IXGH6N170A [IXYS]
High Voltage IGBT; 高压IGBT型号: | IXGH6N170A |
厂家: | IXYS CORPORATION |
描述: | High Voltage IGBT |
文件: | 总2页 (文件大小:56K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Advance Technical Data
IXGH 6N170A
IXGT 6N170A
VCES
IC25
= 1700 V
6 A
High Voltage
IGBT
=
VCE(sat) = 7.0 V
tfi(typ)
=
32 ns
Symbol
TestConditions
Maximum Ratings
TO-268(IXGT)
VCES
VCGR
TJ = 25°C to 150°C
1700
1700
V
TJ = 25°C to 150°C; RGE = 1 MΩ
V
G
VGES
VGEM
Continuous
Transient
20
30
V
V
E
C (TAB)
IC25
IC90
ICM
TC = 25°C
6
3
A
A
A
TO-247AD(IXGH)
TC = 90°C
TC = 25°C, 1 ms
14
SSOA
(RBSOA)
VGE = 15 V, TVJ = 125°C, RG = 33Ω
ICM = 12
@ 0.8 VCES
A
TAB)
Clamped inductive load
G
C
E
tSC
PC
TJ = 125°C, VCE = 1200 V; VGE = 15 V, RG = 33Ω
TC = 25°C
10
75
µs
G = Gate,
E=Emitter,
C = Collector,
TAB = Collector
W
TJ
-55 ... +150
150
°C
°C
°C
Features
z International standard packages
JEDEC TO-268 and
TJM
Tstg
-55 ... +150
JEDEC TO-247 AD
Md
Mounting torque (M3)
(TO-247)
1.13/10Nm/lb.in.
300 °C
z High current handling capability
z MOS Gate turn-on
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
- drive simplicity
z Rugged NPT structure
z Molding epoxies meet UL 94 V-0
flammability classification
Weight
TO-247
TO-268
6
4
g
g
Applications
z Capacitor discharge & pulser circuits
z AC motor speed control
z DC servo and robot drives
z DC choppers
Symbol
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
z Uninterruptible power supplies (UPS)
z Switched-mode and resonant-mode
power supplies
BVCES
VGE(th)
IC = 250 µA, VGE = 0 V
IC = 250 µA, VCE = VGE
1700
3.0
V
V
5.0
ICES
VCE = 0.8 • VCES
VGE = 0 V
TJ = 25°C
Note 1 TJ = 125°C
10
500
µA
µA
Advantages
z High power density
IGES
VCE = 0 V, VGE = 20 V
IC = IC90, VGE = 15 V
100
7.0
nA
z Suitable for surface mounting
z Easy to mount with 1 screw,
(isolated mounting screw hole)
VCE(sat)
TJ = 25°C
TJ = 125°C
5.5
6.5
V
V
DS98990A(01/03)
© 2003 IXYS All rights reserved
IXGH 6N170A
IXGT 6N170A
Symbol
gfs
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
TO-247 AD Outline
IC = IC25; VCE = 20 V
Note 2
2
3.5
S
∅ P
Cies
Coes
Cres
330
23
6
pF
pF
pF
VCE = 25 V, VGE = 0 V, f = 1 MHz
IC = IC90, VGE = 15 V, VCE = 0.5 VCES
QG
20
3.6
8
nC
nC
nC
QGE
QGC
e
Dim.
Millimeter
Inches
Min.
Max.
Min. Max.
A
A1
A2
4.7
2.2
2.2
5.3
2.54
2.6
.185 .209
.087 .102
.059 .098
td(on)
tri
td(off)
tfi
46
40
ns
ns
Inductive load, TJ = 25°C
IC = IC25, VGE = 15 V
b
b1
b2
1.0
1.65
2.87
1.4
2.13
3.12
.040 .055
.065 .084
.113 .123
220
32
450 ns
65 ns
RG = 33 Ω, VCE = 0.5 VCES
C
D
E
.4
.8
.016 .031
.819 .845
.610 .640
Eoff
0.19 0.40 mJ
20.80 21.46
15.75 16.26
e
5.20
5.72 0.205 0.225
L
L1
19.81 20.32
4.50
.780 .800
.177
td(on)
tri
48
43
ns
ns
Inductive load, TJ = 125°C
IC = IC25, VGE = 15 V
∅P 3.55
Q
3.65
.140 .144
5.89
6.40 0.232 0.252
Eon
td(off)
0.7
230
mJ
ns
R
S
4.32
5.49
.170 .216
242 BSC
6.15 BSC
RG = 33 Ω, VCE = 0.5 VCES
tfi
41
ns
Eoff
0.26
mJ
TO-268 Outline
RthJC
RthCK
1.65 K/W
K/W
(TO-247)
0.25
Notes:1. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
2. Pulse test, t ≤ 300 µs, duty cycle ≤ 2 %
Dim.
Millimeter
Inches
Min.
Max.
Min. Max.
A
A1
A2
4.9
2.7
.02
5.1
2.9
.25
.193 .201
.106 .114
.001 .010
b
b2
C
1.15
1.9
.4
1.45
2.1
.65
.045 .057
.75
.83
.016 .026
D
E
E1
13.80 14.00
15.85 16.05
.543 .551
.624 .632
.524 .535
13.3
13.6
e
H
L
5.45 BSC
18.70 19.10
.215 BSC
.736 .752
.094 .106
2.40
2.70
L1
1.20
1.40
.047 .055
L2
L3
L4
1.00
0.25 BSC
3.80 4.10
1.15
.039 .045
.010 BSC
.150 .161
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYSMOSFETs andIGBTsarecoveredbyoneormoreofthefollowingU.S.patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715 6,306,728B1
5,381,025
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