IS62U6416LL-20B [ISSI]

64K x 16 LOW VOLTAGE, ULTRA-LOW POWER CMOS STATIC RAM; 64K ×16低电压,超低功耗CMOS静态RAM
IS62U6416LL-20B
型号: IS62U6416LL-20B
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

64K x 16 LOW VOLTAGE, ULTRA-LOW POWER CMOS STATIC RAM
64K ×16低电压,超低功耗CMOS静态RAM

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®
ISSI  
IS62U6416LL  
64K x 16 LOW VOLTAGE,  
ADVANCE INFORMATION  
DECEMBER 1998  
ULTRA-LOW POWER CMOS STATIC RAM  
1
FEATURES  
DESCRIPTION  
The ISSI IS62U6416LL is an ultra-low power, 1,048,576-bit  
static RAM organized as 65,536 words by 16 bits. It is  
fabricated using ISSI's high-performance CMOS technology.  
This highly reliable process coupled with innovative circuit  
design techniques yields access times as fast as 200 ns with  
low power consumption.  
• Access time: 200 ns  
2
• CMOS low power operation  
– 40 mW (typical) operating  
– 90 µW (typical) standby  
• TTL compatible interface levels  
• Single 1.8V-2.7V power supply  
3
WhenCEisHIGH(deselected),thedeviceassumesastandby  
mode at which the power dissipation can be reduced down  
with CMOS input levels.  
• Fully static operation: no clock or refresh  
required  
4
Easy memory expansion is provided by using Chip Enable  
and Output Enable inputs, CEand OE. The active LOW Write  
Enable (WE) controls both writing and reading of the memory.  
A data byte allows Upper Byte (UB) and Lower Byte (LB)  
access.  
• Three state outputs  
• Data control for upper and lower bytes  
• Industrial temperature available  
5
• Available in Jedec Std 44-pin SOJ package,  
44-pin TSOP (Type II), and 48-pin mini BGA  
6
FUNCTIONAL BLOCK DIAGRAM  
7
64K x 16  
MEMORY ARRAY  
A0-A15  
DECODER  
8
VCC  
GND  
9
I/O0-I/O7  
Lower Byte  
I/O  
DATA  
COLUMN I/O  
10  
11  
12  
CIRCUIT  
I/O8-I/O15  
Upper Byte  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
UB  
LB  
The specification contains ADVANCE INFORMATION. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible  
product. We assume no responsibility for any errors which may appear in this publication. © Copyright 1998, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
1
12/09/98  
®
ISSI  
IS62U6416LL  
PIN CONFIGURATIONS  
44-Pin SOJ  
44-Pin TSOP  
A4  
A3  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A4  
A3  
A2  
A1  
A0  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A6  
A7  
OE  
UB  
LB  
2
A6  
2
A2  
3
A7  
3
A1  
4
OE  
A0  
5
UB  
4
CE  
6
LB  
5
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A15  
A14  
A13  
A12  
NC  
7
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
CE  
6
8
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A15  
A14  
A13  
A12  
NC  
7
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
A8  
A9  
A10  
A11  
NC  
9
8
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
A8  
A9  
A10  
A11  
NC  
PIN DESCRIPTIONS  
48-Pin mini BGA (Top View)  
1
2
3
4
5
6
A0-A15  
I/O0-I/O15  
CE  
Address Inputs  
Data Inputs/Outputs  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
OE  
A0  
A3  
A1  
A4  
A2  
LB  
OE  
UB  
N/C  
A
B
C
D
E
F
WE  
I/O  
8
I/O  
0
CE  
LB  
Lower-byte Control (I/O0-I/O7)  
Upper-byte Control (I/O8-I/O15)  
No Connection  
I/O  
9
I/O  
10  
I/O  
1
I/O  
2
A5  
A6  
UB  
I/O  
11  
I/O  
3
GND  
Vcc  
NC  
NC  
A14  
A12  
A7  
Vcc  
NC  
I/O  
12  
I/O  
4
GND  
NC  
A15  
A13  
A10  
Vcc  
Power  
I/O  
14  
I/O  
13  
I/O  
5
I/O  
6
GND  
Ground  
I/O  
7
I/O  
15  
NC  
A8  
WE  
G
H
NC  
A9  
A11  
NC  
2
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
12/09/98  
®
ISSI  
IS62U6416LL  
TRUTH TABLE  
I/O Pin  
I/O0-I/O7 I/O8-I/O15 Vcc Current  
1
Mode  
WE  
X
CE  
H
OE  
X
LB  
X
UB  
X
Not Selected  
High-Z  
High-Z  
ISB1, ISB2  
Output Disabled  
H
X
L
L
H
X
X
H
X
H
High-Z  
High-Z  
High-Z  
High-Z  
ICC  
2
Read  
Write  
H
H
H
L
L
L
L
L
L
L
H
L
H
L
L
DOUT  
High-Z  
DOUT  
High-Z  
DOUT  
DOUT  
ICC  
3
L
L
L
L
L
L
X
X
X
L
H
L
H
L
L
DIN  
High-Z  
DIN  
High-Z  
DIN  
DIN  
ICC  
4
AC TEST CONDITIONS  
5
Parameter  
Unit  
Input Pulse Level  
Input Rise and Fall Times  
0.4 to 1.8V(1)  
5 ns  
0.9V(1)  
6
Input and Output Timing and Reference Level  
Output Load  
See Figures 1 and 2  
7
AC TEST LOADS  
THEVENIN EQUIVALENT  
3070  
3070 Ω  
1.8V  
1.8V  
1554  
8
OUTPUT  
0.91V  
OUTPUT  
OUTPUT  
Figure 3.  
3150 Ω  
3150 Ω  
30 pF  
100 pF  
Including  
jig and  
scope  
Including  
jig and  
scope  
9
Figure 1.  
Figure 2.  
10  
11  
12  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
3
12/09/98  
®
ISSI  
IS62U6416LL  
ABSOLUTE MAXIMUM RATINGS(1)  
Note:  
1. Stress greater than those listed under  
ABSOLUTE MAXIMUM RATINGS  
may cause permanent damage to the  
device. This is a stress rating only and  
functional operation of the device at  
these or any other conditions above  
those indicated in the operational sec-  
tions of this specification is not im-  
plied. Exposure to absolute maximum  
rating conditions for extended periods  
may affect reliability.  
Symbol Parameter  
Value  
Unit  
V
VTERM  
TSTG  
PT  
Terminal Voltage with Respect to GND –0.5 to Vcc +0.5  
Storage Temperature  
Power Dissipation  
–65 to +150  
°C  
W
1.5  
20  
IOUT  
DC Output Current (LOW)  
mA  
OPERATING RANGE  
Range  
Ambient Temperature  
VCC  
Commercial  
Industrial  
0°C to +70°C  
1.8V (Min.) to 2.7V (Max.)  
1.8V (Min.) to 2.7V (Max.)  
–40°C to +85°C  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range Unless Otherwise Specified)  
Symbol Parameter  
Test Conditions  
Min.  
1.6  
Max.  
Unit  
V
VOH  
VOL  
VIH  
Output HIGH Voltage  
VCC = Min., IOH = –0.44 mA  
VCC = Min., IOL = 0.33 mA  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
Input Leakage  
0.4  
V
1.6  
–0.2  
–1  
VCC + 0.2  
V
(1)  
VIL  
ILI  
0.4  
1
V
GND VIN VCC  
µA  
µA  
ILO  
Output Leakage  
GND VOUT VCC, Outputs Disabled  
–1  
1
Note:  
1. VIL (min.) = –1.5V for pulse width less than 30 ns.  
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range Unless Otherwise Specified)  
-200  
Symbol Parameter  
Test Conditions  
Min. Max.  
Unit  
ICC  
Vcc Dynamic Operating  
Supply Current  
VCC = Max.,  
IOUT = 0 mA, f = fMAX  
CE = VIH  
Com.  
Ind.  
25  
40  
mA  
ISB1  
ISB2  
TTL Standby Current  
(TTL Inputs)  
VCC = Max.,  
VIN = VIH or VIL  
CE VIH , f = 0  
Com.  
Ind.  
0.3  
0.3  
mA  
CMOS Standby  
Current (CMOS Inputs)  
VCC = Max.,  
CE VCC – 0.2V,  
VIN 0.2V, f = 0  
Com.  
Ind.  
5
5
µA  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency; f = 0 means no input lines change.  
4
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
12/09/98  
®
ISSI  
IS62U6416LL  
CAPACITANCE(1)  
1
Symbol  
Parameter  
Conditions  
VIN = 0V  
Max.  
8
Unit  
pF  
CIN  
Input Capacitance  
Input/Output Capacitance  
COUT  
Note:  
VOUT = 0V  
10  
pF  
2
1. Tested initially and after any design or process changes that may affect these parameters.  
3
4
READ CYCLE SWITCHING CHARACTERISTICS(1)  
(Over Operating Range)  
5
-200  
Min. Max.  
Symbol Parameter  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRC  
Read Cycle Time  
200  
20  
0
200  
6
tAA  
Address Access Time  
Output Hold Time  
tOHA  
tACE  
tDOE  
tHZOE  
CE Access Time  
200  
100  
50  
7
OE Access Time  
(2)  
OE to High-Z Output  
OE to Low-Z Output  
CE to High-Z Output  
CE to Low-Z Output  
LB, UB Access Time  
LB, UB to High-Z Output  
LB, UB to Low-Z Output  
(2)  
tLZOE  
20  
0
8
(2)  
tHZCE  
50  
(2)  
tLZCE  
tBA  
30  
0
100  
50  
9
tHZB  
tLZB  
20  
Notes:  
10  
11  
12  
1. Test conditions assume signal transition times of 5 ns or less, timing  
reference levels of 0.9V, input pulse levels of 0.4 to 1.8V and output  
loading specified in Figure 1.  
2. TestedwiththeloadinFigure2.Transitionismeasured ±500mVfrom  
steady-state voltage. Not 100% tested.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
5
12/09/98  
®
ISSI  
IS62U6416LL  
AC WAVEFORMS  
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
t
OHA  
DATA VALID  
DOUT  
PREVIOUS DATA VALID  
READ CYCLE NO. 2(1,3)  
t
RC  
ADDRESS  
OE  
t
AA  
t
OHA  
t
HZOE  
t
DOE  
LZOE  
ACE  
t
CE  
t
t
HZCE  
t
LZCE  
LB, UB  
t
BA  
t
HZB  
t
LZB  
HIGH-Z  
DOUT  
DATA VALID  
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CE, UB, or LB = VIL.  
3. Address is valid prior to or coincident with CE LOW transition.  
6
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
12/09/98  
®
ISSI  
IS62U6416LL  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)  
-200  
Symbol  
tWC  
Parameter  
Min.  
200  
160  
160  
0
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
1
Write Cycle Time  
tSCE  
tAW  
CE to Write End  
Address Setup Time to Write End  
Address Hold from Write End  
Address Setup Time  
2
tHA  
tSA  
0
tPWB  
tPWE  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width  
160  
160  
160  
0
3
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
tHD  
4
(3)  
tHZWE  
50  
(3)  
tLZWE  
20  
Notes:  
5
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V,  
input pulse levels of 0.4V to 1.8V and output loading specified in Figure 1.  
2. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All  
signals must be in valid states to initiate a Write, but any one can go inactive to terminate the  
Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the  
signal that terminates the write.  
6
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage.  
7
DATA RETENTION CHARACTERISTICS  
Symbol  
Parameter  
Test Condition  
Min.  
1.5  
Max.  
Unit  
VDR  
Vcc for Data Retention  
Data Retention Current  
CE VCC – 0.2V  
V
8
I
DR  
V
CC = VDR  
5.0  
µA  
CE VCC – 0.2V  
t
t
SDR  
RDR  
Data Retention Set up Time  
Recovery Time  
See Data Retention Waveform  
See Data Retention Waveform  
0
ns  
ns  
9
t
RC  
10  
11  
12  
DATA RETENTION TIMING DIAGRAM  
t
SDR  
DATA RETENTION MODE  
tRDR  
VCC  
1.8V  
VIH  
VDR  
CE VCC – 0.2V  
CE  
GND  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
7
12/09/98  
®
ISSI  
IS62U6416LL  
AC WAVEFORMS  
WRITE CYCLE NO. 1(1,2) (WE Controlled)  
tWC  
ADDRESS  
CE  
tHA  
tSCE  
tPWB  
LB, UB  
tAW  
tPWE  
WE  
tSA  
(1)  
WRITE  
tSD  
tHD  
DIN  
tHZWE  
tLZWE  
HIGH-Z  
HIGH-Z  
DOUT  
UNDEFINED  
UNDEFINED  
Notes:  
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least  
one of the LB and UB inputs being in the LOW state.  
2. WRITE = (CE) [ (LB) = (UB) ] (WE).  
8
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
12/09/98  
®
ISSI  
IS62U6416LL  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
1
2
3
4
5
6
7
8
9
10  
Speed (ns) Order Part No.  
Package  
200  
IS62U6416LL-20T  
IS62U6416LL-20K  
IS62U6416LL-20B  
Plastic TSOP (Type II)  
400-mil Plastic SOJ  
Mini BGA (6mm x 8mm)  
ORDERING INFORMATION  
Industrial Range: –40°C to +85°C  
Speed (ns) Order Part No.  
Package  
200  
IS62U6416LL-20TI  
IS62U6416LL-20KI  
IS62U6416LL-20BI  
Plastic TSOP (Type II)  
400-mil Plastic SOJ  
Mini BGA (6mm x 8mm)  
NOTICE  
Integrated Silicon Solution, Inc., reserves the right to make changes to the products contained in this publication in  
order to improve design, performance or reliability. Integrated Silicon Solution, Inc. assumes no responsibility for the  
use of any circuits described herein, conveys no license under any patent or other right, and makes no representation  
thatthecircuitsarefreeofpatentinfringement. Chartsandschedulescontainedhereinreflectrepresentativeoperating  
parameters, and may vary depending upon a user's specific application. While the information in this publication has  
been carefully checked, Integrated Silicon Solution, Inc. shall not be liable for any damages arising as a result of any  
error or omission.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where  
the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to  
significantlyaffectitssafetyoreffectiveness. ProductsarenotauthorizedforuseinsuchapplicationsunlessIntegrated  
Silicon Solution, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been  
minimized;(b)theuserassumesallsuchrisks;and(c)potentialliabilityofIntegratedSiliconSolution,Inc.isadequately  
protected under the circumstances.  
Copyright 1998 Integrated Silicon Solution, Inc.  
Reproduction in whole or in part, without the prior written consent of Integrated Silicon Solution, Inc., is prohibited.  
®
ISSI  
Integrated Silicon Solution, Inc. 11  
2231 Lawson Lane  
Santa Clara, CA 95054  
Fax: (408) 588-0806  
12  
Toll Free: 1-800-379-4774  
email: sales@issi.com  
http://www.issi.com  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION SR034-0C  
9
12/09/98  

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