HIP5060DW [INTERSIL]

Power Control IC Single Chip PowerSupply; 电源控制IC单芯片POWERSUPPLY
HIP5060DW
型号: HIP5060DW
厂家: Intersil    Intersil
描述:

Power Control IC Single Chip PowerSupply
电源控制IC单芯片POWERSUPPLY

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中文:  中文翻译
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HIP5060  
®
August 1998  
File Number 3207.2  
Power Control IC Single Chip  
PowerSupply  
Features  
• Single Chip Current Mode Control IC  
• 60V, 10A On-Chip DMOS Transistor  
• Thermal Protection  
• Over-Voltage Protection  
• Over-Current Protection  
• 1MHz Operation or External Clock  
• Synchronization Output  
• On-Chip Reference Voltage - 5.1V  
• Output Rise and Fall Times ~ 3ns  
• Designed for 27V to 45V Operation  
The HIP5060 is a complete power control IC, incorporating  
both the high power DMOS transistor, CMOS logic and low  
level analog circuitry on the same Intelligent Power IC. Both  
the standard “Boost” and the “SEPIC” (Single-Ended  
Primary Inductance Converter) power supply topologies are  
easily implemented with this single control IC.  
Special power transistor current sensing circuitry is  
incorporated that minimizes losses due to the monitoring  
circuitry. Moreover, over-temperature and over-voltage  
detection circuitry is incorporated within the IC to monitor the  
chip temperature and the actual power supply output  
voltage. These circuits can disable the drive to the power  
transistor to protect both the transistor and, most  
importantly, the load from over-voltage.  
Applications  
• Single Chip Power Supplies  
• Current Mode PWM Applications  
• Distributed Power Supplies  
• Multiple Output Converters  
As a result of the power DMOS transistor’s current and  
voltage capability (10A and 60V), power supplies with output  
power capability up to 100 watts are possible.  
Ordering Information  
TEMPERATURE  
PART NUMBER  
HIP5060DY  
RANGE  
PACKAGE  
37 Pad Chip  
Wafer  
o
o
0 C to +85 C  
o
o
HIP5060DW  
0 C to +85 C  
Chip  
(8) V  
DDA  
FLTH (37)  
VREG (36)  
VCMP (35)  
PSOK (34)  
(9) V+  
(10) SLCT  
(11) CKIO  
(12) DGD1  
SHRT (33)  
PSEN (32)  
TMON (31)  
(13) V  
(14) V  
DDP  
DDP  
NOTE: Unused pads are for trim and test.  
153 mils x 165 mils (3.88mm x 4.19mm)  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2002. All Rights Reserved  
1
HIP5060  
Simplified Block Diagram  
4µH  
4µH  
1.1µF  
V
IN  
0.1µF  
100µF  
0.1µF  
D
V+  
1
µF  
4µH  
0.88µF  
CLOCK  
VCMP  
AND  
CONTROL  
LOGIC  
GATE  
DRIVERS  
FLTN  
PSOK  
SHRT  
PSEN  
TMON  
DGD1  
30.1K  
S
DG02  
0.033µF  
VREG  
AMP  
0.1µF  
V
DDP  
DDP  
V
REFERENCE  
0.1µF  
VINP  
AGND  
SFST  
CKIO SLCT  
V
V
IRF1  
IRF0  
DDA  
DDD  
0.1µF  
0.1µF  
0.1µF  
4.02K  
TYPICAL SEPIC CONFIGURATION  
2
HIP5060  
Absolute Maximum Ratings  
Thermal Information  
DC Supply Voltage, V+. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 45V  
DMOS Drain Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 60V  
DMOS Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20A  
DC Logic Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 16V  
Output Voltage, Logic Outputs . . . . . . . . . . . . . . . . . . . -0.3V to 16V  
Input Voltage, Analog and Logic. . . . . . . . . . . . . . . . . . -0.3V to 16V  
Thermal Resistance  
(Solder Mounted to . . . . . . . . . . . . . . . . . . . . . . . . . 3 C/W Max  
0.050” Thick Copper Heat Sink)  
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . +110 C  
(Controlled By Thermal Shutdown Circuit)  
θ
JC  
o
o
o
o
Operating Junction Temperature Range . . . . . . . . . .0 C to +110 C  
o
o
Storage Temperature Range . . . . . . . . . . . . . . . . . -55 C to +150 C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
o
o
Electrical Specifications V+ = 36V, T = 0 C to +110 C; Unless Otherwise Specified  
J
SYMBOL  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
DEVICE PARAMETERS  
I+  
Supply Current  
PSEN = 12V  
-
19.5  
-
32  
mA  
V
V
Internal Regulator Output  
Voltage  
V+ = 15V to 45V, I  
OUT  
= 10mA  
11.0  
13.2  
DDA  
VINP  
Reference Voltage  
VINP Resistance  
I
= 0mA  
5.01  
-
5.1  
5.19  
-
V
VINP  
R
VINP = 0  
900  
VINP  
ERROR AMPLIFIERS  
|V  
IO  
|
Input Offset Voltage  
(VREG - VINP)  
I
= 0mA  
-
-
10  
mV  
VCMP  
R
VREG  
Input Resistance to GND  
VREG Transconductance  
VREG = 5.1V  
VCMP = 1V to 8V, SFST = 11V  
-
56  
30  
-
kΩ  
IN  
g
(VREG)  
15  
50  
mS  
m
I
/(VREG - VINP)  
VCMP  
g
(SFST)  
SFST Transconductance  
V
< 4.9V  
0.8  
-
6
mS  
m
SFST  
I
/(VREG - SFST)  
VCMP  
I
I
Maximum Source Current  
Maximum Sink Current  
Over-Voltage Threshold  
VREG = 4.95V, VCMP = 8V  
VREG = 5.25V, VCMP = 0.4V  
-2.5  
0.75  
6.2  
-
-
-
-0.75  
2.5  
mA  
mA  
V
VCMP  
VCMP  
OVTH  
Voltage at VREG for FLTN to be  
latched  
6.7  
CLOCK  
fq  
Internal Clock Frequency  
SLCT = 0V, V  
SLCT = 12V  
= 12V  
0.9  
33  
1.0  
-
1.1  
66  
MHz  
DDD  
V
CKIN  
External Clock Input Threshold  
Voltages  
%V  
DDD  
TH  
DMOS TRANSISTORS  
o
r
Drain-Source On-State  
Resistance  
I Drain = 5A, T = +25 C  
J
-
-
-
0.13  
100  
DS(on)  
I
Drain-Source Leakage Current  
Drain to Source Voltage = 60V  
1
µA  
DSS  
CURRENT CONTROLLED PWM  
|V | VCMP  
IO  
Buffer Offset Voltage (VCMP -  
IRFO = 0mA to -5mA,  
VCMP = 0.2V to 7.6V  
-
-
-
125  
270  
mV  
mV  
V
)
IRFO  
V
IRFO  
Voltage at IRFO that disables  
PWM. This is due to low load  
current  
100  
TH  
3
HIP5060  
o
o
Electrical Specifications V+ = 36V, T = 0 C to +110 C; Unless Otherwise Specified (Continued)  
J
SYMBOL  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
CURRENT CONTROLLED PWM (Continued)  
I
IRFO  
Voltage at IRFO to enable SHRT  
output current. This is due to  
Regulator Over Current Condi-  
tion  
7.4  
-
8.0  
V
TH  
I
SHRT Output Current, During  
Over-Current  
V
= 8.1V  
-37  
4
-
-17  
8
µA  
SHRT  
IRFO  
V
SHRT  
Threshold voltage on SHRT to  
set FLTN latch  
6
V
TH  
I
I
(DMOS  
)/I  
DRAIN IRFI  
I (DMOS  
)/t = 1A/ms  
)/t > 1A/µs  
3.8  
150  
-
-
-
4.9  
360  
-
A/mA  
GAIN  
PEAK  
DRAIN  
DRAIN  
R
IRFI Resistance to GND  
I
= 2mA  
IRFI  
IRFI  
t
(Note 1)  
Current Comparator Response  
Time  
I (DMOS  
30  
ns  
RS  
MCPW (Note  
1)  
Minimum Controllable Pulse  
Width  
25  
50  
100  
800  
ns  
MCPI  
(Note 1)  
Minimum Controllable DMOS  
Peak Current  
200  
400  
mA  
START-UP  
V+  
Rising V+ Power-On Reset  
Voltage  
22  
-
-
27  
-
V
V
V+  
V+  
Falling V+ Power-Off Set  
Voltage  
15  
V+ Power-On Hysteresis  
9
-
-
12  
V
V
V
TH  
PSEN  
Voltage at PSEN to Enable  
Supply  
0.8  
2.0  
r
Internal Pull-Up Resistance, to  
5.1V  
-
20  
-
KΩ  
PSEN  
I
Soft-Start Charging Current  
V
= 0V to 10V  
-1.0  
-1  
-0.7  
-
-0.4  
1
µA  
µA  
SFST  
SFST  
I
PSOK High-State Leakage  
Current  
SFST = 0V, PSOK = 12V  
PSOK  
V
PSOK Low-State Voltage  
SFST = 11V, I  
PSOK  
= 1mA  
-
-
-
0.4  
11  
V
V
PSOK  
V
TH  
SFST  
PSOK Threshold, Rising V  
9.4  
SFST  
THERMAL MONITOR  
o
TEMP  
(Note 1)  
Substrate Temperature for  
Thermal Monitor to Trip  
TMON pin open  
105  
-
135  
C
NOTE:  
1. Determined by design, not a measured parameter.  
4
HIP5060  
Pin Descriptions  
PAD NUMBER  
DESIGNATION  
DESCRIPTION  
1
2
3
AGND  
VINP  
Analog ground.  
Internal 5.1V reference.  
SFST  
Controls the rate of rise of the output voltage. Time is determined by an internal 0.7µA current  
source and an external capacitor.  
4
IRFO  
A resistor placed between this pad and IRFI converts the VCMP signal to a current for the current  
sense comparator. The maximum current is set by the value of the resistor, according to the  
equation: I  
= 32/R. Where R is the value of the external resistor in Kand must be greater  
PEAK  
than 1.5Kbut less than 10K. For example, if the resistor chosen is 1.8K, the peak current will  
be 17.8A. This assumes VCMP is 7.3V. Maximum output current should be kept below 20A.  
5
6
7
8
9
IRFI  
See IRFO  
DGD2  
Ground of the DMOS gate driver. This pad is used for bypassing.  
Voltage input for the chip’s digital circuits. This pad also allows decoupling of this supply.  
This is the analog supply and internal 12V regulator output.  
V
V
DDD  
DDA  
V+  
This is the main supply voltage input pad to the regulator IC. Because of the high peak currents  
this pad must be well bypassed with at least a 0.7µF capacitor and may be composed of seven,  
single 0.1µF chip capacitors.  
10  
11  
SLCT  
This pad provides for the option of using either internal 1MHz operation of for an external clock.  
Floating or grounding this pad will place the internal clock at the CKIO pad. Returning this termi-  
nal to V  
or 12V will allow application of an external clock to the IC via the CKIO pad. There  
DDD  
is an internal 50K pull down  
CKIO  
Clock output when SLCT is floated or grounded. External clock input when SLCT is returned to  
12V.  
12  
DGD1  
This pad is the return for the digital supply.  
13 & 14  
V
These pads are used to decouple the high current pulses to the output driver transistors. The  
capacitor should be at least a 0.1µF chip capacitor placed close to this pad and the DMOS  
source pads.  
DDP  
15, 16, 19, 20,  
23, 24, 27, 28  
S
D
Source pads of the DMOS power transistor.  
17, 18, 21, 22,  
25, 26, 29, 30  
Drain pads of the DMOS power transistor.  
31  
TMON  
This is the thermal shut down pad than can be used to disable the thermal shutdown circuit. By  
returning this pad to 12V the function is disabled. Returning this pad to ground will put the IC into  
the thermal shutdown state. Normally, this pad is left floating. Thermal shutdown occurs at a  
o
nominal junction temperature of +125 C.  
32  
PSEN  
This terminal is provided to activate the converter. This terminal may be left open or returned to  
5V for normal operation. When the input is low, the DMOS driver is disabled.  
33  
34  
35  
SHRT  
PSOK  
VCMP  
25µA is internally applied to this node when there is an over-current condition.  
This pad provides a delayed positive indication when the supply is enabled.  
Output of the transconductance amplifier. This node is used for both gain and frequency com-  
pensation of the loop.  
36  
37  
VREG  
FLTN  
Input to the transconductance error amplifier is available on this pad. The other input is internally  
connected to the 5.1V reference, VINP, Pad 2.  
This is an open drain output that remains low when V+ is too low for proper operation. This node  
and PSEN are useful in multiple converter configurations. This pad will be latched low when over-  
temperature, over-voltage or over-current is experienced.  
5
HIP5060  
Functional Block Diagram  
CKIO  
V
SLCT  
V
DDD  
DDA  
12V  
REGULATOR  
BIAS  
CIRCUITS  
V+  
V
DDA  
1MHz  
CLOCK  
BAND GAP  
REFERENCE  
REGULATOR  
VREF =  
5.1V  
12V  
REGULATOR  
50K  
VREF  
V+  
MONITOR  
MULTIPLEXER  
POWER  
SUPPLY  
ENABLE  
V
DDP  
20KΩ  
+
V
PSEN  
V
DDP  
DDP  
-
VREF  
V
DDA  
POWER  
360KΩ  
140KΩ  
PSOK  
SFST  
VINP  
SUPPLY  
OK  
DRAIN  
0.7µA  
S
GATE  
DRIVERS  
FLIP-FLOP  
R
Q
VREF  
900Ω  
FAST RESET  
gm  
AMP  
LOW  
LOAD  
CONTROL  
+
-
+
-
CURRENT  
MONITOR-  
ING AMP  
AND  
BLANKING  
LOGIC  
SOURCE  
VREG  
11.3KΩ  
VREF  
98KΩ  
4KΩ  
FLTN  
OVER  
VOLTAGE  
-
+
45KΩ  
VREF  
THERMAL  
MONITOR  
TMON  
SHRT  
+
-
SHORT  
CIRCUIT  
VREF  
26KΩ  
-
+
13KΩ  
DGD2  
IRFI  
AGND  
IRF0  
VCMP  
DGD1  
6

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