KPF070G03 [KEC]

Semiconductor Pressure Sensor; 半导体压力传感器


型号：	KPF070G03
厂家：	KEC(KOREA ELECTRONICS)
描述：	Semiconductor Pressure Sensor 半导体压力传感器半导体传感器压力传感器
文件：	总3页 (文件大小：524K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SEMICONDUCTOR

KPF010D04~KPF070D04

TECHNICAL DATA

Semiconductor Pressure Sensor

FEATURES

Low pressure (0~1

)

Easy to use dual in-line package (DIP)

Wide 0~60 compensated temperature range

Span calibration to 2% for low pressure

Zero offset calibration

High performance, stable packaged silicon chip

Gage and differential pressure configurations

APPLICATIONS

Medical Equipment

Respiration

HVAC

Level Detection

Flow Measurement

Industrial Control

MODEL NUMBER FOR ORDERING

KP F 000 G 00 A

Package Pin Configuration

No Mark : Standard

A : Type 1

Silicon Pressure Sensor

Package Type

00 : Die

01~ : Package Series

ON/OFF Chip

N:ON Chip (Amplified)

F:OFF Chip (Not Amplified)

Measuring Pressure

A : Absolute Pressure

D : Differential Pressure

G : Gage Pressure

Rated Pressure

123

12 10³=12,000kPa

PIP3

MAXIMUM RATING

ITEM

SPEC.

UNIT

Model No.

Classification

KPF010D04

KPF020D04

KPF070D04

010

020

070

kPa

psi

kPa

Rated Pressure

0.14

0.290

1.015

Maximum Pressure Load

Burst Pressure

Tenth of Rated Pressure

Fifth of Rated Pressure

3000~6000

-40~125

Bridge Impedance

Operating Temperature

Storage Temperature

-55~125

ELECTRICAL CHARACTERISTICS

ITEM

SPEC.

020

UNIT

Classification

010

070

Test Condition

Operating Input Current 1.5 constant, Ambient Temperature Ta=25

Compensational Temperature Range

Full Scale Voltage

0 ~ 60

25~75

Offset Voltage

Linearity

%FS

2.5

0.65

0.3

2.0

Pressure Hysteresis

Repeatability

Temperature Coefficient Of Offset (TCO)

Temperature Coefficient Of Sensitivity (TCS)

Comment) 1. Operating humidity 25~80%RH (unless otherwise noted)

2. Please, consult us when you use any other pressure media except air.

2007. 5. 15

Revision No : 2

1/3

KPF010D04~KPF070D04

RELIABILITY TEST

ITEMS

High Temp. Storage

Low Temp. Storage

TEST CONDITIONS

120 , 1000hrs

-40 , 1000hrs

Steady State Operating

Low Temp. Operating

High Temp. Operating

Temperature / Humidity Operating

Heat Resistance

, 1 million times, Rated Pressure

Life Test

-20 , 1 million times, Rated Pressure

100 , 1 million times, Rated Pressure

40 , 90%RH, 1 million times, Rated Voltage

260 , 10 seconds

Environment Test

Mechanical Test

Temp. Cycle

-40 ~120 , 30minutes/1Cycle, 100Cycles

Amplitude : 1.5mm, Frequency : 10~55Hz,

X, Y, Z(3-directions), 2 hrs each direction

Vibration

Drop

75cm height, 2 times

Tensile Strength : 9.8N(1kgf), 10seconds

Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time

Lead Fatigue

Solderability

230 , 5 seconds

PACKAGE CONFIGURATION AND DIMENSIONS (Unit : mm)

2.54 2.54 2.54

Not Used

for Absolute

15.24

3.3 OD 2.03ID

2 Tubes

0.9 dia

2.54

3.87

L = 12.19

8 = 8.38

Not Used

for Gage

15.24

14.73

Ceramic

Substrate 1.02

8.13

5.08

8.64

4.45

4.06

Cover 9.40 13.97

0.51 Typ. 8Pins

3.05

Pin Hole

9.40

0.51 Ref

PIN CONFIGURATION

Pressure Sensor

- Out

Temminal No.

Meaning

Gain Set

Resistor

(-) Out

(-) In

100K

ln +

3.012V

(+) Out

(+) In

Gainset resistor

+ Out

ln -

2007. 5. 15

Revision No : 2

2/3

KPF010D04~KPF070D04

the sensor lead wires.

(f) When using a soldering iron select those which have less

leakage, and be sure to ground the soldering iron.

Note

1. Mounting on printed circuit boards

When mounting a transistor on a printed circuit, it is assumed that

lead wires will be processed or reformed due to space limitation or

relations with other components. Even if no such special

processing reforming is conducted exercise care on the following

points :

(a) Make the spaces of lead wire inserting holes on the printed

circuit board the same as those of lead wires on a transistor.

(b) Even if The spaces are not the same, do not pull the lead

wires or push heavily against the sensor element.

and a printed circuit board, rather than closely contacting

them with each other.

(d) When forming a lead prior to mounting onto a board

- Bend the lead at a point 3mm or more apart from the

body(Lead root).

- Bend one lead wire after securing the other lead wire. (near

the main body)

- Keep space between the sensor main body and and a fixing

jig.

- When bending the lead along the jig, be careful not to

damage it with an edge of the jig.

3. Cleaning a circuit board

After soldering, circuit boards must be cleaned to remove flux.

Observe the following precautions while cleaning them

(a) When cleaning circuit boards to remove flux, make sure that

no residual reactive ions such as Na or Cl ions remain. Note

that organic solvents react with water to generate hydrogen

chloride and other corrosive gases which can degrade device

performance.

(b) Do not rub the indication marks with a brush or one’s fingers

when cleaning or while a cleaning agent is applied to the

markings.

high cleaning effect within a short time. Since there methods

involve a complicated combination of factors such as the

cleaning bath size, ultrasonic wave vibrator output, and

printed circuit board mounting method, there is fear that the

service life of airtight seal-type sensors may be extremely

shortened. Therefore, as far as possible avoid using the

ultrasonic wave cleaning method.

- Basic requirements of ultrasonic wave cleaning method.

Frequency : 27~29kHz

- Follow other precautions described in respective standard

(e) When mounting a sensor onto a heat sink

- Use the specified accessory.

- Drill threaded holes on the heat kink as per specifications

and keep the surface free from burrs and undulations.

- Use KEC’s recommended silicon grease.

Output : 300W or less (300W/ or less)

Recommended solvents : Refer to details above

Cleaning time : 30seconds or less

- Tighten the screw within the specified torque.

- Never apply a pneumatic screwdriver to a transistor main

body.

(f) Do not bend or stretch the lead wires repeatedly.

When pulling in the axial directions, apply 500g or 600g

power, depending on the shapes of lead wires.

2. Soldering

When soldering a sensor to a printed circuit board, the soldering

temperature is usually so high that it adversely affects the sensor.

Normally, tests are conducted at a soldering temperature of 265

for 10 seconds or 300

for 3 seconds. Be sure to complete

soldering procedures under these conditions of temperature and

time.

Be careful to select a type of flux that will neither corrode the

lead wires nor affect the electrical characteristics of a sensor.

The basic precautions for soldering procedures are as follows :

(a) Complete soldering procedures in a time as short as possible.

(b) Do not apply stress to a sensor after soldering by correcting

or modifying its location or direction.

first: then solder this unit to a printed circuit board after

confirming that it is fully secured.

(d) Do not directly solder the heat-radiating portion of a sensor

to a printed circuit board.

(e) In flow solder jobs, sensors are apt to float on the solder due

to solder surface tension. When adjusting the locations of

sensor, be careful not to apply excessive stress to the roots of

2007. 5. 15

Revision No : 2

3/3

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