FRE260D [INTERSIL]

31A, 200V, 0.080 Ohm, Rad Hard, N-Channel Power MOSFETs; 31A , 200V , 0.080欧姆,抗辐射, N沟道功率MOSFET
FRE260D
型号: FRE260D
厂家: Intersil    Intersil
描述:

31A, 200V, 0.080 Ohm, Rad Hard, N-Channel Power MOSFETs
31A , 200V , 0.080欧姆,抗辐射, N沟道功率MOSFET

晶体 晶体管 开关 脉冲 局域网
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FRE260D, FRE260R,  
FRE260H  
31A, 200V, 0.080 Ohm, Rad Hard,  
N-Channel Power MOSFETs  
June 1998  
Features  
Package  
• 31A, 200V, RDS(on) = 0.080  
TO-258AA  
• Second Generation Rad Hard MOSFET Results From New Design Concepts  
• Gamma  
- Meets Pre-Rad Specifications to 100KRAD(Si)  
- Defined End Point Specs at 300KRAD(Si) and 1000KRAD(Si)  
- Performance Permits Limited Use to 3000KRAD(Si)  
• Gamma Dot  
- Survives 3E9 RAD(Si)/sec at 80% BVDSS Typically  
- Survives 2E12 Typically If Current Limited to IDM  
• Photo Current - 18.0nA Per-RAD(Si)/sec Typically  
2
• Neutron  
- Pre-RAD Specifications for 1E13 Neutrons/cm  
2
- Usable to 1E14 Neutrons/cm  
Description  
Symbol  
The Intersil has designed a series of SECOND GENERATION hardened power  
MOSFETs of both N and P channel enhancement types with ratings from 100V to  
500V, 1A to 60A, and on resistance as low as 25m. Total dose hardness is  
offered at 100K RAD(Si) and 1000KRAD(Si) with neutron hardness ranging from  
1E13 for 500V product to 1E14 for 100V product. Dose rate hardness (GAMMA  
DOT) exists for rates to 1E9 without current limiting and 2E12 with current limiting.  
This MOSFET is an enhancement-mode silicon-gate power field effect transistor of  
the vertical DMOS (VDMOS) structure. It is specially designed and processed to  
o
exhibit minimal characteristic changes to total dose (GAMMA) and neutron (n )  
exposures. Design and processing efforts are also directed to enhance survival to  
heavy ion (SEU) and/or dose rate (GAMMA DOT) exposure.  
This part may be supplied as a die or in various packages other than shown above.  
Reliability screening is available as either non TX (commercial), TX equivalent of  
MIL-S-19500, TXV equivalent of MIL-S-19500, or space equivalent of  
MIL-S-19500. Contact the Intersil High-Reliability Marketing group for any desired  
deviations from the data sheet.  
o
Absolute Maximum Ratings (TC = +25 C) Unless Otherwise Specified  
FRE260D, R, H  
UNITS  
Drain-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS  
Drain-Gate Voltage (RGS = 20k). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR  
Continuous Drain Current  
200  
200  
V
V
o
TC = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID  
31  
19  
93  
A
A
A
V
o
TC = +100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID  
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM  
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS  
Maximum Power Dissipation  
±20  
o
TC = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT  
150  
60  
1.20  
W
W
o
TC = +100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT  
o
o
Derated Above +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
W/ C  
Inductive Current, Clamped, L = 100µH, (See Test Figure). . . . . . . . . . . . . . . . . . . . . . . . . . ILM  
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IS  
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM  
Operating And Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJC, TSTG  
Lead Temperature (During Soldering)  
93  
31  
93  
A
A
A
o
-55 to +150  
C
o
Distance > 0.063 in. (1.6mm) From Case, 10s Max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL  
300  
C
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 3259.1  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 19994-1  
FRE260D, FRE260R, FRE260H  
o
Pre-Radiation Electrical Specifications TC = +25 C, Unless Otherwise Specified  
LIMITS  
MAX  
PARAMETER  
SYMBOL  
BVDSS  
VGS(th)  
IGSSF  
TEST CONDITIONS  
VGS = 0, ID = 1mA  
MIN  
200  
2.0  
-
UNITS  
V
Drain-Source Breakdown Volts  
Gate-Treshold Volts  
-
VDS = VGS, ID = 1mA  
VGS = +20V  
4.0  
100  
100  
V
Gate-Body Leakage Forward  
Gate-Body Leakage Reverse  
Zero-Gate Voltage Drain Current  
nA  
IGSSR  
VGS = -20V  
-
nA  
IDSS1  
IDSS2  
IDSS3  
VDS = 200V, VGS = 0  
VDS = 160V, VGS = 0  
VDS = 160V, VGS = 0,Tc = +125 C  
-
-
-
1
0.025  
0.25  
mA  
o
Rated Avalanche Current  
Drain-Source On-State Volts  
Drain-Source On Resistance  
Turn-On Delay Time  
Rise Time  
IAR  
VDS(on)  
RDS(on)  
td(on)  
tr  
Time = 20µs  
-
93  
2.60  
0.080  
100  
250  
600  
300  
24  
A
V
VGS = 10V, ID = 31A  
VGS = 10V, ID = 19A  
-
-
VDD = 100V, ID = 31A  
Pulse Width = 3µs  
Period = 300µs Rg = 10 Ω  
0 < VGS < 10 (See Test Circuit)  
-
-
ns  
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
-
-
Gate-Charge Threshold  
Gate-Charge On State  
Gate-Charge Total  
QG(th)  
QG(on)  
QGM  
VGP  
6
110  
214  
3
440  
856  
12  
VDD = 100V, ID = 31A  
IGS1 = IGS2  
0 < Vgs < 20  
Plateau Voltage  
V
Gate-Charge Source  
Gate-Charge Drain  
Diode Forward Voltage  
Reverse Recovery Time  
Junction-To-Case  
QGS  
QGD  
VSD  
20  
46  
0.6  
-
80  
nc  
184  
1.8  
ID = 31A, VGD = 0  
I = 31A; di/dt = 100A/µs  
-
V
TT  
1200  
0.83  
48  
ns  
Rθjc  
-
o
C/W  
Junction-To-Ambient  
Rθja  
Free Air Operation  
-
ELECTRONIC SWITCH OPENS  
WHEN I IS REACHED  
AS  
V
DD  
V
DS  
L
R
L
+
I
-
CURRENT  
TRANSFORMER  
V
AS  
DS  
V
= 12V  
GS  
VARY t TO OBTAIN  
P
DUT  
+
50Ω  
REQUIRED PEAK I  
AS  
V
DD  
0V  
V
20V  
GS  
-
R
50V-150V  
DUT  
GS  
50Ω  
t
P
0V  
FIGURE 1. RESISTIVE SWITCHING TEST CIRCUIT  
FIGURE 2. UNCLAMPED ENERGY TEST CIRCUIT  
4-2  
FRE260D, FRE260R, FRE260H  
o
Post-Radiation Electrical Specifications TC = +25 C, Unless Otherwise Specified  
LIMITS  
PARAMETER  
SYMBOL  
BVDSS  
BVDSS  
VGS(th)  
VGS(th)  
IGSSF  
TYPE  
TEST CONDITIONS  
VGS = 0, ID = 1mA  
MIN  
MAX  
-
UNITS  
V
Drain-Source  
(Note 4, 6)  
FRE260D, R  
FRE260H  
200  
Breakdown Volts  
(Note 5, 6)  
VGS = 0, ID = 1mA  
190  
-
V
Gate-Source  
(Note 4, 6)  
FRE260D, R  
FRE260H  
VGS = VDS, ID = 1mA  
VGS = VDS, ID = 1mA  
VGS = 20V, VDS = 0  
VGS = 20V, VDS = 0  
VGS = -20V, VDS = 0  
VGS = -20V, VDS = 0  
VGS = 0, VDS = 160V  
VGS = 0, VDS = 160V  
VGS = 10V, ID = 31A  
VGS = 16V, ID = 31A  
VGS = 10V, ID = 19A  
VGS = 14V, ID = 19A  
2.0  
4.0  
V
Threshold Volts  
(Note 3, 5, 6)  
(Note 4, 6)  
1.5  
4.5  
V
Gate-Body  
FRE260D, R  
FRE260H  
-
-
-
-
-
-
-
-
-
-
100  
200  
100  
200  
25  
nA  
nA  
nA  
nA  
µA  
µA  
V
Leakage Forward  
(Note 5, 6)  
IGSSF  
Gate-Body  
(Note 2, 4, 6)  
(Note 2, 5, 6)  
(Note 4, 6)  
IGSSR  
IGSSR  
IDSS  
FRE260D, R  
FRE260H  
Leakage Reverse  
Zero-Gate Voltage  
Drain Current  
FRE260D, R  
FRE260H  
(Note 5, 6)  
IDSS  
100  
2.60  
3.90  
0.080  
0.120  
Drain-Source  
On-State Volts  
(Note 1, 4, 6)  
(Note 1, 5, 6)  
(Note 1, 4, 6)  
(Note 1, 5, 6)  
VDS(on)  
VDS(on)  
RDS(on)  
RDS(on)  
FRE260D, R  
FRE260H  
V
Drain-Source  
On Resistance  
FRE260D, R  
FRE260H  
NOTES:  
1. Pulse test, 300µs max  
2. Absolute value  
3. Gamma = 300KRAD(Si)  
4. Gamma = 10KRAD(Si) for “D”, 100KRAD(Si) for “R”. Neutron = 1E13  
5. Gamma = 1000KRAD(Si). Neutron = 1E13  
6. Insitu Gamma bias must be sampled for both VGS = +10V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS  
7. Gamma data taken 1/02/90 on TA 17662 devices by GE ASTRO SPACE; EMC/SURVIVABILITY LABORATORY; KING OF PRUSSIA,  
PA 19401  
8. Single event drain burnout testing by Titus, J.L., et al of NWSC, Crane, IN at Brookhaven Nat. Lab. Dec 11-14, 1989  
9. Neutron derivation, INTERSIL Application Note AN-8831, Oct. 1988  
4-3  
FRE260D, FRE260R, FRE260H  
Performance Curves  
4-4  
FRE260D, FRE260R, FRE260H  
Rad Hard Data Packages - Intersil Power Transistors  
TXV Equivalent  
E. Preconditioning Attributes Data Sheet  
Hi-Rel Lot Traveler  
HTRB - Hi Temp Gate Stress Post Reverse  
Bias Data and Delta Data  
1. Rad Hard TXV Equivalent - Standard Data Package  
A. Certificate of Compliance  
B. Assembly Flow Chart  
HTRB - Hi Temp Drain Stress Post Reverse  
Bias Delta Data  
C. Preconditioning - Attributes Data Sheet  
F. Group A  
G. Group B  
H. Group C  
I. Group D  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
D. Group A  
E. Group B  
F. Group C  
G. Group D  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
2. Rad Hard Max. “S” Equivalent - Optional Data Package  
A. Certificate of Compliance  
2. Rad Hard TXV Equivalent - Optional Data Package  
A. Certificate of Compliance  
B. Serialization Records  
B. Assembly Flow Chart  
C. Assembly Flow Chart  
C. Preconditioning - Attributes Data Sheet  
- Precondition Lot Traveler  
- Pre and Post Burn-In Read and Record  
Data  
D. SEM Photos and Report  
E. Preconditioning - Attributes Data Sheet  
- Hi-Rel Lot Traveler  
D. Group A  
- Attributes Data Sheet  
- Group A Lot Traveler  
- HTRB - Hi Temp Gate Stress Post  
Reverse Bias Data and Delta Data  
- HTRB - Hi Temp Drain Stress Post  
Reverse Bias Delta Data  
E. Group B  
- Attributes Data Sheet  
- Group B Lot Traveler  
- X-Ray and X-Ray Report  
- Pre and Post Read and Record Data for  
Intermittent Operating Life (Subgroup B3)  
- Bond Strength Data (Subgroup B3)  
- Pre and Post High Temperature Operating  
Life Read and Record Data (Subgroup B6)  
F. Group A  
G. Group B  
H. Group C  
I. Group D  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Subgroups A2, A3, A4, A5 and A7 Data  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Subgroups B1, B3, B4, B5 and B6 Data  
F. Group C  
- Attributes Data Sheet  
- Group C Lot Traveler  
- Pre and Post Read and Record Data for  
Intermittent Operating Life (Subgroup C6)  
- Bond Strength Data (Subgroup C6)  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Subgroups C1, C2, C3 and C6 Data  
G. Group D  
- Attributes Data Sheet  
- Group D Lot Traveler  
- Pre and Post RAD Read and Record Data  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Pre and Post Radiation Data  
Class S - Equivalents  
1. Rad Hard “S” Equivalent - Standard Data Package  
A. Certificate of Compliance  
B. Serialization Records  
C. Assembly Flow Chart  
D. SEM Photos and Report  
4-5  
FRE260D, FRE260R, FRE260H  
TO-258AA  
3 LEAD JEDEC STYLE TO-258AA HERMETIC METAL PACKAGE  
INCHES  
MIN  
MILLIMETERS  
0.080 R MAX. (2 PLC'S)  
E
A
1
SYMBOL  
MAX  
0.270  
0.045  
0.045  
0.830  
0.695  
MIN  
6.35  
MAX  
6.85  
NOTES  
ØP  
A
A
0.250  
0.035  
0.035  
0.815  
0.685  
-
Q
A
0.89  
1.14  
-
1
H
1
Øb  
D
0.89  
1.14  
2, 3  
20.71  
17.40  
21.08  
17.65  
-
-
D
E
e
0.200 TYP  
0.400 BSC  
5.08 TYP  
10.16 BSC  
4
4
-
e
1
H
0.270  
0.290  
0.150  
0.650  
0.165  
0.125  
6.86  
7.36  
3.81  
1
1
J
0.130  
0.600  
0.155  
0.115  
3.31  
15.24  
3.94  
4
-
0.075 R  
(4 PLC'S)  
L
16.51  
4.19  
ØP  
Q
-
Øb  
L
2.93  
3.17  
-
NOTES:  
1. These dimensions are within allowable dimensions of Rev. A of  
JEDEC TO-258AA outline dated 2-88. Except Øb.  
1
2
3
2. Add typically 0.002 inches (0.05mm) for solder coating.  
3. Lead dimension (without solder).  
J
e
1
e1  
4. Position of lead to be measured 0.250 inches (6.35mm) from bot-  
tom of dimension D.  
5. Die to base BeO isolated, terminals to case ceramic isolated.  
6. Controlling dimension: Inch.  
7. Revision 2 dated 5-98.  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
Intersil (Taiwan) Ltd.  
Taiwan Limited  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (407) 724-7000  
FAX: (407) 724-7240  
4-6  

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