C0805Y104M9RACTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination

System (FF-CAP), X7R Dielectric, 6.3 – 250 VDC

(Commercial & Automotive Grade)

Overview

KEMET’s Floating Electrode with Flexible Termination

capacitor (FF-CAP) combines two existing KEMET

technologies– Floating Electrode and Flexible Termination.

The ﬂoating electrode component utilizes a cascading

internal electrode design conﬁgured to form multiple

capacitors in series within a single monolithic structure.

This unique conﬁguration results in enhanced voltage and

ESD performance over standard capacitor designs while

allowing for a fail-open condition if mechanically damaged

(cracked). The ﬂexible termination component utilizes a

conductive silver epoxy between the base metal and nickel

barrier layers of KEMET’s standard termination system

in order to establish pliability while maintaining terminal

strength, solderability and electrical performance. Both

technologies address the primary failure mode of MLCCs–

ﬂex cracks, which are typically the result of excessive

tensile and shear stresses produced during board ﬂexure

and thermal cycling.

The FF-CAP complements KEMET’s Open Mode, Floating

Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET

Power Solutions (KPS) product lines by providing an ultimate

fail-safe design optimized for low to mid range capacitance

values. These devices exhibit a predictable change in

capacitance with respect to time and voltage and boast a

minimal change in capacitance with reference to ambient

temperature. Capacitance change is limited to ±15% from

−55°C to +125°C.

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive

Electronics Council's AEC–Q200 qualiﬁcation requirements.

Although neither technology can eliminate the potential for

mechanical damage that may propagate during extreme

environmental and/or handling conditions, the combination

of these two technologies provide the ultimate level of

protection against a low IR or short circuit condition.

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Ordering Information

C

0805

Y

104

K

5

R

A

C

TU

Case Size Speciﬁcation/ Capacitance

Capacitance Rated Voltage

Failure Rate/

Design

Packaging/

Grade (C-Spec)

Ceramic

Dielectric

R = X7R

Termination Finish¹

(L" x W")

Series

Code (pF)

Tolerance

(VDC)

0603

0805

1206

1210

1812

Y = Floating Two signiﬁcant

J = ±5%

K = ±10%

M = ±20%

9 = 6.3

8 = 10

4 = 16

A = N/A

C = 100% Matte Sn

L = SnPb (5% Pb

minimum)

See

"Packaging

C-Spec

Ordering

Options

Table" below

Electrode

with

digits + number

of zeros

Flexible

Termination

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

¹SnPb termination ﬁnish option is not available on automotive grade product.

One world. One KEMET

C1015_X7R_FF-CAP_SMD • 10/14/2016

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type

Ordering Code (C-Spec)

Commercial Grade¹

Bulk Bag

Not Required (Blank)

TU

7" Reel/Unmarked

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Marked

TM

7040 (EIA 0603 and smaller case sizes)

7215 (EIA 0805 and larger case sizes)

13" Reel/Marked

7" Reel/Unmarked/2 mm pitch²

13" Reel/Unmarked/2 mm pitch²

7081

7082

Automotive Grade³

7" Reel

AUTO

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Unmarked/2 mm pitch²

13" Reel/Unmarked/2 mm pitch²

3190

3191

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked.

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

³Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information".

³For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

³All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For

more information see "Capacitor Marking".

Beneﬁts

• −55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5 mm)

• Floating Electrode/fail open design

• Low to mid capacitance ﬂex mitigation

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, and 1812 case sizes

• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

• Capacitance offerings ranging from 180 pF to 0.22 μF

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Commercial & Automotive (AEC–Q200) grades available

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• SnPb termination ﬁnish option available upon request

(5% Pb minimum)

Applications

Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits

without (integrated) current limitation and any application that is subject to high levels of board ﬂexure or temperature

cycling. Examples include raw power input side ﬁltering (power plane/bus), high current applications (automobile battery

line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive,

aerospace and telecom.

C1015_X7R_FF-CAP_SMD • 10/14/2016

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. These products are supported by a Product Change Notiﬁcation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,

“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive

grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or speciﬁcation for review

by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers

and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are

limited (see details below).

Product Change Notiﬁcation (PCN)

The KEMET Product Change Notiﬁcation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, ﬁt, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

Customer Notiﬁcation due to:

KEMET Automotive

C-Spec

Days prior to

implementation

Process/Product change

Obsolescence*

KEMET assigned¹

AUTO

Yes (with approval and sign off)

Yes (without approval)

Yes

180 days Minimum

90 days Minimum

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design record and speciﬁcation requirements are properly

understood and

fulﬁlled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part

PPAP (Product Part Approval Process) Level

KEMET Automotive

C-Spec

1

●

○

2

3

●

○

4

5

KEMET assigned¹

AUTO

●

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

● Part Number speciﬁc PPAP available

○ Product family PPAP only

C1015_X7R_FF-CAP_SMD • 10/14/2016

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

L

ꢁ

T

ꢀ

S

EIA Size

Code

Metric Size

Code

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

1.60 (0.063)

±0.17 (0.007)

2.00 (0.079)

±0.30 (0.012)

3.30 (0.130)

±0.40 (0.016)

3.30 (0.130)

±0.40 (0.016)

4.50 (0.178)

±0.40 (0.016)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

±0.30 (0.012)

1.60 (0.063)

±0.35 (0.013)

2.60 (0.102)

±0.30 (0.012)

3.20 (0.126)

±0.30 (0.012)

0.45 (0.018)

±0.15 (0.006)

0.50 (0.02)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.70 (0.028)

±0.35 (0.014)

0603

0805

1206

1210

1812

1608

2012

3216

3225

4532

0.58 (0.023)

Solder Wave or

Solder Reﬂow

0.75 (0.030)

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are

referenced in Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination ﬁnish option).

C1015_X7R_FF-CAP_SMD • 10/14/2016

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

±15%

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC)

¹Aging Rate (Maximum % Capacitance Loss/Decade Hour)

²Dielectric Withstanding Voltage (DWV)

3.0%

250% of rated voltage

(5±1 seconds and charge/discharge not exceeding 50mA)

³Dissipation Factor (DF) Maximum Limit at 25°C

5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120±5 seconds at 25°C)

⁴Insulation Resistance (IR) Minimum Limit at 25°C

¹Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

> 25

16/25

< 16

Capacitance Dissipation Factor Capacitance

Insulation

Dielectric

X7R

Value

(Maximum %)

Shift

Resistance

3.0

5.0

7.5

10% of Initial

Limit

All

±20%

Insulation Resistance Limit Table (X7R Dielectric)

1,000 Megohm

EIA Case Size

500 Megohm

Microfarads or 10 GΩ

Microfarads or 100 GΩ

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

< 0.012 µF

< 0.047 µF

< 0.15 µF

< 0.47 µF

< 0.39 µF

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.15 µF

≥ 0.47 µF

≥ 0.39 µF

N/A

< 2.2 µF

ALL

≥ 2.2 µF

N/A

< 10 µF

ALL

≥ 10 µF

N/A

C1015_X7R_FF-CAP_SMD • 10/14/2016

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 0805 Case Sizes)

Case Size/

C0603Y

Series

C0805Y

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

Capacitance

Code

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

J

K

M

CJ

DR

DD

DG

DR

DD

DG

DR

DD

DG

DR

DD

DG

DR

DD

DG

DR

DD

DR

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

Rated Voltage

(VDC)

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

Capacitance

Capacitance Code

Case Size/Series

C0603Y

C0805Y

C1015_X7R_FF-CAP_SMD • 10/14/2016

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1206 – 1812 Case Sizes)

Case Size/

Series

Voltage Code

C1206Y

C1210Y

C1812Y

Cap

Code

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

3

5

1

2

A

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

J

K

M

EQ

ER

EQ

ER

EQ

ER

EQ

ER

EQ

ER

EQ

ER

EQ

FN

FQ

FN

FQ

FN

FQ

FN

FQ

FX

FN

FQ

FN

FN GB GB GB GB GB

FN FN

FN

FQ

FN

FQ

GB GB GB GB GB

0.12 µF

0.15 µF

0.18 µF

0.22 µF

Rated Voltage

(VDC)

Voltage Code

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

3

5

1

2

A

Capacitance Cap Code

Case Size/

Series

C1206Y

C1210Y

C1812Y

C1015_X7R_FF-CAP_SMD • 10/14/2016

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹Range (mm)

CJ

DR

DD

DG

EQ

ER

FN

FQ

FX

GB

0603

0805

1206

1210

1812

0.80 ± 0.15

0.78 ± 0.20

0.90 ± 0.10

1.25 ± 0.15

0.78 ± 0.20

0.90 ± 0.20

0.78 ± 0.20

0.90 ± 0.20

0.95 ± 0.20

1.00 ± 0.10

4,000

0

15,000

0

4,000

2,500

4,000

1,000

10,000

4,000

10,000

0

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA

0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

Packaging C-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The

15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

C1015_X7R_FF-CAP_SMD • 10/14/2016

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1812

1608

2012

3216

3225

4532

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

0.99

1.59

2.10

1.44

1.62

1.80

1.66

2.06

3.01

3.60

4.47

5.85

5.90

7.00

2.71

3.06

4.01

4.60

0.89

1.49

2.00

1.24

1.42

1.60

1.56

1.96

2.91

3.50

3.57

4.95

6.10

2.11

2.46

3.41

4.00

0.79

1.39

1.90

1.04

1.22

1.40

1.46

1.86

2.81

3.40

2.42

4.25

5.40

1.81

2.16

3.11

3.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

ꢁꢂ

ꢀ

ꢁꢃ

X

C

Grid Placement Courtyard

C1015_X7R_FF-CAP_SMD • 10/14/2016

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/

J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes

at these conditions.

Termination Finish

T_P

T_L

t_P

Proﬁle Feature

Maximum Ramp ꢂp Rate ꢃ ꢄꢅCꢆsec

Maximum Ramp Down Rate ꢃ ꢇꢅCꢆsec

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smax

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

3°C/second

60 – 120 seconds

3°C/second

t_s

Ramp-Up Rate (T_Lto T_P)

maximum

ꢀꢁ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

ꢀꢁꢅC to Peaꢈ

Time

Time Within 5°C of Maximum

20 seconds

maximum

30 seconds

maximum

Peak Temperature (t_P)

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T_Pto T_L)

Time 25°C to Peak

6 minutes

maximum

8 minutes

maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1015_X7R_FF-CAP_SMD • 10/14/2016 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 at 260°C

1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.

Measurement at 24 hours +/− 4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/− 4 hours after test conclusion.

MIL–STD–202 Method

103

MIL–STD–202 Method

t = 24 hours/cycle. Steps 7a and 7b not required.

Moisture Resistance

Thermal Shock

Measurement at 24 hours +/− 4 hours after test conclusion.

106

MIL–STD–202 Method

−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20

seconds, dwell time – 15 minutes. Air – Air.

107

MIL–STD–202 Method

108

High Temperature Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

/EIA–198

MIL–STD–202 Method

108

Storage Life

Vibration

150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7

secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz

MIL–STD–202 Method

204

MIL–STD–202 Method

Mechanical Shock

Figure 1 of Method 213, Condition F.

213

MIL–STD–202 Method

215

Resistance to Solvents

Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

C1015_X7R_FF-CAP_SMD • 10/14/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Construction

Detailed Cross Section

Dielectric Material

(BaTiO₃)

Barrier Layer

(Ni)

End Termination/

External Electrode

(Cu)

Termination Finish

(100% Matte Sn /

Epoxy Layer

(Ag)

SnPb - 5% Pb min)

Dielectric Material

(BaTiO₃)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Epoxy Layer

(Ag)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Inner Electrodes

(Ni)

C1015_X7R_FF-CAP_SMD • 10/14/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be

marked as an extra cost option. Marking is available

on most KEMET devices but must be requested using

the correct ordering code identiﬁer(s). If this option is

requested, two sides of the ceramic body will be laser

marked with a “K” to identify KEMET, followed by two

characters (per EIA–198 - see table below) to identify the

capacitance value. EIA 0603 case size devices are limited

to the “K” character only.

• X7R dielectric products in capacitance values outlined

below

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

ꢂ-Digit

ꢀEMET

Capacitance

ꢁD

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

Code

• EIA 0603 case size devices with Flexible Termination

option.

• KPS Commercial and Automotive Grade stacked devices.

EIA Case Size

Metric Size Code

Capacitance

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

≤ 170 pF

≤ 150 pF

≤ 910 pF

≤ 2,000 pF

≤ 3,900 pF

≤ 6,700 pF

≤ 0.018 µF

≤ 0.027 µF

≤ 0.033 µF

C1015_X7R_FF-CAP_SMD • 10/14/2016 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000 100,000 1,000,000 10,000,000

11,000 110,000 1,100,000 11,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

12,000 120,000 1,200,000 12,000,000

13,000 130,000 1,300,000 13,000,000

15,000 150,000 1,500,000 15,000,000

16,000 160,000 1,600,000 16,000,000

18,000 180,000 1,800,000 18,000,000

20,000 200,000 2,000,000 20,000,000

22,000 220,000 2,200,000 22,000,000

24,000 240,000 2,400,000 24,000,000

27,000 270,000 2,700,000 27,000,000

30,000 300,000 3,000,000 30,000,000

33,000 330,000 3,300,000 33,000,000

36,000 360,000 3,600,000 36,000,000

39,000 390,000 3,900,000 39,000,000

43,000 430,000 4,300,000 43,000,000

47,000 470,000 4,700,000 47,000,000

51,000 510,000 5,100,000 51,000,000

56,000 560,000 5,600,000 56,000,000

62,000 620,000 6,200,000 62,000,000

68,000 680,000 6,800,000 68,000,000

75,000 750,000 7,500,000 75,000,000

82,000 820,000 8,200,000 82,000,000

91,000 910,000 9,100,000 91,000,000

25,000 250,000 2,500,000 25,000,000

35,000 350,000 3,500,000 35,000,000

40,000 400,000 4,000,000 40,000,000

45,000 450,000 4,500,000 45,000,000

50,000 500,000 5,000,000 50,000,000

60,000 600,000 6,000,000 60,000,000

70,000 700,000 7,000,000 70,000,000

80,000 800,000 8,000,000 80,000,000

90,000 900,000 9,000,000 90,000,000

G

H

J

0.22

0.24

0.27

0.3

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1015_X7R_FF-CAP_SMD • 10/14/2016 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢐar Code Label

Anti-Static Reel

®

Embossed Plasticꢈ or

Punched Paper Carrierꢄ

Chip and ꢋPS ꢌrientation in Pocꢊet

(except ꢁꢀꢂꢍ Commercial, and ꢁꢀꢂꢍ and ꢂꢂꢂꢍ Military)

KEMET

Sprocꢊet ꢑoles

Embossment or Punched Cavity

ꢀ mm, ꢁꢂ mm

or ꢁꢃ mm Carrier Tape

Anti-Static Cover Tape

(ꢄꢁꢅ mm (ꢄꢅꢅꢉꢆ) Maximum Thicꢊness)

ꢁ7ꢀ mm (7ꢄꢅꢅꢆ)

or

ꢇꢇꢅ mm (ꢁꢇꢄꢅꢅꢆ)

ꢈEꢎA ꢅꢁꢅꢅꢍ, ꢅꢂꢅꢁ, ꢅꢉꢅꢂ and ꢅꢃꢅꢇ case siꢏes available on punched paper carrier onlyꢄ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs

• Double the parts on each reel results in fewer reel

changes and increased efﬁciency

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1015_X7R_FF-CAP_SMD • 10/14/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P ꢄ

ꢉꢃꢊ pitches cumulative

tolerance on tape ꢋ ꢊꢌꢄ mmꢍ

ꢄ

E

ꢃ

Po

ꢅDo

Ao

F

ꢂo

ꢀ

E

ꢄ

ꢁ

ꢃ

ꢁo

S

ꢃ

P

ꢃ

T

ꢃ

Embossment

For cavity siꢆe,

see ꢇote ꢃ Table ꢈ

Center Lines of Cavity

ꢅD

ꢃ

Cover Tape

is for tape feeder reference only,

including draft concentric about ꢁ

ꢁ

ꢃ

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-

0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

(0.024)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1015_X7R_FF-CAP_SMD • 10/14/2016 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢈꢀꢄ pitches cumulative

E^ꢀ

Po

ꢁDo

tolerance on tape ꢉ ꢄꢊꢂ mmꢋ

A^ꢄ

F

ꢃ

E^ꢂ

ꢅ^ꢄ

ꢅottom Cover Tape

P^ꢀ

G

Cavity Siꢆe,

See

T^ꢀ

Center Lines of Cavity

Top Cover Tape

ꢇote ꢀ, Table 7

ꢅottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

8 mm

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1015_X7R_FF-CAP_SMD • 10/14/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocꢈet Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

ꢁ,ꢂꢃ

ꢂꢅ ꢆ ꢃꢄꢄ

ꢃꢄ

ꢂꢄ

ꢀo

Tape

Maximum

°

S

Width (mm) Rotation (

)

ꢁ,ꢂꢃ

ꢂꢅ ꢆ ꢇꢅ

7ꢃ ꢆ ꢃꢄꢄ

ꢃꢄ

ꢂꢄ

ꢇ

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

ꢃ mm & ꢄꢅ mm Tape

ꢄꢆ mm Tape

ꢀꢁꢂ mm maximum

ꢄꢁꢀ mm maximum

R

ꢀending

Radius

R

C1015_X7R_FF-CAP_SMD • 10/14/2016 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

See ꢀote

ꢌꢍ (ꢆncludes

Access ꢂole at

Slot Location

(ꢃ ꢄꢅ mm minimum)

flange distortion

at outer edge)

ꢌꢈ (Measured at hub)

D

(See ꢀote)

A

ꢀ

C

(Arbor hole

ꢌꢋ (Measured at hub)

diameter)

ꢆf present,

tape slot in core

for tape startꢇ

ꢈꢉꢊ mm minimum width x

ꢋꢅꢉꢅ mm minimum depth

ꢁ

(see ꢀote)

ꢀoteꢇ Drive spoꢎes optionalꢏ if used, dimensions ꢁ and D shall applyꢉ

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

8 mm

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1015_X7R_FF-CAP_SMD • 10/14/2016 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Punched Carrier

ꢇ mm & ꢀꢆ mm only

Round Sprocꢃet ꢄoles

START

END

Top Cover Tape

Elongated Sprocꢃet ꢄoles

(ꢅꢆ mm tape and wider)

ꢀꢂꢂ mm

Minimum Leader

ꢈꢂꢂ mm Minimum

Trailer

Components

ꢀꢁꢂ mm Minimum

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocꢀet holes

(ꢆꢃ mm & wider tapes)

Carrier Tape

Round Sprocꢀet ꢁoles

ꢂ mm Maximum, either direction

Straight Edge

ꢃꢄꢅ mm

C1015_X7R_FF-CAP_SMD • 10/14/2016 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

KEMET Electronic Corporation Sales Ofﬁces

For a complete list of our global sales ofﬁces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1015_X7R_FF-CAP_SMD • 10/14/2016 21


型号：	C0805Y104M9RACTU
厂家：	KEMET CORPORATION
描述：	Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial & Automotive Grade)
文件：	总21页 (文件大小：1647K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0805Y104M9RACTU [KEMET]

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