C0603X102K1RACAUTO_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP) X7R Dielectric,

6.3 – 250 VDC (Automotive Grade)

Overview

KEMET’s Automotive Grade Flexible Termination (FT-CAP)

multilayer ceramic capacitor in X7R dielectric incorporates

a unique, ﬂexible termination system that is integrated with

KEMET’s standard termination materials. A conductive silver

epoxy is utilized between the base metal and nickel barrier

layers of KEMET’s standard termination system in order

to establish pliability while maintaining terminal strength,

solderability and electrical performance. This technology

was developed in order to address the primary failure mode

of MLCCs– ﬂex cracks, which are typically the result of

excessive tensile and shear stresses produced during board

ﬂexure and thermal cycling. Flexible termination technology

Combined with the stability of an X7R dielectric and designed

to accommodate all capacitance requirements, these ﬂex-

robust devices are RoHS-compliant, offer up to 5mm of

ﬂex-bend capability and exhibit a predictable change in

capacitance with respect to time and voltage. Capacitance

change with reference to ambient temperature is limited to

±15% from −55°C to +125°C.

Whether under-hood or in-cabin, these capacitors are designed

to provide reliable performance in mission and safety

critical automotive circuits. Stricter testing protocol and

inspection criteria have been established for automotive grade

inhibits the transfer of board stress to the rigid ceramic body, products in recognition of potentially harsh environmental

therefore mitigating ﬂex cracks which can result in low IR or

short circuit failures.

conditions. KEMET automotive grade series capacitors meet

the demanding Automotive Electronics Council's AEC-Q200

qualiﬁcation requirements.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide

superior ﬂex performance over standard termination

systems. FT-CAP complements KEMET’s Open Mode,

Floating Electrode (FE-CAP), Floating Electrode with Flexible

Termination (FF-CAP) and KEMET Power Solutions (KPS)

product lines by providing a complete portfolio of ﬂex

mitigation solutions.

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Ordering Information

C

1206

X

106

K

4

R

A

C

AUTO

Case Size Speciﬁcation/ Capacitance Capacitance Rated Voltage

Failure Rate/

Termination

Packaging/

Ceramic

Dielectric

R = X7R

(L" x W")

Series

Code (pF)

Tolerance

(VDC)

Design

Finish¹

Grade (C-Spec)²

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

Two

J = ±5%

K = ±10%

M = ±20%

9 = 6.3

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

A = N/A

C = 100% Matte Sn

See

"Packaging

C-Spec

Ordering

Options

Table" below

signiﬁcant

digits and

number of

zeros

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

One world. One KEMET

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)³

7" Reel

AUTO

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Unmarked/2 mm pitch²

13" Reel/Unmarked/2 mm pitch²

3190

3191

¹Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information".

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

³All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For

more information see "Capacitor Marking".

³For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

Beneﬁts

• AEC-Q200 automotive qualiﬁed

• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

• −55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5 mm)

• High capacitance ﬂex mitigation

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, and

2225 case sizes

• Capacitance offerings ranging from 180 pF to 22 μF

• Available capacitance tolerances of ±5%, ±10% and ±20%

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

Applications

Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits

without (integrated) current limitation and any application that is subject to high levels of board ﬂexure or temperature

cycling. Examples include raw power input side ﬁltering (power plane/bus), high current applications (automobile battery

line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive,

aerospace and telecom.

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. These products are supported by a Product Change Notiﬁcation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

component without the requirement to submit a customer Source Controlled Drawing (SCD) or speciﬁcation for review by a

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM automotive customers and are

not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited

(see details below.)

Product Change Notiﬁcation (PCN)

The KEMET Product Change Notiﬁcation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, ﬁt, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

Customer Notiﬁcation Due To:

KEMET Automotive

C-Spec

Days Prior To

Implementation

Process/Product change

Obsolescence*

KEMET assigned¹

Yes (with approval and sign off)

Yes (without approval)

Yes

180 days minimum

90 days minimum

AUTO

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design records and speciﬁcation requirements are properly

understood and fulﬁlled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

PPAP (Product Part Approval Process) Level

KEMET Automotive

C-Spec

1

●

○

2

3

●

○

4

5

KEMET assigned¹

●

AUTO

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

● Part number speciﬁc PPAP available

○ Product family PPAP only

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Dimensions – Millimeters (Inches)

L

W

T

B

S

EIA Size

Code

Metric Size

Code

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

1.60 (0.063)

±0.17 (0.007)

2.00 (0.079)

±0.30 (0.012)

3.30 (0.130)

±0.40 (0.016)

3.30 (.130)

±0.40 (.016)

4.70 (0.185)

±0.50 (0.020)

4.50 (0.178)

±0.40 (0.016)

4.60 (0.181)

±0.40 (0.016)

5.90 (0.232)

±0.75 (0.030)

5.90 (0.232)

±0.75 (0.030)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

±0.30 (0.012)

1.60 (0.063)

±0.35 (0.013)

2.60 (0.102)

±0.30 (0.012)

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

6.40 (0.248)

±0.40 (0.016)

0.45 (0.018)

±0.15 (0.006)

0.50 (0.02)

0603¹

0805²

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.58 (0.023)

Solder Wave

or

Solder Reﬂow

0.75 (0.030)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

¹For capacitance values ≥ 0.56 µF add 0.03 (0.001) to length tolerance dimension.

²For capacitance values 1.0 µF or ≥ 2.7 µF add 0.05 (0.002) to length tolerance dimension.

Qualiﬁcation/Certiﬁcation

Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualiﬁcation for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their

website at www.aecouncil.com.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions.

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC)

±15%

¹Aging Rate (Maximum % Capacitance Loss/Decade Hour)

²Dielectric Withstanding Voltage (DWV)

3.0%

250% of rated voltage

(5±1 seconds and charge/discharge not exceeding 50mA)

³Dissipation Factor (DF) Maximum Limit at 25°C

See Dissipation Factor Limit Table

See Insulation Resistance Limit Table

(Rated voltage applied for 120±5 seconds at 25°C)

⁴Insulation Resistance (IR) Minimum Limit at 25°C

¹1Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known

as Automatic Level Control (ALC). The ALC feature should be switched to "ON".

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dissipation

Factor

(Maximum %)

Rated

DC Voltage

Capacitance

Insulation

Resistance

EIA Case Size

Capacitance

< 1.0µF

Shift

< 16

16 / 25

> 25

7.5

5.0

3.0

20.0

7.5

0603

All

≥ 1.0µF

< 4.7µF

≥ 4.7µF

< 4.7µF

≥ 4.7µF

All

< 16

16

20.0

5.0

20.0

5.0

3.0

7.5

0805

25

> 25

10% of Initial

All

±20%

Limit

< 16

All

1206¹

1210

16 / 25

> 25

All

5.0

3.0

7.5

All

< 16

All

16 / 25

> 25

All

5.0

3.0

7.5

All

< 16

All

1808 - 2225

16 / 25

> 25

All

5.0

3.0

All

¹For Capacitance values 4.7 µf and 10 µF DF Post Value is 20% (All Voltages).

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Insulation Resistance Limit Table (X7R Dielectric)

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

100 Megohm

Microfarads or 10 GΩ

EIA Case Size

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

< 0.012 µF

< 0.047 µF

< 0.15 µF

< 0.47 µF

< 0.39 µF

ALL

≥ 0.012 µF

N/A

≥ 0.47 µf

≥ 2.2 µf

≥ 4.7 µf

≥ 10 µf

N/A

≥ 0.047 µf < 0.47 µf

≥ 0.15 µF < 2.2 µf

≥ 0.47 µF < 4.7 µf

≥ 0.39 µF < 10 µf

N/A

< 2.2 µF

ALL

≥ 2.2 µF

N/A

< 10 µF

ALL

≥ 10 µF

N/A

Dissipation Factor (DF) Limit Table

Dissipation

Factor

(Maximum %)

EIA

Case Size

Rated DC

Voltage

Capacitance

< 16

16/25

> 25

All

5.0

3.5

2.5

10.0

5.0

10.0

3.5

10.0

3.5

2.5

5.0

3.5

2.5

5.0

3.5

2.5

5.0

3.5

2.5

< 1.0µF

0603

0805

≥ 1.0µF

< 4.7µF

≥ 4.7µF

< 4.7µF

≥ 4.7µF

All

< 16

16

25

> 25

All

< 16

All

1206¹

1210

16/25

> 25

All

< 16

All

16 / 25

> 25

All

< 16

All

1808 – 2225

16/25

> 25

All

¹For Capacitance values 4.7 µf and 10 µF DF Value is 10% (All Voltages).

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes)

Case Size/

Series

C0603X

C0805X

C1206X

C1210X

Cap

Code

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Rated Voltage

(VDC)

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

J

K

M

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN

CJ CJ CJ CJ CJ CJ

CJ CJ CJ CJ CJ

CJ CJ CJ CJ

DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN

DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN

22,000 pF 223

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF 563

68,000 pF 683

82,000 pF 823

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1.0 µF

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

5.6 µF

273

333

393

473

DR DR DR DR DR DD DS

DR DR DR DR DR DS DG

DD DD DD DD DD DS DG

DD DD DD DD DD DS

DR DR DR DR DR DS

DR DR DR DR DD DG

DD DD DD DD DD

DG DG DG DG DS

DD DD DD DD DS

DD DD DD DG DH

DD DD DD DG

EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN

EQ EQ EQ EQ EQ ER EQ EQ FN FN FN FN FN FN FN FN

EQ EQ EQ EQ EQ ER ES ES FN FN FN FN FN FN FQ FQ

EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FN FQ FQ

EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FQ FA FA

EQ EQ EQ EQ EQ EQ EM EM FN FN FN FN FN FX FZ FZ

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

565

ER ER ER ER ER ER EU

ER ER ER ER ER ER

EQ EQ EQ EQ ER EM

EQ EQ EQ EQ ER EU

ER ER ER ER ER EU

ES ES ES ES ER EM

ET ET ET ET ES EM

EF EF EF EF ES EH

EF EF EF EU ES EH

ES ES ES EU EH

ES ES ES EF EH

EN EN EN EH

FN FN FN FN FN FX FU FU

FQ FQ FQ FQ FQ FX FM FM

FQ FQ FQ FQ FQ FX FK FK

FQ FQ FQ FQ FQ FX

FX FX FX FX FX FX

FX FX FX FX FX FA

FX FX FX FX FX FZ

FA FA FA FA FA FL

FU FU FU FU FU FM

FU FU FU FU FZ FH

FU FU FU FU FZ FM

FU FU FU FU FZ FJ

FJ FJ FJ FJ FZ FK

FE FE FE FZ FU

CJ CJ CJ CJ

CJ CJ CJ

DD DD DD DG

DS DS DS

DG DG DG

ES ES ES EH

FA FA FA FM FM

EF EF EF EH

FZ FZ FZ FZ FK

DH DH DH

EF EA EA EA

FQ FQ FQ FZ FS

EH EH EH

FA FA FA FU

Rated Voltage

(VDC)

Cap

Code

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Case Size/

Series

C0603X

C0805X

C1206X

C1210X

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes) cont'd

Case Size/

Series

C0603X

C0805X

C1206X

C1210X

Cap

Code

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Rated Voltage

(VDC)

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

6.8 µF

8.2 µF

10 µF

12 µF

15 µF

18 µF

22 µF

685

825

106

126

156

186

226

J

K

M

EH EH EH

EA EA EA EA

FZ FZ FZ FM

FU FU FU FK

FU FU FU FS

DH DH

FS FS

Rated Voltage

(VDC)

Cap

Code

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Case Size/

Series

C0603X

C0805X

C1206X

C1210X

Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes)

Case Size/

Series

Voltage Code

C1808X

C1812X

C1825X

C2220X

C2225X

Cap

Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Rated Voltage

(VDC)

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

J

K

M

LD

GB

GC

GE

GB

GC

GE

GB

GG

GB

GE

GF

GG

GB

GE

GG

GJ

HB

HD

HF

HB

HD

HF

HB

HD

HF

JC

JD

JF

JC

JD

JF

JC

JD

JF

KC

KB

KC

KD

KE

KC

KD

KE

KC

KD

KE

GG GG

GG

GB

GJ

0.56 µF

0.68 µF

0.82 µF

1.0 µF

1.2 µF

Rated Voltage

(VDC)

Cap

Code

Voltage Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Case Size/

Series

C1808X

C1812X

C1825X

C2220X

C2225X

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes) cont'd

Case Size/

Series

Voltage Code

C1808X

C1812X

C1825X

C2220X

C2225X

Cap

Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Rated Voltage

(VDC)

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

5.6 µF

6.8 µF

8.2 µF

10 µF

12 µF

15 µF

18 µF

22 µF

155

185

225

275

335

395

475

565

685

825

106

126

156

186

226

J

K

M

GC

GE

GG

GJ

GL

GC

GE

GG

GJ

GL

GC

GE

GG

GJ

GL

HC

HD

HF

JC

JD

JF

JC

JD

JF

KC

KD

GK

JF

JO

Rated Voltage

(VDC)

Cap

Code

Voltage Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Case Size/

Series

C1808X

C1812X

C1825X

C2220X

C2225X

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Table 2 – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

7" Reel 13" Reel

Plastic Quantity

Thickness Case Thickness ±

Code

Size¹Range (mm)

7" Reel

13" Reel

CJ

DR

DD

DS

DG

DH

EQ

ER

EN

ES

ET

EF

EM

EH

EU

EA

FN

FQ

FX

FE

0603

0805

1206

1210

1808

1812

1825

2220

2225

0.80 ± 0.15*

0.78 ± 0.20

0.90 ± 0.10

1.00 ± 0.20

1.25 ± 0.15

1.25 ± 0.20

0.78 ± 0.20

0.90 ± 0.20

0.95 ± 0.10

1.00 ± 0.20

1.10 ± 0.20

1.20 ± 0.15

1.25 ± 0.15

1.60 ± 0.20

1.60 ± 0.25

1.60 ± 0.35

0.78 ± 0.20

0.90 ± 0.20

0.95 ± 0.20

1.00 ± 0.10

1.10 ± 0.15

1.25 ± 0.20

1.40 ± 0.15

1.55 ± 0.15

1.55 ± 0.20

1.70 ± 0.20

1.85 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.30 ± 0.10

1.50 ± 0.10

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.90 ± 0.20

1.10 ± 0.15

1.15 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

2.40 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

4,000

0

15,000

0

4,000

2,500

4,000

2,500

2,000

4,000

2,500

2,000

1,000

2,500

1,000

500

10,000

8,000

10,000

8,000

4,000

10,000

4,000

2,000

4,000

2,000

4,000

0

4,000

0

10,000

0

FA

FZ

FL

FH

FU

FM

FJ

FK

FS

LD

GB

GC

GE

GF

GG

GK

GJ

GL

HB

HC

HD

HF

JC

JD

JF

1,000

500

1,000

0

JO

KB

KC

KD

KE

0

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size1

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA

0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

0.99

1.59

2.30

2.10

2.15

2.85

1.44

1.62

1.75

1.80

2.10

1.66

2.06

3.01

2.30

3.60

6.90

5.50

6.90

4.47

5.85

5.90

7.40

7.00

7.10

8.80

2.71

3.06

4.01

3.30

4.60

7.90

6.50

7.90

0.89

1.49

2.20

2.00

2.05

2.75

1.24

1.42

1.55

1.60

1.90

1.56

1.96

2.91

2.20

3.50

6.80

5.40

6.80

3.57

4.95

6.50

6.10

6.20

7.90

2.11

2.46

3.41

2.70

4.00

7.30

5.90

7.30

0.79

1.39

2.10

1.90

1.95

2.65

1.04

1.22

1.35

1.40

1.70

1.46

1.86

2.81

2.10

3.40

6.70

5.30

6.70

2.42

4.25

5.80

5.40

5.50

7.20

1.81

2.16

3.11

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/

J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes

at these conditions.

Termination Finish

T_P

T_L

t_P

Proﬁle Feature

Maximum Ramp ꢀp Rate ꢁ 3ꢂCꢃsecond

Maximum Ramp Doꢄn Rate ꢁ 6ꢂCꢃsecond

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smax

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

t_s

3°C/second

maximum

3°C/second

maximum

Ramp-Up Rate (T_Lto T_P)

25

25ꢂC to Peaꢅ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Time

Time Within 5°C of Maximum

20 seconds

maximum

30 seconds

maximum

Peak Temperature (t_P)

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T_Pto T_L)

Time 25°C to Peak

6 minutes

maximum

8 minutes

maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Construction

Detailed Cross Section

Dielectric Material

(BaTiO₃)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Epoxy Layer

(Ag)

Dielectric

Material (BaTiO₃)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Epoxy Layer

(Ag)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Inner Electrodes

(Ni)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be

marked as an extra cost option. Marking is available

on most KEMET devices but must be requested using

the correct ordering code identiﬁer(s). If this option is

requested, two sides of the ceramic body will be laser

marked with a “K” to identify KEMET, followed by two

characters (per EIA–198 - see table below) to identify the

capacitance value. EIA 0603 case size devices are limited

to the “K” character only.

Marking appears in legible contrast. Illustrated below

is an example of an MLCC with laser marking of “KA8”,

which designates a KEMET device with rated capacitance

of 100 µF. Orientation of marking is vendor optional.

2-Digit

KEMET

Capacitance

ID

Code

Laser marking option is not available on:

• C0G, ultra stable X8R and Y5V dielectric devices.

• EIA 0402 case size devices.

• EIA 0603 case size devices with ﬂexible termination

option.

• KPS commercial and automotive grade stacked

devices.

• X7R dielectric products in capacitance values outlined

below.

EIA Case Size

Metric Size Code

Capacitance

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

≤ 170 pF

≤ 150 pF

≤ 910 pF

≤ 2,000 pF

≤ 3,900 pF

≤ 6,700 pF

≤ 0.018 µF

≤ 0.027 µF

≤ 0.033 µF

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.20

0.22

0.24

0.27

0.30

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.40

0.45

0.50

0.60

0.70

0.80

0.90

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4.0

4.5

5.0

6.0

7.0

8.0

9.0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000 100,000 1,000,000 10,000,000

11,000 110,000 1,100,000 11,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

12,000 120,000 1,200,000 12,000,000

13,000 130,000 1,300,000 13,000,000

15,000 150,000 1,500,000 15,000,000

16,000 160,000 1,600,000 16,000,000

18,000 180,000 1,800,000 18,000,000

20,000 200,000 2,000,000 20,000,000

22,000 220,000 2,200,000 22,000,000

24,000 240,000 2,400,000 24,000,000

27,000 270,000 2,700,000 27,000,000

30,000 300,000 3,000,000 30,000,000

33,000 330,000 3,300,000 33,000,000

36,000 360,000 3,600,000 36,000,000

39,000 390,000 3,900,000 39,000,000

43,000 430,000 4,300,000 43,000,000

47,000 470,000 4,700,000 47,000,000

51,000 510,000 5,100,000 51,000,000

56,000 560,000 5,600,000 56,000,000

62,000 620,000 6,200,000 62,000,000

68,000 680,000 6,800,000 68,000,000

75,000 750,000 7,500,000 75,000,000

82,000 820,000 8,200,000 82,000,000

91,000 910,000 9,100,000 91,000,000

25,000 250,000 2,500,000 25,000,000

35,000 350,000 3,500,000 35,000,000

40,000 400,000 4,000,000 40,000,000

45,000 450,000 4,500,000 45,000,000

50,000 500,000 5,000,000 50,000,000

60,000 600,000 6,000,000 60,000,000

70,000 700,000 7,000,000 70,000,000

80,000 800,000 8,000,000 80,000,000

90,000 900,000 9,000,000 90,000,000

G

H

J

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

b

d

e

f

m

n

t

y

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢊar code label

Anti-static reel

®

ꢃmbossed plasticꢄ or

punched paper carrier.

Chip and ꢇPS orientation in pocꢆet

(except ꢁꢀ25 commercial, and ꢁꢀ25 and 2225 Military)

KEMET

Sprocꢆet holes

ꢃmbossment or punched cavity

ꢀ mm, ꢁ2 mm

or ꢁ6 mm carrier tape

Anti-static cover tape

(0.ꢁ0 mm (0.00ꢅꢂ) maximum thicꢆness)

ꢁ7ꢀ mm (7.00ꢂ)

or

330 mm (ꢁ3.00ꢂ)

ꢄꢃꢈA 0ꢁ005, 020ꢁ, 0ꢅ02 and 0603 case siꢉes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

• Double the parts on each reel results in fewer reel

changes and increased eﬃciency.

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste.

KPS 1210

8

KPS 1812

and 2220

12

4

12

4

Array 0612

*Refer to Figures 1 and 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance speciﬁcations.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

T₂

P₂

ꢊꢃ0 pitches cumulative

tolerance on tape ꢋ0.2 mmꢌ

ꢆ_ꢃ

P₀

ꢅD₀

A₀

F

ꢂ₀

ꢀ

ꢆ₂

ꢁ_ꢃ

ꢁ₀

S_ꢃ

P_ꢃ

T_ꢃ

Cover Tape

ꢆmbossment

For cavity siꢇe,

see ꢈote ꢃ Table ꢉ

Center Lines of Cavity

ꢅD_ꢃ

ꢁ_ꢃis for tape feeder reference only,

includinꢄ draft concentric about ꢁ₀.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

and Double (8 mm)

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6.)

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with suﬃcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4.)

(e) for KPS product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢇꢀ0 pitches cumulative

tolerance on tape ꢈ0.2 mmꢉ

ꢂ_ꢀ

Po

ꢁDo

A₀

F

ꢃ

ꢂ₂

ꢄ₀

P^ꢀ

ꢄottom Cover Tape

G

Cavity Siꢅe,

See

T^ꢀ

Center Lines of Cavity

Top Cover Tape

ꢆote ꢀ, Table 7

ꢄottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with suﬃcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3.)

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6.)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

ꢉ₃(ꢅncludes

flanꢊe distortion

at outer edꢊe)

Access ꢂole at

Slot Location

(ꢃ ꢄ0 mm minimum)

See ꢀote

ꢉ₂(Measured at hub)

D

(See ꢀote)

A

ꢀ

C

(Arbor hole

ꢉ_ꢈ(Measured at hub)

diameter)

ꢅf present,

tape slot in core

for tape startꢆ

2.5 mm minimum ꢇidth x

ꢈ0.0 mm minimum depth

ꢁ

(see ꢀote)

ꢀoteꢆ Drive spoꢋes optionalꢌ if used, dimensions ꢁ and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/−0.2

(0.521 +0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/−0.0

(0.331 +0.059/−0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/−0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/−0.0)

(0.724)

16.4 +2.0/−0.0

(0.646 +0.078/−0.0)

22.4

(0.882)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢃmbossed Carrier

Carrier Tape

Punched Carrier

ꢆ mm ꢇ ꢀ2 mm only

Round Sprocꢁet ꢂoles

START

END

Top Cover Tape

ꢃlonꢄated Sprocꢁet ꢂoles

(32 mm tape and ꢅider)

ꢀ00 mm

minimum Leader

ꢈ00 mm minimum

Trailer

Components

ꢀ60 mm minimum

Top Cover Tape

Figure 8 – Maximum Camber

ꢄlonꢃated Sprocꢀet ꢁoles

(32 mm ꢅ ꢆider tapes)

Carrier Tape

Round Sprocꢀet ꢁoles

ꢂ mm maximum, either direction

Straiꢃht ꢄdꢃe

250 mm

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

KEMET Electronics Corporation Sales Oﬃces

For a complete list of our global sales oﬃces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.


型号：	C0603X102K1RACAUTO
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0603, CHIP 电容器
文件：	总23页 (文件大小：1490K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0603X102K1RACAUTO [KEMET]

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