or the system is operating
at or below the platform ambient thermal limit of 35°C (95°F).
The THOL may also list hard drives that are only recommended for use in non-extreme operating
environments, where the ambient air is at or below 20°C (68°F) and /or the hard drives are installed in system
configurations where the system fans regularly operate below 80% PWM. Hard drives that require these
support criteria for a given system will include an “Environmental Limitation” tag and message in the THOL
“NOTES” column for that device. Using these drives in the more extreme operating environments puts these
devices at higher risk of performance degradation.
Intel recommends the following general support guidelines for server systems configured with hard drive
storage technology:
•
Avoid sustained server operation in extreme operating environments. Doing so will cause the system
fans to operate at their upper speed limits and produce higher levels of RVI which could affect hard
drive performance.
Note: Solid State Drive (SSD) performance is not impacted by the effects of system fan RVI.
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5.3 Hot Swap Storage Device Carriers
Each SAS/SATA hard disk drive or SSD that interfaces with a backplane is mounted to a hot swap drive
carrier. Drive carriers include a latching mechanism used to assist with drive extraction and drive insertion.
Note: To ensure proper system air flow requirements, all front drive bays must be populated with a drive
tray. Drive trays must be installed with either a drive or supplied drive blank.
There are drive carriers to support 2.5” devices and 3.5” devices. To maintain system thermals, all drive bays
must be populated with a drive carrier mounted with a hard disk drive, SSD, or supplied drive blank. Drive
blanks used with the 3.5” drive carrier can also be used to mount a 2.5” SSD into it as shown below.
Figure 31. 2.5" SSD mounted to 3.5" Drive Tray
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Note: Due to degraded performance and reliability concerns, the use of the 3.5” drive blank as a 2.5” device
bracket is intended to support SSD type storage devices only. Installing a 2.5” hard disk drive into the 3.5”
drive blank cannot be supported.
Each drive carrier includes separate LED indicators for drive Activity and drive Status. Light pipes integrated
into the drive carrier assembly direct light emitted from LEDs mounted next to each drive connector on the
backplane to the drive carrier faceplate, making them visible from the front of the system.
Amber Status LED
2.5” only drive tray
Green Activity LED
Amber Status LED
Green Activity LED
2.5” / 3.5” drive tray
Figure 32. Drive Tray LED Identification
Table 27. Drive Status LED States
Off
No access and no fault
Amber Solid On Hard Drive Fault has occurred
Blink
RAID rebuild in progress (1 Hz), Identify (2 Hz)
Table 28. Drive Activity LED States
Condition
Drive Type
Behavior
SAS
LED stays on
LED stays off
Power on with no drive activity
Power on with drive activity
Power on and drive spun down
Power on and drive spinning up
SATA
SAS
LED blinks off when processing a command
LED blinks on when processing a command
LED stays off
SATA
SAS
Green
SATA
SAS
LED stays off
LED blinks
SATA
LED stays off
Note: The drive activity LED is driven by signals coming from the drive itself. Drive vendors may choose to
operate the activity LED different from what is described in the table above. Should the activity LED on a
given drive type behave differently than what is described, customers should reference the drive vendor
specifications for the specific drive model to determine what the expected drive activity LED operation
should be.
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5.4 Peripheral Power Sources
Power for all backplanes and peripheral storage devices is drawn from two power connectors labeled as
“HSBP_PWR” and “Peripheral_PWR” on the server board as illustrated below.
Figure 33. Server Board Peripheral Power Connectors
HSBP Power – The hot swap backplane power connector provides power for all front mounted backplane
options. Appropriate power cables to support any given backplane option will be included with the given
system model or given backplane accessory kit. See Table 21. Hot Swap Backplane Power Connector Pin-out
(“HSBP PWR").
Peripheral Power – The “Peripheral_PWR” connector is used to provide power to the optical SATA drive.
Depending on the system model, the system will ship with a peripheral power cable compatible with the
devices supported for the given system. See Table 22. Peripheral Drive Power Connector Pin-out (“Peripheral
PWR”).
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5.5 Optical Drive Support
Systems configured with four 3.5” drive bays also include support for an optical drive bay ‘A’ as illustrated
below.
Figure 34. Optical Drive Support
For systems that support eight 2.5” hard drives, the front I/O Panel, which provides video and USB ports, can
be replaced with a SATA optical drive.
A 2x3 pin power connector labeled “Peripheral_PWR” on the server board is designed to provide power to
the SATA optical drive. SATA signals for the optical drive are cabled from one of the two white single port
SATA connectors on the server board.
Figure 35. Optical Drive Installation
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5.6 Storage Backplane Options
The 1U systtem has support for several backplane options.
For 2.5” drives, available backplane options include:
.
.
8 x 2.5” drive SAS/SATA backplane
8 x 2.5” drive combo SAS / PCIe* SFF (NVMe) SSD backplane (Intel Accessory Kit
A1U44X25NVMEDK)
For 3.5” drives, available options include:
4 x 3.5 SAS/SATA backplane
.
All available backplane options mount directly to the back of the drive bay as shown in the following
illustration.
Figure 36. Backplane Installation
All available SAS/SATA compatible backplanes include the following common features:
.
.
12 Gb SAS and 6Gb SAS/SATA or slower support
29-pin SFF-8680 12 Gb rated drive interface connectors, providing both power and I/O signals to
attached devices
.
.
.
.
.
.
.
.
.
.
.
Hot swap support for SAS/SATA devices
Mini-SAS HD input connectors that are 12Gb capable
SGPIO SFF-8485 interface embedded within the sideband of the mini-SAS HD connectors
I2C interface from a 5-pin connector for device status communication to the BMC over slave SMBus
HSBP microcontroller – Cypress* CY8C22545-24AXI Programmable System-on-Chip (PSoC*) device
LEDs to indicate drive activity and status for each attached device
Device presence detect inputs to the microcontroller
5V VR for devices
3.3V VR for microcontroller
In-application microcontroller FW updateable over the I2C interface
FRU EEPROM support
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.
Temperature sensor through the use of a TMP75 (or equivalent) thermistor implementation with the
microcontroller
5.6.1
SGPIO Functionality
Backplanes include support for an SFF-8485 compliant SGPIO interface used to activate the Status LED. This
interface is also monitored by the microcontroller for generating FAULT, IDENTIFY, and REBUILD registers
that in turn are monitored by the server board BMC for generating corresponding SEL events.
5.6.2
I2C Functionality
The microcontroller has a master/slave I2C connection to the server board BMC. The microcontroller is not
an IPMB compliant device. The BMC will generate SEL events by monitoring registers on the HSBP
microcontroller for DRIVE PRESENCE, FAULT, and RAID REBUILD in progress.
5.6.3
4 x 3.5” Drive Hot-Swap Backplane Overview
Intel Spare Product Code: FR1304S3HSBP
All 3.5” drive system SKUs within the product family will ship with a 4 x drive backplane capable of
supporting 12 Gb/sec SAS and 6 Gb/sec SAS / SATA drives. Both hard disks and Solid State Devices (SSDs)
can be supported within a common backplane. Each backplane can support either SATA or SAS devices.
However, mixing of SATA and SAS devices within a common hot swap backplane is not supported.
Supported devices are dependent on the type of host bus controller driving the backplane, SATA only or
SAS.
The front side of the backplane includes 8 x 29-pin drive interface connectors, each capable of supporting
12 Gb SAS or 6 Gb SAS/SATA. The connectors are numbered 0 thru 3. Signals for all four drive connectors
are routed to a single multi-port mini-SAS HD connector on the back side of the backplane.
Label Description
A
B
C
D
HDD_0
HDD_1
HDD_2
HDD_3
Figure 37. 4 x 3.5” Drive Hot-Swap Backplane – front view
On the backside of the backplane are several connectors. The following illustration identifies each.
Label
Description
A
Power connector
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Intel® R1000WT Server System TPS
B
C
SAS/SATA Ports 0-3 Mini-SAS HD cable connector
I2C connector
Figure 38. 4 x 3.5” Drive Hot-Swap Backplane – rear view
A – Power Harness Connector – The backplane includes a 2x2 connector supplying power to the backplane.
Power is routed to the backplane via a power cable harness from the server board.
B – Multi-port Mini-SAS Cable Connector – The backplane includes one multi-port mini-SAS cable connector
providing I/O signals for four SAS/SATA drives on the backplane. A cable can be routed from matching
connectors on the server board or add-in SAS/SATA RAID cards.
C – I2C Cable Connector – The backplane includes a 1x5 cable connector used as a management interface to
the server board.
5.6.4
8 x 2.5” Drive SAS Backplane
Intel Spare Product Code: F1U8X25S3HSBP
Most 2.5” drive system SKUs within the product family will ship with a 8 x drive backplane capable of
supporting 12 Gb/sec SAS and 6 Gb/sec SAS / SATA drives. Both hard disks and Solid State Devices (SSDs)
can be supported within a common backplane. Each backplane can support either SATA or SAS devices.
However, mixing of SATA and SAS devices within a common hot swap backplane is not supported.
Supported devices are dependent on the type of host bus controller driving the backplane, SATA only or
SAS.
The front side of the backplane includes 8 x 29-pin drive interface connectors, each capable of supporting
12 Gb/s SAS or 6 Gb SAS/SATA. The connectors are numbered 0 thru 7. Signals for each set of four drive
connectors (0-3 and 4-7), are routed to separate multi-port mini-SAS HD connectors on the back side of the
backplane.
Label Description
A
B
C
D
E
HDD_0
HDD_1
HDD_2
HDD_3
HDD_4
HDD_5
HDD_6
HDD_7
F
G
H
Figure 39. 8 x 2.5” Drive SAS/SATA Backplane – front view
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On the backside of each backplane there are several connectors. The following illustration identifies each.
Label
Description
A
Power connector
B
C
D
I2C-In cable connector – From Server board
SAS/SATA Ports 4-7 Mini-SAS HD cable connector
SAS/SATA Ports 0-3 Mini-SAS HD cable connector
Figure 40. 8 x 2.5” Drive SAS/SATA Backplane – rear view
A – Power Harness Connector – The backplane includes a 2x2 connector supplying power to the backplane.
Power is routed to the backplane via a power cable harness from the server board.
PIN
SIGNAL
SIGNAL
PIN
1
GND
P12V
3
2
GND
P12V
4
B – I2C Cable Connectors – The backplane includes a 1x5 cable connector used as a management interface
to the server board.
PIN
SIGNAL
1
SMB_3V3SB_DAT
GND
2
3
4
5
SMB_3V3SB_CLK
SMB_ADD0
SMB_ADD1
C and D – Multi-port Mini-SAS Cable Connectors – The backplane includes two multi-port mini-SAS cable
connectors, each providing I/O signals for four SAS/SATA hard drives on the backplane. Cables can be
routed from matching connectors on the server board or add-in SAS/SATA RAID cards.
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Intel® R1000WT Server System TPS
5.6.5
8 x 2.5” Drive Combo SAS / PCIe* SFF (NVMe) SSD Backplane Accessory Kit
Intel Accessory Kit Product Code: A1U44X25NVMEDK
An optional eight drive Combo Backplane accessory kit is capable of supporting a combination of both
SAS/SATA drives and up to four PCIe* SFF (Small Form Factor) (NVMe) SSD drives.
Note – Different PCIe* storage device manufacturers may reference their PCIe* storage devices differently
from one another. Some may reference them as PCIe SFF while others may reference them as NVMe. Visit
https://serverconfigurator.intel.com for a list of supported PCIe* storage devices.
The kit includes:
.
.
.
.
.
1 – 8 x 2.5” Drive Combo Backplane
1 – PCIe* 4x4 Re-driver add-in card
4 – PCIe* SFF (NVMe) SSD drive trays with Blue latches
4 – SAS/SATA drive trays with Green latches
2 – Dual port PCIe* add-in card to backplane cables
Accessory Kit Integration and Usage Requirements:
•
•
This kit is only supported in dual processor configurations
The backplane is capable of supporting 12 Gb/s SAS or 6 Gb SAS/SATA drives. The SAS/SATA drives
are hot-swappable. However, mixing of SATA and SAS drives within a common hot swap backplane is
not recommended.
•
•
PCIe* SFF (NVMe) SSDs are hot swap / hot plug capable. Support and usage is OS dependent (See
Table 37). The server system must have the following System Software installed.
o
o
o
System BIOS version R01.01.1008 or later
BMC Firmware version 01.18.7601 or later
FRUSDR version 1.06 or later
System software updates can be downloaded from the following Intel web site:
http://downloadcenter.intel.com/
To identify a PCIe* SFF drive from a SAS / SATA drive, two different drive carriers are included in the kit.
Drive carriers with a Blue latch are used to identify PCIe* SFF (NVMe) drives. Drives carriers with a
Green latch are used to identify SAS / SATA drives
Figure 41. Combo Backplane Kit Device Carrier Identification
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•
Each drive carrier includes separate LED indicators for drive Activity and drive Status. However, their
functionality may differ depending on the drive type. For SAS and SATA LED support, see section 6.3.
PCIe* SFF (NVMe) LED support is as follows:
Amber Status LED (Not supported)
Green Activity LED
•
Any combination and number of drives up to eight can be supported as long as the number of PCIe*
SFF (NVMe) devices does not exceed four and they are installed into any of the first four drive
connectors on the backplane. The remaining drives can be SAS or SATA.
NOTE: Mixing of PCIe* SFF and SAS/SATA devices in an alternating manner (as identified in the following
example) is not a recommended configuration.
Example – “SAS/SATA” + “PCIe* SFF” + “SAS/SATA” + “PCIe* SFF”.
•
The front side of the backplane includes eight drive interface connectors: four SFF-8639
PCIe/SAS/SATA capable, and four SFF-8680 SAS/SATA only. All eight connectors can support SATA or
SAS drives, but only the last four on the backplane are capable of supporting PCIe* SFF (NVMe) drives.
Labels
Description
A
SAS/SATA_0
B
C
D
SAS/SATA_1
SAS/SATA_2
SAS/SATA_3
PCIe* SFF_0 or
SAS/SATA_4
E
F
PCIe* SFF _1 or
SAS/SATA_5
PCIe* SFF _2 or
SAS/SATA_6
G
H
PCIe* SFF _3 or
SAS/SATA_7
Figure 42. 8 x 2.5" Combo SAS / PCIe* SFF (NVMe) Backplane – Front View
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On the backside of the backplane are several connectors. The following illustration identifies each.
Label
Silkscreen
Description
A
“PWR”
Power connector
B
C
D
E
“I2C”
I2C-In cable connector – From server board
“PCIE_3”
“PCIE_2”
“PORT 4-7”
“PCIE_0”
“PCIE_1”
“PORT 0-3”
PCIe* SFF Device #3 Mini-SAS HD cable connector
PCIe* SFF Device #2 Mini-SAS HD cable connector
SAS/SATA Ports 4-7 Mini-SAS HD cable connector
PCIe* SFF Device #0 Mini-SAS HD cable connector
PCIe* SFF Device #1 Mini-SAS HD cable connector
SAS/SATA Ports 0-3 Mini-SAS HD cable connector
F
G
H
Figure 43. Combo Backplane Rear Connector Identification
Connector A – Power Harness Connector – The backplane includes a 2x2 connector supplying power to the
backplane. Power is routed to each installed backplane via a multi-connector power cable harness from the
server board.
PIN SIGNAL SIGNAL PIN
1
GND
P12V
3
2
GND
P12V
4
Connectors B – I2C Cable Connector – The backplane includes one 1x5 cable connector used as a
management interface between the server board and the installed backplane.
PIN
SIGNAL
1
SMB_3V3SB_DAT
GND
2
3
4
5
SMB_3V3SB_CLK
SMB_ADD0
SMB_ADD1
Connectors C and H – Multi-port Mini-SAS HD Cable Connectors – The backplane includes two multi-port
mini-SAS HD cable connectors, each providing SGPIO and I/O signals for four SAS/SATA hard drives on the
backplane. Cables can be routed from matching connectors on the server board, installed add-in SAS/SATA
RAID cards, or optionally installed SAS expander cards for drive configurations of greater than 8 hard drives.
Connectors D, E, F and G – Each connector supports a single PCIe* SFF SFF device. Each connector is cabled
directly to an add-in PCIe* SFF SFF controller card installed in one of the riser card slots on the server board.
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•
The PCIe* SFF add-in re-driver card is ONLY supported when configured in Riser Slot #2 of the server
board. The PCIe* SFF add-in re-driver card will not be identified or configured by the system BIOS
when installed in Riser Slot #1.
PCIe*
Port
PCIe*
0/1
Port
2/3
SAS Ports
4-7
SAS Ports
0-3
PCIe* SFF
Device 0
PCIe* SFF
Device 2
PCIe* SFF
Device 3
PCIe* SFF
Device 1
Figure 44. Combo Backplane Cable Routing – PCIe* SFF (NVMe) + SAS
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PCIe*
Port
PCIe*
0/1
Port
2/3
SATA
Ports
0-3
PCIe* SFF
Device 0
SATA
Ports
4-7
PCIe* SFF
Device 2
PCIe* SFF
Device 3
PCIe* SFF
Device 1
Figure 45. Combo Backplane Cable Routing – PCIe* SFF (NVMe) + SATA
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5.6.5.1
Intel® Accessory Kit A2U44X25NVMEDK Operating System Support List
As of this writing, Intel® accessory kit A2U44X25NVMEDK provides support for the following operating
systems. This list will be updated as new operating systems are validated with this kit by Intel.
Table 29. Intel® Accessory Kit A2U44X25NVMEDK Operating System Support List
PCIe* SFF
PCIe* SFF (NVMe)
Hot Plug / Hot Swap
A2U44X25NVMEDK (NVMe)
Operating System
support
(Y/N)
OS Boot
support
(Y/N)
No
Support
(Y/N)
Windows Server 2012* R2 w/Updated Datacenter x64, Legacy boot
Windows Server 2012 R2 w/Updated Datacenter x64, uEFI boot
Windows Hyper-V 2012* R2 x64, Legacy boot
Windows Hyper-V 2012 R2 x64, uEFI boot
Red Hat Enterprise Linux 7.0* x64, Legacy boot
Red Hat Enterprise Linux 7.0 x64, uEFI boot
Red Hat Enterprise Linux 6.5* x64, Legacy boot
Red Hat Enterprise Linux 6.5 x64, uEFI boot
Red Hat Enterprise Linux 6.5 x86, Legacy boot
SuSE Linux Enterprise Server 11* SP3 x64, Legacy Boot
SuSE Linux Enterprise Server 11 SP3 x64, uEFI Boot
SuSE Linux Enterprise Server 11 SP3 x86, Legacy Boot
Windows Server 2008* R2 sp1 x64, Legacy Boot
Windows Server 2008 R2 sp1 x64, uEFI Boot
Windows Server 2008 R2 sp1 x86, Legacy Boot
Windows 7* x64, Legacy boot
Windows 7 x64, uEFI boot
VMWare ESXi 5.5* U2
Ubuntu 14.04 Server* x64, Legacy Boot
Ubuntu 14.04 Server x64, EFI Boot
Ubuntu 14.04 Server x86, Legacy Boot
CentOS 6.5* x64, Legacy Boot
CentOS 6.5 x64, uEFI Boot
CentOS 6.5 x86, Legacy Boot
FreeBSD 10* x64 Legacy Boot
FreeBSD 10 x86 Legacy Boot
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
Yes
Yes
No
No
No
No
No
No
No
No
No
No
No
No
Yes
Yes
Yes
Yes
No
Yes
No
Yes
No
Yes
No
N/A
N/A
N/A
N/A
N/A
N/A
No
N/A
N/A
N/A
N/A
N/A
N/A
Yes
Yes
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
No
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
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5.7 Low Profile eUSB SSD Support
The system provides support for a low profile eUSB SSD storage device. A 2mm 2x5-pin connector labeled
“eUSB SSD” near the rear I/O section of the server board is used to plug this small flash storage device into.
Bottom View
Top View
Figure 46. Low Profile eUSB SSD Support
eUSB features include:
.
.
.
.
2 wire small form factor Universal Serial Bus 2.0 (Hi-Speed USB) interface to host
Read Speed up to 35 MB/s and write Speed up to 24 MB/s
Capacity range from 256 MB to 16 GB
Support USB Mass Storage Class requirements for Boot capability
Visit https//serverconfigurator.intel.com for a list of supported devices.
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5.8 SATA DOM Support
The system has support for up to two vertical low profile Disk-on-Module (DOM) devices. Supported
SATADOMs for this server board include those from Apacer* or Innodisk*.
Note: In this server system, SATADOMs from Innodisk* must have firmware version S130710 or later.
Innodisk*
Apacer*
Each installed SATA DOM plugs directly into one of the white single port SATA connectors on the server
board, which provide both power and I/O signals.
SATA Port 5
SATA Port 4
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Each single port SATA connector has the following 7 + 2 pin-out.
PIN
SIGNAL
PWR 2
GND
GND
1
2
SATAx_TX_DP
SATAx_TX_DN
GND
3
4
5
SATAx_RX_DN
SATAx_RX_DP
GND
6
7
PWR 1
5V
Note: With a SATADOM device installed, only low profile PCIe* add-in cards can be used in Riser Slot #2
Visit https://serverconfigurator.intel.com for a list of supported SATA DOM devices.
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6. Storage Controller Options Overview
The server platform supports many different embedded and add-in SAS/SATA controller options to provide
a large number of possible storage configurations. This section will provide an overview of the different
options available.
6.1 Embedded SATA/SATA RAID Support
The server board utilizes two chipset embedded AHCI SATA controllers, identified as SATA and sSATA,
providing for up to ten 6 Gb/sec Serial ATA (SATA) ports.
The AHCI SATA controller provides support for up to six SATA ports on the server board:
.
Four SATA ports from the Mini-SAS HD (SFF-8643) connector labeled “SATA Ports 0-3” on the
server board
.
Two SATA ports accessed via two white single port connectors labeled “SATA-4” and “SATA-5” on
the server board
The AHCI sSATA controller provides support for up to four SATA ports on the server board:
.
Four SATA ports from the Mini-SAS HD (SFF-8643) connector labeled “sSATA Ports 0-3” on the
server board
The following diagram identifies the location of all on-board SATA features.
ESRT2 SATA RAID 5
Upgrade Key (iPN – RKSATA4R5)
Connector
Multi-port Mini-SAS HD
connector (SFF-8643)
sSATA Ports 0 thru 3
SATA Ports 0 thru 3
SATA Port 5
SATA Port 4
Figure 47. On-board SATA Features
Note: the onboard SATA controllers are not compatible with and cannot be used with RAID Expander Cards.
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Table 30. SATA and sSATA Controller Feature Support
AHCI / RAID
Disabled
AHCI / RAID
Enabled
Feature
Description
Allows the device to reorder commands for more
efficient data transfers
Native Command Queuing (NCQ)
Auto Activate for DMA
N/A
N/A
Supported
Supported
Collapses a DMA Setup then DMA Activate
sequence into a DMA Setup only
Allows for device detection without power being
applied and ability to connect and disconnect
devices without prior notification to the system
Hot Plug Support
N/A
Supported
Provides a recovery from a loss of signal or
establishing communication after hot plug
Asynchronous Signal Recovery
6 Gb/s Transfer Rate
N/A
Supported
Supported
Supported
Capable of data transfers up to 6 Gb/s
Supported
N/A
A mechanism for a device to send a notification to
the host that the device requires attention
ATAPI Asynchronous Notification
Host & Link Initiated Power
Management
Capability for the host controller or device to
request Partial and Slumber interface power states
N/A
Supported
Supported
Enables the host the ability to spin up hard drives
sequentially to prevent power load problems on
boot
Staggered Spin-Up
Supported
Reduces interrupt and completion overhead by
allowing a specified number of commands to
complete and then generating an interrupt to
process the commands
Command Completion Coalescing
N/A
The SATA controller and the sSATA controller can be independently enabled and disabled and configured
through the <F2> BIOS Setup Utility under the “Mass Storage Controller Configuration” menu screen. The
following table identifies supported setup options.
Table 31. SATA and sSATA Controller BIOS Utility Setup Options
SATA Controller
AHCI
sSATA Controller
AHCI
Supported
Yes
AHCI
Enhanced
Disabled
RSTe
Yes
AHCI
Yes
AHCI
Yes
AHCI
ESRT2
Microsoft* Windows Only
Enhanced
Enhanced
Enhanced
Enhanced
Enhanced
Disabled
Disabled
Disabled
Disabled
Disabled
RSTe
AHCI
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Enhanced
Disabled
RSTe
ESRT2
AHCI
Enhanced
Disabled
RSTe
ESRT2
AHCI
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SATA Controller
sSATA Controller
Enhanced
Disabled
RSTe
Supported
RSTe
RSTe
Yes
Yes
RSTe
Yes
RSTe
ESRT2
No
ESRT2
ESRT2
ESRT2
ESRT2
ESRT2
AHCI
Microsoft* Windows Only
Enhanced
Disabled
RSTe
Yes
Yes
No
ESRT2
Yes
6.1.1
Staggered Disk Spin-Up
Because of the high density of disk drives that can be attached to the Intel® C610 Onboard AHCI SATA
Controller and the sSATA Controller, the combined startup power demand surge for all drives at once can be
much higher than the normal running power requirements and could require a much larger power supply for
startup than for normal operations.
In order to mitigate this and lessen the peak power demand during system startup, both the AHCI SATA
Controller and the sSATA Controller implement a Staggered Spin-Up capability for the attached drives. This
means that the drives are started up separately, with a certain delay between disk drives starting.
For the Onboard SATA Controller, Staggered Spin-Up is an option – AHCI HDD Staggered Spin-Up – in the
Setup Mass Storage Controller Configuration screen found in the <F2> BIOS Setup Utility.
6.2 Embedded SATA SW-RAID support
The server board has embedded support for two SATA SW-RAID options:
.
.
Intel® Rapid Storage Technology (RSTe) 4.1
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 based on LSI* MegaRAID SW RAID
technology
Using the <F2> BIOS Setup Utility, accessed during system POST, options are available to enable/disable SW
RAID, and select which embedded software RAID option to use.
Note: RAID partitions created using either RSTe or ESRT2 cannot span across the two embedded SATA
controllers. Only drives attached to a common SATA controller can be included in a RAID partition.
See Table 2 for a list of supported Operating Systems.
6.2.1
Intel® Rapid Storage Technology (RSTe) 4.1
Intel® Rapid Storage Technology offers several options for RAID (Redundant Array of Independent Disks) to
meet the needs of the end user. AHCI support provides higher performance and alleviates disk bottlenecks
by taking advantage of the independent DMA engines that each SATA port offers in the chipset.
.
.
RAID Level 0 – Non-redundant striping of drive volumes with performance scaling of up to 6 drives,
enabling higher throughput for data intensive applications such as video editing.
Data security is offered through RAID Level 1, which performs mirroring.
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.
.
RAID Level 10 provides high levels of storage performance with data protection, combining the fault-
tolerance of RAID Level 1 with the performance of RAID Level 0. By striping RAID Level 1 segments,
high I/O rates can be achieved on systems that require both performance and fault-tolerance. RAID
Level 10 requires 4 hard drives, and provides the capacity of two drives.
RAID Level 5 provides highly efficient storage while maintaining fault-tolerance on 3 or more drives.
By striping parity, and rotating it across all disks, fault tolerance of any single drive is achieved while
only consuming 1 drive worth of capacity. That is, a 3 drive RAID 5 has the capacity of 2 drives, or a 4
drive RAID 5 has the capacity of 3 drives. RAID 5 has high read transaction rates, with a medium write
rate. RAID 5 is well suited for applications that require high amounts of storage while maintaining
fault tolerance.
Note: RAID configurations cannot span across the two embedded AHCI SATA controllers.
By using Intel® RSTe, there is no loss of PCI resources (request/grant pair) or add-in card slot. Intel® RSTe
functionality requires the following:
.
.
.
.
.
.
The SW-RAID option must be enable in <F2> BIOS Setup
Intel® RSTe option must be selected in <F2> BIOS Setup
Intel® RSTe drivers must be loaded for the installed operating system
At least two SATA drives needed to support RAID levels 0 or 1
At least three SATA drives needed to support RAID level 5
At least four SATA drives needed to support RAID level 10
With Intel® RSTe SW-RAID enabled, the following features are made available:
.
A boot-time, pre-operating system environment, text mode user interface that allows the user to
manage the RAID configuration on the system. Its feature set is kept simple to keep size to a
minimum, but allows the user to create and delete RAID volumes and select recovery options when
problems occur. The user interface can be accessed by pressing the <CTRL-I> keys during system
POST.
.
.
Provides boot support when using a RAID volume as a boot disk. It does this by providing Int13
services when a RAID volume needs to be accessed by MS-DOS applications (such as NTLDR) and by
exporting the RAID volumes to the System BIOS for selection in the boot order
At each boot up, provides the user with a status of the RAID volumes
6.2.2
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41
Features of ESRT2 include the following:
.
.
.
Based on LSI* MegaRAID Software Stack
Software RAID with system providing memory and CPU utilization
RAID Level 0 - Non-redundant striping of drive volumes with performance scaling up to 6 drives,
enabling higher throughput for data intensive applications such as video editing.
Data security is offered through RAID Level 1, which performs mirroring.
RAID Level 10 provides high levels of storage performance with data protection, combining the fault-
tolerance of RAID Level 1 with the performance of RAID Level 0. By striping RAID Level 1 segments,
high I/O rates can be achieved on systems that require both performance and fault-tolerance. RAID
Level 10 requires 4 hard drives, and provides the capacity of two drives
Optional support for RAID Level 5
.
.
.
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o
o
Enabled with the addition of an optionally installed ESRT2 SATA RAID 5 Upgrade Key (iPN -
RKSATA4R5)
RAID Level 5 provides highly efficient storage while maintaining fault-tolerance on 3 or more
drives. By striping parity, and rotating it across all disks, fault tolerance of any single drive is
achieved while only consuming 1 drive worth of capacity. That is, a 3 drive RAID 5 has the
capacity of 2 drives, or a 4 drive RAID 5 has the capacity of 3 drives. RAID 5 has high read
transaction rates, with a medium write rate. RAID 5 is well suited for applications that require
high amounts of storage while maintaining fault tolerance
Figure 48. SATA RAID 5 Upgrade Key
.
.
Maximum drive support = 6 SATA controller + 4 sSATA controller (Maximum on-board SATA port
support)
Open Source Compliance = Binary Driver (includes Partial Source files) or Open Source using MDRAID
layer in Linux*.
Note: RAID configurations cannot span across the two embedded AHCI SATA controllers.
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6.3 Intel® Integrated RAID Module Support
Figure 49. Intel® Integrated RAID Module
The system has support for many Intel and 3rd party PCIe add-in 6G and 12Gb RAID adapters which can be
installed in available PCIe add-in cards slots. For system configurations with limited add-in card slot
availability, an optional Intel® Integrated RAID mezzanine module can be installed onto a high density 80-pin
connector (labeled “SAS Module”) on the server board.
Please visit the Intel® Server Configurator Tool at the following website for a list of supported Intel®
Integrated RAID options:
https://serverconfigurator.intel.com
6.3.1
Intel® RAID Maintenance Free Backup Unit (RMFBU) Support
The 1U system has support for one or two Intel® RAID Maintenance Free Backup Units (RMFBU).
Figure 50. Support for single Intel® RAID Maintenance Free Backup Unit (Standard Option)
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Support for two RMFBUs will require the use of an optional bracket capable of supporting stacked RMFBUs.
Intel Accessory Kit order code – AWTAUXBBUBKT
Figure 51. Support for dual Intel® RAID Maintenance Free Backup Units (Optional Accessory)
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7. Front Control Panel and I/O Panel Overview
All system configurations include a Control Panel and I/O Panel on the front of the system. On systems that
support 8x2.5” drives, the I/O Panel can be replaced with a SATA optical drive.
7.1 I/O Panel Features
USB 2.0/3.0**
Ports
Video
Figure 52. Front I/O Panel Features
Video connector – The front I/O Panel video connector gives the option of attaching a monitor to the front
of the system. When BIOS detects that a monitor is attached to the front video connector, it disables the
video signals routed to the on-board video connector on the back of the system. Video resolutions from the
front video connector may be lower than that of the rear on-board video connector. A short video cable
should be used for best resolution. The front video connector is cabled to a 2x7 header on the server board
labeled “FP Video”.
USB 2.0/3.0 Ports –The front I/O panel includes two USB 2.0/3.0 ports. The USB ports are cabled to a Blue
2x5 connector on the server board labeled “FP_USB”.
** Note: Due to signal strength limits associated with USB 3.0 ports cabled to a front panel, some marginally
compliant USB 3.0 devices may not be supported from these ports. In addition, server systems based on the
Intel® Server Board S2600WT cannot be USB 3.0 certified with USB 3.0 ports cabled to a front panel.
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7.2 Control Panel Features
The system includes a control panel that provides push button system controls and LED indicators for
several system features. Depending on the hard drive configuration, the front control panel may come in
either of two formats; however, both provide the same functionality. This section will provide a description
for each front control panel feature.
Label
A
Description
System ID Button w/Integrated LED
Label
E
Description
System Status LED
B
C
D
NMI Button (recessed, tool required for use)
NIC-1 Activity LED
F
G
H
Power/Sleep Button w/Integrated LED
Storage Drive Activity LED
NIC-2 Activity LED
System Cold Reset Button (recessed, tool required for use)
Figure 53. Front Control Panel Options
A – System ID Button w/Integrated LED – Toggles the integrated ID LED and the Blue server board ID LED
on and off. The System ID LED is used to identify the system for maintenance when installed in a rack of
similar server systems. The System ID LED can also be toggled on and off remotely using the IPMI “Chassis
Identify” command which will cause the LED to blink for 15 seconds.
B – NMI Button – When the NMI button is pressed, it puts the server in a halt state and issues a
non-maskable interrupt (NMI). This can be useful when performing diagnostics for a given issue where a
memory download is necessary to help determine the cause of the problem. To prevent an inadvertent
system halt, the actual NMI button is located behind the Front Control Panel faceplate where it is only
accessible with the use of a small tipped tool like a pin or paper clip.
C and H – Network Activity LEDs – The Front Control Panel includes an activity LED indicator for each on-
board Network Interface Controller (NIC). When a network link is detected, the LED will turn on solid. The
LED will blink once network activity occurs at a rate that is consistent with the amount of network activity
that is occurring.
D – System Cold Reset Button – When pressed, this button will reboot and re-initialize the system. To
prevent an inadvertent system reset, the actual Reset button is located behind the Front Control Panel
faceplate where it is only accessible with the use of a small tipped tool like a pin or paper clip.
E – System Status LED – The System Status LED is a bi-color (Green/Amber) indicator that shows the current
health of the server system. The system provides two locations for this feature; one is located on the Front
Control Panel, the other is located on the back edge of the server board, viewable from the back of the
system. Both LEDs are tied together and will show the same state. The System Status LED states are driven
by the on-board platform management subsystem. The following table provides a description of each
supported LED state.
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Table 32. System Status LED State Definitions
Color
State
Criticality
Description
Off
System is Not ready
not
operating
•
•
•
System is powered off (AC and/or DC).
System is in EuP Lot6 Off Mode.
System is in S5 Soft-Off State.
Green
Solid on
Ok
Indicates that the System is running (in S0 State) and its
status is ‘Healthy’. The system is not exhibiting any errors. AC
power is present and BMC has booted and manageability
functionality is up and running.
After a BMC reset, and in conjuction with the Chassis ID solid
ON, the BMC is booting Linux*. Control has been passed
from BMC uBoot to BMC Linux* itself. It will be in this state
for ~10-~20 seconds
Green
~1 Hz
blink
Degraded -
system is
System degraded:
•
•
•
Redundancy loss such as power-supply or fan. Applies
only if the associated platform sub-system has
redundancy capabilities.
Fan warning or failure when the number of fully
operational fans is less than minimum number needed to
cool the system.
Non-critical threshold crossed – Temperature (including
HSBP temp), voltage, input power to power supply,
output current for main power rail from power supply
and Processor Thermal Control (Therm Ctrl) sensors.
Power supply predictive failure occurred while redundant
power supply configuration was present.
Unable to use all of the installed memory (more than 1
DIMM installed).
operating in a
degraded state
although still
functional, or
system is
operating in
a redundant
state but with
an impending
failure warning
•
•
•
Correctable Errors over a threshold and migrating to a
spare DIMM (memory sparing). This indicates that the
system no longer has spared DIMMs (a redundancy lost
condition). Corresponding DIMM LED lit.
•
•
In mirrored memory mode, when memory mirroring
takes place and system loses memory redundancy.
In mirrored memory mode, and threshold for correctable
errors has been crossed
•
•
Battery failure.
BMC executing in uBoot. (Indicated by Chassis ID blinking
at 3Hz). System in degraded state (no manageability).
BMC uBoot is running but has not transferred control to
BMC Linux*. Server will be in this state 6-8 seconds after
BMC reset while it pulls the Linux* image into flash.
BMC Watchdog has reset the BMC.
•
•
Power Unit sensor offset for configuration error is
asserted.
•
HDD HSC is off-line or degraded.
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Description
Color
State
Criticality
Non-critical -
System is
Amber ~1 Hz
blink
Non-fatal alarm – system is likely to fail:
•
Critical threshold crossed – Voltage, temperature
(including HSBP temp), input power to power supply,
output current for main power rail from power supply
and PROCHOT (Therm Ctrl) sensors.
operating in a
degraded state
with an
impending
•
•
VRD Hot asserted.
Minimum number of fans to cool the system not present
or failed
failure warning,
although still
functioning
•
•
Hard drive fault
Power Unit Redundancy sensor – Insufficient resources
offset (indicates not enough power supplies present)
In memory non-sparing and non-mirroring mode, if the
threshold of correctable errors is crossed within the
window
In mirrored memory mode, and a correctable error takes
place after memory has already lost redundancy
•
•
Amber Solid on
Critical, non-
recoverable –
System is
Fatal alarm – system has failed or shutdown:
•
CPU CATERR signal asserted
•
MSID mismatch detected (CATERR also asserts for this
case).
halted
•
•
•
•
CPU 1 is missing
CPU Thermal Trip
No power good – power fault
DIMM failure when there is only 1 DIMM present and
hence no good memory present.
Runtime memory uncorrectable error in non-redundant
mode.
•
•
•
•
•
DIMM Thermal Trip or equivalent
SSB Thermal Trip or equivalent
CPU ERR2 signal asserted
BMC/Video memory test failed. (Chassis ID shows
blue/solid-on for this condition)
Both uBoot BMC FW images are bad. (Chassis ID shows
blue/solid-on for this condition)
240VA fault
•
•
•
Fatal Error in processor initialization:
o
o
o
o
o
o
Processor family not identical
Processor model not identical
Processor core/thread counts not identical
Processor cache size not identical
Unable to synchronize processor frequency
Unable to synchronize QPI link frequency
•
Uncorrectable memory error in a non-redundant mode
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F – Power/Sleep Button – Toggles the system power on and off. This button also functions as a sleep button
if enabled by an ACPI compliant operating system. Pressing this button will send a signal to the integrated
BMC, which will either power on or power off the system. The integrated LED is a single color (Green) and is
capable of supporting different indicator states as defined in the following table.
Table 33. Power/Sleep LED Functional States
State
Power Mode
LED
Description
Power-off Non-ACPI
Off
On
Off
System power is off, and the BIOS has not initialized the chipset.
Power-on
S5
Non-ACPI
ACPI
System power is on
Mechanical is off, and the operating system has not saved any
context to the hard disk.
S0
ACPI
Steady on
System and the operating system are up and running.
G – Drive Activity LED – The drive activity LED on the front panel indicates drive activity from the on-board
storage controllers. The server board also provides a header giving access to this LED for add-in controllers.
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8. Intel® Local Control Panel
The Intel® Local Control Panel option (Intel Product Order Code – A1U2ULCP) utilizes a combination of
control buttons and LCD display to provide system accessibility and monitoring.
Label
A
Description
LCD Display
Functionality
one line 18 character display
B
C
D
E
F
Left Control Button
“Enter” Button
moves the cursor backward one step or one character
selects the menu item highlighted by the cursor
Right Control Button moves the cursor forward one step or one character
USB 2.0/3.0 Port**
USB 2.0/3.0 Port**
Figure 54. Intel Local Control Panel Option
** Note: Due to signal strength limits associated with USB 3.0 ports cabled to a front panel, some marginally
compliant USB 3.0 devices may not be supported from these ports. In addition, server systems based on the
Intel® Server Board S2600WT cannot be USB 3.0 certified with USB 3.0 ports cabled to a front panel.
The LCD (Local Control Display) is a one line character display that resides on the front panel of the chassis.
It can display a maximum of 18 characters at a time. This device also contains 3 buttons (Left, Right and
Enter). The user can select the content that needs to be displayed on the LCD screen by operating these
buttons.
For a complete description of the LCP accessory, please reference the Intel® Local Control Panel for Intel®
Server Platforms Based on Intel® Xeon® Processor E5 4600/2600/2400/1600/1400 Product Families
Technical Product Specification (Intel document order number G83726-001).
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9. PCIe* Riser Card Support
The system includes two riser card slots on the server board. Available riser cards can be used in either slot.
This section will provide an overview of each available riser card and describe the server board features and
architecture supporting them.
The server board provides three riser card slots identified as: Riser Slot #1, Riser Slot #2, and Riser Slot #3. In
a 1U system, only Riser Slot #1 and Riser Slot #2 can be used. Riser Slot #3 is for 2U system use only.
Note: The riser card slots are specifically designed to support riser cards only. Attempting to install a
PCIe* add-in card directly into a riser card slot on the server board may damage the server board, the add-in
card, or both.
The PCIe* bus interface for each riser card slot is supported by each of the two installed processors. The
following tables provide the PCIe* bus routing for all supported risers cards.
Note: Riser Slot #2 can only be used in dual processor configurations.
Table 34. Riser Slot #1 – Riser Card Options
1U – 1-Slot Riser Card
PCIe* Slot
CPU #1 – Port 3A
(x16 elec, x16 mech)
Table 35. Riser Slot #2 – Riser Card Options
1U – 1-Slot Riser Card
PCIe* Slot
CPU #2 – Port 2A
(x16 elec, x16 mech)
The system supports two single slot PCIe* x16 (x16 lanes, x16 slot) riser cards. Each riser card is mounted to
a bracket assembly which is inserted into a riser card slot on the server board.
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Figure 55. Add-in Card Support
Each riser card assembly has support for a single full height, ½ length PCIe* add-in card. However, riser card
#2 may be limited to ½ length, ½ height add-in cards if either of the two mini-SAS HD connectors on the
server board are used or if a SATADOM storage device is installed into either of the single port SATA
connectors.
Note: Add-in cards that exceed the PCI specification for ½ length PCI add-in cards (167.65mm or 6.6in) may
interfere with other installed devices on the server board.
Figure 56. Riser Card Assembly
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10. Intel® I/O Module Support
To broaden the standard on-board feature set, the server board provides support for one of several
available Intel® I/O Module options. The I/O module attaches to a high density 80-pin connector on the
server board (labeled “IO_Module”) and is supported by x8 PCIe Gen3 signals from the IIO module of the
CPU 1 processor.
Figure 57. Intel® I/O Module Placement
Supported I/O modules include:
Table 36. Supported Intel® I/O Modules
Description
Intel Product Code
Quad port RJ45 1 GbE based on Intel® Ethernet Controller I350
Dual port RJ-45 10GBase-T I/O Module based on Intel® Ethernet Controller x540
Dual port SFP+ 10 GbE module based on Intel® 82599 10 GbE controller
Single port QSFP FDR 56 GT/S speed InfiniBand* module
Dual port QSFP FDR 56 GT/S speed infiniband* module
Single port QSFP+ 40 GbE module
Intel® I/O Module AXX4P1GBPWLIOM
Intel® I/O Module AXX10GBTWLIOM3
Intel® I/O Module AXX10GBNIAIOM
Intel® I/O Module AXX1FDRIBIOM
Intel® I/O Module AXX2FDRIBIOM
Intel® I/O Module AXX1P40FRTIOM
Intel® I/O Module AXX2P40FRTIOM
Dual port QSFP+ 40 GbE module
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11. Basic and Advanced Server Management Features
The integrated BMC has support for basic and advanced server management features. Basic management
features are available by default. Advanced management features are enabled with the addition of an
optionally installed Remote Management Module 4 Lite (RMM4 Lite) key.
Table 37. Intel® Remote Management Module 4 (RMM4) Options
Intel Product
Code
Description
Kit Contents
Benefits
AXXRMM4LITE Intel® Remote Management Module 4 Lite RMM4 Lite Activation
Key
Enables KVM & media redirection
When the BMC FW initializes, it attempts to access the Intel® RMM4 lite. If the attempt to access Intel® RMM4
lite is successful, then the BMC activates the Advanced features.
The following table identifies both Basic and Advanced server management features.
Table 38. Basic and Advanced Server Management Features Overview
Advanced
Feature
Basic
w/RMM4 Lite
Key
IPMI 2.0 Feature Support
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
In-circuit BMC Firmware Update
FRB 2
Chassis Intrusion Detection
Fan Redundancy Monitoring
Hot-Swap Fan Support
Acoustic Management
Diagnostic Beep Code Support
Power State Retention
ARP/DHCP Support
PECI Thermal Management Support
E-mail Alerting
Embedded Web Server
SSH Support
Integrated KVM
Integrated Remote Media Redirection
Lightweight Directory Access Protocol (LDAP)
Intel® Intelligent Power Node Manager Support
SMASH CLP
X
X
X
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On the server board the Intel® RMM4 Lite key is installed at the following location.
RJ45 – Dedicated
Management Port
Intel® RMM4
Lite Key
Figure 58. Intel® RMM4 Lite Activation Key Installation
11.1.1
Dedicated Management Port
The server board includes a dedicated 1GbE RJ45 Management Port. The management port is active with or
without the RMM4 Lite key installed.
11.1.2
Embedded Web Server
BMC Base manageability provides an embedded web server and an OEM-customizable web GUI which
exposes the manageability features of the BMC base feature set. It is supported over all on-board NICs that
have management connectivity to the BMC as well as an optional dedicated add-in management NIC. At least
two concurrent web sessions from up to two different users is supported. The embedded web user interface
shall support the following client web browsers:
.
.
.
.
Microsoft Internet Explorer 9.0*
Microsoft Internet Explorer 10.0*
Mozilla Firefox 24*
Mozilla Firefox 25*
The embedded web user interface supports strong security (authentication, encryption, and firewall support)
since it enables remote server configuration and control. The user interface presented by the embedded web
user interface, shall authenticate the user before allowing a web session to be initiated. Encryption using
128-bit SSL is supported. User authentication is based on user id and password.
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The GUI presented by the embedded web server authenticates the user before allowing a web session to be
initiated. It presents all functions to all users but grays-out those functions that the user does not have
privilege to execute. For example, if a user does not have privilege to power control, then the item shall be
displayed in grey-out font in that user’s UI display. The web GUI also provides a launch point for some of the
advanced features, such as KVM and media redirection. These features are grayed out in the GUI unless the
system has been updated to support these advanced features. The embedded web server only displays US
English or Chinese language output.
Additional features supported by the web GUI includes:
.
.
.
.
.
.
.
.
Presents all the Basic features to the users
Power on/off/reset the server and view current power state
Displays BIOS, BMC, ME and SDR version information
Display overall system health.
Configuration of various IPMI over LAN parameters for both IPV4 and IPV6
Configuration of alerting (SNMP and SMTP)
Display system asset information for the product, board, and chassis.
Display of BMC-owned sensors (name, status, current reading, enabled thresholds), including color-
code status of sensors.
.
Provides ability to filter sensors based on sensor type (Voltage, Temperature, Fan and Power supply
related)
.
.
.
.
.
Automatic refresh of sensor data with a configurable refresh rate
On-line help
Display/clear SEL (display is in easily understandable human readable format)
Supports major industry-standard browsers (Microsoft Internet Explorer* and Mozilla Firefox*)
The GUI session automatically times-out after a user-configurable inactivity period. By default, this
inactivity period is 30 minutes.
.
.
Embedded Platform Debug feature - Allow the user to initiate a “debug dump” to a file that can be
sent to Intel for debug purposes.
Virtual Front Panel. The Virtual Front Panel provides the same functionality as the local front panel.
The displayed LEDs match the current state of the local panel LEDs. The displayed buttons (for
example, power button) can be used in the same manner as the local buttons.
.
.
.
Display of ME sensor data. Only sensors that have associated SDRs loaded will be displayed.
Ability to save the SEL to a file
Ability to force HTTPS connectivity for greater security. This is provided through a configuration
option in the UI.
.
.
.
.
.
Display of processor and memory information as is available over IPMI over LAN.
Ability to get and set Node Manager (NM) power policies
Display of power consumed by the server
Ability to view and configure VLAN settings
Warn user the reconfiguration of IP address will cause disconnect.
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.
Capability to block logins for a period of time after several consecutive failed login attempts. The
lock-out period and the number of failed logins that initiates the lock-out period are configurable by
the user.
.
.
Server Power Control – Ability to force into Setup on a reset
System POST results – The web server provides the system’s Power-On Self Test (POST) sequence
for the previous two boot cycles, including timestamps. The timestamps may be viewed in relative to
the start of POST or the previous POST code.
.
Customizable ports – The web server provides the ability to customize the port numbers used for
SMASH, http, https, KVM, secure KVM, remote media, and secure remote media.
For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web
Console Users Guide.
11.1.3
Advanced Management Feature Support (RMM4 Lite)
The integrated baseboard management controller has support for advanced management features which are
enabled when an optional Intel® Remote Management Module 4 Lite (RMM4 Lite) is installed. The Intel RMM4
add-on offers convenient, remote KVM access and control through LAN and internet. It captures, digitizes,
and compresses video and transmits it with keyboard and mouse signals to and from a remote computer.
Remote access and control software runs in the integrated baseboard management controller, utilizing
expanded capabilities enabled by the Intel RMM4 hardware.
Key Features of the RMM4 add-on are:
.
.
KVM redirection from either the dedicated management NIC or the server board NICs used for
management traffic; upto to two KVM sessions
Media Redirection – The media redirection feature is intended to allow system administrators or
users to mount a remote IDE or USB CDROM, floppy drive, or a USB flash disk as a remote device to
the server. Once mounted, the remote device appears just like a local device to the server allowing
system administrators or users to install software (including operating systems), copy files, update
BIOS, or boot the server from this device.
.
KVM – Automatically senses video resolution for best possible screen capture, high performance
mouse tracking and synchronization. It allows remote viewing and configuration in pre-boot POST
and BIOS setup.
11.1.3.1
Keyboard, Video, Mouse (KVM) Redirection
The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This feature is available
remotely from the embedded web server as a Java applet. This feature is only enabled when the Intel® RMM4
lite is present. The client system must have a Java Runtime Environment (JRE) version 6.0 or later to run the
KVM or media redirection applets.
The BMC supports an embedded KVM application (Remote Console) that can be launched from the
embedded web server from a remote console. USB1.1 or USB 2.0 based mouse and keyboard redirection are
supported. It is also possible to use the KVM-redirection (KVM-r) session concurrently with media-redirection
(media-r). This feature allows a user to interactively use the keyboard, video, and mouse (KVM) functions of
the remote server as if the user were physically at the managed server. KVM redirection console supports the
following keyboard layouts: English, Dutch, French, German, Italian, Russian, and Spanish.
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KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an entire
keyboard that is connected to the remote system. The “soft keyboard” functionality supports the following
layouts: English, Dutch, French, German, Italian, Russian, and Spanish.
The KVM-redirection feature automatically senses video resolution for best possible screen capture and
provides high-performance mouse tracking and synchronization. It allows remote viewing and configuration
in pre-boot POST and BIOS setup, once BIOS has initialized video.
Other attributes of this feature include:
.
.
.
.
Encryption of the redirected screen, keyboard, and mouse
Compression of the redirected screen.
Ability to select a mouse configuration based on the OS type.
Supports user definable keyboard macros.
KVM redirection feature supports the following resolutions and refresh rates:
.
.
.
.
.
.
.
.
.
640x480 at 60Hz, 72Hz, 75Hz, 85Hz, 100Hz
800x600 at 60Hz, 72Hz, 75Hz, 85Hz
1024x768 at 60Hx, 72Hz, 75Hz, 85Hz
1280x960 at 60Hz
1280x1024 at 60Hz
1600x1200 at 60Hz
1920x1080 (1080p),
1920x1200 (WUXGA)
1650x1080 (WSXGA+)
11.1.3.2
Remote Console
The Remote Console is the redirected screen, keyboard and mouse of the remote host system. To use the
Remote Console window of your managed host system, the browser must include a Java* Runtime
Environment plug-in. If the browser has no Java support, such as with a small handheld device, the user can
maintain the remote host system using the administration forms displayed by the browser.
The Remote Console window is a Java Applet that establishes TCP connections to the BMC. The protocol
that is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This protocol uses
ports #7578 for KVM, #5120 for CDROM media redirection, and #5123 for Floppy/USB media redirection.
When encryption is enabled, the protocol uses ports #7582 for KVM, #5124 for CDROM media redirection,
and #5127 for Floppy/USB media redirection. The local network environment must permit these
connections to be made, that is, the firewall and, in case of a private internal network, the NAT (Network
Address Translation) settings have to be configured accordingly.
11.1.3.3
Performance
The remote display accurately represents the local display. The feature adapts to changes to the video
resolution of the local display and continues to work smoothly when the system transitions from graphics to
text or vice-versa. The responsiveness may be slightly delayed depending on the bandwidth and latency of
the network.
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Enabling KVM and/or media encryption will degrade performance. Enabling video compression provides the
fastest response while disabling compression provides better video quality.
For the best possible KVM performance, a 2Mb/sec link or higher is recommended.
The redirection of KVM over IP is performed in parallel with the local KVM without affecting the local KVM
operation.
11.1.3.4
Security
The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual
algorithm that is used is negotiated with the client based on the client’s capabilities.
11.1.3.5
Availability
The remote KVM session is available even when the server is powered-off (in stand-by mode). No re-start of
the remote KVM session shall be required during a server reset or power on/off. A BMC reset (for example,
due to an BMC Watchdog initiated reset or BMC reset after BMC FW update) will require the session to be re-
established.
KVM sessions persist across system reset, but not across an AC power loss.
11.1.3.6
Usage
As the server is powered up, the remote KVM session displays the complete BIOS boot process. The user is
able interact with BIOS setup, change and save settings as well as enter and interact with option ROM
configuration screens.
At least two concurrent remote KVM sessions are supported. It is possible for at least two different users to
connect to same server and start remote KVM sessions.
11.1.3.7
Force-enter BIOS Setup
KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter F2 setup
while booting which is often missed by the time the remote console redirects the video.
11.1.3.8
Media Redirection
The embedded web server provides a Java applet to enable remote media redirection. This may be used in
conjunction with the remote KVM feature, or as a standalone applet.
The media redirection feature is intended to allow system administrators or users to mount a remote IDE or
USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote
device appears just like a local device to the server, allowing system administrators or users to install
software (including operating systems), copy files, update BIOS, and so on, or boot the server from this
device.
The following capabilities are supported:
.
The operation of remotely mounted devices is independent of the local devices on the server. Both
remote and local devices are useable in parallel.
.
.
Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the server.
It is possible to boot all supported operating systems from the remotely mounted device and to boot
from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the Tested/supported Operating
System List for more information.
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.
Media redirection supports redirection for both a virtual CD device and a virtual Floppy/USB device
concurrently. The CD device may be either a local CD drive or else an ISO image file; the Floppy/USB
device may be a local Floppy drive, a local USB device, or a disk image file.
.
.
The media redirection feature supports multiple encryption algorithms, including RC4 and AES. The
actual algorithm that is used is negotiated with the client based on the client’s capabilities.
A remote media session is maintained even when the server is powered-off (in standby mode). No
restart of the remote media session is required during a server reset or power on/off. An BMC reset
(for example, due to an BMC reset after BMC FW update) will require the session to be re-established
.
.
.
The mounted device is visible to (and useable by) managed system’s OS and BIOS in both pre-boot
and post-boot states.
The mounted device shows up in the BIOS boot order and it is possible to change the BIOS boot
order to boot from this remote device.
It is possible to install an operating system on a bare metal server (no OS present) using the remotely
mounted device. This may also require the use of KVM-r to configure the OS during install.
USB storage devices will appear as floppy disks over media redirection. This allows for the installation of
device drivers during OS installation.
If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the virtual IDE
and virtual floppy are presented as bootable devices. It is not possible to present only a single-mounted
device type to the system BIOS.
11.1.3.8.1 Availability
The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection sessions persist
across system reset but not across an AC power loss or BMC reset.
11.1.3.8.2 Network Port Usage
The KVM and media redirection features use the following ports:
.
.
.
.
.
.
5120 – CD Redirection
5123 – FD Redirection
5124 – CD Redirection (Secure)
5127 – FD Redirection (Secure)
7578 – Video Redirection
7582 – Video Redirection (Secure)
For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web
Console Users Guide.
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Appendix A: Integration and Usage Tips
This section provides a list of useful information that is unique to the Intel® Server System R1000WT Product
Family and should be kept in mind while configuring your server system.
.
When adding or removing components or peripherals, power cords must be disconnected from the
server. With power applied to the server, standby voltages are still present even though the server
board is powered off.
.
This server board supports the Intel® Xeon® Processor E5-2600 v3 and v4 product family with a
Thermal Design Power (TDP) of up to and including 145 Watts. Previous generations of the Intel®
Xeon® processors are not supported. Server systems using this server board may or may not meet the
TDP design limits of the server board. Validate the TDP limits of the server system before selecting a
processor.
.
.
Processors must be installed in order. CPU 1 must be populated for the server board to operate
The riser card slots are specifically designed to support riser cards only. Attempting to install a
PCIe* add-in card directly into a riser card slot on the server board may damage the server board, the
add-in card, or both.
.
.
.
This server board only supports DDR4 ECC RDIMM – Registered (Buffered) DIMMS and DDR4 ECC
LRDIMM – Load Reduced DIMMs
For the best performance, the number of DDR4 DIMMs installed should be balanced across both
processor sockets and memory channels
On the back edge of the server board are eight diagnostic LEDs that display a sequence of amber
POST codes during the boot process. If the server board hangs during POST, the LEDs display the
last POST event run before the hang.
.
.
The System Status LED will be set to a steady Amber color for all Fatal Errors that are detected
during processor initialization. A steady Amber System Status LED indicates that an unrecoverable
system failure condition has occurred
RAID partitions created using either embedded software RAID option, RSTe or ESRT2, cannot span
across the two embedded SATA controllers. Only drives attached to a common SATA controller can
be included in a RAID partition
.
The FRUSDR utility must be run as part of the initial platform integration process before it is
deployed into a live operating environment. Once the initial FRU and SDR data is loaded on to the
system, all subsequent system configuration changes will automatically update SDR data using the
BMC auto configuration feature, without having to run the FRUSDR utility again. However, to ensure
the latest sensor data is installed, the SDR data should be updated to the latest available as part of a
planned system software update.
.
Make sure the latest system software is loaded on the server.This includes System BIOS, BMC
Firmware, ME Firmware and FRUSDR. The latest system software can be downloaded from
http://downloadcenter.intel.com.
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Appendix B: POST Code Diagnostic LED Decoder
As an aid to assist in trouble shooting a system hang that occurs during a system’s Power-On Self Test
(POST) process, the server board includes a bank of eight POST Code Diagnostic LEDs on the back edge of
the server board.
During the system boot process, Memory Reference Code (MRC) and System BIOS execute a number of
memory initialization and platform configuration processes, each of which is assigned a specific hex POST
code number. As each routine is started, the given POST code number is displayed to the POST Code
Diagnostic LEDs on the back edge of the server board.
During a POST system hang, the displayed post code can be used to identify the last POST routine that was
run prior to the error occurring, helping to isolate the possible cause of the hang condition.
Each POST code is represented by eight LEDs; four Green and four Amber. The POST codes are divided into
two nibbles, an upper nibble and a lower nibble. The upper nibble bits are represented by Amber Diagnostic
LEDs #4, #5, #6, and #7. The lower nibble bits are represented by Green Diagnostics LEDs #0, #1, #2, and #3.
If the bit is set in the upper and lower nibbles, the corresponding LED is lit. If the bit is clear, the
corresponding LED is off.
Figure 59. POST Diagnostic LED Location
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are
decoded as follows:
Table 39. POST Progress Code LED Example
Upper Nibble AMBER LEDs
Lower Nibble GREEN LEDs
MSB
LED #7
8h
LSB
LED #0
1h
LEDs
LED #6
4h
LED #5
2h
LED #4
1h
LED #3
8h
LED #2
4h
LED #1
2h
ON
OFF
ON
OFF
ON
ON
OFF
OFF
Status
1
0
1
0
1
1
0
0
Results
Ah
Ch
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh.
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Early POST Memory Initialization MRC Diagnostic Codes
Memory Initialization at the beginning of POST includes multiple functions, including: discovery, channel
training, validation that the DIMM population is acceptable and functional, initialization of the IMC and other
hardware settings, and initialization of applicable RAS configurations.
The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in the MRC
operational path at each step.
Table 40. MRC Progress Codes
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
LED
Upper Nibble
MSB
8h 4h 2h 1h 8h 4h 2h 1h
#7 #6 #5 #4 #3 #2 #1 #0
Lower Nibble
LSB
Description
MRC Progress Codes
B0h
B1h
B2h
B3h
B4h
B5h
B6h
B7h
B8h
B9h
BAh
BBh
BCh
BFh
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Detect DIMM population
Set DDR3 frequency
Gather remaining SPD data
Program registers on the memory controller level
Evaluate RAS modes and save rank information
Program registers on the channel level
Perform the JEDEC defined initialization sequence
Train DDR3 ranks
Initialize CLTT/OLTT
Hardware memory test and init
Execute software memory init
Program memory map and interleaving
Program RAS configuration
MRC is done
Should a major memory initialization error occur, preventing the system from booting with data integrity, a
beep code is generated, the MRC will display a fatal error code on the diagnostic LEDs, and a system halt
command is executed. Fatal MRC error halts do NOT change the state of the System Status LED, and they do
NOT get logged as SEL events. The following table lists all MRC fatal errors that are displayed to the
Diagnostic LEDs.
NOTE: Fatal MRC errors will display POST error codes that may be the same as BIOS POST progress codes
displayed later in the POST process. The fatal MRC codes can be distinguished from the BIOS POST progress
codes by the accompanying memory failure beep code of 3 long beeps as identified in Table 39.
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Table 41. MRC Fatal Error Codes
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Upper Nibble Lower Nibble
MSB LSB
Checkpoint
Description
8h 4h 2h 1h 8h 4h 2h 1h
#7 #6 #5 #4 #3 #2 #1 #0
LED
MRC Fatal Error Codes
E8h
1
1
1
0
1
0
0
0
No usable memory error
01h = No memory was detected from SPD read, or invalid config that
causes no operable memory.
02h = Memory DIMMs on all channels of all sockets are disabled due to
hardware memtest error.
3h = No memory installed. All channels are disabled.
E9h
EAh
1
1
1
1
1
1
0
0
1
1
0
0
0
1
1
0
Memory is locked by Intel Trusted Execution Technology and is
inaccessible
DDR3 channel training error
01h = Error on read DQ/DQS (Data/Data Strobe) init
02h = Error on Receive Enable
3h = Error on Write Leveling
04h = Error on write DQ/DQS (Data/Data Strobe
Memory test failure
EBh
EDh
1
1
1
1
1
1
0
0
1
1
0
1
1
0
1
1
01h = Software memtest failure.
02h = Hardware memtest failed.
03h = Hardware Memtest failure in Lockstep Channel mode requiring a
channel to be disabled. This is a fatal error which requires a reset and
calling MRC with a different RAS mode to retry.
DIMM configuration population error
01h = Different DIMM types (UDIMM, RDIMM, LRDIMM) are detected
installed in the system.
02h = Violation of DIMM population rules.
03h = The 3rd DIMM slot cannot be populated when QR DIMMs are
installed.
04h = UDIMMs are not supported in the 3rd DIMM slot.
05h = Unsupported DIMM Voltage.
EFh
1
1
1
0
1
1
1
1
Indicates a CLTT table structure error
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Appendix C: POST Code Errors
Most error conditions encountered during POST are reported using POST Error Codes. These codes
represent specific failures, warnings, or are informational. POST Error Codes may be displayed in the Error
Manager display screen, and are always logged to the System Event Log (SEL). Logged events are available to
System Management applications, including Remote and Out of Band (OOB) management.
There are exception cases in early initialization where system resources are not adequately initialized for
handling POST Error Code reporting. These cases are primarily Fatal Error conditions resulting from
initialization of processors and memory, and they are handed by a Diagnostic LED display with a system halt.
The following table lists the supported POST Error Codes. Each error code is assigned an error type which
determines the action the BIOS will take when the error is encountered. Error types include Minor, Major,
and Fatal. The BIOS action for each is defined as follows:
.
Minor: The error message is displayed on the screen or on the Error Manager screen, and an error is
logged to the SEL. The system continues booting in a degraded state. The user may want to replace
the erroneous unit. The POST Error Pause option setting in the BIOS setup does not have any effect
on this error.
.
Major: The error message is displayed on the Error Manager screen, and an error is logged to the
SEL. The POST Error Pause option setting in the BIOS setup determines whether the system pauses
to the Error Manager for this type of error so the user can take immediate corrective action or the
system continues booting.
Note that for 0048 “Password check failed”, the system halts, and then after the next reset/reboot
will displays the error code on the Error Manager screen.
.
Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error found.
System will not boot until the error is resolved” and “Press <F2> to enter setup” The POST Error
Pause option setting in the BIOS setup does not have any effect with this class of error.
When the operator presses the F2 key on the keyboard, the error message is displayed on the Error
Manager screen, and an error is logged to the SEL with the error code. The system cannot boot
unless the error is resolved. The user needs to replace the faulty part and restart the system.
Note: The POST error codes in the following table are common to all current generation Intel server
platforms. Features present on a given server board/system will determine which of the listed error codes
are supported
Table 42. POST Error Messages and Handling
Error Code
Error Message
Response
0012
System RTC date/time not set
Password check failed
Major
0048
0140
0141
0146
0191
0192
0194
Major
Major
Major
Major
Fatal
Fatal
Fatal
PCI component encountered a PERR error
PCI resource conflict
PCI out of resources error
Processor core/thread count mismatch detected
Processor cache size mismatch detected
Processor family mismatch detected
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Error Code
Error Message
Response
0195
Processor Intel(R) QPI link frequencies unable to synchronize
Fatal
0196
0197
5220
5221
5224
8130
8131
8160
8161
8170
8171
8180
8181
8190
8198
8300
8305
83A0
83A1
84F2
84F3
84F4
84FF
8500
8501
8520
8521
8522
8523
8524
8525
8526
8527
8528
8529
852A
852B
852C
852D
852E
852F
8530
8531
8532
8533
Processor model mismatch detected
Processor frequencies unable to synchronize
BIOS Settings reset to default settings
Passwords cleared by jumper
Fatal
Fatal
Major
Major
Major
Major
Major
Major
Major
Major
Major
Minor
Minor
Major
Major
Major
Major
Major
Major
Major
Major
Major
Minor
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Password clear jumper is Set
Processor 01 disabled
Processor 02 disabled
Processor 01 unable to apply microcode update
Processor 02 unable to apply microcode update
Processor 01 failed Self Test (BIST)
Processor 02 failed Self Test (BIST)
Processor 01 microcode update not found
Processor 02 microcode update not found
Watchdog timer failed on last boot
OS boot watchdog timer failure
Baseboard management controller failed self test
Hot Swap Controller failure
Management Engine (ME) failed self test
Management Engine (ME) Failed to respond.
Baseboard management controller failed to respond
Baseboard management controller in update mode
Sensor data record empty
System event log full
Memory component could not be configured in the selected RAS mode
DIMM Population Error
DIMM_A1 failed test/initialization
DIMM_A2 failed test/initialization
DIMM_A3 failed test/initialization
DIMM_B1 failed test/initialization
DIMM_B2 failed test/initialization
DIMM_B3 failed test/initialization
DIMM_C1 failed test/initialization
DIMM_C2 failed test/initialization
DIMM_C3 failed test/initialization
DIMM_D1 failed test/initialization
DIMM_D2 failed test/initialization
DIMM_D3 failed test/initialization
DIMM_E1 failed test/initialization
DIMM_E2 failed test/initialization
DIMM_E3 failed test/initialization
DIMM_F1 failed test/initialization
DIMM_F2 failed test/initialization
DIMM_F3 failed test/initialization
DIMM_G1 failed test/initialization
DIMM_G2 failed test/initialization
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Intel® R1000WT Server System TPS
Error Message
Error Code
Response
8534
DIMM_G3 failed test/initialization
Major
8535
8536
8537
8538
8539
853A
853B
853C
853D
853E
DIMM_H1 failed test/initialization
DIMM_H2 failed test/initialization
DIMM_H3 failed test/initialization
DIMM_J1 failed test/initialization
DIMM_J2 failed test/initialization
DIMM_J3 failed test/initialization
DIMM_K1 failed test/initialization
DIMM_K2 failed test/initialization
DIMM_K3 failed test/initialization
DIMM_L1 failed test/initialization
DIMM_L2 failed test/initialization
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
853F
(Go to
85C0)
8540
8541
8542
8543
8544
8545
8546
8547
8548
8549
854A
854B
854C
854D
854E
854F
8550
8551
8552
8553
8554
8555
8556
8557
8558
8559
855A
855B
855C
855D
855E
DIMM_A1 disabled
DIMM_A2 disabled
DIMM_A3 disabled
DIMM_B1 disabled
DIMM_B2 disabled
DIMM_B3 disabled
DIMM_C1 disabled
DIMM_C2 disabled
DIMM_C3 disabled
DIMM_D1 disabled
DIMM_D2 disabled
DIMM_D3 disabled
DIMM_E1 disabled
DIMM_E2 disabled
DIMM_E3 disabled
DIMM_F1 disabled
DIMM_F2 disabled
DIMM_F3 disabled
DIMM_G1 disabled
DIMM_G2 disabled
DIMM_G3 disabled
DIMM_H1 disabled
DIMM_H2 disabled
DIMM_H3 disabled
DIMM_J1 disabled
DIMM_J2 disabled
DIMM_J3 disabled
DIMM_K1 disabled
DIMM_K2 disabled
DIMM_K3 disabled
DIMM_L1 disabled
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
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Error Message
Error Code
855F
Response
Major
DIMM_L2 disabled
(Go to
85D0)
8560
8561
8562
8563
8564
8565
8566
8567
8568
8569
856A
856B
856C
856D
856E
856F
8570
8571
8572
8573
8574
8575
8576
8577
8578
8579
857A
857B
857C
857D
857E
DIMM_A1 encountered a Serial Presence Detection (SPD) failure
DIMM_A2 encountered a Serial Presence Detection (SPD) failure
DIMM_A3 encountered a Serial Presence Detection (SPD) failure
DIMM_B1 encountered a Serial Presence Detection (SPD) failure
DIMM_B2 encountered a Serial Presence Detection (SPD) failure
DIMM_B3 encountered a Serial Presence Detection (SPD) failure
DIMM_C1 encountered a Serial Presence Detection (SPD) failure
DIMM_C2 encountered a Serial Presence Detection (SPD) failure
DIMM_C3 encountered a Serial Presence Detection (SPD) failure
DIMM_D1 encountered a Serial Presence Detection (SPD) failure
DIMM_D2 encountered a Serial Presence Detection (SPD) failure
DIMM_D3 encountered a Serial Presence Detection (SPD) failure
DIMM_E1 encountered a Serial Presence Detection (SPD) failure
DIMM_E2 encountered a Serial Presence Detection (SPD) failure
DIMM_E3 encountered a Serial Presence Detection (SPD) failure
DIMM_F1 encountered a Serial Presence Detection (SPD) failure
DIMM_F2 encountered a Serial Presence Detection (SPD) failure
DIMM_F3 encountered a Serial Presence Detection (SPD) failure
DIMM_G1 encountered a Serial Presence Detection (SPD) failure
DIMM_G2 encountered a Serial Presence Detection (SPD) failure
DIMM_G3 encountered a Serial Presence Detection (SPD) failure
DIMM_H1 encountered a Serial Presence Detection (SPD) failure
DIMM_H2 encountered a Serial Presence Detection (SPD) failure
DIMM_H3 encountered a Serial Presence Detection (SPD) failure
DIMM_J1 encountered a Serial Presence Detection (SPD) failure
DIMM_J2 encountered a Serial Presence Detection (SPD) failure
DIMM_J3 encountered a Serial Presence Detection (SPD) failure
DIMM_K1 encountered a Serial Presence Detection (SPD) failure
DIMM_K2 encountered a Serial Presence Detection (SPD) failure
DIMM_K3 encountered a Serial Presence Detection (SPD) failure
DIMM_L1 encountered a Serial Presence Detection (SPD) failure
DIMM_L2 encountered a Serial Presence Detection (SPD) failure
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
857F
(Go to 85E0)
85C0
85C1
85C2
85C3
85C4
85C5
85C6
85C7
85C8
85C9
DIMM_L3 failed test/initialization
DIMM_M1 failed test/initialization
DIMM_M2 failed test/initialization
DIMM_M3 failed test/initialization
DIMM_N1 failed test/initialization
DIMM_N2 failed test/initialization
DIMM_N3 failed test/initialization
DIMM_P1 failed test/initialization
DIMM_P2 failed test/initialization
DIMM_P3 failed test/initialization
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
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Intel® R1000WT Server System TPS
Error Message
Error Code
Response
85CA
DIMM_R1 failed test/initialization
Major
85CB
85CC
85CD
85CE
85CF
85D0
85D1
85D2
85D3
85D4
85D5
85D6
85D7
85D8
85D9
85DA
85DB
85DC
85DD
85DE
85DF
85E0
85E1
85E2
85E3
85E4
85E5
85E6
85E7
85E8
85E9
85EA
85EB
85EC
85ED
85EE
85EF
8604
8605
8606
DIMM_R2 failed test/initialization
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Minor
Major
Major
Fatal
DIMM_R3 failed test/initialization
DIMM_T1 failed test/initialization
DIMM_T2 failed test/initialization
DIMM_T3 failed test/initialization
DIMM_L3 disabled
DIMM_M1 disabled
DIMM_M2 disabled
DIMM_M3 disabled
DIMM_N1 disabled
DIMM_N2 disabled
DIMM_N3 disabled
DIMM_P1 disabled
DIMM_P2 disabled
DIMM_P3 disabled
DIMM_R1 disabled
DIMM_R2 disabled
DIMM_R3 disabled
DIMM_T1 disabled
DIMM_T2 disabled
DIMM_T3 disabled
DIMM_L3 encountered a Serial Presence Detection (SPD) failure
DIMM_M1 encountered a Serial Presence Detection (SPD) failure
DIMM_M2 encountered a Serial Presence Detection (SPD) failure
DIMM_M3 encountered a Serial Presence Detection (SPD) failure
DIMM_N1 encountered a Serial Presence Detection (SPD) failure
DIMM_N2 encountered a Serial Presence Detection (SPD) failure
DIMM_N3 encountered a Serial Presence Detection (SPD) failure
DIMM_P1 encountered a Serial Presence Detection (SPD) failure
DIMM_P2 encountered a Serial Presence Detection (SPD) failure
DIMM_P3 encountered a Serial Presence Detection (SPD) failure
DIMM_R1 encountered a Serial Presence Detection (SPD) failure
DIMM_R2 encountered a Serial Presence Detection (SPD) failure
DIMM_R3 encountered a Serial Presence Detection (SPD) failure
DIMM_T1 encountered a Serial Presence Detection (SPD) failure
DIMM_T2 encountered a Serial Presence Detection (SPD) failure
DIMM_T3 encountered a Serial Presence Detection (SPD) failure
POST Reclaim of non-critical NVRAM variables
BIOS Settings are corrupted
NVRAM variable space was corrupted and has been reinitialized
Recovery boot has been initiated.
8607
Note: The Primary BIOS image may be corrupted or the system may hang during
POST. A BIOS update is required.
92A3
92A9
Serial port component was not detected
Major
Major
Serial port component encountered a resource conflict error
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Error Message
Error Code
Response
A000
TPM device not detected.
Minor
A001
A002
A003
A100
A421
A5A0
A5A1
TPM device missing or not responding.
TPM device failure.
Minor
Minor
Minor
Major
Fatal
TPM device failed self test.
BIOS ACM Error
PCI component encountered a SERR error
PCI Express component encountered a PERR error
PCI Express component encountered an SERR error
Minor
Fatal
DXE Boot Services driver: Not enough memory available to shadow a Legacy
Option ROM.
Minor
A6A0
POST Error Beep Codes
The following table lists the POST error beep codes. Prior to system video initialization, the BIOS uses these
beep codes to inform users on error conditions. The beep code is followed by a user-visible code on the
POST Progress LEDs.
Table 43. POST Error Beep Codes
Beeps
Error Message
USB device action
POST Progress Code
Description
Short beep sounded whenever USB device is
discovered in POST, or inserted or removed during
runtime.
1
N/A
1 long
3
Intel® TXT security
violation
0xAE, 0xAF
System halted because Intel® Trusted Execution
Technology detected a potential violation of system
security.
Memory error
Multiple
System halted because a fatal error related to the
memory was detected.
3 long
and 1
CPU mismatch
error
0xE5, 0xE6
System halted because a fatal error related to the
CPU family/core/cache mismatch was detected.
The following Beep Codes are sounded during BIOS Recovery.
2
4
Recovery started
Recovery failed
N/A
N/A
Recovery boot has been initiated.
Recovery has failed. This typically happens so quickly
after recovery is initiated that it sounds like a 2-4
beep code.
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Intel® R1000WT Server System TPS
The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes are sounded
each time the problem is discovered, such as on each power-up attempt, but are not sounded continuously.
Codes that are common across all Intel server boards and systems that use same generation chipset are
listed in the following table. Each digit in the code is represented by a sequence of beeps whose count is
equal to the digit.
Table 44. Integrated BMC Beep Codes
Code
Associated Sensors
Reason for Beep
CPU1 socket is empty, or sockets are populated
incorrectly
1-5-2-1 No CPUs installed or first CPU socket is
empty.
CPU1 must be populated before CPU2.
1-5-2-4 MSID Mismatch
1-5-4-2 Power fault
MSID mismatch occurs if a processor is installed
into a system board that has incompatible power
capabilities.
DC power unexpectedly lost (power good
dropout) – Power unit sensors report power unit
failure offset
1-5-4-4 Power control fault (power good
assertion timeout).
Power good assertion timeout – Power unit
sensors report soft power control failure offset
1-5-1-2 VR Watchdog Timer sensor assertion
VR controller DC power on sequence was not
completed in time.
1-5-1-4 Power Supply Status
The system does not power on or unexpectedly
powers off and a Power Supply Unit (PSU) is
present that is an incompatible model with one or
more other PSUs in the system.
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Appendix D: System Configuration Table for Thermal
Compatibility
This section provides system configuration compatibility data based on various supported system operating
thermal limits. Two tables are provided. The first table identifies supported system configurations while the
system is in “normal” operating mode; all systems fans are present, on-line, and operational. The second
table identifies supported system configurations while the system is in a “fan fail” mode; one system fan or
system fan rotor, is no longer on-line or operational, fan redundancy is lost.
The following notes communicate support criteria associated with specific configurations identified in the
following tables. Each relevant note to a configuration is identified by reference number in the table. Listed
notes that are not specified in the table will reflect support criteria for a similar 2U based system within the
Intel® Server Board S2600WT product family, details of which can be found in the Intel® Server System
R2000WT Technical Product Specification.
Thermal Configuration Table Notes:
1. The 27°C configuration alone is limited to elevations of 900m or less. Altitudes higher than 900m
need to be de-rated to ASHRAE Class 2 levels.
2. To support system fan redundancy, the system must be configured with two power supplies to
maintain sufficient cooling. Concurrent system and power supply fan failures is not supported.
3. Processor throttling may occur which may impact system performance. CPU reliability is not
impacted
4. In fan fail mode, Intel® I/O Modules AXX10GBTWLIOM and AXX2FDRIBIOM are only supported in the
specified base system model configured with 120W processors and DRx4 memory.
5. Use of the designated PCIe* slot is limited to add-in cards that have air flow requirements of 100 LFM
or less. See add-in card specs for air flow requirements.
6. For ASHRAE Class 3 and Class 4 support, the following power supply margining is required to meet
thermal specifications:
a) For dual power supply configurations, the power budget must fit within a single power supply
rated load and be installed in a dual configuration, or
b) For single power supply configurations, the power budget must be sized with 30% margin to
single power supply rated load.
7. Intel® Xeon Phi™ or non-Intel GPGPU cards may have performance impact during ASHRAE Class 3 and
Class 4 ambient air excursions
8. PCIe* SSD AIC SFF devices can only be supported in the top add-in card slot on Riser Slot #1 and
Riser Slot #2.
9. The Intel® RAID Maintenance Free Backup Unit (AXXRMFBUx) can support a case temperature of up to
45°C with the system operating in normal mode and up to 55°C with the system operating in a fan fail
mode. The case temperature of Intel® Smart RAID Battery (AXXRSBBUx) can support up to 45°C in
both normal and fan fail mode. Excursions over these specs may result in a reliability impact.
10. The 2U system must be configured with Intel® accessory kits AWTCOPRODUCT and A2UL16RISER2 in
order to support Intel® Xeon Phi™ or Non-Intel GPGPU add-in cards with passive cooling solutions.
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Intel® R1000WT Server System TPS
Thermal Configuration Table – System in “Normal” Operating Mode
"●" = Full Support without limitation
"4,5" (Cell with number) = Conditional support for configuration with limitations. See notes Section
" " (Blank Cell) = Configuration Not supported
Intel® Server System
Base System Models:
R1304WTxxxx
R1208WTxxxx
Classifications
Max Ambient
27C
27°C
(1)
A2
35°
C
A3
40°
C
A4
45°
C
ASHRAE
(See note 1)
1100W AC
750W AC
750W DC
●
●
●
●
●
●
●
●
PS (See note 6)
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3)
EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3)
EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3)
EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3)
EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3E5-2620 V3, E5-2609 V3,
E5-2603 V3)
●
●
●
●
EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E5-2637
V3)
EP Processors
( See Notes 3)
3
3
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3)
EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3)
EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3)
EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3)
EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3)
EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3)
RDIMM-2Rx8,1Rx4, 1Rx8
●
●
●
3
●
●
3
3
3
●
●
●
●
●
●
●
●
●
Memory Type
RDIMM-DRx4
LRDIMM-QRx4 DDP
Riser #1 - Bottom Slot (1U riser and 2U riser)
Riser #1 - Middle Slot (2U riser)
●
●
●
●
Add-in Cards
(See note 5)
Riser #1 - Top Slot (2U riser)
Riser #2 - Bottom Slot (1U riser and 2U riser)
Riser #2 - Middle Slot (2U riser)
●
●
●
●
Riser #2 - Top Slot (2U riser)
Riser #3 - Bottom Slot
3rd PCI Riser
Riser #3 - Top Slot
Intel® Integrated RAID Modules (Mezzanine cards)
AXX10GBTWLIOM - Dual 10GBASE-T IO Module
AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module
AXX1FDRIBIOM - Single Port FDR Infiniband IO Module
AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module
AXX4P1GBPWLIOM - Quad Port 1GbE IO Module
AXX1P40FRTIOM - Single Port 40GbE IO Module
AXX2P40FRTIOM - Dual Port 40GbE IO Module
AXXRSBBUx (rated to 45C)
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
SAS and I/O
Modules
(See Note 4)
Battery Backup
(See note 9)
AXXRMFBUx (rated to 55C)
Cache Offload Module (rated to 55C)
●
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Intel® R1000WT Server System TPS
Intel® Server System
Base System Models:
R1304WTxxxx
R1208WTxxxx
Classifications
Max Ambient
27C
27°C
(1)
A2
35°
C
A3
40°
C
A4
45°
C
ASHRAE
(See note 1)
Rated to 60C
Rated to 70C
Rated to 60C
Rated to 70C
1600GB/2TB
800GB
Internal SSD
Rear SSD
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
PCIe* SFF SSD
(DC
P3700/P3500)
600GB
400GB
200GB
1600GB/2TB
800GB
600GB
PCIe* SSD AIC FF
(DC
P3700/P3500)
(See note 8)
400GB
200GB
Active Cooling up to 300W
Active Cooling up to 225W
Intel® Xeon Phi™
(See Note 7, 10 )
Intel® Xeon Phi™ w/Passive Cooling up to 225W
Intel® Xeon Phi™ w/Passive Cooling up to 245W
Intel® Xeon Phi™ w/Passive Cooling up to 300W
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Intel® R1000WT Server System TPS
Thermal Configuration Table – System in “Fan Fail” Operating Mode
"●" = Full Support without limitation
"4,5" (Cell with number) = Conditional support for configuration with limitations. See notes Section
" " (Blank Cell) = Configuration Not supported
Base System SKUs:
R1304WTxxxx
R1208WTxxxx
Classifications
Max Ambient
27C
27°C
(1)
A2
35°
C
A3
40°
C
A4
45°
C
ASHRAE
(See note 1)
1100W AC
750W AC
750W DC
2
2
2
2
2
2
PS (See note 6)
EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3)
EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3 )
EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3)
●
●
●
●
●
●
●
●
EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3)
EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3, E5-2620 V3, E5-2609 V3,
E5-2603 V3)
●
●
EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E5-2637
V3)
EP Processors
( See Notes 3)
3
●
●
●
3
●
3
●
●
●
3
●
EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3)
EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3)
EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3)
EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3)
EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3)
EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3)
RDIMM-2Rx8,1Rx4
●
●
●
●
●
●
●
●
Memory Type
RDIMM-DRx4
LRDIMM-QRx4 DDP
Riser #1 - Bottom Slot (1U riser and 2U riser)
Riser #1 - Middle Slot (2U riser)
●
●
Add-in Cards
(See note 5)
Riser #1 - Top Slot (2U riser)
Riser #2 - Bottom Slot (1U riser and 2U riser)
Riser #2 - Middle Slot (2U riser)
●
●
Riser #2 - Top Slot (2U riser)
Riser #3 - Bottom Slot
3rd PCI Riser
Riser #3 - Top Slot
Intel® Integrated RAID Modules (Mezzanine cards)
AXX10GBTWLIOM - Dual 10GBASE-T IO Module
AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module
AXX1FDRIBIOM - Single Port FDR Infiniband IO Module
AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module
AXX4P1GBPWLIOM - Quad Port 1GbE IO Module
AXX1P40FRTIOM - Single Port 40GbE IO Module
AXX2P40FRTIOM - Dual Port 40GbE IO Module
AXXRSBBUx (rated to 45C)
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
SAS and I/O
Modules
(See Note 4)
Battery Backup
(See note 9)
AXXRMFBUx (rated to 55C)
Cache Offload Module (rated to 55C)
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Intel® R1000WT Server System TPS
Base System SKUs:
R1304WTxxxx
R1208WTxxxx
Classifications
Max Ambient
27C
27°C
(1)
A2
35°
C
A3
40°
C
A4
45°
C
ASHRAE
(See note 1)
Rated to 60C
Rated to 70C
Rated to 60C
Rated to 70C
1600GB/2TB
800GB
Internal SSD
Rear SSD
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
PCIe* SFF SSD
(DC
P3700/P3500)
600GB
400GB
200GB
1600GB/2TB
800GB
600GB
400GB
PCIe* SSD AIC FF
(DC
P3700/P3500)
(See note 8)
200GB
Active Cooling up to 300W
Active Cooling up to 225W
Intel® Xeon Phi™
(See Note 7, 10 )
Intel® Xeon Phi™ w/Passive Cooling up to 225W
Intel® Xeon Phi™ w/Passive Cooling up to 245W
Intel® Xeon Phi™ w/Passive Cooling up to 300W
November 2016
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Intel® R1000WT Server System TPS
Appendix E: System Cable Routing Diagrams
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Intel® R1000WT Server System TPS
Appendix F: Statement of Volatility
The tables in this section are used to identify the volatile and non-volatile memory components for system
boards used within the Intel® Server System R1000WT product family.
The tables provide the following data for each identified component.
Component Type
Three types of memory components are used on the server board assembly. These include:
.
Non-volatile: Non-volatile memory is persistent, and is not cleared when power is removed from the
system. Non-Volatile memory must be erased to clear data. The exact method of clearing these areas
varies by the specific component. Some areas are required for normal operation of the server, and
clearing these areas may render the server board inoperable.
.
.
Volatile: Volatile memory is cleared automatically when power is removed from the system.
Battery powered RAM: Battery powered RAM is similar to volatile memory, but is powered by a
battery on the server board. Data in Battery powered Ram is persistent until the battery is removed
from the server board.
Size
The size of each component includes sizes in bits, Kbits, bytes, kilobytes (KB) or megabytes (MB).
Board Location
The physical location of each component is specified in the Board Location column. The board location
information corresponds to information on the server board silkscreen.
User Data
The flash components on the server boards do not store user data from the operating system. No operating
system level data is retained in any listed components after AC power is removed. The persistence of
information written to each component is determined by its type as described in the table.
Each component stores data specific to its function. Some components may contain passwords that provide
access to that device’s configuration or functionality. These passwords are specific to the device and are
unique and unrelated to operating system passwords. The specific components that may contain password
data are:
.
BIOS: The server board BIOS provides the capability to prevent unauthorized users from configuring
BIOS settings when a BIOS password is set. This password is stored in BIOS flash, and is only used to
set BIOS configuration access restrictions.
.
BMC: The server boards support an Intelligent Platform Management Interface (IPMI) 2.0 conformant
baseboard management controller (BMC). The BMC provides health monitoring, alerting and remote
power control capabilities for the Intel® server board. The BMC does not have access to operating
system level data.
The BMC supports the capability for remote software to connect over the network and perform
health monitoring and power control. This access can be configured to require authentication by a
password. If configured, the BMC will maintain user passwords to control this access. These
passwords are stored in the BMC flash.
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Intel® Server Board S2600WT (iPN - H21573-xxx and G92187-xxx)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
128Mbit
U4F1
No(BIOS)
BIOS Flash
BMC Flash
Non-Volatile
Non-Volatile
Non-Volatile
Non-Volatile
Non-Volatile
Volatile
128Mbit
16Mbit
256K bit
N/A
U2D2
U5L2
U5L3
U1E1
U1C1
U1D2
No(FW)
No
10 GB NIC EEPROM (S2600WTTR)
No
1 GB NIC EEPROM (S2600WT2R)
No
CPLD
N/A
No
IPLD
128 MB
No
BMC SDRAM
1U 1 Slot PCIe* Riser Card (iPN – H39531-xxx)
Component Type
Size
Board Location
User Data
Name
N/A
N/A
None
No
N/A
Front Panel Board (iPN – H29366-xxx)
Component Type
Size
256x8
Board Location
U1A1
User Data
Name
PSOC / Microcontroller
Non-Volatile
Yes
1U 4 x 3.5” Hot Swap Back Plane option (iPN – G97162-xxx)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
16384x8
EU7L1
Yes
PSOC / Microcontroller / FRU
Non-Volatile
1024x8
U1
No
SAS Re-Driver Settings
1U 8 x 2.5” SAS Hot Swap Back Plane option (iPN – G97152-xxx)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
16384x8
U8A4
Yes
PSOC / Microcontroller / FRU
Non-Volatile
1024x8
U25
No
SAS Re-Driver Settings
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Intel® R1000WT Server System TPS
1U 8 x 2.5” Combo PCIe* SFF (NVMe) / SAS Hot Swap Back Plane Accessory Kit (iPC - A1U44X25NVMEDK)
1U 8 x 2.5” Combo PCIe* SFF (NVMe) / SAS Hot Swap Back Plane (iPN – G97154-xxx)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
16384x8
U8A4
Yes
PSOC / Microcontroller / FRU
Non-Volatile
1024x8
U25
No
SAS Re-Driver Settings
PCIe* SFF SSD Add-in Re-driver Card (iPN – G97168-xxx)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
1024x8
U24
No
PCIe Re-Timer Settings
Non-Volatile
256x8
U3
Yes
FRU
Intel® Remote Management Module Lite Accessory Option (iPC – AXXRMM4LITE)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
1Mbit
U2B1
No
RMM Programming
750W power supply module (iPC - FXX750PCRPS & AXX750DCCRPS)
Description
IC MCU FLASH 64K*8+1K*8 TQFP-44P
SMD / Manufacture Microchip
Component Type Size
Non-Volatile 64K
Location
User Data
Name
N/A
YES
750 power supply
108
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Intel® R1000WT Server System TPS
Appendix G: Intel® Storage System R1000WT
The Intel® Storage System R1000WT product family has features, functions, and support specifications
similar to those of the Intel® Server System R1000WT product family. This section identifies the features and
functions that make them different.
Intel® SSD DC P3700 NVMe* drives
Boot/Application drives
Figure 60. Intel® Storage Server R1000WT
November 2016
109
Intel® R1000WT Server System TPS
There are two Intel product codes that make up the product family:
R1208WTTA04NVMR & R1208WTTB04NVMR
Systems within the Intel® Storage System R1000WT support the following features:
Table 45. Intel® Storage System R1000WT Feature List
Feature
Description
Chassis Type
1U Rack Mount Chassis
Server Board
. Intel® Server Board S2600WT w/Dual 10GbE ports – (Intel product code - S2600WTTR)
. Two LGA2011-3 (Socket R3) processor sockets
Processor Support
. Support for one or two Intel® Xeon® processors E5-2600 v3 and v4 product family
. Maximum supported Thermal Design Power (TDP) of up to 145 W.
. 24 DIMM slots – 3 DIMMs/Channel – 4 memory channels per processor
. Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
. Memory data transfer rates:
Memory
Chipset
o
o
DDR4 RDIMM: 1600 MT/s (3DPC), 1866 MT/s (2DPC) and 2133 MT/s (1DPC)
DDR4 LRDIMM: 1600 MT/s (3DPC), 2133 MT/s (2DPC & 1DPC)
. DDR4 standard I/O voltage of 1.2V
Intel® C612 chipset
. DB-15 Video connectors
o
Front and Back
. RJ-45 Serial Port A connector
External I/O
connections
. Dual 10 GbE RJ-45 Network Interface connectors
. Dedicated RJ-45 server management NIC
. Three USB 2.0 / 3.0 connectors on back panel
. Two USB 2.0 / 3.0 connectors on front panel
. One Type-A USB 2.0 connector
. One 2x5 pin connector providing front panel support for two USB 2.0 ports
. One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports
. One 2x15 pin SSI-EEB compliant front panel header
. One 2x7pin Front Panel Video connector
Internal I/O connectors
/ headers
. One DH-10 Serial Port B connector
The server board includes a proprietary on-board connector allowing for the installation of a variety of
available Intel® I/O modules. An installed I/O module can be supported in addition to standard on-board
features and add-in PCIe cards.
. AXX4P1GBPWLIOM – Quad port RJ45 1 GbE based on Intel® Ethernet Controller I350
. AXX10GBTWLIOM3 – Dual port RJ-45 10GBase-T based on Intel® Ethernet Controller x540
. AXX10GBNIAIOM – Dual port SFP+ 10 GbE module based on Intel® 82599 10 GbE controller
. AXX1FDRIBIOM – Single port QSFP FDR 56 GT/S speed InfiniBand* module
. AXX2FDRIBIOM – Dual port QSFP FDR 56 GT/S speed infiniband* module
. AXX1P40FRTIOM – Single port QSFP+ 40 GbE module
Intel® I/O Module
Accessory Options
. AXX2P40FRTIOM – Dual port QSFP+ 40 GbE module
. Six managed 40mm dual rotor system fans
System Fans
. One power supply fan for each installed power supply module
110
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Intel® R1000WT Server System TPS
Description
Feature
Support for two riser cards:
.
.
Riser #1 – PCIe* Gen3 x24 – 1 PCIe slot
Riser #2 – PCIe* Gen3 x24 – 1 PCIe slot
Riser Card Support
With two riser cards installed, up to 2 possible add-in cards can be supported:
2 Full Height / Half Length add-in cards via Risers #1 and #2
.
NOTE: Riser card #2 is pre-populated with PCIe* NVMe interface add-in card
. Integrated 2D Video Controller
Video
. 16 MB DDR3 Memory
. 10 x SATA 6Gbps ports (6Gb/s, 3 Gb/s and 1.5Gb/s transfer rates are supported)
o
o
Two single port SATA connectors capable of supporting up to 6 Gb/sec
Two 4-port mini-SAS HD (SFF-8643) connectors capable of supporting up to 6 Gb/sec /SATA
. One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices
. Optional SAS IOC/ROC support via on-board Intel® Integrated RAID module connector
. Embedded Software SATA RAID
On-board storage
controllers and options
o
Intel® Rapid Storage RAID Technology (RSTe) 4.1
o
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 with optional RAID 5 key support
Security
Intel® Trusted Platform Module (TPM) – AXXTPME5, AXXTPME6, AXXTPME7 (Accessory Option)
. Integrated Baseboard Management Controller, IPMI 2.0 compliant
. Support for Intel® Server Management Software
Server Management
. On-board RJ45 management port
. Advanced Server Management via an Intel® Remote Management Module 4 Lite (Accessory Option)
. The server system can support 1 or 2 power supply modules, providing support for the following
power configurations: 1+0 (Single PS), or 1+1 Redundant Power and 2+0 Combined Power (Dual PS)
Power Supply
. (1) AC 750W Platinum (Included)
(8) – 2.5” Hot-swap drive bays
•
•
•
Includes (1) Combo (NVMe/SAS) backplane
Includes (4) 2.5” hot swap drive trays (Green Tab) + drive blanks + SATA/SAS cable
Includes (4) 2.5” hot swap NVMe drive assemblies (Blue Tab)
Hot Swap Drive Bay
R1208WTTA04NVMR
o
o
Includes (4) 2TB Intel® SSD DC P3700 (SFF NVMe) Drives
Includes (1) PCIe* SSD Interface Card (installed in Riser #2) + cables
(8) – 2.5” Hot-swap drive bays
•
•
•
Includes (1) Combo (NVMe/SAS) backplane
Includes (4) 2.5” hot swap drive trays (Green Tab) + drive blanks + SATA/SAS cable
Includes (4) 2.5” hot swap NVMe drive assemblies (Blue Tab)
Hot Swap Drive Bay
R1208WTTB04NVMR
o
Includes (4) 800GB Intel® SSD DC P3700 (SFF NVMe) Drives
o
Includes (1) PCIe* SSD Interface Card (installed in Riser #2) + cables
. AXXPRAIL – Tool-less rack mount rail kit – 800mm max travel length
. AXXELVRAIL – Enhanced value rack mount rail kit - 424mm max travel length
. AXX1U2UCMA – Cable Management Arm – (*supported with AXXPRAIL only)
. AXX2POSTBRCKT – 2-post fixed mount bracket kit
Supported Rack Mount
Kit Accessory Options
. A1USHRTRAIL - 1U Premium quality rails with no CMA support
. A1UFULLRAIL - 1U Premium quality rails with CMA support
November 2016
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Intel® R1000WT Server System TPS
Manageability Features
The Intel® Storage System R1000 includes management features that provide NVMe health monitoring and
alerting. Added health sensors give system administrators notification of potential issues with installed
NVMe drives.
•
•
NVMe Percentage of life monitoring – Monitors overall wear of the NVMe drive. As this value nears
100%, administrators can prepare to back up data and replace drives as needed.
NVMe Temperature monitoring – Provides the ability to read and report the case temperature of
installed NVMe drives. NVMe drives may operate at higher temperatures as compared to traditional
hard drives. With temperature monitoring, if desired, system administrators can modify
preprogrammed fan speed control to operate system fans to more aggressive lower or higher
operating levels.
•
Integrated BMC Web Console – Provides administrators remote access to NVMe drive information
112
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Glossary
Word/Acronym
BMC
BIOS
CLST
CMOS
CPU
Definition
Baseboard Management Controller
Basic Input/Output System
Closed Loop System Throttling
Complementary Metal-oxide-semiconductor
Central Processing Unit
DDR4
DIMM
DOM
DPC
Double Data Rate 4th edition
Dual In-line Memory Module
Disk-on-module
DIMMs per Channel
EDS
External Design Specification
External Product Specification
Front Panel
EPS
FP
FRB
Fault Resilient Boot
FRU
Field Replaceable Unit
GPGPU
HDD
I2C
General Purpose Graphic Processing Unit
Hard Disk Drive
Inter-integrated Circuit bus
Liquid Crystal Display
LCD
LCP
Local Control Panel
LED
Light Emitting Diode
LFM
Linear Feet per Minute – Air Flow measurement
Low-pin Count
LPC
LRDIMM
LSB
Load Reduced DIMM
Least Significant Bit
MSB
MTBF
NIC
Most Significant Bit
Mean Time Between Failure
Network Interface Card
NMI
Non-maskable Interrupt
Over-current Protection
Over-temperature Protection
Over-voltage Protection
Peripheral Component Interconnect
Printed Circuit Board
OCP
OTP
OVP
PCI
PCB
PCIe*
PCI-X
PFC
Peripheral Component Interconnect Express*
Peripheral Component Interconnect Extended
Power Factor Correction
Power-on Self Test
POST
PSU
Power Supply Unit
RAID
RAM
SSD
Redundant Array of Independent Disks
Random Access Memory
Solid State Drive
TDP
Thermal Design Power
November 2016
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Intel® R1000WT Server System TPS
Definition
Word/Acronym
TPM
TPS
USB
VLSI
VSB
Trusted Platform Module
Technical Product Specification
Universal Serial Bus
Very Large Scale Integration
Voltage Standby
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Reference Documents
See the following documents for additional information:
.
.
.
.
.
.
Intel® Server Board S2600WT Technical Product Specification
Intel® Server S2600WT Product Configuration Guide and Spares/Accessories List
Intel® Server System R1000WT Product Family System Integration and Service Guide
Intel® S2600WT Product Family Power Budget and Thermal Configuration Tool
Advanced Configuration and Power Interface Specification, Revision 3.0, http://www.acpi.info/.
Intelligent Platform Management Bus Communications Protocol Specification, Version 1.0. 1998.
Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.
.
.
Intelligent Platform Management Interface Specification, Version 2.0. 2004. Intel Corporation,
Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.
Platform Support for Serial-over-LAN (SOL), TMode, and Terminal Mode External Architecture
Specification, Version 1.1, 02/01/02, Intel Corporation.
.
.
Intel® Remote Management Module User’s Guide, Intel Corporation.
Alert Standard Format (ASF) Specification, Version 2.0, 23 April 2003, ©2000-2003, Distributed
Management Task Force, Inc., http://www.dmtf.org.
.
.
.
.
.
Intel® Server System BIOS External Product Specification for Intel® Servers Systems supporting the
Intel® Xeon® processor E5-2600 V3 and v4 product family – (Intel NDA Required)
Intel® Server System BIOS Setup Utility Guide for Intel® Servers Systems supporting the Intel® Xeon®
processor E5-2600 V3 and v4 product family
Intel® Server System BMC Firmware External Product Specification for Intel® Servers Systems
supporting the Intel® Xeon® processor E5-2600 V3 and v4 product family – (Intel NDA Required)
SmaRT & CLST Architecture on Intel Systems and Power Supplies Specification (Doc Reference #
461024)
Intel Integrated RAID Module RMS25PB080, RMS25PB040, RMS25CB080, and RMS25CB040
Hardware Users Guide
.
.
.
.
.
.
Intel® Remote Management Module 4 Technical Product Specification
Intel® Remote Management Module 4 and Integrated BMC Web Console Users Guide
Intel® Ethernet Controller I350 Family Product Brief
Intel® Ethernet Controller X540 Family Product Brief
Intel® Chipset C610 product family (“Wellsburg”) External Design Specification – (Intel NDA Required)
Intel® Xeon® Processor E5-4600/2600/2400/1600 v3 and v4 Product Families (“Haswell”) and
(“Broadwell”) External Design Specification – (Intel NDA Required)
November 2016
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Intel® R1000WT Server System TPS
NOTES
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116
November 2016
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