BLF177_15 [JMNIC]

HF/VHF power MOS transistor;
BLF177_15
型号: BLF177_15
厂家: QUANZHOU JINMEI ELECTRONIC CO.,LTD.    QUANZHOU JINMEI ELECTRONIC CO.,LTD.
描述:

HF/VHF power MOS transistor

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中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BLF177  
HF/VHF power MOS transistor  
1998 Jul 02  
Product specification  
Supersedes data of September 1992  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
FEATURES  
PIN CONFIGURATION  
High power gain  
Low intermodulation distortion  
Easy power control  
andbook, halfpage  
4
3
Good thermal stability  
Withstands full load mismatch.  
d
APPLICATIONS  
g
s
MBB072  
Designed for industrial and military  
applications in the HF/VHF  
frequency range.  
1
2
MLA876  
DESCRIPTION  
Silicon N-channel enhancement  
mode vertical D-MOS transistor  
encapsulated in a 4-lead, SOT121B  
flanged package, with a ceramic cap.  
All leads are isolated from the flange.  
Fig.1 Simplified outline (SOT121B) and symbol.  
CAUTION  
A marking code, showing gate-source  
voltage (VGS) information is provided  
for matched pair applications. Refer  
to the handbook 'General' section for  
further information.  
This product is supplied in anti-static packing to prevent damage caused by  
electrostatic discharge during transport and handling. For further information,  
refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A, and SNW-FQ-302B.  
WARNING  
PINNING  
Product and environmental safety - toxic materials  
PIN  
DESCRIPTION  
This product contains beryllium oxide. The product is entirely safe provided  
that the BeO disc is not damaged. All persons who handle, use or dispose of  
this product should be aware of its nature and of the necessary safety  
precautions. After use, dispose of as chemical or special waste according to  
the regulations applying at the location of the user. It must never be thrown  
out with the general or domestic waste.  
1
2
3
4
drain  
source  
gate  
source  
QUICK REFERENCE DATA  
RF performance at Th = 25 °C in a common source test circuit.  
MODE OF  
OPERATION  
f
VDS  
(V)  
PL  
(W)  
Gp  
(dB)  
ηD  
(%)  
d3  
(dB)  
d5  
(dB)  
(MHz)  
SSB class-AB  
CW class-B  
28  
50  
50  
150 (PEP)  
150  
>20  
>35  
<−30  
<−30  
108  
typ. 19  
typ. 70  
1998 Jul 02  
2
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
drain-source voltage  
CONDITIONS  
MIN.  
MAX.  
110  
UNIT  
VDS  
VGS  
ID  
V
gate-source voltage  
drain current (DC)  
±20  
16  
V
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
T
mb 25 °C  
220  
150  
200  
W
65  
°C  
°C  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
K/W  
K/W  
Rth j-mb  
Rth mb-h  
thermal resistance from junction to mounting base  
thermal resistance from mounting base to heatsink  
max. 0.8  
max. 0.2  
MGP089  
MRA906  
2
10  
300  
handbook, halfpage  
handbook, halfpage  
I
P
D
tot  
(A)  
(W)  
10  
200  
(1)  
(2)  
(1)  
(2)  
1
100  
1  
0
0
10  
2
3
1
10  
10  
10  
50  
100  
150  
V
(V)  
T
(°C)  
DS  
h
(1) Current in this area may be limited by RDSon  
.
(1) Short-time operation during mismatch.  
(2) Continuous operation.  
(2) Tmb = 25 °C.  
Fig.2 DC SOAR.  
Fig.3 Power derating curves.  
1998 Jul 02  
3
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
ID = 50 mA; VGS = 0  
MIN.  
110  
TYP. MAX. UNIT  
V(BR)DSS  
IDSS  
drain-source breakdown voltage  
drain-source leakage current  
gate-source leakage current  
gate-source threshold voltage  
V
VGS = 0; VDS = 50 V  
VGS = ±20 V; VDS = 0  
ID = 50 mA; VDS = 10 V  
ID = 50 mA; VDS = 10 V  
2
2.5  
1
mA  
µA  
V
IGSS  
VGSth  
VGS  
4.5  
100  
gate-source voltage difference of  
matched pairs  
mV  
gfs  
forward transconductance  
drain-source on-state resistance  
on-state drain current  
input capacitance  
ID = 5 A; VDS = 10 V  
4.5  
6.2  
0.2  
25  
S
RDSon  
IDSX  
Cis  
ID = 5 A; VGS = 10 V  
0.3  
VGS = 10 V; VDS = 10 V  
A
VGS = 0; VDS = 50 V; f = 1 MHz  
VGS = 0; VDS = 50 V; f = 1 MHz  
VGS = 0; VDS = 50 V; f = 1 MHz  
480  
190  
14  
pF  
pF  
pF  
Cos  
Crs  
output capacitance  
feedback capacitance  
MGP090  
MGP091  
0
30  
handbook, halfpage  
handbook, halfpage  
T.C.  
I
(mV/K)  
D
(A)  
1  
20  
2  
3  
4  
5  
10  
0
0
2  
1  
5
10  
15  
10  
10  
1
10  
I
(A)  
V
(V)  
D
GS  
VDS = 10 V; valid for Th = 25 to 70 °C.  
VDS = 10 V.  
Fig.4 Temperature coefficient of gate-source  
voltage as a function of drain current; typical  
values.  
Fig.5 Drain current as a function of gate-source  
voltage; typical values.  
1998 Jul 02  
4
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
MBK408  
MGP092  
1200  
400  
handbook, halfpage  
handbook, halfpage  
R
C
DSon  
(pF)  
(m)  
800  
400  
300  
C
is  
200  
100  
C
os  
0
0
20  
40  
60  
0
50  
100  
150  
V
(V)  
T (°C)  
DS  
j
ID = 5 A; VGS = 10 V.  
VGS = 0; f = 1 MHz.  
Fig.6 Drain-source on-state resistance as a  
function of junction temperature; typical  
values.  
Fig.7 Input and output capacitance as functions  
of drain-source voltage; typical values.  
MGP093  
300  
handbook, halfpage  
C
rs  
(pF)  
200  
100  
0
0
10  
20  
30  
40  
50  
(V)  
V
DS  
VGS = 0; f = 1 MHz.  
Fig.8 Feedback capacitance as a function of  
drain-source voltage; typical values.  
1998 Jul 02  
5
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
APPLICATION INFORMATION FOR CLASS-AB OPERATION  
RF performance in SSB operation in a common source class-AB test circuit (see Fig.13).  
Th = 25 °C; Rth mb-h = 0.2 K/W; ZL = 6.25 + j0 ; f1 = 28.000 MHz; f2 = 28.001 MHz unless otherwise specified.  
d3  
(dB)  
(note 1)  
d5  
(dB)  
(note 1)  
MODE OF  
OPERATION  
f
VDS  
(V)  
IDQ  
(A)  
PL  
(W)  
Gp  
(dB)  
ηD  
(%)  
(MHz)  
SSB, class-AB  
28  
50  
0.7  
20 to 150  
(PEP)  
>20  
typ. 35  
>35  
typ. 40  
<−30  
typ. 35  
<−30  
typ. 38  
Note  
1. Stated figures are maximum values encountered at any driving level between the specified value of PEP and are  
referred to the according level of either the equal amplified tones. Related to the according peak envelope power  
these figures should be decreased by 6 dB.  
Ruggedness in class-AB operation  
The BLF177 is capable of withstanding a load mismatch corresponding to VSWR = 50 through all phases under the  
following conditions: f = 28 MHz; VDS = 50 V at rated output power.  
MGP096  
MGP094  
30  
60  
handbook, halfpage  
handbook, halfpage  
G
p
η
D
(dB)  
(%)  
20  
40  
10  
20  
0
0
0
0
100  
200  
100  
200  
P
(W) PEP  
P (W) PEP  
L
L
Class-AB operation; VDS = 50 V; IDQ = 0.7 A;  
Class-AB operation; VDS = 50 V; IDQ = 0.7 A;  
RGS = 5 ; f1 = 28.000 MHz; f2 = 28.001 MHz.  
RGS = 5 ; f1 = 28.000 MHz; f2 = 28.001 MHz.  
Fig.9 Power gain as a function of load power;  
typical values.  
Fig.10 Two tone efficiency as a function of load  
power; typical values.  
1998 Jul 02  
6
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
MGP097  
MGP098  
20  
20  
handbook, halfpage  
handbook, halfpage  
d
5
d
3
(dB)  
(dB)  
30  
30  
40  
50  
60  
40  
50  
60  
0
100  
200  
0
100  
200  
P
(W) PEP  
P
(W) PEP  
L
L
Class-AB operation; VDS = 50 V; IDQ = 0.7 A;  
GS = 5 ; f1 = 28.000 MHz; f2 = 28.001 MHz.  
Class-AB operation; VDS = 50 V; IDQ = 0.7 A;  
RGS = 5 ; f1 = 28.000 MHz; f2 = 28.001 MHz.  
R
Fig.11 Third order intermodulation distortion as a  
function of load power; typical values.  
Fig.12 Fifth order intermodulation distortion as a  
function of load power; typical values.  
C9  
C12  
C14  
C15  
L3  
D.U.T.  
L6  
output  
50 Ω  
C3  
C1  
L2  
L1  
input  
50 Ω  
C10 C11  
C2  
C4  
L4  
R1  
R3  
R2  
C5  
C13  
C6  
L5  
C7  
R5  
C8  
R4  
+V  
G
+V  
MGP095  
D
Fig.13 Test circuit for class-AB operation at 28 MHz.  
7
1998 Jul 02  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
List of components class-AB test circuit (see Fig.13)  
COMPONENT  
DESCRIPTION  
VALUE  
DIMENSIONS  
CATALOGUE NO.  
C1, C4, C13, C14 film dielectric trimmer  
7 to 100 pF  
56 pF  
2222 809 07015  
C2  
multilayer ceramic chip capacitor  
(note 1)  
C3, C11  
multilayer ceramic chip capacitor  
(note 1)  
62 pF  
C5, C6  
C7  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
electrolytic capacitor  
100 nF  
2222 852 47104  
2222 852 47104  
3 × 100 nF  
2.2 µF, 63 V  
20 pF  
C8  
C9, C10  
multilayer ceramic chip capacitor  
(note 1)  
C12  
C15  
L1  
multilayer ceramic chip capacitor  
(note 1)  
100 pF  
150 pF  
133 nH  
multilayer ceramic chip capacitor  
(note 1)  
5 turns enamelled 0.7 mm copper  
wire  
length 4.5 mm;  
int. dia. 6 mm;  
leads 2 × 5 mm  
L2, L3  
L4  
stripline (note 2)  
41.1 Ω  
length 13 × 6 mm  
7 turns enamelled 1.5 mm copper  
wire  
236 nH  
length 12.5 mm;  
int. dia. 8 mm;  
leads 2 × 5 mm  
L5  
L6  
grade 3B Ferroxcube wideband HF  
choke  
4312 020 36642  
5 turns enamelled 2 mm copper wire 170 nH  
length 11.5 mm;  
int. dia. 8 mm;  
leads 2 × 5 mm  
R1, R2  
R2  
metal film resistor  
metal film resistor  
metal film resistor  
metal film resistor  
10 , 1 W  
10 kΩ, 0.4 W  
1 M, 0.4 W  
10 k, 1 W  
R3  
R5  
Notes  
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.  
2. The striplines are on a double copper-clad printed circuit board, with PTFE fibre-glass dielectric (εr = 2.2),  
thickness 1.6 mm.  
1998 Jul 02  
8
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
MGP099  
MGP100  
10  
30  
handbook, halfpage  
handbook, halfpage  
Z
i
G
p
()  
(dB)  
r
i
5
0
20  
10  
x
i
5  
0
0
0
10  
20  
30  
10  
20  
30  
f (MHz)  
f (MHz)  
Class-AB operation; VDS = 50 V; IDQ = 0.7 A;  
Class-AB operation; VDS = 50 V; IDQ = 0.7 A;  
PL = 150 W (PEP); RGS = 6.25 ; RL = 6.25 .  
PL = 150 W (PEP); RGS = 6.25 ; RL = 6.25 .  
Fig.14 Input impedance as a function of frequency  
(series components); typical values.  
Fig.15 Power gain as a function of frequency;  
typical values.  
1998 Jul 02  
9
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
APPLICATION INFORMATION FOR CLASS-B OPERATION  
RF performance in CW operation in a common source class-B test circuit (see Fig.19).  
Th = 25 °C; Rth mb-h = 0.2 K/W; RGS = 15.8 unless otherwise specified.  
MODE OF  
OPERATION  
f
VDS  
(V)  
IDQ  
(A)  
PL  
(W)  
Gp  
(dB)  
ηD  
(%)  
(MHz)  
CW, class-B  
108  
50  
0.1  
150  
typ. 19  
typ. 70  
MGP101  
MGP102  
30  
100  
handbook, halfpage  
handbook, halfpage  
G
p
(dB)  
η
D
(%)  
20  
50  
10  
0
0
0
0
100  
200  
100  
200  
P
(W)  
L
P
(W)  
L
Class-B operation; VDS = 50 V; IDQ = 100 mA;  
Class-B operation; VDS = 50 V; IDQ = 100 mA;  
RGS = 15.8 ; f = 108 MHz.  
RGS = 15.8 ; f = 108 MHz.  
Fig.16 Power gain as a function of load power;  
typical values.  
Fig.17 Two tone efficiency as a function of load  
power; typical values.  
1998 Jul 02  
10  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
MGP103  
200  
handbook, halfpage  
P
L
(W)  
100  
0
0
1
2
3
4
P
(W)  
IN  
Class-B operation; VDS = 50 V; IDQ = 100 mA;  
RGS = 15.8 ; f = 108 MHz.  
Fig.18 Load power as a function of input power;  
typical values.  
C17  
C18  
C13  
L8  
C15  
C16  
D.U.T.  
BLF177  
L4  
L7  
output  
50 Ω  
C3  
C2  
C4  
C5  
C1  
L2  
L3  
L1  
input  
50 Ω  
C14  
L5  
C9  
C10  
R1  
R2  
C11  
L6  
C12  
C6  
R6  
C7  
R3  
+V  
C8  
D
C19  
R5  
R4  
MGP104  
Fig.19 Test circuit for class-B operation at 108 MHz.  
11  
1998 Jul 02  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
List of components class-B test circuit (see Fig.19)  
COMPONENT  
DESCRIPTION  
VALUE  
DIMENSIONS  
CATALOGUE NO.  
C1, C2, C16, C18 film dielectric trimmer  
2.5 to 20 pF  
20 pF  
2222 809 07004  
C3  
multilayer ceramic chip capacitor  
(note 1)  
C4, C5  
multilayer ceramic chip capacitor  
(note 1)  
62 pF  
1 nF  
C6, C7, C9, C10  
multilayer ceramic chip capacitor  
(note 1)  
C8  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
100 nF  
10 nF  
2222 852 47104  
2222 852 47103  
2222 852 47104  
C11  
C12  
3 × 100 nF  
36 pF  
C13, C14  
multilayer ceramic chip capacitor  
(note 1)  
C15  
C17  
multilayer ceramic chip capacitor  
(note 1)  
12 pF  
multilayer ceramic chip capacitor  
(note 1)  
5.6 pF  
C19  
L1  
electrolytic capacitor  
4.4 µF, 63 V  
2222 030 28478  
3 turns enamelled 0.8 mm copper  
wire  
22 nH  
length 5.5 mm;  
int. dia. 3 mm;  
leads 2 × 5 mm  
L2  
stripline (note 2)  
stripline (note 2)  
64.7 Ω  
41.1 Ω  
122 nH  
31 × 3 mm  
10 × 6 mm  
L3, L4  
L5  
6 turns enamelled 1.6 mm copper  
wire  
length 13.8 mm;  
int. dia. 6 mm;  
leads 2 × 5 mm  
L6  
L7  
L8  
grade 3B Ferroxcube wideband HF  
choke  
4312 020 36642  
1 turn enamelled 1.6 mm copper  
wire  
16.5 nH  
34.4 nH  
int. dia. 9 mm;  
leads 2 × 5 mm  
2 turns enamelled 1.6 mm copper  
wire  
length 3.9 mm;  
int. dia. 6 mm;  
leads 2 × 5 mm  
R1, R2  
R3  
metal film resistor  
metal film resistor  
cermet potentiometer  
metal film resistor  
metal film resistor  
31.6 , 1 W  
1 k, 0.4 W  
5 kΩ  
R4  
R5  
44.2 , 0.4 W  
10 Ω, 1 W  
R6  
Notes  
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.  
2. The striplines are on a double copper-clad printed circuit board, with PTFE fibre-glass dielectric (εr = 2.2),  
thickness 1.6 mm.  
1998 Jul 02  
12  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
174  
strap  
strap  
70  
rivet  
strap  
R4  
R5  
C19  
L6  
+V  
D
R6  
R3  
C8  
C11  
C10  
C9  
C6  
C7  
C12  
C13  
L5  
R1  
R2  
L3  
C4  
C5  
C15  
C16  
C3  
C2  
L2  
L1  
L7  
L8  
C17  
C18  
L4  
C14  
C1  
MGP105  
Dimensions in mm.  
The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being fully metallized to serve as a ground. Earth  
connections are made by means of hollow rivets, whilst under the source leads and at the input and output copper straps are used for a direct contact  
between upper and lower sheets.  
Fig.20 Component layout for 108 MHz class-B test circuit.  
1998 Jul 02  
13  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
MGP107  
MGP108  
4
10  
handbook, halfpage  
handbook, halfpage  
Z
Z
i
L
()  
()  
2
0
8
r
i
R
X
L
6
4
2
x
i
L
2  
4  
6  
0
0
0
100  
200  
100  
200  
f (MHz)  
f (MHz)  
Class-B operation; VDS = 50 V; IDQ = 0.1 A;  
PL = 150 W; RGS = 15 .  
Class-B operation; VDS = 50 V; IDQ = 0.1 A;  
PL = 150 W; RGS = 15 .  
Fig.21 Input impedance as a function of frequency  
(series components); typical values.  
Fig.22 Load impedance as a function of frequency  
(series components); typical values.  
MGP109  
30  
handbook, halfpage  
G
p
(dB)  
20  
handbook, halfpage  
10  
Z
Z
L
MBA379  
i
0
0
100  
200  
f (MHz)  
Class-B operation; VDS = 50 V; IDQ = 0.1 A;  
PL = 150 W; RGS = 15 .  
Fig.24 Power gain as a function of frequency;  
typical values.  
Fig.23 Definition of transistor impedance.  
1998 Jul 02  
14  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
PACKAGE OUTLINE  
Flanged ceramic package; 2 mounting holes; 4 leads  
SOT121B  
D
A
F
q
C
U
1
B
c
H
b
L
w
M
C
2
4
3
α
A
D
U
3
U
p
1
2
w
M
A
B
1
1
2
H
Q
0
5
10 mm  
scale  
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)  
c
A
b
D
D
F
H
L
p
Q
q
U
U
U
3
w
w
2
α
UNIT  
1
1
2
1
5.82  
5.56  
12.83  
12.57  
7.27  
6.17  
12.86  
12.59  
2.67 28.45 7.93  
2.41 25.52 6.32  
3.30  
3.05  
4.45  
3.91  
24.90 6.48 12.32  
24.63 6.22 12.06  
0.16  
0.10  
18.42  
0.725  
1.02  
0.51  
0.02 0.04  
mm  
45°  
0.229  
0.219  
0.505  
0.495  
0.286  
0.243  
0.506  
0.496  
0.105 1.120 0.312 0.130  
0.095 1.005 0.249 0.120  
0.255 0.485  
0.245 0.475  
0.006  
0.004  
0.175  
0.154  
0.98  
0.97  
inches  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
SOT121B  
97-06-28  
1998 Jul 02  
15  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1998 Jul 02  
16  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
NOTES  
1998 Jul 02  
17  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
NOTES  
1998 Jul 02  
18  
Philips Semiconductors  
Product specification  
HF/VHF power MOS transistor  
BLF177  
NOTES  
1998 Jul 02  
19  
Philips Semiconductors – a worldwide company  
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Middle East: see Italy  
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Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
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United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
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MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
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Uruguay: see South America  
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Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA60  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
125108/00/03/pp20  
Date of release: 1998 Jul 02  
Document order number: 9397 750 04059  

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