IS31LT3170-STLS4-TR [ISSI]
Display Driver,;
| 型号： | IS31LT3170-STLS4-TR |
| 厂家： | 
INTEGRATED SILICON SOLUTION, INC |
| 描述： | Display Driver, 驱动 光电二极管 接口集成电路 |
| 文件： | 总19页 (文件大小：454K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IS31LT3170/71
10-TO-150MA CONSTANT-CURRENT LED DRIVER
October 2017
GENERAL DESCRIPTION
FEATURES
The IS31LT3170 and IS31LT3171 are adjustable
linear current devices with excellent temperature
stability. A single resistor is all that is required to set
the operating current from 10mA to 150mA. The
devices can operate from an input voltage from 2.5V
to 42V with a minimal voltage headroom of 1V
(typical). Designed with a low dropout voltage; the
device can drive LED strings close to the supply
voltage without switch capacitors or inductors.
Low-side current sink
- Current preset to 10mA
- Adjustable from 10mA to 150mA with external
resistor selection
Wide input voltage range from
- 2.5V to 42V (IS31LT3171)
- 5V to 42V (IS31LT3170)
with a low dropout of typical 1V
Up to 10kHz PWM input (IS31LT3171 only)
Protection features:
The IS31LT3170/71 simplifies designs by
providing a stable current without the additional
requirement of input or output capacitors,
inductors, FETs or diodes. The complete constant
current driver requires only a current set resistor
and a small PCB area making designs both
efficient and cost effective.
- 0.26%/K negative temperature coefficient at
high temp for thermal protection
Up to 1W power dissipation in a small SOT23-6
package
RoHS compliant (Pb-free) package
The EN pin (1) of the IS31LT3170 can be tied to
Vbat or BCM PWM signal for high side dimming.
The EN Pin (1) of the IS31LT3171 can function as
the PWM signal input used for low side dimming.
APPLICATIONS
Architectural LED lighting
Channel letters for advertising, LED strips for
decorative lighting
As a current sink it is ideal for LED lighting
applications or current limiter for power supplies.
Retail lighting in fridge, freezer case and
vending machines
The device is provided in a lead (Pb) free, SOT23-6
package.
Emergency lighting (e.g. steps lighting, exit way
sign etc.)
TYPICAL APPLICATION CIRCUIT
Figure 1 Typical Application Circuit
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Rev. C, 10/20/2017
1
IS31LT3170/71
PIN CONFIGURATION
Package
Pin Configuration (Top View)
SOT23-6
PIN DESCRIPTION
No.
Pin
Description
1
EN
Enable pin (PWM input IS31LT3171 only).
Current sink.
2,3,5
OUT
GND
REXT
4
6
Ground.
Optional current adjust.
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Rev. C, 10/20/2017
IS31LT3170/71
ORDERING INFORMATION
Industrial Range: -40°C to +125°C
Order Part No.
Package
QTY/Reel
IS31LT3170-STLS4-TR
IS31LT3171-STLS4-TR
SOT-23-6, Lead-free
3000
Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the
product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not
authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
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Rev. C, 10/20/2017
IS31LT3170/71
ABSOLUTE MAXIMUM RATINGS (Note 1)
Maximum enable voltage, VEN(MAX) only for IS31LT3170-STLS4-TR
45V
VEN(MAX) only for IS31LT3171-STLS4-TR
6V
Maximum output current, IOUT(MAX)
Maximum output voltage, VOUT(MAX)
Reverse voltage between all terminals, VR
Package thermal resistance, junction to ambient (4 layer standard test
PCB based on JEDEC standard), θJA
Power dissipation, PD(MAX) (Note 2)
Maximum junction temperature, TJMAX
Storage temperature range, TSTG
Operating temperature range, TA=TJ
ESD (HBM)
200mA
45V
0.5V
130°C/W
0.77W
+150°C
-65°C ~ +150°C
-40°C ~ +125°C
±2kV
ESD (CDM)
±500V
Note 1:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2:
Detail information please refer to package thermal de-rating curve on Page 14.
ELECTRICAL CHARACTERISTICS
“●”
This symbol in the table means these parameters are for IS31LT3170-STLS4-TR.
“○” This symbol in the table means these parameters are for IS31LT3171-STLS4-TR.
Test condition is TA = TJ = 25°C, unless otherwise specified. (Note 3)
Symbol
Parameter
Condition
Min.
Typ.
Max. Unit
VBD_OUT OUT pin breakdown voltage
VEN= 0V
42
V
VEN= 24V
VEN= 3.3V
●
○
0.35
0.35
106
IEN
Enable current
Internal resistor
mA
RINT
IRINT = 10mA
OUT = 1.4V, VEN = 24V,
Ω
V
●
○
●
○
●
○
9
9
10
10
11
REXT OPEN
mA
11
VOUT = 1.4V, VEN = 3.3V,
REXT OPEN
Output current
VOUT > 2.0V, VEN = 24V,
REXT = 10Ω
100
100
10
10
113
113
120
mA
120
IOUT
VOUT > 2.0V, VEN = 3.3V,
REXT = 10Ω
VOUT > 2.0V, VEN = 24V
VOUT > 2.0V, VEN = 3.3V
150
mA
150
Output current Range
(Note 4, 5)
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Rev. C, 10/20/2017
IS31LT3170/71
DC CHARACTERISTICS WITH STABILIZED LED LOAD
“●”
This symbol in the table means these parameters are for IS31LT3170-STLS4-TR.
“○” This symbol in the table means these parameters are for IS31LT3171-STLS4-TR.
Test condition is TA= TJ= 25°C, unless otherwise specified. (Note 3)
Symbol
Parameter
Condition
Min.
Typ.
Max. Unit
●
○
5
42
V
Sufficient supply voltage on EN
pin
VS
2.5
5.5
Lowest sufficient headroom
voltage on OUT pin
VHR
IOUT = 100mA
1
1.2
V
VOUT > 2.0V, VEN = 24V,
EXT = 10Ω
●
○
●
○
-0.26
-0.26
1.9
R
Output current change versus
ambient temp change
%/K
VOUT > 2.0V, VEN = 3.3V,
REXT = 10Ω
∆IOUT/IOUT
(Note 4)
VOUT > 2.0V, VEN = 24V,
R
EXT = 10Ω
VOUT > 2.0V, VEN = 3.3V,
EXT = 10Ω
Output current change versus
Vout
%/V
1.9
R
Note 3: Production testing of the device is performed at 25°C. Functional operation of the device and parameters specified over -40°C to
+125°C temperature range, are guaranteed by design and characterization.
Note 4: Guaranteed by design.
Note 5: The maximum output current is dependent on the PCB board design, air flow, ambient temperature and power dissipation in the
device. Please refer to the package thermal de-rating curve on Page 14 for more detail information.
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Rev. C, 10/20/2017
IS31LT3170/71
FUNCTIONAL BLOCK DIAGRAM
IS31LT3170
IS31LT3171
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Rev. C, 10/20/2017
IS31LT3170/71
TYPICAL PERFORMANCE CHARACTERISTICS
IS31LT3170
30
80
60
V
EN = 42V
V
EN = 42V
TA = 25°C
TA
= -40°C
R
EXT = 20Ω
R
EXT Open
25
20
15
10
TA = 125°C
TA = 85°C
40
TA = 85°C
TA = 25°C
20
0
T = 125°C
A
T = -40°C
A
5
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
Output Voltage (V)
Output Voltage (V)
Figure 2 IOUT vs. VOUT
Figure 3 IOUT vs. VOUT
150
100
50
180
160
V
EN = 42V
V
EN = 42V
R
EXT = 7.5Ω
REXT = 10Ω
T = 25°C
A
TA = 25°C
T = -40°C
A
TA
= -40°C
140
120
100
80
TA = 85°C
TA = 85°C
TA = 125°C
TA = 125°C
60
40
20
0
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
Output Voltage (V)
Output Voltage (V)
Figure 4 IOUT vs. VOUT
Figure 5 IOUT vs. VOUT
200
180
160
140
120
100
80
200
180
160
140
120
100
80
V
f
EN = 5V
PWM = 100Hz@1% Duty Cycle
= 25°C
V
EN = 42V
= 25°C
REXT = 7.5Ω
TA
TA
R
EXT = 10Ω
REXT = 7.5Ω
REXT = 10Ω
R
EXT= 20Ω
REXT = 20Ω
60
60
40
40
REXT Open
REXT Open
20
0
20
0
0
2
4
6
8
10
12
14
0
2
4
6
8
10
12
14
Output Voltage (V)
Output Voltage (V)
Figure 6 IOUT vs. VOUT
Figure 7 IOUT vs. VOUT
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Rev. C, 10/20/2017
IS31LT3170/71
20
80
60
40
VOUT = 2V
V
OUT = 2V
TA
= 25°C
R
EXT Open
REXT = 20Ω
TA = 85°C
16
12
8
TA = -40°C
TA = 125°C
T = 25°C
A
TA
= 85°C
TA = 125°C
TA
= -40°C
20
0
4
0
5
15
25
35
42
5
15
25
35
42
V
EN (V)
V
EN (V)
Figure 8 IOUT vs. VEN
Figure 9 IOUT vs. VEN
150
120
200
175
150
125
100
75
V
OUT = 2V
V
OUT = 2V
R
EXT = 10Ω
R
EXT = 7.5Ω
T = 25°C
A
TA = 25°C
TA
= 85°C
T = 85°C
A
T = -40°C
A
T = -40°C
A
90
60
TA = 125°C
TA = 125°C
50
30
0
25
0
5
15
25
35
42
5
15
25
35
42
VEN (V)
V
EN (V)
Figure 10 IOUT vs. VEN
Figure 11 IOUT vs. VEN
180
160
500
400
300
200
V
OUT = 2V
= 25°C
R
EXT = 7.5Ω
I
R
OUT = 0A
EXT Open
TA
TA = -40°C
140
120
100
80
TA = 25°C
R
EXT = 10Ω
TA
= 85°C
R
EXT = 20Ω
TA = 125°C
60
40
100
0
R
EXT Open
20
0
0
5
10
15
20
25
30
35
40 42
42
0
5
10
15
20
25
30
35
40
V
EN (V)
V
EN (V)
Figure 12 IOUT vs. VEN
Figure 13 IEN vs. VEN
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Rev. C, 10/20/2017
IS31LT3170/71
250
V
V
EN = 42V
OUT = 2V
200
150
100
50
0
1
10
100
R
EXT (Ω)
Figure 14 IOUT vs. REXT
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Rev. C, 10/20/2017
IS31LT3170/71
IS31LT3171
30
80
60
V
EN = 3.3V
T
A
= -40°C
= 125°C
T = 25°C
A
V
EN = 3.3V
R
EXT = 20Ω
R
EXT Open
25
20
15
10
TA = 85°C
TA
40
TA = 25°C
TA = 85°C
20
0
T = 125°C
A
5
0
TA
= -40°C
2
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
0.5
3.5
5
6.5
8
9.5
11
12.5
14
Output Voltage (V)
Output Voltage (V)
Figure 16 IOUT vs. VOUT
Figure 15 IOUT vs. VOUT
150
100
50
180
160
V
EN = 3.3V
V
EN = 3.3V
R
EXT = 7.5Ω
T = 25°C
A
R
EXT = 10Ω
T
A
= -40°C
T = 25°C
A
T = -40°C
A
140
120
100
80
T = 85°C
A
TA = 85°C
T = 125°C
A
TA = 125°C
60
40
20
0
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
Output Voltage (V)
Output Voltage (V)
Figure 17 IOUT vs. VOUT
Figure 18 IOUT vs. VOUT
200
180
160
140
120
100
80
200
180
160
140
120
100
80
V
EN = 5V
V
EN = 3.3V
= 25°C
REXT = 7.5Ω
fPWM = 100Hz@1% Duty Cycle
TA
TA
= 25°C
REXT = 7.5Ω
R
EXT = 10Ω
R
EXT = 10Ω
R
EXT = 20Ω
R
EXT= 20Ω
60
60
40
40
REXT Open
R
EXT Open
20
0
20
0
0
2
4
6
8
10
12
14
0
2
4
6
8
10
12
14
Output Voltage (V)
Output Voltage (V)
Figure 19 IOUT vs. VOUT
Figure 20 IOUT vs. VOUT
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Rev. C, 10/20/2017
IS31LT3170/71
20
80
60
40
TA = 25°C
V
OUT = 2V
VOUT = 2V
TA = 85°C
REXT = 20Ω
R
EXT Open
16
12
8
TA = 125°C
TA = -40°C
TA = 85°C
TA = 25°C
TA = 125°C
TA = -40°C
20
0
4
0
2.5
2.5
0.5
3
3.5
4
4.5
5
5
5
2.5
3
3.5
4
4.5
5
V
EN (V)
V
EN (V)
Figure 21 IOUT vs. VEN
Figure 22 IOUT vs. VEN
150
120
200
175
150
125
100
75
V
R
OUT = 2V
V
R
OUT = 2V
EXT = 7.5Ω
T = 25°C
A
EXT = 10Ω
T = 25°C
A
T = -40°C
A
TA
= 85°C
TA = 85°C
T = -40°C
A
T
A
= 125°C
TA
= 125°C
90
60
50
30
0
25
0
3
3.5
4
4.5
2.5
3
3.5
4
4.5
5
V
EN (V)
VEN (V)
Figure 23 IOUT vs. VEN
Figure 24 IOUT vs. VEN
180
160
500
400
300
200
REXT = 7.5Ω
VOUT = 2V
IOUT = 0A
T
A
= 25°C
R
EXT Open
140
120
100
80
R
EXT = 10Ω
TA
= -40°C
TA
= 25°C
R
EXT = 20Ω
T = 85°C
A
TA = 125°C
60
40
100
0
R
EXT Open
20
0
2.5
3
3.5
4
4.5
5
1
1.5
2
2.5
3
3.5
4
4.5
VEN (V)
V
EN (V)
Figure 25 IOUT vs. VEN
Figure 26 IEN vs. VEN
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Rev. C, 10/20/2017
IS31LT3170/71
250
V
OUT = 3V, 3 LEDs
V
V
EN = 3.3V
OUT = 2V
VEN = 5V, 100Hz, 50% Duty Cycle
REXT = 10Ω
200
150
100
TJ
= -40°C
V
EN
2V/Div
50
0
I
OUT
50mA/Div
1
10
100
Time (200ns/Div)
R
EXT (Ω)
Figure 27 IOUT vs. REXT
Figure 28 VEN vs. IOUT Delay and Rising Edge
V
V
OUT = 3V, 3 LEDs
EN = 5V, 100Hz, 50% Duty Cycle
V
OUT = 3V, 3 LEDs
VEN = 5V, 100Hz, 50% Duty Cycle
R
EXT = 10Ω
REXT = 10Ω
T
J
= 25°C
TJ
= 125°C
VEN
VEN
2V/Div
2V/Div
IOUT
IOUT
50mA/Div
50mA/Div
Time (200ns/Div)
Time (200ns/Div)
Figure 29 VEN vs. IOUT Delay and Rising Edge
Figure 30 VEN vs. IOUT Delay and Rising Edge
V
OUT = 3V, 3 LEDs
V
OUT = 3V, 3 LEDs
VEN = 5V, 100Hz, 50% Duty Cycle
VEN = 5V, 100Hz, 50% Duty Cycle
REXT = 10Ω
REXT = 10Ω
TJ
= -40°C
TJ
= 25°C
V
EN
V
EN
2V/Div
2V/Div
I
OUT
I
OUT
50mA/Div
50mA/Div
Time (100ns/Div)
Time (100ns/Div)
Figure 31 VEN vs. IOUT Delay and Falling Edge
Figure 32 VEN vs. IOUT Delay and Falling Edge
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Rev. C, 10/20/2017
IS31LT3170/71
V
V
OUT = 3V, 3 LEDs
EN = 5V, 100Hz, 50% Duty Cycle
R
EXT = 10Ω
T
J
= 125°C
VEN
2V/Div
IOUT
50mA/Div
Time (100ns/Div)
Figure 33 VEN vs. IOUT Delay and Falling Edge
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Rev. C, 10/20/2017
IS31LT3170/71
APPLICATIONS INFORMATION
IS31LT3170/71 provides an easy constant current
source solution for LED lighting applications. It uses
an external resistor to adjust the LED current from
10mA to 150mA. The LED current can be
determined by the Equation (1):
When operating the chip at high ambient
temperatures, or when driving maximum load
current, care must be taken to avoid exceeding the
package power dissipation limits. Exceeding the
package dissipation will cause the device to enter
thermal protection mode. The maximum package
power dissipation can be calculated using the
following Equation (2):
RINT REXT
(1)
ISET 10mA
REXT
Where RINT (106Ω Typ.) is an internal resistor and
EXT is the external resistor.
R
TJ (MAX ) TA
(2)
PD(MAX )
Paralleling a low tolerance resistor REXT with the
internal resistor RINT will improve the overall
accuracy of the current sense resistance. The
resulting output current will vary slightly lower due to
the negative temperature coefficient (NTC) resulting
from the self heating of the IS31LT3170/71.
JA
Where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and θJA is the junction
to ambient thermal resistance; a metric for the
relative thermal performance of a package.
HIGH INPUT VOLTAGE APPLICATION
The recommended maximum operating junction
temperature, TJ(MAX), is 125°C and so the maximum
ambient temperature is determined by the package
parameter; θJA. The θJA for the IS31LT3170/71
SOT23-6 package, is 130°C/W.
When driving a long string of LEDs whose total
forward voltage drop exceeds the IS31LT3170
VBD_OUT limit of 42V, it is possible to stack several
LEDs(such as 2 LEDs) between the EN pin and the
OUT pins 2,3, and 5 so the voltage on the EN pin is
higher than 5V. The remaining string of LEDs can
then be placed between power supply +VS and EN
pin, (Figure 34). The number of LEDs required to
stack at EN pin will depend on the LED’s forward
voltage drop (VF) and the +VS value.
Therefore the maximum power dissipation at TA =
25°C is:
125C 25C
130C /W
PD(MAX )
0.77W
The actual power dissipation PD is:
(3)
PD VOUT IOUT VEN IEN
To ensure the performance, the die temperature (TJ)
of the IS31LT3170/71 should not exceed 125°C. The
graph below gives details for the package power
derating.
1.2
SOT23-6
Figure 34 High Input Voltage Application Circuit
1
0.8
0.6
0.4
Note: when operating the IS31LT3170 at voltages
exceeding the device operating limits, care needs to
be taken to keep the EN pin and OUT pin voltage
below 42V.
THERMAL PROTECTION AND DISSIPATION
The IS31LT3170/71 implements thermal foldback
protection to reduce the LED current when the
package’s thermal dissipation is exceeded and
prevent “thermal runaway”. The thermal foldback
implements a negative temperature coefficient
(NTC) of -0.26%/K.
0.2
0
-40 -25 -10
5
20
35
50
65
80
95 110 125
Temperature (°C)
Figure 35 PD vs. TA (SOT23-6)
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Rev. C, 10/20/2017
IS31LT3170/71
The thermal resistance is achieved by mounting the
IS31LT3170/71 on a standard FR4 double-sided
printed circuit board (PCB) with a copper area of a
few square inches on each side of the board under
the IS31LT3170/71. Multiple thermal vias, as shown
in Figure 36, help to conduct the heat from the
exposed pad of the IS31LT3170/71 to the copper on
each side of the board. The thermal resistance can
be reduced by using a metal substrate or by adding
a heatsink.
Figure 36 Board Via Layout For Thermal Dissipation
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Rev. C, 10/20/2017
IS31LT3170/71
CLASSIFICATION REFLOW PROFILES
Profile Feature
Pb-Free Assembly
Preheat & Soak
150°C
Temperature min (Tsmin)
200°C
Temperature max (Tsmax)
60-120 seconds
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate (Tsmax to Tp)
Liquidous temperature (TL)
Time at liquidous (tL)
3°C/second max.
217°C
60-150 seconds
Max 260°C
Peak package body temperature (Tp)*
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to peak temperature
Max 30 seconds
6°C/second max.
8 minutes max.
Figure 37 Classification Profile
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IS31LT3170/71
PACKAGE INFORMATION
SOT23-6
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Rev. C, 10/20/2017
IS31LT3170/71
RECOMMENDED LAND PATTERN
Note:
1. Land pattern complies to IPC-7351.
2. All dimensions in MM.
3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since
land pattern design depends on many factors unknown (eg. user’s board manufacturing specs), user must determine suitability for use.
Integrated Silicon Solution, Inc. – www.issi.com
18
Rev. C, 10/20/2017
IS31LT3170/71
REVISION HISTORY
Revision
Detail Information
Date
A
B
C
Initial release
2016.05.04
2016.07.05
2017.10.20
Update EC table (output current limit)
Update θJA value
Integrated Silicon Solution, Inc. – www.issi.com
19
Rev. C, 10/20/2017
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