BUZ45B [INTERSIL]

10A, 500V, 0.500 Ohm, N-Channel Power MOSFET; 10A , 500V , 0.500 Ohm的N通道功率MOSFET
BUZ45B
型号: BUZ45B
厂家: Intersil    Intersil
描述:

10A, 500V, 0.500 Ohm, N-Channel Power MOSFET
10A , 500V , 0.500 Ohm的N通道功率MOSFET

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中文:  中文翻译
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BUZ45B  
Semiconductor  
Data Sheet  
October 1998  
File Number 2259.1  
10A, 500V, 0.500 Ohm, N-Channel Power  
MOSFET  
Features  
• 10A, 500V  
• r = 0.500  
[ /Title  
(BUZ45  
B)  
/Subject  
(10A,  
This is an N-Channel enhancement mode silicon gate power  
field effect transistor designed for applications such as  
switching regulators, switching converters, motor drivers,  
relay drivers, and drivers for high power bipolar switching  
transistors requiring high speed and low gate drive power.  
This type can be operated directly from integrated circuits.  
DS(ON)  
• SOA is Power Dissipation Limited  
• Nanosecond Switching Speeds  
• Linear Transfer Characteristics  
• High Input Impedance  
500V,  
0.500  
Formerly developmental type TA17435.  
• Majority Carrier Device  
Ohm, N-  
Channel  
Power  
MOS-  
FET)  
/Author  
()  
/Key-  
Ordering Information  
Symbol  
PART NUMBER  
PACKAGE  
BRAND  
BUZ45B  
D
BUZ45B  
TO-204AA  
NOTE: When ordering, use the entire part number.  
G
S
words  
(Harris  
Semi-  
conduc-  
tor, N-  
Channel  
Power  
MOS-  
FET,  
Packaging  
JEDEC TO-204AA  
DRAIN  
(FLANGE)  
TO-  
204AA)  
/Creator  
()  
SOURCE (PIN 2)  
GATE (PIN 1)  
/DOCIN  
FO pdf-  
mark  
[ /Page-  
Mode  
/UseOut-  
lines  
/DOC-  
VIEW  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-800-4-HARRIS | Copyright © Harris Corporation 1998  
1
BUZ45B  
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
BUZ45B  
500  
UNITS  
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V  
V
V
DS  
Drain to Gate Voltage (R  
GS  
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
500  
DGR  
o
Continuous Drain Current (T = 35 C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
10  
A
C
D
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
40  
A
DM  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V  
GS  
±20  
V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P  
125  
W
D
o
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
1.0  
W/ C  
o
-55 to 150  
E
C
J
STG  
DIN Humidity Category - DIN 40040 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
IEC Climatic Category - DIN IEC 68-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Maximum Temperature for Soldering  
55/150/56  
o
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
260  
C
L
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
o
o
1. T = 25 C to 125 C.  
J
o
Electrical Specifications  
T = 25 C, Unless Otherwise Specified  
C
PARAMETER  
Drain to Source Breakdown Voltage  
Gate to Threshold Voltage  
SYMBOL  
TEST CONDITIONS  
= 250µA, V = 0V  
MIN  
TYP  
-
MAX  
-
UNITS  
V
BV  
I
500  
DSS  
D
GS  
V
V
= V , I = 1mA (Figure 9)  
2.1  
3
4
V
GS(TH)  
GS  
DS  
D
o
Zero Gate Voltage Drain Current  
I
T = 25 C, V  
J
= 500V, V  
GS  
= 0V  
= 0V  
-
20  
250  
1000  
100  
0.50  
-
µA  
µA  
nA  
DSS  
GSS  
DS  
o
T = 125 C, V  
= 500V, V  
= 0V  
-
100  
10  
J
DS  
DS  
GS  
Gate to Source Leakage Current  
I
V
= 20V, V  
-
GS  
Drain to Source On Resistance (Note 2)  
Forward Transconductance (Note 2)  
Turn-On Delay Time  
r
I
= 5A, V  
= 10V (Figure 8)  
-
0.49  
5
DS(ON)  
D
GS  
g
V
= 25V, I = 5A (Figure 11)  
2.7  
S
DS  
CC  
D
fs  
t
V
= 30V, ID 2.9A, V = 10V,  
= 50Ω, R = 10. (Figures 14, 15)  
-
-
-
-
-
-
-
50  
75  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
d(ON)  
GS  
R
GS  
L
Rise Time  
t
80  
120  
430  
140  
4900  
400  
170  
r
Turn-Off Delay Time  
t
330  
110  
3800  
250  
100  
1  
35  
d(OFF)  
Fall Time  
t
f
Input Capacitance  
C
V
= 25V, V  
(Figure 10)  
= 0V, f = 1MHz  
GS  
ISS  
DS  
Output Capacitance  
C
C
OSS  
Reverse Transfer Capacitance  
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
RSS  
o
R
R
C/W  
θJC  
o
C/W  
θJA  
Source to Drain Diode Specifications  
PARAMETER  
Continuous Source to Drain Current  
Pulsed Source to Drain Current  
Source to Drain Diode Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
NOTES:  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
10  
40  
1.7  
-
UNITS  
o
I
T
= 25 C  
-
-
-
-
-
-
-
A
A
SD  
C
I
SDM  
o
V
T = 25 C, I  
J
= 20A, V  
GS  
= 0V  
1.3  
1200  
12  
V
SD  
SD  
SD  
o
t
T = 25 C, I  
= 10A, dI /dt = 100A/µs,  
SD  
ns  
µC  
rr  
J
V
= 100V  
R
Q
-
RR  
2. Pulse Test: Pulse width 300µs, duty cycle 2%.  
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3).  
2
BUZ45B  
Typical Performance Curves Unless Otherwise Specified  
12  
1.2  
1.0  
0.8  
V
10V  
GS  
10  
8
6
0.6  
0.4  
4
2
0.2  
0
0
0
25  
50  
75  
100  
125  
150  
0
50  
100  
150  
o
o
T
, CASE TEMPERATURE ( C)  
T , CASE TEMPERATURE ( C)  
C
C
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE  
TEMPERATURE  
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs  
CASE TEMPERATURE  
1
D =  
0.5  
0.2  
P
DM  
0.1  
0.1  
0.05  
0.02  
0.01  
t
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
0
1
2
PEAK T = P  
x Z  
x R  
+ T  
θJC C  
J
DM  
θJC  
0.01  
10  
-5  
-4  
-3  
10  
-2  
-1  
10  
0
1
10  
10  
t, RECTANGULAR PULSE DURATION (s)  
10  
10  
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE  
2
1
30  
10  
PULSE DURATION = 80µs  
P
= 125W  
20V  
D
o
T
= 25 C  
J
0.8µs  
10µs  
10V  
8.0V  
20  
10  
0
7.5V  
10  
V
= 7.0V  
= 6.5V  
= 6.0V  
= 5.5V  
= 5.0V  
GS  
100µs  
V
GS  
OPERATION IN THIS  
AREA MAY BE LIMITED  
V
1ms  
GS  
0
10  
V
BY r  
GS  
DS(ON)  
10ms  
V
100ms  
DC  
GS  
T
T
= MAX RATED  
J
C
V
= 4.5V  
= 4.0V  
GS  
o
= 25 C  
V
-1  
10  
GS  
0
1
2
3
10  
10  
, DRAIN TO SOURCE VOLTAGE (V)  
10  
10  
0
10  
V , DRAIN TO SOURCE VOLTAGE (V)  
DS  
20  
30  
40  
V
DS  
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA  
FIGURE 5. OUTPUT CHARACTERISTICS  
3
BUZ45B  
Typical Performance Curves Unless Otherwise Specified (Continued)  
15  
10  
5
2.0  
1.5  
1.0  
0.5  
0
PULSE DURATION = 80µs  
PULSE DURATION = 80µs  
= 25V  
V
DS  
= 25 C  
o
T
J
V
= 5V 5.5V 6V 6.5V 7V  
GS  
7.5V  
8V  
9V  
10V  
20V  
0
0
10  
20  
30  
0
5
10  
V
, GATE TO SOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
GS  
FIGURE 6. TRANSFER CHARACTERISTICS  
FIGURE 7. DRAIN TO SOURCE ON RESISTANCE vs GATE  
VOLTAGE AND DRAIN CURRENT  
1.6  
1.2  
0.8  
0.4  
0
4
I
V
= 5A  
= 10V  
V
= V , I = 1mA  
GS  
D
DS  
D
GS  
PULSE DURATION = 80µs  
3
2
1
0
-50  
0
50  
100  
o
150  
-50  
0
50  
100  
o
150  
T , JUNCTION TEMPERATURE ( C)  
T , JUNCTION TEMPERATURE ( C)  
J
J
FIGURE 8. DRAIN TO SOURCE ON RESISTANCE vs  
JUNCTION TEMPERATURE  
FIGURE 9. GATE THRESHOLD VOLTAGE vs JUNCTION  
TEMPERATURE  
1
7
10  
PULSE DURATION = 80µs  
V
= 25V  
DS  
= 25 C  
o
C
6
5
T
ISS  
J
0
10  
4
3
2
1
0
C
C
OSS  
-1  
10  
RSS  
V
= 0, f = 1MHz  
GS  
C
C
C
= C  
GS  
+ C  
ISS  
GD  
= C  
= C  
DS  
RSS  
OSS  
GD  
+ C  
GS  
-2  
10  
0
10  
20  
30  
40  
0
5
10  
15  
V
, DRAIN TO SOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
DS  
D
FIGURE 10. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE  
FIGURE 11. TRANSCONDUCTANCE vs DRAIN CURRENT  
4
BUZ45B  
Typical Performance Curves Unless Otherwise Specified (Continued)  
2
1
0
15  
10  
5
10  
10  
10  
I
= 14.4A  
PULSE DURATION = 80µs  
D
V
= 100V  
DS  
o
T
= 150 C  
J
V
= 400V  
DS  
o
T
= 25 C  
J
-1  
10  
0
0
20  
40  
60  
80  
100  
120  
0
0.5  
1.0  
1.5  
2.0  
V
, SOURCE TO DRAIN VOLTAGE (V)  
SD  
Q
g(TOT)  
, TOTAL GATE CHARGE (nC)  
FIGURE 12. SOURCE TO DRAIN DIODE VOLTAGE  
FIGURE 13. GATE TO SOURCE VOLTAGE vs GATE CHARGE  
Test Circuits and Waveforms  
t
t
ON  
OFF  
t
d(OFF)  
t
d(ON)  
t
t
f
r
R
L
V
DS  
90%  
90%  
+
V
DD  
10%  
10%  
R
G
0
-
DUT  
90%  
50%  
V
GS  
50%  
PULSE WIDTH  
10%  
V
GS  
0
FIGURE 14. SWITCHING TIME TEST CIRCUIT  
FIGURE 15. RESISTIVE SWITCHING WAVEFORMS  
V
DS  
(ISOLATED  
SUPPLY)  
CURRENT  
REGULATOR  
V
DD  
Q
SAME TYPE  
AS DUT  
g(TOT)  
V
GS  
12V  
BATTERY  
0.2µF  
Q
gd  
50kΩ  
0.3µF  
Q
gs  
D
S
V
DS  
G
DUT  
0
0
I
g(REF)  
0
V
I
DS  
g(REF)  
I
CURRENT  
SAMPLING  
RESISTOR  
I
CURRENT  
SAMPLING  
RESISTOR  
G
D
FIGURE 16. GATE CHARGE TEST CIRCUIT  
FIGURE 17. GATE CHARGE WAVEFORMS  
5

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