TLP321G [ISOCOM]
Transistor Output Optocoupler, 1-Element, 5300V Isolation, DIP-4;
| 型号： | TLP321G |
| 厂家： | 
ISOCOM COMPONENTS |
| 描述： | Transistor Output Optocoupler, 1-Element, 5300V Isolation, DIP-4 |
| 文件： | 总15页 (文件大小：994K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DESCRIPTION
The TLP321, TLP321-2 and TLP321-4 series of
optically coupled isolator consist of an infrared light
emitting diode and an NPN silicon photo transistor in
a space efficient Dual In Line Plastic Package.
TLP321
FEATURES
•
•
•
AC Isolation Voltage 5300VRMS
CTR Selections Available
Wide Operating Temperature Range
-30°C to +100°C
Lead Free and RoHS Compliant
UL File E91231 Package Code “EE”
VDE Approval Certificate No. 40028086
TLP321-2
TLP321-4
•
•
•
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
•
•
•
•
Computer Terminals
Industrial System Controllers
Measuring Instruments
Signal Transmission between Systems of
Different Potentials and Impedances
Input
Forward Current
Reverse Voltage
Power dissipation
50mA
6V
ORDER INFORMATION
70mW
•
•
•
•
Add X after PN for VDE Approval
Add G after PN for 10mm lead spacing
Add SM after PN for Surface Mount
Add SMT&R after PN for Surface Mount
Tape & Reel
(Available for TLP321SM and TLP321-2SM)
Consult Factory for Tape and Reel version of
TLP321-4SM
Output
Collector to Emitter Voltage BVCEO
Emitter to Collector Voltage BVECO
Collector Current
80V
6V
50mA
150mW
Power Dissipation
•
Total Package
Isolation Voltage
5300VRMS
200mW
Total Power Dissipation
Operating Temperature
Storage Temperature
-30 to 100 °C
-55 to 125 °C
260°C
Lead Soldering Temperature
(10s)
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansion
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
http://www.isocom.com
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ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
INPUT
Parameter
Forward Voltage
Reverse Voltage
Symbol
Test Condition
IF = 10mA
Min
1.0
Typ.
Max
Unit
V
VF
VR
IR
1.15
1.3
IR = 10μA
5.0
V
Reverse Leakage
Terminal Capacitance
VR = 5V
10
µA
pF
Ct
V = 0V, f = 1KHz
30
250
OUTPUT
Parameter
Symbol
Test Condition
Min
Typ.
Max
Unit
Collector—Emitter
breakdown Voltage
BVCEO
IC = 0.5mA, IF = 0mA
80
V
Emitter—Collector
breakdown Voltage
BVECO
ICEO
IE = 100µA, IF = 0mA
VCE = 48V, IF = 0mA
6
V
Collector-Emitter Dark
Current
100
nA
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ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
COUPLED
Parameter
Symbol
Test Condition
IF = 5mA, VCE = 5V
Min
Typ.
Max
Unit
Current Transfer Ratio
CTR
50
600
%
Optional CTR Grades
BL
GB
200
100
30
600
600
GB (IF = 1mA, VCE = 0.4V)
Collector—Emitter
Saturation Voltage
VCE(sat)
IF = 8mA, IC = 2.4mA
GB (IF = 1mA, IC = 0.2mA)
0.4
0.4
V
Output Rise Time
Output Fall Time
Turn-on Time
tr
tf
VCE = 10V,
Ic = 2mA,
RL = 100Ω
2
3
3
3
µs
ton
toff
Turn-off Time
ISOLATION
Parameter
Symbol
Test Condition
Min
Typ.
Max
Unit
Input to Output
Isolation Voltage
VISO
AC 1 minute, RH = 40 to 60%
Note 1
5300
VRMS
Input to Output
Isolation Resistance
RISO
VIO= 500V
Note 1
5x1010
Ω
Note 1 : Measure with input leads shorted together and output leads shorted together.
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Fig 1 Forward Current vs TA
Fig 2 Collector Power Dissipation vs TA
Fig 3 Collector-emitter Saturation Voltage vs
Forward Current
Fig 4 Collector Current vs
Collector-emitter Voltage
Fig 6 Forward Current vs Forward Voltage
Fig 5 Current Transfer Ratio vs Forward Current
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Fig 7 Relative CTR vs TA
Fig 8 Frequency Response
Response Time Test Circuit
Fig 9 Response Time vs Load Resistance
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ORDER INFORMATION
TLP321 (UL Approval)
Description
After PN
PN
Packing quantity
None
TLP321,
Standard DIP4
100 pcs per tube
TLP321BL, TLP321GB
G
TLP321G,
TLP321BLG, TLP321GBG
10mm Lead Spacing
Surface Mount
100 pcs per tube
100 pcs per tube
1000 pcs per reel
SM
TLP321SM,
TLP321BLSM, TLP321GBSM
SMT&R
TLP321SMT&R,
Surface Mount Tape & Reel
TLP321BLSMT&R,
TLP321GBSMT&R
TLP321-2 (UL Approval)
Description
Standard DIP8
After PN
PN
Packing quantity
None
TLP321-2,
50 pcs per tube
TLP321-2BL, TLP321-2GB
G
TLP321-2G,
TLP321-2BLG, TLP321-2GBG
10mm Lead Spacing
Surface Mount
50 pcs per tube
50 pcs per tube
SM
TLP321-2SM,
TLP321-2BLSM,
TLP321-2GBSM
SMT&R
TLP321-2SMT&R,
TLP321-2BLSMT&R,
TLP321-2GBSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
TLP321-4 (UL Approval)
After PN
PN
Description
Packing quantity
None
TLP321-4,
Standard DIP16
25 pcs per tube
TLP321-4BL, TLP321-4GB
G
TLP321-4G,
TLP321-4BLG, TLP321-4GBG
10mm Lead Spacing
Surface Mount
25 pcs per tube
25 pcs per tube
SM
TLP321-4SM,
TLP321-4BLSM,
TLP321-4GBSM
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ORDER INFORMATION
TLP321X (UL and VDE Approvals)
Description
After PN
PN
Packing quantity
None
TLP321X,
Standard DIP4
100 pcs per tube
TLP321XBL, TLP321XGB
G
TLP321XG,
TLP321XBLG, TLP321XGBG
10mm Lead Spacing
Surface Mount
100 pcs per tube
100 pcs per tube
1000 pcs per reel
SM
TLP321XSM,
TLP321XBLSM, TLP321XGBSM
SMT&R
TLP321XSMT&R,
Surface Mount Tape & Reel
TLP321XBLSMT&R,
TLP321XGBXSMT&R
TLP321-2X (UL and VDE Approvals)
Description
After PN
PN
Packing quantity
None
TLP321-2X,
Standard DIP8
50 pcs per tube
TLP321-2XBL, TLP321-2XGB
G
TLP321-2XG,
TLP321-2XBLG, TLP321-2XGBG
10mm Lead Spacing
Surface Mount
50 pcs per tube
50 pcs per tube
SM
TLP321-2XSM,
TLP321-2XBLSM,
TLP321-2XGBSM
SMT&R
TLP321-2XSMT&R,
TLP321-2XBLSMT&R,
TLP321-2XGBSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
TLP321-4X (UL and VDE Approvals)
Description
After PN
PN
Packing quantity
None
TLP321-4X,
Standard DIP16
25 pcs per tube
TLP321-4XBL, TLP321-4XGB
G
TLP321-4XG,
TLP321-4XBLG, TLP321-4XGBG
10mm Lead Spacing
Surface Mount
25 pcs per tube
25 pcs per tube
SM
TLP321-4XSM,
TLP321-4XBLSM,
TLP321-4XGBSM
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PACKAGE DIMENSIONS in mm (inch)
DIP
TLP321
TLP321-2
TLP321-4
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PACKAGE DIMENSIONS in mm (inch)
G Form
TLP321G
TLP321-2G
TLP321-4G
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PACKAGE DIMENSIONS in mm (inch)
SMD
TLP321SM
TLP321-2SM
TLP321-4SM
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RECOMMENDED PAD LAYOUT FOR SMD (mm)
TLP321SM
TLP321-2SM
TLP321-4SM
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TAPE AND REEL PACKAGING
TLP321SMT&R
TLP321-2SMT&R
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IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD
(One Time Reflow Soldering is Recommended)
260°C
TP
TP - 5°C
tP
Max Ramp Down Rate
6°C/s
Max Ramp Up Rate
3°C/s
217°C
200°C
TL
TL
Tsmax
150°C
Tsmin
ts Preheat
60s – 120s
25°C
TIME (s)
Time 25°C to Peak Temperature
Profile Details
Conditions
Preheat
- Min Temperature (TSMIN
)
150°C
- Max Temperature (TSMAX
)
200°C
- Time TSMIN to TSMAX (ts)
60s - 120s
Soldering Zone
- Peak Temperature (TP)
260°C
- Time at Peak Temperature
- Liquidous Temperature (TL)
10s max
217°C
- Time within 5°C of Actual Peak Temperature (TP
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
̶
5°C)
30s max
60s - 100s
3°C/s max
6°C/s max
- Ramp Down Rate (TP to TL)
Average Ramp Up Rate (Tsmax to TP)
Time 25°C to Peak Temperature
3°C/s max
8 minutes max
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NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves
the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices, audio/visual
equipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc., please contact our
sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
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__ ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
15 20/01/2017
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