MWS5101DL3X [INTERSIL]

256-Word x 4-Bit LSI Static RAM; 256字×4位LSI静态RAM
MWS5101DL3X
型号: MWS5101DL3X
厂家: Intersil    Intersil
描述:

256-Word x 4-Bit LSI Static RAM
256字×4位LSI静态RAM

文件: 总7页 (文件大小:44K)
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MWS5101,  
MWS5101A  
256-Word x 4-Bit  
LSI Static RAM  
March 1997  
Features  
Description  
• Industry Standard Pinout  
The MWS5101 and MWS5101A are 256 word by 4-bit static  
random access memories designed for use in memory  
systems where high speed, very low operating current, and  
simplicity in use are desirable. They have separate data  
inputs and outputs and utilize a single power supply of 4V to  
6.5V. The MWS5101 and MWS5101A differ in input voltage  
characteristics (MWS5101A is TTL compatible).  
• Very Low Operating Current . . . . . . . . . . . . . . . . . . 8mA  
at V  
= 5V and Cycle Time = 1µs  
DD  
• Two Chip Select Inputs Simple Memory Expansion  
• Memory Retention for Standby. . . . . . . . . . . . . 2V (Min)  
Battery Voltage  
Two Chip Select inputs are provided to simplify system  
expansion. An Output Disable control provides Wire-OR  
capability and is also useful in common Input/Output  
systems by forcing the output into a high impedance state  
during a write operation independent of the Chip Select input  
condition. The output assumes a high impedance state  
when the Output Disable is at high level or when the chip is  
deselected by CS1 and/or CS2.  
• Output Disable for Common I/O Systems  
• Three-State Data Output for Bus Oriented Systems  
• Separate Data Inputs and Outputs  
• TTL Compatible (MWS5101A)  
The high noise immunity of the CMOS technology is  
preserved in this design. For TTL interfacing at 5V operation,  
excellent system noise margin is preserved by using an  
external pull-up resistor at each input.  
Pinout  
MWS5101, MWS5101A  
(PDIP, SBDIP)  
TOP VIEW  
For applications requiring wider temperature and operating  
voltage ranges, the mechanically and functionally equivalent  
static RAM, CDP1822 may be used.  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
V
DD  
1
2
A3  
A2  
A1  
A0  
A5  
A6  
A7  
A4  
The MWS5101 and MWS5101A types are supplied in 22  
lead hermetic dual-in-line, sidebrazed ceramic packages (D  
suffix), in 22 lead dual-in-line plastic packages (E suffix), and  
in chip form (H suffix).  
R/W  
CSI  
O.D.  
CS2  
DO4  
DI4  
3
4
5
6
7
8
V
SS  
DO3  
9
DI1  
DI3  
10  
11  
DO1  
DI2  
DO2  
Ordering Information  
MWS5101  
MWS5101A  
PACKAGE  
TEMP. RANGE  
250ns  
350ns  
250ns  
350ns  
PKG. NO.  
E22.4  
o
o
PDIP  
0 C to +70 C  
MWS5101EL2  
MWS5101ELS  
MWS5101AEL2 MWS5101AEL3  
Burn-In  
MWS5101AEL3X E22.4  
MWS5101ADL3 D22.4A  
D22.4A  
o
o
SBDIP  
Burn-In  
0 C to +70 C  
-
MWS5101DL3X  
-
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 1106.2  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
6-56  
MWS5101, MWS5101A  
OPERATIONAL MODES  
INPUTS  
CHIP SELECT 1  
CHIP SELECT 2  
OUTPUT  
DISABLE (OD)  
READ/WRITE  
(R/W)  
MODE  
(CS )  
1
(CS )  
2
OUTPUT  
Read  
0
0
0
1
X
X
1
1
1
X
0
X
0
0
1
X
X
1
1
0
Read  
Write  
Data In  
Write  
0
High Impedance  
High Impedance  
High Impedance  
High Impedance  
Standby  
Standby  
X
X
X
Output Disable  
NOTE: Logic 1 = High, Logic 0 = Low, X = Don’t Care.  
Functional Block Diagram  
4
3
(32)  
ROW  
(5)  
INPUT  
BUFFERS  
AND  
ALL ROWS  
DESELECT  
FUNCTION  
A0  
A1  
A2  
A3  
A4  
† † †  
22  
2
V
DD  
DECODERS  
1
21  
(8 x 32)  
STORAGE  
ARRAY  
(8 x 32)  
STORAGE  
ARRAY  
(8 x 32)  
STORAGE  
ARRAY  
(8 x 32)  
STORAGE  
ARRAY  
(4)  
††  
9
10  
12  
DI1  
DI2  
DI3  
DI4  
D01  
BUFFER  
DRIVERS  
††  
11  
BITS  
(1-4)  
D02  
(4)  
GATES  
††  
13  
15  
14  
16  
D03  
††  
D04  
BIT (1)  
(8)  
BIT (2)  
(8)  
BIT (3)  
(8)  
BIT (4)  
(8)  
(3)  
INPUT  
BUFFERS  
AND  
ALL COLUMNS  
DESELECT  
FUNCTION  
5
6
COLUMN  
DECODERS  
COLUMN  
DECODERS  
COLUMN  
DECODERS  
COLUMN  
DECODERS  
A5  
A6  
A7  
7
20  
CONTROL  
B
R/W  
† † †  
8
19  
CONTROL  
A
CONTROL  
C
V
SS  
CSI  
CS2  
OD  
17  
18  
V
V
V
DD  
DD  
DD  
V
V
V
SS  
SS  
SS  
INPUT PROTECTION  
NETWORK  
OUTPUT  
PROTECTION  
CIRCUIT  
OVER VOLTAGE  
PROTECTION  
CIRCUIT  
††  
†  
6-57  
MWS5101, MWS5101A  
Absolute Maximum Ratings  
Thermal Information  
o
o
DC Supply Voltage Range, (V  
DD  
)
Thermal Resistance (Typical)  
θ
( C/W)  
θ
( C/W)  
JA  
JC  
(All Voltages Referenced to V Terminal). . . . . . . . -0.5V to +7V  
PDIP Package . . . . . . . . . . . . . . . . . . .  
SBDIP Package. . . . . . . . . . . . . . . . . .  
75  
80  
N/A  
21  
SS  
Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to V  
+0.5V  
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . . . .±10mA  
DD  
Operating Temperature Range (T )  
A
o
o
Package Type D. . . . . . . . . . . . . . . . . . . . . . . . . .-55 C to +125 C  
Package Type E. . . . . . . . . . . . . . . . . . . . . . . . . . .-40 C to +85 C  
Maximum Storage Temperature Range (T  
Maximum Junction Temperature  
Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175 C  
o
o
o
o
) . . .-65 C to +150 C  
STG  
o
o
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150 C  
Maximum Lead Temperature (During Soldering)  
At distance 1/16 ±1/32 In. (1.59 ±0.79mm)  
from case for 10s max . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265 C  
o
Recommended Operating Conditions At T = Full Package Temperature Range. For maximum reliability, operating conditions  
A
should be selected so that operation is always within the following ranges:  
LIMITS  
PARAMETER  
MIN  
MAX  
UNITS  
DC Operating Voltage Range  
Input Voltage Range  
4
6.5  
V
V
V
V
DD  
SS  
o
o
Static Electrical Specifications At T = 0 C to +70 C, V = 5V ±5%  
A
DD  
CONDITIONS  
LIMITS  
MWS5101  
MWS5101A  
V
V
(NOTE 1)  
(NOTE 1)  
O
IN  
PARAMETER  
SYMBOL  
(V)  
(V)  
0, 5  
0, 10  
0, 5  
0, 5  
0, 5  
0, 5  
-
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
50  
200  
-
UNITS  
Quiescent Device  
Current  
L2 Types  
L3 Types  
I
-
-
25  
100  
4
50  
200  
-
-
25  
100  
4
µA  
µA  
mA  
mA  
V
DD  
-
-
-
Output Low (Sink) Current  
Output High (Source) Current  
Output Voltage Low-Level  
Output Voltage High-Level  
Input Low Voltage  
I
0.4  
2
2
OL  
I
4.6  
-1  
-2  
0
-
-1  
-2  
0
-
OH  
V
-
-
0.1  
-
-
0.1  
-
OL  
V
-
4.9  
5
4.9  
5
V
OH  
V
-
-
-
1.5  
-
-
-
0.65  
-
V
IL  
IH  
IN  
Input High Voltage  
V
-
-
3.5  
-
2.2  
-
V
Input Leakage Current  
Operating Current (Note 2)  
I
-
0, 5  
0, 5  
0, 5  
0, 5  
-
-
-
-
-
-
-
-
±5  
8
-
-
-
-
-
-
-
±5  
8
µA  
mA  
µA  
µA  
pF  
pF  
I
-
0, 5  
0, 5  
-
4
4
DD1  
OUT  
Three-State Output  
Leakage Current  
L2 Types  
L3 Types  
I
-
±5  
±5  
7.5  
15  
-
±5  
±5  
7.5  
15  
-
-
Input Capacitance  
Output Capacitance  
NOTES:  
C
5
5
IN  
C
-
-
10  
10  
OUT  
o
1. Typical values are for T = +25 C and nominal V  
A
.
DD  
2. Outputs open circuited; Cycle time = 1µs.  
6-58  
MWS5101, MWS5101A  
o
o
Dynamic Electrical Specifications at T = 0 C to +70 C, V = 5V ±5%  
A
DD  
LIMITS (NOTE 1)  
L2 TYPES  
L3 TYPES  
(NOTE 2)  
MIN  
(NOTE 3)  
TYP  
(NOTE 2)  
MIN  
(NOTE 3)  
TYP  
PARAMETER  
READ CYCLE TIMES (FIGURE 1)  
Read Cycle  
SYMBOL  
MAX  
MAX  
UNITS  
t
250  
-
-
-
250  
250  
250  
110  
-
350  
-
-
-
350  
350  
350  
150  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Access from Address  
Output Valid from Chip Select 1  
Output Valid from Chip Select 2  
Output Valid from Output Disable  
Output Hold from Chip Select 1  
Output Hold from Chip Select 2  
Output Hold from Output Disable  
WRITE CYCLE TIMES (FIGURE 2)  
Write Cycle  
t
150  
200  
AA  
t
t
t
-
150  
-
200  
DOA1  
DOA2  
DOA3  
DOH1  
DOH2  
DOH3  
-
150  
-
200  
-
-
-
-
-
-
-
-
-
-
t
t
t
20  
20  
20  
20  
20  
20  
-
-
-
-
t
t
300  
110  
40  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
400  
150  
50  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
Address Setup  
t
AS  
Write Recovery  
WR  
Write Width  
t
150  
150  
40  
200  
200  
50  
WRW  
Input Data Setup Time  
Data in Hold  
t
DS  
t
DH  
Chip Select 1 Setup  
t
t
110  
110  
0
150  
150  
0
CS1S  
CS2S  
CS1H  
CS2H  
Chip Select 2 Setup  
Chip Select 1 Hold  
t
t
Chip Select 2 Hold  
0
0
Output Disable Setup  
NOTES:  
t
110  
150  
ODS  
1. MWS5101: t , t = 20ns, V = 0.7V , V = 0.3V ; C = 100pF and MWS5101A: t , t = 20ns, V = 2.2V, V = 0.65V; C = 50pF  
R
F
IH  
DD IL  
DD  
L
R
F
IH  
IL  
L
and 1 TTL Load.  
2. Time required by a limit device to allow for the indicated function.  
o
3. Typical values are for T = 25 C and nominal V  
A
DD.  
6-59  
MWS5101, MWS5101A  
t
RC  
A0 - A7  
t
DOA1  
CHIP SELECT 1  
t
DOH1  
t
t
DOH2  
CHIP SELECT 2  
OUTPUT DISABLE  
READ/WRITE  
DOA2  
t
t
DOH3  
DOA3  
t
AA  
DATA OUT  
VALID  
DATA OUT  
HIGH  
IMPEDANCE  
HIGH  
IMPEDANCE  
FIGURE 1. READ CYCLE TIMING WAVEFORMS  
t
WC  
t
WR  
A0-A7  
t
t
CS1S  
CS1H  
CHIP SELECT 1  
CHIP SELECT 2  
t
CS2H  
t
CS2S  
(NOTE)  
OUTPUT DISABLE  
DI1-DI4  
t
t
t
DH  
ODS  
DS  
DATA IN STABLE  
t
WRW  
READ/WRITE  
t
AS  
DON’T CARE  
NOTE: t  
ODS  
is required for common I/O operation only; for separate I/O operations, output disable is “don’t care”.  
FIGURE 2. WRITE CYCLE TIME WAVEFORMS  
6-60  
MWS5101, MWS5101A  
o
o
Data Retention Specifications at T = 0 C to +70 C; See Figure 3  
A
TEST  
CONDITIONS  
LIMITS  
ALL TYPES  
V
V
(NOTE 1)  
DR  
DD  
PARAMETER  
Minimum Data Retention Voltage  
Data Retention Quiescent Current  
SYMBOL  
(V)  
(V)  
MIN  
TYP  
MAX  
UNITS  
V
V
-
-
-
-
1.5  
2
5
-
2
10  
50  
-
DR  
L2 Types  
L3 Types  
I
2
2
-
-
µA  
µA  
ns  
DD  
-
-
Chip Deselect to Data Retention Time  
Recovery to Normal Operation Time  
t
5
5
5
600  
600  
1
CDR  
t
-
-
-
ns  
RC  
V
to V  
Rise and Fall Time  
t , t  
2
-
-
µs  
DD  
DR  
R
F
NOTE:  
o
1. Typical Values are for T = 25 C and nominal V  
A
.
DD  
V
DD  
READ  
ADDRESS  
DECODER  
DATA RETENTION  
MODE  
V
DD  
0.95 V  
0.95 V  
DD  
DD  
V
DR  
V
SS  
t
t
t
t
RC  
CDR  
F
R
WRITE  
ADDRESS  
DECODER  
C
S2  
V
V
IH  
IH  
V
IL  
V
IL  
V
DD  
FIGURE 3. LOW V  
DD  
DATA RETENTION TIMING WAVEFORMS  
FIGURE 4. MEMORY CELL CONFIGURATION  
6-61  
MWS5101, MWS5101A  
CONTROL A  
CS1  
CS2  
19  
17  
A
CHIP-SELECT  
CONTROL  
CONTROL B  
CONTROL C  
B
R/W  
20  
CHIP-SELECT AND  
R/W CONTROL  
C
OUTPUT  
DISABLE  
CONTROL  
OUTPUT  
DISABLE  
18  
FIGURE 5. LOGIC DIAGRAM OF CONTROLS FOR MWS5101, MWS5101A  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
Intersil (Taiwan) Ltd.  
Taiwan Limited  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (407) 724-7000  
FAX: (407) 724-7240  
6-62  

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