ISL80102_11 [INTERSIL]
High Performance 2A and 3A Linear Regulators; 高性能2A和3A线性稳压器型号: | ISL80102_11 |
厂家: | Intersil |
描述: | High Performance 2A and 3A Linear Regulators |
文件: | 总15页 (文件大小:845K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Performance 2A and 3A Linear Regulators
ISL80102, ISL80103
The ISL80102 and ISL80103 are low voltage, high-current, single
output LDOs specified for 2A and 3A output current, respectively.
These LDOs operate from input voltages of 2.2V to 6V and are
capable of providing output voltages of 0.8V to 5V on the
Features
• Stable with all Capacitor Types (Note 11)
• 2A and 3A Output Current Ratings
• 2.2V to 6V Input Voltage Range
adjustable V
versions. Fixed output voltage options are
OUT
• ±1.8% V
OUT
T = -40°C to +125°C
J
Accuracy Guaranteed Over Line, Load and
available in 1.8V, 2.5V, 3.3V and 5V. Other custom voltage
options available upon request.
• Very Low 120mV Dropout Voltage at 3A (ISL80103)
For applications that demand in-rush current less than the
current limit, an external capacitor on the soft-start pin provides
adjustment. The ENABLE feature allows the part to be placed into
a low quiescent current shutdown mode. A sub-micron BiCMOS
process is utilized for this product family to deliver the best in
class analog performance and overall value.
• Fixed and Adjustable V
OUT
Versions
• Very Fast Transient Response
• Excellent 62dB PSRR
• 100µV
Output Noise
RMS
These CMOS LDOs will consume significantly lower quiescent
current as a function of load over bipolar LDOs, which translates
into higher efficiency and the ability to consider packages with
smaller footprints. Quiescent current is modestly compromised
to enable a leading class fast load transient response, and hence
a lower total AC regulation band for an LDO in this category.
• Power-Good Output
• Adjustable In-Rush Current Limiting
• Short Circuit and Over-Temperature Protection
• Available in a 10 Ld DFN (now), 5 Ld TO220 and 5 Ld TO263
(soon)
Applications
• Servers
• Telecommunications and Networking
• Medical Equipment
• Instrumentation Systems
• Routers and Switchers
ISL80102, ISL80103
1.8V ±1.8%
2.5V ±10%
1
2
9
V
OUT
V
VOUT
VOUT
VIN
VIN
IN
C
C
10
OUT
IN
10µF
10µF
R
PG
100kΩ
ON
3
SENSE
PG
7
6
ENABLE
SS
OFF
4
PGOOD
*C
SS
GND
5
*CSS is optional, (see Note 12) on page 5.
FIGURE 1. TYPICAL APPLICATION
March 24, 2011
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2009-2011. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1
FN6660.2
ISL80102, ISL80103
Block Diagram
VIN
R5
IL/10,000
M4
10µA
10µA
M5
M3
M1
POWER PMOS
IL
VOUT
+
-
LEVEL
SHIFT
R8
R9
M6
R1
R7
EN
EN
SENSE
-
500mV
+
R2
R4
EN
ADJ
PG
+
EN
-
ENABLE
SS
M7
M8
-
+
-
M2
500mV
+
V TO I
+
-
*R3
485mV
EN
GND
*R3 is open for ADJ versions.
Ordering Information
PART NUMBER
(Notes 1, 2, 4)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG
DWG. #
V
VOLTAGE
ADJ
OUT
ISL80102IRAJZ
DZJA
DZNA
DZPA
DZRA
DZSA
DZAA
DZEA
DZFA
DZGA
DZHA
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
10 Ld 3x3 DFN
L10.3x3
L10.3x3
L10.3x3
L10.3x3
L10.3x3
L10.3x3
L10.3x3
L10.3x3
L10.3x3
L10.3x3
ISL80102IR18Z
ISL80102IR25Z
ISL80102IR33Z
ISL80102IR50Z
ISL80103IRAJZ
ISL80103IR18Z
ISL80103IR25Z
ISL80103IR33Z
ISL80103IR50Z
NOTES:
1.8V
2.5V
3.3V (Note 3)
5.0V (Note 3)
ADJ
1.8V
2.5V
3.3V (Note 3)
5.0V (Note 3)
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-
free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. The 3.3V and 5V fixed output voltages will be released in the future. Please contact Intersil Marketing for more details.
4. For Moisture Sensitivity Level (MSL), please see device information page for ISL80102, ISL80103. For more information on MSL please see tech brief
TB363.
FN6660.2
March 24, 2011
2
ISL80102, ISL80103
Pin Configuration
ISL80102, ISL80103
(10 LD 3x3 DFN)
TOP VIEW
V
V
V
V
1
2
3
4
5
10
9
OUT
OUT
IN
IN
SENSE/ADJ
PG
DNC
8
7
ENABLE
SS
GND
6
Pin Descriptions
PIN NUMBER
PIN NAME
DESCRIPTION
1, 2
V
Output voltage pin.
OUT
3
4
SENSE/ADJ Remote voltage sense for internally fixed V
options. ADJ pin for externally set V
.
OUT
OUT
PG
GND
V
in regulation signal. Logic low defines when V is not in regulation. Must be grounded if not used.
OUT
OUT
5
GND pin.
6
SS
External cap adjusts in-rush current.
7
ENABLE
DNC
V
independent chip enable. TTL and CMOS compatible.
IN
8
Do not connect this pin to ground or supply. Leave floating.
Input supply pin.
9, 10
V
IN
EPAD
EPAD at ground potential. Soldering it directly to GND plane is optional.
Typical Application
ISL80102, ISL80103
1.8V
2.5V ±10%
1
2
9
V
VOUT
VOUT
V
OUT
IN
VIN
VIN
C
OUT
C
10
IN
10µF
10µF
R
PG
100kΩ
R
1
10kΩ
4
PGOOD
PG
7
6
ENABLE
SS
EN
OPEN DRAIN COMPATIBLE
**C
PB
R
3
2.61kΩ
1500pF
3
ADJ
*C
SS
GND
R
4
5
1.0kΩ
*CSS is optional, (see Note 12) on page 5.
**C is optional. See “Functional Description” on page 12 for more information.
PB
FIGURE 2. TYPICAL APPLICATION DIAGRAM
FN6660.2
March 24, 2011
3
ISL80102, ISL80103
Absolute Maximum Ratings (Note 7)
Thermal Information
V
V
Relative to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Relative to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Thermal Resistance (Typical)
10 Ld 3x3 DFN Package (Notes 5, 6). . . . .
θ
JA (°C/W)
48
θ
JC (°C/W)
IN
OUT
4
PG, ENABLE, SENSE/ADJ, SS, Relative to GND. . . . . . . . . . . -0.3V to +6.5V
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . .+150°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions (Note 10)
Junction Temperature Range (T ) . . . . . . . . . . . . . . . . . . .-40°C to +125°C
J
VIN Relative to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.2V to 6V
V
Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800mV to 5V
OUT
PG, ENABLE, SENSE/ADJ, SS Relative to GND . . . . . . . . . . . . . . . . 0V to 6V
PG Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
JA
Brief TB379.
6. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
7. ABS max voltage rating is defined as the voltage applied for a lifetime average duty cycle above 6V of 1%.
Electrical Specifications Unless otherwise noted, all parameters are established over the following specified conditions:
V
= V
OUT
+ 0.4V, V
OUT
= 1.8V, C = C
IN
= 10µF, T = +25°C, I
= 0A. Applications must follow thermal guidelines of the package to
IN
OUT
J
LOAD
determine worst case junction temperature. Please refer to “Functional Description” on page 12 and Tech Brief TB379.
Boldface limits apply over the operating temperature range, -40°C to +125°C. Pulse load techniques used by ATE to ensure T = T defines
J
A
established limits.
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 8)
TYP
0.5
(Note 8)
UNITS
DC CHARACTERISTICS
DC Output Voltage Accuracy
V
V
V
Options: 1.8V.
OUT
%
%
%
%
OUT
=2.2V; I
= 0A
IN
LOAD
V
Options: 1.8V.
-1.8
1.8
OUT
2.2V < V < 3.6V; 0A < I
< 3A
LOAD
IN
LOAD
= 0A
V
V
Options: 2.5V
0.5
OUT
=V
+ 0.4V; I
IN OUT
LOAD
V
V
Options: 2.5V
-1.8
491
-1.8
OUT
OUT
+ 0.4V < V < 6V; 0A < I
< 3A
IN
Feedback Pin (ADJ Version)
DC Input Line Regulation
V
2.2V < V < 6V, 0A < I
IN
< 3A
LOAD
500
0.1
0.1
509
0.4
0.8
mV
%
FB
ΔV /ΔV
OUT
V
+ 0.4V < V < 3.6V, V = 1.8V
IN OUT
IN
OUT
OUT
V
+ 0.4V < V < 6V, V
= 2.5V
%
IN OUT
DC Output Load Regulation
ΔV
/ΔI
0A < I
0A < I
< 3A, All voltage options
< 2A, All voltage options
-0.8
-0.6
%
OUT
OUT
LOAD
LOAD
%
Feedback Input Current
Ground Pin Current
V
= 0.5V
0.01
7.5
1
9
µA
mA
mA
µA
µA
mV
mV
A
ADJ
I
I
I
= 0A, 2.2V < V < 6V
IN
Q
LOAD
LOAD
= 3A, 2.2V < V < 6V
IN
8.5
0.4
3.3
120
81
12
Ground Pin Current in Shutdown
Dropout Voltage (Note 9)
I
ENABLE Pin = 0.2V, V = 5V
IN
SHDN
ENABLE Pin = 0.2V, V = 6V
IN
16
V
I
I
= 3A, V
= 2.5V, 10 LD 3x3 DFN
= 2.5V, 10 LD 3x3 DFN
185
125
DO
LOAD
LOAD
OUT
OUT
= 2A, V
Output Short Circuit Current
(3A Version)
ISC
V
= 0V, V
+ 0.4V < V < 6V
IN
5.0
OUT
OUT
Output Short Circuit Current
(2A Version)
V
= 0V, V
+ 0.4V < V < 6V
IN
2.8
A
OUT
OUT
FN6660.2
March 24, 2011
4
ISL80102, ISL80103
Electrical Specifications Unless otherwise noted, all parameters are established over the following specified conditions:
V
= V
OUT
+ 0.4V, V
OUT
= 1.8V, C = C
IN
= 10µF, T = +25°C, I
= 0A. Applications must follow thermal guidelines of the package to
IN
OUT
J
LOAD
determine worst case junction temperature. Please refer to “Functional Description” on page 12 and Tech Brief TB379.
Boldface limits apply over the operating temperature range, -40°C to +125°C. Pulse load techniques used by ATE to ensure T = T defines
J
A
established limits. (Continued)
MIN
MAX
PARAMETER
SYMBOL
TSD
TEST CONDITIONS
(Note 8)
TYP
160
15
(Note 8)
UNITS
°C
Thermal Shutdown Temperature
V
V
+ 0.4V < V < 6V
OUT
IN
Thermal Shutdown Hysteresis
(Rising Threshold)
TSDn
+ 0.4V < V < 6V
°C
OUT
IN
AC CHARACTERISTICS
Input Supply Ripple Rejection
PSRR
f = 1kHz, I
= 1A; V = 2.2V
IN
55
62
dB
dB
LOAD
f = 120Hz, I
= 1A; V = 2.2V
IN
LOAD
Output Noise Voltage
I
= 10mA, BW = 300Hz < f < 300kHz
100
µV
LOAD
RMS
ENABLE PIN CHARACTERISTICS
Turn-on Threshold
V
2.2V < V < 6V
IN
0.3
0.8
135
150
0.95
1
V
EN(HIGH)
Hysteresis (Rising Threshold)
Enable Pin Turn-on Delay
Enable Pin Leakage Current
SOFT-START CHARACTERISTICS
Reset Pull-Down resistance
Soft-Start Charge Current
PG PIN CHARACTERISTICS
V
2.2V < V < 6V
IN
mV
EN(HYS)
t
C
= 10µF, I
= 1A
µs
EN
OUT
LOAD
V
= 6V, EN = 3V
µA
IN
R
323
-4.5
Ω
PD
I
-7
-2
µA
CHG
V
PG Flag Threshold
PG Flag Hysteresis
75
84
4
92
%V
OUT
OUT
OUT
V
%
PG Flag Low Voltage
PG Flag Leakage Current
NOTES:
I
= 500µA
47
100
1
mV
µA
SINK
V
= 6V, PG = 6V
0.05
IN
8. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
9. Dropout is defined by the difference in supply V and V when the supply produces a 2% drop in V from its nominal value.
IN OUT OUT
10. Electromigration specification defined as lifetime average junction temperature of +110°C where max rated DC current = lifetime average current.
11. Minimum cap of 10µF X5R/X7R on V and V required for stability.
IN OUT
12. If the current limit for in-rush current is acceptable in application, do not use this feature. Used only when large bulk capacitance required on V
application.
for
OUT
FN6660.2
March 24, 2011
5
ISL80102, ISL80103
Typical Operating Performance
Unless otherwise noted: V = 2.2V, V
IN
= 1.8V, C = C
IN
= 10µF, T = +25°C, I = 0A.
OUT J L
OUT
1.8
1.2
0.6
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
+125°C
+25°C
-40°C
-0.6
-1.2
-1.8
0
1
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
SUPPLY VOLTAGE (V)
JUNCTION TEMPERATURE (°C)
FIGURE 4. OUTPUT VOLTAGE vs SUPPLY VOLTAGE
FIGURE 3. ΔV
vs TEMPERATURE
OUT
1.8
1.2
9
8
7
6
5
4
3
2
1
0
0.6
+25°C
0.0
-0.6
-1.2
-1.8
-40°C
+125°C
1.0
0
0.5
1.5
2.0
2.5
3.0
2
3
4
5
6
OUTPUT CURRENT (A)
INPUT VOLTAGE (V)
FIGURE 6. GROUND CURRENT vs SUPPLY VOLTAGE
FIGURE 5. ΔV
vs OUTPUT CURRENT
OUT
12.0
9.1
8.9
8.7
8.5
8.3
8.1
7.9
7.7
7.5
11.5
11.0
10.5
10.0
9.5
-40°C
-40°C
+25°C
9.0
+125°C
+125°C
1.0
8.5
+25°C
2.0
8.0
7.5
0.8
1.4
2.6
3.2
3.8
4.4
5.0
0
0.5
1.5
2.0
2.5
3.0
OUTPUT VOLTAGE (V)
OUTPUT CURRENT (A)
FIGURE 8. GROUND CURRENT vs OUTPUT VOLTAGE
FIGURE 7. GROUND CURRENT vs OUTPUT CURRENT
FN6660.2
March 24, 2011
6
ISL80102, ISL80103
Typical Operating Performance
Unless otherwise noted: V = 2.2V, V
IN
= 1.8V, C = C
IN
= 10µF, T = +25°C, I = 0A. (Continued)
OUT J L
OUT
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
12
11
10
9
8
7
6
5
4
3
2
V
= 5V
V
= 6V
IN
IN
1
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
TEMPERATURE (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
TEMPERATURE (°C)
FIGURE 10. SHUTDOWN CURRENT vs TEMPERATURE
FIGURE 9. SHUTDOWN CURRENT vs TEMPERATURE
150
140
130
120
110
100
90
80
70
60
50
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
2A
3A
40
30
20
10
1A
0
0
0.5
1.0
1.5
2.0
2.5
3.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
TEMPERATURE (°C)
OUTPUT CURRENT (A)
FIGURE 11. DROPOUT VOLTAGE vs TEMPERATURE
FIGURE 12. DROPOUT VOLTAGE vs OUTPUT CURRENT
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
V
(1V/DIV)
IN
SS (1V/DIV)
V
(1V/DIV)
OUT
PG (1V/DIV)
-40 -25 -10
5
20 35 50 65 80 95 110 125
JUNCTION TEMPERATURE (°C)
TIME (10ms/DIV)
FIGURE 14. POWER-UP (V = 2.2V)
IN
FIGURE 13. ENABLE THRESHOLD VOLTAGE vs TEMPERATURE
FN6660.2
March 24, 2011
7
ISL80102, ISL80103
Typical Operating Performance
Unless otherwise noted: V = 2.2V, V
IN OUT
= 1.8V, C = C
IN
= 10µF, T = +25°C, I = 0A. (Continued)
OUT J L
EN (1V/DIV)
SS (1V/DIV)
V
(1V/DIV)
IN
SS (1V/DIV)
V
(1V/DIV)
V
(1V/DIV)
OUT
OUT
PG (1V/DIV)
PG (1V/DIV)
TIME (50µs/DIV)
TIME (10ms/DIV)
FIGURE 15. POWER-DOWN (V = 2.2V)
IN
FIGURE 16. ENABLE START-UP
300
250
200
150
100
50
EN (1V/DIV)
SS (1V/DIV)
V
(1V/DIV)
OUT
0
PG (1V/DIV)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INPUT VOLTAGE (V)
TIME (5ms/DIV)
FIGURE 17. ENABLE SHUTDOWN
FIGURE 18. START-UP TIME vs SUPPLY VOLTAGE
7.0
300
250
200
150
100
50
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
ISL80103
ISL80102
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
FIGURE 19. START-UP TIME vs TEMPERATURE
FIGURE 20. CURRENT LIMIT vs TEMPERATURE
FN6660.2
March 24, 2011
8
ISL80102, ISL80103
Typical Operating Performance
Unless otherwise noted: V = 2.2V, V
IN
= 1.8V, C = C
IN
= 10µF, T = +25°C, I = 0A. (Continued)
OUT J L
OUT
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
ISL80103
ISL80102
V
(1V/DIV)
OUT
I
(1A/DIV)
OUT
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INPUT VOLTAGE (V)
TIME (10ms/DIV)
FIGURE 21. CURRENT LIMIT vs SUPPLY VOLTAGE
FIGURE 22. CURRENT LIMIT RESPONSE (ISL80102)
V
(1V/DIV)
OUT
V
(1V/DIV)
OUT
I
(1A/DIV)
OUT
I
(2A/DIV)
OUT
TIME (100ms/DIV)
TIME (20ms/DIV)
FIGURE 24. CURRENT LIMIT RESPONSE (ISL80103)
FIGURE 23. THERMAL CYCLING (ISL80102)
EN (1V/DIV)
V
(1V/DIV)
OUT
I
(2A/DIV)
(1V/DIV)
OUT
I
(2A/DIV)
OUT
V
OUT
TIME (1ms/DIV)
TIME (50ms/DIV)
FIGURE 26. IN-RUSH CURRENT WITH NO SOFT-START
CAPACITOR, C = 1000µF
FIGURE 25. THERMAL CYCLING (ISL80103)
OUT
FN6660.2
March 24, 2011
9
ISL80102, ISL80103
Typical Operating Performance
Unless otherwise noted: V = 2.2V, V
IN OUT
= 1.8V, C = C
IN
= 10µF, T = +25°C, I = 0A. (Continued)
OUT
J
L
EN (1V/DIV)
EN (1V/DIV)
I
(2A/DIV)
I
(2A/DIV)
OUT
OUT
V
(1V/DIV)
V
(1V/DIV)
OUT
OUT
TIME (1ms/DIV)
TIME (1ms/DIV)
FIGURE 27. IN-RUSH WITH 22nF SOFT-START CAPACITOR,
= 1000µF
FIGURE 28. IN-RUSH WITH 47nF SOFT-START CAPACITOR,
= 1000µF
C
C
OUT
OUT
V
(50mV/DIV)
(2A/DIV)
OUT
V
(50mV/DIV)
(2A/DIV)
OUT
I
I
OUT
OUT
di/dt = 30A/µs
di/dt = 30A/µs
TIME (200µs/DIV)
TIME (200µs/DIV)
FIGURE 29. LOAD TRANSIENT 0A TO 3A, C
= 10µF CERAMIC
FIGURE 30. LOAD TRANSIENT 0A TO 3A, C
+ 100µF OSCON
= 10µF CERAMIC
OUT
OUT
V
(50mV/DIV)
V
(50mV/DIV)
OUT
OUT
I
(2A/DIV)
I
(2A/DIV)
OUT
OUT
di/dt = 30A/µs
di/dt = 30A/µs
TIME (200µs/DIV)
TIME (200µs/DIV)
FIGURE 31. LOAD TRANSIENT 1A TO 3A, C
= 10µF CERAMIC
FIGURE 32. LOAD TRANSIENT 1A TO 3A, C
+ 100µF OSCON
= 10µF CERAMIC
OUT
OUT
FN6660.2
March 24, 2011
10
ISL80102, ISL80103
Typical Operating Performance
Unless otherwise noted: V = 2.2V, V
IN OUT
= 1.8V, C = C
IN
= 10µF, T = +25°C, I = 0A. (Continued)
OUT J L
V
(20mV/DIV)
OUT
V
(20mV/DIV)
OUT
(2A/DIV)
I
I
(2A/DIV)
OUT
OUT
di/dt = 3A/µs
TIME (50µs/DIV)
di/dt = 3A/µs
TIME (50µs/DIV)
FIGURE 33. LOAD TRANSIENT 0A TO 3A, C
= 10µF CERAMIC,
OUT
FIGURE 34. LOAD TRANSIENT 0A TO 3A, C
= 10µF CERAMIC,
OUT
= 1500pF (ADJ VERSION)
No C (ADJ VERSION)
PB
C
PB
3.2V
2.2V
80
70
60
50
40
30
20
10
V
(1V/DIV)
IN
1A
100mA
10k
V
(10mV/DIV)
OUT
0
10
100
1k
100k
1M
TIME (200µs/DIV)
FREQUENCY (Hz)
FIGURE 36. PSRR vs LOAD
FIGURE 35. LINE TRANSIENT
80
70
60
50
40
30
20
10
10
1
100µF
0.1
10µF
47µF
100k
I
= 100mA
100
L
0.01
0
10
100
1k
10k
100k
1M
10
1k
10k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 38. SPECTRAL NOISE DENSITY vs FREQUENCY
FIGURE 37. PSRR vs C
OUT
FN6660.2
March 24, 2011
11
ISL80102, ISL80103
5.0
4.5
4.0
Functional Description
Input Voltage Requirements
Despite other output voltages offered, this family of LDOs is
optimized for a true 2.5V to 1.8V conversion where the input
supply can have a tolerance of as much as ±10% for conditions
noted in the “Electrical Specifications” table on page 4. Minimum
guaranteed input voltage is 2.2V, however, due to the nature of
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
an LDO, V must be some margin higher than the output voltage
IN
plus dropout at the maximum rated current of the application if
active filtering (PSRR) is expected from V to V . The dropout
IN
OUT
spec of this family of LDOs has been generously specified in
order to allow applications to design for a level of efficiency that
can accommodate the smaller outline package for those
applications that cannot accommodate the profile of the
TO220/TO263.
0
20
40
C
60
(nF)
80
100
SS
FIGURE 39. IN-RUSH CURRENT vs SOFT-START CAPACITANCE
Output Voltage Selection
An external resistor divider is used to scale the output voltage
relative to the internal reference voltage. This voltage is then fed
back to the error amplifier. The output voltage can be
Enable Operation
The Enable turn-on threshold is typically 770mV with a hysteresis of
135mV. An internal pull-up or pull-down resistor is available upon
request. As a result, this pin must not be left floating. This pin must
programmed to any level between 0.8V and 5V. An external
resistor divider, R and R , is used to set the output voltage as
be tied to V if it is not used. A 1kΩ to 10kΩ pull-up resistor will be
3
4
IN
shown in Equation 1. The recommended value for R is 500Ω to
required for applications that use open collector or open drain
outputs to control the Enable pin. The Enable pin may be connected
4
1kΩ. R is then chosen according to Equation 2:
3
directly to V for applications that are always on.
IN
R
⎛
⎜
⎝
⎞
3
(EQ. 1)
(EQ. 2)
------
V
= 0.5V ×
+ 1
⎟
OUT
R
4
⎠
Power-Good Operation
V
Applications not using this feature must connect this pin to
ground. The PGOOD flag is an open-drain NMOS that can sink up
to 10mA during a fault condition. The PGOOD pin requires an
external pull-up resistor which is typically connected to the VOUT
pin. The PGOOD pin should not be pulled up to a voltage source
OUT
0.5V
⎛
⎝
⎞
------------
R
= R
×
4
– 1
3
⎠
External Capacitor Requirements
External capacitors are required for proper operation. Careful
attention must be paid to the layout guidelines and selection of
capacitor type and value to ensure optimal performance.
greater than V . The PGOOD fault can be caused by the output
IN
voltage going below 84% of the nominal output voltage, or the
current limit fault, or low input voltage. The PGOOD does not
function during thermal shutdown. The PGOOD functions in
shutdown.
OUTPUT CAPACITOR
The ISL80102, ISL80103 applies state-of-the-art internal
compensation to keep selection of the output capacitor simple
Soft-Start Operation (Optional)
for the customer. Stable operation over full temperature, V
IN
range and load extremes are guaranteed for all
If the current limit for in-rush current is acceptable in the
application, do not use this feature. The soft-start circuit controls
the rate at which the output voltage comes up to regulation at
power-up or LDO enable. A constant current charges an external
soft-start capacitor. The external capacitor always gets
range, V
OUT
capacitor types and values assuming a 10µF X5R/X7R is used
for local bypass on V . This minimum capacitor must be
OUT
and Ground pins of the LDO with PCB traces
connected to V
OUT
no longer than 0.5cm.
discharged to ground pin potential at the beginning of start-up or
Lower cost Y5V and Z5U type ceramic capacitors are acceptable
if the size of the capacitor is larger to compensate for the
significantly lower tolerance over X5R/X7R types. Additional
capacitors of any value in Ceramic, POSCAP or Alum/Tantalum
Electrolytic types may be placed in parallel to improve PSRR at
higher frequencies and/or load transient AC output voltage
tolerances.
enabling. The discharge rate is the RC time constant of R and
PD
C
. See Figures 26 through 29 in the “Typical Operating
SS
Performance Curves” beginning on page 6. R is the
PD
ON-resistance of the pull down MOSFET, M8. R is 300Ω
PD
typically.
The soft-start feature effectively reduces the in-rush current at
power-up or LDO enable until V
reaches regulation. The in-
OUT
rush current can be an issue for applications that require large,
external bulk capacitances on V where high levels of charging
INPUT CAPACITOR
OUT
current can be seen for a significant period of time. The in-rush
currents can cause V to drop below minimum which could
The minimum input capacitor required for proper operation is
10µF having a ceramic dielectric. This minimum capacitor must
IN
to shutdown. Figure 39 shows the relationship
be connected to V and ground pins of the LDO with PCB traces
IN
cause V
OUT
no longer than 0.5cm.
between in-rush current and C with a C
of 1000µF.
SS
OUT
FN6660.2
March 24, 2011
12
ISL80102, ISL80103
The maximum allowable junction temperature, T
maximum expected ambient temperature, T
A(MAX)
maximum allowable power dissipation as shown in Equation 4:
and the
will determine the
Phase Boost Capacitor (Optional)
The ISL80102 and ISL80103 are designed to be stable with
10µF or larger ceramic capacitor.
J(MAX)
(EQ. 4)
P
= (T
– T ) ⁄ θ
J(MAX) A JA
D(MAX)
Applications using the ADJ versions, may see improved
performance with the addition of a small ceramic capacitor C
PB
Where θ is the junction-to-ambient thermal resistance.
JA
as shown in Figure 2 on page 3. The conditions where C may
PB
be beneficial are: (1) V
OUT
AC voltage regulation band.
>1.5V, (2) C = 10µF, and (3) tight
OUT
For safe operation, please make sure that power dissipation
calculated in Equation 3, P be less than the maximum
D
allowable power dissipation P
.
D(MAX)
C
introduces phase lead with the product of R and C that
PB
3
PB
results in increasing the bandwidth of the LDO. Typical R3 x C
should be 4μs.
The DFN package uses the copper area on the PCB as a heat-
sink. The EPAD of this package must be soldered to the copper
plane (GND plane) for heat sinking. Figure 40 shows a curve for
PB
C
not recommended for V < 1.5V.
OUT
PB
the θ of the DFN package for different copper area sizes.
JA
Current Limit Protection
46
44
42
40
38
36
34
The ISL80102, ISL80103 family of LDOs incorporates protection
against overcurrent due to short, overload condition applied to
the output and the in-rush current that occurs at start-up. The
LDO performs as a constant current source when the output
current exceeds the current limit threshold noted in the
“Electrical Specifications” table on page 4. If the short or
overload condition is removed from V , then the output returns
OUT
to normal voltage mode regulation. In the event of an overload
condition, the LDO might begin to cycle on and off due to the die
temperature exceeding the thermal fault condition. The
TO220/TO263 package will tolerate higher levels of power
dissipation on the die which may never thermal cycle if the
heatsink of this larger package can keep the die temperature
below the specified typical thermal shutdown temperature.
2
4
6
8
10
12
14
16
18
20
2
22
24
EPAD-MOUNT COPPER LAND AREA ON PCB, mm
FIGURE 40. 3mmx3mm-10 PIN DFN ON 4-LAYER PCB WITH
THERMAL VIAS θ vs EPAD-MOUNT COPPER LAND
AREA ON PCB
JA
Thermal Fault Protection
Power Dissipation and Thermals
In the event the die temperature exceeds typically +160°C, then
the output of the LDO will shut down until the die temperature
can cool down to typically +145°C. The level of power combined
with the thermal impedance of the package (+48°C/W for DFN)
will determine if the junction temperature exceeds the thermal
shutdown temperature.
The junction temperature must not exceed the range specified in
the “Recommended Operating Conditions (Note 10)” on page 4.
The power dissipation can be calculated by using Equation 3:
P
= (V – V
) × I
+ V × I
OUT IN GND
(EQ. 3)
D
IN
OUT
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6660.2
March 24, 2011
13
ISL80102, ISL80103
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev.
DATE
REVISION
FN6660.2
CHANGE
3/4/11
Converted to new template
Pg 1 - first paragraph, changed "Fixed output voltage options are available in 1.5V, 1.8V, 2.5V, 3.3V and 5V" to
"Fixed output voltage options are available in 1.8V, 2.5V, 3.3V and 5V"
Ordering Info table, remove ISL80102IR15Z and ISL80103IR15Z.
Note 3 below the ordering info table, removed '1.5V'. So it will read "The 3.3V and 5V fixed output voltages will
be released in the future. Please contact Intersil Marketing for more details."
3/4/10
FN6660.1
Corrected Features on page 1 as follows:
-Changed bullet "• 185mV Dropout @ 3A, 125mV Dropout @ 2A" to "• Very Low 120mV Dropout at 3A"
-Changed bullet "• 65dB Typical PSRR" to "• 62dB Typical PSRR"
-Deleted 0.5% Initial VOUT Accuracy
Modified Figure 1 and placed as Typical Application on Page 1.
Moved Pinout to page 3
In "Block Diagram" on page 2, corrected resistor associated with M5 from R4 to R5
Updated Block Diagram on page 2 as follows”
- Added M8 from SS to ground.
Updated Figure 1 on page 3 as follows:
-Corrected Pin 6 from SS to IRSET
-Removed Note 12 callout "Minimum cap on VIN and VOUT required for stability." Added Note "*CSS is optional.
See Note 12 on Page 5." and “** CPB is optional. See “Functional Description” on page 12 for more
information.”
Added "The 1.5V, 3.3V and 5V fixed output voltages will be released in the future." to Note 3 on page 2.
In “Thermal Information” on page 4, updated Theta JA from 45 to 48 per ASYD
In “Soft-Start Operation (Optional)” on page 12:
-Changed "The external capacitor always gets discharged to 0V at start-up of after coming out of a chip disable."
to "The external capacitor always gets discharged to ground pin potential at start-up or enabling."
-Changed "The soft-start function effectively limits the amount of in-rush current below the programmed current
limit during start-up or an enable sequence to avoid an overcurrent fault condition." to "The soft-start feature
effectively reduces the in-rush current at power-up or LDO enable until VOUT reaches regulation."
-Added "See Figures 25 through 27 in the “Typical Operating Performance Curves” beginning on page 9."
-Added “RPD is the on resistance of the pull down MOSFET, M8. RPD is 300Ohms typically.”
Added "Phase Boost Capacitor (CPB)" section on page 13.
In “Typical Operating Performance” on page 11, revised figure "PSRR vs VIN" which had 3 curves with "Spectral
Noise Density vs Frequency" which has one curve.
Added "FIGURE 32. LOAD TRANSIENT 0A TO 3A, COUT = 10µF CERAMIC, NO CPB (ADJ VERSION)" and "FIGURE
33. LOAD TRANSIENT 1A TO 3A, COUT = 10µF CERAMIC, CPB = 1500pF (ADJ VERSION)"
09/30/09
FN6660.0
Initial Release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page
on intersil.com: ISL80102, ISL80103
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
FN6660.2
March 24, 2011
14
ISL80102, ISL80103
Package Outline Drawing
L10.3x3
10 LEAD DUAL FLAT PACKAGE (DFN)
Rev 6, 09/09
6
3.00
A
B
PIN #1 INDEX AREA
1
2
6
PIN 1
INDEX AREA
10 x 0.23
4
(4X)
0.10
1.60
10x 0.35
4
TOP VIEW
BOTTOM VIEW
C A B
M
0.10
(4X)
0.415
0.23
PACKAGE
OUTLINE
0.35
SEE DETAIL "X"
0.10
(10 x 0.55)
(10x 0.23)
C
C
BASE PLANE
0.20
SEATING PLANE
0.08 C
SIDE VIEW
(8x 0.50)
5
0.20 REF
0.05
C
1.60
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Lead width applies to the metallized terminal and is measured
between 0.18mm and 0.30mm from the terminal tip.
Tiebar shown (if present) is a non-functional feature.
5.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
FN6660.2
March 24, 2011
15
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