ISL3296EFRTZ-T [INTERSIL]
【16.5kV ESD Protected, +125∑C, 3.0V to 5.5V, SOT-23/TDFN Packaged, Low Power, RS-485/RS-422 Transmitters; 【 16.5kV ESD保护， + 125ΣC ， 3.0V至5.5V ， SOT -23 / TDFN封装，低功耗， RS - 485 / RS - 422发射器
| 型号： | ISL3296EFRTZ-T |
| 厂家： | 
Intersil |
| 描述： | 【16.5kV ESD Protected, +125∑C, 3.0V to 5.5V, SOT-23/TDFN Packaged, Low Power, RS-485/RS-422 Transmitters |
| 文件： | 总17页 (文件大小：642K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISL3293E, ISL3294E, ISL3295E, ISL3296E,
ISL3297E, ISL3298E
®
Data Sheet
September 19, 2007
FN6544.0
±16.5kV ESD Protected, +125°C, 3.0V to
5.5V, SOT-23/TDFN Packaged, Low Power,
RS-485/RS-422 Transmitters
Features
• High ESD Protection on RS-485 Outputs . . ±16.5kV HBM
- IEC61000-4-2 Contact Test Method . . . . . . . . . . . . ±7kV
- Class 3 ESD Level on all Other Pins . . . . . . >8kV HBM
The Intersil ISL3293E, ISL3294E, ISL3295E, ISL3296E,
ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV
IEC61000 contact), 3.0V to 5.5V powered, single
• Specified for +125°C Operation (V
≤ 3.6V Only)
CC
• Logic Supply Pin (V ) Eases Operation in Mixed Supply
L
Systems (ISL3296E through ISL3298E Only)
transmitters for balanced communication using the RS-485
and RS-422 standards. These drivers have very low bus
currents (±40mA), so they present less than a “1/8 unit load”
to the RS-485 bus. This allows more than 256 transmitters on
the network without violating the RS-485 specification’s
32 unit load maximum, and without using repeaters.
• Hot Plug - Tx Outputs Remain Three-state During
Power-up
• Low Tx Leakage Allows >256 Devices on the Bus
• High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 20Mbps
Hot Plug circuitry ensures that the Tx outputs remain in a
high impedance state while the power supply stabilizes.
• Low Quiescent Supply Current . . . . . . . . . . .150µA (Max)
- Very Low Shutdown Supply Current. . . . . . . 1µA (Max)
The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew
rate limited drivers which reduce EMI, and minimize reflections
from improperly terminated transmission lines, or from
unterminated stubs in multidrop and multipoint applications.
Drivers on the ISL3295E and ISL3298E are not limited, so they
can achieve the 20Mbps data rate. All versions are offered in
Industrial and Extended Industrial (-40°C to +125°C)
temperature ranges.
• -7V to +12V Common Mode Output Voltage Range
(V
≤ 3.6V Only)
CC
• Current Limiting and Thermal Shutdown for Driver
Overload Protection (V
• Tri-statable Tx Outputs
≤ 3.6V Only)
CC
• 5V Tolerant Logic Inputs When V
• Pb-Free (RoHS Compliant)
≤5V
CC
A 26% smaller footprint is available with the ISL3296E,
ISL3297E, ISL3298E’s TDFN package. These devices also
feature a logic supply pin (V ) that sets the switching points
of the DE and DI inputs to be compatible with a lower supply
voltage in mixed voltage systems.
L
Applications
• Clock Distribution
• High Node Count Systems
• Space Constrained Systems
• Security Camera Networks
For companion single RS-485 receivers in micro packages,
please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E,
ISL3284E data sheet.
• Building Environmental Control/Lighting Systems
• Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
TX
MAXIMUM
ENABLE? QUIESCENT LOW POWER
PART
DATA RATE SLEW-RATE
HOT
PIN
NUMBER
FUNCTION
1 Tx
(Mbps)
0.25
0.5
LIMITED?
PLUG?
V
PIN?
(Note 10)
I
(µA)
SHUTDOWN?
COUNT
L
CC
ISL3293E
ISL3294E
ISL3295E
ISL3296E
ISL3297E
ISL3298E
YES
YES
YES
YES
YES
YES
YES
NO
NO
YES
150
YES
6 Ld SOT
6 Ld SOT
6 Ld SOT
8 Ld TDFN
8 Ld TDFN
8 Ld TDFN
1 Tx
YES
YES
150
150
150
150
150
YES
1 Tx
20
NO
NO
YES
YES
1 Tx
0.25
0.5
YES
YES
YES
YES
YES
YES
1 Tx
YES
YES
YES
1 Tx
20
NO
YES
YES
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
1
All other trademarks mentioned are the property of their respective owners.
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Pinouts
ISL3293E, ISL3294E, ISL3295E
(6 LD SOT-23)
ISL3296E, ISL3297E, ISL3298E
(8 LD TDFN)
TOP VIEW
TOP VIEW
DI
1
2
3
6
5
4
Y
V
V
CC
1
2
3
4
8
7
6
5
L
V
D
GND
Z
CC
DE
DI
Z
D
DE
Y
GND
GND
NOTE: BOTH GND PINS MUST BE CONNECTED
Ordering Information
Truth Tables
PART
TEMP.
PACKAGE
TRANSMITTING
PART NUMBER MARKING RANGE (Tape and Reel) PKG.
(Notes 1, 2) (Note 3) (°C) (Pb-Free)
INPUTS
DE (Note 10)
OUTPUTS
DWG. #
P6.064
P6.064
P6.064
P6.064
P6.064
P6.064
L8.2x3A
L8.2x3A
L8.2x3A
L8.2x3A
L8.2x3A
L8.2x3A
DI
Z
0
1
Y
ISL3293EFHZ-T 293F
ISL3293EIHZ-T 293I
ISL3294EFHZ-T 294F
ISL3294EIHZ-T 294I
ISL3295EFHZ-T 295F
ISL3295EIHZ-T 295I
ISL3296EFRTZ-T 96F
ISL3296EIRTZ-T 96I
ISL3297EFRTZ-T 97F
ISL3297EIRTZ-T 97I
ISL3298EFRTZ-T 98F
ISL3298EIRTZ-T 98I
NOTES:
-40 to +125 6 Ld SOT-23
-40 to +85 6 Ld SOT-23
-40 to +125 6 Ld SOT-23
-40 to +85 6 Ld SOT-23
-40 to +125 6 Ld SOT-23
-40 to +85 6 Ld SOT-23
-40 to +125 8 Ld TDFN
-40 to +85 8 Ld TDFN
-40 to +125 8 Ld TDFN
-40 to +85 8 Ld TDFN
-40 to +125 8 Ld TDFN
-40 to +85 8 Ld TDFN
1
1
0
1
0
1
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode
1. These Intersil Pb-free plastic packaged products employ special Pb-
free material sets; molding compounds/die attach materials and
100% matte tin plate PLUS ANNEAL - e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. SOT-23 “PART MARKING” is branded on the bottom side.
FN6544.0
September 19, 2007
2
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Pin Descriptions
PIN
FUNCTION
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the
driver enable function isn’t needed, connect DE to V
(or V ) through a 1kΩ to 3kΩ resistor.
L
CC
DI
GND
Y
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
Ground connection. This is also the potential of the TDFN thermal pad.
±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, noninverting transmitter output.
±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, inverting transmitter output.
Z
V
System power supply input (3.0V to 5.5V). On devices with a V pin, power-up V
first.
CC
CC
L
V
Logic-Level supply which sets the V /V levels for the DI and DE pins (ISL3296E, ISL3297E, ISL3298E only). Power-up this supply
IL IH
L
after V , and keep V ≤ V
CC
L
CC.
FN6544.0
September 19, 2007
3
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Typical Operating Circuits
NETWORK WITH ENABLES
+3.3V TO 5V
1
+3.3V
2
+
+
0.1µF
0.1µF
V
V
CC
CC
ISL3281E
ISL329xE
R
6
4
Y
Z
6
4
T
A
RO
RE
3
5
1
3
DI
R
B
D
DE
GND
2
GND
5
NETWORK WITHOUT ENABLE
+3.3V TO 5V
1
+3.3V
1kΩ TO 3kΩ (NOTE 10)
+
+
0.1µF
0.1µF
2
3
V
V
CC
CC
ISL3280E
ISL329xE
DE
R
5
4
T
6
Y
Z
A
RO
3
1
DI
R
4
B
D
GND
2
GND
5
NETWORK WITH V PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
L
2.5V +3.3V TO 5V
+3.3V
1.8V
+
+
0.1µF
0.1µF
4
6
8
1
V
V
V
V
L
CC
L
CC
V
V
CC
CC
ISL3282E
R
ISL3298E
LOGIC
DEVICE
(µP, ASIC,
UART)
LOGIC
R
DEVICE
(µP, ASIC,
UART)
5
8
T
6
7
Y
Z
A
B
RO
RE
1
7
3
2
DI
D
DE
GND
2
GND
4, 5
FN6544.0
September 19, 2007
4
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Absolute Maximum Ratings
Thermal Information
V
V
to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
CC
to GND (ISL3296E thru ISL3298E Only) . . -0.3V to (V
+0.3V)
L
CC
6 Ld SOT-23 Package (Note 4) . . . . . .
8 Ld TDFN Package (Notes 5, 6). . . . .
177
65
N/A
8
Input Voltages
DI, DE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Y, Z (V
Y, Z (V
≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
CC
CC
> 3.6V) . . . . . . . . . . . . . . . . . . . . . . -0.5V to V
+0.5V
CC
Short Circuit Duration
Y, Z (V
Y, Z (V
≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
> 3.6V, Note 12). . . . . . . . . . . . . . . . . . . 1s at <300mA
CC
CC
Operating Conditions
Temperature Range
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
F Suffix (V
≤ 3.6V Only). . . . . . . . . . . . . . . . . .-40°C to +125°C
CC
I Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
5. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JA
Tech Brief TB379.
6. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical Specifications Test Conditions: V = 3.0V to 5.5V; V = V (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
CC
CC
L
T
= +25°C; Unless Otherwise Specified. (Note 7)
A
TEMP
(°C)
MIN
(Note 11)
TYP
(Note 13)
MAX
(Note 11) UNITS
PARAMETER
SYMBOL
TEST CONDITIONS
DC CHARACTERISTICS
Driver Differential V
V
R
= 100Ω (RS-422)
V
V
V
V
≥ 3.15V
≥ 4.5V
≥ 3.0V
≥ 4.5V
Full
Full
Full
Full
Full
Full
Full
2
3
2.3
3.8
2
-
-
V
V
V
V
OUT
OD
L
CC
CC
CC
CC
(Figure 1A)
R
= 54Ω (RS-485)
1.5
2.5
-
V
V
V
L
CC
CC
(Figure 1A)
3.4
-
No Load
CC
-
R
R
= 60Ω, -7V ≤ V
≤ 12V (Figure 1B)
1.5
-
2, 3.4
0.01
V
V
L
CM
Change in Magnitude of Driver
Differential V for
ΔV
= 54Ω or 100Ω (Figure 1A)
0.2
OD
L
OUT
Complementary Output States
Driver Common-Mode V
V
R
= 54Ω or 100Ω
V
V
≤ 3.6V
≤ 5.5V
Full
Full
Full
-
-
-
2
-
3
V
V
V
OUT
OC
L
CC
CC
(Figure 1A)
3.2
0.2
Change in Magnitude of Driver
Common-Mode V for
ΔV
R
= 54Ω or 100Ω (Figure 1A)
0.01
OC
L
OUT
Complementary Output States
Input High Voltage (DI, DE)
V
V
V
V = V if ISL3296E,
CC
ISL3297E, ISL3298E
V
V
≤ 3.6V
≤ 5.5V
Full
Full
Full
2.2
3
-
-
-
-
-
-
V
V
V
IH1
IH2
IH3
L
CC
CC
2.7V ≤ V < 3.0V (ISL3296E, ISL3297E,
2
L
ISL3298E only)
V
V
V
2.3V ≤ V < 2.7V (ISL3296E, ISL3297E,
ISL3298E only)
Full
Full
25
1.65
-
-
-
-
-
V
V
V
IH4
IH5
IH6
L
1.6V ≤ V < 2.3V (ISL3296E, ISL3297E,
0.7*V
-
L
L
ISL3298E only)
1.35V ≤ V < 1.6V (ISL3296E, ISL3297E,
0.5*V
L
L
ISL3298E only)
FN6544.0
September 19, 2007
5
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Electrical Specifications Test Conditions: V = 3.0V to 5.5V; V = V (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
CC
CC
L
T
= +25°C; Unless Otherwise Specified. (Note 7) (Continued)
A
TEMP
(°C)
MIN
(Note 11)
TYP
(Note 13)
MAX
(Note 11) UNITS
PARAMETER
SYMBOL
TEST CONDITIONS
if ISL3296E, ISL3297E, ISL3298E Full
Input Low Voltage (DI, DE)
V
V
V = V
-
-
-
-
0.8
0.8
V
V
IL1
IL2
L
CC
V
≥ 2.7V (ISL3296E, ISL3297E, ISL3298E
Full
Full
Full
25
L
only)
V
V
V
I
2.3V ≤ V < 2.7V (ISL3296E, ISL3297E,
ISL3298E only)
-
-
-
-
-
0.65
0.22*V
-
V
V
V
IL3
IL4
IL5
L
1.6V ≤ V < 2.3V (ISL3296E, ISL3297E,
ISL3298E only)
L
L
1.35V ≤ V < 1.6V (ISL3296E, ISL3297E,
0.3*V
L
L
ISL3298E only)
Logic Input Current
DI = DE = 0V or V
(Note 10)
CC
Full
Full
Full
-2
-
-
2
40
-
µA
µA
µA
IN
Output Leakage Current (Y, Z,
Note 10)
I
DE = 0V,
V
V
= 12V
= -7V
0.1
-10
OZ
IN
IN
V
= 0V, 3.6V, or
CC
5.5V
-40
Driver Short-Circuit Current,
I
DE = V , -7V ≤ V ≤ 12V, V ≤ 3.6V
CC CC
Full
Full
-
-
-
-
±250
±450
mA
mA
OSD1
O
V
= High or Low (Note 8)
O
DE = V , 0V ≤ V ≤ V , V
CC CC CC
> 3.6V
O
(Note 12)
Thermal Shutdown Threshold
SUPPLY CURRENT
T
Full
-
160
-
°C
SD
No-Load Supply Current
Shutdown Supply Current
ESD PERFORMANCE
RS-485 Pins (Y, Z)
I
DI = 0V or V
DE = V
Full
Full
-
-
120
150
1
µA
µA
CC
CC
CC
I
DE = 0V, DI = 0V or V
0.01
SHDN
CC
Human Body Model, From Bus Pins to GND
IEC61000 Contact, From Bus Pins to GND
HBM, per MIL-STD-883 Method 3015
Machine Model
25
25
25
25
-
-
-
-
±16.5
±7
-
-
-
-
kV
kV
kV
V
All Pins
±8
±400
DRIVER SWITCHING CHARACTERISTICS (ISL3293E, ISL3296E, 250kbps)
Maximum Data Rate
f
V
= ±1.5V, C = 820pF (Figure 4)
Full
Full
250
400
-
-
kbps
ns
MAX
OD
D
Driver Single Ended Output
Delay
t
R
= 54Ω, C = 50pF (Figure 2)
1350
1700
SD
DIFF
D
Part-to-Part Output Delay Skew
t
R
R
= 54Ω, C = 50pF (Figure 2, Note 9)
Full
Full
-
-
-
900
750
ns
ns
SKPP
DIFF
D
Driver Single Ended Output
Skew
t
= 54Ω, C = 50pF (Figure 2)
600
SSK
DIFF
D
Driver Differential Output Delay
Driver Differential Output Skew
t
R
R
= 54Ω, C = 50pF (Figure 2)
Full
Full
Full
25
400
1100
4, 1
1500
30
ns
ns
ns
ns
ns
ns
ns
DD
DIFF
DIFF
DIFF
D
t
= 54Ω, C = 50pF (Figure 2)
-
DSK
D
Driver Differential Rise or Fall
Time
t , t
R
C
= 54Ω,
= 50pF (Figure 2)
V
V
≤ 3.6V
400
960
1500
-
R
F
CC
CC
D
= 5V
-
-
-
-
1300
Driver Enable to Output High
Driver Enable to Output Low
t
t
R = 500Ω, C = 50pF, SW = GND (Figure 3) Full
100, 60
60, 35
30, 22
250
250
60
ZH
L
L
t
R = 500Ω, C = 50pF, SW = V
(Figure 3) Full
ZL
L
L
CC
Driver Disable from Output
High
R = 500Ω, C = 50pF, SW = GND (Figure 3) Full
HZ
L
L
Driver Disable from Output Low
t
R = 500Ω, C = 50pF, SW = V
CC
(Figure 3) Full
-
25, 20
60
ns
LZ
L
L
FN6544.0
September 19, 2007
6
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Electrical Specifications Test Conditions: V = 3.0V to 5.5V; V = V (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
CC
CC
L
T
= +25°C; Unless Otherwise Specified. (Note 7) (Continued)
A
TEMP
(°C)
MIN
(Note 11)
TYP
(Note 13)
MAX
(Note 11) UNITS
PARAMETER
SYMBOL
TEST CONDITIONS
DRIVER SWITCHING CHARACTERISTICS (ISL3294E, ISL3297E, 500kbps)
Maximum Data Rate
f
V
= ±1.5V, C = 820pF (Figure 4)
Full
Full
500
200
-
-
kbps
ns
MAX
OD
D
Driver Single Ended Output
Delay
t
R
= 54Ω, C = 50pF (Figure 2)
340
500
SD
DIFF
D
Part-to-Part Output Delay Skew
t
R
R
= 54Ω, C = 50pF (Figure 2, Note 9)
Full
Full
-
-
-
300
150
ns
ns
SKPP
DIFF
D
Driver Single Ended Output
Skew
t
= 54Ω, C = 50pF (Figure 2)
30, 80
SSK
DIFF
D
Driver Differential Output Delay
Driver Differential Output Skew
t
R
R
R
= 54Ω, C = 50pF (Figure 2)
Full
Full
Full
200
-
345
2
500
30
ns
ns
ns
DD
DIFF
DIFF
DIFF
D
t
= 54Ω, C = 50pF (Figure 2)
D
DSK
Driver Differential Rise or Fall
Time
t , t
= 54Ω, C = 50pF (Figure 2)
200
350
800
R
F
D
Driver Enable to Output High
Driver Enable to Output Low
t
t
R = 500Ω, C = 50pF, SW = GND (Figure 3) Full
-
-
-
100, 60
60, 35
30, 22
250
250
60
ns
ns
ns
ZH
L
L
t
R = 500Ω, C = 50pF, SW = V
(Figure 3) Full
ZL
L
L
CC
Driver Disable from Output
High
R = 500Ω, C = 50pF, SW = GND (Figure 3) Full
HZ
L
L
Driver Disable from Output Low
t
R = 500Ω, C = 50pF, SW = V
CC
(Figure 3) Full
-
25, 20
60
ns
LZ
L
L
DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps)
Maximum Data Rate
f
V
= ±1.5V, C = 360pF (Figure 4)
Full
Full
25
20
15
-
-
29, 23
32
-
Mbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MAX
OD
D
Driver Single Ended Output
Delay
t
R
C
= 54Ω,
= 50pF (Figure 2)
V
V
V
V
= V
CC
42
SD
DIFF
L
L
L
L
D
≥ 1.8V
= 1.5V
= 1.35V
-
25
-
36
-
25
-
40
-
Part-to-Part Output Delay Skew
t
R
= 54Ω, C = 50pF (Figure 2, Note 9)
Full
Full
25
-
-
25
SKPP
DIFF
D
Driver Single Ended Output
Skew
t
R
C
= 54Ω,
= 50pF (Figure 2)
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= V
CC
-
3
7
SSK
DIFF
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
D
≥ 1.8V
= 1.5V
= 1.35V
-
3
-
25
-
4
-
25
-
5
-
Driver Differential Output Delay
Driver Differential Output Skew
t
R
C
= 54Ω,
= 50pF (Figure 2)
= V
CC
Full
25
-
29, 22
32
42
DD
DIFF
D
≥ 1.8V
= 1.5V
= 1.35V
-
-
25
-
36
-
25
-
42
-
t
R
C
= 54Ω,
= 50pF (Figure 2)
= V
= V
≤ 3.6V
Full
25
-
0.5
2
3
DSK
DIFF
CC
CC
D
= 5V
-
-
≥ 1.8V
≥ 1.5V
25
-
0.5, 1
1, 2
2, 4
9
-
-
25
-
= 1.35V
= V
25
-
-
Driver Differential Rise or Fall
Time
t , t
R
C
= 54Ω,
= 50pF (Figure 2)
Full
25
-
15
-
R
F
DIFF
CC
≥ 1.35V
D
-
9
Driver Enable to Output High
Driver Enable to Output Low
t
R = 500Ω, C = 50pF, SW = GND (Figure 3) Full
-
100, 60
60, 35
250
250
ZH
L
L
t
R = 500Ω, C = 50pF, SW = V
CC
(Figure 3) Full
-
ZL
L
L
FN6544.0
September 19, 2007
7
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Electrical Specifications Test Conditions: V = 3.0V to 5.5V; V = V (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
CC
CC
L
T
= +25°C; Unless Otherwise Specified. (Note 7) (Continued)
A
TEMP
(°C)
MIN
(Note 11)
TYP
(Note 13)
MAX
(Note 11) UNITS
PARAMETER
SYMBOL
TEST CONDITIONS
R = 500Ω, C = 50pF, SW = GND (Figure 3) Full
Driver Disable from Output
High
t
-
-
30, 22
25, 20
60
60
ns
HZ
L
L
Driver Disable from Output Low
NOTES:
t
R = 500Ω, C = 50pF, SW = V (Figure 3) Full
CC
ns
LZ
L
L
7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
8. Applies to peak current. See “Typical Performance Curves” on page 12 for more information.
9. t
is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (V
,
CC
SKPP
temperature, etc.).
10. If the driver enable function isn’t needed, connect DE to V
(or V ) through a 1kΩ to 3kΩ resistor.
L
CC
11. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
12. Due to the high short circuit current at V > 3.6V, the outputs must not be shorted outside the range of GND to V or damage may occur. To
CC
prevent excessive power dissipation that may damage the output, the short circuit current should be limited to ≤ 300mA during testing. It is best
to use an external resistor for this purpose, since the current limiting on the V supply may respond too slowly to protect the output.
CC
O
13. Typicals are measured at V
= 3.3V for parameters specified with 3V ≤ V
≤ 3.6V, and are measured at V
= 5V for parameters specified
CC
CC
≤ 5.5V. If V
CC
isn’t specified, then a single “TYP” entry applies to both V
with 4.5V ≤ V
= 3.3V and 5V, and two entries separated by a
CC
CC
= 3.3V and 5V, respectively.
CC
comma refer to V
CC
Test Circuits and Waveforms
R /2
L
375Ω
DE
DE
DI
V
OR V
V
OR V
CC
L
CC L
Z
Y
Z
Y
V
CM
DI
R
= 60Ω
V
V
OD
L
D
D
OD
-7V TO +12V
V
R /2
L
375Ω
OC
FIGURE 1B. V
WITH COMMON MODE LOAD
FIGURE 1A. V
AND V
OC
OD
OD
FIGURE 1. DC DRIVER TEST CIRCUITS
FN6544.0
September 19, 2007
8
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Test Circuits and Waveforms (Continued)
3V OR V
0V
L
DI
50%
SD1
50%
SD2
DE
DI
t
t
V
OR V
L
CC
V
OH
OUT (Z)
OUT (Y)
Z
Y
50%
50%
R
CD
DIFF
D
V
OL
t
t
DDLH
DDHL
SIGNAL
GENERATOR
+V
OD
90%
50%
10%
90%
50%
10%
DIFF OUT (Y - Z)
-V
OD
t
t
R
F
t
= |t
- t
SD1(Y) SD2(Y)
| OR |t
- t
SD1(Z) SD2(Z)
|
t
= |t
DSK
- t |
DDLH DDHL
SSK
FIGURE 2A. TEST CIRCUIT
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FIGURE 2B. MEASUREMENT POINTS
DE
DI
3V OR V
Z
Y
L
500Ω
V
CC
DE
50%
50%
HZ
D
GND
SW
SIGNAL
GENERATOR
0V
50pF
t
ZH
t
OUTPUT HIGH
50%
V
OH
V
- 0.25V
OH
OUT (Y, Z)
OUT (Y, Z)
PARAMETER
OUTPUT
Y/Z
DI
SW
0V
t
1/0
0/1
1/0
0/1
GND
HZ
t
t
Y/Z
V
ZL
t
LZ
LZ
CC
t
Y/Z
GND
V
ZH
CC
OL
t
Y/Z
V
50%
ZL
CC
V
+ 0.25V
V
OL
OUTPUT LOW
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
FIGURE 3B. MEASUREMENT POINTS
3V OR V
0V
DE
DI
L
V
OR V
L
CC
+
DI
Z
Y
V
C
54Ω
OD
-
D
D
+V
OD
SIGNAL
GENERATOR
DIFF OUT (Y - Z)
0V
-V
OD
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. DRIVER DATA RATE
FN6544.0
September 19, 2007
9
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Application Information
V
= +3.3V
V
= +2V
CC
CC
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transmitters and receivers are also RS-422 compliant.
RS-422 is a point-to-multipoint (multidrop) standard, which
allows only one driver and up to 10 (assuming one unit load
devices) receivers on each bus. RS-485 is a true multipoint
standard, which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 specification requires
that drivers must handle bus contention without sustaining
any damage.
V
V
≥ 2V
IH
IH
T
XD
DI
V
≤ 2V
≤ 2V
OH
≥ 2V
DEN
DE
V
OH
GND
GND
ISL3293E
= +3.3V
UART/PROCESSOR
= +2V
V
V
CC
CC
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
V
L
V
= 1.4V
V
T
IH
XD
DI
≤ 2V
≤ 2V
OH
V
= 1.4V
IH
DEN
DE
V
OH
GND
GND
Driver Features
These RS-485/RS-422 drivers are differential output devices
that delivers at least 1.5V across a 54Ω load (RS-485), and
at least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
ISL3296E
UART/PROCESSOR
FIGURE 5. USING V PIN TO ADJUST LOGIC LEVELS
L
Logic Supply (V Pin, ISL3296E through ISL3298E)
L
All drivers are tri-statable via the active high DE input. If the
Note: Power-up V
CC
before powering up the V supply.
L
Tx enable function isn’t needed, tie DE to V
(or V )
L
CC
through a 1kΩ to 3kΩ resistor.
The ISL3296E through ISL3298E include a V pin that
L
powers the logic inputs (DI and DE). These pins interface
with “logic” devices such as UARTs, ASICs, and µcontrollers,
and today most of these devices use power supplies
significantly lower than 3.3V. Thus, the logic device’s low
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI, and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL3295E and ISL3298E drivers are not limited, so faster
output transition times allow data rates of at least 20Mbps.
V
might not exceed the V of a 3.3V or 5V powered DI or
OH
IH
DE input. Connecting the V pin to the power supply of the
L
Wide Supply Range
logic device (as shown in Figure 5) reduces the DI and DE
input switching points to values compatible with the logic
device’s output levels. Tailoring the logic pin input switching
points and output levels to the supply voltage of the UART,
ASIC, or µcontroller eliminates the need for a level
shifter/translator between the two ICs.
The ISL3293E through ISL3298E are optimized for 3.3V
operation, but can be operated with supply voltages as high
as 5.5V. These devices meet the RS-422 and RS-485
specifications for supply voltages less than 4V, and are
RS-422 and RS-485 compatible for supplies greater than
4V. Operation at +125°C requires V
≤ 3.6V, while 5V
CC
V can be anywhere from V
down to 1.35V, but the input
L
CC
switching points may not provide enough noise margin, and
20Mbps data rates may not be achievable, when V < 1.5V.
operation requires adding output current limiting resistors
(as described in the “Driver Overload Protection” on
page 11) if output short circuits (e.g., from bus contention)
are a possibility.
L
Table 2 indicates typical V and V values for various V
IH IL
L
settings so the user can ascertain whether or not a particular
V voltage meets his needs.
L
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD nor parasitic
diodes to V
(nor to V ), so they withstand input voltages
CC
L
exceeding 5.5V regardless of the V
and V voltages.
L
CC
FN6544.0
September 19, 2007
10
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
TABLE 2. V AND V vs V FOR V
= 3.3V OR 5V
Twisted pair is the cable of choice for RS-485/RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
IH
IL
L
CC
V
(V)
V
(V)
V
(V)
IL
L
IH
1.35
1.5
0.7
0.8
0.9
1.1
1.3
1.5
2.7
0.4
0.5
0.7
1.0
1.1
1.4
2.3
1.8
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
2.3
2.7
3.3
5.0 (i.e., V
)
CC
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transmitter or
receiver to the main cable should be kept as short as
possible.
The V supply current (I ) is typically much less than 20µA,
L
L
as shown in Figure 9, when DE and DI are above/below
/V .
V
IH IL
Hot Plug Function
When a piece of equipment powers-up, there is a period of
time where the processor or ASIC driving the RS-485 control
line (DE) is unable to ensure that the RS-485 Tx outputs are
kept disabled. If the equipment is connected to the bus, a
driver activating prematurely during power up may crash the
bus. To avoid this scenario, the ISL329xE family
Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged.
incorporates a “Hot Plug” function. During power-up, circuitry
monitoring V ensures that the Tx outputs remain disabled for
CC
These drivers meet this requirement, for V
≤ 3.6V, via
CC
a period of time, regardless of the state of DE. This gives the
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.
driver output short circuit current limits, and on-chip thermal
shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
ESD Protection
exceeds the RS-485 specification, for V
≤ 3.6V, even at
All pins on these devices include class 3 (8kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs) incorporate advanced
structures allowing them to survive ESD events in excess
of ±16.5kV HBM and ±7kV to the IEC61000 contact test
method. The RS-485 pins are particularly vulnerable to
ESD damage because they typically connect to an exposed
port on the exterior of the finished product. Simply touching
the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether or not it is powered
up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection
eliminates the need for board level protection structures
(e.g., transient suppression diodes), and the associated,
undesirable capacitive load they present.
CC
the common mode voltage range extremes. Additionally,
these devices utilize a foldback circuit which reduces the
short circuit current, and thus the power dissipation,
whenever the contending voltage exceeds either V
GND.
or
CC
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about +20°C. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
At V
> 3.6V, the instantaneous short circuit current is high
enough that output stage damage may occur during short
CC
circuit conditions to voltages outside of GND to V , before
the short circuit limiting and thermal shutdown activate. For
CC
V
= 5V operation, if output short circuits are a possibility
CC
Data Rate, Cables, and Terminations
(e.g., due to bus contention), it is recommended that a 5Ω
resistor be inserted in series with each output. This resistor
limits the instantaneous current below levels that can cause
damage. The driver V
small added resistance has little impact.
RS-485/RS-422 are intended for network lengths up to
4000’, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 250kbps
versions can operate at full data rates with lengths of several
1000’.
at V
= 5V is so large that this
OD
CC
FN6544.0
September 19, 2007
11
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
High Temperature Operation
Due to power dissipation and instantaneous output short
circuit current levels at V = 5V, these transmitters may not
Low Power Shutdown Mode
These BiCMOS transmitters all use a fraction of the power
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent I
CC
be operated at +125°C with V
> 3.6V.
CC
CC
to a 1µA trickle. These devices enter shutdown whenever
the driver disables (DE = GND).
At V
CC
= 3.6V, even the SOT-23 versions may be operated
at +125°C, while driving a 100’, double terminated, CAT 5
cable at 20Mbps, without triggering the thermal SHDN
circuit.
Typical Performance Curves V = V = 3.3V, T = +25°C; Unless Otherwise Specified
CC
L
A
110
100
90
80
70
60
50
40
30
20
10
0
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
+85°C
R
= 100Ω
DIFF
+25°C
+125°C
R
= 54Ω
DIFF
+25°C
2.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
0
0.5
1.0
1.5
2.0
3.0
3.5
-40
10
60
TEMPERATURE (°C)
110 125
-15
35
85
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
40
100
90
80
70
60
50
40
30
20
10
V
CC
= 3.3V
35
30
25
20
15
10
5
V
= 3.3V
L
V
= 2.5V
L
V
≤ 2V
L
DE = V
85
= V
L
CC
0
0
-40
10
60
TEMPERATURE (°C)
110 125
-15
35
0
1
2
3
4
5
6
7 7.5
DI VOLTAGE (V)
FIGURE 8. SUPPLY CURRENT vs TEMPERATURE
FIGURE 9.
V
SUPPLY CURRENT vs LOGIC PIN VOLTAGE
L
FN6544.0
September 19, 2007
12
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Typical Performance Curves V = V = 3.3V, T = +25°C; Unless Otherwise Specified (Continued)
CC
L
A
1250
1225
1200
1175
1150
1125
1100
1075
1050
700
600
500
400
300
200
100
0
V
= 1.35V TO V
CC
t
L
DDLH
t
SSK
t
DDHL
V
= 1.35V TO V
CC
L
t
DSK
-40
10
60
TEMPERATURE (°C)
110 125
-15
35
85
-40
-15
10
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 10. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3293E, ISL3296E)
FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL3293E,
ISL3296E)
60
390
V = 1.35V to V
L CC
V
= 1.35V TO V
L
CC
50
40
30
20
10
0
380
370
360
350
340
330
t
SSK
t
DDHL
t
DDLH
t
DSK
-40
-15
10
35
60
85
110 125
-40
-15
10
35
60
85
110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL3294E,
FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3294E, ISL3297E)
ISL3297E)
50
4.5
4.0
3.5
3.0
45
V
= 1.35V, t
DDLH
L
V
= 1.35V, t
DDHL
L
40
35
30
25
20
V
= 1.5V, t
, t
DDLH DDHL
L
V
= 1.35V
= 1.5V
L
2.5
2.0
1.5
1.0
0.5
0
V
= 1.8V, t
, t
L
DDLH DDHL
V
L
V
= V , t
, t
L
CC DDLH DDHL
V
≥ 1.8V
L
-40
-15
10
35
60
85
110 125
-40
-15
10
35
60
85
110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3295E, ISL3298E)
FIGURE 15. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3295E, ISL3298E)
FN6544.0
September 19, 2007
13
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Typical Performance Curves V = V = 3.3V, T = +25°C; Unless Otherwise Specified (Continued)
CC
L
A
200
150
100
50
6
5
4
3
2
1
0
ISL3295E/ISL3298E
OTHER ISL329xE
V
= 1.35V
L
V
= 1.5V
Y OR Z = LOW
L
0
V
≥ 1.8V
L
-50
-100
-150
Y OR Z = HIGH
ISL329xE
-7 -6 -4
-2
0
2
4
6
8
10
12
-40
-15
10
35
60
85
110 125
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 16. DRIVER SINGLE ENDED SKEW vs
TEMPERATURE (ISL3295E, ISL3298E)
R
= 54Ω, C = 50pF
D
R
= 54Ω, C = 50pF
D
DIFF
DIFF
3
0
3
0
DI
Z
DI
Y
3.0
1.5
3.0
1.5
Y
Z
0
0
3
2
3
2
1
1
Y - Z
0
0
Y - Z
-1
-2
-3
-1
-2
-3
TIME (400ns/DIV)
TIME (400ns/DIV)
FIGURE 18. DRIVER WAVEFORMS, LOW TO HIGH
(ISL3293E, ISL3296E)
FIGURE 19. DRIVER WAVEFORMS, HIGH TO LOW
(ISL3293E, ISL3296E)
R
= 54Ω, C = 50pF
D
R
= 54Ω, C = 50pF
D
DIFF
DIFF
3
0
3
0
DI
Y
DI
Z
3.0
1.5
3.0
1.5
Y
Z
0
0
3
2
3
2
1
1
Y - Z
0
0
Y - Z
-1
-2
-3
-1
-2
-3
TIME (200ns/DIV)
TIME (200ns/DIV)
FIGURE 21. DRIVER WAVEFORMS, HIGH TO LOW
FIGURE 20. DRIVER WAVEFORMS, LOW TO HIGH
(ISL3294E, ISL3297E)
(ISL3294E, ISL3297E)
FN6544.0
September 19, 2007
14
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Typical Performance Curves V = V = 3.3V, T = +25°C; Unless Otherwise Specified (Continued)
CC
L
A
R
= 54Ω, C = 50pF
R
= 54Ω, C = 50pF
DIFF D
DIFF
D
3
0
3
0
DI
Z
DI
Y
3.0
1.5
3.0
1.5
Y
Z
0
0
3
2
3
2
1
1
Y - Z
Y - Z
0
0
-1
-2
-3
-1
-2
-3
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 23. DRIVER WAVEFORMS, HIGH TO LOW
FIGURE 22. DRIVER WAVEFORMS, LOW TO HIGH
(ISL3295E, ISL3298E)
(ISL3295E, ISL3298E)
V
= 1.35V
R
= 54Ω, C = 50pF
D
V
= 1.35V
DI
R
= 54Ω, C = 50pF
DIFF D
L
DIFF
L
3
0
3
0
DI
3.0
1.5
3.0
1.5
Z
Y
Y
Z
0
0
3
2
3
2
1
1
Y - Z
0
0
Y - Z
-1
-2
-3
-1
-2
-3
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 24. DRIVER WAVEFORMS, LOW TO HIGH
(ISL3295E, ISL3298E)
FIGURE 25. DRIVER WAVEFORMS, HIGH TO LOW
(ISL3295E, ISL3298E)
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
TRANSISTOR COUNT:
516
PROCESS:
Si Gate BiCMOS
FN6544.0
September 19, 2007
15
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Small Outline Transistor Plastic Packages (SOT23-6)
VIEW C
P6.064
0.20 (0.008)
C
M
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
C
L
INCHES
MIN
MILLIMETERS
e
b
6
SYMBOL
MAX
0.057
0.0059
0.051
0.020
0.018
0.009
0.008
0.118
0.118
0.068
MIN
0.90
0.00
0.90
0.30
0.30
0.08
0.08
2.80
2.60
1.50
MAX
1.45
0.15
1.30
0.50
0.45
0.22
0.20
3.00
NOTES
A
A1
A2
b
0.036
0.000
0.036
0.012
0.012
0.003
0.003
0.111
0.103
0.060
-
-
-
-
5
2
4
3
C
L
E1
C
E
L
1
b1
c
6
6
3
-
e1
C
c1
D
D
C
L
E
3.00
1.75
0.95 Ref
1.90 Ref
0.35 0.55
E1
e
3
-
SEATING
PLANE
0.0374 Ref
0.0748 Ref
0.014 0.022
A2
A1
A
e1
L
-
-C-
4
L1
L2
N
0.024 Ref.
0.010 Ref.
6
0.60 Ref.
0.25 Ref.
6
0.10 (0.004)
C
5
b
WITH
R
0.004
-
0.10
-
PLATING
b1
R1
α
0.004
0.010
0.10
0.25
c
c1
o
o
o
o
0
8
0
8
-
Rev. 3 9/03
BASE METAL
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC-74 and JEDEC MO178AB.
4X θ1
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
R1
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
R
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
GAUGE PLANE
SEATING
PLANE
L
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
C
α
L2
L1
4X θ1
VIEW C
FN6544.0
September 19, 2007
16
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Thin Dual Flat No-Lead Plastic Package (TDFN)
2X
L8.2x3A
0.15
C A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
A
D
2X
MILLIMETERS
0.15
C B
SYMBOL
MIN
0.70
NOMINAL
MAX
0.80
NOTES
A
A1
A3
b
0.75
-
-
0.20
1.50
1.65
-
0.20 REF
0.25
0.05
-
E
-
6
INDEX
AREA
0.32
1.75
1.90
5,8
D
2.00 BSC
1.65
-
B
A
D2
E
7,8
TOP VIEW
3.00 BSC
1.80
-
// 0.10
0.08
C
E2
e
7,8
0.50 BSC
-
-
C
k
0.20
0.30
-
-
SIDE VIEW
A3
C
SEATING
PLANE
L
0.40
0.50
8
N
8
2
D2
D2/2
2
7
8
Nd
4
3
(DATUM B)
Rev. 0 6/04
NOTES:
1
NX k
6
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
INDEX
AREA
3. Nd refers to the number of terminals on D.
(DATUM A)
E2
4. All dimensions are in millimeters. Angles are in degrees.
E2/2
5. Dimension b applies to the metallized terminal and is measured
between 0.25mm and 0.30mm from the terminal tip.
NX L
8
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
N
N-1
e
NX b
5
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
0.10
M
C A B
(Nd-1)Xe
REF.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
BOTTOM VIEW
C
L
(A1)
NX (b)
5
L
SECTION "C-C"
C
C
TERMINAL TIP
e
FOR EVEN TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6544.0
September 19, 2007
17
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