HS-81C55RH [INTERSIL]

Radiation Hardened 256 x 8 CMOS RAM; 抗辐射256 ×8 CMOS RAM
HS-81C55RH
型号: HS-81C55RH
厂家: Intersil    Intersil
描述:

Radiation Hardened 256 x 8 CMOS RAM
抗辐射256 ×8 CMOS RAM

文件: 总14页 (文件大小:88K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HS-81C55RH,  
HS-81C56RH  
Radiation Hardened  
256 x 8 CMOS RAM  
March 1996  
Features  
Description  
• Devices QML Qualified in Accordance with  
MIL-PRF-38535  
The HS-81C55/56RH are radiation hardened RAM and I/O  
chips fabricated using the Intersil radiation hardened Self-  
Aligned Junction Isolated (SAJI) silicon gate technology.  
Latch-up free operation is achieved by the use of epitaxial  
starting material to eliminate the parasitic SCR effect seen in  
conventional bulk CMOS devices.  
• Detailed Electrical and Screening Requirements are  
Contained in SMD# 5962-95818 and Intersil’ QM Plan  
• Radiation Hardened EPI-CMOS  
- Parametrics Guaranteed 1 x 105 RAD(Si)  
- Transient Upset > 1 x 108 RAD(Si)/s  
- Latch-Up Free > 1 x 1012 RAD(Si)/s  
The HS-81C55/56RH is intended for use with the  
HS-80C85RH radiation hardened microprocessor system. The  
RAM portion is designed as 2048 static cells organized as 256  
x 8. A maximum post irradiation access time of 500ns allows  
the HS-81C55/56RH to be used with the HS-80C85RH CPU  
without any wait states. The HS-81C55RH requires an active  
low chip enable while the HS-81C56RH requires an active high  
chip enable. These chips are designed for operation utilizing a  
single 5V power supply.  
• Electrically Equivalent to Sandia SA 3001  
• Pin Compatible with Intel 8155/56  
• Bus Compatible with HS-80C85RH  
• Single 5V Power Supply  
Functional Diagram  
• Low Standby Current 200µA Max  
• Low Operating Current 2mA/MHz  
• Completely Static Design  
PORT A  
IO/M  
256 x 8  
STATIC  
RAM  
8
PA0 - PA7  
PB0 - PB7  
PC0 - PC5  
A
B
C
AD0 - AD7  
CE OR CE  
ALE  
• Internal Address Latches  
PORT B  
8
• Two Programmable 8-Bit I/O Ports  
• One Programmable 6-Bit I/O Port  
• Programmable 14-Bit Binary Counter/Timer  
• Multiplexed Address and Data Bus  
• Self Aligned Junction Isolated (SAJI) Process  
• Military Temperature Range -55oC to +125oC  
RD  
PORT C  
8
WR  
RESET  
TIMER  
VDD (10V)  
GND  
TIMER CLK  
TIMER OUT  
81C55RH = CE  
81C56RH = CE  
Ordering Information  
PART NUMBER  
5962R9XXXX01QRC  
5962R9XXXX01VRC  
5962R9XXXX01QXC  
5962R9XXXX01VXC  
5962R9XXXX02QRC  
5962R9XXXX02VRC  
5962R9XXXX02QXC  
5962R9XXXX02VXC  
HS1-81C55RH/Sample  
HS9-81C55RH/Sample  
HS1-81C56RH/Sample  
HS9-81C56RH/Sample  
TEMPERATURE RANGE  
SCREENING LEVEL  
PACKAGE  
o
o
-55 C to +125 C  
MIL-PRF-38535 Level Q  
MIL-PRF-38535 Level V  
MIL-PRF-38535 Level Q  
MIL-PRF-38535 Level V  
MIL-PRF-38535 Level Q  
MIL-PRF-38535 Level V  
MIL-PRF-38535 Level Q  
MIL-PRF-38535 Level V  
Sample  
40 Lead SBDIP  
40 Lead SBDIP  
o
o
-55 C to +125 C  
o
o
-55 C to +125 C  
42 Lead Ceramic Flatpack  
42 Lead Ceramic Flatpack  
40 Lead SBDIP  
o
o
-55 C to +125 C  
o
o
-55 C to +125 C  
o
o
-55 C to +125 C  
40 Lead SBDIP  
o
o
-55 C to +125 C  
42 Lead Ceramic Flatpack  
42 Lead Ceramic Flatpack  
40 Lead SBDIP  
o
o
-55 C to +125 C  
o
+25 C  
o
+25 C  
Sample  
42 Lead Ceramic Flatpack  
40 Lead SBDIP  
o
+25 C  
Sample  
o
+25 C  
Sample  
42 Lead Ceramic Flatpack  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
Spec Number 518056  
File Number 3039.1  
1
HS-81C55RH, HS-81C56RH  
Pinouts  
40 LEAD DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP)  
MIL-STD-1835 CDIP2-T40  
TOP VIEW  
1
2
3
4
40  
39  
38  
37  
36  
35  
PC3  
PC4  
VDD  
PC2  
PC1  
PC0  
PB7  
PB6  
TIMER IN  
RESET  
PC5  
TIMER OUT  
IO / M  
5
6
7
8
9
34 PB5  
CE or CE*  
RD  
33  
32  
PB4  
PB3  
WR 10  
ALE  
31  
30  
29  
28  
27  
26  
25  
24  
PB2  
PB1  
*81C55RH = CE  
81C56RH = CE  
11  
AD0 12  
PB0  
PA7  
PA6  
PA5  
PA4  
PA3  
13  
14  
15  
16  
17  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6 18  
AD7 19  
GND 20  
23 PA2  
22 PA1  
21 PA0  
42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
INTERSIL OUTLINE K42.A  
TOP VIEW  
PC3  
PC4  
1
2
3
4
42  
41  
40  
39  
VDD  
PC2  
PC1  
PC0  
PB7  
TIMER IN  
RESET  
PC5  
5
6
38  
37  
TIMER OUT  
PB6  
PB5  
PB4  
PB3  
PB2  
PB1  
IO/M  
7
8
36  
35  
CE OR CE  
RD  
WR  
9
34  
33  
32  
31  
30  
29  
28  
27  
10  
11  
12  
13  
14  
15  
16  
ALE  
AD0  
AD1  
AD2  
AD3  
NC  
PB0  
PA7  
PA6  
PA5  
NC  
PA4  
AD4  
AD5  
AD6  
17  
18  
19  
26  
25  
24  
PA3  
PA2  
PA1  
PA0  
AD7  
20  
21  
23  
22  
GND  
Spec Number 518056  
2
HS-81C55RH, HS-81C56RH  
Pin Description  
SYMBOL  
RESET  
TYPE  
NAME AND FUNCTION  
I
Reset: Pulse provided by the HS-80C85RH to initialize the system (connect to HS-80C85RH RESET  
OUT). Input high on this line resets the chip and initializes the three I/O ports to input mode. The width  
of RESET pulse should typically be two HS-80C85RH clock cycle times.  
AD0 - AD7  
I/O  
Address/Data: Tri-state Address/Data lines that interface with the CPU lower 8-bit Address/Data Bus.  
The 8-bit address is latched into the address latch inside the HS-81C55 and HS-81C56RH on the falling  
edge of ALE. The address can be either for the memory section or the I/O section depending on the IO/  
M input. The 8-bit data is either written into the chip or read from the chip, depending on the WR or RD  
input signal.  
CE or CE  
RD  
I
I
Chip Enable: On the HS-81C55RH, this pin is CE and is ACTIVE LOW. On the HS-81C56RH, this pin  
is CE and is ACTIVE HIGH.  
Read Control: Input low on this line with the Chip Enable active enables and AD0 - AD7 buffers. If IO/  
M pin is low, the RAM content will be read out to the AD bus. Otherwise the content of the selected I/O  
port or command/status registers will be read to the AD bus.  
WR  
I
I
Write Control: Input low on this line with the Chip Enable active causes the data on the Address/Data  
bus to be written to the RAM or I/O ports and command/status register, depending on IO/M.  
ALE  
Address Latch Enable: This control signal latches both the address on the AD0 - AD7 lines and the  
state of the Chip Enable and IO/M into the chip at the falling edge of ALE.  
IO/M  
I
I/O Memory: Selects memory if low and I/O and command/status registers if high.  
PA0 - PA7 (8)  
I/O  
Port A: These 8 pins are general purpose I/O pins. The in/out direction is selected by programming the  
command register.  
PB0 - PB7 (8)  
PC0 - PC7 (8)  
I/O  
I/O  
Port B: These 8 pins are general purpose I/O pins. The in/out direction is selected by programming the  
command register.  
Port C: These 6 pins can function as either input port, output port, or as control signals for PA and PB.  
Programming is done through the command register. When PC0 - PC5 are used as control signals, they  
will provide the following:  
PC0 - A INTR (Port A Interrupt)  
PC1 - ABF (Port A Buffer Full)  
PC2 - A STB (Port A Strobe)  
PC3 - B INTR (Port B Interrupt)  
PC4 - B BF (Port B Buffer Full)  
PC5 - B STB (Port B Strobe)  
TIMER IN  
TIMER OUT  
VDD  
I
O
I
Timer Input: Input to the counter-timer.  
Timer Output: This output can be either a square wave or a pulse, depending on the timer mode.  
Voltage: +5V.  
GND  
I
Ground: Ground reference.  
Spec Number 518056  
3
Specifications HS-81C55RH, HS-81C56RH  
Absolute Maximum Ratings  
Reliability Information  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7.0V Thermal Resistance  
θ
θ
JC  
JA  
o
o
Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.3V to VDD+0.3V SBDIP Package. . . . . . . . . . . . . . . . . . . . 40.0 C/W 5.0 C/W  
o
o
o
o
Storage Temperature Range . . . . . . . . . . . . . . . . . -65 C to +150 C  
Ceramic Flatpack Package . . . . . . . . . . . 45.0 C/W 5.0 C/W  
Maximum Package Power Dissipation at +125 C  
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.25W  
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 1.11W  
o
o
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175 C  
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300 C  
Typical Derating Factor. . . . . . . . . . . . 2mA/MHz Increase in IDDOP  
o
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 If device power exceeds package dissipation capability, provide heat  
sinking or derate linearly at the following rate:  
o
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25.0mW/ C  
o
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . 22.2mW/ C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Operating Conditions  
Operating Voltage Range . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +0.8V  
o
o
Operating Temperature Range. . . . . . . . . . . . . . . . -55 C to +125 C  
Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . VDD -0.5V to VDD  
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS  
LIMITS  
GROUP A  
PARAMETERS  
SYMBOL  
CONDITIONS  
SUBGROUPS TEMPERATURE  
MIN  
MAX  
UNITS  
o
o
High Input Leakage  
Current  
IIH  
VDD = 5.25V, VIN = 0V,  
Pin under test = VDD  
1, 2, 3  
-55 C, +25 C,  
-
1
µA  
o
+125 C  
o
o
Low Input Leakage  
Current  
IIL  
VOL  
VDD = 5.25V, VIN = 5.25V,  
Pin under test = 0V  
1, 2, 3  
-55 C, +25 C,  
-1  
-
0.5  
-
µA  
V
o
+125 C  
o
o
Low Output Voltage  
High Output Voltage  
Static Current  
VDD = 5.25V, IOL = 2mA  
VDD = 4.75V, IOH = 2mA  
VDD = 5.25V  
1, 2, 3  
-55 C, +25 C,  
-
o
+125 C  
o
o
VOH  
IDDSB  
IDDOP  
FT  
1, 2, 3  
-55 C, +25 C,  
4.25  
V
o
+125 C  
o
o
1, 2, 3  
-55 C, +25 C,  
-
-
-
200  
2
µA  
mA  
-
o
+125 C  
o
o
Dynamic Current  
Functional Tests  
VDD = 5.25V, f = 1MHz  
1, 2, 3  
-55 C, +25 C,  
o
+125 C  
o
o
VDD = 4.75V and 5.25V,  
VIH = VDD-0.5V, VIL = 0.8V  
7, 8A, 8B  
-55 C, +25 C,  
-
o
+125 C  
NOTE: All devices are guaranteed at worst case limits and over radiation. Dynamic current is proportional to operating frequency (2mA/MHz).  
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS  
LIMITS  
GROUP A  
PARAMETERS  
Address Latch Setup Time  
Address Hold Time After Latch  
Latch to READ/WRITE Control  
Valid Data Out From Read Control  
Address Stable to Data Out Valid  
Latch Enable Width  
SYMBOL  
TAL  
CONDITIONS  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4,7  
SUBGROUPS  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
TEMPERATURE  
MIN  
60  
60  
200  
-
MAX  
UNITS  
ns  
o
o
-55 C T +125 C  
-
A
o
o
TLA  
-55 C T +125 C  
-
ns  
A
o
o
TLC  
-55 C T +125 C  
-
250  
500  
-
ns  
A
o
o
TRD  
TAD  
TLL  
-55 C T +125 C  
ns  
A
o
o
-55 C T +125 C  
-
ns  
A
o
o
-55 C T +125 C  
200  
20  
ns  
A
o
o
READ/WRITE Control to Latch  
Enable  
TCL  
-55 C T +125 C  
-
ns  
A
o
o
READ/WRITE Control Width  
Data In to WRITE Setup Time  
Data In Hold Time After WRITE  
TCC  
TDW  
TWD  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
9, 10, 11  
9, 10, 11  
9, 10, 11  
-55 C T +125 C  
250  
200  
25  
-
-
-
ns  
ns  
ns  
A
o
o
-55 C T +125 C  
A
o
o
-55 C T +125 C  
A
Spec Number 518056  
4
Specifications HS-81C55RH, HS-81C56RH  
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)  
LIMITS  
GROUP A  
PARAMETERS  
WRITE to Port Output  
SYMBOL  
TWP  
TPR  
CONDITIONS  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4, 5  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4  
Notes 1, 4, 6  
Notes 1, 4  
SUBGROUPS  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
TEMPERATURE  
MIN  
MAX  
300  
-
UNITS  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
o
o
-55 C T +125 C  
-
50  
15  
-
A
o
o
Port Input Setup Time  
Port Input Hold Time  
Strobe to Buffer Full  
-55 C T +125 C  
A
o
o
TRP  
-55 C T +125 C  
-
A
o
o
TSBF  
TSS  
-55 C T +125 C  
300  
-
A
o
o
Strobe Width  
-55 C T +125 C  
150  
-
A
o
o
READ to Buffer Empty  
Strobe to INTR Off  
TRBE  
TSI  
-55 C T +125 C  
300  
300  
360  
-
A
o
o
-55 C T +125 C  
-
A
o
o
READ to INTR Off  
TRDI  
TPSS  
TPHS  
TSBE  
TWBF  
TWI  
-55 C T +125 C  
A
o
o
Port Setup Time to Strobe  
Post Hold Time After Strobe  
Strobe to Buffer Empty  
WRITE to Buffer full  
-55 C T +125 C  
100  
A
o
o
-55 C T +125 C  
100  
-
A
o
o
-55 C T +125 C  
-
300  
300  
340  
300  
300  
-
A
o
o
-55 C T +125 C  
-
-
A
o
o
WRITE to INTR Off  
-55 C T +125 C  
A
o
o
TIMER-IN to TIMER OUT Low  
TIMER-IN to TIMER-OUT High  
Data Bus Enable from READ Control  
TIMER-IN Low Time  
TIMER-IN High Time  
NOTES:  
TTL  
-55 C T +125 C  
-
A
o
o
TTH  
-55 C T +125 C  
-
A
o
o
TRDE  
T1  
-55 C T +125 C  
120  
40  
115  
A
o
o
-55 C T +125 C  
-
A
o
o
T2  
-55 C T +125 C  
-
A
1. All devices guaranteed at worst case limits and over radiation.  
2. Operating supply current (IDDOP) is proportional to operating frequency.  
3. Output timings are measured with purely capacitive load.  
4. For design purposes the limits are given as shown. For compatibility with the 80C85RH microprocessor, the AC parameters are tested  
as maximums.  
5. Parameter tested as part of the functional test. No read and record data available.  
6. At low temperature, T1 is measured down to 10ns. If the reading is less than 10ns, the parameter will read 10ns.  
7. Read and Record data available on failing data only.  
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS  
LIMITS  
PARAMETERS  
SYMBOL  
CONDITIONS  
TEMPERATURE  
MIN  
MAX  
UNITS  
o
Input Capacitance  
CIN  
VDD = Open, f = 1MHz, All measurements  
referenced to device ground  
T = +25 C  
-
10  
pF  
A
o
I/O Capacitance  
CI/O  
COUT  
TRDF  
TRV  
VDD = Open, f = 1MHz, All measurements  
referenced to device ground  
T = +25 C  
-
-
12  
10  
pF  
pF  
ns  
ns  
A
o
Output Capacitance  
VDD = Open, f = 1MHz, All measurements  
referenced to device ground  
T = +25 C  
A
o
o
Data Bus Float After  
READ  
VDD = 4.75V  
-55 C, +25 C,  
10  
-
100  
220  
o
+125 C  
o
o
Recovery Time Between  
Controls  
VDD = 4.75V  
-55 C, +25 C,  
o
+125 C  
NOTE: The parameters listed in Table 3 are controlled via design or process parameters and are not directly tested. These parameters are  
characterized upon initial design release and upon design changes which would affect these characteristics.  
Spec Number 518056  
5
Specifications HS-81C55RH, HS-81C56RH  
Waveforms  
READ  
CE (81C55RH)  
OR  
CE (81C56RH)  
IO/M  
AD0-7  
ALE  
tAD  
ADDRESS  
DATA VALID  
tAL  
tLA  
tLL  
tRIDE  
tRDF  
tRD  
RD  
tCL  
tRV  
tLC  
tCC  
WRITE  
CE (81C55RH)  
OR  
CE (81C56RH)  
IO/M  
AD0-7  
ALE  
ADDRESS  
DATA VALID  
tAL  
tLA  
tDW  
tCL  
tLL  
tLC  
tWD  
WR  
tCL  
tCC  
tRV  
Spec Number 518056  
6
HS-81C55RH, HS-81C56RH  
Waveforms (Continued)  
STROBED INPUT  
BF  
tSBF  
STROBED  
INTR  
tRBE  
tSS  
tSI  
tRDI  
RD  
tPSS  
tPHS  
INPUT DATA  
FROM PORT  
STROBED OUTPUT  
BF  
tSBE  
STROBE  
INTR  
tSI  
tWBF  
tWI  
WR  
tWP  
OUTPUT DATA  
TO PORT  
Spec Number 518056  
7
HS-81C55RH, HS-81C56RH  
Waveforms (Continued)  
BASIC INPUT  
RD  
BASIC INPUT  
RD  
tRP  
tWP  
tPR  
INPUT  
INPUT  
DATA BUS  
DATA BUS  
TIMER OUTPUT COUNTDOWN FROM 5 TO 1  
LOAD COUNTER CLR  
RELOAD COUNTER CLR  
2
1
5
4
3
2
1
5
tF  
t2  
TIMER IN  
t1  
tR  
tCYC  
TIMER OUT  
(PULSE)  
(NOTE 1)  
tTL  
tTH  
tTH  
TIMER OUT  
(SQUARE WAVE)  
(NOTE 1)  
tTL  
NOTE: THE TIMER OUTPUT IS PERIODIC IF IN AN AUTOMATIC  
RELOAD MODE (M, MODE BIT = 1)  
Spec Number 518056  
8
HS-81C55RH, HS-81C56RH  
Metallization Topology  
DIE DIMENSIONS:  
222 x 202 x 14 ± 1mil (Die Thickness)  
METALLIZATION:  
Type: AlSi  
Thickness: 11kÅ ± 2kÅ  
GLASSIVATION:  
Type: SiO2  
Thickness: 8kÅ ± 1kÅ  
Metallization Mask Layout  
HS-81C55RH, HS-81C56RH  
TIMER OUT (6)  
IO/M (7)  
(34) PB5  
CE OR CE (8)  
RD (9)  
(33) PB4  
(32) PB3  
WR (10)  
ALE (11)  
(31) PB2  
(30) PB1  
AD0 (12)  
(29) PB0  
(28) PA7  
AD1 (13)  
AD2 (14)  
(27) PA6  
Spec Number 518056  
9
HS-81C55RH, HS-81C56RH  
Functional Description  
7
6
5
4
3
2
1
0
TM2 TM1 IEB IEA PC2 PC1 PB PA  
The HS-81C55RH and 81C56RH contains the following:  
2K Bit Static RAM Organized as 256 x 8  
DEFINES  
PA0 - PA7  
0 = INPUT  
Two 8-Bit I/O Ports (PA and PB) and One 6-Bit I/O Port  
(PC)  
1 = OUTPUT  
DEFINES  
PB0 - PB7  
14-Bit Timer-Counter  
00 = ALT1  
11 = ALT2  
01 = ALT3  
10 = ALT4  
DEFINES  
PC0 - PC5  
The IO/M (IO/Memory Select) pin selects either the five reg-  
ister (Command, Status, PA0 - PA7, PB0 - PB7, PC0 - PC5)  
or the memory (RAM) portion.  
ENABLE PORT  
A INTERRUPT  
0 = INPUT  
1 = OUTPUT  
The 8-bit address on the Address/Data lines, Chip Enable  
input CE or CE and IO/M are all latched on-chip at the falling  
edge of ALE.  
ENABLE PORT  
B INTERRUPT  
00 = NOP - DO NOT AFFECT COUNTER  
OPERATION  
01 = STOP - NOP IF TIMER HAS NOT  
STARTED; STOP COUNTING IF  
THE TIMER IS RUNNING  
8-BIT INTERNAL DATA BUS  
10 = STOP AFTER TC - STOP IMME-  
DIATELY AFTER PRESENT TC  
IS REACHED (NOP IF TIMER  
HAS NOT STARTED)  
TIMER  
COMMAND  
11 = START - LOAD MODE AND CNT  
LENGTH AND START IMMEDIATE-  
LY AFTER LOADING (IF TIMER IS  
NOT PRESENTLY RUNNING). IF  
TIMER IS RUNNING, START THE  
NEW MODE AND CNT LENGTH  
IMMEDIATELY AFTER PRESENT  
TC IS REACHED.  
PC  
PB  
PA  
COMMAND  
STATUS  
TIMER  
MSB  
TIMER  
LSB  
6
8
8
TIMER MODE  
FIGURE 3. COMMAND REGISTER BIT ASSIGNMENT  
FIGURE 1. INTERNAL REGISTERS  
Reading the Status Register  
The status register consists of seven latches, one for each  
bit six (0-5) for the status of the ports and one (6) for the  
status of the timer.  
CE (81C55RH)  
OR  
The status of the timer and the I/O section can be polled by  
reading the Status Register (Address XXXXX000). Status  
word format is shown in Figure 4. Note that you may never  
write to the status register since the command register  
shares the same I/O address and the command register is  
selected when a write to that address is issued.  
CE (81C56RH)  
IO/M  
AD0 - AD7  
ALE  
ADDRESS  
DATA  
VALID  
AD7 AD6  
TIMER  
AD5 AD4 AD3 AD2 AD1 AD0  
INTE  
B
B
BF  
INTR INTE  
A
BF  
INTR  
A
B
A
RD OR WR  
FIGURE 2. ON-BOARD MEMORY READ/WRITE CYCLE  
PORT A  
INTERRUPT  
REQUEST  
Programming of the Command Register  
PORT A BUFFER  
FULL/EMPTY  
(INPUT/OUTPUT)  
The command register consists of eight latches. Four bits (0-  
3) define the mode of the ports, two bit (4-5) enable or disable  
the interrupt from port C when it acts as control port, and the  
last two bits (6-7) are for the timer.  
PORT A INTERRUPT ENABLE  
PORT B INTERRUPT REQUEST  
PORT B BUFFER FULL/EMPTY  
(INPUT/OUTPUT)  
The command register contents can be altered at anytime by  
using the I/O address XXXXX000 during a WRITE operation  
with the Chip Enable active and IO/M = 1. The meaning of  
each bit of the command byte is defined in Figure 3. The  
contents of the command register may never be read.  
PORT B INTERRUPT ENABLE  
TIMER INTERRUPT (THIS BIT IS LATCHED HIGH WHEN  
TERMINAL COUNT IS REACHED, AND IS RESET TO LOW  
READING OF THE C/S REGISTER & BY HARDWARE RESET).  
FIGURE 4. STATUS REGISTER BIT ASSIGNMENT  
Spec Number 518056  
10  
HS-81C55RH, HS-81C56RH  
When the ‘C’ port is programmed to either ALT3 or ALT4, the  
control signals for PA and Pb are initialized as follows:  
Input/Output Section  
:
The I/O section of the HS-81C55RH and HS-81C56RH  
consists of five registers: (See Figure 5)  
CONTROL  
BF  
INPUT MODE  
Low  
OUTPUT MODE  
• Command/Status Register (C/S) - Both register are  
assigned the address XXXXX000. The C/S address  
serves the dual prupose.  
Low  
High  
INTR  
Low  
STB  
Input Control  
Input Control  
When the C/S registers are selected during WRITE  
operation, a command is written into the command  
register. The contents of this register are not accessible  
through the pins.  
I/O ADDRESS†  
A7 A6 A5 A4 A3 A2 A1 A0  
SELECTION  
When the C/S (XXXXX000) is selected during a READ  
operation, the status information of the I/O ports and the  
timer becomes available on the AD0 - AD7 lines.  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
Interval Command/  
Status Register  
General Purpose I/O  
Port A  
PA Register - This register can be programmed to be  
either input or output ports depending on the status of the  
contents of the C/S Register. also depending on the  
command, this port can operate in either the basic mode  
or the strobed mode (See timing diagram). the I/O pins  
assigned in relation to this register are PA0 - PA7. The  
address of this register is XXXXX001.  
General Purpose I/O  
Port B  
General Purpose I/O or  
Control Port C  
Low-Order 8 Bits of  
Timer Count  
• PB Register - This register functions the same as PA  
Register. the I/O pins assigned are PB0 - PB7. The  
address of this register is XXXXX010  
High 6 Bits of Timer  
Count and 2 Bits of Timer  
Mode  
• PC Register - This register has the address XXXXX011  
and contains only 6 bits. The 6 bits can be programmed to  
be either input ports, output ports or as control signals for  
PA and PB by properly programming the AD2 and AD3  
bits of the C/S register.  
† I/O Address must be qualified by CE = 1(81C56RH) or CE =  
0(81C55RH) and IO/M = 1 in order to select the appropriate register.  
X = Don’t Care  
FIGURE 5. I/O PORT AND TIMER ADDRESSING SCHEME  
Figure 6 shows how I/O Ports A and B are structured within  
the HS-81C55RH and HS-81C56RH.  
When PC0 - PC5 is used as a control port, 3 bits are  
assigned for Port A and 3 for Port B. The first bit is an  
Interrupt that the HS-81C55RH and HS-81C56RH sends  
out. The second is an output signal indicating whether the  
buffer is full or empty, and the third is an input pin to  
accept a strobe for the strobed input mode. (See Table 1).  
Note in the diagram that when the I/O ports are programmed  
to be output ports, the contents of the output ports can still  
be read by  
addressed.  
a
READ operation when appropriately  
HS-81C55RH AND HS-81C56RH  
ONE BIT OF PORT A OR PORT B  
(1) OUTPUT MODE  
MULTIPLEXER  
(2) SIMPLE INPUT  
CONTROL  
OUTPUT  
LATCH  
D
Q
(3) STROBED INPUT  
(4) = 1 FOR OUTPUT MODE  
= 0 FOR INPUT MODE  
CLK  
CLR  
PA/PB  
PIN  
WRITE  
PORT  
(1)  
(2)  
(3)  
MUX  
MODE (4)  
NOTES:  
LATCH  
1. READ Port = (IO/M = 1)(RD = 0)(CE Active)  
Q
D
READ  
PORT  
(Port Address Selected)  
CLK  
2. WRITE Port = (IO/M = 1)(wr = 0)(CE Active)  
(Port Address Selected)  
STB  
FIGURE 6. HS-81C55RH AND HS-81C56RH PORT FUNCTION  
Spec Number 518056  
11  
HS-81C55RH, HS-81C56RH  
The outputs of the HS-81C55/56RH are “glitch-free”  
meaning that you can write a “1” to a bit position that was  
previously “1” and the level at the output pin will not change.  
TO HS-80C85RH  
RST INPUT  
PORT A OUTPUT  
PORT A  
Note also that the output latch is cleared when the port  
enters the input mode. the output latch cannot be loaded by  
writing to the port if the port is in theinput mode. The result is  
that each time a port mode is changed from input to output,  
the output pins will go low. When the HS-81C55/56RH is  
RESET, the output latches are all cleared and all 3 ports  
enter the input mode.  
A INTR (SIGNAL DATA RECEIVED)  
A BF (SIGNALS DATA READY)  
A STB (ACKNOWL. DATA RCV’D)  
B STB (LOAD PORT B LATCH)  
B BF (SIGNALS BUFFER IS FULL)  
TO/FROM  
PERIPHERAL  
INTERFACE  
PORT C  
When in the ALT1 or ALT2 modes, the bits of Port C are  
structured like the diagram above in the simple input or  
output mode, respectively.  
B INTR (SIGNALS BUFFER  
READY FOR READING)  
TO INPUT PORT  
(OPTIONAL)  
PORT B  
INPUT  
Reading from an input port with nothing connected to the  
pins will provide unpredictable results.  
TO HS-80C85RH  
RST INPUT  
Figure 7 shows how the HS-81C55/56RH I/O ports might be  
configured in a typical system.  
FIGURE 7. EXAMPLE: COMMAND REGISTER = 00111001  
Timer Section  
The timer is a 14 bit down counter that counts the TIMER IN  
pulses and provides either a square wave or pulse when  
terminal count (TC) is reached.  
7
6
5
4
3
2
1
0
M2 M1 T13 T12 T11 T10 T9 T8  
The timer has the I/O address XXXXX100 for the low order  
byte of the register and the I/O address XXXXX101 for the  
high order byte of the register. (See Figure 5).  
TIMER  
MODE  
MSB OF  
CNT LENGTH  
7
6
5
4
3
2
1
0
To program the timer, the COUNT LENGTH REG is loaded  
first, one byte at a time, by selecting the timer addresses.  
Bits 0-13 of the high order count register will specify the  
length of the next count and bits 14-15 of the high order  
register will specify the timer output mode (see Figure 8).  
The value loaded into the count length register can have any  
value from 2H through 3FFH in Bits 0-13.  
T7  
T6  
T5  
T4  
T3  
T2  
T1  
T0  
LSB OF  
CNT LENGTH  
FIGURE 8. TIMER FORMAT  
TABLE 1. PORT CONTROL ASSIGNMENT  
PIN  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
ALT1  
Input Port  
Input Port  
Input Port  
Input Port  
Input Port  
Input Port  
ALT2  
ALT3  
A INTR (Port A Interrupt)  
A BF (Port A Buffer Full)  
A STB (Port A Strobe)  
Output Port  
ALT4  
Output Port  
Output Port  
Output Port  
Output Port  
Output Port  
Output Port  
A INTR (Port A Interrupt)  
A BF (Port A Buffer Full)  
A STB (Port A Strobe)  
B INTR (Port B Interrupt)  
B BF (Port B Buffer Full)  
B STB (Port B Strobe)  
Output Port  
Output Port  
Spec Number 518056  
12  
HS-81C55RH, HS-81C56RH  
There are four modes to choose from: M2 and M1 define the  
timer mode, as shown in Figure 9.  
TIMER OUT WAVEFORMS:  
4
START TERMINAL (TERMINAL  
COUNT COUNT COUNT)  
MODE BITS  
M2 M1  
5
FIGURE 10. ASYMMETRICAL SQUARE-WAVE OUTPUT RE-  
SULTING FROM COUNT OF 9  
0
0
1. SINGLE SQ.  
WAVE  
The counter in the HS-81C55/56RH is not initialized to any  
particular mode or count when hardware RESET occurs, but  
RESET does stop the counting. Therefore, counting cannot  
begin following RESET until a START command is issued  
via the C/S register.  
2. CONTINUOUS  
SQ. WAVE  
0
1
1
0
3. SINGLE PULSE  
ON TERM. COUNT  
1
1
4. CONTINUOUS  
PULSES  
Please note that the timer circuit on the HS-81C55/56RH  
chip is designed to be a square-wave timer, not an event  
counter. To achieve this, it counts down by twos twice in  
completing one cycle. Thus, its registers do not contain  
values directly representing the number of TIMER IN pulses  
received. You cannot load an initial value of 1 into the count  
register and cause the timer to operate, as its terminal count  
value is 10 (binary) or 2 (decimal). (For the detection of  
single pulses, it is suggested that one of the hardware inter-  
rupt pins on the HS-80C85RH be used.) After the timer has  
started counting down, the values residing in the count  
registers can be used to calculate the actual number of  
TIMER IN pulses required to complete the timer cycle if  
desired. To obtain the remaining count, perform the following  
operations in order:  
FIGURE 9. TIMER MODES  
Bits 6-7 (TM2 and TM1) of command register contents are  
used to start and stop the counter. there are four commands  
to choose from:  
TM2  
TM1  
0
0
0
1
NOP - Do not affect counter operation  
STOP-NOP - If timer has not started; stop  
counting if the timer is running  
1
1
0
1
STOP AFTER TC - Stop immediately after  
present TC is reached (NOP if timer has  
not started)  
1. Stop the count  
START - Load mode and CNT length and  
start immediately after loading (if timer is  
not presently running). If timer is running,  
start the new mode and CNT length imme-  
diately after present TC is reached.  
2. Read in the 16 bit value from the count length registers  
3. Reset the upper two mode bits  
4. Reset the carry and rotate right one position all 16 bits  
through carry  
5. If carry is set, add 1/2 of the full original count (1/2 full  
count - 1 if full count is odd).  
Note that while the counter is counting, you may load a new  
count and mode into the count length registers. Before the  
new count and mode will be used by the counter, you must  
issue a START command to the counter. This applies even  
thought you may only want to change the count and use the  
previous mode.  
NOTE: If you started with an odd count and you read the  
count length register before the third count pulse occurs, you  
will not be able to discern whether one or two counts has  
occurred. Regardless of this, the HS-81C55/56RH always  
counts out the right number of pulses in generating the  
TIMER OUT waveforms.  
In case of an odd-numbered count, the first half-cycle of the  
squarewave output, which is high, is one count longer than  
the second (low) half-cycle, as shown in Figure 10.  
Spec Number 518056  
13  
HS-81C55RH, HS-81C56RH  
Ceramic Metal Seal Flatpack Packages (Flatpack)  
K42.A TOP BRAZED  
42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
E
N
1
INCHES  
MIN  
MILLIMETERS  
A
A
e
SYMBOL  
MAX  
0.100  
0.025  
0.023  
0.013  
0.010  
MIN  
-
MAX  
2.54  
0.64  
0.58  
0.33  
0.25  
NOTES  
D
A
b
-
-
-
-
-
-
0.017  
0.017  
0.007  
0.  
0.43  
0.43  
0.18  
0.18  
b
b1  
c
E1  
S1  
C
L
c1  
A
Q
007  
E2  
D
E
1.045  
0.630  
-
1.075  
0.650  
0.680  
0.550  
26.54  
16.00  
-
27.31  
16.51  
17.27  
13.97  
3
-
c1  
LEAD FINISH  
E1  
E2  
e
3
-
0.530  
13.46  
BASE  
METAL  
(c)  
0.050 BSC  
1.27 BSC  
11  
-
k
-
-
-
8.13  
1.14  
0.00  
-
-
8.89  
1.65  
-
b1  
M
L
0.320  
0.045  
0.000  
-
0.350  
0.065  
-
-
M
(b)  
Q
S1  
M
N
8
6
-
SECTION A-A  
NOTES:  
0.0015  
0.04  
1. Index area: A notch or a pin one identification mark shall be locat-  
ed adjacent to pin one and shall be located within the shaded  
area shown. The manufacturer’s identification shall not be used  
as a pin one identification mark. Alternately, a tab (dimension k)  
may be used to identify pin one.  
42  
42  
-
Rev. 0 6/17/94  
7. Forbottom-brazedleadpackages,noorganicorpolymericmaterials  
shall be molded to the bottom of the package to cover the leads.  
2. If a pin one identification mark is used in addition to a tab, the lim-  
its of dimension k do not apply.  
8. Dimension Q shall be measured at the point of exit (beyond the  
meniscus) of the lead from the body. Dimension Q minimum  
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-  
der dip lead finish is applied.  
3. This dimension allows for off-center lid, meniscus, and glass  
overrun.  
4. Dimensions b1 and c1 apply to lead base metal only. Dimension  
M applies to lead plating and finish thickness. The maximum lim-  
its of lead dimensions b and c or M shall be measured at the cen-  
troid of the finished lead surfaces, when solder dip or tin plate  
lead finish is applied.  
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
10. Controlling dimension: INCH.  
11. The basic lead spacing is 0.050 inch (1.27mm) between center  
lines. Each lead centerline shall be located within ±0.005 inch  
(0.13mm) of its exact longitudinal position relative to lead 1 and  
the highest numbered (N) lead.  
5. N is the maximum number of terminal positions.  
6. Measure dimension S1 at all four corners.  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
Intersil (Taiwan) Ltd.  
Taiwan Limited  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (407) 724-7000  
FAX: (407) 724-7240  
Spec Number 518056  
14  

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