MX881R [IXYS]

LED Driver, PDSO16, 3 X 5 MM, DFN-16;
MX881R
型号: MX881R
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

LED Driver, PDSO16, 3 X 5 MM, DFN-16

驱动 光电二极管 接口集成电路
文件: 总13页 (文件大小:296K)
中文:  中文翻译
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MX881  
IXYS  
Xenon Flash Controller & LED Torch Driver  
Features:  
General Description  
The MX881 offers a highly integrated Xenon Flash  
controller, providing an ideal solution for small form  
Highly Integrated Solution that includes:  
Optimized Flyback Boost Converter  
Controller, IGBT Driver, 100mA LED Torch  
Driver, and Transformer Drive Transistor  
Small Size (3mm x 5mm DFN-16)  
High Efficiency  
3.0 to 5.5 Volt Battery Operation  
1.65 to 5.5 Volt Digital Interface Operation  
Low Shut Down Current: 0.1µA  
SPI and I2C Bus Compatibility  
factor flash and torch lighting applications. The  
MX881 integrates a user programmable Controller,  
IGBT Driver, 100mA LED Torch Driver, and  
Transformer Drive Transistor to significantly reduce  
component count, solution size, and design  
complexity.  
The Boost Control Logic manages the peak primary  
current and off time to optimize charge time and  
control average battery current.  
Programmable Average Battery Current:  
(50mA – 220mA)  
The Charge Cycle Control starts the charge cycle on  
a low to high transition of the CHARGE input. Then  
detects when the output voltage has reached the  
desired voltage and stops the Boost Control Logic,  
while asserting the DONE output signal.  
The SPI/I2C serial interface adds the flexibility of 6  
programmable average battery currents and 4  
programmable high voltage output levels for the  
flash function.  
Programmable Output Voltage: (300V - 330V)  
Applications:  
Camera Cell Phones, Digital Still Cameras, and  
Optical Film Cameras  
Ordering Information  
Qty  
73  
Part No.  
MX881R  
Description  
3mm X 5mm DFN-16  
MX881RTR DFN-16 Tape & Reel  
2000  
Typical Application  
VHV  
T1  
500V Total  
Switching  
Diodes  
+
1:10 min.  
MX881  
CONTROLLER / DRIVER  
22 uF  
L
SEC  
SW  
VCC  
VCC  
TRIGGER  
CAPACITOR  
FLASH  
TUBE  
Boost Control  
Logic  
I
PEAK  
DVCC  
DVCC  
VFB  
CHARGE  
Charge  
Cycle Logic  
DONE  
VOUT  
V
BATT  
IGBTGATE  
IXYS  
IGBT  
FLASH  
IGBT  
DRIVER  
SPI / I2C  
Interface to  
set VOUT  
& IAVE  
SPI / I2C  
X 4  
ISET  
LED  
LED_EN  
Bandgap  
REF  
GND  
MX881  
Drawing No. 088109  
1
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
Boost Switch: When turned on, current flows in the primary of the flyback transformer. The energy  
stored in the transformer is transferred to the secondary as high voltage when the boost switch is turned  
off.  
IGBT Driver: Switches the VCC supply to the IGBT gate when the FLASH signal is brought high. If  
FLASH is low, the IGBT gate is driven to ground.  
LED Driver: When LED_EN is high, the LED pin will sink 100mA to GND. If LED_EN is low, the LED  
pin is high impedance.  
Pin Description  
Pin No.  
Pin Name Description  
VCC  
Supply voltage from battery, (3.0V – 5.5V). Must be connected to VDVCC.  
11  
7
DVCC  
Digital supply voltage for I/O logic (1.65V-5.5V)  
Low level stops the charging cycle and puts the device into power down mode.  
Charge remains on the high voltage capacitor. A high level starts a charging cycle.  
Charging continues until either the correct voltage is reached or CHARGE is brought  
low.  
CHARGE  
15  
Open drain output that transitions high when the capacitor reaches the desired  
voltage. This output is normally high except when charging so that standby current is  
minimized. (Pull-up resistor not sourcing current).  
Feedback voltage input from voltage divider that determines when the output has  
reached the desired voltage.  
DONE  
VFB  
6
12  
A high level will cause the IGBT to turn on firing the flash. A low level will turn the  
IGBT off. FLASH can be brought low to shorten the flash pulse for red-eye reduction.  
High level enables the I2C interface, low level enables SPI interface.  
FLASH  
ISEL  
14  
16  
Serial port chip enable. A low on this pin enables the SPI interface to receive data. If  
SCEn is asserted low while in the I2C mode, the serial interface and control register  
are reset.  
SCEn  
1
SCLK  
Clock input for SPI and I2C interface.  
4
2
Data input and output for SPI interface. Data input and acknowledge/data output for  
I2C interface. This output is open drain for I2C output data.  
SDATA  
Connection to internal power transistor that drives the negative terminal of the  
transformer primary coil.  
SW  
3
Connection to negative terminal of the transformer secondary. This input is grounded  
internally through a low impedance used to sense the secondary transformer current.  
LSEC  
13  
9
IGBTGATE IGBT Gate driver output.  
A high level will cause the 100mA LED current regulator to turn on.  
VF = VBATT  
100mA LED current regulator. Connect the cathode of the torch LED to this pin.  
VF = VBATT  
LED_EN  
LED  
5
10  
Exposed  
Pad  
GND  
N/C  
Ground Terminal.  
No Connect. Do not connect to any signal, ground or power source.  
8
MX881  
Drawing No. 088109  
2
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
Absolute Maximum Ratings  
Symbol  
VCC, DVCC  
VIN  
VSW  
TSTG  
Parameter  
Rating  
0.3 to 7.0  
-0.3 to VCC+0.3  
-0.3 to 55  
-40 to +150  
Unit  
V
V
DC Supply Voltage  
DC Input Voltage  
Voltage On SW pad  
Storage Temperature  
V
oC  
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device.  
These are stress ratings only and functional operation of the device at these or any other conditions beyond  
those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-  
rated conditions for extended periods may affect device reliability.  
Recommended Operating Conditions  
Symbol  
VCC  
DVCC  
VIN  
VSW  
TJ  
Parameter  
Rating  
3 to 5.5  
1.65 to 5.5  
0 to DVCC  
0 to 40  
Unit  
V
V
Analog and Digital Supply Voltage  
Digital I/O Supply Voltage  
DC Input Voltage  
Voltage On SW pad  
Junction Temperature  
V
V
-20 to +115  
oC  
MX881  
3
7/30/07  
Drawing No. 088109  
www.claremicronix.com  
MX881  
IXYS  
DC Characteristics  
Junction temperature range -20 to +115°C  
Symbol Parameter  
Condition  
Min  
3
Typ  
3.6  
3.3  
Max  
Unit  
Supply Voltage – Analog and  
voltage doubler  
AVCC  
5.5  
V
DVCC  
ICC  
Supply Voltage – Digital I/O  
Supply Current (When Charging)  
1.65  
5.5  
4
V
mA  
µA  
nA  
@ 25° C  
ISTANDBY Supply Current (Not Charging)  
ISW_LEAK SW pin Leakage Current  
0.1  
30  
@ 25° C Vsw = 40V  
Schmitt trigger, positive-going  
threshold (All digital inputs)  
1.65V < DVCC < 2.4V  
VT+  
1.3  
1.6  
2.1  
V
Schmitt trigger, negative-going  
threshold (All digital inputs)  
1.65V < DVCC < 2.4V  
1.65V < DVCC < 2.4V  
2.4V < DVCC < 3.6V  
VT-  
0.4  
0.15  
V
V
Vhys  
VT+  
Hysteresis, Schmitt trigger  
Schmitt trigger, positive-going  
threshold (All digital inputs)  
Schmitt trigger, negative-going  
threshold (All digital inputs)  
Hysteresis, Schmitt trigger  
Schmitt trigger, positive-going  
threshold (All digital inputs)  
Schmitt trigger, negative-going  
threshold (All digital inputs)  
Hysteresis, Schmitt trigger  
Input Current  
Output Low Voltage  
Output High Voltage  
SW Switch on resistance  
SW Switch on resistance  
LED drive current  
V
2.4V < DVCC < 3.6V  
2.4V < DVCC < 3.6V  
3.6 < DVCC <5.5V  
VT-  
0.65  
0.16  
V
V
Vhys  
VT+  
V
3.6V < DVCC <5.5V  
VT-  
0.9  
0.17  
-10  
V
V
µA  
V
V
3.6V < DVCC <5.5V  
VIN = DVCC or GND  
2K to DVCC  
Vhys  
IIN  
10  
0.15  
VOL  
VOH  
RSW  
RSW  
ILED  
IPEAK  
2K to Ground  
DVCC-0.3  
DVCC = 3.0V  
.15  
.19  
85  
.25  
.25  
100  
.7  
.50  
.32  
115  
DVCC=3.0V, @ 25°C  
VLED > 0.5V  
mA  
A
Primary Peak Current  
OVS = 11  
OVS = 10  
OVS = 01  
OVS = 00  
1.20  
1.16  
1.12  
1.10  
1.23  
1.19  
1.15  
1.12  
1.26  
1.22  
1.18  
1.14  
V
V
V
V
VTRIP  
Output Voltage Trip Point  
MX881  
4
7/30/07  
Drawing No. 088109  
www.claremicronix.com  
MX881  
IXYS  
AC Characteristics  
Junction temperature range 0 to + 115°C  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Unit  
CHARGE High to Beginning of  
Charge Cycle  
TSTART  
110  
µS  
CHARGE Low to End of Charge  
Cycle  
TEND  
100  
100  
100  
nS  
nS  
nS  
CL = 6.8nF, 10% to  
90%  
CL = 6.8nF, 90% to  
10%  
TIGBT-ON  
TIGBT-OFF  
FLASH High to IGBTGATE High  
FLASH Low to IGBTGATE Low  
TLED-ON  
TLED-OFF  
LED_EN High to Iout > 90mA  
LED_EN Low to Iout < 1mA  
TBD  
TBD  
µS  
µS  
Control Register  
The MX881 control register is a 5 bit register that allows the user to program the maximum output  
voltage and the maximum average battery current during the charge cycle. Table1 shows how the bits in  
the control register are assigned. ABC(2:0) are used to set the average battery current and OVS(1:0) are  
used to set the output voltage selection reference.  
Table 1 – Control Register  
BIT:  
D4  
D3  
D2  
D1  
D0  
Control:  
OVS1  
OVS0  
ABC2  
ABC1  
ABC0  
Output Voltage Selection  
The MX881 limits the high voltage placed on the external capacitor by comparing a divided down version  
of the secondary flyback voltage to an internal voltage. This internal voltage is programmable to 4  
discrete values to allow the user to change the flash energy. The external voltage divider ratio needed to  
obtain 330V maximum output voltage should be 269 to 1. This external resistor divider network is also  
used to form a low pass filter with an internal capacitor so it is important that the equivalent resistance of  
the voltage divider network be 3K ohms. Table 2 shows the internal reference values used for possible  
values of the capacitor charge voltage. The default value is 11.  
Table 2 - Output Voltage Selection  
OVS Value (Binary) Reference Voltage (VTRIP  
)
Capacitor Voltage  
11  
10  
01  
00  
1.23  
1.19  
1.15  
1.12  
330  
320  
310  
300  
MX881  
5
7/30/07  
Drawing No. 088109  
www.claremicronix.com  
MX881  
IXYS  
Average Battery Current  
The 3 bits (ABC2 – ABC0) of the control register are used to program the maximum average battery  
current during a charge cycle. The MX881 does this by limiting the minimum off time during a switching  
cycle. The off time compensates for variation of the battery voltage so that the average current is  
independent of battery voltage. The default value of ABC is 101. With the default value of ABC, the  
average battery current control circuits are disabled for maximum efficiency, and the maximum battery  
current is approximately 220mA. The average current versus the output voltage is shown in Figure1.  
The battery current peak value is preset internally to 0.7A. This current must be averaged by placing an  
external bypass capacitor from VCC to ground. A 10uF capacitor is recommended for good current  
smoothing and averaging.  
Figure 1 - Average Battery Current  
Average Battery Current Setting of 50mA (ABC = 000)  
60  
50  
40  
VCC = 3.0V  
30  
VCC = 5.5V  
20  
10  
0
0
100  
200  
300  
400  
V
MX881  
6
7/30/07  
Drawing No. 088109  
www.claremicronix.com  
MX881  
IXYS  
Average Battery Current Setting of 100mA (ABC = 001)  
140  
120  
100  
80  
VCC = 3.0V  
VCC = 5.5V  
60  
40  
20  
0
0
100  
200  
300  
400  
V
Average Battery Current Setting of 150mA (ABC = 010)  
200  
150  
100  
50  
VCC = 3.0V  
VCC = 5.5V  
0
0
100  
200  
300  
400  
V
MX881  
Drawing No. 088109  
7
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
Serial Interface  
The MX881 has a 4 wire serial interface that is capable of operating in two modes: I2C or SPI. Both  
modes transfer 8 bits of information but only 5 bits are actually used to set the internal control register.  
Table 3 - Interface Modes  
ISEL  
1
0
Active Interface  
Standard I2C slave only serial interface  
Standard 3-wire SPI  
I2C Bus Interface  
The I2C interface (follows the standard bus protocol and timing as defined by Philips). For complete  
information on this bus, refer to  
www.semiconductors.philips.com  
The MX881 acts as a slave device on the I2C bus and is compatible with both the HS (High Speed)  
Mode and Fast Mode formats. Its primary function is as a receiver, receiving data from a master device  
that is used to set a single 5 bit register that determines the average battery current and the output  
voltage. It will act as a transmitter after receiving a read command. During a read, the register data will  
be output onto the I2C bus. When receiving a non-broadcast message, the MX881 will respond with an  
acknowledge bit, in which it pulls the data bus low at the appropriate time. Data packets begin with the  
Master issuing a START command (S) and end with the Master issuing a STOP command (P). A Restart  
command is simply another START command that is issued before a STOP command. Note that with  
START and STOP commands that SDATA transitions while SCLK is high. Conversely, for all other bits,  
SDATA is only allowed to transition while SCLK is low.  
Figure 2 - I2C Sequences  
SDA TA  
TI2C-CP  
TI2C-CS  
TI2C-S C  
TI2C-DS  
TI2C-DH  
TI2C-P C  
SCLK  
DA TA is stable during high period  
of SCLK  
STA RT  
STOP  
Shaded boxes represent bits  
sourced by the MX889.  
Unshaded boxes represent bits  
sourced by the master .  
0
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
0
1
1
1
1
1
1
0
0
0
P
Write Sequence  
Overview  
Slave Address  
Data Byte - Written to control  
Register  
The slave address is internally  
fixed to 0111111 b.  
Status  
Read  
S
0
1
1
1
1
1
1
1
0
1
1
0
1
1
1
1
0
0
P
Sequence  
Slave Address  
Data Byte - Register contents  
placed on bus by MX889  
Slave address is 0111111b.  
MX881  
Drawing No. 088109  
8
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
To write to the MX881 register, the master device will first issue a Start Bit. It will then transmit a 7-bit  
address. In the MX881, the address is internally set to 0111111b. If the address in the message  
corresponds to the address of the MX881, the device will issue an acknowledge. The master will send 8  
bits of data. These 8 bits will be written into the control register. Another Acknowledge will follow. The  
write sequence is illustrated in Figure 2.  
To read the control register the master issues a read command by setting the R/Wn bit. The master will  
then tri-state the data bus while the MX881 outputs data. See the example in Figure 2.  
3-Wire SPI (Serial Peripheral Interface)  
A standard 3-wire bi-directional serial interface is available (Figure 3). The interface signals are the serial  
clock: SCLK, the serial data line: SDATA, and the serial chip enable: SCEn. SDATA is bidirectional.  
In write mode, the microcontroller is writing to the MX881 control register. Each packet sent contains an  
8-bit command followed by 8 bits of data to be written into the register.  
When SCEn goes low, the rising edge of SCLK clocks in 8 bits, MSB first. At the end of the first  
transmission byte, the MX881 determines whether the first byte is a recognized command. The MX881  
only recognizes one write command “00011110”. If the command is recognized, the next byte clocked  
into the MX881 will be written into the control register. This sequence is illustrated in Figure 3.  
In read mode, a command is received which tells the MX881 to output the control register contents. The  
MX881 only recognizes one read command: “01011110”. If the correct command is recognized, the  
MX881 will output 8 bits of data beginning on the first falling edge of SCLK after the rising edge of SCLK  
in which the last transmission bit was clocked in. In this manner, the first control register bit will be  
available to the microcontroller on the next rising edge of SCLK. SCEn must remain low while the  
MX881 is outputting data, going high after the MX881 has output the last bit. While the device is  
outputting data, the microcontroller must stop driving the SDATA line so that the MX881 can drive the  
data onto this bus. This sequence is also illustrated in Figure 3.  
Table 4 - Serial Interface Timing  
Symbol  
TCYCS  
THI, TLO  
TDS  
TDH  
TSS  
TSH  
TACCS  
TOHS  
TI2C_CS  
TI2C_SC  
TI2C_DS  
TI2C_DH  
TI2C_CP  
TI2C_PC  
Parameter  
Cycle Time  
Pulse Width  
Data Setup Time  
Condition  
Min  
250  
50  
50  
30  
Max  
Units  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
Data Hold Time  
SCEn Setup Time, Write  
SCEn Hold Time, Write  
Read Access Time  
Read Output Disable Time  
I2C Clock High to Start Bit  
I2C Start Bit to Clock Low  
I2C Data Valid to Clock High  
I2C Clock Low to Data Change  
I2C Clock High to Stop Bit  
I2C Stop Bit to Clock Low  
30  
30  
CL = 100pF  
CL = 100pF  
30  
30  
50  
50  
50  
30  
50  
50  
MX881  
Drawing No. 088109  
9
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
Figure 3 – 3-WIRE SPI  
SCEn  
SCLK  
SDATATo  
MX881  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
0
1
1
1
1
0
WriteCycle  
SCEn  
T
TF  
T
TSS  
R
THI  
TDH  
TCYCS  
SH  
SCLK  
SDATA  
TDS  
TLO  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
WriteCycleTiming  
SCEn  
SCLK  
SDATATo  
MX881  
0
1
0
1
1
1
1
0
SDATA  
From  
MX881  
Control  
Register  
D4  
D3  
D2  
D1  
D0  
ReadCycle  
SCEn  
SCLK  
TACCS  
TOHS  
SDATA  
D7  
D0  
ReadCycleTiming-Detailed  
.
MX881  
Drawing No. 088109  
10  
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
Layout Notes  
T1  
LDT565620ST-201  
7
D1  
BAV23S  
VPRI  
VCC  
6
8
5
4
1
1
2
VHV  
VSEC  
C1  
C2  
1.0uF 10uF  
R1  
C3  
133K, 1%  
22uF/350V  
R2  
137K, 1%  
U1  
SCEn  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
ISEL  
CHARGE  
FLASH  
SCEn  
ISEL  
SDATA  
SDATA  
SW  
CHARGE  
FLASH  
LSEC  
SCLK  
SCLK  
R3  
LED_EN  
DONE  
DVCC  
VFB  
LED_EN  
DONE  
DVCC  
PROG  
VFB  
1K, 1%  
VCC  
LED  
VCC  
LED  
IGBTGATE  
C4  
IGBTGATE  
.1uF  
MX881 16 PIN DFN  
C4  
.1uF  
R1  
R2  
R3  
C1  
C2  
VCC  
MX881  
Drawing No. 088109  
11  
7/30/07  
www.claremicronix.com  
MX881  
IXYS  
Layout Notes:  
Parasitic capacitance on node VSEC or VPRI will cause loss of efficiency. Keep wires on this  
node as short as possible.  
Parasitic inductance on the transformer connections can cause overshoot during switching that  
could damage the part. Keep connections from the capacitors and MX881 to the transformer  
short.  
Also keep the connection from pin 2 of D1 to C3 as short as possible.  
The VFB node is sensitive to coupling from T1 and the VSEC node. The VSEC node ramps to  
over 300 volts in just a few nano-seconds. Keep R1, R2, and R3 as far from T1 as possible. If  
possible, shield resistors by placing on the other side of the board from T1.  
VCC should be well bypassed to average charge current to the battery and reduce noise to  
analog circuits within MX881.  
VFB is a very fast and short pulse. Keep VFB connection to R7 short to minimize capacitance on  
this node. If VFB has too much capacitance, the feedback voltage may be filtered so that the  
output voltage does not stop at 330V but continues to a much higher voltage.  
A good ground plane is extremely important. Large pulse currents of 0.7 amps will be flowing in  
the ground. The large bottom pad of the MX881 is the only ground pad and requires a low  
impedance return to C1, C2, and R7.  
The ground plane must have adequate clearance from high voltage nodes VHV and VSEC to  
avoid arcing. Also, the node connecting R1 to R2 will be at approximately 170V.  
R1 and R2 must be at least 1206 size surface mount to withstand 200V each.  
Transformer  
For 330V charger, the transformer should have a turns ratio of approximately 10 to insure that the fly-  
back voltage on the primary side of the transformer does not damage the power switch internal to the  
MX881. The fly-back voltage should be equal to the output voltage divided by the turns ratio plus the  
VCC supply voltage. The fly-back voltage will be greater than this due to the energy stored in the  
transformer leakage inductance. The actual voltage will depend on the transformer leakage inductance  
and the parasitic capacitance of the circuits and layout.  
The MX881 is designed to work with a transformer having a primary inductance of approximately 10µH.  
Larger values are acceptable as long as leakage inductance is small. Smaller primary inductance values  
may cause feedback pulses that are too short and lead to higher than expected output voltage.  
IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this  
publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither  
circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS’ Standard Terms and Conditions of Sale,  
IXYS Corporation assumes no liability whatsoever, and disclaims any expressed or implied warranty, relating to its products  
including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any  
intellectual property right  
MX881  
12  
7/30/07  
Drawing No. 088109  
www.claremicronix.com  
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Santa Clara, CA 925054  
Tel: 408-982-0700  
Fax: 408-496-0670  
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Langley Park  
Chippenham  
Wiltshire SN 15 1GE - England  
Tel: 44 1249 444524  
Fax: 44 1249 659448  
sales@ixys.co.uk  
Micronix  
An IXYS Company  
145 Columbia  
Aliso Viejo, CA 92656-1490  
Tel: 1-949-831-4622  
Fax: 1-949-831-4628  
Sales Offices ASIA / PACIFIC  
Asian Headquarters  
IXYS  
Room 1016, Chia-Hsin, Bldg II,  
10F, No. 96, Sec. 2  
Chung Shan North Road  
Taipei, Taiwan R.O.C.  
Tel: 886-2-2523-6368  
Fax: 886-2-2523-6368  
bradley.green@ixys.co.uk  
Jhong@clare.com  
SALES OFFICES AMERICAS  
Eastern Region  
[Eastern North America, Mexico, South America]  
IXYS Corporation  
Beverly, MA  
Tel: 508-528-6883  
Fax: 508-528-4562  
wgh@ixys.net  
Check the IXYS Website for the local sales  
office nearest you. (www.ixys.com)  
Central Region  
[Central North America]  
IXYS Corporation  
Greensburg, PA  
Tel: 724-836-8530  
Fax: 724-836-8540  
neil.lejeune@westcode.com  
Western Region  
[Western North America]  
IXYS Corporation  
Solana Beach, CA  
Tel: 858-792-1101  
slodor@ix.netcom.com  
http://www.claremicronix.com  
SALES OFFICES EUROPE  
European Headquarters  
IXYS Semiconductor GMBH  
Edisonstrasse 15  
D- 68623 Lampertheim  
Germany  
Tel: 49-6206-503203  
Fax: 49-6206-503286  
marcom@ixys.de  
IXYS cannot assume responsibility for use of any circuitry other than circuitry  
entirely embodied in this IXYS product. No circuit patent licenses nor indemnity  
are expressed or implied. IXYS reserves the right to change the specification and  
circuitry, without notice at any time. The products described in this document are  
not intended for use in medical implantation or other direct life support  
applications where malfunction may result in direct physical harm, injury or death  
to a person.  
Specification: MX881  
©Copyright 2007, IXYS Corporation  
All rights reserved. Printed in USA.  
MX881  
13  
7/30/07  
Drawing No. 088109  
www.claremicronix.com  

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