IS-2981RH [INTERSIL]

Radiation Hardened 8-Channel Source Driver; 抗辐射8通道源驱动器


型号：	IS-2981RH
厂家：	Intersil
描述：	Radiation Hardened 8-Channel Source Driver 抗辐射8通道源驱动器驱动器
文件：	总2页 (文件大小：43K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IS-2981RH

Data Sheet

June 2000

File Number 4869.1

Radiation Hardened 8-Channel Source

Driver

Features

• Electrically Screened to SMD # 5962-00520

The Star*Power Radiation Hardened

IS-2981RH is a monolithic device

• QML Qualiﬁed Per MIL-PRF-38535 Requirements

• Radiation Environment

designed for use in high-side

switching applications that beneﬁt

- Single Event Latch-up Immune. . . . . . . . . . . DI Process

from separate grounds for the logic and loads. The device

has a 5V to 80V operating supply voltage range and is

capable of sourcing -200mA continuously from each output.

The outputs are controlled by active-high inputs and may be

paralleled to increase the drive current. Output clamp diodes

prevent device damage, when switching inductive loads.

- Total Dose. . . . . . . . . . . . . . . . . . . 1 x 10 rad(Si) (Max)

• Input Voltage Range. . . . . . . . . . . 0.0V to V

(20V Max)

• Supply Voltage Range . . . . . . . . . . . . . . . . . . . . 5V to 80V

• Turn-on Delay Time . . . . . . . . . . . . . . . . . . . . . .2µs (Max)

• Turn-off Delay Time . . . . . . . . . . . . . . . . . . . . .11µs (Max)

Constructed with the Intersil bonded wafer, dielectrically

isolated HVTDLM process, these single event latch-up

immune devices have been speciﬁcally designed to provide

highly reliable performance in harsh radiation environments.

They are fully guaranteed for 100krad(Si) total dose

performance through wafer-by-wafer radiation testing, and

are production tested over the full military temperature

range.

• Output Clamp Diode, V . . . . . . . . . . . . . . . -1.75V (Max)

Applications

• Drivers for Various Loads

- Relays, Solenoids and Motors

• Reliable Replacement of Discrete Solutions

• Interfacing Between Low-Level Logic and High-Current

Loads

Speciﬁcations for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed here must be used when ordering.

Pinout

IS1-2981RH-Q

(CDIP2-T18, SBDIP)

TOP VIEW

Detailed Electrical Speciﬁcations for these devices are

contained in SMD 5962-00520. A “hot-link” is provided

on our homepage for downloading.

www.intersil.com/spacedefense/space.htm

IN 1

IN 2

IN 3

IN 4

IN 5

IN 6

IN 7

IN 8

OUT 1

OUT 2

Ordering Information

16 OUT 3

15 OUT 4

14 OUT 5

13 OUT 6

INTERNAL MKT.

NUMBER

TEMP. RANGE

ORDERING NUMBER

5962R0052001VVC

5962R0052001QVC

IS1-2981RH/Proto

( C)

IS1-2981RH-Q

IS1-2981RH-8

-55 to 125

OUT 7

OUT 8

GND

IS1-2981RH/Proto

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

IS-2981RH

Die Characteristics

DIE DIMENSIONS:

Substrate

2667µm x 5131µm (105 mils x 202 mils)

HVTDLM, Bonded Wafer, Dielectric Isolation

Thickness: 483µm ± 25.4µm (19 mils ± 1 mil)

Backside Finish

INTERFACE MATERIALS

Glassivation

Silicon

ASSEMBLY RELATED INFORMATION

Type: Nitride (Si N ) over Silox (SiO )

Nitride Thickness: 4.0kÅ ± 1.0kÅ

Silox Thickness: 12.0kÅ ± 4.0kÅ

Substrate Potential

Must be tied to GND.

ADDITIONAL INFORMATION

Worst Case Current Density

Metallization

Top Metal 2: Ti/AlCu

Thickness: 1.6µm ± 0.02µm

Metal 1: Ti/AlCu

Thickness: 0.8µm ± 0.01µm

<1.0 x 10 A/cm

Transistor Count

Metallization Mask Layout

IS-2981RH

10A

NOTES:

1. Pad numbers correspond to package pin functions.

2. Bond to all four pad 9 locations for V current sharing purposes.

3. Bond to both pad 10 locations for GND current sharing purposes.

4. Pad 10A is not used in die applications.

5. Die backside must be connected to GND.

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site www.intersil.com

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