LDA211S [IXYS]

Dual Optocouplers, Unidirectional Input Darlington-Transistor Output; 双通道光电耦合器，单向输入达林顿晶体管输出


型号：	LDA211S
厂家：	IXYS CORPORATION
描述：	Dual Optocouplers, Unidirectional Input Darlington-Transistor Output 双通道光电耦合器，单向输入达林顿晶体管输出晶体光电晶体管达林顿晶体管
文件：	总6页 (文件大小：118K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LDA211

Dual Optocouplers, Unidirectional Input

Darlington-Transistor Output

INTEGRATED

CIRCUITS

DIVISION

Description

Parameter

Breakdown Voltage - BV_CEO

Rating

Units

V_P

LDA211 is a dual unidirectional-input optocoupler

with Darlington-transistor outputs. The LDA211 has a

minimum current transfer ratio (CTR) of 300% with a

typical value of 8500%.

Current Transfer Ratio -

CTR (typical)

8500

Saturation Voltage - V_CE(sat)

Input Control Current - I_F

Approvals

Features

• 100mA Continuous Load Rating

• 3750V_rmsInput/Output Isolation

• Unidirectional Input

• UL Recognized Component: File E76270

• CSA Certified Component: Certificate 1175739

• EN/IEC 60950-1 Certified Component:

TUV Certificate B 09 07 49410 006

• Small 8-Pin Package, Thru-Hole or Surface Mount

• Machine Insertable, Wave Solderable

• Surface Mount Tape & Reel Packaging Available

Ordering Information

Part Number

LDA211

Description

8-Pin DIP (50/tube)

Applications

• Telecom Switching

• Tip/Ring Circuits

• Modem Switching (Laptop, Notebook, Pocket Size)

• Loop Detect

LDA211S

8-Pin Surface Mount (50/tube)

8-Pin Surface Mount (1000/Reel)

LDA211STR

• Ringing Detect

• Current Sensing

Pin Configuration

e₃

DS-LDA211-R05

www.ixysic.com

LDA211

INTEGRATED

CIRCUITS

DIVISION

Absolute Maximum Ratings @ 25ºC

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Parameter

Ratings

Units

V_P

Breakdown Voltage

Reverse Input Voltage

Input Control Current

Peak (10ms)

100

Power Dissipation

Input Power Dissipation ¹

Phototransistor ²

150

Isolation Voltage, Input to Output

Operational Temperature

Storage Temperature

3750

V_rms

°C

-40 to +85

-40 to +125

°C

Derate linearly 1.33mW / °C

Derate linearly 2mW / °C

Electrical Characteristics @ 25ºC

Parameter

Conditions

Symbol Min

Typ

Max

Units

Output Characteristics

Phototransistor Breakdown Voltage

Phototransistor Dark Current

Saturation Voltage

I_C= 100µA

BV_CEO

I_CEO

500

V_CEO= 5V, I_F= 0mA

I_C= 3mA, I_F= 1mA

I_F= 1mA, V_CE= 2V

50V, f =1MHz

V_CE(sat)

CTR

300

Current Transfer Ratio

8500

30000

Output Capacitance

C_OUT

Input Characteristics

Input Control Current

I_C= 3mA, V_CE= 2V

I_F= 5mA

I_F

V_F

I_R

0.9

0.07

1.2

Input Voltage Drop

1.4

Reverse Input Current

V_R= 5V

µA

Common Characteristics

Capacitance, Input to Output

C_I/O

Switching Characteristics @ 25ºC

Characteristic

Turn-On Time

Symbol

Test Condition

Typ

Units

t_on

V_CC=5V, I_F=1mA, R_L=500

s

Turn-Off Time

t_off

345

Switching Time Test Circuit

I_F

Pulse Width=5ms

Duty Cycle=1%

V_CC

R_L

I_F

V_CE

90%

10%

t_on

t_off

R05

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LDA211

INTEGRATED

CIRCUITS

DIVISION

PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

LED Voltage vs. Current

LED Voltage vs. Current (Log)

LED Forward Voltage vs.Temperature

1.6

1.5

1.4

1.3

1.2

1.1

1.0

100

I_F=50mA

I_F=20mA

I_F=10mA

I_F=5mA

I_F=2mA

I_F=1mA

0.1

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.0

1.1

1.2

1.3

1.4

1.5

1.6

-40

-20

100

LED Forward Voltage (V)

Temperature (ºC)

LED Forward Voltage (V)

Typical CTR vs. LED Forward Current

(V_CE=5V)

Typical Collector Current

vs. Collector Voltage

I_CECurrent vs.Temperature

(V_CE=5V)

250

200

150

100

20000

15000

10000

5000

250

200

150

100

I_F=10mA

I_F=20mA

I_F=10mA

I_F=5mA

-40ºC

25ºC

85ºC

I_F=5mA

I_F=2mA

I_F=1mA

I_F=0.2mA

I_F=0.1mA

I_F=2mA

I_F=0.5mA

I_F=1mA

I_F=0.5mA

-40

-20

100

LED Forward Current (mA)

Collector Voltage V_CE(V)

Temperature (ºC)

V_CE(sat)vs.Temperature

(I_F=1mA, I_C=3mA)

Leakage Current vs.Temperature

0.95

0.90

0.85

0.80

0.75

0.70

1400

1200

1000

800

600

400

200

V_CC=10V

V_CC=5V

V_CC=3V

-40

-20

100

-40

-20

100

Temperature (ºC)

Turn-On Time vs. Load Resistance

(I_F=1mA, V_CC=5V)

Turn-Off Time vs. Load Resistance

(I_F=1mA, V_CC=5V)

15000

10000

5000

8.0

7.9

7.8

7.7

7.6

7.5

7.4

7.3

7.2

7.1

7.0

6.9

6.8

1x10²

1x10³

1x10⁴

1x10⁵

1x10²

1x10³

1x10⁴

1x10⁵

Load Resistance (:)

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁcations, please

contact our application department.

R05

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LDA211

INTEGRATED

CIRCUITS

DIVISION

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Rating

LDA211 / LDA211S

MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device

MaximumTemperature xTime

LDA211 / LDA211S

250ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to

remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as

an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary

if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.

Cleaning methods that employ ultrasonic energy should not be used.

e₃

R05

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LDA211

INTEGRATED

CIRCUITS

DIVISION

Mechanical Dimensions

LDA211

9.652 0.381

(0.380 0.015)

PCB Hole Pattern

7.620 0.254

(0.300 0.010)

2.540 0.127

(0.100 0.005)

8-0.800 DIA.

2.540 0.127

(0.100 0.005)

(8-0.031 DIA.)

9.144 0.508

(0.360 0.020)

6.350 0.127

(0.250 0.005)

6.350 0.127

(0.250 0.005)

3.302 0.051

Pin 1

0.457 0.076

(0.018 0.003)

(0.130 0.002)

7.620 0.127

(0.300 0.005)

7.239 TYP.

(0.285)

7.620 0.127

(0.300 0.005)

4.064 TYP

(0.160)

0.254 0.0127

(0.010 0.0005)

Dimensions

0.813 0.102

(0.032 0.004)

(inches)

LDA211S

9.652 0.381

(0.380 0.015)

PCB Land Pattern

0.635 0.127

(0.025 0.005)

2.540 0.127

(0.100 0.005)

3.302 0.051

(0.130 0.002)

2.54

(0.10)

9.525 0.254

(0.375 0.010)

6.350 0.127

(0.250 0.005)

8.90

(0.3503)

1.65

(0.0649)

7.620 0.254

(0.300 0.010)

Pin 1

0.457 0.076

(0.018 0.003)

0.254 0.0127

(0.010 0.0005)

0.65

(0.0255)

4.445 0.127

(0.175 0.005)

Dimensions

(inches)

0.813 0.102

(0.032 0.004)

R05

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LDA211

INTEGRATED

CIRCUITS

DIVISION

LDA211STR Tape & Reel

330.2 DIA.

(13.00 DIA.)

W=16.00

(0.63)

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

Bo=10.30

(0.406)

Ao=10.30

(0.406)

P=12.00

(0.472)

K₀=4.90

(0.193)

K₁=4.20

(0.165)

User Direction of Feed

Dimensions

Embossed Carrier

(inches)

NOTES:

1. Dimensions carry tolerances of EIA Standard 481-2

Embossment

2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to

its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-LDA211-R05

12/22/2012

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