IS61LV5128-12BI [ISSI]

512K x 8 HIGH-SPEED CMOS STATIC RAM; 512K ×8高速CMOS静态RAM
IS61LV5128-12BI
型号: IS61LV5128-12BI
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

512K x 8 HIGH-SPEED CMOS STATIC RAM
512K ×8高速CMOS静态RAM

文件: 总9页 (文件大小:75K)
中文:  中文翻译
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®
IS61LV5128  
ISSI  
512K x 8 HIGH-SPEED CMOS STATIC RAM  
JULY 2001  
FEATURES  
DESCRIPTION  
• High-speed access times:  
10, 12 and 15 ns  
The ISSI IS61LV5128 is a very high-speed, low power,  
524,288-wordby8-bitCMOSstaticRAM.TheIS61LV5128  
is fabricated using ISSI's high-performance CMOS tech-  
nology. This highly reliable process coupled with innova-  
tive circuit design techniques, yields higher performance  
and low power consumption devices.  
• High-performance, low-power CMOS process  
• Multiple center power and ground pins for  
greater noise immunity  
• Easy memory expansion with CE and OE  
When CE is HIGH (deselected), the device assumes a  
standby mode at which the power dissipation can be  
reduced down to 250 µW (typical) with CMOS input levels.  
options  
CE power-down  
• Fully static operation: no clock or refresh  
required  
The IS61LV5128 operates from a single 3.3V power  
supply and all inputs are TTL-compatible.  
• TTL compatible inputs and outputs  
• Single 3.3V power supply  
The IS61LV5128 is available in 36-pin 400-mil SOJ, 36-  
pin mini BGA, and 44-pin TSOP (Type II) packages.  
• Packagesavailable:  
– 36-pin 400-mil SOJ  
– 36-pin miniBGA  
– 44-pin TSOP (Type II)  
FUNCTIONAL BLOCK DIAGRAM  
512K X 8  
MEMORY ARRAY  
A0-A18  
DECODER  
VCC  
GND  
I/O  
DATA  
COLUMN I/O  
I/O0-I/O7  
CIRCUIT  
CE  
CONTROL  
CIRCUIT  
OE  
WE  
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any  
errors which may appear in this publication. © Copyright 2000, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
1
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
PIN CONFIGURATION  
36 mini BGA  
44-Pin TSOP (Type II)  
1
2
3
4
5
6
NC  
NC  
A0  
A1  
A2  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
NC  
NC  
NC  
2
3
4
A18  
A17  
A16  
A15  
OE  
I/O7  
I/O6  
GND  
Vcc  
I/O5  
I/O4  
A14  
A13  
A12  
A11  
A10  
NC  
5
A3  
A4  
6
A
B
C
D
E
F
A0  
I/O4  
I/O5  
GND  
Vcc  
I/O6  
I/O7  
A9  
A1  
A2  
NC  
WE  
NC  
A3  
A4  
A5  
A6  
A7  
A8  
I/O0  
I/O1  
Vcc  
7
CE  
I/O0  
I/O1  
Vcc  
GND  
I/O2  
I/O3  
WE  
A5  
A6  
A7  
A8  
A9  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
GND  
I/O2  
I/O3  
A14  
A18  
CE  
A17  
A16  
A12  
OE  
A15  
A13  
G
H
A10  
A11  
NC  
NC  
NC  
NC  
36-Pin SOJ  
PIN DESCRIPTIONS  
A0-A18  
CE  
Address Inputs  
A0  
A1  
1
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
NC  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
Bidirectional Ports  
Power  
2
A18  
A17  
A16  
A15  
OE  
A2  
3
OE  
A3  
4
WE  
A4  
5
CE  
6
I/O0-I/O7  
Vcc  
I/O0  
I/O1  
Vcc  
GND  
I/O2  
I/O3  
WE  
A5  
7
I/O7  
I/O6  
GND  
Vcc  
I/O5  
I/O4  
A14  
A13  
A12  
A11  
A10  
NC  
8
GND  
NC  
Ground  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
No Connection  
TRUTH TABLE  
A6  
A7  
Mode  
WE  
CE OE I/O Operation Vcc Current  
A8  
Not Selected  
(Power-down)  
X
H
X
High-Z  
ISB1, ISB2  
A9  
Output Disabled H  
L
L
L
H
L
High-Z  
DOUT  
DIN  
ICC  
ICC  
ICC  
Read  
Write  
H
L
X
2
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol Parameter  
Value  
0.5 to Vcc + 0.5  
55 to +125  
65 to +150  
1.0  
Unit  
V
°C  
°C  
W
VTERM  
TBIAS  
TSTG  
PT  
Terminal Voltage with Respect to GND  
Temperature Under Bias  
Storage Temperature  
Power Dissipation  
Notes:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause perma-  
nentdamagetothedevice. Thisisastressratingonlyandfunctionaloperationofthedeviceat  
these or any other conditions above those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended  
periodsmayaffectreliability.  
OPERATING RANGE  
10 ns  
12 ns, 15 ns  
Range  
Ambient Temperature  
0°C to +70°C  
VCC  
VCC  
Commercial  
Industrial  
3.3V +10%, -5%  
3.3V +10%, -5%  
3.3V 10%  
3.3V 10%  
40°C to +85°C  
CAPACITANCE(1,2)  
Symbol  
CIN  
Parameter  
Conditions  
Max.  
Unit  
Input Capacitance  
VIN = 0V  
6
8
pF  
pF  
CI/O  
Input/Output Capacitance  
VOUT = 0V  
Notes:  
1. Tested initially and after any design or process changes that may affect these parameters.  
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V.  
Integrated Silicon Solution, Inc. 1-800-379-4774  
3
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol Parameter  
Test Conditions  
Min.  
2.4  
Max.  
Unit  
V
VOH  
VOL  
VIH  
VIL  
ILI  
Output HIGH Voltage  
VCC = Min., IOH = 4.0 mA  
VCC = Min., IOL = 8.0 mA  
0.4  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage(1)  
Input Leakage  
V
2.0  
VCC + 0.3  
0.8  
V
0.3  
V
GND VIN VCC  
Com.  
Ind.  
1  
5  
1
5
µA  
ILO  
Output Leakage  
GND VOUT VCC, Outputs Disabled Com.  
1  
5  
1
5
µA  
Ind.  
Note:  
1. VIL = 3.0V for pulse width less than 10 ns.  
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
-10ns  
Min.  
-12ns  
Min.  
-15ns  
Min.  
Symbol Parameter  
TestConditions  
Max.  
Max.  
Max.  
Unit  
ICC  
VccOperating  
SupplyCurrent  
VCC = Max., CE = VIL  
IOUT = 0 mA, f = fMAX.  
Com.  
Ind.  
145  
155  
135  
145  
125  
135  
mA  
ISB  
TTL Standby  
Current  
(TTLInputs)  
VCC = Max.,  
VIN = VIH or VIL  
CE VIH, f = fMAX.  
Com.  
Ind.  
70  
80  
60  
70  
50  
60  
mA  
ISB1  
ISB2  
TTL Standby  
Current  
(TTLInputs)  
VCC = Max.,  
VIN = VIH or VIL  
CE VIH, f = 0  
Com.  
Ind.  
20  
25  
20  
25  
20  
25  
mA  
mA  
CMOSStandby  
Current  
(CMOSInputs)  
VCC = Max.,  
Com.  
Ind.  
10  
15  
10  
15  
10  
15  
CE  
VIN VCC 0.2V, or  
VIN 0.2V, f = 0  
VCC 0.2V,  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
4
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)  
-10 ns  
Min.  
-12 ns  
Min.  
-15 ns  
Min. Max.  
Symbol  
tRC  
Parameter  
Max.  
10  
10  
4
Max.  
12  
12  
5
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Read Cycle Time  
Address Access Time  
Output Hold Time  
CE Access Time  
OE Access Time  
OE to Low-Z Output  
OE to High-Z Output  
CE to Low-Z Output  
CE to High-Z Output  
Power Up Time  
10  
3
12  
3
15  
3
15  
15  
7
tAA  
tOHA  
tACE  
tDOE  
0
0
0
(2)  
tLZOE  
4
5
6
(2)  
tHZOE  
0
0
0
(2)  
tLZCE  
3
4
3
6
3
8
(2)  
tHZCE  
0
0
0
tPU  
tPD  
0
10  
0
12  
0
15  
Power Down Time  
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and  
outputloadingspecifiedinFigure1.  
2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100% tested.  
AC TEST CONDITIONS  
Parameter  
Input Pulse Level  
Input Rise and Fall Times  
Unit  
0V to 3.0V  
3 ns  
Input and Output Timing  
and Reference Levels  
1.5V  
Output Load  
See Figures 1 and 2  
AC TEST LOADS  
319  
319  
3.3V  
3.3V  
OUTPUT  
OUTPUT  
353 Ω  
353 Ω  
30 pF  
Including  
jig and  
5 pF  
Including  
jig and  
scope  
scope  
Figure 1  
Figure 2  
Integrated Silicon Solution, Inc. 1-800-379-4774  
5
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
AC WAVEFORMS  
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL)  
tRC  
ADDRESS  
tAA  
tOHA  
tOHA  
DATA VALID  
D
OUT  
PREVIOUS DATA VALID  
READ1.eps  
READ CYCLE NO. 2(1,3) (CE and OE Controlled)  
t
RC  
ADDRESS  
OE  
t
AA  
t
OHA  
t
HZOE  
t
DOE  
t
t
LZOE  
ACE  
CE  
t
HZCE  
t
LZCE  
HIGH-Z  
D
OUT  
DATA VALID  
CE_RD2.eps  
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CE = VIL.  
3. Address is valid prior to or coincident with CE LOW transitions.  
6
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)  
-10 ns  
Min.  
-12 ns  
Min.  
-15 ns  
Min. Max.  
Symbol  
tWC  
Parameter  
Max.  
Max.  
Unit  
ns  
Write Cycle Time  
CE to Write End  
Address Setup Time to  
10  
8
12  
9
15  
10  
10  
tSCE  
ns  
tAW  
8
9
ns  
Write End  
tHA  
Address Hold from  
0
0
0
ns  
Write End  
tSA  
Address Setup Time  
0
8
5
0
8
6
0
10  
12  
7
7
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tPWE1(4)  
tPWE2  
tSD  
WE Pulse Width  
WE Pulse Width (OE = LOW)  
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
10  
6
12  
6
tHD  
0
0
0
(2)  
tHZWE  
0
0
0
(2)  
tLZWE  
0
0
0
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and  
outputloadingspecifiedinFigure1.  
2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100% tested.  
3. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but  
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of  
the signal that terminates the Write.  
4. Tested with OE HIGH.  
AC WAVEFORMS  
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)  
t
WC  
VALID ADDRESS  
SCE  
ADDRESS  
CE  
t
SA  
t
t
HA  
t
AW  
t
tPPWWEE21  
WE  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
D
OUT  
t
SD  
t
HD  
DATAIN VALID  
D
IN  
CE_WR1.eps  
Integrated Silicon Solution, Inc. 1-800-379-4774  
7
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
WRITE CYCLE NO. 2(1,2) (WE Controlled: OE is HIGH During Write Cycle)  
t
WC  
ADDRESS  
OE  
VALID ADDRESS  
t
HA  
LOW  
CE  
t
AW  
t
PWE1  
WE  
t
SA  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
D
OUT  
t
SD  
t
HD  
DATAIN VALID  
D
IN  
CE_WR2.eps  
Notes:  
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but  
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of  
the signal that terminates the Write.  
2. I/O will assume the High-Z state if OE VIH.  
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)  
t
WC  
ADDRESS  
VALID ADDRESS  
t
HA  
LOW  
LOW  
OE  
CE  
t
t
AW  
t
PWE2  
WE  
t
SA  
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
CE_WR3.eps  
8
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. B  
07/16/01  
®
IS61LV5128  
ISSI  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
Industrial Range: 40°C to +85°C  
Speed (ns)  
Order Part No.  
Package  
Speed (ns)  
Order Part No.  
Package  
10  
10  
10  
IS61LV5128-10K  
IS61LV5128-10T  
IS61LV5128-10B  
400-milPlasticSOJ  
TSOP (Type II)  
miniBGA(8mmx10mm)  
10  
10  
10  
IS61LV5128-10KI  
IS61LV5128-10TI  
IS61LV5128-10BI  
400-milPlasticSOJ  
TSOP (Type II)  
miniBGA(8mmx10mm)  
12  
12  
12  
IS61LV5128-12K  
IS61LV5128-12T  
IS61LV5128-12B  
400-milPlasticSOJ  
TSOP (Type II)  
miniBGA(8mmx10mm)  
12  
12  
12  
IS61LV5128-12KI  
IS61LV5128-12TI  
IS61LV5128-12BI  
400-milPlasticSOJ  
TSOP (Type II)  
miniBGA(8mmx10mm)  
15  
15  
15  
IS61LV5128-15K  
IS61LV5128-15T  
IS61LV5128-15B  
400-milPlasticSOJ  
TSOP (Type II)  
miniBGA(8mmx10mm)  
15  
15  
15  
IS61LV5128-15KI  
IS61LV5128-15TI  
IS61LV5128-15BI  
400-milPlasticSOJ  
TSOP (Type II)  
miniBGA(8mmx10mm)  
®
ISSI  
Integrated Silicon Solution, Inc.  
2231 Lawson Lane  
Santa Clara, CA 95054  
Tel: 1-800-379-4774  
Fax: (408) 588-0806  
E-mail: sales@issi.com  
www.issi.com  
Integrated Silicon Solution, Inc. 1-800-379-4774  
9
Rev. B  
07/16/01  

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