ICL3207ECBZ [INTERSIL]

+/- 15kV ESD Protected, +3V to +5.5V, Low Power, 250kbps, RS-232 Transmitters/Receivers; +/- 15kV ESD保护， + 3V至+ 5.5V ，低功耗， 250kbps的， RS - 232发射器/接收器


型号：	ICL3207ECBZ
厂家：	Intersil
描述：	+/- 15kV ESD Protected, +3V to +5.5V, Low Power, 250kbps, RS-232 Transmitters/Receivers +/- 15kV ESD保护， + 3V至+ 5.5V ，低功耗， 250kbps的， RS - 232发射器/接收器
文件：	总12页 (文件大小：319K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ICL3207E, ICL3217E

Data Sheet

J une 2004

FN4914.5

+/- 15kV ESD Protected, +3V to +5.5V, Low

Power, 250kbps , RS-232

Trans mitters /Receivers

Features

• Pb-Free Available as an Option (see Ordering Info)

• ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000)

The Intersil ICL32X7E devices are 3V to 5.5V powered

RS-232 transmitters (five)/receivers (three) which meet

ElA/TIA-232 and V.28/V.24 specifications, even at

• 5V Lower Power Replacement for MAX207E, HIN207E,

HIN237E

• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V

• Latch-Up Free

= 3.0V. Additionally, they provide ±15kV ESD

protection (IEC61000-4-2 Air Gap) and ±15kV Human Body

Model protection on transmitter outputs and receiver inputs

(RS-232 pins). Targeted applications are ISDN Terminal

Adaptors, PDAs, Palmtops, peripherals, and notebook and

laptop computers where the low operational, and even lower

standby, power consumption is critical. The ICL3217E’s

efficient on-chip charge pumps, coupled with an automatic

powerdown function, reduces the standby supply current to

a 1µA trickle. Small footprint packaging, and the use of

small, low value capacitors ensure board space savings as

well. Data rates greater than 250kbps are guaranteed at

worst case load conditions. This family is fully compatible

with 3.3V-only systems, mixed 3.3V and 5V systems, and

5V-only systems, and is a lower power, pin-for-pin

• On-Chip Voltage Converters Require Only Four External

0.1µF Capacitors

• RS-232 Compatible with V

= 2.7V

= 1µA, ICL3217E Only)

• Automatic Powerdown (I

• Receiver Hysteresis For Improved Noise Immunity

• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps

• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs

• Wide Power Supply Range . . . . . . . Single +3V to +5.5V

Applications

• Battery Powered, Hand-Held, and Portable Equipment

• Laptop Computers, Notebooks, Palmtops

• Modems, Printers and other Peripherals

• ISDN Terminal Adaptors and Set Top Boxes

• Related Literature

replacement for ‘207E and ‘237E type devices.

The ICL3217E features an automatic powerdown function

which powers down the on-chip power-supply and driver

circuits. This occurs when an attached peripheral device is

shut off or the RS-232 cable is removed, conserving system

power automatically, without changes to the hardware or

operating system. The ICL3217E powers up again when a

valid RS-232 voltage is applied to any receiver input.

- Technical Brief TB363, Guidelines for Handling and

Processing Moisture Sensitive Surface Mount

Devices (SMDs)

Pinout

ICL3207E, ICL3217E (SOIC, SSOP)

TOP VIEW

Table 1 summarizes the features of the devices represented

by this data sheet, while application Note AN9863

summarizes the features of each device comprising the

ICL32XXE 3V family.

OUT

V-

GND

OUT

C1+

V+

C2-

C1-

C2+

TABLE 1. SUMMARY OF FEATURES

NO. OF MONITOR

RX (R

MANUAL

POWER-

DOWN?

AUTOMATIC

POWERDOWN

FUNCTION?

NO. OF NO. OF

)

DATA RATE

(kbps)

RX ENABLE

OUTB

PART NUMBER

ICL3207E

FUNCTION?

250

ICL3217E

YES

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

ICL3207E, ICL3217E

Pin Des criptions

Ordering Information

TEMP.

PKG.

FUNCTION

(NOTE 1)

PART NO.

RANGE (°C)

PACKAGE

24 Ld SSOP

DWG. #

System power supply input (3.0V to 5.5V).

ICL3207ECA

0 to 70

M24.209

V+ Internally generated positive transmitter supply (+5.5V).

V- Internally generated negative transmitter supply (-5.5V).

GND Ground connection.

ICL3207ECAZ

(See Note 2)

ICL3207ECB

0 to 70

24 Ld SSOP (Pb-Free) M24.209

0 to 70

24 Ld SOIC

M24.3

ICL3207ECBZ

(See Note 2)

ICL3217ECA

24 Ld SOIC (Pb-Free) M24.3

C1+ External capacitor (voltage doubler) is connected to this lead.

C1- External capacitor (voltage doubler) is connected to this lead.

C2+ External capacitor (voltage inverter) is connected to this lead.

C2- External capacitor (voltage inverter) is connected to this lead.

0 to 70

24 Ld SSOP

M24.209

ICL3217ECAZ

(See Note 2)

ICL3217ECB

24 Ld SSOP (Pb-Free) M24.209

0 to 70

24 Ld SOIC

M24.3

TTL/CMOS compatible transmitter inputs.

ICL3217ECBZ

(See Note 2)

24 Ld SOIC (Pb-Free) M24.3

±15kV ESD Protected, RS-232 level (nominally ±5.5V)

OUT

transmitter outputs.

ICL3217EIA

-40 to 85

24 Ld SSOP

M24.209

ICL3217EIAZ

(See Note 2)

ICL3217EIB

24 Ld SSOP (Pb-Free) M24.209

±15kV ESD Protected, RS-232 compatible receiver inputs.

TTL/CMOS level receiver outputs.

OUT

-40 to 85

24 Ld SOIC

M24.3

ICL3217EIBZ

(See Note 2)

24 Ld SOIC (Pb-Free) M24.3

NOTES:

1. Most surface mount devices are available on tape and reel; add

“-T” to suffix.

2. Intersil Pb-free products employ special Pb-free material sets;

molding compounds/die attach materials and 100% matte tin

plate termination finish, which is compatible with both SnPb and

Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or

exceed the Pb-free requirements of IPC/JEDEC J Std-020B.

ICL3207E, ICL3217E

Typical Operating Circuit

ICL32X7E

(OPTIONAL CONNECTION)

†

0.1µF

C1+

^C†

V+

V-

^C†

C1-

C2+

C †

C2-

OUT

RS-232

LEVELS

OUT

TTL/CMOS

LOGIC LEVELS

OUT

5kΩ

RS-232

LEVELS

OUT

5kΩ

GND

† - FOR V

= 3.3V, C - C = 0.1µF or 0.22µF

1 4

FOR V

= 5V, C - C = 0.1µF OR 1µF

1 4

ICL3207E, ICL3217E

Absolute Maximum Ratings

Thermal Information

to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V

Thermal Resistance (Typical, Note 3)

θ_JA(‘/W)

V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V

V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V

Input Voltages

24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C

Maximum Storage Temperature Range . . . . . . . . . .-65°C to 150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C

(Lead Tips Only)

100

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V

Output Voltages

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V

OUT

Operating Conditions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V + 0.3V

OUT

Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous

Temperature Range

ICL32X7ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

ICL32X7EIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C

OUT

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

3. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Electrical Specifications Test Conditions: V = 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.

Typicals are at T = 25°C

TEMP

(°C)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Supply Current, Automatic

Powerdown

All R Open (ICL3217E Only)

1.0

0.3

µA

Supply Current,

All Outputs Unloaded

1.0

Automatic Powerdown Disabled

TRANSMITTER INPUTS AND RECEIVER OUTPUTS

Input Logic Threshold Low

Input Logic Threshold High

Full

2.0

2.4

0.8

= 3.3V

= 5.0V

Input Leakage Current

±0.01

±0.05

±1.0

±10

µA

Output Leakage Current

(ICL3217E Only)

Output Voltage Low

Output Voltage High

= 1.6mA

= -1.0mA

Full

0.4

OUT

-0.6

-0.1

AUTOMATIC POWERDOWN (ICL3217E Only)

Receiver Input Thresholds to

Enable Transmitters

ICL3217E Powers Up (Figure 4)

Full

-2.7

2.7

0.3

Receiver Input Thresholds to

Disable Transmitters

ICL3217E Powers Down (Figure 4)

-0.3

Receiver Threshold to

Transmitters Enabled Delay (t

100

µs

)

Receiver Positive or Negative

Threshold to Transmitters

Disabled Delay

RECEIVER INPUTS

Input Voltage Range

Input Threshold Low

Full

-25

0.6

0.8

= 3.3V

= 5.0V

= 3.3V

= 5.0V

1.2

1.5

1.8

Input Threshold High

2.4

ICL3207E, ICL3217E

Electrical Specifications Test Conditions: V = 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.

Typicals are at T = 25°C (Continued)

TEMP

(°C)

PARAMETER

Input Hysteresis

TEST CONDITIONS

MIN

TYP

0.3

MAX

UNITS

Input Resistance

kΩ

TRANSMITTER OUTPUTS

Output Voltage Swing

Output Resistance

All Transmitter Outputs Loaded with 3kΩ to Ground

Full

±5.0

±5.4

10M

±35

Ω

= V+ = V- = 0V, Transmitter Output = ±2V

300

Output Short-Circuit Current

±60

±25

µA

Output Leakage Current

(ICL3217E Only)

= ±12V, V

= 0V or 3V to 5.5V

OUT

In Automatic Powerdown

TIMING CHARACTERISTICS

Maximum Data Rate

(One Transmitter Switching)

= 3.15V, C - C = 0.1µF, R = 3kΩ, C = 1000pF

Full

250

500

286

310

0.3

200

100

kbps

µs

= 3.0V, C - C = 0.22µF, R = 3kΩ, C = 1000pF

250

≥ 4.5V, C - C = 0.1µF, R = 3kΩ, C = 1000pF

250

Receiver Propagation Delay

Receiver Input to Receiver

Output, C = 150pF

PHL

PLH

µs

Transmitter Skew

- t

PHL PLH

Full

1000

500

Receiver Skew

- t

PHL PLH

Transition Region Slew Rate

= 3.3V, R = 3kΩ to 7kΩ,

C = 200pF to 2500pF

V/µs

Measured From +3V to -3V or -3V

to +3V

C = 200pF to 1000pF

ESD PERFORMANCE

RS-232 Pins (T

, R

OUT IN

)

IEC61000-4-2, Air-Gap Discharge Method

IEC61000-4-2, Contact Discharge Method

Human Body Model

±15

±8

±15

±2

All Other Pins

Human Body Model

Trans mitters

Detailed Des cription

The transmitters are proprietary, low dropout, inverting

drivers that translate TTL/CMOS inputs to EIA/TIA-232

output levels. Coupled with the on-chip ±5.5V supplies,

these transmitters deliver true RS-232 levels over a wide

range of single supply system voltages.

The ICL32X7E interface ICs operate from a single +3V to

+5.5V power supply, guarantee a 250kbps minimum data

rate, require only four small external 0.1µF capacitors,

feature low power consumption, and meet all ElA RS-232C

and V.28 specifications. The circuit is divided into three

sections: charge pump, transmitters and receivers.

ICL3217E transmitter outputs disable and assume a high

impedance state when the device enters the automatic

powerdown mode. These outputs may be driven to ±12V

when disabled.

Charge-Pump

Intersil’s new ICL32XXE family utilizes regulated on-chip

dual charge pumps as voltage doublers, and voltage

inverters to generate ±5.5V transmitter supplies from a V

Both devices guarantee a 250kbps data rate for full load

supply as low as 3V. This allows these devices to maintain

RS-232 compliant output levels over the ±10% tolerance

range of 3.3V powered systems. The efficient on-chip power

supplies require only four small, external 0.1µF capacitors

conditions (3kΩ and 1000pF), V

≥ 3.0V, with one

transmitter operating at full speed. Under more typical

conditions of V ≥ 3.3V, R = 3kΩ, and C = 250pF, one

transmitter easily operates at 800kbps.

for the voltage doubler and inverter functions at V

= 3.3V.

See the Capacitor Selection section, and Table 3 for

Transmitter inputs float if left unconnected, and may cause

increases. Connect unused inputs to GND for the best

performance.

capacitor recommendations for other operating conditions.

The charge pumps operate discontinuously (i.e., they turn off

as soon as the V+ and V- supplies are pumped up to the

nominal values), resulting in significant power savings.

ICL3207E, ICL3217E

Receivers

The ICL32X7E each contain inverting receivers that convert

RS-232 signals to CMOS output levels and accept inputs up

to ±25V while presenting the required 3kΩ to 7kΩ input

impedance (see Figure 1) even if the power is off

TRANSITION

DETECTOR

ICL3217E

WAKE-UP

LOGIC

= 0V). The receivers’ Schmitt trigger input stage uses

hysteresis to increase noise immunity and decrease errors

due to slow input signal transitions.

V-

Receivers on the ICL3207E are always active. The

ICL3217E receivers disable when in the automatic

powerdown state, thereby eliminating the possible current

path through a shutdown peripheral’s input protection diode

(see Figures 2 and 3).

= HI-Z*

OUT

POWERED

DOWN

UART

* IN AUTOMATIC

POWERDOWN

Low Power Operation

These 3V devices require a nominal supply current of

FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN

0.3mA, even at V

= 5.5V, during normal operation (not in

powerdown mode). This is considerably less than the 11mA

current required by comparable 5V RS-232 devices,

allowing users to reduce system power simply by replacing

the old style device with the ICL3207E.

When replacing a ‘207E or ‘237E device in an existing 5V

application, it is acceptable to terminate C to V

as shown

on the Typical Operating Circuit. Nevertheless, terminate C

to GND if possible, as slightly better performance results

from this configuration.

Low Power, Pin Compatible Replacement

Pin compatibility with existing 5V products (e.g., MAX207E),

coupled with the wide operating supply range, make the

ICL32X7E potential lower power, higher performance drop-

in replacements for existing ‘2X7E 5V applications. As long

as the ±5V RS-232 output swings are acceptable, the

ICL32X7E devices should work in most 5V applications.

Automatic Powerdown (ICL3217E Only)

Even greater power savings is available by using the

ICL3217E which features an automatic powerdown function.

When no valid RS-232 voltages (see Figure 4) are sensed

on any receiver input for 30µs, the ICL3217E automatically

enters its powerdown state (see Figure 5). In powerdown,

supply current drops to 1µA, because the on-chip charge

pump turns off (V+ collapses to V , V- collapses to GND),

XIN

XOUT

and the receiver and transmitter outputs three-state (see

Table 2). This micro-power mode makes the ICL3217E ideal

for battery powered and portable applications. Invalid

receiver levels occur whenever the driving peripheral’s

outputs are shut off (powered down) or when the RS-232

interface cable is disconnected. The ICL3217E powers back

up whenever it detects a valid RS-232 voltage level on any

receiver input (such as when the RS-232 cable is

reconnected). The time to recover from automatic

powerdown mode is typically 100µs.

-25V ≤ V

≤ +25V

RIN

GND ≤ V

≤ V

5kΩ

ROUT

GND

FIGURE 1. INVERTING RECEIVER CONNECTIONS

CURRENT

FLOW

= V

OUT

TABLE 2. ICL3217E AUTOMATIC POWERDOWN OPERATION

RS-232 SIGNAL

POWERED

DOWN

UART

PRESENT AT

RECEIVER

INPUT?

MODE

OUTPUTS OPERATION

TRANSMITTER RECEIVER

OUTPUTS

SHDN = GND

OLD

RS-232 CHIP

GND

YES

Active

Normal

Operation

High-Z

Powerdown

Due to Auto

Powerdown

Logic

FIGURE 2. POWER DRAIN THROUGH POWERED DOWN

PERIPHERAL

ICL3207E, ICL3217E

reduces ripple on the transmitter outputs and slightly

reduces power consumption. C , C , and C can be

VALID RS-232 LEVEL - ICL3217E IS ACTIVE

2.7V

increased without increasing C ’s value, however, do not

INDETERMINATE - POWERDOWN MAY OR

MAY NOT OCCUR

increase C without also increasing C , C , and C to

maintain the proper ratios (C to the other capacitors).

0.3V

When using minimum required capacitor values, make sure

that capacitor values do not degrade excessively with

temperature. If in doubt, use capacitors with a larger nominal

value. The capacitor’s equivalent series resistance (ESR)

usually rises at low temperatures and it influences the

^{amount of ripple on V+ and V-}.

INVALID LEVEL - POWERDOWN OCCURS AFTER 30µs

-0.3V

INDETERMINATE - POWERDOWN MAY OR

MAY NOT OCCUR

-2.7V

VALID RS-232 LEVEL - ICL3217E IS ACTIVE

TABLE 3. REQUIRED CAPACITOR VALUES

FIGURE 4. DEFINITION OF VALID RS-232 RECEIVER

LEVELS

(V)

C (µF)

C , C , C (µF)

2 3 4

3.15 to 3.6

3.0 to 3.6

4.5 to 5.5

3.0 to 5.5

0.1

0.22

0.1

RECEIVER

INPUTS

INVALID

REGION

}

0.22

0.1 to 1.0

0.22

0.1 to 1.0

0.22

TRANSMITTER

OUTPUTS

PWR UP (t

)

AUTOPWDN

Power Supply Decoupling

In most circumstances a 0.1µF bypass capacitor is

adequate. In applications that are particularly sensitive to

power supply noise, decouple V to ground with a

V+

capacitor of the same value as the charge-pump capacitor C .

Connect the bypass capacitor as close as possible to the IC.

V-

Trans mitter Outputs when Exiting

Powerdown

FIGURE 5. AUTOMATIC POWERDOWN TIMING DIAGRAM

This automatic powerdown feature provides additional

system power savings without changes to the existing

operating system or hardware.

Figure 6 shows the response of two ICL3217E transmitter

outputs when exiting powerdown mode. As they activate, the

two transmitter outputs properly go to opposite RS-232

levels, with no glitching, ringing, nor undesirable transients.

Each transmitter is loaded with 3kΩ in parallel with 2500pF.

Note that the transmitters enable only when the magnitude

of the supplies exceed approximately 3V.

Utilizing power management circuitry, to power down the

rest of the communication circuitry (e.g., the UART) when

the ICL3217E powers down, produces even greater power

savings. Connecting a transition detector to the V- pin (see

Figure 3) is an easy way for the power management logic to

determine when the ICL3217E enters and exits powerdown.

5V/DIV

Capacitor Selection

The charge pumps require 0.1µF, or greater, capacitors for

3.3V operation. With 0.1µF capacitors, five percent tolerance

supplies (e.g., 3.14V minimum) deliver greater than ±5V

transmitter swings at full data rate, while ten percent

tolerance supplies (e.g., 2.97V minimum) deliver ±4.95V

transmitter swings. If greater than ±5V transmitter swings

are required with a 10% tolerance 3.3V supply, 0.22µF

capacitors are recommended (see Table 3). Existing 5V

applications typically utilize either 0.1µF or 1µF capacitors,

and the ICL32X7E works well with either value. New 5V

designs should use 0.22µF capacitors for the best results.

For other supply voltages refer to Table 3 for capacitor

values. Do not use values smaller than those listed in

Table 3. Increasing the capacitor values (by a factor of two)

2V/DIV

= +3.3V

C1 - C4 = 0.1µF

TIME (20µs/DIV.)

FIGURE 6. TRANSMITTER OUTPUTS WHEN EXITING

POWERDOWN (ICL3217E ONLY)

ICL3207E, ICL3217E

Operation down to 2.7V

5V/DIV.

ICL32X7E transmitter outputs meet RS-562 levels (±3.7V)

with V as low as 2.7V. RS-562 levels typically ensure inter

operability with RS-232 devices.

High Data Rates

OUT

The ICL32XX maintain the RS-232 ±5V minimum transmitter

output voltages even at high data rates. Figure 7 details a

transmitter loopback test circuit, and Figure 8 illustrates the

loopback test result at 120kbps. For this test, all transmitters

were simultaneously driving RS-232 loads in parallel with

1000pF, at 120kbps. Figure 9 shows the loopback results for

a single transmitter driving 1000pF and an RS-232 load at

250kbps. The static transmitters were also loaded with an

RS-232 receiver.

OUT

= +3.3V

C1 - C4 = 0.1mF

2µs/DIV.

FIGURE 9. LOOPBACK TEST AT 250kbps

Interconnection with 3V and 5V Logic

0.1µF

The ICL32X7E directly interface with 5V CMOS and TTL

logic families. Nevertheless, with the ICL32X7E at 3.3V, and

the logic supply at 5V, AC, HC, and CD4000 outputs can

drive ICL32X7E inputs, but ICL32X7E outputs do not reach

V+

V-

C1+

C1-

C2+

C2-

the minimum V for these logic families. See Table 4 for

ICL32X7E

more information.

TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS

SUPPLY VOLTAGES

OUT

SYSTEM

1000pF

POWER-SUPPLY SUPPLY

OUT

VOLTAGE

(V)

VOLTAGE

(V)

COMPATIBILITY

3.3

Compatible with all CMOS

families.

Compatible with all TTL and

CMOS logic families.

FIGURE 7. TRANSMITTER LOOPBACK TEST CIRCUIT

3.3

Compatible with ACT and HCT

CMOS, and with TTL. ICL32X7E

outputs are incompatible with AC,

HC, and CD4000 CMOS inputs.

5V/DIV.

±15kV ESD Protection

All pins on ICL32XX devices include ESD protection

structures, but the ICL32X7E incorporate advanced

structures which allow the RS-232 pins (transmitter outputs

and receiver inputs) to survive ESD events up to ±15kV. The

RS-232 pins are particularly vulnerable to ESD damage

because they typically connect to an exposed port on the

exterior of the finished product. Simply touching the port

pins, or connecting a cable, can cause an ESD event that

might destroy unprotected ICs. These new ESD structures

protect the device whether or not it is powered up, protect

without allowing any latchup mechanism to activate, and

don’t interfere with RS-232 signals as large as ±25V.

OUT

= +3.3V

C1 - C4 = 0.1µF

5µs/DIV.

FIGURE 8. LOOPBACK TEST AT 120kbps

ICL3207E, ICL3217E

the HBM test. The extra ESD protection built into this

Human Body Model (HBM) Tes ting

device’s RS-232 pins allows the design of equipment

meeting level 4 criteria without the need for additional board

level protection on the RS-232 port.

As the name implies, this test method emulates the ESD

event delivered to an IC during human handling. The tester

delivers the charge through a 1.5kΩ current limiting resistor,

making the test less severe than the IEC61000 test which

utilizes a 330Ω limiting resistor. The HBM method

determines an ICs ability to withstand the ESD transients

typically present during handling and manufacturing. Due to

the random nature of these events, each pin is tested with

respect to all other pins. The RS-232 pins on “E” family

devices can withstand HBM ESD events to ±15kV.

AIR-GAP DISCHARGE TEST METHOD

For this test method, a charged probe tip moves toward the

IC pin until the voltage arcs to it. The current waveform

delivered to the IC pin depends on approach speed,

humidity, temperature, etc., so it is difficult to obtain

repeatable results. The “E” device RS-232 pins withstand

±15kV air-gap discharges.

IEC61000-4-2 Tes ting

CONTACT DISCHARGE TEST METHOD

The IEC61000 test method applies to finished equipment,

rather than to an individual IC. Therefore, the pins most likely

to suffer an ESD event are those that are exposed to the

outside world (the RS-232 pins in this case), and the IC is

tested in its typical application configuration (power applied)

rather than testing each pin-to-pin combination. The lower

current limiting resistor coupled with the larger charge

storage capacitor yields a test that is much more severe than

During the contact discharge test, the probe contacts the

tested pin before the probe tip is energized, thereby

eliminating the variables associated with the air-gap

discharge. The result is a more repeatable and predictable

test, but equipment limits prevent testing devices at voltages

higher than ±8kV. All “E” family devices survive ±8kV contact

discharges on the RS-232 pins.

Typical Performance Curves

= 3.3V, T = 25°C

CC A

6.0

OUT

4.0

-SLEW

2.0

1 TRANSMITTER AT 250kbps

OTHER TRANSMITTERS AT 30kbps

-2.0

-4.0

-6.0

+SLEW

OUT

-SLEW

1000

2000

3000

4000

5000

1000

2000

3000

4000

5000

LOAD CAPACITANCE (pF)

FIGURE 10. TRANSMITTER OUTPUT VOLTAGE vs LOAD

CAPACITANCE

FIGURE 11. SLEW RATE vs LOAD CAPACITANCE

ICL3207E, ICL3217E

Typical Performance Curves

= 3.3V, T = 25°C (Continued)

3.5

3.0

2.5

2.0

1.5

1.0

NO LOAD

ALL OUTPUTS STATIC

1 TRANSMITTER SWITCHING

250kbps

120kbps

20kbps

0.5

2.5

1000

2000

3000

4000

5000

3.0

3.5

4.0

4.5

5.0

5.5

6.0

LOAD CAPACITANCE (pF)

SUPPLY VOLTAGE (V)

FIGURE 12. SUPPLY CURRENT vs LOAD CAPACITANCE

WHEN TRANSMITTING DATA

FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE

Die Characteris tics

SUBSTRATE POTENTIAL (POWERED UP):

GND

TRANSISTOR COUNT:

ICL3207E: 469

ICL3217E: 488

PROCESS:

Si Gate CMOS

ICL3207E, ICL3217E

Shrink Small Outline Plas tic Packages (SSOP)

M24.209 (JEDEC MO-150-AG ISSUE B)

24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

B M

INCHES

MILLIMETERS

GAUGE

PLANE

SYMBOL

MIN

MAX

MIN

MAX

2.00

NOTES

-B-

0.078

0.002

0.065

0.009

0.004

0.312

0.197

0.05

1.65

0.22

0.09

7.90

5.00

0.072

0.014

0.009

0.334

0.220

1.85

0.38

0.25

8.50

5.60

0.25

0.010

SEATING PLANE

-A-

-C-

0.026 BSC

0.65 BSC

0.292

0.322

0.037

7.40

0.55

8.20

0.95

0.10(0.004)

0.022

0.25(0.010) M

C A M B S

NOTES:

Rev. 1 3/95

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.20mm

(0.0078 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-

sion at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

ICL3207E, ICL3217E

Small Outline Plas tic Packages (SOIC)

M24.3 (JEDEC MS-013-AD ISSUE C)

24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

B M

INCHES

MILLIMETERS

SYMBOL

MIN

MAX

MIN

2.35

0.10

0.33

0.23

MAX

2.65

0.30

0.51

0.32

15.60

7.60

NOTES

-B-

0.0926

0.0040

0.013

0.1043

0.0118

0.020

SEATING PLANE

0.0091

0.5985

0.2914

0.0125

-A-

0.6141 15.20

h x 45

0.2992

7.40

-C-

0.05 BSC

1.27 BSC

0.394

0.010

0.016

0.419

0.029

0.050

10.00

0.25

0.40

10.65

0.75

1.27

0.10(0.004)

0.25(0.010) M

C A M B S

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

Rev. 0 12/93

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm

(0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site www.intersil.com

ICL3207ECBZ [INTERSIL]

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