ISL6753AAZA-T [INTERSIL]

ZVS Full-Bridge PWM Controller; ZVS全桥PWM控制器
ISL6753AAZA-T
型号: ISL6753AAZA-T
厂家: Intersil    Intersil
描述:

ZVS Full-Bridge PWM Controller
ZVS全桥PWM控制器

开关 光电二极管 信息通信管理 控制器
文件: 总15页 (文件大小:457K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL6753  
®
Data Sheet  
March 10, 2005  
FN9182.1  
ZVS Full-Bridge PWM Controller  
Features  
The ISL6753 is a high-performance, low-pin-count  
alternative zero-voltage switching (ZVS) full-bridge PWM  
controller. Like the ISL6551, it achieves ZVS operation by  
driving the upper bridge FETs at a fixed 50% duty cycle while  
the lower bridge FETS are trailing-edge modulated with  
adjustable resonant switching delays. Compared to the more  
familiar phase-shifted control method, this algorithm offers  
equivalent efficiency and improved overcurrent and light-  
load performance with less complexity in a lower pin count  
package.  
• Adjustable Resonant Delay for ZVS Operation  
• Voltage- or Current-Mode Operation  
• 3% Current Limit Threshold  
175µA Startup Current  
• Supply UVLO  
• Adjustable Deadtime Control  
• Adjustable Soft-Start  
• Adjustable Oscillator Frequency Up to 2MHz  
This advanced BiCMOS design features low operating  
current, adjustable oscillator frequency up to 2MHz,  
adjustable soft-start, internal over temperature protection,  
precision deadtime and resonant delay control, and short  
propagation delays. Additionally, Multi-Pulse Suppression  
ensures alternating output pulses at low duty cycles where  
pulse skipping may occur.  
• Tight Tolerance Error Amplifier Reference Over Line,  
Load, and Temperature  
• 5MHz GBWP Error Amplifier  
• Adjustable Cycle-by-Cycle Peak Current Limit  
• Fast Current Sense to Output Delay  
• 70ns Leading Edge Blanking  
Ordering Information  
• Multi-Pulse Suppression  
TEMP. RANGE  
(°C)  
PKG.  
PART NUMBER  
PACKAGE  
DWG. #  
• Buffered Oscillator Sawtooth Output  
• Internal Over Temperature Protection  
• Pb-free and ELV, WEEE, RoHS Compliant  
ISL6753AAZA  
(See Note)  
-40 to 105  
16 Ld QSOP  
(Pb-free)  
M16.15A  
Add -T suffix to part number for tape and reel packaging  
NOTE: Intersil Pb-free products employ special Pb-free material  
sets; molding compounds/die attach materials and 100% matte tin  
plate termination finish, which are RoHS compliant and compatible  
with both SnPb and Pb-free soldering operations. Intersil Pb-free  
products are MSL classified at Pb-free peak reflow temperatures that  
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
Applications  
• ZVS Full-Bridge Converters  
Telecom and Datacom Power  
• Wireless Base Station Power  
• File Server Power  
• Industrial Power Systems  
Pinout  
ISL6753 (QSOP)  
TOP VIEW  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VERR  
CTBUF  
RTD  
VREF  
SS  
VDD  
OUTLL  
OUTLR  
OUTUL  
OUTUR  
GND  
RESDEL  
CT  
FB  
RAMP  
CS  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2005. All Rights Reserved  
All other trademarks mentioned are the property of their respective owners.  
Functional Block Diagram  
VDD  
VDD  
OUTUL  
OUTUR  
50%  
VREF  
UVLO  
PWM  
STEERING  
LOGIC  
OVER-  
TEMPERATURE  
PROTECTION  
OUTLL  
OUTLR  
PWM  
GND  
VREF  
+
CS  
-
1.00V  
70 nS  
LEADING  
EDGE  
OVER CURRENT  
COMPARATOR  
RESDEL  
BLANKING  
80mV  
+
RAMP  
-
0.33  
PWM  
OSCILLATOR  
COMPARATOR  
CT  
VREF  
1 mA  
VREF  
RTD  
VERR  
FB  
CTBUF  
SS  
+
0.6V  
SOFTSTART  
CONTROL  
-
Typical Application - High Voltage Input ZVS Full-Bridge Converter  
P1  
VIN+  
Q1  
FQB6N50  
Q2  
T3  
P0544  
FQB6N50  
C17  
100pF  
250V  
COG  
R18  
10  
4
5
6
3
5%  
Q5  
3
2
3
2
2512  
Q6  
BSS138LT1  
BSS138LT1  
1
1
R16  
10.0k  
R13  
10.0k  
R15  
R14  
4.99  
0805  
8
1
CR3  
CR4  
4.99  
+
+
SS12  
SS12  
0805  
15, 16  
Ns  
T1  
C1-C4  
33uF  
450V  
2
1,C  
2, 3  
CR5  
+
+
R1  
4.7k  
5%  
CSD10060G  
13, 14  
11, 12  
P4  
300 - 400  
VDC  
Np  
RETURN  
7,8  
5,6  
7,8  
5,6  
C13  
0.1uF  
CR6  
2512  
CSD10060G  
Ns  
1
3
1
3
Q9  
6, 7  
Q10  
2
2
4
ZXTDB2M832  
R2  
4.7k  
5%  
ZXTDB2M832  
L1  
9, 10  
+
PB2020.103  
4
2
C18  
1uF  
100V  
1210  
R28  
10.0k  
2512  
1,C  
2512  
+
C19  
1uF  
C20  
C21  
470uF  
63V  
470uF  
63V  
R3  
4.7k  
5%  
100V  
1210  
P3  
Q4  
FQB6N50  
+ Vout  
2512  
(48V@10A)  
7,8  
5,6  
7,8  
5,6  
C16  
R19  
10  
100pF  
250V  
COG  
1
1
3
2
4
2
4
2512  
C12  
1.0uF  
Q3  
C22  
C23  
FQB6N50  
R17  
10.0  
4700pF  
250VAC  
SAFETY  
4700pF  
3
250VAC  
SAFETY  
Q8  
ZXTDB2M832  
P2  
VIN-  
Q7  
ZXTDB2M832  
8
7
U1  
ISL6753  
2
1
3
R27  
3
1
10.0k  
0805  
T2  
R11  
VERR  
VREF  
SS  
P8205  
3.65k  
R25  
CTBUF  
37.4k  
0805  
R21  
R26  
10.0k  
0805  
C15  
220pF  
CR1  
3.74k  
1206  
RTD  
VDD  
BAV70  
R8  
R5  
OUTLL  
OUTLR  
OUTUL  
OUTUR  
GND  
RESDEL  
CT  
45.3k  
100k  
1206  
R22  
3.74k  
1206  
CR7  
BAT54  
R4  
FB1  
3
1
4.7k  
5%  
U2  
PS2701-1P  
R20  
499  
RAMP  
CS  
2512  
4
3
1
2
2
R6  
R24  
100k  
R9  
C14  
5.11k  
499  
4.7nF  
2
3
Q11  
1
R12  
20.0k  
MJD50  
CR2  
BAT54C  
3
1
1
3
1
BIAS  
VR2  
BZX84-C6V8  
U3  
R29  
20.0k  
R30  
20.0k  
2
3
2
C6  
R7A, B  
180pF  
3
1
18.7  
R23  
5% COG  
C5  
0.1uF  
0805  
1.10k  
C10  
C11  
C8  
1.0nF  
C9  
0.47uF  
C7  
VR1  
R10  
10.0k  
0.1uF  
0.1uF  
47pF  
BZX84-C12  
ISL6753  
Absolute Maximum Ratings  
Thermal Information  
Thermal Resistance Junction to Ambient (Typical)  
16 Lead QSOP (Note 1). . . . . . . . . . . . . . . . . . . . . .  
Maximum Junction Temperature . . . . . . . . . . . . . . . .-55°C to 150°C  
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C  
(QSOP- Lead Tips Only)  
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . GND - 0.3V to +20.0V  
θ
(°C/W)  
95  
JA  
OUTxxx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VDD  
Signal Pins. . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to V  
+ 0.3V  
REF  
VREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 6.0V  
Peak GATE Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1A  
ESD Classification  
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3000V  
Charged Device Model (Per EOS/ESD DS5.3, 4/14/93) . . .1000V  
Operating Conditions  
Temperature Range  
ISL6753AAxx . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 105°C  
Supply Voltage Range (Typical). . . . . . . . . . . . . . . . . . . . 9-16 VDC  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTES:  
1. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
2. All voltages are with respect to GND.  
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application  
schematic. 9 V < VDD< 20 V, RTD = 10.0k, CT = 470pF, T = -40°C to 105°C (Note 3), Typical values are at  
A
T
= 25°C  
A
PARAMETER  
SUPPLY VOLTAGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Supply Voltage  
-
-
20  
400  
15.5  
9.00  
7.50  
-
-
µA  
mA  
V
Start-Up Current, IDD  
Operating Current, IDD  
UVLO START Threshold  
UVLO STOP Threshold  
Hysteresis  
VDD = 5.0V  
, C  
-
-
175  
11.0  
8.75  
7.00  
1.75  
R
= 0  
LOAD OUT  
8.00  
6.50  
-
V
V
REFERENCE VOLTAGE  
Overall Accuracy  
I
= 0 - -10mA  
4.850  
-
5.000  
5.150  
V
VREF  
Long Term Stability  
Operational Current (source)  
Operational Current (sink)  
Current Limit  
T
= 125°C, 1000 hours (Note 4)  
3
-
-
mV  
mA  
mA  
mA  
A
-10  
5
-
-
-
VREF = 4.85V  
-15  
-
-100  
CURRENT SENSE  
Current Limit Threshold  
CS to OUT Delay  
VERR = VREF  
Excl. LEB (Note 4)  
(Note 4)  
0.97  
1.00  
1.03  
50  
V
ns  
ns  
ns  
-
50  
-
35  
70  
-
Leading Edge Blanking (LEB) Duration  
CS to OUT Delay + LEB  
100  
130  
20  
T
= 25°C  
A
CS Sink Current Device Impedance  
Input Bias Current  
V
V
= 1.1V  
= 0.3V  
-
-
CS  
CS  
-1.0  
-
1.0  
µA  
RAMP  
RAMP Sink Current Device Impedance  
RAMP to PWM Comparator Offset  
V
= 1.1V  
-
-
20  
95  
RAMP  
T
= 25°C  
65  
80  
mV  
A
FN9182.1  
March 10, 2005  
4
ISL6753  
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application  
schematic. 9 V < VDD< 20 V, RTD = 10.0k, CT = 470pF, T = -40°C to 105°C (Note 3), Typical values are at  
A
T
= 25°C (Continued)  
A
PARAMETER  
TEST CONDITIONS  
MIN  
-5.0  
6.5  
TYP  
MAX  
-2.0  
8.0  
UNITS  
µA  
Bias Current  
V
= 0.3V  
-
-
RAMP  
Clamp Voltage  
(Note 4)  
V
PULSE WIDTH MODULATOR  
Minimum Duty Cycle  
VERR < 0.6V  
-
-
0
%
%
Maximum Duty Cycle (per half-cycle)  
VERR = 4.20V, V  
= 0V,  
RAMP  
V
= 0V (Note 5)  
-
-
-
94  
97  
99  
-
-
-
CS  
RTD = 2.00k, CT = 220pF  
RTD = 2.00k, CT = 470pF  
Zero Duty Cycle VERR Voltage  
VERR to PWM Comparator Input Offset  
VERR to PWM Comparator Input Gain  
Common Mode (CM) Input Range  
ERROR AMPLIFIER  
0.85  
0.7  
0.31  
0
-
0.8  
0.33  
-
1.20  
0.9  
V
V
T
= 25°C  
A
0.35  
V/V  
V
(Note 4)  
V
SS  
Input Common Mode (CM) Range  
GBWP  
(Note 4)  
(Note 4)  
0
5
-
VREF  
-
V
MHz  
V
-
-
VERR VOL  
I
I
= 2mA  
= 0mA  
-
0.4  
LOAD  
LOAD  
VERR VOH  
4.20  
0.8  
-
-
V
VERR Pull-Up Current Source  
EA Reference  
VERR = 2.5V  
= 25°C  
1.0  
0.600  
0.600  
1.3  
mA  
V
T
0.594  
0.590  
0.606  
0.612  
A
EA Reference + EA Input Offset Voltage  
OSCILLATOR  
V
Frequency Accuracy, Overall  
(Note 4)  
165  
-10  
-
183  
0.3  
201  
+10  
1.7  
kHz  
%
Frequency Variation with VDD  
Temperature Stability  
T
= 25°C, (F  
- - F  
)/F  
0°C 0°C  
%
A
20V  
10V 10V  
VDD = 10V, |F  
- F |/F  
-
-
4.5  
1.5  
-
-
%
-40°C  
|/F  
|F  
0°C  
- F  
105°C 25°C  
(Note 4)  
= 25°C  
Charge Current  
T
-193  
19  
-200  
20  
-207  
23  
µA  
A
Discharge Current Gain  
CT Valley Voltage  
CT Peak Voltage  
CT Pk-Pk Voltage  
RTD Voltage  
µA/µA  
Static Threshold  
Static Threshold  
Static Value  
0.75  
2.75  
1.92  
1.97  
0
0.80  
2.80  
2.00  
2.00  
-
0.88  
2.88  
2.05  
2.03  
2
V
V
V
V
RESDEL Voltage Range  
V
CTBUF Gain (V  
/V  
CTBUFp-p CTp-p  
)
V
V
= 0.8V, 2.6V  
= 0.8V  
1.95  
0.34  
-
2.0  
0.40  
-
2.05  
0.44  
0.10  
V/V  
V
CT  
CT  
CTBUF Offset from GND  
CTBUF VOH  
V(I  
V
= 0mA, I  
= -2mA),  
= 0mA),  
V
LOAD  
= 2.6V  
LOAD  
LOAD  
CT  
CTBUF VOL  
V(I  
V
= 2mA, I  
-
-
0.10  
V
LOAD  
= 0.8V  
CT  
FN9182.1  
March 10, 2005  
5
ISL6753  
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application  
schematic. 9 V < VDD< 20 V, RTD = 10.0k, CT = 470pF, T = -40°C to 105°C (Note 3), Typical values are at  
A
T
= 25°C (Continued)  
A
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
SOFT-START  
Charging Current  
SS Clamp Voltage  
SS = 3V  
-60  
4.410  
10  
-70  
4.500  
-
-80  
4.590  
-
µA  
V
SS Discharge Current  
Reset Threshold Voltage  
OUTPUTS  
SS = 2V  
= 25°C  
mA  
V
T
0.23  
0.27  
0.33  
A
High Level Output Voltage (VOH)  
Low Level Output Voltage (VOL)  
Rise Time  
I
I
= -10mA, VDD - VOH  
-
-
-
-
-
0.5  
0.5  
110  
90  
-
1.0  
1.0  
V
V
OUT  
OUT  
= 10mA, VOL - GND  
C
= 220pF, VDD = 15V(Note 4)  
= 220pF, VDD = 15V(Note 4)  
200  
150  
1.25  
ns  
ns  
V
OUT  
OUT  
Fall Time  
C
UVLO Output Voltage Clamp  
THERMAL PROTECTION  
Thermal Shutdown  
VDD = 7V, I  
= 1mA (Note 6)  
LOAD  
(Note 4)  
(Note 4)  
(Note 4)  
130  
115  
-
140  
125  
15  
150  
135  
-
°C  
°C  
°C  
Thermal Shutdown Clear  
Hysteresis, Internal Protection  
NOTE:  
3. Specifications at -40°C and 105°C are guaranteed by 25°C test with margin limits.  
4. Guaranteed by design, not 100% tested in production.  
5. This is the maximum duty cycle achievable using the specified values of RTD and CT. Larger or smaller maximum duty cycles may be obtained  
using other values for these components. See Equations 1 - 5.  
6. Adjust VDD below the UVLO stop threshold prior to setting at 7V.  
FN9182.1  
6
March 10, 2005  
ISL6753  
Typical Performance Curves  
25  
24  
23  
22  
21  
20  
19  
18  
1.02  
1.01  
1
0.99  
0.98  
40 25 10 5 20 35 50 65 80 95 110  
0
200  
400  
600  
800 1000  
Temperature (C)  
RTD Current (uA)  
FIGURE 1. REFERENCE VOLTAGE vs TEMPERATURE  
FIGURE 2. CT DISCHARGE CURRENT GAIN vs RTD CURRENT  
3
.
4
CT =  
.
1 10  
1 10  
1000pF  
680pF  
470pF  
330pF  
220pF  
100pF  
3
.
1 10  
100  
100  
10  
RTD=  
10k  
50k  
100k  
10  
0
10 20 30 40 50 60 70 80 90 100  
RTD (kohms)  
0.1  
1
10  
CT (nF)  
FIGURE 3. DEADTIME (DT) vs CAPACITANCE  
FIGURE 4. CAPACITANCE vs FREQUENCY  
RTD - This is the oscillator timing capacitor discharge  
current control pin. The current flowing in a resistor  
connected between this pin and GND determines the  
magnitude of the current that discharges CT. The CT  
discharge current is nominally 20x the resistor current. The  
PWM deadtime is determined by the timing capacitor  
discharge duration. The voltage at RTD is nominally 2.00V.  
Pin Descriptions  
VDD - VDD is the power connection for the IC. To optimize  
noise immunity, bypass VDD to GND with a ceramic  
capacitor as close to the VDD and GND pins as possible.  
Supply voltage under-voltage lock-out (UVLO) start and stop  
thresholds track each other resulting in relatively constant  
hysteresis.  
CS - This is the input to the overcurrent comparator. The  
overcurrent comparator threshold is set at 1.00V nominal.  
The CS pin is shorted to GND at the termination of either  
PWM output.  
GND - Signal and power ground connections for this device.  
Due to high peak currents and high frequency operation, a  
low impedance layout is necessary. Ground planes and  
short traces are highly recommended.  
Depending on the current sensing source impedance, a  
series input resistor may be required due to the delay  
between the internal clock and the external power switch.  
This delay may result in CS being discharged prior to the  
power switching device being turned off.  
VREF - The 5.00V reference voltage output having 3%  
tolerance over line, load and operating temperature. Bypass  
to GND with a 0.1µF to 2.2µF low ESR capacitor.  
CT - The oscillator timing capacitor is connected between  
this pin and GND. It is charged through an internal 200µA  
current source and discharged with a user adjustable current  
source controlled by RTD.  
RAMP - This is the input for the sawtooth waveform for the  
PWM comparator. The RAMP pin is shorted to GND at the  
termination of the PWM signal. A sawtooth voltage  
FN9182.1  
7
March 10, 2005  
ISL6753  
waveform is required at this input. For current-mode control  
this pin is connected to CS and the current loop feedback  
signal is applied to both inputs. For voltage-mode control,  
the oscillator sawtooth waveform may be buffered and used  
to generate an appropriate signal, RAMP may be connected  
to the input voltage through a RC network for voltage feed  
forward control, or RAMP may be connected to VREF  
through a RC network to produce the desired sawtooth  
waveform.  
Functional Description  
Features  
The ISL6753 PWM is an excellent choice for low cost ZVS  
full-bridge applications employing conventional output  
rectification. If synchronous rectification is required, please  
consider the ISL6752 or ISL6551 products.  
With the ISL6753’s many protection and control features, a  
highly flexible design with minimal external components is  
possible. Among its many features are support for both  
current- and voltage-mode control, a very accurate  
overcurrent limit threshold, thermal protection, a buffered  
sawtooth oscillator output suitable for slope compensation,  
voltage controlled resonant delay, and adjustable frequency  
with precise deadtime control.  
OUTUL and OUTUR - These outputs control the upper  
bridge FETs and operate at a fixed 50% duty cycle in  
alternate sequence. OUTUL controls the upper left FET and  
OUTUR controls the upper right FET. The left and right  
designation may be switched as long as they are switched in  
conjunction with the lower FET outputs, OUTLL and OUTLR.  
Oscillator  
RESDEL - Sets the resonant delay period between the  
toggle of the upper FETs and the turn on of either of the  
lower FETs. The voltage applied to RESDEL determines  
when the upper FETs switch relative to a lower FET turning  
on. Varying the control voltage from 0 to 2.00V increases the  
resonant delay duration from 0 to 100% of the deadtime. The  
control voltage divided by 2 represents the percent of the  
deadtime equal to the resonant delay. In practice the  
maximum resonant delay must be set lower than 2.00V to  
ensure that the lower FETs, at maximum duty cycle, are OFF  
prior to the switching of the upper FETs.  
The ISL6753 has an oscillator with a programmable  
frequency range to 2MHz, and can be programmed with an  
external resistor and capacitor.  
The switching period is the sum of the timing capacitor  
charge and discharge durations. The charge duration is  
determined by CT and a fixed 200µA internal current source.  
The discharge duration is determined by RTD and CT.  
3
T
11.5 10 CT  
S
(EQ. 1)  
C
OUTLL and OUTLR - These outputs control the lower  
bridge FETs, are pulse width modulated, and operate in  
alternate sequence. OUTLL controls the lower left FET and  
OUTLR controls the lower right FET. The left and right  
designation may be switched as long as they are switched in  
conjunction with the upper FET outputs, OUTUL and  
OUTUR.  
9  
(EQ. 2)  
T
≈ (0.06 RTD CT) + 50 10  
S
D
1
T
= T + T = ------------  
S
(EQ. 3)  
SW  
C
D
F
SW  
where T and T are the charge and discharge times,  
C
D
VERR - The control voltage input to the inverting input of the  
PWM comparator. The output of an external error amplifier  
(EA) is applied to this input for closed loop regulation. VERR  
has a nominal 1mA pull-up current source.  
respectively, T  
is the oscillator period, and F is the  
SW  
SW  
oscillator frequency. One output switching cycle requires two  
oscillator cycles. The actual times will be slightly longer than  
calculated due to internal propagation delays of  
approximately 10nS/transition. This delay adds directly to  
the switching duration, but also causes overshoot of the  
timing capacitor peak and valley voltage thresholds,  
effectively increasing the peak-to-peak voltage on the timing  
capacitor. Additionally, if very small discharge currents are  
used, there will be increased error due to the input  
impedance at the CT pin.  
FB - FB is the inverting input to the error amplifier (EA).  
SS - Connect the soft-start timing capacitor between this pin  
and GND to control the duration of soft-start. The value of  
the capacitor determines the rate of increase of the duty  
cycle during start up.  
SS may also be used to inhibit the outputs by grounding  
through a small transistor in an open collector/drain  
configuration.  
The maximum duty cycle, D, and percent deadtime, DT, can  
be calculated from:  
CTBUF - CTBUF is the buffered output of the sawtooth  
oscillator waveform present on CT and is capable of  
sourcing 2mA. It is offset from ground by 0.40V and has a  
nominal valley-to-peak gain of 2. It may be used for slope  
compensation.  
T
C
(EQ. 4)  
D = ------------  
T
SW  
DT = 1 D  
(EQ. 5)  
FN9182.1  
8
March 10, 2005  
ISL6753  
by the leading edge blanking (LEB) interval. The effective  
Soft-Start Operation  
delay is the sum of the two delays and is nominally 105nS.  
The ISL6753 features a soft-start using an external capacitor  
in conjunction with an internal current source. Soft-start  
reduces component stresses and surge currents during start  
up.  
Voltage Feed Forward Operation  
Voltage feed forward is a technique used to regulate the  
output voltage for changes in input voltage without the  
intervention of the control loop. Voltage feed forward is often  
implemented in voltage-mode control loops, but is redundant  
and unnecessary in peak current-mode control loops.  
Upon start up, the soft-start circuitry limits the error voltage  
input (VERR) to a value equal to the soft-start voltage. The  
output pulse width increases as the soft-start capacitor  
voltage increases. This has the effect of increasing the duty  
cycle from zero to the regulation pulse width during the soft-  
start period. When the soft-start voltage exceeds the error  
voltage, soft-start is completed. Soft-start occurs during  
start-up and after recovery from a fault condition. The soft-  
start charging period may be calculated as follows:  
Voltage feed forward operates by modulating the sawtooth  
ramp in direct proportion to the input voltage. Figure 5  
demonstrates the concept.  
VIN  
(EQ. 6)  
t = 64.3 C  
mS  
ERROR VOLTAGE  
RAMP  
where t is the charging period in mS and C is the value of the  
soft-start capacitor in µF.  
CT  
The soft-start voltage is clamped to 4.50V with a tolerance of  
2%. It is suitable for use as a “soft-started” reference  
provided the current draw is kept well below the 70µA  
charging current.  
OUTLL, LR  
The outputs may be inhibited by using the SS pin as a  
disable input. Pulling SS below 0.25V forces all outputs low.  
An open collector/drain configuration may be used to couple  
the disable signal into the SS pin.  
FIGURE 5. VOLTAGE FEED FORWARD BEHAVIOR  
Input voltage feed forward may be implemented using the  
RAMP input. An RC network connected between the input  
voltage and ground, as shown in Figure 7, generates a  
voltage ramp whose charging rate varies with the amplitude  
of the source voltage. At the termination of the active output  
pulse RAMP is discharged to ground so that a repetitive  
sawtooth waveform is created. The RAMP waveform is  
compared to the VERR voltage to determine duty cycle. The  
selection of the RC components depends upon the desired  
input voltage operating range and the frequency of the  
oscillator. In typical applications the RC components are  
selected so that the ramp amplitude reaches 1.0V at  
minimum input voltage within the duration of one half-cycle.  
Gate Drive  
The ISL6753 outputs are capable of sourcing and sinking  
10mA (at rated VOH, VOL) and are intended to be used in  
conjunction with integrated FET drivers or discrete bipolar  
totem pole drivers. The typical on resistance of the outputs is  
50.  
Overcurrent Operation  
The cycle-by-cycle peak current limit results in pulse-by-  
pulse duty cycle reduction when the current feedback signal  
exceeds 1.0V. When the peak current exceeds the  
threshold, the active output pulse is immediately terminated.  
This results in a decrease in output voltage as the load  
current increases beyond the current limit threshold. The  
ISL6753 operates continuously in an overcurrent condition  
without shutdown.  
If voltage-mode control is used in a bridge topology, it should  
be noted that peak current limit results in inherently unstable  
operation. The DC blocking capacitors used in voltage-mode  
bridge topologies become unbalanced, as does the flux in  
the transformer core. A latching overcurrent shutdown  
method using external components is recommended.  
The propagation delay from CS exceeding the current limit  
threshold to the termination of the output pulse is increased  
FN9182.1  
9
March 10, 2005  
ISL6753  
From the small signal current-mode model [1] it can be  
shown that the naturally-sampled modulator gain, Fm,  
without slope compensation, is  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VIN  
1
Fm = -------------------  
(EQ. 9)  
SnTsw  
ISL6753  
R3  
C7  
where Sn is the slope of the sawtooth signal and Tsw is the  
duration of the half-cycle. When an external ramp is added,  
the modulator gain becomes  
RAMP  
GND  
1
1
(EQ. 10)  
Fm = -------------------------------------- = ---------------------------  
(Sn + Se)Tsw m SnTsw  
c
where Se is slope of the external ramp and  
Se  
Sn  
m
= 1 + -------  
(EQ. 11)  
c
FIGURE 6. VOLTAGE FEED FORWARD CONTROL  
The charging time of the ramp capacitor is  
The criteria for determining the correct amount of external  
ramp can be determined by appropriately setting the  
damping factor of the double-pole located at half the  
oscillator frequency. The double-pole will be critically  
damped if the Q-factor is set to 1, and over-damped for Q >  
1, and under-damped for Q < 1. An under-damped condition  
can result in current loop instability.  
V
RAMP(PEAK)  
t = –R3 C7 ln 1 ---------------------------------------  
S
(EQ. 7)  
V
IN(MIN)  
For optimum performance, the maximum value of the  
capacitor should be limited to 10nF. The maximum DC  
current through the resistor should be limited to 2mA  
maximum. For example, if the oscillator frequency is  
400kHz, the minimum input voltage is 300V, and a 4.7nF  
ramp capacitor is selected, the value of the resistor can be  
determined by rearranging EQ. 7.  
1
(EQ. 12  
Q = -------------------------------------------------  
π(m (1 D) 0.5)  
c
where D is the percent of on time during a half cycle. Setting  
Q = 1 and solving for Se yields  
6  
t  
2.5 10  
R3 = ------------------------------------------------------------------------- = ------------------------------------------------------------  
9  
1
300  
V
RAMP(PEAK)  
4.7 10 ln 1 ---------  
C7 ln 1 ---------------------------------------  
1
1
π
  
(EQ. 13)  
-------------  
S
= S  
-- + 0.5  
1  
V
e
n
  
IN(MIN))  
1 D  
= 159  
kΩ  
(EQ. 8)  
Since Sn and Se are the on time slopes of the current ramp  
and the external ramp, respectively, they can be multiplied  
by Ton to obtain the voltage change that occurs during Ton.  
where t is equal to the oscillator period minus the deadtime.  
If the deadtime is short relative to the oscillator period, it can  
be ignored for this calculation.  
1
1
  
-------------  
V
= V  
-- + 0.5  
1  
(EQ. 14)  
e
n
  
1 D  
π
If feed forward operation is not desired, the RC network may  
be connected to VREF rather than the input voltage.  
Alternatively, a resistor divider from CTBUF may be used as  
the sawtooth signal. Regardless, a sawtooth waveform must  
be generated on RAMP as it is required for proper PWM  
operation.  
where Vn is the change in the current feedback signal during  
the on time and Ve is the voltage that must be added by the  
external ramp.  
Vn can be solved for in terms of input voltage, current  
transducer components, and output inductance yielding  
T
V R  
Slope Compensation  
N
SW  
CS  
O
S
1
π
----------------------------------------- -------  
V
=
-- + D 0.5  
V
(EQ. 15)  
e
N
P
N
L  
Peak current-mode control requires slope compensation to  
improve noise immunity, particularly at lighter loads, and to  
prevent current loop instability, particularly for duty cycles  
greater than 50%. Slope compensation may be  
CT  
O
where R  
is the current sense burden resistor, N is the  
CT  
CS  
current transformer turns ratio, L is the output inductance,  
O
accomplished by summing an external ramp with the current  
feedback signal or by subtracting the external ramp from the  
voltage feedback error signal. Adding the external ramp to  
the current feedback signal is the more popular method.  
V
is the output voltage, and Ns and Np are the secondary  
O
and primary turns, respectively.  
FN9182.1  
10  
March 10, 2005  
ISL6753  
The inductor current, when reflected through the isolation  
transformer and the current sense transformer to obtain the  
current feedback signal at the sense resistor yields  
peak amplitude of CT (0.4 - 4.4V). A typical application sums  
this signal with the current sense feedback and applies the  
result to the CS pin as shown in Figure 7.  
N
R  
D T  
N
  
  
  
S
CS  
SW  
S
------------------------  
--------------------  
-------  
V
=
I
+
V
V  
O
V
CS  
O
IN  
N
N  
2L  
O
N
P
1
P
CT  
(EQ. 16)  
2
3
4
5
6
7
8
CTBUF  
where V  
is the voltage across the current sense resistor  
CS  
and I is the output current at current limit.  
O
ISL6753  
R9  
Since the peak current limit threshold is 1.00V, the total  
current feedback signal plus the external ramp voltage must  
sum to this value.  
CS  
V
+ V  
= 1  
CS  
(EQ. 17)  
e
R6  
RCS  
C4  
Substituting EQs. 15 and 16 into EQ. 17 and solving for R  
yields  
CS  
N
N  
1
P
CT  
----------------------- ------------------------------------------------------  
R
=
(EQ. 18)  
CS  
N
V
O
S
1
D
-------  
I
+
T
-- + ---  
SW  
   
π
O
L
2
O
FIGURE 7. ADDING SLOPE COMPENSATION  
For simplicity, idealized components have been used for this  
discussion, but the effect of magnetizing inductance must be  
considered when determining the amount of external ramp  
to add. Magnetizing inductance provides a degree of slope  
compensation to the current feedback signal and reduces  
the amount of external ramp required. The magnetizing  
inductance adds primary current in excess of what is  
reflected from the inductor current in the secondary.  
Assuming the designer has selected values for the RC filter  
placed on the CS pin, the value of R9 required to add the  
appropriate external ramp can be found by superposition.  
(D(V  
0.4) + 0.4) ⋅ R6  
R6 + R9  
CTBUF  
(EQ. 22)  
V
V  
= ------------------------------------------------------------------------------  
CS  
V
e
Rearranging to solve for R9 yields  
V
DT  
IN  
SW  
(EQ. 19)  
I = -------------------------------  
A
(D(V  
0.4) V + V  
+ 0.4) ⋅ R6  
CS  
P
CTBUF  
e
L
R9 = ------------------------------------------------------------------------------------------------------------------  
V  
m
V
e
CS  
(EQ. 23)  
where V is the input voltage that corresponds to the duty  
IN  
cycle D and Lm is the primary magnetizing inductance. The  
effect of the magnetizing current at the current sense  
The value of R  
determined in EQ. 18 must be rescaled so  
CS  
that the current sense signal presented at the CS pin is that  
predicted by EQ. 16. The divider created by R6 and R9  
makes this necessary.  
resistor, R , is  
CS  
I R  
P
CS  
(EQ. 20)  
V  
= -------------------------  
V
CS  
N
CT  
R6 + R9  
----------------------  
R  
CS  
(EQ. 24)  
R′  
=
CS  
R9  
If V  
CS  
is greater than or equal to Ve, then no additional  
slope compensation is needed and R  
becomes  
CS  
Example:  
N
CT  
V
V
= 280V  
R
= -------------------------------------------------------------------------------------------------------------------------------------  
IN  
CS  
N
DT  
N
V
DT  
SW  
  
  
S
SW  
S
IN  
-------  
----------------  
-------  
I
+
V
V  
O
+ -------------------------------  
= 12V  
O
IN  
O
N
P
2L  
O
N
P
L
  
m
(EQ. 21)  
L
= 2.0µH  
O
Np/Ns = 20  
Lm = 2mH  
If V is less than Ve, then EQ. 18 is still valid for the value  
CS  
of R , but the amount of slope compensation added by the  
CS  
external ramp must be reduced by V  
.
CS  
I
= 55A  
O
Adding slope compensation is accomplished in the ISL6753  
using the CTBUF signal. CTBUF is an amplified  
representation of the sawtooth signal that appears on the CT  
pin. It is offset from ground by 0.4V and is 2x the peak-to-  
Oscillator Frequency, Fsw = 400kHz  
Duty Cycle, D = 85.7%  
N
= 50  
CT  
FN9182.1  
11  
March 10, 2005  
ISL6753  
R6 = 499Ω  
Solve for the current sense resistor, R , using EQ. 18.  
Using CT to provide slope compensation instead of CTBUF  
requires the same calculations, except that EQs. 21 and 22  
require modification. EQ. 21 becomes:  
CS  
R
= 15.1.  
CS  
2D R6  
R6 + R9  
V
V  
= ----------------------  
CS  
V
(EQ. 25)  
e
Determine the amount of voltage, Ve, that must be added to  
the current feedback signal using EQ. 15.  
and EQ. 22 becomes:  
Ve = 153mV  
(2D V + V ) ⋅ R6  
e
CS  
(EQ. 26)  
R9 = ------------------------------------------------------------  
V  
Next, determine the effect of the magnetizing current from  
EQ. 20.  
V
e
CS  
The buffer transistor used to create the external ramp from  
CT should have a sufficiently high gain so as to minimize the  
required base current. Whatever base current is required  
reduces the charging current into CT and will reduce the  
oscillator frequency.  
V  
CS  
= 91mV  
Using EQ. 23, solve for the summing resistor, R9, from  
CTBUF to CS.  
R9 = 30.1kΩ  
ZVS Full-Bridge Operation  
Determine the new value of R , R’ , using EQ. 24.  
CS CS  
The ISL6753 is a full-bridge zero-voltage switching (ZVS)  
PWM controller that behaves much like a traditional hard-  
switched topology controller. Rather than drive the diagonal  
bridge switches simultaneously, the upper switches (OUTUL,  
OUTUR) are driven at a fixed 50% duty cycle and the lower  
switches (OUTLL, OUTLR) are pulse width modulated on  
the trailing edge.  
R’  
CS  
= 15.4Ω  
The above discussion determines the minimum external  
ramp that is required. Additional slope compensation may be  
considered for design margin.  
f the application requires deadtime less than about 500nS,  
the CTBUF signal may not perform adequately for slope  
compensation. CTBUF lags the CT sawtooth waveform by  
300-400nS. This behavior results in a non-zero value of  
CTBUF when the next half-cycle begins when the deadtime  
is short.  
CT  
DEADTIME  
Under these situations, slope compensation may be added  
by externally buffering the CT signal as shown below.  
PWM  
PWM  
OUTLL  
OUTLR  
OUTUR  
PWM  
PWM  
1
2
3
4
5
6
7
8
VREF 16  
15  
14  
13  
12  
11  
10  
9
RESONANT  
DELAY  
ISL6753  
OUTUL  
RESDEL  
WINDOW  
CT  
CS  
R9  
FIGURE 9. BRIDGE DRIVE SIGNAL TIMING  
R6  
RCS  
C4  
CT  
FIGURE 8. ADDING SLOPE COMPENSATION USING CT  
FN9182.1  
12  
March 10, 2005  
ISL6753  
To understand how the ZVS method operates one must  
include the parasitic elements of the circuit and examine a  
full switching cycle.  
the node to VIN and then forward biases the body diode of  
upper switch UR.  
VIN+  
UL  
UR  
VIN+  
IS  
D1  
UL  
UR  
D1  
VOUT+  
RTN  
LL  
VOUT+  
RTN  
LL  
IP  
LL  
LR  
LL  
LR  
D2  
D2  
VIN-  
VIN-  
FIGURE 12. UL - UR FREE-WHEELING PERIOD  
FIGURE 10. IDEALIZED FULL-BRIDGE  
The primary leakage inductance, L , maintains the current  
L
In Figure 10, the power semiconductor switches have been  
replaced by ideal switch elements with parallel diodes and  
capacitance, the output rectifiers are ideal, and the  
which now circulates around the path of switch UL, the  
transformer primary, and switch UR. When switch LR opens,  
the output inductor current free-wheels through both output  
diodes, D1 and D2. This condition persists through the  
remainder of the half-cycle.  
transformer leakage inductance has been included as a  
discrete element. The parasitic capacitance has been  
lumped together as switch capacitance, but represents all  
parasitic capacitance in the circuit including winding  
capacitance. Each switch is designated by its position, upper  
left (UL), upper right (UR), lower left (LL), and lower right  
(LR). The beginning of the cycle, shown in Figure 11, is  
arbitrarily set as having switches UL and LR on and UR and  
LL off. The direction of the primary and secondary currents  
During the period when CT discharges, also referred to as  
the deadtime, the upper switches toggle. Switch UL turns off  
and switch UR turns on. The actual timing of the upper  
switch toggle is dependent on RESDEL which sets the  
resonant delay. The voltage applied to RESDEL determines  
how far in advance the toggle occurs prior to a lower switch  
turning on. The ZVS transition occurs after the upper  
switches toggle and before the diagonal lower switch turns  
on. The required resonant delay is 1/4 of the period of the LC  
resonant frequency of the circuit formed by the leakage  
inductance and the parasitic capacitance. The resonant  
transition may be estimated from EQ. 27.  
are indicated by I and I , respectively.  
P
S
VIN+  
UL  
LL  
UR  
LR  
IS  
D1  
VOUT+  
RTN  
LL  
IP  
π
2
1
-------------------------------------  
τ =  
(EQ. 27)  
2
1
R
-------------- – ---------  
2
L
L C  
D2  
L
P
4L  
VIN-  
where τ is the resonant transition time, L is the leakage  
L
FIGURE 11. UL - LR POWER TRANSFER CYCLE  
inductance, C is the parasitic capacitance, and R is the  
P
equivalent resistance in series with L and C .  
L
P
The UL - LR power transfer period terminates when switch  
LR turns off as determined by the PWM. The current flowing  
in the primary cannot be interrupted instantaneously, so it  
must find an alternate path. The current flows into the  
parasitic switch capacitance of LR and UR which charges  
The resonant delay is always less than or equal to the  
deadtime and may be calculated using the following  
equation.  
V
resdel  
2
-------------------  
τ
=
DT  
S
(EQ. 28)  
resdel  
where τ  
resdel  
is the desired resonant delay, V  
voltage between 0 and 2V applied to the RESDEL pin, and  
DT is the deadtime (see EQs. 1 - 5).  
is a  
resdel  
When the upper switches toggle, the primary current that  
was flowing through UL must find an alternate path. It  
charges/discharges the parasitic capacitance of switches UL  
and LL until the body diode of LL is forward biased. If  
FN9182.1  
13  
March 10, 2005  
ISL6753  
RESDEL is set properly, switch LL will be turned on at this  
time.  
and LR until the body diode of LR is forward biased. If  
RESDEL is set properly, switch LR will be turned on at this  
time.  
VIN+  
UL  
UR  
VIN+  
IS  
D1  
UL  
UR  
IS  
D1  
VOUT+  
RTN  
LL  
VOUT+  
RTN  
LL  
IP  
IP  
LL  
LR  
LL  
LR  
D2  
D2  
VIN-  
VIN-  
FIGURE 13. UPPER SWITCH TOGGLE AND RESONANT  
TRANSITION  
FIGURE 16. UPPER SWITCH TOGGLE AND RESONANT  
TRANSITION  
The second power transfer period commences when switch  
LL closes. With switches UR and LL on, the primary and  
secondary currents flow as indicated below.  
The first power transfer period commences when switch LR  
closes and the cycle repeats. The ZVS transition requires  
that the leakage inductance has sufficient energy stored to  
fully charge the parasitic capacitances. Since the energy  
VIN+  
2
UL  
LL  
UR  
LR  
stored is proportional to the square of the current (1/2 L I  
,
L P  
D1  
D2  
the ZVS resonant transition is load dependent. If the leakage  
inductance is not able to store sufficient energy for ZVS, a  
discrete inductor may be added in series with the  
transformer primary.  
VOUT+  
RTN  
LL  
Fault Conditions  
A fault condition occurs if VREF or VDD fall below their  
undervoltage lockout (UVLO) thresholds or if the thermal  
protection is triggered. When a fault is detected, the soft-  
start capacitor is quickly discharged, and the outputs are  
disabled low. When the fault condition clears and the soft-  
start voltage is below the reset threshold, a soft-start cycle  
begins.  
VIN-  
FIGURE 14. UR - LL POWER TRANSFER  
The UR - LL power transfer period terminates when switch  
LL turns off as determined by the PWM. The current flowing  
in the primary must find an alternate path. The current flows  
into the parasitic switch capacitance which charges the node  
to VIN and then forward biases the body diode of upper  
An overcurrent condition is not considered a fault and does  
not result in a shutdown.  
switch UL. The primary leakage inductance, L , maintains  
L
the current, which now circulates around the path of switch  
UR, the transformer primary, and switch UL. When switch LL  
opens, the output inductor current free-wheels through both  
output diodes, D1 and D2. This condition persists through  
the remainder of the half-cycle.  
Thermal Protection  
Internal die over temperature protection is provided. An  
integrated temperature sensor protects the device should  
the junction temperature exceed 140°C. There is  
approximately 15°C of hysteresis.  
VIN+  
Ground Plane Requirements  
UL  
UR  
IS  
D1  
Careful layout is essential for satisfactory operation of the  
device. A good ground plane must be employed. VDD and  
VREF should be bypassed directly to GND with good high  
frequency capacitance.  
VOUT+  
RTN  
LL  
IP  
LL  
LR  
References  
D2  
[1] Ridley, R., “A New Continuous-Time Model for Current  
Mode Control”, IEEE Transactions on Power  
Electronics, Vol. 6, No. 2, April 1991.  
VIN-  
FIGURE 15. UR - UL FREE-WHEELING PERIOD  
When the upper switches toggle, the primary current that  
was flowing through UR must find an alternate path. It  
charges/discharges the parasitic capacitance of switches UR  
FN9182.1  
14  
March 10, 2005  
ISL6753  
Shrink Small Outline Plastic Packages (SSOP)  
Quarter Size Outline Plastic Packages (QSOP)  
M16.15A  
N
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
(0.150” WIDE BODY)  
INDEX  
M
M
B
0.25(0.010)  
H
AREA  
3
E
INCHES  
MILLIMETERS  
GAUGE  
PLANE  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.55  
0.102  
1.40  
0.20  
0.191  
4.80  
3.81  
MAX  
1.73  
0.249  
1.55  
0.31  
0.249  
4.98  
3.99  
NOTES  
A
A1  
A2  
B
0.061  
0.004  
0.055  
0.008  
0.0075  
0.189  
0.150  
0.068  
0.0098  
0.061  
0.012  
0.0098  
0.196  
0.157  
-
1
2
-
L
-
0.25  
0.010  
SEATING PLANE  
A
9
-A-  
D
h x 45°  
C
D
E
-
3
-C-  
4
α
A2  
e
A1  
e
0.025 BSC  
0.635 BSC  
-
C
B
H
h
0.230  
0.010  
0.016  
0.244  
0.016  
0.035  
5.84  
0.25  
0.41  
6.20  
0.41  
0.89  
-
0.10(0.004)  
M
M
S
B
0.17(0.007)  
C
A
5
L
6
NOTES:  
N
α
16  
16  
7
1. Symbols are defined in the “MO Series Symbol List” in Section  
0°  
8°  
0°  
8°  
-
2.2 of Publication Number 95.  
Rev. 2 6/04  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.15mm (0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions.  
Interlead flash and protrusions shall not exceed 0.25mm (0.010  
inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual  
index feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “B” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.10mm (0.004 inch) total in excess  
of “B” dimension at maximum material condition.  
10. Controlling dimension: INCHES. Converted millimeter dimen-  
sions are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN9182.1  
15  
March 10, 2005  

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