MDD172-12N1 [IXYS]

High Power Diode Modules; 大功率二极管模块
MDD172-12N1
型号: MDD172-12N1
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

High Power Diode Modules
大功率二极管模块

二极管 局域网
文件: 总3页 (文件大小:131K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MDD 172  
IFRMS = 2x 300 A  
IFAVM = 2x 190 A  
VRRM = 800-1800 V  
High Power  
Diode Modules  
3
2
3
1
2
1
VRSM  
V V  
VRRM  
Type  
900  
800  
MDD 172-08N1  
MDD 172-12N1  
MDD 172-14N1  
MDD 172-16N1  
MDD 172-18N1  
1300  
1500  
1700  
1900  
1200  
1400  
1600  
1800  
Symbol  
Test Conditions  
Maximum Ratings  
Features  
International standard package  
Direct copper bonded Al2O3 -ceramic  
IFRMS  
IFAVM  
TVJ = TVJM  
TC = 100°C; 180° sine  
300  
190  
A
A
base plate  
Planar passivated chips  
Isolation voltage 3600 V~  
UL registered, E 72873  
IFSM  
TVJ = 45°C;  
VR = 0  
t = 10 ms (50 Hz), sine  
t = 8.3 ms (60 Hz), sine  
6600  
7290  
A
A
TVJ = TVJM  
VR = 0  
t = 10 ms (50 Hz), sine  
t = 8.3 ms (60 Hz), sine  
5600  
6200  
A
A
òi2dt  
TVJ = 45°C  
VR = 0  
t = 10 ms (50 Hz), sine  
t = 8.3 ms (60 Hz), sine  
218 000  
221 000  
A2s  
Applications  
A2s  
Supplies for DC power equipment  
DC supply for PWM inverter  
Field supply for DC motors  
Battery DC power supplies  
TVJ = TVJM  
VR = 0  
t = 10 ms (50 Hz), sine  
t = 8.3 ms (60 Hz), sine  
157 000  
160 000  
A2s  
A2s  
TVJ  
TVJM  
Tstg  
-40...+150  
150  
-40...+125  
°C  
°C  
°C  
Advantages  
Space and weight savings  
Simple mounting  
Improved temperature and power  
VISOL  
50/60 Hz, RMS  
t = 1 min  
t = 1 s  
3000  
3600  
V~  
V~  
IISOL £ 1 mA  
cycling  
Reduced protection circuits  
Md  
Mounting torque (M6)  
Terminal connection torque (M6)  
2.25-2.75/20-25 Nm/lb.in.  
4.5-5.5/40-48 Nm/lb.in.  
Weight  
Typical including screws  
120  
g
Dimensions in mm (1 mm = 0.0394")  
Symbol  
IR  
Test Conditions  
Characteristic Values  
TVJ = TVJM; VR = VRRM  
20 mA  
VF  
IF = 300 A; TVJ = 25°C  
1.15  
0.8  
0.8 mW  
V
V
VT0  
rT  
For power-loss calculations only  
TVJ = TVJM  
QS  
IRM  
TVJ = 125°C; IF = 300 A, -di/dt = 50 A/ms  
550  
235  
mC  
A
RthJC  
per diode; DC current  
per module  
per diode; DC current  
per module  
0.21 K/W  
0.105 K/W  
0.31 K/W  
0.155 K/W  
other values  
see Fig. 6/7  
RthJK  
dS  
dA  
a
Creepage distance on surface  
Strike distance through air  
Maximum allowable acceleration  
12.7 mm  
9.6 mm  
50 m/s2  
Data according to IEC 60747 and refer to a single diode unless otherwise stated.  
IXYS reserves the right to change limits, test conditions and dimensions  
© 2000 IXYS All rights reserved  
1 - 3  
MDD 172  
t  
© 2000 IXYS All rights reserved  
2 - 3  
MDD 172  
Fig. 5 Three phase rectifier bridge:  
Power dissipation versus direct  
output current and ambient  
temperature  
Fig. 6 Transient thermal impedance  
junction to case (per diode)  
RthJC for various conduction angles d:  
d
RthJC (K/W)  
DC  
180°  
120°  
60°  
0.210  
0.223  
0.233  
0.260  
0.295  
30°  
Constants for ZthJC calculation:  
i
Rthi (K/W)  
ti (s)  
1
2
3
0.0087  
0.0163  
0.185  
0.001  
0.065  
0.4  
Fig. 7 Transient thermal impedance  
junction toheatsink(per diode)  
RthJK for various conduction angles d:  
d
RthJK (K/W)  
DC  
180°  
120°  
60°  
0.31  
0.323  
0.333  
0.360  
0.395  
30°  
Constants for ZthJK calculation:  
i
Rthi (K/W)  
ti (s)  
1
2
3
4
0.0087  
0.0163  
0.185  
0.1  
0.001  
0.065  
0.4  
1.29  
© 2000 IXYS All rights reserved  
3 - 3  

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