IS65WV12816ALL-70B2A3 [ISSI]

Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48;
IS65WV12816ALL-70B2A3
型号: IS65WV12816ALL-70B2A3
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48

静态存储器 内存集成电路
文件: 总19页 (文件大小:103K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
IS65WV12816ALL  
IS65WV12816BLL  
ISSI  
PRELIMINARYINFORMATION  
FEBRUARY2003  
128K x 16 LOW VOLTAGE,  
ULTRA LOW POWER CMOS STATIC RAM  
FEATURES  
Option A2: –40 to +105oC  
Option A3: –40 to +125oC  
• High-speed access time: 55ns, 70ns  
• CMOS low power operation:  
36 mW (typical) operating  
DESCRIPTION  
9 µW (typical) CMOS standby  
• TTL compatible interface levels  
• Single power supply:  
TheISSIIS65WV12816ALL/IS65WV12816BLLare high-  
speed, 2M bit static RAMs organized as 128K words by 16  
bits. It is fabricated using ISSI's high-performance CMOS  
technology. This highly reliable process coupled with  
innovative circuit design techniques, yields high-  
performance and low power consumption devices.  
1.65V to 2.2V VDD (65WV12816ALL)  
2.5V to 3.6V VDD (65WV12816BLL)  
When CS1 is HIGH (deselected) or when CS2 is LOW  
(deselected) or when CS1 is LOW, CS2 is HIGH and both  
LBandUBareHIGH, thedeviceassumesastandbymode  
at which the power dissipation can be reduced down with  
CMOS input levels.  
• Fully static operation: no clock or refresh  
required  
• Three state outputs  
Easy memory expansion is provided by using Chip Enable  
and Output Enable inputs. The active LOW Write Enable  
(WE) controls both writing and reading of the memory. A  
data byte allows Upper Byte (UB) and Lower Byte (LB)  
access.  
• Data control for upper and lower bytes  
• 2CS Option Available  
• Temperature Offerings:  
Option A: 0 to 70oC  
TheIS65WV12816ALLandIS65WV12816BLLarepackged  
intheJEDECstandard48-pinminiBGA(6mmx8mm)and  
44-Pin TSOP (TYPE II).  
Option A1: –40 to +85oC  
FUNCTIONAL BLOCK DIAGRAM  
128K x 16  
MEMORY ARRAY  
A0-A16  
DECODER  
V
DD  
GND  
I/O0-I/O7  
Lower Byte  
I/O  
DATA  
CIRCUIT  
COLUMN I/O  
I/O8-I/O15  
Upper Byte  
CS2  
CS1  
OE  
WE  
UB  
CONTROL  
CIRCUIT  
LB  
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability  
arisingoutoftheapplicationoruseofanyinformation, productsorservicesdescribedherein. Customersareadvisedtoobtainthelatestversionofthisdevicespecificationbeforerelyingonany  
publishedinformationandbeforeplacingordersforproducts.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
1
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
PIN CONFIGURATIONS  
48-Pin mini BGA (6mm x 8mm)  
2 CS Option (Package Code B2)  
48-Pin mini BGA (6mm x 8mm)  
(Package Code B)  
1
2
3
4
5
6
1
2
3
4
5
6
A0  
A3  
A1  
A4  
A2  
A0  
A3  
A1  
A4  
A2  
LB  
I/O  
OE  
UB  
N/C  
LB  
OE  
UB  
CS2  
A
B
C
D
E
F
A
B
C
D
E
F
CSI  
I/O  
0
I/O  
CS1  
I/O  
0
8
8
I/O  
I/O  
A5  
A6  
I/O  
I/O  
I/O  
I/O  
10  
A5  
A6  
I/O  
1
I/O  
2
9
10  
1
2
9
GND  
NC  
NC  
A14  
A12  
A7  
GND  
NC  
NC  
A14  
A12  
A7  
I/O  
I/O  
I/O  
I/O  
I/O  
VDD  
I/O  
I/O  
I/O  
I/O  
I/O  
VDD  
11  
3
4
5
11  
3
4
5
GND  
GND  
VDD  
A16  
A15  
A13  
A10  
VDD  
A16  
A15  
A13  
A10  
12  
12  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
6
I/O  
I/O  
6
14  
14  
13  
13  
NC  
A8  
WE  
NC  
A8  
WE  
I/O  
7
I/O  
7
15  
15  
G
H
G
H
NC  
NC  
A9  
A11  
NC  
A9  
A11  
NC  
44-Pin mini TSOP (Type II)  
(Package Code T)  
PIN DESCRIPTIONS  
A0-A16  
I/O0-I/O15  
CS1, CS2  
OE  
Address Inputs  
DataInputs/Outputs  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
A4  
A3  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A6  
A7  
OE  
UB  
LB  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
2
A2  
3
A1  
4
WE  
A0  
5
CS1  
I/O0  
I/O1  
I/O2  
I/O3  
6
LB  
Lower-byteControl(I/O0-I/O7)  
Upper-byteControl(I/O8-I/O15)  
NoConnection  
7
8
UB  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
NC  
VDD  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A16  
A15  
A14  
A13  
A12  
VDD  
VDD  
Power  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
A8  
A9  
A10  
A11  
NC  
GND  
Ground  
2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
TRUTH TABLE  
I/O PIN  
Mode  
WE CS1 CS2  
OE  
LB  
UB  
I/O0-I/O7  
I/O8-I/O15 VddCurrent  
Not Selected  
X
X
X
H
X
X
X
L
X
X
X
X
X
X
H
X
X
H
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
ISB1, ISB2  
ISB1, ISB2  
ISB1, ISB2  
OutputDisabled  
Read  
H
H
L
L
H
H
H
H
L
X
X
L
High-Z  
High-Z  
High-Z  
High-Z  
ICC  
ICC  
H
H
H
L
L
L
H
H
H
L
L
L
L
H
L
H
L
L
DOUT  
High-Z  
DOUT  
High-Z  
DOUT  
DOUT  
ICC  
Write  
L
L
L
L
L
L
H
H
H
X
X
X
L
H
L
H
L
L
DIN  
High-Z  
DIN  
High-Z  
DIN  
DIN  
ICC  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol  
VTERM  
TSTG  
Parameter  
Value  
–0.2 to VDD+0.3  
–65 to +150  
1.0  
Unit  
Terminal Voltage with Respect to GND  
Storage Temperature  
V
°C  
W
PT  
Power Dissipation  
Note:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect  
reliability.  
OPERATING RANGE (VDD)  
Option  
A
AmbientTemperature  
0°C to +70°C  
IS65WV12816ALL  
1.65V - 2.2V  
IS65WV12816BLL  
2.5V - 3.6V  
A1  
–40°Cto+85°C  
1.65V - 2.2V  
2.5V - 3.6V  
A2  
A3  
–40°Cto+105°C  
–40°Cto+125°C  
1.65V - 2.2V  
1.65V - 2.2V  
2.5V - 3.6V  
2.5V - 3.6V  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
3
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol Parameter  
TestConditions  
Vdd  
Min.  
Max.  
Unit  
VOH  
VOL  
VIH  
OutputHIGHVoltage  
IOH = -0.1 mA  
IOH = -1 mA  
1.65-2.2V  
2.5-3.6V  
1.4  
2.2  
V
V
OutputLOWVoltage  
Input HIGH Voltage  
Input LOW Voltage  
IOL = 0.1 mA  
IOL = 2.1 mA  
1.65-2.2V  
2.5-3.6V  
0.2  
0.4  
V
V
1.65-2.2V  
2.5-3.6V  
1.4  
2.2  
VDD + 0.2  
VDD + 0.3  
V
V
(1)  
VIL  
1.65-2.2V  
2.5-3.6V  
–0.2  
–0.2  
0.4  
0.6  
V
V
ILI  
InputLeakage  
GND VIN VDD  
–1  
–1  
1
1
µA  
µA  
ILO  
OutputLeakage  
GND VOUT VDD, Outputs Disabled  
Notes:  
1. VIL (min.) = –1.0V for pulse width less than 10 ns.  
CAPACITANCE(1)  
Symbol  
CIN  
Parameter  
Conditions  
VIN = 0V  
Max.  
8
Unit  
Input Capacitance  
Input/Output Capacitance  
pF  
pF  
COUT  
VOUT = 0V  
10  
Note:  
1. Tested initially and after any design or process changes that may affect these parameters.  
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
IS65WV12816ALL, POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
Symbol  
Parameter  
TestConditions  
Options  
Max.  
-70ns  
Unit  
mA  
mA  
mA  
ICC  
VddDynamicOperating  
SupplyCurrent  
V
DD =Max.,  
OUT =0mA,f=fMAX  
DD =Max.,  
OUT =0mA,f=0  
DD =Max.,  
IN =VIH orVIL  
CS1=VIH ,CS2=VIL  
f = 1 MH  
A,A1  
A2,A3  
15  
20  
I
I
CC  
1
OperatingSupply  
Current  
V
I
A,A1  
A2,A3  
7
7
I
SB  
1
TTLStandbyCurrent  
(TTLInputs)  
V
V
A,A1  
A2,A3  
0.6  
0.6  
,
Z
OR  
ULBControl  
V
DD =Max.,VIN =VIH orVIL  
CS1=VIL,f=0,UB=VIH,LB=VIH  
DD =Max.,  
CS1 DD0.2V,  
CS2 0.2V,  
I
SB  
2
CMOSStandby  
Current(CMOSInputs)  
V
A,A1  
A2  
A3  
15  
20  
50  
µA  
V  
VIN  
VDD 0.2V,or  
VIN  
0.2V, f = 0  
OR  
ULBControl  
VDD = Max., CS1 = VIL, CS2=VIH  
IN 0.2V,f=0;UB/LB=VDD 0.2V  
V
IS65WV12816BLL, POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
Symbol  
Parameter  
TestConditions  
Options  
Max.  
-55ns -70ns  
Max.  
Unit  
mA  
mA  
mA  
ICC  
VddDynamicOperating  
SupplyCurrent  
V
DD =Max.,  
OUT =0mA,f=fMAX  
DD =Max.,  
OUT =0mA,f=0  
DD =Max.,  
IN =VIH orVIL  
CS1=VIH ,CS2=VIL  
f = 1 MH  
A,A1  
A2,A3  
25  
30  
20  
25  
I
I
CC  
1
OperatingSupply  
Current  
V
I
A,A1  
A2,A3  
7
7
7
7
I
SB  
1
TTLStandbyCurrent  
(TTLInputs)  
V
V
A,A1  
A2,A3  
0.6  
0.6  
0.6  
0.6  
,
Z
OR  
ULBControl  
V
DD =Max.,VIN =VIH orVIL  
CS1=VIL,f=0,UB=VIH,LB=VIH  
DD =Max.,  
CS1 DD0.2V,  
CS2 0.2V,  
I
SB  
2
CMOSStandby  
Current(CMOSInputs)  
V
A,A1  
A2  
A3  
15  
25  
65  
15  
25  
65  
µA  
V  
VIN  
VDD 0.2V,or  
VIN  
0.2V, f = 0  
OR  
ULBControl  
VDD = Max., CS1 = VIL, CS2=VIH  
IN 0.2V,f=0;UB/LB=VDD 0.2V  
V
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
5
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
AC TEST CONDITIONS  
Parameter  
65WV12816ALL  
65WV12816BLL  
(Unit)  
(Unit)  
0.4V to VDD-0.2V  
5 ns  
Input Pulse Level  
0.4V to VDD-0.3V  
Input Rise and Fall Times  
5ns  
Input and Output Timing  
andReferenceLevel  
VREF  
VREF  
OutputLoad  
See Figures 1 and 2  
See Figures 1 and 2  
65WV12816ALL  
65WV12816BLL  
(2.5V - 3.6V)  
(1.65V-2.2V)  
3070  
R1(Ω)  
R2(Ω)  
3070  
3150  
3150  
VREF  
VTM  
0.9V  
1.8V  
1.5V  
2.8V  
AC TEST LOADS  
R1  
R1  
VTM  
VTM  
OUTPUT  
OUTPUT  
R2  
R2  
30 pF  
5 pF  
Including  
jig and  
Including  
jig and  
scope  
scope  
Figure 1  
Figure 2  
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)  
-55 ns  
-70 ns  
Symbol  
tRC  
Parameter  
Min.  
Max.  
Min.  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Read Cycle Time  
55  
10  
5
70  
10  
5
tAA  
Address Access Time  
Output Hold Time  
55  
70  
tOHA  
tACS1/tACS2  
tDOE  
CS1/CS2 Access Time  
OE Access Time  
55  
25  
20  
70  
35  
25  
(2)  
tHZOE  
OE to High-Z Output  
OE to Low-Z Output  
CS1/CS2 to High-Z Output  
CS1/CS2 to Low-Z Output  
LB, UB Access Time  
LB, UB to High-Z Output  
LB, UB to Low-Z Output  
(2)  
tLZOE  
(2)  
tHZCS1/tHZCS2  
0
20  
0
25  
(2)  
tLZCS1/tLZCS2  
10  
0
10  
0
tBA  
55  
20  
70  
25  
tHZB  
tLZB  
0
0
Notes:  
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V, input pulse levels of 0.4 to 1.4V and  
outputloadingspecifiedinFigure1.  
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
7
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
AC WAVEFORMS  
READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = VIL, CS2 = WE = VIH, UB or LB = VIL)  
tRC  
ADDRESS  
tAA  
tOHA  
tOHA  
DATA VALID  
DOUT  
PREVIOUS DATA VALID  
AC WAVEFORMS  
READ CYCLE NO. 2(1,3) (CS1, CS2, OE, AND UB/LB Controlled)  
t
RC  
ADDRESS  
OE  
t
AA  
t
OHA  
t
HZOE  
t
DOE  
t
LZOE  
CS1  
t
ACE1/tACE2  
CS2  
tLZCE1/  
tLZCE2  
t
t
HZCS1/  
HZCS2  
LB UB  
,
t
BA  
t
HZB  
t
LZB  
HIGH-Z  
DOUT  
DATA VALID  
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CS1, UB, or LB = VIL. CS2=WE=VIH.  
3. Address is valid prior to or coincident with CS1 LOW transition.  
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)  
-55 ns  
-70 ns  
Symbol  
Parameter  
Min. Max.  
Min. Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tWC  
Write Cycle Time  
55  
45  
45  
0
20  
70  
60  
60  
0
20  
tSCS1/tSCS2 CS1/CS2 to Write End  
tAW  
Address Setup Time to Write End  
tHA  
Address Hold from Write End  
Address Setup Time  
tSA  
0
0
tPWB  
tPWE  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width  
45  
40  
25  
0
60  
50  
30  
0
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
tHD  
(3)  
tHZWE  
5
5
(3)  
tLZWE  
Notes:  
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V, input pulse levels of 0.4V to 1.4V  
and output loading specified in Figure 1.  
2. TheinternalwritetimeisdefinedbytheoverlapofCS1LOW,CS2HIGHandUBorLB,andWELOW.AllsignalsmustbeinvalidstatestoinitiateaWrite,butanyonecango  
inactivetoterminatetheWrite.TheDataInputSetupandHoldtimingarereferencedtotherisingorfallingedgeofthesignalthatterminatesthewrite.  
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
9
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
AC WAVEFORMS  
WRITE CYCLE NO. 1(1,2) (CS1 Controlled, OE = HIGH or LOW)  
t
WC  
ADDRESS  
CS1  
t
HA  
t
SCS1  
t
SCS2  
CS2  
t
AW  
t
PWE  
WE  
t
PWB  
LB, UB  
t
SA  
t
HZWE  
t
LZWE  
HIGH-Z  
SD  
DOUT  
DIN  
DATA UNDEFINED  
t
t
HD  
DATA-IN VALID  
Notes:  
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CS1 , CS2 and WE inputs and at  
least one of the LB and UB inputs being in the LOW state.  
2. WRITE = (CS1) [ (LB) = (UB) ] (WE).  
10  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
AC WAVEFORMS  
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)  
t
WC  
ADDRESS  
OE  
t
HA  
tSCS1  
CS1  
t
SCS2  
CS2  
t
AW  
t
PWE  
WE  
LB, UB  
DOUT  
DIN  
t
SA  
t
HZWE  
t
LZWE  
HIGH-Z  
SD  
DATA UNDEFINED  
t
t
HD  
DATA-IN VALID  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
11  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
AC WAVEFORMS  
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)  
tWC  
ADDRESS  
OE  
tHA  
tSCS1  
CS1  
tSCS2  
CS2  
tAW  
tPWE  
WE  
LB, UB  
tSA  
tHZWE  
tLZWE  
HIGH-Z  
tSD  
DATA-IN VALID  
DATA UNDEFINED  
DOUT  
DIN  
tHD  
12  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
AC WAVEFORMS  
WRITE CYCLE NO. 4 (UB/LB Controlled)  
t
WC  
t
WC  
ADDRESS  
OE  
ADDRESS 1  
ADDRESS 2  
t
SA  
LOW  
HIGH  
CS1  
t
HA  
SA  
t
HA  
CS2  
t
WE  
t
PBW  
t
PBW  
WORD 1  
WORD 2  
LB, UB  
DOUT  
DIN  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
t
HD  
t
HD  
t
SD  
t
SD  
DATAIN  
VALID  
DATAIN  
VALID  
UB_CSWR4.eps  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
13  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
DATA RETENTION SWITCHING CHARACTERISTICS (LL)  
Symbol  
VDR  
Parameter  
Test Condition  
Options  
Min.  
Typ.(1)  
Max.  
Unit  
V
VDD for Data Retention  
Data Retention Current  
See Data Retention Waveform  
Vdd = 1.2V, CS1 VDD – 0.2V  
1.2  
3.6  
IDR  
A, A1  
A2  
5
15  
25  
65  
µA  
A3  
tSDR  
tRDR  
Data Retention Setup Time See Data Retention Waveform  
0
ns  
ns  
Recovery Time  
See Data Retention Waveform  
tRC  
O
Note 1: Typical values are measured at VDD = 3.0V, T  
A
= 25 C and not 100% tested.  
DATA RETENTION WAVEFORM (CS1 Controlled)  
tSDR  
Data Retention Mode  
tRDR  
VDD  
1.65V  
1.4V  
VDR  
CS1 VDD - 0.2V  
CS1  
GND  
DATA RETENTION WAVEFORM (CS2 Controlled)  
Data Retention Mode  
VDD  
3.0  
t
SDR  
t
RDR  
CE2  
2.2V  
VDR  
CS2 0.2V  
0.4V  
GND  
14  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
ORDERING INFORMATION  
IS65WV12816ALL (1.65V - 2.2V)  
Temperature Range (A): 0°C to +70°C  
Speed(ns)  
Order Part No.  
Package  
70  
IS65WV12816ALL-70TA  
IS65WV12816ALL-70BA  
IS65WV12816ALL-70B2A  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Temperature Range (A1): –40°C to +85°C  
Speed(ns)  
Order Part No.  
Package  
70  
IS65WV12816ALL-70TA1  
IS65WV12816ALL-70BA1  
IS65WV12816ALL-70B2A1  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Temperature Range (A2): –40°C to +105°C  
Speed(ns)  
Order Part No.  
Package  
70  
IS65WV12816ALL-70TA2  
IS65WV12816ALL-70BA2  
IS65WV12816ALL-70B2A2  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Temperature Range (A3): –40°C to +125°C  
Speed(ns)  
Order Part No.  
Package  
70  
IS65WV12816ALL-70TA3  
IS65WV12816ALL-70BA3  
IS65WV12816ALL-70B2A3  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
15  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
ORDERING INFORMATION  
IS65WV12816BLL (2.5V - 3.6V)  
Temperature Range (A): 0°C to +70°C  
Speed(ns)  
Order Part No.  
Package  
55  
IS65WV12816BLL-55TA  
IS65WV12816BLL-55BA  
IS65WV12816BLL-55B2A  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
70  
IS65WV12816BLL-70TA  
IS65WV12816BLL-70BA  
IS65WV12816BLL-70B2A  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Temperature Range (A1): –40°C to +85°C  
Speed(ns)  
Order Part No.  
Package  
55  
IS65WV12816BLL-55TA1  
IS65WV12816BLL-55BA1  
IS65WV12816BLL-55B2A1  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
70  
IS65WV12816BLL-70TA1  
IS65WV12816BLL-70BA1  
IS65WV12816BLL-70B2A1  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
16  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
02/05/03  
®
IS65WV12816ALL, IS65WV12816BLL  
ISSI  
ORDERING INFORMATION (continual)  
IS65WV12816BLL (2.5V - 3.6V)  
TEMPERATURE RANGE (A2): –40°C TO +105°C  
Speed(ns)  
Order Part No.  
Package  
55  
IS65WV12816BLL-55TA2  
IS65WV12816BLL-55BA2  
IS65WV12816BLL-55B2A2  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
70  
IS65WV12816BLL-70TA2  
IS65WV12816BLL-70BA2  
IS65WV12816BLL-70B2A2  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Temperature Range (A3): –40°C to +125°C  
Speed(ns)  
Order Part No.  
Package  
55  
IS65WV12816BLL-55TA3  
IS65WV12816BLL-55BA3  
IS65WV12816BLL-55B2A3  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
70  
IS65WV12816BLL-70TA3  
IS65WV12816BLL-70BA3  
IS65WV12816BLL-70B2A3  
TSOP  
mini BGA (6mm x 8mm)  
mini BGA (6mm x 8mm), 2 CS Option  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. 00D  
17  
02/05/03  
®
PACKAGING INFORMATION  
Mini Ball Grid Array  
ISSI  
Package Code: B (48-pin)  
Top View  
Bottom View  
φ b (48x)  
1
2
3
4
5 6  
6
5
4
3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
e
D
D1  
G
H
G
H
e
E
E1  
Notes:  
1. Controllingdimensionsareinmillimeters.  
A2  
A
A1  
SEATING PLANE  
mBGA - 6mm x 8mm  
mBGA - 8mm x 10mm  
MILLIMETERS  
INCHES  
MILLIMETER  
INCHES  
Sym. Min. Typ. Max.  
Min. Typ. Max.  
Sym. Min. Typ. Max.  
Min. Typ. Max.  
N0.  
N0.  
Leads  
48  
Leads  
48  
A
1.20  
0.30  
0.047  
0.012  
A
1.20  
0.30  
0.047  
0.012  
A1  
A2  
D
0.24  
0.60  
7.90  
0.009  
0.024  
0.311  
A1  
A2  
D
0.24  
0.60  
9.90  
0.009  
0.024  
0.390  
8.10  
0.319  
10.10  
0.398  
D1  
E
5.25 BSC  
0.207 BSC  
D1  
E
5.25 BSC  
0.207 BSC  
5.90  
6.10  
0.232  
0.240  
7.90  
8.10  
0.311  
0.319  
E1  
e
3.75 BSC  
0.75 BSC  
0.148 BSC  
E1  
e
3.75 BSC  
0.75 BSC  
0.148 BSC  
0.030 BSC  
0.030 BSC  
b
0.30 0.35 0.40  
0.012 0.014 0.016  
b
0.30 0.35 0.40  
0.012 0.014 0.016  
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
Rev. D  
01/15/03  
®
PACKAGINGINFORMATION  
ISSI  
Plastic TSOP  
Package Code: T (Type II)  
N
N/2+1  
Notes:  
1. Controlling dimension: millimieters,  
unless otherwise specified.  
2. BSC = Basic lead spacing between  
centers.  
3. Dimensions D and E1 do not include  
mold flash protrusions and should be  
measured from the bottom of the  
E
E1  
package  
.
4. Formed leads shall be planar with  
respect to one another within 0.004  
inches at the seating plane.  
1
N/2  
D
SEATING PLANE  
A
ZD  
L
α
e
b
C
A1  
Plastic TSOP (T - Type II)  
Millimeters Inches  
Millimeters  
Inches  
Millimeters  
Inches  
Symbol Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Ref. Std.  
No. Leads (N)  
32  
44  
1.2044  
0.050 0.150  
0.45  
0.21  
18.313 18.517  
10.03 10.29  
11.56 11.96  
0.800 BSC  
50  
A
A1  
b
1.20  
0.05 0.15  
0.30 0.52  
0.12 0.21  
20.82 21.08  
10.03 10.29  
11.56 11.96  
1.27 BSC  
0.047  
0.047  
1.20  
0.047  
0.002 0.006  
0.012 0.020  
0.005 0.0083  
0.820 0.830  
0.391 0.400  
0.451 0.466  
0.050 BSC  
0.002 0.0059  
0.012 0.018  
0.005 0.0083  
0.721 0.729  
0.395 0.405  
0.455 0.471  
0.0315 BSC  
0.05 0.15  
0.30 0.45  
0.12 0.21  
20.82 21.08  
10.03 10.29  
11.56 11.96  
0.80 BSC  
0.002 0.006  
0.012 0.018  
0.005 0.0083  
0.820 0.830  
0.395 0.405  
0.455 0.471  
0.031 BSC  
0.30  
0.12  
C
D
E1  
E
e
L
ZD  
α
0.40 0.60  
0.95 REF.  
0.016 0.024  
0.406 0.597  
0.805 REF.  
0.016 0.0235  
0.40 0.60  
0.875 REF.  
0.016 0.024  
0°  
5°  
0°  
5°  
0°  
5°  
0°  
5°  
0°  
5°  
0°  
5°  
Integrated Silicon Solution, Inc.  
PK13197T2 Rev.D 07/17/97  

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