IX4428NTR [IXYS]
1.5-Ampere Dual Low-Side Ultrafast MOSFET Drivers;
| 型号： | IX4428NTR |
| 厂家： | 
IXYS CORPORATION |
| 描述： | 1.5-Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| 文件： | 总13页 (文件大小：245K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IX4426-IX4427-IX4428
1.5-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
INTEGRATED
C
IRCUITS
D
IVISION
Features
Description
• 1.5A Peak Output Current
The IX4426, IX4427, and IX4428 are dual high-speed,
low-side gate drivers. Each of the two outputs can
source and sink 1.5A of peak current with rise and fall
times of less than 10ns. The inputs of each driver are
TTL and CMOS compatible, and are virtually immune
to latch-up. Low propagation delay times and fast,
matched rise and fall times make the IX4426, IX4427,
and IX4428 ideal for high-frequency and high-power
applications.
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Operating Temperature Range
• Latch-up Protected to 1.5A
• TTL and CMOS Compatible Inputs
• Fast Rise and Fall Times
• Low Power Consumption
Applications
• MOSFET Driver
• Switching Power Supplies
• Motor Controls
• DC to DC Converters
• Pulse Transformer Driver
The IX4426 is configured as a dual inverting driver;
the IX4427 is configured as a dual non-inverting
driver; and the IX4428 is configured with one inverting
driver and one non-inverting driver. All three devices
are available in a standard 8-pin SOIC package (N
suffix) and an 8-pin DFN package (M suffix).
Ordering Information
Logic Configuration
Part Number
Package Type
Packing Method
Quantity
IX4426N
8-Pin SOIC
Tube
100
OUTA
OUTB
INA
INB
A
B
IX4426NTR
IX4426MTR
IX4427N
8-Pin SOIC
8-Pin DFN
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
Tape & Reel
Tape & Reel
Tube
2000
2000
100
OUTA
OUTB
INA
INB
A
B
IX4427NTR
IX4427MTR
IX4428N
Tape & Reel
Tape & Reel
Tube
2000
2000
100
INA
INB
OUTA
OUTB
A
B
IX4428NTR
IX4428MTR
Tape & Reel
Tape & Reel
2000
2000
DS-IX4426-27-28_R05
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1
IX4426-27-28
INTEGRATED
C
IRCUITS
D
IVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. IX4426-27-28 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 IX4426 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 IX4428 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 IX4427 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2
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R05
IX4426-27-28
INTEGRATED
C
IRCUITS
D
IVISION
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IX4426
Pin Name
Description
NC
INA
1
2
3
4
8
7
6
5
NC
INA
INB
Channel A Logic Input
Channel B Logic Input
A
OUTA
VCC
GND
INB
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
B
OUTB
IX4427
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn on or turn off a discrete MOSFET or IGBT
NC
INA
1
2
3
4
8
7
6
5
NC
V
Supply Voltage - Provides power to the device
CC
A
OUTA
VCC
GND
INB
Ground - Common ground reference for the
device
GND
NC
B
OUTB
No Connection
IX4428
NC
INA
1
2
3
4
8
7
6
5
NC
A
B
OUTA
VCC
GND
INB
OUTB
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
Input Voltage
-0.3
-5.0
-
35
V
V
CC
V
V
CC+0.3
IN
I
Output Current
Junction Temperature
Storage Temperature
±1.5
+150
+150
A
OUT
T
°C
-55
-65
J
T
°C
STG
Unless otherwise specified, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
4.5
-40
30
V
CC
T
Operating Temperature Range
+125
°C
A
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IX4426-27-28
INTEGRATED
C
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D
IVISION
1.5 Electrical Characteristics: T = 25°C
A
Test Conditions: 4.5V < V < 18V.
CC
Parameter
Conditions
Symbol
VIH
Minimum
Typical Maximum Units
Input Voltage, High
Input Voltage, Low
-
2.4
-
-
-
-
0.8
±1
-
V
-
VIL
0V < V < V
IN
Input Current
IIN
CC
-
-
A
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Latch-Up Protection
Rise Time
-
VOH
VOL
ROH
ROL
VCC-0.025
-
V
-
-
-
-
0.025
8
V
=18V, I =-100mA
OUT
CC
4
V
=18V, I =100mA
OUT
CC
-
2
-
4
-
With Reverse Current
I
>500
mA
V
V
V
V
=18V, C
=18V, C
=18V, C
=18V, C
=1000pF
=1000pF
=1000pF
=1000pF
tR
CC
CC
CC
CC
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
10
8
20
20
60
60
4
Fall Time
tF
ns
On-Time Propagation Delay
Off-Time Propagation Delay
ton
toff
35
35
2.5
0.6
V
V
=V =3V
INA INB
Power Supply Current
ICC
mA
=V =0V
0.8
INA INB
4
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IX4426-27-28
INTEGRATED
C
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D
IVISION
1.6 Electrical Characteristics: T = - 40°C to +125°C
A
Test Conditions: 4.5V < V < 18V.
CC
Parameter
Conditions
Symbol
VIH
Minimum
Maximum
Units
Input Voltage, High
Input Voltage, Low
-
2.4
-
-
0.8
±1
V
-
VIL
0V < V < V
IN
Input Current
IIN
CC
-
A
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Latch-Up Protection
Rise Time
-
VOH
VOL
ROH
ROL
VCC-0.025
-
V
-
-
-
0.025
12
V
=18V, I =-100mA
OUT
CC
V
=18V, I =100mA
OUT
CC
-
8
-
With Reverse Current
I
>500
mA
V
V
V
V
=18V, C
=18V, C
=18V, C
=18V, C
=1000pF
=1000pF
=1000pF
=1000pF
tR
CC
CC
CC
CC
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
30
30
70
70
6
Fall Time
tF
ns
On-Time Propagation Delay
Off-Time Propagation Delay
ton
toff
V
V
=V =3V
INA INB
Power Supply Current
ICC
mA
=V =0V
1
INA INB
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IX4426-27-28
INTEGRATED
C
IRCUITS
D
IVISION
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
8-Pin SOIC
8-Pin DFN
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
120
68
°C/W
°C/W
JA
JA
2 IX4426-27-28 Performance
2.1 Timing Diagrams
VIH
VIH
VIL
INx
INx
VIL
t
t
t
t
on
off
off
on
90%
90%
10%
OUTx
10%
OUTx
t
t
t
t
R
F
F
R
Non-Inverting Driver Waveforms
Inverting Driver Waveforms
2.2 Characteristics Test Diagram
+
VCC
VCC
INA
INB
OUTA
OUTB
0.1μF 10μF
-
Tektronix
Current Probe
6302
GND
1000pF
VIN
Tektronix
1000pF
Current Probe
6302
6
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IX4426-27-28
INTEGRATED
C
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D
IVISION
3 Block Diagrams & Truth Tables
3.1 IX4426
3.3 IX4427
VCC
VCC
OUTA
INA
OUTA
INA
GND
GND
VCC
VCC
OUTB
INB
OUTB
INB
IN
OUT
IN
OUT
X
X
X
X
0
1
0
1
1
0
0
1
3.2 IX4428
VCC
OUTA
INA
GND
VCC
OUTB
INB
INA
OUTA
0
1
1
0
INB
0
OUTB
0
1
1
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7
IX4426-27-28
INTEGRATED
C
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D
IVISION
4 Performance Data
Fall Time vs. Supply Voltage
Rise Time & Fall Time vs.Temperature
Rise Time vs. Supply Voltage
(VIN=0V-5V, f=1kHz)
(VIN=0V-5V, f=1kHz)
(VIN=0V-5V, CL=1nF, VCC=18V)
100
90
80
70
60
50
40
30
20
10
0
13
12
11
10
9
100
90
80
70
60
50
40
30
20
10
0
Fall Time
CL=4.7nF
CL=1nF
CL=470pF
C =4.7nF
CL=1nF
Rise Time
CLL=470pF
8
7
0
5
10
15
20
25
30
-50
0
50
100
150
0
5
10
15
20
25
30
Supply Voltage (V)
Temperature (ºC)
Supply Voltage (V)
Fall Time vs Load Capacitance
Rise Time vs. Load Capacitance
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
VCC=4.5V
VCC=4.5V
V
CC=8V
CC=12V
VCC=18V
CC=25V
V
CC=8V
CC=12V
VCC=18V
CC=25V
V
V
V
V
VCC=30V
VCC=30V
0
0
0
1000
2000
3000
4000
5000
1000
2000
3000
4000
5000
Load Capacitance (pF)
Load Capacitance (pF)
Propagation Delay vs.Temperature
(CL=1nF, VCC=18V)
Propagation Delay vs. Supply Voltage
Propagation Delay vs. Input Voltage
(CL=1nF, VCC=18V)
(CL=1nF, VIN=0V-5V, f=1kHz)
35
30
25
20
15
70
60
50
40
30
20
10
90
80
70
60
50
40
30
20
10
toff
ton
toff
ton
toff
ton
-50
0
50
100
150
0
5
10
15
20
25
30
0
5
10
15
20
Temperature (ºC)
Supply Voltage (V)
Input Voltage (V)
Input Threshold vs.Temperature
Input Threshold vs. Supply Voltage
(CL=1nF, VCC=18V)
(CL=1nF)
1.85
1.80
1.75
1.70
1.65
1.60
1.9
1.8
1.7
1.6
1.5
1.4
1.3
Min VIH
Min VIH
Max VIL
Max VIL
1.55
-50
0
50
100
150
0
5
10
15
20
25
30
Temperature (ºC)
Supply Voltage (V)
8
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IX4426-27-28
INTEGRATED
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D
IVISION
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=8V)
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=12V)
100
90
80
70
60
50
40
30
20
10
0
140
120
100
80
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
60
40
20
0
100
1000
10000
100
1000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Supply Current vs. Load Capacitance
A&B Outputs Active
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=18V)
(VCC=30V)
200
150
100
50
350
300
250
200
150
100
50
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
0
100
0
1000
10000
100
1000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Quiescent Supply Current
vs.Temperature
(VCC=18V)
Dynamic Supply Current vs.Temperature
Both Outputs Active
Supply Current vs. Frequency
A&B Outputs Active
(CL=1000pF)
(VCC=18V,VIN=0V-5V, f=1kHz, CL=1nF)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.65
80
70
60
50
40
30
20
10
0
VIN=3V to 18V
VCC=30V
1.60
1.55
1.50
1.45
1.40
V
CC=25V
VCC=18V
CC=12V
V
VCC=8V
CC=4.5V
V
VIN=0V
-50
0
50
100
150
-50
0
50
100
150
1
10
100
1000
Temperature (ºC)
Temperature (ºC)
Frequency (kHz)
Output Sink Current
vs. Supply Voltage
(CL=47nF)
Output Source Current
vs. Supply Voltage
(CL=47nF)
6
5
4
3
2
1
0
0
-1
-2
-3
-4
-5
-6
0
0
5
10
15
20
25
30
5
10
15
20
25
30
Supply Voltage (V)
Supply Voltage (V)
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IX4426-27-28
INTEGRATED
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D
IVISION
Output Sink Current
vs.Temperature
Output Source Current
vs.Temperature
(CL=47nF, VCC=18V)
(CL=47nF, VCC=18V)
3.4
3.2
3.0
2.8
2.6
2.4
-2.3
-2.4
-2.5
-2.6
-2.7
-2.8
-2.9
-3.0
-50
0
50
100
150
-50
0
50
100
150
Temperature (ºC)
Temperature (ºC)
High-State Output Resistance
vs. Supply Voltage
(IOUT=-10mA)
Low-State Output Resistance
vs. Supply Voltage
(IOUT=+10mA)
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Supply Voltage (V)
Supply Voltage (V)
10
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5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IX4426 / IX4427 / IX4428 All Versions
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
IX4426 / IX4427 / IX4428 All Versions
260°C for 30 seconds
R05
www.ixysic.com
11
IX4426-27-28
INTEGRATED
C
IRCUITS
D
IVISION
5.4 Mechanical Dimensions
5.4.1 “N” Package (8-Pin SOIC)
PCB Land Pattern
1.27 REF
Pin 8
0.65
0.40 min
1.27 max
6.00 ± 0.20
3.90 ± 0.10
1.75
Pin 1
5.60
0.42 ± 0.09
1.25 min
4.90 ± 0.10
1.27
NOTES:
1.75 max
1. Complies with JEDEC Standard MS-012.
2. All dimensions are in millimeters.
0.175 ± 0.075
3. Dimensions do not include mold flash or burrs
5.4.2 “N” Package Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
W=12.00
(0.472)
Tape Thickness
B0=5.30
(0.209)
0.102 MAX.
(0.004 MAX.)
A0=6.50
(0.256)
P=8.00
(0.315)
K0= 2.10
(0.083)
Dimensions
mm
(inches)
User Direction of Feed
Embossed Carrier
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
12
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R05
IX4426-27-28
INTEGRATED
C
IRCUITS
D
IVISION
5.4.3 “M” Package (8-Pin DFN)
Recommended PCB Land Pattern
0.85±0.05
(0.033±0.002)
3.00 BSC
(0.118 BSC)
0.203 REF
(0.008 REF)
0.65
3.00
(0.026)
(0.118)
Pin 1
2.05
(0.081)
3.00 BSC
(0.118 BSC)
0.35
(0.014)
1.70
(0.067)
0.80
(0.031)
MIN 0.00 / MAX 0.05
(MIN 0.000 / MAX 0.002)
1.65±0.05
(0.065±0.002)
MIN 0.2
(MIN 0.008)
Dimensions
mm
(inches)
2.00±0.05
(0.079±0.002)
0.30±0.05
(0.012±0.002)
NOTES:
0.65 BSC
(0.026 BSC)
1. The exposed metal pad on the back of the package should
be connected to GND. Pad is not suitable for carrying current.
2. Terminal width (0.30±0.05) is measured between
0.15mm and 0.30mm from the terminal tip.
3. Bilateral coplanarity zone applies to the exposed
heat sink slug as well as the terminals.
Pin 1
Pin 8
0.40±0.05
(0.016±0.002)
C0.35 x 45º
(C0.014 x 45º)
5.4.4 “M” Package Tape & Reel
∅1.55 0.05
(0.061 0.002)
4.00 Note #1
(0.157)
1.75 0.10
(0.069 0.004)
330.2 DIA.
(13.00 DIA.)
2.00 0.05
(0.079 0.002)
0.30 0.05
(0.012 0.002)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.05
(0.217 0.002)
Pin 1
B0=3.30
(0.130)
12.00 0.30
(0.472 0.012)
Embossed Carrier
NOTES:
K0=1.10
(0.043)
8.00
(0.315)
∅1.50 (MIN)
(∅0.059 MIN)
A0=3.30
(0.130)
Embossment
User direction of feed
1. 10 sprocket hole pitch cumulative tolerance 0.2
2. Camber not to exceed 1mm in 100mm
3. Material black Advantek Polystyrene
Dimensions
mm
(inches)
4. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket
5. K0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier
6. Pocket position relative to the sprocket hole measured as true position of pocket, not pocket hole
7. Cover tape width 9.3 0.1mm
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IX4426-27-28_R05
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
8/20/2015
R05
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13
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