PLA171P [IXYS]
Transistor Output SSR, 1-Channel, 5000V Isolation, ROHS COMPLIANT, FLATPACK-6/8;
| 型号： | PLA171P |
| 厂家： | 
IXYS CORPORATION |
| 描述： | Transistor Output SSR, 1-Channel, 5000V Isolation, ROHS COMPLIANT, FLATPACK-6/8 输出元件 光电 |
| 文件： | 总6页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PLA171
Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED
CIRCUITS
DIVISION
Parameter
Load Voltage
Load Current
Rating
800
100
50
Units
Description
VP
mArms / mADC
Specially designed to provide 7mm of separation
between the two output pins, IXYS Integrated Circuits
Division's PLA171 is a single-pole, normally open
(1-Form-A) Solid State Relay that uses optically
coupled MOSFET technology to provide an enhanced
On-Resistance (max)
Input Control Current
2
mA
input-to-output isolation of 5000Vrms
.
Features
• 7mm Separation of Output Pins
• 800VP Blocking Voltage
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
The PLA171 is designed to replace, and offers
superior reliability over, electromechanical relays. This
device provides bounce-free switching in a compact
surface-mount package.
• Small Surface Mount Package
• Machine Insertable, Wave Solderable
• Flammability Rating UL 94 V-0
Approvals
• UL Certified Component: File E76270
• EN/IEC 60950 Certified Component:
TUV Certificate B 12 11 82667 001
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
Ordering Information
Part #
PLA171P
Description
6-Pin (8-Pin Body) Flatpack (50/Tube)
PLA171PTR 6-Pin (8-Pin Body) Flatpack, Tape & Reel (1000/Reel)
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Automotive High-Voltage Circuitry
• Aerospace
Pin Configuration
8
5
1
2
3
4
NC
+ Control
– Control
NC
Load
Load
• Industrial Controls
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
t
t
off
on
Pb
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DS-PLA171-R03
1
www.ixysic.com
PLA171
INTEGRATED
CIRCUITS
DIVISION
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
Parameter
Blocking Voltage
Ratings Units
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
800
VP
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
ESD, Human Body Model
Isolation Voltage, Input to Output (60 Seconds)
Operational Temperature
Storage Temperature
5
V
50
mA
A
1
150
mW
mW
kV
800
8
5000
Vrms
°C
-40 to +85
-40 to +125
°C
1
2
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics
Load Current
Continuous 1
IF=2mA
IL
-
-
-
-
-
-
-
100
350
50
85
1
mArms / mADC
mAP
Peak
On-Resistance 2
IF=2mA , t=10ms
IF=2mA, IL= 100mA
IF=5mA, IL=1mA
IF=0mA, VL=800VP
ILPK
40
70
-
RON
Off-State Leakage Current
Switching Speeds
ILEAK
µA
Turn-On
ton
toff
-
-
-
0.42
0.15
11
5
5
-
IF=5mA, VL=10V
ms
pF
Turn-Off
Output Capacitance
IF=0mA, VL=50V, f=1MHz
COUT
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
IL=100mA
-
IF
IF
-
0.39
2
-
mA
mA
V
0.1
0.9
-
-
1.2
-
IF=5mA
VR=5V
VF
IR
1.4
10
Reverse Input Current
Common Characteristics
Input to Output Capacitance
µA
-
CI/O
-
3
-
pF
1
2
3
Load derates linearly from 100mA @ 25oC to 55mA @85oC.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a LED drive current of 5mA is recommended.
R03
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PLA171
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
35
30
25
20
15
10
5
25
20
15
10
5
20
15
10
5
0
0
0
1.230 1.235 1.240 1.245 1.250 1.255
0.36 0.38 0.40 0.42 0.44 0.46 0.48
0.135 0.140 0.145 0.150 0.155 0.160 0.165
LED Forward Voltage (V)
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=100mA)
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=100mA)
Typical Blocking Voltage Distribution
(N=50)
15
10
5
35
30
25
20
15
10
5
15
10
5
0
0
0
40.0
40.5
41.0
41.5
42.0
42.5
0.33 0.35 0.37 0.39 0.41 0.43 0.45
956 964 972 980 988 996 1004
On-Resistance (:)
LED Current (mA)
Blocking Voltage (VP)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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3
PLA171
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-Off Time
vs. LED Forward Current
(IL=55mA)
Typical Turn-On Time
vs. LED Forward Current
(IL=55mA)
Typical LED Voltage Drop
vs.Temperature
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.160
0.158
0.156
0.154
0.152
0.150
0.148
0.7
0.6
0.5
0.4
0.3
0.2
0.1
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
0
10
20
30
40
50
100
6
-40
-20
0
20
40
60
80
80
80
100
100
100
100
0
10
20
30
40
50
LED Current (mA)
Temperature (ºC)
LED Current (mA)
LED Current to Operate
vs.Temperature
(IL=55mA)
Typical Turn-On Time
vs.Temperature
Typical Turn-Off Time
vs.Temperature
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.20
0.18
0.16
0.14
0.12
0.10
0.55
0.50
0.45
0.40
0.35
IF=2mA
IF=2mA
IF=5mA
IF=5mA
-40
-20
0
20
40
60
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical On-Resistance
vs.Temperature
(IF=5mA)
Maximum Load Current
vs.Temperature
(IF=5mA)
Typical Load Current
vs. Load Voltage
(IF=2mA)
70
60
50
40
30
20
100
50
110
100
90
IL=30mA
0
80
70
IL=55mA
-50
-100
60
50
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
-6
-4
-2
0
2
4
Temperature (ºC)
Temperature (ºC)
Voltage (V)
Typical Leakage Current
vs.Temperature
(VL=800V)
Typical Blocking Voltage
vs.Temperature
Energy Rating Curve
1040
80
70
60
50
40
30
20
10
1.0
0.8
0.6
0.4
0.2
0.0
1020
1000
980
960
940
920
900
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
1ms 10ms 100ms 1s
10s 100s
10Ps 100Ps
Temperature (ºC)
Temperature (ºC)
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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PLA171
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PLA171P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
MaximumTemperature xTime
PLA171P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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R03
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5
PLA171
INTEGRATED
CIRCUITS
DIVISION
Mechanical Dimensions
PLA171P
Recommended PCB Land Pattern
Leadframe
to package
standoff
MIN=0.000
MAX=0.102
(0.004)
2.286 MAX
(0.090) MAX
See Note 3
7.620 TYP
(0.300) TYP
7.62
(0.30)
7.620 0.254
(0.300 0.010)
6.350 0.127
(0.250 0.005)
9.398 0.127
(0.370 0.005)
8.70
(0.3425)
Pin 1
0.203 0.025
0.457 0.076
(0.008 0.001)
2.540 0.127
(0.100 0.005)
(0.018 0.003)
0.635 0.127
(0.025 0.005)
1.55
(0.0610)
2.54
(0.10)
9.652 0.381
(0.380 0.015)
0.65
(0.0255)
2.159 0.025
(0.085 0.001)
Notes:
1. Coplanarity = 0.102mm (0.004”) MAX
2. Leadframe thickness does not include solder
plating (1000 micro-inches MAX)
Dimensions
mm
(inches)
0.864 0.102
3. Sum of package height, standoff, and coplanarity
shall not exceed 2.286mm (0.090”)
(0.034 0.004)
PLA171PTR Tape & Reel
2.00
(0.079)
4.00
(0.157)
330.2 DIA.
(13.00 DIA.)
W = 16.00
(0.63)
7.50
(0.295)
Top Cover
Tape Thickness
Bo = 10.30
(0.406)
0.102 MAX.
(0.004 MAX.)
P = 12.00
(0.472)
Ao = 10.30
(0.406)
K0 = 2.70
(0.106)
Dimensions
mm
(inches)
K1 = 2.00
(0.079)
User Direction of Feed
Embossed Carrier
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-PLA171-R03
©Copyright 2013, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/20/2013
6
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