ISL6410AIR-TK [INTERSIL]
Single Synchronous Buck Regulators with Integrated FET; 单同步降压型稳压器具有集成FET型号: | ISL6410AIR-TK |
厂家: | Intersil |
描述: | Single Synchronous Buck Regulators with Integrated FET |
文件: | 总13页 (文件大小:392K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL6410, ISL6410A
®
Data Sheet
September 17, 2004
FN9149.3
Single Synchronous Buck Regulators
with Integrated FET
Features
• Fully Integrated Synchronous Buck Regulator
The ISL6410, ISL6410A are synchronous current-mode
PWM regulators designed to provide a total DC-DC solution
for microcontrollers, microprocessors, CPLDs, FPGAs, core
processors/BBP/MAC, and ASICs. The ISL6410 should be
selected for applications using 3.3V ±10% as an input
voltage and the ISL6410A in applications requiring 5.0V
±10%.
• PWM Fixed Output Voltage Options
- 1.8V, 1.5V or 1.2V with ISL6410 (VIN = 3.3V)
- 3.3V, 1.8V or 1.2V with ISL6410A (VIN = 5.0V)
• Continuous Output Current . . . . . . . . . . . . . . . . . . 600mA
• Ultra-Compact DC-DC Converter Design
• Stable with Small Ceramic Output Capacitors
• High Conversion Efficiency
These synchronous current mode PWM regulators have
integrated N- and P-Channel power MOSFETs and provide
pre-set pin programmable outputs. Synchronous rectification
with internal MOSFETs is used to achieve higher efficiency
and a reduced external component count. The operating
frequency of 750kHz typical allows the use of small inductor
and capacitor values. The device can be synchronized to an
external clock signal in the range of 500kHz to 1MHz. A
power good signal “PG” is generated when the output
voltage falls outside the regulation limits. Other features
include overcurrent protection and thermal overload
shutdown. The ISL6410, ISL6410A are available in an
MSOP 10 lead package.
• Extensive Circuit Protection and Monitoring features
- Overvoltage, UVLO
- Overcurrent
- Thermal Shutdown
• Available in MSOP and QFN packages
• QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
• Pb-Free Packaging Available
Ordering Information
TEMP.
PKG.
Applications
• CPUs, DSP, CPLDs, FPGAs
PART NUMBER* RANGE (°C)
PACKAGE
DWG. #
ISL6410IR
-40 to 85 16 Ld 4x4 QFN
L16.4x4
L16.4x4
• ASICs
ISL6410IRZ (Note)
-40 to 85 16 Ld 4x4 QFN
(Pb-free)
• DVD and DSL applications
• WLAN Cards
ISL6410IU
-40 to 85 10 Ld MSOP
M10.118
ISL6410IUZ (Note)
ISL6410AIR
-40 to 85 10 Ld MSOP (Pb-free) M10.118
• Generic 5V to 3.3V Conversion
-40 to 85 16 Ld 4x4 QFN
L16.4x4
L16.4x4
ISL6410AIRZ (Note) -40 to 85 16 Ld 4x4 QFN
(Pb-free)
Pinouts
ISL6410 (MSOP)
ISL6410 (QFN)
ISL6410AIU
-40 to 85 10 Ld MSOP
M10.118
TOP VIEW
TOP VIEW
ISL6410AIUZ (Note) -40 to 85 10 Ld MSOP (Pb-free) M10.118
*For tape and reel, add “-T”, “-TK” or “-T5K” suffix.
PVCC
VIN
1
10 PGND
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
16
15
14
13
2
3
4
5
9
8
7
6
L
VIN
CT
1
2
3
4
12 NC
GND
PG
EN
SYNC
VSET
11 RESET
10 EN
FB
GND
PG
9
SYNC
5
6
7
8
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
Functional Block Diagram for MSOP Version
VIN
0.1µF
10µF
1
PVCC
CURRENT
SENSE
2
3
VIN
SLOPE
SOFT
GND
COMPENSATION
START
L1
EN
8.2µH
VOUT
PWM
9
L
OVERCURRENT,
OVERVOLTAGE
LOGIC
GATE
EA
GM
DRIVE
10µF
COMPENSATION
10
PGND
7
6
SYNC
VSET
750kHz
OSCILLATOR
POWER GOOD
PWM
V
OUT
UVLO
PWM
8
EN
REFERENCE
0.45V
FB
5
4
PG
NOTES:
1. VIN is 3.3V for ISL6410 and 5.0V for ISL6410A.
2. VSET in the above schematic is connected to VIN, so the VOUT is 1.8V for ISL6410 and 3.3V for ISL6410A.
Functional Block Diagram for QFN Version
VIN
0.1µF
10µF
15
PVCC
CURRENT
SENSE
16 VIN
SLOPE
SOFT
START
3
GND
COMPENSATION
L1
EN
8.2µH
VOUT
PWM
14
13
L
OVERCURRENT,
OVERVOLTAGE
LOGIC
GATE
EA
GM
DRIVE
10µF
COMPENSATION
PGND
9
7
SYNC
VSET
750kHz
OSCILLATOR
POWER GOOD
PWM
V
IN
11
RESET
V
OUT
UVLO
RESET
BLOCK
PWM
10 EN
REFERENCE
0.45V
FB
5
4
8
2
C
T
PG
PG
NOTES:
1. VIN is 3.3V for ISL6410 and 5.0V for ISL6410A.
2. VSET in the above schematic is connected to VIN, so the VOUT is 1.8V for ISL6410 and 3.3V for ISL6410A.
ISL6410, ISL6410A
Typical Application Schematics
VIN
3.3V
±10%
C
IN
10µF
0.1µF
L1
PVCC
VIN
PGND
L
1
2
3
4
5
10
9
8.2µH
V
OUT
1.8V
ISL6410
GND
PG
EN
8
C
OUT
10µF
7
SYNC
VSET
6
FB
FIGURE 1. SCHEMATIC USING THE ISL6410 MSOP
VIN
5.0V
±10%
C
IN
10µF
0.1µF
L1
12µH
PVCC
VIN
PGND
L
1
2
3
4
5
10
9
V
OUT
3.3V
ISL6410A
GND
EN
8
C
OUT
10µF
7
PG
SYNC
VSET
6
FB
FIGURE 2. SCHEMATIC USING THE ISL6410A MSOP
L1
+1.2V
VOUT
+3.3V
VIN
8.2µH
C
16 15 14 13
C
IN
OUT
10µF
1µF
10µF
GND
12
11
10
9
1
2
3
4
GND
NC
RESET
EN
VIN
CT
U1
GND ISL6410IR
PG
EP
C
C7
0.1µF
T
SYNC
0.01µF
17
RESET
BAR
5
6
7
8
FIGURE 3. SCHEMATIC USING THE ISL6410 QFN
4
ISL6410, ISL6410A
Absolute Maximum Ratings
Thermal Information
Thermal Resistance (Typical)
MSOP Package (Note 4) . . . . . . . . . . .
QFN Package (Notes 4, 5). . . . . . . . . .
Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
θ
(°C/W)
128
45
θ
(°C/W)
JC
NA
7.5
CC
JA
SYNC, FB, VSET & Enable Input (Note 3) . . . . -0.3V to VCC+0.3V
ESD Classification (Human Body Model) . . . . . . . . . . . . . . . Class 2
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (10s, soldering . . . . . . . . . . . . . 260°C
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Junction Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to 125°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. All voltages are with respect to GND.
4. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JA
Tech Brief TB379.
5. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical Specifications Recommended operating conditions unless otherwise noted. V = 3.3V ±10% (ISL6410) or 5V ±10%
IN
(ISL6410A), T = 25°C (Note 6).
A
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
SUPPLY
CC
Supply Voltage Range
VIN (ISL6410)
3.0
3.3
5.0
2.68
2.59
4.37
4.22
2.3
5
3.6
5.5
2.73
2.64
4.45
4.32
-
V
V
VIN (ISL6410A)
4.5
Input UVLO Threshold
V
V
V
V
(ISL6410) Rising
(ISL6410) Falling
(ISL6410A) Rising
(ISL6410A) Falling
2.62
V
TR
TF
2.53
V
4.27
V
TR
4.1
V
TF
Quiescent Supply Current
Shutdown Supply Current
I
= 0mA
-
-
-
-
-
mA
µA
µA
°C
°C
OUT
EN = GND, T = 25°C
10
A
EN = GND, T = 85°C
A
10
15
Thermal Shutdown Temperature (Note 7)
Thermal Shutdown Hysteresis (Note 7)
SYNCHRONOUS BUCK PWM REGULATOR
Output Voltage
Rising Threshold
150
20
-
25
ISL6410, VSET = L
-
1.2
1.8
1.5
1.2
3.3
1.8
-
-
V
V
ISL6410, VSET = H
-
-
ISL6410, VSET = OPEN
ISL6410A, VSET = L
ISL6410A, VSET = H
ISL6410A, VSET = OPEN
-
-
V
-
-
V
-
-
-
V
-
-1.5
-0.5
-1.5
-
V
Output Voltage Accuracy
Line Regulation
I
I
I
= 3mA, T = -40°C to 85°C
A
+1.5
+0.5
+1.5
600
1300
-
%
OUT
OUT
OUT
= 3mA
-
%
Load Regulation
= 3mA to 600mA
-
%
Maximum Output Current
Peak Output Current Limit
-
mA
mA
mΩ
mΩ
%
700
-
-
PMOS r
NMOS r
I
I
I
= 200mA
= 200mA
230
230
92
DS(ON)
OUT
OUT
OUT
-
-
DS(ON)
Efficiency
= 200mA, V = 3.3V, V = 1.8V (ISL6410)
IN
-
-
O
5
ISL6410, ISL6410A
Electrical Specifications Recommended operating conditions unless otherwise noted. V = 3.3V ±10% (ISL6410) or 5V ±10%
IN
(ISL6410A), T = 25°C (Note 6). (Continued)
A
PARAMETER
TEST CONDITIONS
MIN
TYP
93
MAX
UNITS
%
Efficiency
I
= 200mA, V = 5.0V, V = 3.3V (ISL6410A)
IN
-
-
-
-
-
-
OUT
O
Efficiency
I
= 600mA, V = 5.0V, V = 3.3V (ISL6410A)
IN
91
%
OUT
O
Soft-Start Time
OSCILLATOR
4096 Clock Cycles @ 750kHz
5.5
ms
Oscillator Frequency
620
500
70
-
750
860
1000
-
kHz
kHz
%
Frequency Synchronization Range (f
SYNC High Level Input Voltage
SYNC Low Level Input Voltage
Sync Input Leakage Current
)
Clock signal on SYNC pin
As % of VIN
-
-
-
-
-
SYNC
As % of VIN
30
1
%
SYNC = GND or V
-1
µA
%
IN
Duty Cycle of External Clock Signal (Note 7)
PGOOD (ISL6410 interfaces to 3.3V Logic, ISL6410A interfaces to 5.0V Logic)
20
60
Rising Threshold
1mA minimum source/sink
+5.0
-10.5
-
8.0
-8.0
1
+10.5
-5.0
-
%
%
%
Falling Threshold
Rising/Falling Hysteresis
ENABLE
EN High Level Input Voltage
EN Low Level Input Voltage
EN Input Leakage Current
OVERVOLTAGE
As % of VIN
As % of VIN
70
-
-
-
-
30
1
%
%
EN = GND or V
-1
µA
IN
Overvoltage Threshold
RESET BLOCK SPECIFICATIONS
RESET (reset released)
RESET (reset asserted)
RESET Rising Threshold
RESET Falling Threshold
RESET (reset released)
RESET (reset asserted)
RESET Rising Threshold
RESET Falling Threshold
RESET Threshold Hysteresis
RESET Threshold Hysteresis
RESET Active Timeout Period (Note 8)
27
30
33
%
ISL6410, ISOURCE = 500µA, VIN = 2.90V
0.8V
-
-
-
-
0.3
2.81
2.79
-
V
V
IN
ISL6410, ISINK = 1.2mA, VIN = 2.50V
ISL6410
2.74
2.72
2.78
2.77
-
V
ISL6410
V
ISL6410A, ISOURCE = 800µA, VIN = 4.70V
0.8V
-
V
IN
ISL6410A, ISINK = 3.2mA, VIN = 4.10V
-
0.4
4.64
4.61
-
V
ISL6410A
ISL6410A
ISL6410
4.5
4.58
4.55
20
30
25
V
4.47
V
-
-
-
mV
mV
ms
ISL6410A
CT = 0.01mF
-
-
V
V
V
V
SET
SET
SET
SET
High Level Input
Low Level Input
Open Level Input
V
-0.4V
-
-
-
0.4
-
V
V
V
IN
-
-
V
/2
IN
NOTES:
6. Specifications at -40°C and +85°C are guaranteed by design, not production tested.
7. Guaranteed by design, not production tested.
8. The RESET Timeout period is linear with C at a slope of 2.5ms/nF, thus a 10nF capacitor provides for 25ms.
T
6
ISL6410, ISL6410A
efficiency and reduced number of external components.
Pin Description
Operating frequency of 750kHz typical allows the use of
small inductor and capacitor values. The device can be
synchronized to an external clock signal in the range of
500kHz to 1MHz. The PG output indicates loss of regulation
on PWM output.
VIN - Supply voltage for the IC. It is recommended to place a
1µF decoupling capacitor as close as possible to the IC.
GND - Small signal ground for the PWM controller stage. All
internal control circuits are referenced to this pin.
PG - The Power good is an open-drain output. A pull-up
resistor should be connected between PG and VIN. It is
asserted active high when the output voltage reaches
94.5% of the nominal value.
The PWM is based on the peak current mode control
topology with internal slope compensation. At the beginning
of each clock cycle, the high side P-channel MOSFET is
turned on. The current in the inductor ramps up and is
sensed via an internal circuit. On exceeding a preset limit the
high side switch is turned off causing the PWM comparator
to trip. This occurs whenever the output voltage is in
regulation or when the inductor current reaches the current
limit. After a minimum dead time to prevent shoot through
current, the low side N-channel MOSFET turns on and the
current ramps down. As the clock cycle is completed, the low
side switch turns off and the next clock cycle is initiated.
FB - The Feedback pin is used to sense the output voltage,
and should be connected to VOUT for normal operation.
VSET - This pin is used to program the output voltages.
Refer to Table 1 below for details.
TABLE 1.
ISL6410
Vo
ISL6410A
Vo
VSET
High
1.8V
1.5V
1.2V
3.3V
1.8V
1.2V
The control loop is internally compensated thus reducing the
amount of external components.
Open (NC)
Low
The switch current is internally sensed and the maximum
current limit is 1300mA peak.
SYNC - This pin is used for synchronization. The converter
switching frequency can be synchronized to an external
CMOS clock signal in the range of (500kHz to 1MHz).
Synchronization
The typical operating frequency for the converter is 750kHz.
It is possible to synchronize the converter to an external
clock frequency in the range of 500kHz to 1000kHz when an
external signal is applied to SYNC pin. The device will
automatically detect and synchronize to the rising edge of
the first clock pulse. If the clock signal is stopped, the
converter automatically switches back to the internal clock
and continues its operation without interruption. The switch
over will be initiated if no rising edge triggers are present on
the SYNC pin for a duration of four clock cycles.
EN - A logic high enables the converter, logic low forces the
device into shutdown mode reducing the supply current to
less than 10µA at 25°C. This pin should be pulled up to VCC
via a 10K resistor.
L - This pin is the drain junction of the internal power
MOSFETs and is to be connected to the external inductor.
PGND - Power ground. Connect all power grounds to this pin.
PVCC - This pin provides the Input supply for the internal
MOSFETs. It is recommended to place a 1µF decoupling
capacitor as close as possible to the IC.
Soft-Start
As the EN (Enable) pin goes high, the soft-start function will
generate an internal voltage ramp. This causes the start-up
current to slowly rise preventing output voltage overshoot
and high inrush currents. The soft-start duration is typically
5.5ms with 750kHz switching frequency. When the soft-start
is completed, the error amplifier will be connected directly to
the internal voltage reference.
CT - Timing capacitor connection to set the 25ms minimum
pulse width for the RESET signal.
RESET - The outputs of the reset supervisory circuit, which
monitors VIN. The IC asserts these RESET signals
whenever the supply voltage drops below a preset threshold
and keeps it asserted for at least 25ms after VCC (VIN) has
risen above the reset threshold. These outputs are push-
pull. RESET is LOW when re-setting the microprocessor.
The PWM will continue to operate until VIN drops below the
UVLO threshold.
Enable
Logic low on EN pin forces the PWM section into shutdown.
In the shutdown mode all the major blocks of the PWM
including power switches, drivers, voltage reference, and
oscillator are turned off.
Undervoltage Lockout
Functional Description
An undervoltage lockout circuit prevents the converter from
turning on when the voltage on VIN is less than the values
specified in the Input UVLO Threshold section of the
electrical specification.
The ISL6410, ISL6410A is a synchronous buck regulator
with integrated N- and P-channel power MOSFET and
provides pre-set pin programmable outputs. Synchronous
rectification with internal MOSFETs is used to achieve higher
7
ISL6410, ISL6410A
Power Good
Input Capacitor Selection
This output is asserted high when the PWM is enabled, and
Vout is within 8.0% typical of its final value, and is active low
outside this range. When disabled, the output turns active
low. It is recommended to leave the PG pin unconnected
when not used.
The input current to the buck converter is pulsed, and
therefore a low ESR input capacitor is required. This results
in good input voltage filtering and minimizes the interference
it causes to other circuits. The input capacitor should have a
minimum value of 10µF and a higher value can be selected
for improving input voltage filtering. The input capacitor
should be rated for the maximum input ripple current
calculated as:
PWM Overvoltage and Overcurrent Protection
The PWM output current is sampled at the end of each PWM
cycle, exceeding the overcurrent limit, causes a 4 bit
up/down counter to increment by one LSB. A normal current
state causes the counter to decrement by one LSB (the
counter will not however “rollover” or count below 0000).
When the PWM goes into overcurrent, the counter rapidly
reaches count 1111 and the PWM output is shut down and
the soft-start counter is reset. After 16 clocks the PWM
output is enabled and the soft-start cycle is started.
Vo
Vo
---------
I
= Io(max) ×
× 1 – ---------
RMS
Vin
Vin
The worst case RMS ripple current occurs at D = 0.5 and is
calculated as: Irms = Io/2.
D = Duty Cycle
Ceramic capacitors are preferred because of their low ESR
value. They are also less sensitive to voltage transients
when compared to tantalum capacitors. It is good practice to
place the input capacitor as close as possible to the input pin
of the IC for optimum performance.
If Vout exceeds the overvoltage limit for 32 consecutive clock
cycles the PWM output is shut off and the soft-start cycle is
initiated.
No Load Operation
If there is no load connected to the output, the converter will
regulate the output voltage by allowing the inductor current
to reverse for a short period of time.
Inductor Selection
The ISL6410 is an internally compensated device and hence
a minimum of 8.2µH must be used for the ISL6410 and a
minimum of 12µH for the ISL6410A. The selected inductor
must have a low DC resistance and a saturation current
greater than the maximum inductor current value can be
calculated from the equations below
Output Capacitor Selection
For best performance, a low ESR output capacitor is
needed. Output voltages below 1.8V require a larger output
capacitor and ESR value to improve the performance and
stability of the converter. For 1.8V output applications, a
ceramic capacitor of 10µF or higher value with ESR ≤50mΩ
is recommended.
Vo
1 – --------
Vin
------------------
dIL = Vo ×
L × f
The RMS ripple current is calculated as:
dIL
IL max = Io max + --------
2
Vo
1 – --------
Vin
1
2 ×
------------------ ----------------
I
= Vo ×
×
RMS(Co)
L × f
where
3
dIL = the peak to peak inductor current
L = the inductor value
f = the switching frequency
L = the inductor value
f = the switching frequency
ILmax = the max inductor current
The overall output ripple voltage is the sum of the voltage spike
caused by the output capacitor ESR and the voltage ripple
caused by charge and discharge of the output capacitor:
TABLE 3. RECOMMENDED INDUCTORS
COMPONENT
SUPPLIER
Vo
INDUCTOR VALUE
DCR (mΩ)
1 – --------
Vin
1
------------------
∆Vo = Vo ×
×
------------------------- + ESR
8.2µH
75
Coilcraft
MSS6122-822MX
L × f
8 × Co × f
12µH
100
Coilcraft
MSS6122-123MX
Where the highest output voltage ripple occurs at the highest
input voltage VIN.
TABLE 2. RECOMMENDED OUTPUT CAPACITORS
CAPACITOR ESR
COMPONENT
SUPPLIER
VALUE
(mΩ)
COMMENTS
10µF
<50 AVX 08056D106KAT2A
Ceramic
8
ISL6410, ISL6410A
Layout Considerations
As in all switching power supplies, the layout is an important
step in the design process, more so at high peak currents
and switching frequencies. Improper layout practice will give
rise to Stability and EMI issues. It is recommended that wide
and short traces are used for the main current paths. The
input capacitor should be placed as close as possible to the
IC pins. This applies to the output inductor and capacitor as
well. The analog ground, GND, and the power ground,
PGND, need to be separated. Use a common ground node
to minimize the effects of ground noise.
Performance Curves and Waveforms
100
100
VOUT = 1.8V
IOUT = 200mA
90
90
VOUT = 1.5V
VOUT = 1.2V
80
IOUT = 600mA
80
70
60
50
70
60
50
2.9
3.1
3.3
3.5
50
100
1000
IOUT LOAD CURRENT (mA)
VIN INPUT VOLTAGE (V)
FIGURE 4. ISL6410 EFFICIENCY vs LOAD CURRENT
FIGURE 5. ISL6410 VIN vs EFFICIENCY
100
100
90
VOUT = 3.3V
VOUT = 1.8V
IOUT = 200mA
IOUT = 600mA
90
80
70
60
50
80
VOUT = 1.2V
70
60
50
50
100
1000
4.6
4.4
4.8
5.0
VIN (V)
5.2
5.6
5.4
IOUT LOAD CURRENT (mA)
FIGURE 6. ISL6410A EFFICIENCY vs LOAD CURRENT
FIGURE 7. ISL6410A EFFICIENCY vs VIN
9
ISL6410, ISL6410A
Performance Curves and Waveforms (Continued)
800
790
780
770
760
750
780
770
760
750
740
730
-15
-15
-40
10
35
60
85
-40
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 8. ISL6410 OSCILLATOR FREQUENCY vs
TEMPERATURE
FIGURE 9. ISL6410A OSCILLATOR FREQUENCY vs
TEMPERATURE
CH1 = Top, CH2 = Middle, CH4 = Bottom, where applicable
VOUT
VOUT
L PIN VOLTAGE
L1 CURRENT
L PIN VOLTAGE
L1 CURRENT
VIN = 5.0V, VOUT = 1.2V, IOUT = 0.5A
0.5µs/DIV
0.5µs/DIV
CH1 = 0.1V/DIV, CH2 = 2V/DIV CH4 = 200mA/DIV
CH1 = 0.1V/DIV, CH2 = 2V/DIV CH4 = 200mA/DIV
FIGURE 10. SWITCHING WAVEFORM FOR ISL6410
FIGURE 11. SWITCHING WAVEFORM FOR ISL6410A
VOUT
VOUT
IOUT
IOUT
VIN = 3.3V, VOUT = 1.2V
VIN = 5.0V, VOUT = 1.2V
0.5ms/DIV
CH1 = 0.2V/DIV, CH4 = 200mA/DIV
0.5ms/DIV
CH1 = 0.1V/DIV, CH4 = 200mA/DIV
FIGURE 12. TRANSIENT LOAD WAVEFORM FOR ISL6410
FIGURE 13. TRANSIENT LOAD WAVEFORM FOR ISL6410A
10
ISL6410, ISL6410A
Performance Curves and Waveforms (Continued)
VOUT
VOUT
VIN = 3.3V, VOUT = 1.2V
VIN = 5.0V, VOUT = 1.2V
1µs/DIV
1µs/DIV
CH1 = 20mV/DIV
CH1 = 20mV/DIV
FIGURE 14. RIPPLE WAVEFORM FOR ISL6410
FIGURE 15. RIPPLE WAVEFORM FOR ISL6410A
-40
-50
-40
-50
VIN = 5.0V, VOUT = 1.2V
VIN = 3.3V, VOUT = 1.2V
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
NOISE LEVEL 732kHz = -65.3dBm
CENTER 2.75MHz, SPAN = 4.5MHz
NOISE LEVEL 761kHz = -54.0dBm
CENTER 2.75MHz, SPAN = 4.5MHz
FIGURE 16. SWITCHING HARMONICS AND NOISE FOR
ISL6410
FIGURE 17. SWITCHING HARMONICS AND NOISE FOR
ISL6410A
11
ISL6410, ISL6410A
Quad Flat No-Lead Plas tic Package (QFN)
L16.4x4
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220-VGGC ISSUE C)
Micro Lead Frame Plas tic Package (MLFP)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
1.00
0.05
1.00
NOTES
A
A1
A2
A3
b
0.80
0.90
-
-
-
-
-
-
9
0.20 REF
9
0.23
1.95
1.95
0.28
0.35
2.25
2.25
5, 8
D
4.00 BSC
-
D1
D2
E
3.75 BSC
9
2.10
7, 8
4.00 BSC
-
E1
E2
e
3.75 BSC
9
2.10
7, 8
0.65 BSC
-
k
0.25
0.50
-
-
-
-
L
0.60
0.75
0.15
8
L1
N
-
16
4
4
-
10
2
Nd
Ne
P
3
3
-
-
0.60
12
9
θ
-
9
Rev. 5 5/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensionsare provided toassistwith PCBLandPattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
12
ISL6410, ISL6410A
Mini Small Outline Plas tic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
E1
E
SYMBOL
MIN
MAX
MIN
0.94
0.05
0.75
0.18
0.09
2.95
2.95
MAX
1.10
0.15
0.95
0.27
0.20
3.05
3.05
NOTES
A
A1
A2
b
0.037
0.002
0.030
0.007
0.004
0.116
0.116
0.043
0.006
0.037
0.011
0.008
0.120
0.120
-
-B-
0.20 (0.008)
INDEX
AREA
1 2
A
B
C
-
-
TOP VIEW
4X θ
9
0.25
(0.010)
R1
c
-
R
GAUGE
PLANE
D
3
E1
e
4
SEATING
PLANE
L
0.020 BSC
0.50 BSC
-
-C-
4X θ
L1
A
A2
E
0.187
0.016
0.199
0.028
4.75
0.40
5.05
0.70
-
L
6
SEATING
PLANE
L1
N
0.037 REF
10
0.95 REF
10
-
0.10 (0.004)
-A-
C
C
b
7
-H-
A1
e
R
0.003
0.003
-
-
0.07
0.07
-
-
-
D
0.20 (0.008)
C
R1
θ
-
o
o
o
o
a
SIDE VIEW
5
15
5
15
-
C
L
o
o
o
o
0
6
0
6
-
α
E
1
-B-
Rev. 0 12/02
0.20 (0.008)
C
D
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
- H -
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
- B -
-A -
10. Datums
and
to be determined at Datum plane
.
- H -
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
13
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