IXGP12N60BD1 [IXYS]

Insulated Gate Bipolar Transistor, 24A I(C), 600V V(BR)CES, N-Channel, TO-220AB,;
IXGP12N60BD1
型号: IXGP12N60BD1
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Insulated Gate Bipolar Transistor, 24A I(C), 600V V(BR)CES, N-Channel, TO-220AB,

局域网 电动机控制 栅 晶体管
文件: 总2页 (文件大小:68K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HiPerFASTTM IGBT  
IXGA 12N60BD1 V  
IXGP 12N60BD1 I  
= 600 V  
= 24 A  
CES  
C25  
V
= 2.1 V  
= 120 ns  
CE(sat)  
t
fi(typ)  
Symbol  
TestConditions  
Maximum Ratings  
TO-220AB(IXGP)  
VCES  
VCGR  
T
T
= 25°C to 150°C  
600  
600  
V
V
J
J
= 25°C to 150°C; R = 1 MΩ  
GE  
C (TAB)  
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
G
E
IC25  
IC90  
ICM  
T
= 25°C  
24  
12  
48  
A
C
T
= 90°C  
A
A
TO-263AA(IXGA)  
C
T
= 25°C, 1 ms  
C
SSOA  
V
= 15 V, T = 125°C, R = 33 Ω  
I
CM  
=
24A  
GE  
VJ  
G
(RBSOA)  
Clamped inductive load, L = 300 µH  
= 25°C  
@ 0.8 V  
CES  
G
C (TAB)  
E
PC  
T
100  
W
C
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
G = Gate,  
E = Emitter,  
C = Collector,  
TAB = Collector  
-55 ... +150  
Md  
Mounting torque with screw M3  
Mounting torque with screw M3.5  
0.45/4 Nm/lb.in.  
0.55/5 Nm/lb.in.  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Features  
l
Moderate frequency IGBT and anti-  
parallel FRED in one package  
TM  
New generation HDMOS process  
Weight  
4
g
l
l
International standard package  
JEDEC TO-220AB and TO-263AA  
High peak current handling capability  
l
Symbol  
TestConditions  
Characteristic Values  
(T = 25°C, unless otherwise specified)  
Applications  
J
min. typ. max.  
l
PFC circuit  
AC motor speed control  
DC servo and robot drives  
Switch-mode and resonant-mode  
power supplies  
l
BVCES  
VGE(th)  
I
= 250 µA, V = 0 V  
600  
2.5  
V
V
C
GE  
l
I
= 250 µA, V = V  
5.0  
l
C
GE  
GE  
ICES  
V
V
= 0.8 V  
= 0 V  
T = 25°C  
200 µA  
1.5 mA  
CE  
CES  
J
T = 125°C  
GE  
J
IGES  
V
= 0 V, V = ±20 V  
±100 nA  
CE  
GE  
VCE(sat)  
I
= I , V = 15 V  
2.1  
V
C
CE90  
GE  
© 1999 IXYS All rights reserved  
98601 (3/99)  
IXGA 12N60BD1  
IXGP 12N60BD1  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(T = 25°C, unless otherwise specified)  
TO-220 AB Outline  
J
min. typ. max.  
I
= I ; V = 10 V,  
5
11  
S
C
C90  
CE  
Pulse test, t 300 µs, duty cycle 2 %  
Cies  
Coes  
Cres  
860  
100  
15  
pF  
pF  
pF  
V
= 25 V, V = 0 V, f = 1 MHz  
GE  
CE  
Qg  
32  
10  
10  
nC  
nC  
nC  
Pins:  
1 - Gate  
Qge  
Qgc  
I = I , V = 15 V, V = 0.5 V  
C C90 GE CE CES  
2 - Collector 3 - Emitter  
4 - Collector Bottom Side  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
td(on)  
tri  
td(off)  
tfi  
20  
ns  
ns  
ns  
ns  
Inductive load, TJ = 25°C  
A
B
12.70 13.97 0.500 0.550  
14.73 16.00 0.580 0.630  
20  
I = I , V = 15 V, L = 300 µH  
C
C90  
GE  
V
= 0.8 V , R = R = 18 Ω  
C
D
9.91 10.66 0.390 0.420  
4.08 0.139 0.161  
CE  
CES  
G
off  
150 250  
120 270  
3.54  
Remarks: Switching times may increase  
for V (Clamp) > 0.8 V , higher T or  
increased R  
E
F
5.85  
2.54  
6.85 0.230 0.270  
3.18 0.100 0.125  
CE  
CES  
J
Eoff  
0.5  
0.8 mJ  
G
H
1.15  
2.79  
1.65 0.045 0.065  
5.84 0.110 0.230  
G
td(on)  
tri  
20  
20  
ns  
ns  
J
0.64  
2.54  
1.01 0.025 0.040  
BSC  
Inductive load, TJ = 125°C  
K
BSC 0.100  
I = I , V = 15 V, L = 300 µH  
M
N
4.32  
1.14  
4.82 0.170 0.190  
1.39 0.045 0.055  
C
C90  
GE  
Eon  
td(off)  
tfi  
0.15  
200  
200  
0.8  
mJ  
ns  
V
= 0.8 V , R = R = 18 Ω  
CE  
CES  
G
off  
Q
R
0.35  
2.29  
0.56 0.014 0.022  
2.79 0.090 0.110  
Remarks: Switching times may increase  
for V (Clamp) > 0.8 V , higher T or  
increased R  
ns  
CE  
CES  
J
Eoff  
mJ  
TO-263 AA Outline  
G
RthJC  
RthCK  
IGBT  
1.25 K/W  
K/W  
0.25  
ReverseDiode(FRED)  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Symbol  
VF  
TestConditions  
min. typ. max.  
IF = 15A; TVJ = 150°C  
1.3  
2
V
V
TVJ  
=
25°C  
2.5  
2.5  
IRM  
VR = 100 V; IF =25A; -diF/dt = 100 A/µs  
L < 0.05 µH; TVJ = 100°C  
A
1. Gate  
2. Collector  
3. Emitter  
4. Collector  
BottonSide  
trr  
IF = 1 A; -di/dt = 50 A/µs;  
VR = 30 V TJ = 25°C  
35  
ns  
Dim.  
Millimeter  
Inches  
Min.  
Max.  
Min.  
Max.  
RthJC  
Diode  
1.6 K/W  
A
4.06  
2.03  
4.83  
2.79  
.160  
.080  
.190  
.110  
A1  
b
0.51  
1.14  
0.99  
1.40  
.020  
.045  
.039  
.055  
b2  
Min.RecommendedFootprint  
(Dimensions in inches and mm)  
c
0.46  
1.14  
0.74  
1.40  
.018.029  
.045  
c2  
.055  
D
8.64  
7.11  
9.65  
8.13  
.340  
.280  
.380  
.320  
D1  
E
9.65  
6.86  
2.54  
10.29  
8.13  
.380  
.270  
.405  
.320  
E1  
e
BSC  
.100  
BSC  
L
14.61  
2.29  
1.02  
1.27  
0
15.88  
2.79  
.575  
.090  
.040  
.625  
.110  
.055  
L1  
L2  
L3  
L4  
1.40  
1.78.050  
0.380  
.070  
.015  
.018.029  
R
0.46  
0.74  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106  
4,850,072 4,931,844  
5,017,508  
5,034,796  
5,049,961 5,187,117 5,486,715  
5,063,307 5,237,481 5,381,025  

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