C0805H223M3GACTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Temperature 200°C, C0G Dielectric, 10VDC-200VDC

(Commercial Grade)

Overview

KEMET’s high temperature surface mount C0G Multilayer

Ceramic Capacitors (MLCCs) feature a robust, proprietary base

metal dielectric system that offers industry-leading performance

relative to capacitance and case size combined with capacitance

Electronics Components, Assemblies & Materials Association

(EIA) characterizes C0G dielectric as a Class I material.

Components of this classiﬁcation are temperature compensating

and are suited for resonant circuit applications or those where

stability at extreme temperatures up to +200°C. This new platform Q and stability of capacitance characteristics are required.

promotes downsizing opportunities of existing high temperature

C0G technology, and offers replacement opportunities of existing

X7R/BX/BR technologies.

KEMET’s high temperature C0G dielectric features a 200°C

maximum operating temperature and is considered “stable.” The

C0G exhibits no change in capacitance with respect to time

and voltage and boasts a negligible change in capacitance with

reference to ambient temperature. Capacitance change is limited

to ±30ppm/ºC from -55°C to +200°C.

Beneﬁts

• No capacitance decay with time

• -55°C to +200°C operating temperature range

• Pb-Free and RoHS compliant

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated end metallization allowing for

excellent solderability

• EIA 0603, 0805, 1206, 1210, 1812 & 2220 case sizes

• DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V

• Capacitance offerings ranging from 0.5pF up to 0.47μF

• Available capacitance tolerances of ±0.25pF, ±0.5pF, ±1%,

±2%, ±5%, ±10% or ±20%

• No piezoelectric noise

• Extremely low ESR and ESL

• High thermal stability

• High ripple current capability

Applications

Typical applications include critical timing, tuning, circuits requiring

low loss, circuits with pulse, high current, decoupling, bypass,

ﬁltering, transient voltage suppression, blocking and energy

storage for use in extreme environments such as down-hole

exploration, aerospace engine compartments and geophysical

probes.

• Preferred capacitance solution at line frequencies and into the

MHz range

• No capacitance change with respect to applied rated DC voltage

• Negligible capacitance change with respect to temperature from

-55°C to +200°C

Ordering Information

C

1210

H

124

J

5

G

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance¹

Failure Rate/ End Metallization Packaging/Grade

Design

Ceramic

Voltage Dielectric

(L" x W")

Series

(Plated)²

(C-Spec)³

0603

0805

1206

1210

1812

2220

H= High Temp

(200°C)

2 Sig. Digits +

Number of Zeros

Use 9 for

1.0 - 9.9pF

Use 8 for

0.5 - .99pF

ex. 2.2pF = 229

ex. 0.5pF = 508

C = ±0.25pF

D = ±0.5pF

F = ±1%

G = ±2%

J = ±5%

8 = 10V

4 = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

G = C0G

A = N/A

C = 100% Matte Sn Blank = Bulk

L = SnPb (5% min) TU = 7" Reel

Unmarked

K = ±10%

M = ±20%

¹Additional capacitance tolerance offerings may be available. Contact KEMET for details.

²Additional termination options may be available. Contact KEMET for details.

³Additional reeling or packaging options may be available. Contact KEMET for details.

One WORLD

One Brand

One Strategy

One Focus

One Team

One KEMET

C1001-1 • 9/14/2010

1

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

100% Tin or SnPb Plate

L

Dimensions – Millimeters (Inches)

W

B

T

Nickel Plate

S

Conductive Metalization

Electrodes

EIA Size

Code

0603

Metric

Size Code

1608

Mounting

Technique

L Length

W Width

B Bandwidth

T Thickness

1.60 (.063) ± 0.15 (.006)

2.00 (.079) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012)

5.70 (.224) ± 0.40 (.016)

0.80 (.032) ± 0.15 (.006)

1.25 (.049) ± 0.20 (.008)

1.60 (.063) ± 0.20 (.008)

2.50 (.098) ± 0.20 (.008)

3.20 (.126) ± 0.30 (.012)

5.00 (.197) ± 0.40 (.016)

0.35 (.014) ± 0.15 (.006)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.35 (.014)

Solder Wave or

Solder Reﬂow

0805

2012

1206

3216

See Table 2 for

Thickness

1210

3225

Solder Reﬂow

Only

1812

4532

2220

5650

Qualiﬁcation/Certiﬁcation

Commercial grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in Table

4, Performance and Reliability.

Environmental Compliance

RoHS PRC ( Peoples Republic of China) compliant

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range:

-55°C to +200°C

Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC):

Aging Rate (Max % Cap Loss/Decade Hour):

±30PPM/ºC (up to 200ºC)

0%

250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding

50mA)

Dielectric Withstanding Voltage:

Dissipation Factor (DF) Maximum Limits @ 25ºC:

Insulation Resistance (IR) Limit @ 25°C:

Insulation Resistance (IR) Limit @ 200°C:

0.1%

1000 megohm microfarads or 100GΩ

10 megohm microfarads or 1GΩ

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and Dissipation Factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

C1001-1 • 9/14/2010

2

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Electrical Characteristics

C1210H104J1GAC - Life Test IR Distribution (Lognormal)

Delta Cap vs. Temperature (Typical)

20

15

10

5

99

0 hrs

2000 hrs

95

90

80

70

60

50

40

30

0

-5

20

-10

-15

-20

0 Vr

10

100% Vr

5

1

0.1

1.0

10.0

100.0

25°C IR (GOhms)

Temperature (ºC)

Capacitance vs. Temperature with 25V DC Bias

(Rated Voltage)

DF vs. Temperature without DC Bias.

200

1.00

0.50

0.00

-0.50

-1.00

200ºC C0G 100nF no DC

200ºC C0G MLCC 100nF

200ºC C0G 100nF 25V DC

150

100

50

0

Temperature (°C)

BME vs. PME/IR vs. Temperature with 25V DC Bias

(Rated Voltage)

IR vs. Temperature with 25V DC Bias (Rated Voltage)

1.E+08

1.E+07

1.E+06

1.E+05

1.E+04

1.E+03

1.E+02

1.E+08

1.E+07

1.E+06

1.E+05

1.E+04

1.E+03

PME C0G MLCC 1206/10nF

1.E+02

1.E+01

1.E+00

200ºC C0G MLCC 100nF

BME C0G MLCC 1206/10nF

1.E+01

Temperature (°C)

C1001-1 • 9/14/2010

3

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Table 1A – (0603 - 1210 Case Sizes)

Series

Voltage Code

Voltage VDC

Cap Tolerance

C0603

C0805

C1206

C1210

Cap

Code

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

Cap

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

0.5-0.75 pF 508-759

1.0-2.4 pF 109-249

2.7-5.1 pF 279-519

5.6-9.1 pF 569-919

C

D

CB CB CB CB CB CB DC DC DC DC DC

DC

D

DC EB EB EB EB EB

EB FB FB FB FB FB

EC FB FB FB FB FB

ED FB FB FB FB FB

EE FB FB FB FB FB

EB FB FB FB FB FB

EC FB FB FB FB FB

ED FB FB FB FB FB

ED FB FB FB FB FC

EE FB FB FB FB FC

EC FB FB FB FB FC

FB FB FB FB FC

FB

FC

FE

FG

FC

FF

FG

K

M

J

10-13 pF

15-24 pF

27-36 pF

39-51 pF

100-130

150-240

270-360

390-510

G

F

56-91 pF 560-910

100-180 pF 101-181

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

CB CB CB CB CB

CB CB CB CB

DC DC DC DC DC

DC DC DC DC DC DD EB EB EB EB EB

DC DC DC DC DC

DC EB EB EB EB EB

DC DC DC DC DD DD EB EB EB EB EB

DC DC DC DC DC

DD DD DD DD DD

DC DC DC DC DC

DD DD DD DD DC

DE DE DE DE DC

DC DC DC DC DC

EB EB EB EB EB

EB EB EB EB EC

EB EB EB EB ED

EB EB EB EB EE

EB EB EB EB EC

EC EC EC EC EC

EC EC EC EC EE

EC EC EC EC EF

EC EC EC EC EC

ED ED ED ED ED

EB EB EB EB EB

FB FB FB FB FF

FF FF FF FF FG

FB FB FB FB FG

CB CB CB CB

FB FB FB FB FG

K

CB CB CB

DC DC DC DC DC

EB EB EB EB EB

FC FC FC FC FC

C

1210

H

124

J

5

G

A

C

TU

K

EC EC EC EC EB

FC FC FC FC FC

Case Size Speciﬁcation/

(L" x W")

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/ End Metallization Packaging/Grade

F

G

J

K

M

CB CB CB

DC DC DC DC DC

EC EC EC EC EB

ED ED ED ED EB

(Plated)

FE FE FE FE FE

FF FF FF FF FF

(C-Spec)

FG FG FG FG FB

Ceramic

Voltage Dielectric

2

3

103

DC ¹DC DC DC DD

Series

Design

123

153

183

223

273

F

K

DC DC DC DC DE

EB EB EB EB EB

0603

0805

1206

1210

1812

2220

H= High Temp

2 Sig. Digits +

Number of Zeros

Use 9 for

C = ±0.25pF

8 = 10V

G = C0G

A = N/A

C = 100% Matte Sn Blank = Bulk

J

M

DC DC DC DD DG

EB EB EB EB EB

FG FG FG FG FB

L = SnPb (5% min) TU = 7” Reel

FB FB FB FB FB

(200°C)

D = ±0.5pF

4 = 16V

3 = 25V

5 = 50V

J

K

M

DC DC DC DD

EB EB EB EB EB

EB EB EB EB EC

EB EB EB EB EE

F = ±1%

Unmarked

DD DD DD DF

FB FB FB FB FB

1.0 - 9.9pF

G = ±2%

DF DF DF

FB FB FB FB FB

Use 8 for

J = ±5%

1 = 100V

Voltage VDC

0.5 - .99pF

K = ±10%

M = ±20%

2 = 200V

Cap

Code

Voltage Code

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

Cap

ex. 2.2pF = 229

ex. 0.5pF = 508

Series

C0603

C0805

C1206

C1210

UD = Under Developement

C1001-1 • 9/14/2010

4

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Table 1A con't – (0603 - 1210 Case Sizes)

Series

Voltage Code

Voltage VDC

Cap Tolerance

C0603

C0805

C1206

C1210

Cap

Code

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

Cap

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

33,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 uF

0.12 uF

0.15 uF

0.18 uF

0.22 uF

333

473

563

683

823

104

124

154

184

224

F

G

J

K

M

DG DG DG

UD UD UD

EB EB EB EB EE

EC EC EC EE EH

ED ED ED EF

EF EF EF EH

EH EH EH EH

EH EH EH

FB FB FB FB FB

FB FB FB FB FE

FB FB FB FB FF

FB FB FB FC FG

FC FC FC FF FH

FE FE FE FG FM

FG FG FG FH

FH FH FH FM

UD UD UD

Voltage VDC

Cap

Code

Voltage Code

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

Cap

Series

C0603

C0805

C1206

C1210

Table 1B – (1812 - 2220 Case Sizes)

Series

Cap

Code

C1812

C2220

Voltage Code

Voltage VDC

Cap Tolerance

1

100

2

200

5

50

1

100

Cap

See Table 2 for Chip Thickness Dimensions

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 uF

0.12 uF

0.15 uF

0.18 uF

0.22 uF

0.27 uF

0.33 uF

0.47 uF

0.56 uF

153

183

223

273

333

473

563

683

823

104

124

154

184

224

274

334

474

564

684

824

F

G

J

K

M

GB

GD

GH

GN

GB

GD

GH

GK

JG

0.68 uF

0.82 uF

J

H

C

1210

124

J

5

G

A

C

TU

Voltage VDC

Voltage Code

100

200

50

5

100

1

Cap

Case Size Speciﬁcation/

Capacitance

Failure Rate/ End Metallization Packaging/Grade

Design

1

2

Cap

Ceramic

Voltage Dielectric

C2220

(L" x W")

Series

Code (pF)

Tolerance¹

(Plated)²

(C-Spec)³

Code

Series

C1812

0603

0805

1206

1210

1812

2220

H= High Temp

(200°C)

2 Sig. Digits +

Number of Zeros

Use 9 for

1.0 - 9.9pF

Use 8 for

0.5 - .99pF

ex. 2.2pF = 229

ex. 0.5pF = 508

C = ±0.25pF

D = ±0.5pF

F = ±1%

G = ±2%

J = ±5%

8 = 10V

4 = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

G = C0G

A = N/A

C = 100% Matte Sn Blank = Bulk

L = SnPb (5% min) TU = 7” Reel

Unmarked

K = ±10%

M = ±20%

UD = Under Developement

C1001-1 • 9/14/2010

5

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Table 2 – Chip Thickness / Packaging Quantities

Thickness

Code

Chip

Size

Thickness ± Qty per Reel Qty per Reel Qty per Reel Qty per Reel Qty per Bulk

Range (mm)

7" Plastic

13" Plastic

7" Paper

13" Paper

Cassette

AA

AB

BB

CB

CC

CD

DC

DD

DL

DE

DF

DG

DH

EB

EK

EC

EN

ED

EE

EF

EM

EG

EH

EJ

FB

FC

FD

FE

FF

FG

FL

FO

FH

FP

FM

FJ

FN

FT

FK

FR

FS

PA

MA

NA

LD

LA

LB

LC

GB

GC

GD

GE

GH

GF

GG

GK

GJ

GN

GL

GM

GO

HB

HC

HD

HE

HF

HG

JB

01005

0201

0402

0603

0805

1206

1210

1220

1632

1706

1808

1812

1825

2220

2225

0.20 ± 0.02

0.30 ± 0.03

0.50 ± 0.05

0.80 ± 0.07

0.80 ± 0.10

0.80 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.25 ± 0.20

0.78 ± 0.10

0.80 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

1.25 ± 0.15

1.60 ± 0.15

1.60 ± 0.20

1.70 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.50 ± 0.20

1.55 ± 0.15

1.60 ± 0.20

1.70 ± 0.20

1.85 ± 0.20

1.90 ± 0.20

2.10 ± 0.20

2.25 ± 0.20

2.50 ± 0.20

0.80 ± 0.10

0.90 ± 0.10

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.30 ± 0.10

1.40 ± 0.15

1.50 ± 0.10

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

1.90 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.10 ± 0.15

1.15 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.60 ± 0.20

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.60 ± 0.20

1.70 ± 0.15

1.80 ± 0.15

2.40 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

15000

10000

4000

50000

10000

50000

15000

4000

2500

4000

2000

4000

2500

2000

4000

2500

2000

1500

2000

1000

4000

2500

1000

500

10000

8000

10000

8000

10000

8000

4000

8000

4000

10000

4000

2000

4000

2000

4000

10000

Package Quantity

Based on Finished Chip

Thickness Speciﬁcations

1000

500

JC

JD

JE

JF

JP

JG

JH

JO

KB

KC

KD

KE

KF

1000

C1001-1 • 9/14/2010

6

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle

• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.90

1.00

1.60

2.30

2.15

2.75

2.70

1.15

1.35

1.75

1.60

1.70

1.10

1.55

1.90

2.80

2.30

3.60

6.90

5.50

6.90

4.00

4.40

5.60

5.65

7.40

6.90

8.20

8.10

2.10

2.60

2.90

3.80

3.30

4.60

7.90

6.50

7.90

0.80

0.90

1.50

2.20

2.05

2.65

2.60

0.95

1.15

1.55

1.40

1.50

1.00

1.45

1.80

2.70

2.20

3.50

6.80

5.40

6.80

3.10

3.50

4.70

6.50

6.00

7.30

7.20

1.50

2.00

2.30

3.20

2.70

4.00

7.30

5.90

7.30

0.60

0.75

1.40

2.10

1.95

2.55

2.50

0.75

0.95

1.35

1.20

1.30

0.90

1.35

1.70

2.60

2.10

3.40

6.70

5.30

6.70

2.40

2.80

4.00

5.80

5.30

6.60

6.50

1.20

1.70

2.00

2.90

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

C1001-1 • 9/14/2010

7

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Product Qualiﬁcation Test Plan

Reliability/Environmental Tests per MIL-STD-202//JESD22

High Temperature Life

Load Humidity

200°C, Rated Voltage, 2000 Hours

85°C /85%RH, Rated Voltage, 1000 Hours

85°C /85%RH, 1.5V, 1000 Hours

Low Voltage Humidity

Temperature Cycling

Thermal Shock

-55°C to +200°C, 50 Cycles

-55°C to +150°C, 20s transfer, 15 min dwell, 300 Cycles

Cycled Temp/RH. 0V, 10 cycles @ 24 Hours each

Moisture Resistance

Physical, Mechanical & Process Tests per MIL-STD 202/JIS-C-6429

Resistance to Solvents

Include Aqueous wash chemical - OKEM Clean or equivalent

Method 213: Figure 1, Condition F Method 204: 5gs for 20min, 12 cycles

Condition B, no per-heat of samples, Single Wave Solder

Force of 1.8 kg for 60 seconds

Mechanical Shock and Vibration

Resistance to Soldering Heat

Terminal Strength

Board Flex

3mm minimum

C1001-1 • 9/14/2010

8

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers Multilayer Ceramic Chip Capacitors packaged in

8mm, 12mm and 16mm tape on 7" and 13" reels in accordance

with EIA standard 481. This packaging system is compatible with

all tape fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8mm, 12mm

or 16mm Carrier Tape

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

178mm (7.00")

or

330mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration (mm)

EIA Case Size

Tape size (W)*

Pitch (P₁)*

01005 - 0402

0603 - 1210

8

2

4

1805 - 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figure 1 for W and P₁carrier tape reference locations.

*Refer to Table 6 for tolerance speciﬁcations.

C1001-1 • 9/14/2010

9

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ±0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 6

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Min.

Note 1

1.0

R Ref.

Note 2

25.0

S₁Min.

Note 3

Tape Size

8mm

D₀

E₁

P₀

P₂

T Max. T₁Max.

(0.039)

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ± 0.10

4.0 ± 0.10

2.0 ± 0.05

0.600

(0.024)

0.600

(0.024) (0.004)

0.100

12mm

(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)

1.5

30

(0.059)

(1.181)

16mm

Variable Dimensions — Millimeters (Inches)

B₁Max.

Note 4

4.35

(0.171)

8.2

(0.323)

12.1

(0.476)

Tape Size

8mm

Pitch

E₂Min.

F

P₁

T₂Max

W Max

A₀,B₀& K₀

Note 5

6.25

(0.246)

10.25

(0.404)

14.25

3.5 ± 0.05

4.0 ± 0.10

2.5

(0.098)

4.6

(0.181)

4.6

8.3

(0.327)

12.3

(0.484)

16.3

Single (4mm)

(0.138 ± 0.002) (0.157 ± 0.004)

5.5 ± 0.05 8.0 ± 0.10

(0.217 ± 0.002) (0.315 ± 0.004)

5.5 ± 0.05 8.0 ± 0.10

(0.217 ± 0.002) (0.315 ± 0.004)

Single (4mm) &

Double (8mm)

12mm

16mm

Triple (12mm)

(0.561)

(0.181)

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 5).

3. If S₁<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).

(e) for KPS Series product A₀and B₀are measured on a plane 0.3mm above the bottom of the pocket.

(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

C1001-1 • 9/14/2010

10

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ±0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Ref.

Note 2

25

Tape Size

8mm

D₀

E₁

P₀

P₂

T₁Max

G Min

1.5 +0.10-0.0

(0.059 +0.004, -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(.004) Max.

0.75

(.030)

(.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8mm

Pitch

E2 Min

F

P₁

T Max

W Max

A₀B₀

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.10

8.3

(0.327)

8.3

Half (2mm)

6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

1.1

(0.098)

Note 5

8mm

Single (4mm)

(0.157 ± 0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 5).

C1001-1 • 9/14/2010

11

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

Peel Strength

8mm

0.1 Newton to 1.0 Newton (10g to 100g)

0.1 Newton to 1.3 Newton (10g to 130g)

12mm & 16mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the

carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16-200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16-56

72-200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

8mm & 12mm Tape

16mm Tape

0.5 mm maximum

1.0 mm maximum

0.5 mm maximum

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

R

Bending

Radius

R

C1001-1 • 9/14/2010

12

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Figure 6 – Reel Dimensions

Full Radius,

See Note

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm min.)

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm min. width x

10.0 mm min. depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric Dimensions Will Govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8mm

A

B Min

C

D Min

178 ± 0.20

(7.008 ± 0.008)

or

330 ± 0.20

(13.000 ± 0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12mm

16mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8mm

N Min

W₁

W₂Max

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

12.4 +2.0/-0.0

(0.488 +0.078/-0.0)

16.4 +2.0/-0.0

14.4

(0.567)

18.4

(0.724)

22.4

50

(1.969)

Shall accommodate tape width

without interference

12mm

16mm

(0.646 +0.078/-0.0)

(0.882)

C1001-1 • 9/14/2010

13

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Punched Carrier

8 mm & 12 mm only

Round Sprocket Holes

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm Min.

Leader

Trailer

160 mm minimum,

Components

400 mm Minimum,

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

C1001-1 • 9/14/2010

14

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)

Meets Dimensional Requirements IEC-286 and EIAJ 7201

Unit mm *Reference

53 3*

10*

1.5 ± ⁰₀^.1

2.0 ± ₀⁰_.1

3.0 ± ⁰₀^.2

5 0*

110 ± 0.7

Table 9 – Capacitor Dimensions for Bulk Cassette

Cassette Packaging – Millimeters

EIA Size Metric Size

S Separation

minimum

0.3

Number of

Pcs/Cassette

L Length

W Width

B Bandwidth

T Thickness

Code

0402

1005

1.0 ± 0.05

1.6 ± 0.07

0.5 ± 0.05

0.8 ± 0.07

0.2 to 0.4

0.2 to 0.5

0.5 ± .05

0.8 ± .07

50,000

0603

1608

0.7

15,000

Table 10 – Capacitor Marking

Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to

identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any

Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)

Numeral

Alpha

Character

Capacitance (pF) For Various Numeral Identiﬁers

9

0

1

2

3

4

5

6

7

A

B

C

D

E

F

G

H

J

0.1

1

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1000

1100

1200

1300

1500

1600

1800

2000

2200

2400

2700

3000

3300

3600

3900

4300

4700

5100

5600

6200

6800

7500

8200

9100

2500

3500

4000

4500

5000

6000

7000

8000

9000

10000

11000

12000

13000

15000

16000

18000

20000

22000

24000

27000

30000

33000

36000

39000

43000

47000

51000

56000

62000

68000

75000

82000

91000

25000

35000

40000

45000

50000

60000

70000

80000

90000

100000

110000

120000

130000

150000

160000

180000

200000

220000

240000

270000

300000

330000

360000

390000

430000

470000

510000

560000

620000

680000

750000

820000

910000

250000

350000

400000

450000

500000

600000

700000

800000

900000

1000000

1100000

1200000

1300000

1500000

1600000

1800000

2000000

2200000

2400000

2700000

3000000

3300000

3600000

3900000

4300000

4700000

5100000

5600000

6200000

6800000

7500000

8200000

9100000

2500000

3500000

4000000

4500000

5000000

6000000

7000000

8000000

9000000

10000000

11000000

12000000

13000000

15000000

16000000

18000000

20000000

22000000

24000000

27000000

30000000

33000000

36000000

39000000

43000000

47000000

51000000

56000000

62000000

68000000

75000000

82000000

91000000

25000000

35000000

40000000

45000000

50000000

60000000

70000000

80000000

90000000

0.11

0.12

0.13

0.15

0.16

0.18

0.2

0.22

0.24

0.27

0.3

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

1.1

1.2

1.3

1.5

1.6

1.8

2

2.2

2.4

2.7

3

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4

Example shown is 1,000 pF capacitor

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

b

d

e

f

m

n

t

0.45

0.5

0.6

0.7

0.8

4.5

5

6

7

8

y

0.9

9

C1001-1 • 9/14/2010

15

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

Search Our FAQs: KnowledgeEdge

Product Information

Resource

Products

Location

http://www.kemet.com/products

Technical Resources (Including Soldering

Techniques)

http://www.kemet.com/technicalpapers

RoHS Statement

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

Sample Request

Engineering Kit Request

http://www.kemet.com/sample

http://www.kemet.com/kits

Contact

Resource

Website

Location

www.kemet.com

Contact Us

Investor Relations

Call Us

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

C1001-1 • 9/14/2010

16

Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)

KEMET Corporation

Europe

20-21 Cumberland Drive

Granby Industrial Estate

Weymouth, Dorset DT4 9TE

United Kingdom

Tel: 44-1305-830747

Fax: 44-1305-760670

Room 305, Floor 3, #142

Sec. 4, Chung Hsiao East Road

Taipei 106

Taiwan ROC

Tel: 886-2-27528585

Fax: 886-2-27213129

Southern Europe

15bis chemin des Mines, 4th ﬂoor

1202 Geneva

World Headquarters

P.O. Box 5928

Greenville, SC 29606

2835 KEMET Way

Simpsonville, SC 29681

www.kemet.com

Switzerland

Tel: 41-22-715-0100

Fax: 41-22-715-0170

Tel: 864-963-6300

Fax: 864-963-6521

Thörnblads Väg 6

Färjestaden 386 90

Sweden

Tel: 46-485-563934

Fax: 46-485-563938

Southeast Asia

73 Bukit Timah Road

#05-01 Rex House

229832 Singapore

Tel: 65-6586-1900

Fax: 65-6586-1901

Zac Paris Rive Gauche

118-122 avenue de France

75013 Paris

France

Tel: 33-1-4646-1009

Fax: 33-1-4646-1599

North America

Corporate Ofﬁces

101 NE Third Avenue

Tower 101, Suite 1700

Fort Lauderdale, FL 33301

Tel: 954-766-2800

Stella Business Park

Lars Sonckin kaari 16

Espoo 02600

Finland

Tel: 358-9-5406-5000

Fax: 358-9-5406-5010

1-5-20 Krystal Point 2

Lebuh Bukit Kecil 6

11900 Bayan Baru

Penang

Malaysia

Tel: 6- 04-6430200

Fax: 6 -04-6444220

Via San Lorenzo 19

Sasso Marconi, BO

40037

Fax: 954-766-2805

Italy

Tel: 39-051-939111

Fax: 39-051-840684

Southeast

801 International Parkway, Suite 5070

Lake Mary, FL 32746

Tel: 407-855-8886

Asia

Viale Milanoﬁori 1

Palazzo E1

20090 Assago

Milano

Northeast Asia

30 Canton Road, Room 1512

Silvercord Tower II

Tsimshatshui, Kowloon

Hong Kong

Ofﬁce No. 605, 6th Floor

Barton Centre M.G. Road

Bangalore 560 001

India

Tel: 91-80-653-76817

Fax: 91-80-2532-0160

Northeast

340-X Fordham Road

Wilmington, MA 01887

Tel: 978-658-1663

Fax: 978-658-1790

Italy

Tel: 39-02-57518176

Fax: 39-02-57512093

Tel: 852-2305-1168

Fax: 852-2759-0345

Room 1411, 14/F New China

Insurance Ediﬁce

Mintian Road, CBD Futian District

Shenzhen 518001

Central Europe

Hermann-Koehl-Str. 2

Landsberg am Lech

86899 Germany

Tel: 49-8191-3350800

Fax: 49-8191-3350990

Central

1900 North Roselle Road, Suite 405

Schaumburg, IL 60195

Tel: 847-882-3590

China

Fax: 847-882-3046

Tel: 1-867-55-25181306

Fax: 1-867-55-25181307

West

Ruhrallee 9

Dortmund

44139 Germany

Tel: 49-2307-3619672

Fax: 49-2307-961527

Floor 17, Tower B, Ping An IFC

No.1-3 Xin Yuan South Road

Chao Yang District

Beijing 100027

1551 McCarthy Boulevard, Suite 117

Milpitas, CA 95035

Tel: 408-433-9946

Fax: 408-433-9946

China

Tel: 86-10-5829-1711

Fax: 86-10-5829-1963

Mexico

Northern Europe

Unit 1, Ducketts Wharf

South Street

Bishops Stortford

Hertfordshire CM23 3AL

United Kingdom

Tezozomoc No. 47

Col. Ciudad del Sol

Zapopan, Jalisco C.P. 45050

Mexico

Room 2602, Grand Gateway Tower 1

No.1 Hong Qiao Road

Shanghai 200030

China

Tel: 86-21-6447-0707

Fax: 86-21-6447-0070

Tel: 52-33-3123-2141

Fax: 52-33-3123-2144

Tel: 44-1279-757201

Fax: 44-1279-465237

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1001-1 • 9/14/2010

17


型号：	C0805H223M3GACTU
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.022uF, Surface Mount, 0805, CHIP 电容器
文件：	总17页 (文件大小：1774K)
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C0805H223M3GACTU [KEMET]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E