LDA212S [IXYS]
Dual Optocouplers, Bidirectional Input Darlington-Transistor Output; 双通道光电耦合器,双向输入达林顿晶体管输出型号: | LDA212S |
厂家: | IXYS CORPORATION |
描述: | Dual Optocouplers, Bidirectional Input Darlington-Transistor Output |
文件: | 总6页 (文件大小:118K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LDA212
Dual Optocouplers, Bidirectional Input
Darlington-Transistor Output
INTEGRATED
CIRCUITS
DIVISION
Description
Parameter
Breakdown Voltage - BVCEO
Rating
30
Units
VP
LDA212 is a dual bidirectional-input optocoupler with
Darlington-transistor outputs. The LDA212 has a
minimum current transfer ratio (CTR) of 300% with a
typical value of 8500%.
Current Transfer Ratio
CTR (Typical)
8500
%
Saturation Voltage - VCE (sat)
Input Control Current - IF
1
1
V
mA
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Features
• 100mA Continuous Load Rating
• 3750Vrms Input/Output Isolation
• Bidirectional Input
• Small 8-Pin Package, Thru-Hole or Surface Mount
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Packaging Available
Ordering Information
Part Number
LDA212
Description
8-Pin DIP (50/tube)
Applications
• Telecom Switching
LDA212S
8-Pin Surface Mount (50/tube)
8-Pin Surface Mount (1000/Reel)
LDA212STR
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Loop Detect
• Ringing Detect
Pin Configuration
• Current Sensing
8
7
6
5
1
C
A/K
2
K/A
E
C
3
A/K
4
E
K/A
Pb
e3
DS-LDA212-R05
1
www.ixysic.com
LDA212
INTEGRATED
CIRCUITS
DIVISION
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter
Ratings
Units
Breakdown Voltage
Input Control Current
Peak (10ms)
30
100
1
VP
mA
A
Power Dissipation
Input Power Dissipation 1
Phototransistor 2
150
150
mW
mW
Vrms
°C
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
3750
-40 to +85
-40 to +125
°C
1
Derate linearly 1.33mW / ºC
2
Derate linearly 2mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Conditions
Symbol Min
Typ
Max
Units
Output Characteristics
Phototransistor Breakdown Voltage
Phototransistor Dark Current
Saturation Voltage
IC = 100µA
BVCEO
ICEO
30
50
50
-
-
500
1
V
nA
V
VCEO = 5V, IF = 0mA
IC = 3mA, IF = 1mA
IF = 1mA, VCE = 2V
50V, f =1MHz
-
VCE(sat)
CTR
-
300
-
Current Transfer Ratio
8500
3
30000
-
%
pF
Output Capacitance
COUT
Input Characteristics
Input Control Current
IC = 3mA, VCE = 2V
IF = 5mA
IF
-
0.07
1.2
1
mA
V
Input Voltage Drop
VF
0.9
1.4
Common Characteristics
Capacitance, Input to Output
-
CI/O
-
3
-
pF
Switching Characteristics @ 25ºC
Characteristic
Turn-On Time
Symbol
Test Condition
Typ
8
Units
ton
VCC=5V, IF=1mA, RL=500
s
Turn-Off Time
toff
345
Switching Time Test Circuit
IF
VCC
RL
IF
VCE
VCE
Pulse Width=5ms
Duty Cycle=1%
90%
10%
ton
toff
R05
2
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LDA212
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Voltage vs. Current
LED Voltage vs. Current (Log)
LED Forward Voltage vs.Temperature
1.6
1.5
1.4
1.3
1.2
1.1
1.0
50
40
30
20
10
0
100
10
1
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
IF=1mA
0.1
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.0
1.1
1.2
1.3
1.4
1.5
1.6
-40
-20
0
20
40
60
80
100
LED Forward Voltage (V)
Temperature (ºC)
LED Forward Voltage (V)
Typical Collector Current
vs. Collector Voltage
ICE Current vs.Temperature
(VCE=5V)
Typical CTR vs. LED Forward Current
(VCE=5V)
250
200
150
100
50
20000
15000
10000
5000
0
0.25
0.20
0.15
0.10
0.05
0.00
IF=10mA
IF=20mA
IF=10mA
IF=5mA
-40ºC
25ºC
85ºC
IF=5mA
IF=2mA
IF=1mA
IF=0.2mA
IF=0.1mA
IF=2mA
IF=0.5mA
IF=1mA
IF=0.5mA
0
-40
0
2
4
6
8
10
0
1
2
3
4
5
6
-20
0
20
40
60
80
100
LED Forward Current (mA)
Collector Voltage VCE (V)
Temperature (ºC)
VCE(sat) vs.Temperature
(IF=1mA, IC=3mA)
Leakage Current vs.Temperature
0.95
0.90
0.85
0.80
0.75
0.70
1400
1200
1000
800
600
400
200
0
VCC=10V
VCC=5V
VCC=3V
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Turn-On Time vs. Load Resistance
(IF=1mA, VCC=5V)
Turn-Off Time vs. Load Resistance
(IF=1mA, VCC=5V)
15000
10000
5000
0
8.0
7.9
7.8
7.7
7.6
7.5
7.4
7.3
7.2
7.1
7.0
6.9
6.8
1x102
1x103
1x104
1x105
1x102
1x103
1x104
1x105
Load Resistance (:)
Load Resistance (:)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
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3
LDA212
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LDA212 / LDA212S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
MaximumTemperature xTime
LDA212 / LDA212S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e3
R05
4
www.ixysic.com
LDA212
INTEGRATED
CIRCUITS
DIVISION
Mechanical Dimensions
LDA212
9.652 0.381
(0.380 0.015)
PCB Hole Pattern
7.620 0.254
(0.300 0.010)
2.540 0.127
(0.100 0.005)
8-0.800 DIA.
2.540 0.127
(0.100 0.005)
(8-0.031 DIA.)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
6.350 0.127
(0.250 0.005)
3.302 0.051
Pin 1
0.457 0.076
(0.018 0.003)
(0.130 0.002)
7.620 0.127
(0.300 0.005)
7.239 TYP.
(0.285)
7.620 0.127
(0.300 0.005)
4.064 TYP
(0.160)
0.254 0.0127
(0.010 0.0005)
Dimensions
0.813 0.102
mm
(0.032 0.004)
(inches)
LDA212S
9.652 0.381
(0.380 0.015)
PCB Land Pattern
0.635 0.127
(0.025 0.005)
2.540 0.127
(0.100 0.005)
3.302 0.051
(0.130 0.002)
2.54
(0.10)
9.525 0.254
(0.375 0.010)
6.350 0.127
(0.250 0.005)
8.90
(0.3503)
1.65
(0.0649)
7.620 0.254
(0.300 0.010)
Pin 1
0.457 0.076
(0.018 0.003)
0.254 0.0127
(0.010 0.0005)
0.65
(0.0255)
4.445 0.127
(0.175 0.005)
Dimensions
mm
(inches)
0.813 0.102
(0.032 0.004)
R05
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5
LDA212
INTEGRATED
CIRCUITS
DIVISION
LDA212STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16.00
(0.63)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
K0=4.90
(0.193)
K1=4.20
(0.165)
User Direction of Feed
Dimensions
mm
Embossed Carrier
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
Embossment
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LDA212-R05
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
6
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