ISL37231DRAZ-TS [INTERSIL]

10.3125 Gb/s Retiming Dual-Channel Transceiver;
ISL37231DRAZ-TS
型号: ISL37231DRAZ-TS
厂家: Intersil    Intersil
描述:

10.3125 Gb/s Retiming Dual-Channel Transceiver

接口集成电路
文件: 总9页 (文件大小:320K)
中文:  中文翻译
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10.3125 Gb/s Retiming Dual-Channel Transceiver  
ISL37231  
Features  
• Industry’s lowest power and highest performance  
10.3125Gbps active cable solution for STP and twin-axial  
cables  
The ISL37231 is an advanced dual-channel, dual-simplex  
retimer for active copper cable applications. Endowed with  
sophisticated functions, such as media optimized (PCB or  
Cable) and adaptive equalization, de-emphasis, and signal  
retiming, this IC fortifies sensitive links that break with lesser  
retiming solutions. The device contains high performance  
mixed signal processing technology to provide a maximally  
robust signal integrity solution for datacenter and consumer  
applications. Such processing includes up to 25dB of  
media-optimized equalization and versatile retiming  
capabilities to reset link jitter budgets.  
• Supports 64b/66b encoding  
• Fully retimed low jitter outputs  
• Up to 16.5dB of adjustable (or adaptive) receiver-side  
equalization  
• 9dB output de-emphasis  
• Supports independent SSC on each channel  
• On-chip microcontroller and eye monitor  
• Multiple loopback modes  
The ISL37231 provides this high level of performance while  
significantly reducing power consumption relative to other  
active cable solutions. At well below 500mW, the operating  
power is the lowest in class, and a sleep mode function can be  
invoked to reduce the power to a miniscule 3mW.  
• Low power (<420mW) operation with 3mW sleep mode  
• Ultra-small 5mmx5mm aQFN package  
To facilitate ease of system integration, the ISL37231 provides  
advanced diagnostic capabilities in the form of loopback and  
high-resolution on-chip eye monitor functions, both accessed  
via a UART interface.  
Applications  
• Thunderboltactive cables  
• Proprietary high-speed active cable assemblies  
The ISL37231 is optimized to work in conjunction with the  
ISL80083 power management IC, however, it will also operate  
with appropriate discrete components (voltage regulators and  
a 33Mhz crystal oscillator).  
Benefits  
• Thinner gauge cable  
• Extends cable reach  
• Improved BER  
ACTIVE CABLE  
CABLE CONNECTOR  
ISL37231  
CABLE CONNECTOR  
CABLE MEDIA  
ISL37231  
EQ CDR  
TX1  
RX1  
EQ CDR DE  
AI1  
DE  
AO1  
BI1  
BI1  
AO1  
BI2  
BO1  
DE  
CDR EQ  
CDR EQ  
DE  
RX1  
TX2  
BO1  
AI2  
AI1  
TX1  
RX2  
EQ CDR  
EQ CDR  
DE  
AO2  
BI2  
DE BO2  
CDR EQ  
µC  
DE CDR EQ  
AI2  
DE  
AO2  
BO2  
TX2  
RX2  
GND  
GND  
µC  
PWR  
PWR  
ISL80083  
EEPROM  
EEPROM  
ISL80083  
FIGURE 1. TYPICAL APPLICATION  
January 25, 2013  
FN8266.1  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2012, 2013. All Rights Reserved  
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.  
All other trademarks mentioned are the property of their respective owners.  
1
ISL37231  
Ordering Information  
PART NUMBER  
(Notes 2, 3)  
PART  
MARKING  
TEMP. RANGE  
(°C)  
PACKAGE  
(Pb-free)  
PKG.  
DWG. #  
ISL37231DRAZ-TS (Note 1)  
ISL37231DRAZ-T7 (Note 1)  
ISL37231DRAZ  
ISL372 31DRAZ  
0 to +85  
0 to +85  
0 to +85  
69 Ld High Density Array (aQFN)  
package (7” 100 pcs.)  
C69.5x5B  
ISL372 31DRAZ  
ISL372 31DRAZ  
69 Ld High Density Array (aQFN)  
package (7” 1k pcs.)  
C69.5x5B  
C69.5x5B  
69 Ld High Density Array (aQFN)  
package  
NOTES:  
1. Please refer to TB347 for details on reel specifications.  
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate  
- e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020  
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL37231. For more information on MSL please see techbrief TB363.  
Pin Configuration  
ISL37231  
(69 LD aQFN)  
TOP VIEW  
A42  
A41  
A40  
A39  
A38  
A37  
A36  
A35  
A34  
A33  
A32  
A31  
A30  
A29  
A28  
A27  
A26  
A25  
A24  
A23  
A22  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
A11  
B27  
B26  
B25  
R4  
B24  
B23  
B22  
B21  
R3  
B20  
B19  
B1  
B2  
B3  
B4  
B5  
B18  
B17  
B16  
B15  
EXPOSED PAD  
R1  
R2  
B6  
B7  
B8  
B9  
B10  
B11  
B12  
B13  
B14  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
A20  
A21  
FN8266.1  
January 25, 2013  
2
ISL37231  
Pin Functions and Definitions  
PIN NAME  
PIN NUMBER  
DIRECTION  
DESCRIPTION  
High-speed differential input for on-ramp (device to cable) Channel 1, CML. The use of series  
220nF, low ESL/ESR, MLCC capacitors with at least 8GHz frequency response is recommended.  
AIN1[P,N]  
A1, A42  
Input  
A2, A10, A13, A16,  
A17, A20, A23, A30,  
A31, A34, A37, A38,  
A41, B4, B6, B7, B16,  
B19, B20, B26, B27,  
Exposed Pad  
Ground. For proper electrical and thermal performance, each of these pads must be connected  
to the PCB ground plane. For the exposed pad, 3x5 or 4x5 via pattern is recommended,  
assuming 0.004" diameter vias.  
GND  
External 33MHz crystal oscillator input/output. An external 33MHz clock source (1V CMOS logic  
level) can optionally be connected XTALP, in which case XTALN must be left floating. A  
differential 33MHz clock source (1V CMOS logic levels) can be input on XTALP and XTALN if  
OSCMODE (pin A29) is pulled high to 1.8V.  
XTAL[P,N]  
A3, B1  
Input  
Auxiliary UART output 1. AUTX1 can be configured via the on-chip microcontroller as either a  
UART output or a GPIO pin, with either 1.8V push-pull or 3.3V tolerant open drain voltage levels.  
AUTX1  
AURX1  
EEWE  
A4  
A5  
A6  
Output  
Input  
Auxiliary UART data input 1, 1.8V powered CMOS logic tolerant to 3.3V.  
EEPROM write enable open drain output. Externally pulled high to 3.3V via a 5kresistor.  
Output  
Pulled low when the ISL37231 writes to an external EEPROM device via the I2C serial interface.  
Thunderbolt CONFIG2 indicator output. 1.8V powered CMOS logic. Pulled high after the  
ISL37231 is powered up and stable to indicate to a Thunderbolt controller that a Thunderbolt  
cable has been plugged in.  
CFIG2  
A7  
Output  
Oscillator enable. CMOS logic, 1.8V. Used as a deep-sleep state indicator. During normal  
operation, OSCEN is pulled high. When entering deep-sleep mode, OSCEN is pulled low. Output  
is not pulled high again until transitions are detected on the URX input pin (A27).  
OSCEN  
AUTX2  
A8  
A9  
Auxiliary UART output 2. AUTX2 can be configured via the on-chip microcontroller as either a  
UART output or a GPIO pin, with either 1.8V push-pull or 3.3V tolerant open drain voltage levels.  
Output  
Input  
High-speed differential input for off-ramp (cable to device) Channel 1, CML. The use of series  
220nF, low ESL/ESR, MLCC capacitors with at least 8GHz frequency response is recommended.  
(Note 4)  
BIN1[P,N]  
A11, A12  
High-speed differential output for off-ramp (cable to device) Channel 1, CML. The use of series  
220nF, low ESL/ESR, MLCC capacitors with at least 8GHz frequency response is recommended.  
BOUT1[N,P]  
BOUT2[P,N]  
A14, A15  
A18, A19  
Output  
Output  
High-speed differential output for off-ramp (cable to device) Channel 2, CML. The use of series  
220nF, low ESL/ESR, MLCC capacitors with at least 8GHz frequency response is recommended.  
High-speed differential input for off-ramp (cable to device) Channel 2, CML. The use of series  
220nF, low ESL/ESR, MLCC capacitors with at least 8GHz frequency response is recommended.  
(Note 4)  
BIN2[N,P]  
A21, A22  
Input  
Level shift enable output. 1.8V powered CMOS logic. Pulled high to indicate an operational UART  
interface to the ISL37231. When pulled low, UTX (pin A28) is set to a high impedance state.  
Serial interface clock. Open drain output, externally pulled high to 3.3V via a 5kresistor. I2C  
LSEN  
SCL  
A24  
A25  
A26  
A27  
Output  
clock, recommended clock speed is 400kHz.  
Serial interface data. Open drain output, externally pulled high to 3.3V via a 5kresistor.  
SDA  
URX  
Bi-directional data from/to I2C bus.  
UART data input. 1.8V powered CMOS logic, but URX is 3.3V tolerant. When the ISL37231 is in  
“Sleep” mode, a H to L transition on URX causes the ISL37231 to drive OSCEN high.  
Input  
UART data tri-statable output. 1.8V powered CMOS logic. UTX is set to a high impedance state  
when the UART interface is not in use and LSEN is pulled low. If UTX interfaces to a 3.3V powered  
UART, then a level translator IC may be needed.  
UTX  
A28  
A29  
Output  
Oscillator mode. CMOS logic, 1.8V, internally pulled low. When OSCMODE is low, the XTALP and  
XTALN input pins (A3 and B1) are configured for operation with an external crystal or with an  
external single-ended clock on XTALP (XTALN must be left floating in this latter case). When  
OSCMODE is pulled high, the XTALP and XTALN input pins are configured for operation with an  
external differential clock.  
OSCMODE  
Input  
FN8266.1  
January 25, 2013  
3
ISL37231  
Pin Functions and Definitions(Continued)  
PIN NAME  
PIN NUMBER  
DIRECTION  
DESCRIPTION  
High-speed differential input for on-ramp (PCB to cable) Channel 2, CML. The use of series  
220nF, low ESL/ESR, MLCC capacitors with at least 8GHz frequency response is recommended.  
AIN2[P,N]  
A32, A33  
Input  
AOUT2[N,P]  
AOUT1[P,N]  
A35, A36  
A39, A40  
Output  
Output  
High-speed differential output for on-ramp (PCB to cable) Channel 2, CML. (Note 4)  
High-speed differential output for on-ramp (PCB to cable) Channel 1, CML. (Note 4)  
B2, R1, R2, R3, R4  
(Note 5)  
1.0V analog supply voltage. The use of parallel 100pF and 10nF decoupling capacitors to ground  
is recommended for each of these pins/rails for broad high-frequency noise suppression.  
AVDD1  
AVDD18  
NC  
1.8V analog supply voltage. The use of parallel 100pF and 10nF decoupling capacitors to ground  
is recommended for this pin for broad high-frequency noise suppression.  
B3  
B4, B6, B7, B13, B14,  
B19, B20, B26, B27  
No connection. Do not connect to these pins.  
1.0V digital supply voltage. The use of parallel 100pF and 10nF decoupling capacitors to ground  
is recommended for these pins for broad high-frequency noise suppression.  
DVDD  
B5, B15  
VDDPLLB1  
REFRETB1  
REXT2  
B8  
B9  
1.8V analog supply voltage for off-ramp Channel 1.  
VDDPLL reference return path for off-ramp Channel 1.  
External reference resistor connection. Recommended value of 1.18k.  
VDDPLL reference return path for off-ramp Channel 2.  
1.8V analog supply voltage for off-ramp Channel 2.  
B10  
B11  
B12  
B16  
REFRETB2  
VDDPLLB2  
AURX2  
Input  
Input  
Auxiliary UART input 2. CMOS logic, 1.8V (tolerant to 3.3V).  
1.8V digital supply voltage. The use of parallel 100pF and 10nF decoupling capacitors to ground  
is recommended for each of these pins for broad high-frequency noise suppression.  
VDDPST  
B17  
RESET  
B18  
B21  
B22  
B23  
B24  
B25  
CMOS logic input. 1.8V powered. Resets all internal registers and memory when pulled low.  
1.8V analog supply voltage for on-ramp Channel 2.  
VDDPLLA2  
REFRETA2  
REXT1  
VDDPLL reference return path for on-ramp Channel 2.  
External reference resistor connection. Recommended value of 1.18k.  
VDDPLL reference return path for on-ramp Channel 1.  
REFRETA1  
VDDPLLA1  
1.8V analog supply voltage for on-ramp Channel 1.  
NOTES:  
4. Series coupling capacitors are required at one end of the cable. For best results, place the capacitors at the receiver end of the cable. The use of  
220nF low ESL/ESR MLCC capacitors with at least 8GHz frequency response is recommended.  
5. Each power bar is independent, so they must all connect to the same 1V supply for proper circuit operation.  
FN8266.1  
January 25, 2013  
4
ISL37231  
Absolute Maximum Ratings  
Thermal Information  
Supply Voltage (VDD to GND, 1.0V Rails) . . . . . . . . . . . . . . . . . . . . . . . . 1.1V  
Supply Voltage (VDD to GND, 1.8V Rails) . . . . . . . . . . . . . . . . . . . . . . . 1.98V  
1V Pin Input Voltage (AIN, BIN, XTALP) . . . . . . . . . . . . . . . . . . . . . . . . . 1.1V  
1.8V Pin Input Voltage (all non 3.3V tolerant logic inputs) . . . . VDD + 0.2V  
3.3V Tolerant I/O Pin Voltage (EEWE, SCLK, SDA, URX, AUTX, AURX,  
RESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6V  
ESD Ratings  
Thermal Resistance (Typical)  
69 Ld aQFN Package (Notes 6, 7) . . . . . . .  
Operating Ambient Temperature Range. . . . . . . . . . . . . . . . 0°C to +85°C  
Storage Ambient Temperature Range. . . . . . . . . . . . . . . -55°C to +150°C  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C  
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
θ
JA (°C/W)  
31.8  
θ
JC (°C/W)  
2.5  
Human Body Model (All Pins) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.25kV  
Charged Device Model (All Pins). . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0kV  
Machine Model (All Pins). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V  
Latch-up (per JEDEC JESD78, Level 2, Class A) . . . . . . . . . . . . . . . . +85°C  
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product  
reliability and result in failures not covered by warranty.  
NOTE:  
6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech  
Brief TB379.  
7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.  
Operating Conditions Boldface limits apply across the operating temperature range, 0°C to +85°C.  
MIN  
MAX  
PARAMETER  
1.0V Supply Voltage  
SYMBOL  
CONDITION  
(Note 12)  
TYP  
1.0  
(Note 12)  
UNITS  
V
AVDD1,  
DVDD  
0.95  
1.71  
1.05  
1.89  
1.8V Supply Voltage  
AVDD18,  
VDDPLL,  
VDDPST  
1.8  
V
Operating Ambient Temperature  
Baud Rate  
TA  
0
25  
85  
°C  
NRZ data applied to any channel  
9.95  
10.3125  
10.4  
Gbps  
Logic I/O Specifications Boldface limits apply across the operating temperature range, 0°C to +85°C.  
MIN  
MAX  
PARAMETER  
Input Leakage Current  
SYMBOL  
ILEAK  
CONDITION  
(Note 12)  
TYP  
0.1  
(Note 12)  
UNITS  
µA  
Pins URX, AURX1, AURX2, RESET  
-1  
1
Pull-down Resistor Current  
Input HIGH Voltage  
IPULLDOWN OSCMODE. VIN = VDD18  
103  
µA  
VIH  
Pins URX, AURX1, AURX2, RESET,  
2
0
3.4  
0.7  
V
OSCMODE  
Input LOW Voltage  
VIL  
Pins URX, AURX1, AURX2, RESET,  
OSCMODE  
V
Output LOW Voltage  
Output High Voltage  
VOL  
VOH  
IOL = 2mA  
IOH = 2mA  
0
0.4  
V
V
1.4  
VDD18  
FN8266.1  
January 25, 2013  
5
ISL37231  
Electrical Characteristics TA = +25°C, VDD1 = 1.0V, VDD18 = 1.8V, unless otherwise noted  
MIN  
MAX  
PARAMETERS  
SYMBOL  
IDD1  
CONDITION  
(Note 12)  
TYP  
430  
(Note 12) UNITS  
NOTES  
1.0V Supply Current  
(Combination of all 1V  
Supplies)  
Both lanes active, after equalizer has trained  
and is static, no eye monitors enabled  
510  
mA  
No lanes active, but microcontroller awake  
Sleep Mode  
85  
4
150  
mA  
mA  
mA  
8
1.8V Supply Current  
(Combination of all 1.8V  
Supplies)  
IDD18  
Both lanes active, after equalizer has trained  
and is static, no eye monitors enabled  
55  
20  
25  
No lanes active, but microcontroller awake  
Sleep Mode  
9
330  
-10  
-6  
mA  
µA  
dB  
dB  
dB  
dB  
8
9
9
9
9
Return Loss Limit  
(Differential)  
S
DD11  
0.05GHz to 2GHz  
S
DD22  
2GHz to 5.2GHz  
5.2GHz to 7GHz  
-5  
Return Loss Limit (Common  
Mode)  
SCC11  
CC22  
10MHz to 5GHz  
-5  
-20  
6
S
Return Loss Limit (Diff. to  
Com. Conversion)  
SCD11  
CD22  
10MHz to 5GHz  
dB  
dB  
dB  
dB  
dB  
9
S
Input Equalization Range  
EQ gain at 5GHz compared to DC. Set to  
minimum gain  
10  
10  
EQ gain at 5GHz compared to DC. Set to  
maximum gain  
16.5  
1.5  
Input Equalization  
Increment  
10 steps covering the Equalization range  
Output De-Emphasis Level  
Range  
Off-ramp channels optimized for PCB  
dielectric loss. On-ramp channels optimized  
for cable skin loss. Minimum setting  
0
9
Off-ramp channels optimized for PCB  
dielectric loss. On-ramp channels optimized  
for cable skin loss. Maximum setting  
dB  
dB  
De-Emphasis Increment  
1
3
Number of De-Emphasis  
Taps  
11  
Output Differential  
Amplitude Range  
VOUT  
Minimum drive setting  
Maximum drive setting  
15 Uniform Steps  
200  
950  
mVP-P  
mVP-P  
mVP-P  
Output Differential  
Amplitude Increment  
50  
45  
5
Output Transition Time  
tr, tf  
20% to 80%  
ps  
Jitter Transfer Function  
Bandwidth  
MHz  
Total Output Jitter  
1E-13 BER; PRBS-31; no low frequency input  
periodic jitter  
UIP-P  
%
0.3  
0.5  
SSC Down Spreading  
Amplitude Tolerance  
SSC Modulation Rate  
Tolerance  
kHz  
33-37  
NOTES:  
8. The specified Sleep Mode currents can only be achieved when the ISL37231 is used in conjunction with the ISL80083 power management IC.  
9. Measured with a Vector Network Analyzer with 100-diff impedance and the ISL37231 input/output impedance at setting 0x07 (i.e. 100-diff).  
10. The equalization response includes all effects starting from the IC input pins up to the output of the equalization stage.  
11. Three de-emphasis taps composed of: 1 pre-cursor + main + 1 post-cursor.  
12. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.  
FN8266.1  
January 25, 2013  
6
ISL37231  
Loopback  
Operation  
To facilitate system diagnostics, a loopback mode is available for  
each signal direction. In particular, for each lane, two loopback  
paths are provided:  
The ISL37231 is a robust signal conditioner that ensures  
maximum performance across a variety of time-varying and  
unpredictable environments. Endowed with functions, such as  
transmit and receive equalization, signal retiming, and  
programmable impedance termination, this IC fortifies sensitive  
links that break with other retiming-based solutions. To facilitate  
systems analysis, the ISL37231 additionally provides visibility of  
link conditions by way of loopback modes, PRBS generators with  
error counters, and an on-chip eye-monitor.  
• Near-End/PCB Loopback: The received on-ramp signal is  
directed back into the off-ramp output driver. This includes  
PCB equalization, limiting, retiming, and PCB de-emphasis.  
• Far-End/Cable Loopback: The received off-ramp signal is  
directed back into the on-ramp output driver. This includes  
cable equalization, limiting, retiming, and cable de-emphasis.  
Equalization  
The ISL37231 equalizes each received signal with a highly  
adjustable equalizer.  
Eye Monitor  
For accurate and detailed analysis of signal integrity, each  
channel in the ISL37231 can provide an on-chip eye-diagram of  
its respective equalizing filter output. This eye diagram can be  
used to evaluate jitter and eye height at the input of the retime  
circuit’s slicer.  
Each received signal is equalized with a five stage  
continuous-time linear filter that can be optimized for either  
copper cable skin loss or dielectric loss. The amount of  
equalization is selectable between 0dB and 16.5dB of  
compensation in increments of 1.5dB. Because the filter is  
phase/jitter-optimized, the maximum 16.5dB compensation  
level yields very low jitter for its targeted 2m (~20dB) 34AWG  
cable length.  
The eye monitor (in conjunction with the on-chip microcontroller)  
generates up to a 50 pixel x 50 pixel resolution eye-diagram (i.e.  
down to 0.02 UI resolution in the time domain and 12mV  
resolution in the voltage domain) that can be read over the UART  
interface. The output eye diagram represents an estimated  
probability density function for the equalized signal under  
investigation.  
In addition to supporting a wide variety of programmable  
settings, all channel equalizers can be trained upon power up to  
minimize jitter. The training of all channels is completed within  
2.5ms of receiving valid data on the input ports after power up.  
Besides providing a full eye-diagram, the Eye-Monitor can also be  
directed to output only the temporal and/or voltage eye-opening  
for a more concise signal fidelity assessment (i.e., jitter and eye  
height, respectively).  
Retiming  
To provide maximum system robustness, the ISL37231 retimes  
each of the four data paths in the device prior to output. With  
independent PLLs for each channel, the device can operate each  
channel with asynchronous baud rates thereby permitting a high  
degree of system flexibility. Examples where such flexibility is  
crucial include independent or staggered SSC rates across  
different channels and asymmetric transmission where up and  
down-stream channels operate at different baud rates.  
Polarity Inversion  
To accommodate uncertainty in signal polarity (as may be  
associated with differential cable receive pairs), each channel  
can be independently programmed to invert its polarity.  
On-Chip Microcontroller  
An internal microcontroller is used to manage the operation of  
the ISL37231.  
Each retimer has high input jitter tolerance and can output less  
than 0.3UI of total jitter (provided the inherent RJ of the test  
equipment is de-embedded and no input low-frequency periodic  
jitter is present).  
The microcontroller communicates with the system host over a  
UART interface. Because the ISL37231 UART interface operates  
at 1.8V, an interfacing IC (such as the ISL80083) is required for  
applications needing 3.3V levels and tri-state (push/pull/no-load)  
operation.  
Output De-Emphasis  
The drive level output of any channel is adjustable from 200 to  
950mVppd rail-to-rail (170 to 807.5mVppd eye height) in 16  
equal increments.  
The microcontroller also includes an I2C interface where the  
ISL37231 serves as the master. This I2C bus is used to:  
Each driver supports output equalization with one tap of  
pre-cursor and one tap of post-cursor de-emphasis. The gains on  
the pre and post-cursor taps are adjustable between 0 and -1  
relative to the main tap in increments of 1/128. The output  
amplitude and de-emphasis for each channel can be  
independently programmed to accommodate routing variation  
between lanes.  
• Instruct a power-regulator providing the 1.0V supply that the  
system is entering sleep mode and power can be removed  
from non-critical 1.0V rails for maximum power savings during  
sleep state.  
• Load firmware from an external EEPROM.  
FN8266.1  
January 25, 2013  
7
ISL37231  
Intersil Lane Extenders allow greater reach over existing cabling  
About Q:ACTIVE® Technology  
while reducing the need for thicker cables. This significantly  
reduces cable weight and clutter, increases airflow, and improves  
power consumption.  
Intersil has long realized that to enable the complex server  
clusters of next generation data centers, it is critical to manage  
the signal integrity issues of electrical interconnects. To address  
this, Intersil has developed its groundbreaking Q:ACTIVE®  
product line. By integrating its analog ICs inside cabling  
interconnects, Intersil is able to achieve unsurpassed  
improvements in reach, power consumption, latency, and cable  
gauge size as well as increased airflow in tomorrow’s data  
centers. This new technology transforms passive cabling into  
intelligent “roadways” that yield lower operating expenses and  
capital expenditures for the expanding datacenter.  
Revision History  
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you  
have the latest revision.  
DATE  
REVISION  
FN8266.1  
FN8266.0  
CHANGE  
January 17, 2013  
December 19, 2012  
Changed TYP values for “IDD1” on page 6.  
Initial release  
About Intersil  
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management  
semiconductors. The company's products address some of the fastest growing markets within the industrial and infrastructure,  
personal computing and high-end consumer markets. For more information about Intersil or to find out how to become a member of  
our winning team, visit our website and career page at www.intersil.com.  
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page.  
Also, please check the product information page to ensure that you have the most updated datasheet: ISL37231  
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff  
Reliability reports are available from our website at: http://rel.intersil.com/reports/search.php  
For additional products, see www.intersil.com/product_tree  
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted  
in the quality certifications found at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time  
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be  
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third  
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN8266.1  
January 25, 2013  
8
ISL37231  
Package Outline Drawing  
C69.5x5B  
69 LEAD aQFN 5X5 PACKAGE WITH 0.40 PITCH  
Rev 1, 12/12  
MILLIMETER  
INCH  
SYMBOL MIN NOM. MAX  
MIN NOM. MAX  
D
A
B
A
A3  
A2  
A1  
b
-
-
0.85  
-
-
0.033  
A
C
C
PIN 1  
CORNER  
A2  
0.020 0.050 0.080 0.001 0.002 0.003  
0.640 0.675 0.710 0.025 0.027 0.028  
0.120 0.130 0.140 0.005 0.005 0.006  
0.170 0.200 0.230 0.007 0.008 0.009  
4.900 5.000 5.100 0.193 0.197 0.201  
2.780 2.880 2.980 0.109 0.113 0.117  
4.900 5.000 5.100 0.193 0.197 0.201  
1.940 2.040 2.140 0.076 0.080 0.084  
A1  
D
E
D2  
E
E2  
eT  
eR  
K
eee C  
A3  
0.400  
0.400  
0.016  
0.016  
aaa C  
aaa C  
ccc C  
C
TOP VIEW  
0.200 0.250 0.300 0.008 0.010 0.012  
0.160 0.210 0.260 0.006 0.008 0.010  
0.160 0.210 0.260 0.006 0.008 0.010  
0.230 0.280 0.330 0.009 0.011 0.013  
0.260 0.310 0.360 0.010 0.012 0.014  
0.330 0.380 0.430 0.013 0.015 0.017  
0.150 0.180 0.210 0.006 0.007 0.008  
TOLERANCES OF FORM AND POSITION  
SECTION C-C  
K1  
L1  
L2  
S1  
S2  
W
eT  
eR  
2.50 PKG.  
aaa  
bbb  
ddd  
ccc  
eee  
fff  
0.100  
0.100  
0.050  
0.100  
0.100  
0.100  
0.004  
0.004  
0.002  
0.004  
0.004  
0.004  
2.12  
2.00  
1.72  
1.60  
1.41  
1.23  
1.20  
A12 A13 A14 A15 A16 A17 A18 A19 A20 A21  
B6 B7 B8 B9 B10 B11 B12B13 B14  
A22  
A23  
A11  
A10  
W
PWR1  
PWR2  
K1  
A24  
A25  
A9  
A8  
0.95  
B15  
B5  
1.02  
A26  
A27  
A7  
A6  
K
B16  
B17  
B4  
B3  
0.00  
0.92  
1.00  
E2  
C.L(PKG.)  
A28  
A29  
A5  
A4  
B18  
D2  
B2  
B1  
1.02  
0.95  
fff M C A B  
1.20  
1.23  
1.41  
1.60  
1.72  
2.00  
2.12  
A30  
A31  
A32  
A3  
A2  
A1  
PWR4  
PWR3  
NOTE:  
B27 B26 B25 B24 B23 B22 B21B20 B19  
S1  
L2  
1. Controlling dimension: mm  
A42 A41 A40 A39 A38 A37 A36 A35 A34 A33  
2.50 PKG.  
b
eT  
eR  
"B"  
bbb  
ddd  
C A B  
C
S2  
(PIN 1 CORNER)  
fff M C A B  
L1  
DETAIL "B" (3:1)(69X)  
BOTTOM VIEW  
FN8266.1  
January 25, 2013  
9

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