ISL6420AIRZ-TK [INTERSIL]
Advanced Single Synchronous Buck Pulse-Width Modulation (PWM) Controller; 高级单同步降压脉宽调制( PWM )控制器型号: | ISL6420AIRZ-TK |
厂家: | Intersil |
描述: | Advanced Single Synchronous Buck Pulse-Width Modulation (PWM) Controller |
文件: | 总20页 (文件大小:558K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL6420A
®
Data Sheet
October 13, 2005
FN9169.1
Advanced Single Synchronous Buck
Features
• Operates from 4.5V to 28V Input
Pulse-Width Modulation (PWM) Controller
The ISL6420A simplifies the implementation of a complete
control and protection scheme for a high-performance
DC/DC buck converter. It is designed to drive N-channel
MOSFETs in a synchronous rectified buck topology, the
ISL6420A integrates control, output adjustment, monitoring
and protection functions into a single package. Additionally,
the IC features an external reference voltage tracking mode
for externally referenced buck converter applications and
DDR termination supplies, as well as a voltage margining
mode for system testing in networking DC/DC converter
applications.
• Excellent Output Voltage Regulation
- 0.6V Internal Reference
- ±1.0% Reference Accuracy Over Line and Temperature
• Resistor-Selectable Switching Frequency
- 100kHz to 1.4MHz
• Voltage Margining and External Reference Tracking
Modes
• Output Can Sink or Source Current
• Lossless, Programmable Overcurrent Protection
- Uses Upper MOSFET’s r
DS(ON)
The ISL6420A provides simple, single feedback loop,
voltage mode control with fast transient response. The
output voltage of the converter can be precisely regulated to
as low as 0.6V, with a maximum tolerance of ±1.0% over
temperature and line voltage variations.
• Programmable Soft-Start
• Drives N-Channel MOSFETs
• Simple Single-Loop Control Design
- Voltage-Mode PWM Control
The operating frequency is fully adjustable from 100kHz to
1.4MHz. High frequency operation offers cost and space
savings.
• Fast Transient Response
- High-Bandwidth Error Amplifier
- Full 0% to 100% Duty Cycle
The error amplifier features a 15MHz gain-bandwidth
product and 6V/µs slew rate that enables high converter
bandwidth for fast transient response. The PWM duty cycle
ranges from 0% to 100% in transient conditions. Selecting
the capacitor value from the ENSS pin to ground sets a fully
adjustable PWM soft-start. Pulling the ENSS pin LOW
disables the controller.
• Extensive Circuit Protection Functions
- PGOOD, Overvoltage, Overcurrent, Shutdown
• Diode Emulation during Startup for Pre-Biased Load
Applications
• Offered in 20 Ld QFN and QSOP Packages
• QFN (4x4) Package
- QFN compliant to JEDEC PUB95 MO-220 QFN - Quad
Flat No Leads - Product Outline
- QFN Near Chip Scale Package Footprint; Improves
PCB Efficiency, Thinner in Profile
The ISL6420A monitors the output voltage and generates a
PGOOD (power good) signal when soft-start sequence is
complete and the output is within regulation. A built-in
overvoltage protection circuit prevents the output voltage
from going above typically 115% of the set point. Protection
from overcurrent conditions is provided by monitoring the
• Pb-Free Plus Anneal Available (RoHS Compliant)
r
of the upper MOSFET to inhibit the PWM operation
DS(ON)
appropriately. This approach simplifies the implementation
and improves efficiency by eliminating the need for a current
sensing resistor.
Applications
• Power Supplies for Microprocessors/ASICs
- Embedded Controllers
- DSP and Core Processors
- DDR SDRAM Bus Termination
• Ethernet Routers and Switchers
• High-Power DC/DC Regulators
• Distributed DC/DC Power Architecture
• Personal Computer Peripherals
• Externally Referenced Buck Converters
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL6420A
Ordering Information
PART
TEMP.
PKG.
PART NUMBER
ISL6420AIAZ (Note)
MARKING
RANGE (°C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
PACKAGE
DWG. #
6420AIAZ
20 Ld QSOP (Pb-free)
M20.15
ISL6420AIAZ-TK (Note)
ISL6420AIRZ (Note)
6420AIAZ
6420AIRZ
6420AIRZ
20 Ld QSOP (Pb-free) Tape and Reel
20 Ld 4x4 QFN (Pb-free)
M20.15
L20.4x4
L20.4x4
ISL6420AIRZ-TK (Note)
20 Ld 4x4 QFN (Pb-free) Tape and Reel
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pinouts
ISL6420A (QFN)
ISL6420A (QSOP)
TOP VIEW
TOP VIEW
1
2
3
4
5
6
7
8
9
PGOOD
ENSS
CDEL
PGND
20
19
20 19 18 17 16
LGATE
18 COMP
17 FB
PVCC
GPIO2
GPIO1/REFIN
OCSET
1
2
3
4
5
15 PGND
14 CDEL
13 PGOOD
12 ENSS
11 COMP
PHASE
16 RT
UGATE
SGND
15
BOOT
14 VIN
13 VCC5
12
GPIO2
REFOUT
GPIO1/REFIN
VMSET/MODE
VMSET/MODE
OCSET 10
11 REFOUT
6
7
8
9
10
FN9169.1
2
October 13, 2005
ISL6420A
Functional Block Diagram
VIN
VCC5
OCSET
PHASE
SGND
LDO
OVERCURRENT
COMP
+
-
OCFLT
BOOT
REFERENCE
0.6V
SS
UGATE
OVFLT
UVFLT
FAULT
LOGIC
PHASE
ERROR
AMP
PHASE
LOGIC
+
+
-
FB
COMP
PWM
-
PWM
LOGIC
PVCC
LGATE
PGND
COMP
GPIO1/REFIN
GPIO2
RAMP
GENERATOR
REFOUT
VOLTAGE
MARGINING
VMSET/MODE
OV/UV
OVFLT
UVFLT
FB
PGOOD
CDEL
VOLTAGE
MONITOR
EN/SS
ENSS
OSC
RT
Typical 5V Input DC/DC Application Schematic
5V
C6
C1
C3
C2
C5
R1
C4
PVCC
VIN
VCC5
D1
C9
OCSET
BOOT
MONITOR AND
PROTECTION
ENSS
RT
Q1
UGATE
PHASE
PGOOD
CDEL
OSC
C7
0.1µF
R2
C8
L1
REF
3.3V
SGND
FB
Q2
LGATE
PGND
C10
-
+
+
-
R3
COMP
GPIO1/REFIN
GPIO2
C11
R6
REFOUT
C12
R5
C13
R4
VMSET/MODE
FN9169.1
October 13, 2005
3
ISL6420A
Typical 12V Input DC/DC Application Schematic
12V
C6
C1
C5
R1
C3
C2
C4
VIN PVCC
VCC5
D1
C9
OCSET
MONITOR AND
PROTECTION
ENSS
BOOT
RT
PGOOD
CDEL
Q1
UGATE
PHASE
OSC
R2
C8
C7
L1
REF
3.3V
SGND
FB
Q2
LGATE
PGND
-
C10
+
+
-
R3
COMP
GPIO1/REFIN
GPIO2
C11
R6
REFOUT
C13
C12
R5
R4
VMSET/MODE
Typical 5V Input DC/DC Application Schematic
5V
C6
C1
C3
C5
R1
C2
C4
D1
C8
PVCC
VIN
VCC5
OCSET
MONITOR AND
PROTECTION
SS/EN
BOOT
RT
CDEL
Q1
UGATE
PHASE
OSC
R2
C7
L1
PGOOD
REF
2.5V/1.25V
SGND
FB
Q2
LGATE
PGND
-
C9
+
+
-
R3
COMP
GPIO1/REFIN <-- VREF = VDDQ/2
GPIO2
C10
C11
REFOUT
R5
1.25V VREF
TO REFIN OF VTT SUPPLY
C12
VMSET/MODE
VCC5
R4
CONFIGURATION FOR DDR TERMINATION/EXTERNALLY REFERENCED TRACKING APPLICATIONS
FN9169.1
October 13, 2005
4
ISL6420A
Typical 12V Input DC/DC Application Schematic
12V
C6
C1
C2
C3
C5
R1
C4
VIN PVCC
VCC5
D1
C8
OCSET
MONITOR AND
PROTECTION
SS/EN
BOOT
RT
CDEL
Q1
UGATE
PHASE
OSC
R2
C7
L1
PGOOD
REF
2.5V/1.25V
VDDQ/VTT
SGND
FB
Q2
LGATE
PGND
-
C9
+
+
-
COMP
R3
GPIO1/REFIN <-- VREF = VDDQ/2
GPIO2
C10
C11
REFOUT
R5
1.25V VREF
TO REFIN OF VTT SUPPLY
C12
VMSET/MODE
VCC5
R4
CONFIGURATION FOR DDR TERMINATION/EXTERNALLY REFERENCED TRACKING APPLICATIONS
FN9169.1
5
October 13, 2005
ISL6420A
Absolute Maximum Ratings (Note 1)
Thermal Information
Thermal Resistance (Typical)
QFN Package (Notes 2, 3). . . . . . . . . .
QSOP Package (Note 2) . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Ambient Temperature Range. . . . . . . . . -40°C to 85°C (for “I” suffix)
Junction Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to 125°C
Bias Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+30V
BOOT and Ugate Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +36V
ESD Classification
Human Body Model (JESD22 - A114) . . . . . . . . . . . . . . . . . 2000V
Charged Device Model (JESD22 - C101) . . . . . . . . . . . . . . 1000V
θ
(°C/W)
47
90
θ
(°C/W)
JC
8.5
NA
JA
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. All voltages are with respect to GND.
2. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JA
Tech Brief TB379.
3. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical Specifications Operating Conditions, Unless Otherwise Noted: VIN = 12V, PV
shorted with V
, T = 25°C
CC5
CC
A
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VIN SUPPLY
Input Voltage Range
5.6
12
28
V
VIN SUPPLY CURRENT
Shutdown Current (Note 4)
Operating Current (Notes 4, 5)
VCC5 SUPPLY (Notes 5, 6)
Input Voltage Range
ENSS = GND
-
-
1.4
2.0
-
mA
mA
3.0
VIN = VCC5 for 5V configuration
4.5
4.5
50
5.0
5.0
-
5.5
5.5
-
V
V
Output Voltage
VIN = 5.6V to 28V, I = 3mA to 50mA
L
Maximum Output Current
POWER-ON RESET
VIN = 12V
mA
Rising V
CC5
Threshold
VIN connected to VCC5, 5V input
operation
4.310
4.400
4.475
V
Falling V
CC5
Threshold
4.090
0.16
4.100
-
4.250
-
V
V
UVLO Threshold Hysteresis
PWM CONVERTERS
Min Output Voltage (Note 7)
Max Output Voltage (Note 7)
Maximum Duty Cycle
-
-
0.6
-
-
V
V
V
- 0.5
IN
96
F = 300kHz
F = 300kHz
90
-
-
%
%
nA
%
Minimum Duty Cycle
-
80
-
0
-
FB Pin Bias Current
-
Undervoltage Protection
V
Fraction of the set point; ~3µs noise filter
Fraction of the set point; ~1µs noise filter
75
85
UV1
Overvoltage Protection
OSCILLATOR
V
112
-
120
%
OVP1
Free Running Frequency
Total Variation
RT = VCC5, T = -40°C to 85°C
270
-
300
330
-
kHz
%
A
T = -40°C to 85°C, with frequency set by
A
±10%
external resistor at RT
VIN = 12V
Frequency Range (Set by RT)
Ramp Amplitude (Note 7)
100
-
-
1400
-
kHz
∆V
1.25
V
P-P
OSC
FN9169.1
October 13, 2005
6
ISL6420A
Electrical Specifications Operating Conditions, Unless Otherwise Noted: VIN = 12V, PV
shorted with V
, T = 25°C (Continued)
CC5
CC
A
PARAMETER
REFERENCE AND SOFT-START/ENABLE
Internal Reference Voltage
Reference Voltage Accuracy
Soft-Start Current
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
-
-1.0
-
0.600
-
+1.0
-
V
%
µA
V
REF
T
= -40°C to 85°C, VIN = 5.6V to 28V
-
10
-
A
I
SS
Soft-Start Threshold
V
1.0
-
-
SOFT
Enable Low (Converter disabled)
PWM CONTROLLER GATE DRIVERS
Gate Drive Peak Current
Rise Time
-
1.0
V
-
-
-
-
0.7
20
20
20
-
-
-
-
A
Co = 1000pF
Co = 1000pF
ns
ns
ns
Fall Time
Dead Time Between Drivers
ERROR AMPLIFIER
DC Gain (Note 7)
-
-
-
88
15
6
-
-
-
dB
Gain-Bandwidth Product (Note 7)
Slew Rate (Note 7)
GBW
SR
MHz
V/µs
OVERCURRENT PROTECTION
OCSET Current Source
I
V
= 4.5V
OCSET
80
-
100
20
120
µA
ms
ms
OCSET
Dynamic Current Limit ON time
Dynamic Current Limit OFF time
POWER GOOD AND CONTROL FUNCTIONS
Power-Good Lower Threshold
Power-Good Higher Threshold
PGOOD Leakage Current
PGOOD Voltage Low
T
Frequency = 300kHz
Frequency = 300kHz
-
-
OCON
T
-
128
OCOFF
V
Fraction of the set point; ~3µs noise filter
Fraction of the set point; ~3µs noise filter
-14
-10
-8
16
1
%
%
PG-
V
9
-
-
-
PG+
I
V
= 5.5V
µA
V
PGLKG
PULLUP
= 4mA
I
-
-
0.5
-
PGOOD
PGOOD Delay
CDEL = 0.1µF
-
125
2
ms
µA
V
CDEL Current for PGOOD
CDEL Threshold
CDEL threshold = 2.5V
-
-
-
2.5
-
EXTERNAL REFERENCE
MIn External Reference Input at
GPIO1/REFIN.
VMSET/MODE = H, C
VMSET/MODE = H, C
= 2.2µF
= 2.2µF
-
-
0.600
-
-
V
V
REFOUT
REFOUT
Max External Reference Input at
GPIO1/REFIN.
1.250
REFERENCE BUFFER
Buffered Output Voltage - Internal Reference
V
V
V
I
= 1mA,
REFOUT
0.583
0.575
1.227
0.595
0.587
1.246
0.607
0.599
1.265
V
V
V
REFOUT
REFOUT
REFOUT
VMSET/MODE = High,
C
= 2.2µF, T = -40°C to 85°C
REFOUT
A
Buffered Output Voltage - Internal Reference
Buffered Output Voltage - External Reference
I
= 20mA,
REFOUT
VMSET/MODE = High,
C
= 2.2µF, T = -40°C to 85°C
A
REFOUT
V
= 1.25V, I
= 1mA,
REFIN
REFOUT
VMSET2/MODE = High,
= 2.2µF
C
REFOUT
FN9169.1
7
October 13, 2005
ISL6420A
Electrical Specifications Operating Conditions, Unless Otherwise Noted: VIN = 12V, PV
shorted with V
MIN
, T = 25°C (Continued)
CC5
CC
A
PARAMETER
SYMBOL
TEST CONDITIONS
TYP
MAX
UNITS
Buffered Output Voltage - External Reference
V
V
= 1.25V, I = 20mA,
1.219
1.238
1.257
V
REFOUT
REFIN
REFOUT
VMSET2/MODE = High,
C
= 2.2µF
REFOUT
Current Drive Capability
VOLTAGE MARGINING
Voltage Margining Range (Note 7)
CDEL Current for Voltage Margining
Slew Time
C
= 2.2µF
20
-
-
mA
REFOUT
-10
-
+10
%
-
-
-
100
2.5
-
-
-
µA
ms
µA
CDEL = 0.1µF, VMSET = 330kΩ
ISET1 on FB Pin
VMSET = 330K,
GPIO1 = L
GPIO2 = H
7.48
ISET2 on FB Pin
VMSET = 330K,
GPIO1 = H
GPIO2 = L
-
7.48
-
µA
THERMAL SHUTDOWN
Shutdown Temperature (Note 7)
Thermal Shutdown Hysteresis (Note 7)
NOTES:
-
-
150
20
-
-
°C
°C
4. The operating supply current and shutdown current specifications for 5V input are the same as VIN supply current specifications, i.e., 5.6V to
28V input conditions. These should also be tested with part configured for 5V input configuration, i.e., VIN = VCC5 = PVCC = 5V.
5. This is the V
current consumed when the device is active but not switching. Does not include gate drive current.
CC
6. When the input voltage is 5.6V to 28V at VIN pin, the VCC5 pin provides a 5V output capable of 50mA (max) total from the internal LDO. When
the input voltage is 5V, VCC5 pin will be used as a 5V input, the internal LDO regulator is disabled and the VIN must be connected to the VCC5.
In both cases the PVCC pin should always be connected to VCC5 pin. (Refer to the Pin Descriptions sections for more details.)
7. Guaranteed by design. Not production tested.
Typical Performance Curves
0.604
0.602
0.600
0.598
0.596
0.594
320
310
300
290
280
270
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 1. V
vs TEMPERATURE
FIGURE 2. V
vs TEMPERATURE
SW
REF
FN9169.1
8
October 13, 2005
ISL6420A
Typical Performance Curves (Continued)
94.00
92.00
90.00
88.00
86.00
84.00
82.00
80.00
1.15
1.05
I
= 5A
OUT
0.95
0.85
0
5
10
15
(V)
20
25
30
-40
-15
10
35
60
85
V
TEMPERATURE (°C)
IN
FIGURE 3. I
vs TEMPERATURE
FIGURE 4. EFFICIENCY vs V
IN
OCSET
25°C, V = 28V, I = 1.367, I
= 10A
IN
IN
OUT
FIGURE 5.
FIGURE 6.
98
V
= 5V
IN
96
94
92
90
88
86
84
82
80
V
= 12V
IN
0
1
2
3
4
5
6
7
8
9
10
LOAD (A)
FIGURE 7. EFFICIENCY vs LOAD CURRENT (V
= 3.3V)
OUT
FN9169.1
9
October 13, 2005
ISL6420A
Pin Descriptions
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
VIN - This pin powers the controller and must be decoupled
to ground using a ceramic capacitor as close as possible to
the VIN pin.
TABLE 1. INPUT SUPPLY CONFIGURATION
INPUT
PIN CONFIGURATION
5.6V to 28V
Connect the input to the VIN pin. The VCC5
pin will provide a 5V output from the internal
LDO. Connect PVCC to VCC5.
5V ±10%
Connect the input to the VCC5 pin. Connect
the PVCC and VIN pins to VCC5.
0
25
50
75
RT (kΩ)
100
125
150
SGND - This pin provides the signal ground for the IC. Tie
this pin to the ground plane through the lowest impedance
connection.
FIGURE 8. OSCILLATOR FREQUENCY vs RT
PGND - This pin provides the power ground for the IC. Tie
this pin to the ground plane through the lowest impedance
connection.
LGATE - This pin provides the PWM-controlled gate drive for
the lower MOSFET.
PHASE - This pin is the junction point of the output filter
inductor, the upper MOSFET source and the lower MOSFET
drain. This pin is used to monitor the voltage drop across the
upper MOSFET for overcurrent protection. This pin also
provides a return path for the upper gate drive.
PVCC - This pin is the power connection for the gate drivers.
Connect this pin to the VCC5 pin.
VCC5 – This pin is the output of the internal 5V LDO.
Connect a minimum of 4.7µF ceramic decoupling capacitor
as close to the IC as possible at this pin. Refer to Table 1.
UGATE - This pin provides the PWM-controlled gate drive
for the upper MOSFET.
ENSS - This pin provides enable/disable function and soft-
start for the PWM output. The output drivers are turned off
when this pin is held below 1V.
BOOT - This pin powers the upper MOSFET driver. Connect
this pin to the junction of the bootstrap capacitor and the
cathode of the bootstrap diode. The anode of the bootstrap
diode is connected to the VCC5 pin.
OCSET - Connect a resistor (ROCSET) from this pin to the
drain of the upper MOSFET. ROCSET, an internal 100µA
current source (IOCS), and the upper MOSFET on
FB - This pin is connected to the feedback resistor divider
and provides the voltage feedback signal for the controller.
This pin sets the output voltage of the converter.
resistance r
set the converter overcurrent (OC) trip
point according to the following equation:
DS(ON)
I
• R
OCSET
OCSSET
(EQ. 1)
COMP - This pin is the error amplifier output pin. It is used as
the compensation point for the PWM error amplifier.
I
= ------------------------------------------------------
OC
R
DS(ON)
PGOOD - This pin provides a power good status. It is an
open collector output used to indicate the status of the
output voltage.
An overcurrent trip cycles the soft-start function with an ON
time of 20ms and an OFF time of 128ms.
GPIO1/REFIN - This is a dual function pin. If VMSET/MODE
is not connected to VCC5 then this pin serves as GPIO1.
Refer to Table 2 for GPIO commands interpretation.
RT - This is the oscillator frequency selection pin.
Connecting this pin directly to VCC5 will select the oscillator
free running frequency of 300kHz. By placing a resistor from
this pin to GND, the oscillator frequency can be programmed
from 100kHz to 1.4MHz. Figure 8 shows the oscillator
frequency vs the RT resistance.
If VMSET/MODE is connected to VCC5 then this pin will
serve as REFIN. As REFIN, this pin is the non-inverting input
to the error amplifier. Connect the desired reference voltage
to this pin in the range of 0.6V to 1.25V.
CDEL - The PGOOD signal can be delayed by a time
proportional to a CDEL current of 2µA & the value of the
capacitor connected between this pin and ground. A 0.1µF
will typically provide 125ms delay. When in the Voltage
margining mode the CDEL current is 100µA typical and
provides the delay for the output voltage slew rate, 2.5ms
typical for the 0.1µF capacitor.
Connect this pin to VCC5 to use internal reference.
REFOUT - If VMSET/MODE pin is connected to VCC5, then
this pin serves as REFOUT. It provides buffered reference
output for REFIN. Connect 2.2µF capacitor to this pin when
used as REFOUT. If not used to source current, connect a
1µF bypass capacitor to this pin.
FN9169.1
10
October 13, 2005
ISL6420A
VMSET/MODE - This pin is a dual function pin. Tie this pin to
TABLE 2. VOLTAGE MARGINING CONTROLLED BY GPIO1
AND GPIO2
VCC5 to disable voltage margining. When not tied to VCC5,
this pin serves as VMSET. Connect a resistor from this pin to
ground to set delta for voltage margining. If voltage
margining and external reference tracking mode are not
needed, this pin can be tied directly to ground.
GPIO1
GPIO2
VOUT
L
L
L
H
L
No Change
+ Delta VOUT
- Delta VOUT
Ignored
H
H
GPIO2 - This is general purpose IO pin for voltage
margining. Refer to Table 2.
H
TABLE 3. VOLTAGE MARGINING/DDR OR TRACKING SUPPLY PIN CONFIGURATION
PIN CONFIGURATIONS
FUNCTION/MODES
VMSET/MODE
REFOUT
GPIO1/REFIN
GPIO2
COMMENTS
Enable Voltage Margining
Pin Connected Connect a 1µF
Serves as a general
Serves as a
REFIN or REFOUT functions
to GND with
resistor. It is
capacitor for
purpose I/O. Refer to general purpose will not be available in this
bypass of external Table 2
used as VMSET. reference.
I/O. Refer to
Table 2
mode. The internal 0.6V
reference is used.
No Voltage Margining. Normal
Pin Connected Connect a 1µF
L
L
operation using internal reference. to GND with
capacitor for
REFOUT not used.
resistor. It is
bypass of external
used as VMSET reference.
No Voltage Margining. Normal
operation with internal reference.
H
H
Connect a 2.2µF
capacitor to GND.
H
L
L
Buffered V
REFOUT
= 0.6V.
No Voltage Margining. External
reference. Buffered V
Connect a 2.2µF Connect to an external
capacitor to GND. reference voltage
source (0.6V to 1.25V)
=
REFOUT
V
REFIN
NOTES:
1. The GPIO1/REFIN and GPIO2 pins cannot be left floating.
2. Ensure that GPIO1/REFIN is tied high prior to the logic change at VMSET/MODE.
Functional Description
Initialization
When the ENSS pin voltage reaches 1V typically, the
internal 0.6V reference begins to charge following the dv/dt
of the ENSS voltage. As the soft-start pin charges from 1V to
1.6V, the reference voltage charges from 0V to 0.6V.
Figure 9 shows a typical soft-start sequence.
The ISL6420A automatically initializes upon receipt of
power. The Power-On Reset (POR) function monitors the
internal bias voltage generated from LDO output (VCC5) and
the ENSS pin. The POR function initiates the soft-start
operation after the VCC5 exceeds the POR threshold. The
POR function inhibits operation with the chip disabled
(ENSS pin <1V).
V
= 28V, V
= 3.3V, I
= 10A
OUT
IN
OUT
The device can operate from an input supply voltage of 5.6V
to 28V connected directly to the VIN pin using the internal 5V
linear regulator to bias the chip and supply the gate drivers.
For 5V ±10% applications, connect VIN to VCC5 to bypass
the linear regulator.
Soft-Start/Enable
The ISL6420A soft-start function uses an internal current
source and an external capacitor to reduce stresses and
surge current during startup.
When the output of the internal linear regulator reaches the
POR threshold, the POR function initiates the soft-start
sequence. An internal 10µA current source charges an
external capacitor on the ENSS pin linearly from 0V to 3.3V.
FIGURE 9. TYPICAL SOFT-START WAVEFORM
FN9169.1
October 13, 2005
11
ISL6420A
Overcurrent Protection
Voltage Margining
The overcurrent function protects the converter from a
The ISL6420A has a voltage margining mode that can be
used for system testing. The voltage margining percentage
is resistor selectable up to ±10%. The voltage margining
mode can be enabled by connecting a margining set resistor
from VMSET pin to ground and using the control pins
GPIO1/2 to toggle between positive and negative margining
(Refer to Table 2). With voltage margining enabled, the
VMSET resistor to ground will set a current, which is
switched to the FB pin. The current will be equal to 2.468V
divided by the value of the external resistor tied to the
VMSET pin.
shorted output by using the upper MOSFET’s on-resistance,
r
to monitor the current. This method enhances the
DS(ON)
converter’s efficiency and reduces cost by eliminating a
current sensing resistor.
The overcurrent function cycles the soft-start function in a
hiccup mode with an ON time of 20ms and an OFF time of
128ms to provide fault protection. On detecting an
overcurrent condition, the IC waits for four soft-start cycles
before the output drivers are turned ON again, this process
is repeated till the overcurrent condition is removed. A
resistor connected to the drain of the upper FET and the
OCSET pin programs the overcurrent trip level. The PHASE
node voltage will be compared against the voltage on the
OCSET pin, while the upper FET is on. A current (100µA
typically) is pulled from the OCSET pin to establish the
OCSET voltage. If PHASE is lower than OCSET while the
upper FET is on then an overcurrent condition is detected for
that clock cycle. The upper gate pulse is immediately
terminated, and a counter is incremented. If an overcurrent
condition is detected for 8 consecutive clock cycles, and the
circuit is not in soft-start, the ISL6420A enters into the soft-
start hiccup mode. During hiccup, the external capacitor on
the ENSS pin is discharged. After the cap is discharged, it is
released and a soft-start cycle is initiated. During soft-start,
pulse termination current limiting is enabled, but the 8-cycle
hiccup counter is held in reset until soft-start is completed.
2.468V
VMSET
I
= -----------------------
(EQ. 2)
VM
R
R
FB
-----------------------
∆V
= 2.468V
(EQ. 3)
VM
R
VMSET
The power supply output increases when GPIO2 is HIGH
and decreases when GPIO1 is HIGH. The amount that the
output voltage of the power supply changes with voltage
margining, will be equal to 2.468V times the ratio of the
external feedback resistor and the external resistor tied to
VMSET. Figure 10 shows the positive and negative
margining for a 3.3V output, using a 20.5kΩ feedback
resistor and using various VMSET resistor values.
3.7
3.6
3.5
3.4
3.3
3.2
3.1
The overcurrent function will trip at a peak inductor current
(I ) determined from Equation 1, where I
is the
OC
OCSET
internal OCSET current source.
The OC trip point varies mainly due to the upper MOSFETs
variations. To avoid overcurrent tripping in the
r
DS(ON)
normal operating load range, find the R
the equation above with:
resistor from
OCSET
3.0
2.9
1. The maximum r
temperature.
at the highest junction
DS(ON)
2.8
150 175 200 225 250 275 300 325 350 375 400
2. Determine I
for I
> I
+ (∆I) ⁄ 2 ,
OUT(MAX)
OC
where ∆I is tOhCe output inductor ripple current.
RVMSET (kΩ)
FIGURE 10. VOLTAGE MARGINING vs VMSET RESISTANCE
A small ceramic capacitor should be placed in parallel with
R
to smooth the voltage across R
in the
OCSET
OCSET
presence of switching noise on the input voltage.
FN9169.1
12
October 13, 2005
ISL6420A
20mA and sinking up to 50µA current with a 2.2µF capacitor
connected to the REFOUT pin.
V
IN
= 12V, V = 3.3V, NO LOAD
OUT
If VMSET/MODE pin is tied to high but GPIO1/REFIN is
connected to an external voltage source between 0.6V to
1.25V, then this external voltage is used as the reference
voltage at the positive input of the error amplifier. The
buffered reference output on REFOUT will be Vrefin ±0.01V,
capable of sourcing 20mA and sinking up to 50µA current
with a 2.2µF capacitor on the REFOUT pin.
Power Good
The PGOOD pin can be used to monitor the status of the
output voltage. PGOOD will be true (open drain) when the
FB pin is within ±10% of the reference and the ENSS pin has
completed its soft-start ramp.
FIGURE 11A.
Additionally, a capacitor on the CDEL pin will set a delay for
the PGOOD signal. After the ENSS pin completes its soft-
start ramp, a 2µA current begins charging the CDEL
capacitor to 2.5V. The capacitor will be quickly discharged
before PGOOD goes high. The programmable delay can be
used to sequence multiple converters or as a LOW-true
reset signal.
V
IN
= 12V, V
= 3.3V, NO LOAD
OUT
V
= 12V, V
OUT
= 3.3V, I = 10A
OUT
IN
FIGURE 11B.
The slew time of the current is set by an external capacitor
on the CDEL pin, which is charged and discharged with a
100µA current source. The change in voltage on the
capacitor is 2.5V. This same capacitor is used to set the
PGOOD active delay after soft-start. When PGOOD is low,
the internal PGOOD circuitry uses the capacitor and when
PGOOD is high, the voltage margining circuit uses the
capacitor. The slew time for voltage margining can be in the
range of 300µs to 2ms.
FIGURE 12. PGOOD DELAY
If the voltage on the FB pin exceeds ±10% of the reference,
then PGOOD will go low after 1µs of noise filtering.
Over-Temperature Protection
External Reference/DDR Supply
The IC is protected against over-temperature conditions.
When the junction temperature exceeds 150°C, the PWM
shuts off. Normal operation is resumed when the junction
temperature is cooled down to 130°C.
The voltage margining can be disabled by connecting the
VMSET/MODE to VCC5. In this mode the chip can be
configured to work with an external reference input and
provide a buffered reference output.
If VMSET/MODE pin and the GPIO1/REFIN pin are both tied
to VCC5, then the internal 0.6V reference is used as the
error amplifier non-inverting input. The buffered reference
output on REFOUT will be 0.6V ±0.01V, capable of sourcing
Shutdown
When ENSS pin is below 1V, the regulator is disabled with
the PWM output drivers three-stated. When disabled, the IC
power will be reduced.
FN9169.1
13
October 13, 2005
ISL6420A
Undervoltage
V
= 12V, V = 3.3V at 25mA LOAD
OUT
IN
If the voltage on the FB pin is less than 15% of the reference
voltage for 8 consecutive PWM cycles, then the circuit enters
into soft-start hiccup mode. This mode is identical to the
overcurrent hiccup mode.
Overvoltage Protection
If the voltage on the FB pin exceeds the reference voltage by
15%, the lower gate driver is turned on continuously to
discharge the output voltage. If the overvoltage condition
continues for 32 consecutive PWM cycles, then the chip is
turned off with the gate drivers three-stated. The voltage on
the FB pin will fall and reach the 15% undervoltage
threshold. After 8 clock cycles, the chip will enter soft-start
hiccup mode. This mode is identical to the overcurrent
hiccup mode.
FIGURE 13. PREBIASED OUTPUT AT 25mA LOAD
Gate Control Logic
The gate control logic translates generated PWM control
signals into the MOSFET gate drive signals providing
necessary amplification, level shifting and shoot-through
protection. Also, it has functions that help optimize the IC
performance over a wide range of operational conditions.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to
another can generate voltage transients across the
impedances of the interconnecting bond wires and circuit
traces. These interconnecting impedances should be
minimized by using wide, short printed circuit traces. The
critical components should be located as close together as
possible using ground plane construction or single point
grounding.
Since MOSFET switching time can vary dramatically from
type to type and with the input voltage, the gate control logic
provides adaptive dead time by monitoring the gate-to-
source voltages of both upper and lower MOSFETs. The
lower MOSFET is not turned on until the gate-to-source
voltage of the upper MOSFET has decreased to less than
approximately 1V. Similarly, the upper MOSFET is not turned
on until the gate-to-source voltage of the lower MOSFET has
decreased to less than approximately 1V. This allows a wide
variety of upper and lower MOSFETs to be used without a
concern for simultaneous conduction, or shoot-through.
V
IN
ISL6420A
Startup into Pre-Biased Load
The ISL6420A is designed to power up into a pre-biased
load. This is achieved by transitioning from Diode Emulation
mode to a Forced Continuous Conduction mode during
startup. The lower gate turns ON for a short period of time
and the voltage on the phase pin is sensed. When this goes
negative the lower gate is turned OFF and remains OFF till
the next cycle. As a result the inductor current will not go
negative during soft-start and thus will not discharge the pre-
biased load. The waveform for this condition is shown below.
UGATE
PHASE
Q1
Q2
L
O
V
OUT
C
IN
C
D2
O
LGATE
GND
RETURN
FIGURE 14. PRINTED CIRCUIT BOARD POWER AND
GROUND PLANES OR ISLANDS
FN9169.1
October 13, 2005
14
ISL6420A
Figure 14 shows the critical power components of the
converter. To minimize the voltage overshoot the
Feedback Compensation
Figure 16 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage
(Vout) is regulated to the Reference voltage level. The error
interconnecting wires indicated by heavy lines should be part
of ground or power plane in a printed circuit board. The
components shown in Figure 14 should be located as close
amplifier (Error Amp) output (V ) is compared with the
E/A
together as possible. Please note that the capacitors C
IN
oscillator (OSC) triangular wave to provide a pulse-width
and C each represent numerous physical capacitors.
O
modulated (PWM) wave with an amplitude of V at the
IN
Locate the ISL6420A within 3 inches of the MOSFETs, Q1
and Q2. The circuit traces for the MOSFETs’ gate and
source connections from the ISL6420A must be sized to
handle up to 2A peak current.
PHASE node. The PWM wave is smoothed by the output filter
(L and C ).
O
O
The modulator transfer function is the small-signal transfer
function of Vout/V . This function is dominated by a DC
E/A
Gain and the output filter (L and C ), with a double pole
Figure 15 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
O
O
break frequency at F and a zero at F
LC
. The DC Gain of
ESR
the modulator is simply the input voltage (V ) divided by the
IN
current paths on the SS PIN and locate the capacitor, C
ss
peak-to-peak oscillator voltage DV
.
OSC
close to the SS pin because the internal current source is
only 30µA. Provide local V decoupling between VCC and
CC
V
IN
GND pins. Locate the capacitor, C
to the BOOT and PHASE pins.
as close as practical
OSC
BOOT
DRIVER
PWM
L
O
COMPARATOR
V
OUT
-
DRIVER
+V
Q1
PHASE
IN
+
∆V
OSC
BOOT
D1
C
O
C
L
O
BOOT
PHASE
+5V
ESR
(PARASITIC)
V
OUT
ISL6420A
Z
FB
SS/EN
V
E/A
C
Q2
O
Z
-
IN
+
VCC
REFERENCE
ERROR
AMP
C
VCC
C
SS
GND
DETAILED COMPENSATION COMPONENTS
FIGURE 15. PRINTED CIRCUIT BOARD SMALL SIGNAL
LAYOUT GUIDELINES
Z
FB
V
OUT
C2
Z
IN
C1
C3
R3
R2
R1
COMP
FB
-
+
ISL6420A
REF
FIGURE 16. VOLTAGE - MODE BUCK CONVERTER
COMPENSATION DESIGN
FN9169.1
October 13, 2005
15
ISL6420A
Modulator Break Frequency Equations
100
F
F
P1
F
F
Z2
Z1
P2
1
F
= --------------------------------------
(EQ. 4)
(EQ. 5)
LC
80
60
40
20
0
2π •
L
• C
O
O
OPEN LOOP
ERROR AMP GAIN
1
F
= --------------------------------------------
ESR
2π • (ESR • C
)
20LOG
(R2/R1)
O
20LOG
IN
(V /∆V
)
OSC
The compensation network consists of the error amplifier
(internal to the ISL6420A) and the impedance networks Z
and Z . The goal of the compensation network is to provide
FB
a closed loop transfer function with the highest 0dB crossing
COMPENSATION
GAIN
IN
MODULATOR
GAIN
-20
-40
-60
CLOSED LOOP
GAIN
F
LC
frequency (f
) and adequate phase margin. Phase margin
F
0dB
ESR
is the difference between the closed loop phase at f
180°. The equations below relate the compensation
and
0dB
10
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
network’s poles, zeros and gain to the components (R1, R2,
R3, C1, C2, and C3) in Figure 16. Use these guidelines for
locating the poles and zeros of the compensation network:
FIGURE 17. ASYMPTOTIC BODE PLOT OF CONVERTER GAIN
The compensation gain uses external impedance networks
Z
and Z to provide a stable, high bandwidth (BW) overall
FB
IN
Compensation Break Frequency Equations
loop. A stable control loop has a gain crossing with
-20dB/decade slope and a phase margin greater than 45°.
Include worst case component variations when determining
phase margin.
1
F
= ----------------------------------
(EQ. 6)
(EQ. 7)
Z1
2π • R2 • C1
1
F
= ------------------------------------------------------
2π • R2 •
P1
C1 • C2
Component Selection Guidelines
----------------------
C1 + C2
Output Capacitor Selection
1
An output capacitor is required to filter the output and supply
the load transient current. The filtering requirements are a
function of the switching frequency and the ripple current.
The load transient requirements are a function of the slew
rate (di/dt) and the magnitude of the transient load current.
These requirements are generally met with a mix of
capacitors and careful layout.
F
F
= -----------------------------------------------------
(EQ. 8)
(EQ. 9)
Z2
P2
2π • (R1 + R3) • C3
1
----------------------------------
=
2π • R3 • C3
1. Pick Gain (R2/R1) for desired converter bandwidth
ST
Modern microprocessors produce transient load rates above
1A/ns. High frequency capacitors initially supply the transient
and slow the current load rate seen by the bulk capacitors.
The bulk filter capacitor values are generally determined by
the ESR (effective series resistance) and voltage rating
requirements rather than actual capacitance requirements.
2. Place 1 Zero Below Filter’s Double Pole
(~75% F
)
LC
ND
3. Place 2
Zero at Filter’s Double Pole
ST
4. Place 1 Pole at the ESR Zero
ND
5. Place 2
Pole at Half the Switching Frequency
6. Check Gain against Error Amplifier’s Open-Loop Gain
7. Estimate Phase Margin - Repeat if Necessary
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements. For example, Intel
recommends that the high frequency decoupling for the
Pentium Pro be composed of at least forty (40) 1.0µF
ceramic capacitors in the 1206 surface-mount package.
Figure 17 shows an asymptotic plot of the DC/DC
converter’s gain vs. frequency. The actual Modulator Gain
has a high gain peak due to the high Q factor of the output
filter and is not shown in Figure 17. Using the above
guidelines should give a Compensation Gain similar to the
curve plotted. The open loop error amplifier gain bounds the
compensation gain. Check the compensation gain at F
P2
with the capabilities of the error amplifier. The Closed Loop
Gain is constructed on the log-log graph of Figure 17 by
adding the Modulator Gain (in dB) to the Compensation Gain
(in dB). This is equivalent to multiplying the modulator
transfer function to the compensation transfer function and
plotting the gain.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors.
The bulk capacitor’s ESR will determine the output ripple
voltage and the initial voltage drop after a high slew-rate
transient. An aluminum electrolytic capacitor's ESR value is
related to the case size with lower ESR available in larger
FN9169.1
16
October 13, 2005
ISL6420A
case sizes. However, the equivalent series inductance (ESL)
Input Capacitor Selection
of these capacitors increases with case size and can reduce
the usefulness of the capacitor to high slew-rate transient
loading. Unfortunately, ESL is not a specified parameter.
Work with your capacitor supplier and measure the
capacitor’s impedance with frequency to select a suitable
component. In most cases, multiple electrolytic capacitors of
small case size perform better than a single large case
capacitor.
Use a mix of input bypass capacitors to control the voltage
overshoot across the MOSFETs. Use small ceramic
capacitors for high frequency decoupling and bulk capacitors
to supply the current needed each time Q1 turns on. Place the
small ceramic capacitors physically close to the MOSFETs
and between the drain of Q1 and the source of Q2.
The important parameters for the bulk input capacitor are the
voltage rating and the RMS current rating. For reliable
operation, select the bulk capacitor with voltage and current
ratings above the maximum input voltage and largest RMS
current required by the circuit. The capacitor voltage rating
should be at least 1.25 times greater than the maximum
input voltage and a voltage rating of 1.5 times is a
conservative guideline. The RMS current rating requirement
for the input capacitor of a buck regulator is approximately
1/2 the DC load current. A more specific equation for
determining the input ripple is the following,
Output Inductor Selection
The output inductor is selected to meet the output voltage
ripple requirements and minimize the converter’s response
time to the load transients. The inductor value determines
the converter’s ripple current and the ripple voltage is a
function of the ripple current and the output capacitors ESR.
The ripple voltage and current are approximated by the
following equations:
V
- V
Fs x L
V
V
IN
IN
OUT OUT
------------------------------- ---------------
∆I =
⋅
(EQ. 10)
(EQ. 11)
L
2
I
= I
⋅
(D – D )
(EQ. 14)
RMS
MAX
∆V
= ∆I ⋅ ESR
OUT
L
For a through hole design, several electrolytic capacitors
(Panasonic HFQ series or Nichicon PL series or Sanyo
MV-GX or equivalent) may be needed. For surface mount
designs, solid tantalum capacitors can be used, but caution
must be exercised with regard to the capacitor surge current
rating. These capacitors must be capable of handling the
surge-current at power-up. The TPS series available from
AVX, and the 593D series from Sprague are both surge
current tested.
Increasing the value of inductance reduces the ripple current
and voltage. However, larger inductance values reduce the
converter’s response time to a load transient.
One of the parameters limiting the converter’s response to a
load transient is the time required to change the inductor
current. Given a sufficiently fast control loop design, the
ISL6420A will provide either 0% or 100% duty cycle in
response to a load transient. The response time is the time
required to slew the inductor current from an initial current
value to the transient current level. During this interval the
difference between the inductor current and the transient
current level must be supplied by the output capacitor.
Minimizing the response time can minimize the output
capacitance required.
MOSFET Selection/Considerations
The ISL6420A requires 2 N-Channel power MOSFETs.
These should be selected based upon r
, gate supply
DS(ON)
requirements, and thermal management requirements.
In high-current applications, the MOSFET power dissipation,
package selection and heatsink are the dominant design
factors. The power dissipation includes two loss
components; conduction loss and switching loss.
The conduction losses are the largest component of power
dissipation for both the upper and the lower MOSFETs.
These losses are distributed between the two MOSFETs
according to duty factor (see the equations below). Only the
upper MOSFET has switching losses, since the Schottky
rectifier clamps the switching node before the synchronous
rectifier turns on.
The response time to a transient is different for the
application of load and the removal of load. The following
equations give the approximate response time interval for
application and removal of a transient load:
L
V
× I
O
TRAN
t
= -------------------------------
(EQ. 12)
RISE
– V
OUT
IN
L
× I
O
TRAN
t
= ------------------------------
(EQ. 13)
is the
FALL
V
OUT
where: I
is the transient load current step, t
RISE
2
1
TRAN
response time to the application of load, and t
--
P
= I ⋅ R
⋅ D +
I
⋅ V ⋅ t ⋅ f
IN sw sw
(EQ. 15)
UFET
O
DS(ON)
O
2
is the
FALL
response time to the removal of load. With a +5V input
source, the worst case response time can be either at the
application or removal of load and dependent upon the
output voltage setting. Be sure to check both of these
equations at the minimum and maximum output levels for
the worst case response time.
2
P
= I ⋅ R
⋅ (1 – D)
(EQ. 16)
LFET
O
DS(ON)
Where D is the duty cycle = Vo/Vin, t
interval, and f
SW
is the switching
is the switching frequency.
SW
FN9169.1
17
October 13, 2005
ISL6420A
These equations assume linear voltage-current transitions
and do not adequately model power loss due the reverse-
recovery of the lower MOSFET’s body diode. The
gate-charge losses are dissipated by the ISL6420A and
don't heat the MOSFETs. However, large gate-charge
increases the switching interval, t
which increases the
SW
upper MOSFET switching losses. Ensure that both
MOSFETs are within their maximum junction temperature at
high ambient temperature by calculating the temperature
rise according to package thermal-resistance specifications.
A separate heatsink may be necessary depending upon
MOSFET power, package type, ambient temperature and air
flow.
Schottky Selection
Rectifier D2 is a clamp that catches the negative inductor
swing during the dead time between turning off the lower
MOSFET and turning on the upper MOSFET. The diode must
be a Schottky type to prevent the parasitic MOSFET body
diode from conducting. It is acceptable to omit the diode and
let the body diode of the lower MOSFET clamp the negative
inductor swing, but efficiency will drop one or two percent as a
result. The diode's rated reverse breakdown voltage must be
greater than the maximum input voltage.
FN9169.1
18
October 13, 2005
ISL6420A
Quad Flat No-Lead Plas tic Package (QFN)
Micro Lead Frame Plas tic Package (MLFP)
L20.4x4
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VGGD-1 ISSUE I)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
1.00
0.05
1.00
NOTES
A
A1
A2
A3
b
0.80
0.90
-
-
-
0.02
-
0.65
9
0.20 REF
9
0.18
1.95
1.95
0.25
0.30
2.25
2.25
5, 8
D
4.00 BSC
-
D1
D2
E
3.75 BSC
9
2.10
7, 8
4.00 BSC
-
E1
E2
e
3.75 BSC
9
2.10
7, 8
0.50 BSC
-
k
0.20
0.35
-
0.60
20
5
-
-
L
0.75
8
N
2
Nd
Ne
P
3
5
3
-
-
-
0.60
12
9
θ
-
9
Rev. 2 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensionsare provided toassistwith PCBLandPattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
FN9169.1
19
October 13, 2005
ISL6420A
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
M20.15
N
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
INDEX
0.25(0.010)
M
B M
H
AREA
E
GAUGE
PLANE
INCHES
MIN
0.053
0.004
-
MILLIMETERS
-B-
SYMBOL
MAX
0.069
0.010
0.061
0.012
0.010
0.344
0.157
MIN
1.35
0.10
-
MAX
1.75
0.25
1.54
0.30
0.25
8.74
3.98
NOTES
A
A1
A2
B
-
1
2
3
-
L
0.25
0.010
SEATING PLANE
A
-
-A-
0.008
0.007
0.337
0.150
0.20
0.18
8.56
3.81
9
D
h x 45°
C
D
E
-
-C-
3
α
4
A2
e
A1
C
e
0.025 BSC
0.635 BSC
-
B
0.10(0.004)
H
h
0.228
0.0099
0.016
0.244
0.0196
0.050
5.80
0.26
0.41
6.19
0.49
1.27
-
0.17(0.007) M
C
A M B S
5
NOTES:
L
6
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
N
α
20
20
7
Publication Number 95.
0°
8°
0°
8°
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
Rev. 1 6/04
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.10mm (0.004 inch) total in excess of “B” di-
mension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN9169.1
20
October 13, 2005
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