C1206C104Z5VAC7800 [KEMET]

Capacitor, Ceramic, Chip, General Purpose, 0.1uF, 50V, +80-20%, Y5V, 1206 (3216 mm), Sn/NiBar, -30º ~ +85ºC, 7" Reel/Unmarked;
C1206C104Z5VAC7800
型号: C1206C104Z5VAC7800
厂家: KEMET CORPORATION    KEMET CORPORATION
描述:

Capacitor, Ceramic, Chip, General Purpose, 0.1uF, 50V, +80-20%, Y5V, 1206 (3216 mm), Sn/NiBar, -30º ~ +85ºC, 7" Reel/Unmarked

文件: 总17页 (文件大小:811K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Overview  
KEMET’s Y5V dielectric features an 85°C maximum operating  
capacitance with respect to time and voltage and displays wide  
temperature and is considered “general-purpose.” The Electronics variations in capacitance with reference to ambient temperature.  
Components, Assemblies & Materials Association (EIA)  
Capacitance change is limited to +22%, -82% from -30°C to  
+85°C.  
characterizes Z5U dielectric as a Class III material. Components  
of this classification are fixed, ceramic dielectric capacitors suited  
for bypass and decoupling or other applications in which dielectric  
losses, high insulation resistance and capacitance stability are  
not of major importance. Y5V exhibits a predictable change in  
Benefits  
Applications  
Typical applications include limited temperature, decoupling and  
bypass.  
• -30°C to +85°C operating temperature range  
• Pb-Free and RoHS compliant  
• EIA 0402, 0603, 0805, 1206, and 1210 case sizes  
• DC voltage ratings of 6.3V, 10V, 16V, 25V and 50V  
• Capacitance offerings ranging from .022μF to 22μF  
• Available capacitance tolerance of +80%-20%  
• Non-polar device, minimizing installation concerns  
• 100% pure matte tin-plated termination finish that allowing for  
excellent solderability  
Ordering Information  
C
1210  
C
226  
Z
4
V
A
C
TU  
Case Size Specification/  
Capacitance  
Code (pF)  
Capacitance  
Tolerance  
Failure Rate/  
Design  
Packaging/Grade  
(C-Spec)2  
Ceramic  
Voltage Dielectric  
Termination Finish2  
(L" x W")  
Series  
0402  
0603  
0805  
1206  
1210  
C = Standard  
2 Sig. Digits + Z = +80%/ -20%  
Number of Zeros  
9 = 6.3V V = Y5V  
8 = 10V  
4 = 16V  
3 = 25V  
5 = 50V  
A = N/A  
C = 100% Matte Sn Blank = Bulk  
TU = 7" Reel  
Unmarked  
TM = 7" Reel  
Marked  
1 Additional termination finish options may be available. Contact KEMET for details.  
2 Additional reeling or packaging options may be available. Contact KEMET for details.  
One WORLD  
One Brand  
One Strategy  
One Focus  
One Team  
One KEMET  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
100% Tin or SnPb Plate  
L
Dimensions – Millimeters (Inches)  
W
B
T
Nickel Plate  
S
Conductive Metalization  
Electrodes  
EIA  
Size  
Code  
0402  
0603  
0805  
1206  
1210  
Metric  
Size  
Code  
1005  
S
L
W
Width  
T
B
Mounting  
Technique  
Separation  
Min.  
0.30 (.012)  
0.70 (.028)  
0.75 (.030)  
Length  
Thickness  
Bandwidth  
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)  
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)  
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)  
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)  
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)  
0.30 (.012) ± 0.10 (.004)  
0.35 (.014) ± 0.15 (.006)  
0.50 (0.02) ± 0.25 (.010)  
0.50 (0.02) ± 0.25 (.010)  
0.50 (0.02) ± 0.25 (.010)  
Solder Reflow Only  
1608  
Solder Wave or  
Solder Reflow  
2012  
3216  
N/A  
3225  
Solder Reflow Only  
Qualification/Certification  
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table  
4, Performance and Reliability.  
Environmental Compliance  
Pb-Free and RoHS compliant  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Electrical Parameters/Characteristics  
Item  
Parameters/Characteristics  
Operating Temperature Range  
-30°C to +85°C  
+22%, -82%  
7.0%  
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC)  
Aging Rate (Max % Cap Loss/Decade Hour)  
250% of rated voltage  
(5 ± 1 seconds and charge/discharge not exceeding 50mA)  
Dielectric Withstanding Voltage  
Dissipation Factor (DF) Maximum Limits @ 25ºC  
10% (10V), 7% (16V & 25V) and 5% (50V )  
See Insulation Resistance Limit Table  
(Rated voltage applied for 120 ± 5 secs @ 25°C)  
Insulation Resistance (IR) Limit @ 25°C  
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1000 Hours.  
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.  
Capacitance and Dissipation Factor (DF) measured under the following conditions:  
1kHz ± 50Hz and 1.0 ± 0.2 Vrms  
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF  
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic  
Level Control (ALC). The ALC feature should be switched to "ON".  
Post Environmental Limits  
High Temperature Life, Biased Humidity, Moisture Resistance  
Dielectric  
Y5V  
Rated DC Voltage Capacitance Value  
>25  
DF (%)  
7.5  
Cap Shift  
IR  
16 / 25  
< 16  
All  
10.0  
15.0  
± 30%  
10% of Initial Limit  
Insulation Resistance Limit Table  
EIA Case Size  
100 megohm microfarads or 10GΩ  
50 megohm microfarads or 10GΩ  
All  
≥ 16V  
≤ 10V  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Table 1 – (0402 - 1210 Case Sizes)  
Series  
Voltage Code  
Voltage DC  
C0402  
C0603  
C0805  
4
C1206  
C1210  
Cap  
Code  
9
8
4
9
8
4
3
9
8
3
5
9
8
4
3
5
9
8
4
3
5
Cap  
Cap Tolerance  
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions  
22,000 pF  
27,000 pF  
33,000 pF  
39,000 pF  
47,000 pF  
56,000 pF  
68,000 pF  
82,000 pF  
0.10 µF  
0.12 µF  
0.15 µF  
0.18 µF  
0.22 µF  
0.27 µF  
0.33 µF  
0.39 µF  
0.47 µF  
0.56 µF  
0.68 µF  
0.82 µF  
1.0 µF  
223  
273  
333  
393  
473  
563  
683  
823  
104  
124  
154  
184  
224  
274  
334  
394  
474  
564  
684  
824  
105  
125  
155  
185  
225  
335  
475  
565  
685  
106  
156  
226  
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
BB BB BB CB CB CB CB DC DC DC DC DC EB EB EB EB EB  
BB BB BB CB CB CB CB DC DC DC DC DC EB EB EB EB EB  
BB BB BB CB CB CB CB DC DC DC DC DC EB EB EB EB EB  
BB BB BB CB CB CB CB DD DD DD DD DD EB EB EB EB EB  
BB BB BB CB CB CB CB DD DD DD DD DD EB EB EB EB EB  
BB BB BB CB CB CB CB DD DD DD DD DD EB EB EB EB EB  
BB BB BB CB CB CB CB DD DD DD DD DD EB EB EB EB EB  
BB BB BB CB CB CB CB DD DD DD DD DD EB EB EB EB EB  
BB BB BB CB CB CB CB DD DD DD DD DD EB EB EB EB EB  
CC CC CC CC DC DC DC DC  
CC CC CC CC DC DC DC DC  
CC CC CC CC DC DC DC DC  
BB  
BB  
BB  
CC CC CC CC DC DC DC DC DG EC EC EC EC  
FD FD FD  
FD FD FD  
FD FD FD  
FD FD FD  
FD FD FD  
FD FD FD  
FD FD FD  
FF FF FF  
FH FH FH  
FD FD FD  
FD FD FD  
FD FD FD  
FD FD FD  
FE FE FE  
FG FG FG  
FG FG FG  
FH FH FH  
FH FH FH  
FH FH FH  
FT FT FM  
FD  
FD  
FD  
FD  
FD  
FD  
FD  
FF  
FH  
FD  
FD  
FD  
FD  
FD  
FD  
FD  
FF  
FH  
CC CC CC CC DC DC DC DC  
CC CC CC CC DC DC DC DC  
EB EB EB EB  
EB EB EB EB  
EB EB EB EB  
EC EC EC EC  
EB EB EB EB  
EB EB EB EB  
EB EB EB EB  
EG EG EG EG  
EC EC EC  
CC CC CC  
CC CC CC  
CC CC  
DC DC DC DC  
DC DC DC DC  
DD DD DD DD  
DE DE DE DE  
DG DG DG DG  
DG DG DG DG  
DC DC DC  
DC DC DC  
DD DD DD  
DD DD DD  
DE DE DH  
CC CC  
CC CC  
CC CC  
1.2 µF  
1.5 µF  
1.8 µF  
2.2 µF  
3.3 µF  
4.7 µF  
5.6 µF  
6.8 µF  
EC EC EC  
ED ED ED  
EE EE EE  
EF EF EF  
DH DH DH  
DF DF  
EM EM EM  
EJ EJ EJ  
DH DH  
EJ EJ  
10 µF  
15 µF  
22 µF  
DH DH  
EJ EJ  
EJ  
Voltage DC  
Voltage Code  
Series  
Cap  
Code  
9
8
4
9
8
4
3
9
8
4
3
5
9
8
4
3
5
9
8
4
3
5
Cap  
C0402  
C0603  
C0805  
C1206  
C1210  
C
1210  
C
226  
Z
4
V
A
C
TU  
Case Size Specification/  
Capacitance  
Code (pF)  
Capacitance  
Tolerance  
Failure Rate/  
Design  
Packaging/Grade  
(C-Spec)2  
Ceramic  
Voltage Dielectric  
Termination Finish2  
(L" x W")  
Series  
0402  
0603  
0805  
1206  
1210  
C = Standard  
2 Sig. Digits + Z = +80%/ -20%  
Number of Zeros  
9 = 6.3V V = Y5V  
8 = 10V  
4 = 16V  
3 = 25V  
5 = 50V  
A = N/A  
C = 100% Matte Sn Blank = Bulk  
TU = 7" Reel  
Unmarked  
TM = 7" Reel  
Marked  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
4
Roll Over for  
Order Info.  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Table 2 – Chip Thickness/Packaging Quantities  
Thickness  
Code  
Chip  
Size  
Thickness ±  
Range (mm)  
QTY per Reel QTY per Reel QTY per Reel QTY per Reel QTY per Bulk  
7" Plastic  
13" Plastic  
7" Paper  
15000  
15000  
10000  
10000  
13" Paper  
Cassette  
AA  
AB  
BB  
BC  
PA  
CB  
CC  
CD  
MA  
DB  
DC  
DD  
DL  
1005  
0201  
0402  
0402  
0508  
0603  
0603  
0603  
0612  
0805  
0805  
0805  
0805  
0805  
0805  
0805  
0805  
1206  
1206  
1206  
1206  
1206  
1206  
1206  
1206  
1206  
1206  
1206  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1210  
1220  
1632  
1706  
1706  
1706  
1808  
1808  
1808  
1808  
1808  
1808  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1812  
1825  
1825  
1825  
1825  
1825  
Chip  
0.20 ± 0.02  
0.30 ± 0.03  
0.50 ± 0.05  
0.50 ± 0.10  
0.80 ± 0.10  
0.80 ± 0.07  
0.80 ± 0.10  
0.80 ± 0.15  
0.80 ± 0.10  
0.60 ± 0.10  
0.78 ± 0.10  
0.90 ± 0.10  
0.95 ± 0.10  
1.00 ± 0.10  
1.10 ± 0.10  
1.25 ± 0.15  
1.25 ± 0.20  
0.78 ± 0.10  
0.80 ± 0.10  
0.90 ± 0.10  
0.95 ± 0.10  
1.00 ± 0.10  
1.10 ± 0.10  
1.20 ± 0.15  
1.25 ± 0.15  
1.60 ± 0.15  
1.60 ± 0.20  
1.70 ± 0.20  
0.78 ± 0.10  
0.90 ± 0.10  
0.95 ± 0.10  
1.00 ± 0.10  
1.10 ± 0.10  
1.25 ± 0.15  
1.40 ± 0.15  
1.50 ± 0.20  
1.55 ± 0.15  
1.60 ± 0.20  
1.70 ± 0.20  
1.85 ± 0.20  
1.85 ± 0.20  
1.90 ± 0.20  
2.10 ± 0.20  
2.25 ± 0.20  
2.50 ± 0.20  
3.35 ± 0.10  
6.15 ± 0.15  
0.80 ± 0.10  
0.80 ± 0.10  
0.90 ± 0.10  
1.00 ± 0.10  
1.00 ± 0.15  
0.90 ± 0.10  
1.00 ± 0.10  
1.00 ± 0.15  
1.40 ± 0.15  
1.60 ± 0.15  
2.00 ± 0.15  
1.00 ± 0.10  
1.10 ± 0.10  
1.25 ± 0.15  
1.30 ± 0.10  
1.40 ± 0.15  
1.50 ± 0.10  
1.55 ± 0.10  
1.60 ± 0.20  
1.70 ± 0.15  
1.70 ± 0.20  
1.90 ± 0.20  
2.00 ± 0.20  
2.50 ± 0.20  
2.65 ± 0.35  
5.00 ± 0.50  
1.10 ± 0.15  
1.15 ± 0.15  
1.30 ± 0.15  
1.40 ± 0.15  
1.50 ± 0.15  
Thickness ±  
50000  
50000  
50000  
50000  
4000  
4000  
10000  
10000  
4000  
4000  
4000  
10000  
10000  
10000  
15000  
15000  
15000  
4000  
4000  
4000  
10000  
10000  
10000  
15000  
15000  
15000  
4000  
2500  
2500  
2500  
2500  
4000  
2000  
4000  
4000  
2500  
2500  
2500  
2500  
2000  
2000  
2000  
4000  
4000  
4000  
2500  
2500  
2500  
2000  
2000  
2000  
2000  
2000  
2000  
2000  
1500  
2000  
2000  
1000  
500  
10000  
10000  
10000  
10000  
10000  
10000  
8000  
10000  
10000  
10000  
10000  
10000  
10000  
8000  
DE  
DF  
DG  
DH  
EB  
4000  
10000  
EK  
EC  
EN  
ED  
EE  
EF  
EM  
EG  
EH  
EJ  
Package Quantity  
Based on Finished Chip  
Thickness Specifications  
8000  
8000  
FB  
10000  
10000  
10000  
10000  
10000  
10000  
8000  
FC  
FD  
FE  
FF  
FG  
FL  
FO  
FH  
FP  
8000  
8000  
8000  
FM  
FJ  
8000  
8000  
FN  
8000  
FT  
4000  
FK  
8000  
FR  
8000  
FS  
4000  
FV  
1800  
FW  
PA  
200  
1000  
4000  
4000  
4000  
4000  
4000  
2500  
2500  
2500  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
500  
10000  
10000  
10000  
10000  
10000  
10000  
10000  
10000  
4000  
MA  
NA  
NB  
NC  
LD  
LE  
LF  
LA  
LB  
4000  
LC  
4000  
GB  
GC  
GD  
GE  
GH  
GF  
GG  
GK  
GJ  
4000  
4000  
4000  
4000  
4000  
4000  
4000  
4000  
4000  
GN  
GL  
GM  
GO  
GP  
GR  
HB  
HC  
HD  
HE  
HF  
4000  
4000  
4000  
2000  
500  
1400  
350  
1000  
1000  
1000  
1000  
1000  
1000  
QTY per Reel  
4000  
4000  
4000  
4000  
4000  
Thickness  
Code  
QTY per Reel  
QTY per Reel  
7" Paper  
QTY per Reel  
13" Paper  
QTY per Bulk  
Cassette  
Size  
Range (mm)  
7" Plastic  
13" Plastic  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Table 2 – Chip Thickness/Packaging Quantities con’t  
Thickness  
Code  
Chip  
Size  
Thickness ±  
Range (mm)  
QTY per Reel QTY per Reel QTY per Reel QTY per Reel QTY per Bulk  
7" Plastic  
13" Plastic  
7" Paper  
13" Paper  
Cassette  
HG  
1825  
2220  
2220  
2220  
2220  
2220  
2220  
2220  
2220  
2220  
2220  
2220  
2225  
2225  
2225  
2225  
2225  
Chip  
1.60 ± 0.20  
1.00 ± 0.15  
1.10 ± 0.15  
1.30 ± 0.15  
1.40 ± 0.15  
1.50 ± 0.15  
1.60 ± 0.20  
1.70 ± 0.15  
1.80 ± 0.15  
2.40 ± 0.15  
3.50 ± 0.30  
5.00 ± 0.50  
1.00 ± 0.15  
1.10 ± 0.15  
1.30 ± 0.15  
1.40 ± 0.15  
1.60 ± 0.20  
Thickness ±  
1000  
1000  
4000  
4000  
JB  
JC  
1000  
4000  
JD  
1000  
4000  
JE  
1000  
4000  
JF  
1000  
4000  
JP  
1000  
4000  
JG  
1000  
4000  
JH  
1000  
4000  
JO  
500  
2000  
JP  
250  
850  
600  
JR  
150  
KB  
1000  
4000  
KC  
1000  
4000  
KD  
1000  
4000  
KE  
1000  
4000  
KF  
1000  
4000  
Thickness  
Code  
QTY per Reel  
7" Plastic  
QTY per Reel  
13" Plastic  
QTY per Reel  
7" Paper  
QTY per Reel  
13" Paper  
QTY per Bulk  
Cassette  
Size  
Range (mm)  
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351  
Density Level A:  
Maximum (Most)  
Land Protrusion (mm)  
Density Level B:  
Median (Nominal)  
Land Protrusion (mm)  
Density Level C:  
Minimum (Least)  
Land Protrusion (mm)  
EIA  
Size  
Code  
Metric  
Size  
Code  
C
Y
X
V1  
V2  
C
Y
X
V1  
V2  
C
Y
X
V1  
V2  
01005  
0201  
0402  
0603  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
0402  
0603  
1005  
1608  
2012  
3216  
3225  
4520  
4532  
4564  
5650  
5664  
0.33  
0.38  
0.50  
0.90  
1.00  
1.60  
1.60  
2.30  
2.15  
2.15  
2.75  
2.70  
0.46  
0.56  
0.72  
1.15  
1.35  
1.35  
1.35  
1.75  
1.60  
1.60  
1.70  
1.70  
0.43  
0.52  
0.72  
1.10  
1.55  
1.90  
2.80  
2.30  
3.60  
6.90  
5.50  
6.90  
1.60  
1.80  
2.20  
4.00  
4.40  
5.60  
5.65  
7.40  
6.90  
6.90  
8.20  
8.10  
0.90  
1.00  
1.20  
2.10  
2.60  
2.90  
3.80  
3.30  
4.60  
7.90  
6.50  
7.90  
0.28  
0.33  
0.45  
0.80  
0.90  
1.50  
1.50  
2.20  
2.05  
2.05  
2.65  
2.60  
0.36  
0.46  
0.62  
0.95  
1.15  
1.15  
1.15  
1.55  
1.40  
1.40  
1.50  
1.50  
0.33  
0.42  
0.62  
1.00  
1.45  
1.80  
2.70  
2.20  
3.50  
6.80  
5.40  
6.80  
1.30  
1.50  
1.90  
3.10  
3.50  
4.70  
4.70  
6.50  
6.00  
6.00  
7.30  
7.20  
0.70  
0.80  
1.00  
1.50  
2.00  
2.30  
3.20  
2.70  
4.00  
7.30  
5.90  
7.30  
0.23  
0.28  
0.40  
0.60  
0.75  
1.40  
1.40  
2.10  
1.95  
1.95  
2.55  
2.50  
0.26  
0.36  
0.52  
0.75  
0.95  
0.95  
0.95  
1.35  
1.20  
1.20  
1.30  
1.30  
0.23  
0.32  
0.52  
0.90  
1.35  
1.70  
2.60  
2.10  
3.40  
6.70  
5.30  
6.70  
1.00  
1.20  
1.60  
2.40  
2.80  
4.00  
4.00  
5.80  
5.30  
5.30  
6.60  
6.50  
0.50  
0.60  
0.80  
1.20  
1.70  
2.00  
2.90  
2.40  
3.70  
7.00  
5.60  
7.00  
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder  
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.  
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.  
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification  
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Soldering Process  
Recommended Soldering Technique:  
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206  
• All other EIA case sizes are limited to solder reflow only  
Recommended Soldering Profile:  
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020  
Table 4 – Performance & Reliability: Test Methods and Conditions  
Stress  
Terminal Strength  
Board Flex  
Reference  
JIS-C-6429  
JIS-C-6429  
Test or Inspection Method  
Appendix 1, Note: Force of 1.8kg for 60 seconds.  
Appendix 2, Note: 2mm (min) for all except 3mm for C0G.  
Magnification 50 X. Conditions:  
a) Method B, 4 hours @ 155°C, dry heat @ 235°C  
b) Method B @ 215°C category 3  
Solderability  
J-STD-002  
c) Method D, category 3 @ 260°C  
Temperature Cycling  
Biased Humidity  
JESD22 Method JA-104  
MIL-STD-202 Method 103  
1000 Cycles (-55°C to +125°C), Measurement at 24 hours. +/- 2 hours after test conclusion.  
Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage. Add 100K ohm resistor. Measurement  
at 24 hours. +/- 2 hours after test conclusion.  
Low Volt Humidity: 1000 hours 85°C/85%RH and 1.5V. Add 100K ohm resistor.  
Measurement at 24 hours. +/- 2 hours after test conclusion.  
t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered.  
Measurement at 24 hours. +/- 2 hours after test conclusion.  
-55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell  
time-15 minutes. Air-Air.  
Moisture Resistance  
Thermal Shock  
MIL-STD-202 Method 106  
MIL-STD-202 Method 107  
MIL-STD-202 Method 108  
/ EIA -198  
High Temperature Life  
1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.  
Storage Life  
MIL-STD-202 Method 108  
MIL-STD-202 Method 213  
MIL-STD-202 Method 215  
150°C, 0VDC, for 1000 Hours.  
Mechanical Shock  
Resistance to Solvents  
Figure 1 of Method 213, Condition F.  
Add aqueous wash chemical - OKEM Clean or equivalent.  
Storage and Handling  
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other  
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term  
storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may  
increase. KEMET recommends that maximum storage temperature not exceed 40ºC, and maximum storage humidity not exceed  
70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts, and atmospheres  
should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably  
within 1.5 years of receipt.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Tape & Reel Packaging Information  
KEMET offers Multilayer Ceramic Chip Capacitors packaged in  
8mm, 12mm and 16mm tape on 7" and 13" reels in accordance  
with EIA standard 481. This packaging system is compatible with  
all tape fed automatic pick and place systems. See Table 2 for  
details on reeling quantities for commercial chips.  
Bar Code Label  
Anti-Static Reel  
®
Embossed Plastic* or  
Punched Paper Carrier.  
Chip and KPS Orientation in Pocket  
(except 1825 Commercial, and 1825 & 2225 Military)  
KEMET  
Sprocket Holes  
Embossment or Punched Cavity  
8mm, 12mm  
or 16mm Carrier Tape  
Anti-Static Cover Tape  
(.10mm (.004") Max Thickness)  
178mm (7.00")  
or  
330mm (13.00")  
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.  
Table 5 – Carrier Tape Configuration (mm)  
EIA Case Size  
Tape size (W)*  
Pitch (P1)*  
01005 - 0402  
0603 - 1210  
8
8
2
4
1805 - 1808  
12  
12  
12  
16  
8
4
≥ 1812  
8
KPS 1210  
8
KPS 1812 & 2220  
Array 0508 & 0612  
12  
4
*Refer to Figure 1 for W and P1 carrier tape reference locations.  
*Refer to Table 6 for tolerance specifications.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions  
T
T
P2  
[10 pitches cumulative  
tolerance on tape ±0.2 mm]  
2
E
1
Po  
ØDo  
Ao  
F
Ko  
W
E
2
B
1
Bo  
S
1
P
1
T
1
Embossment  
For cavity size,  
see Note 1 Table 5  
Center Lines of Cavity  
ØD  
1
Cover Tape  
is for tape feeder reference only,  
including draft concentric about B  
B
1
o
.
User Direction of Unreeling  
Table 6 – Embossed (Plastic) Carrier Tape Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
D1 Min.  
Note 1  
1.0  
(0.039)  
R Ref.  
Note 2  
25.0  
(0.984)  
S1 Min.  
Note 3  
Tape Size  
8mm  
D0  
E1  
P0  
P2  
T Max. T1 Max.  
1.5 +0.10/-0.0  
(0.059 +0.004/-0.0)  
1.75 ± 0.10  
4.0 ± 0.10  
2.0 ± 0.05  
0.600  
(0.024)  
0.600  
0.100  
12mm  
(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)  
(0.024) (0.004)  
1.5  
(0.059)  
30  
(1.181)  
16mm  
Variable Dimensions — Millimeters (Inches)  
B1 Max.  
Note 4  
4.35  
(0.171)  
Tape Size  
8mm  
Pitch  
E2 Min.  
F
P1  
T2 Max  
W Max  
A0,B0 & K0  
Note 5  
6.25  
(0.246)  
3.5 ± 0.05  
(0.138 ± 0.002) (0.157 ± 0.004)  
4.0 ± 0.10  
2.5  
(0.098)  
8.3  
(0.327)  
Single (4mm)  
Single (4mm) &  
Double (8mm)  
8.2  
(0.323)  
10.25  
(0.404)  
5.5 ± 0.05  
(0.217 ± 0.002) (0.315 ± 0.004)  
8.0 ± 0.10  
4.6  
(0.181)  
12.3  
(0.484)  
12mm  
12.1  
(0.476)  
14.25  
(0.561)  
5.5 ± 0.05 8.0 ± 0.10  
(0.217 ± 0.002) (0.315 ± 0.004)  
4.6  
(0.181)  
16.3  
(0.642)  
16mm  
Triple (12mm)  
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and  
hole location shall be applied independent of each other.  
2. The tape with or without components shall pass around R without damage (see Figure 5).  
3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).  
4. B1 dimension is a reference dimension for tape feeder clearance only.  
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:  
(a) the component does not protrude above the top surface of the carrier tape.  
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.  
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).  
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).  
(e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket.  
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Figure 2 – Punched (Paper) Carrier Tape Dimensions  
T
P2  
[10 pitches cumulative  
tolerance on tape ±0.2 mm]  
E
1
Po  
ØDo  
0
A
F
W
2
E
0
B
Bottom Cover Tape  
P
1
G
Cavity Size,  
See  
1
T
1
T
Top Cover Tape  
Center Lines of Cavity  
Note 1, Table 7  
Bottom Cover Tape  
User Direction of Unreeling  
Table 7 – Punched (Paper) Carrier Tape Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
R Ref.  
Note 2  
Tape Size  
8mm  
D0  
E1  
P0  
P2  
T1Max  
G Min  
1.5 +0.10-0.0  
(0.059 +0.004, -0.0)  
1.75 ±0.10  
(0.069 ±0.004)  
4.0 ±0.10  
(0.157 ±0.004)  
2.0 ±0.05  
(0.079 ±0.002)  
0.10  
(.004) Max.  
0.75  
(.030)  
25  
(.984)  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
8mm  
Pitch  
E2 Min  
F
P1  
T Max  
W Max  
A0 B0  
2.0 ± 0.05  
(0.079 ± 0.002)  
4.0 ± 0.10  
8.3  
(0.327)  
8.3  
Half (2mm)  
Single (4mm)  
6.25  
(0.246)  
3.5 ± 0.05  
(0.138 ± 0.002)  
1.1  
(0.098)  
Note 5  
8mm  
(0.157 ± 0.004)  
(0.327)  
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:  
a) the component does not protrude beyond either surface of the carrier tape.  
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.  
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).  
e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.  
2. The tape with or without components shall pass around R without damage (see Figure 5).  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
10  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Packaging Information Performance Notes  
1. Cover Tape Break Force: 1.0 Kg Minimum.  
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:  
Tape Width  
Peel Strength  
8mm  
0.1 Newton to 1.0 Newton (10gf to 100gf)  
0.1 Newton to 1.3 Newton (10gf to 130gf)  
12mm & 16mm  
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the  
carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.  
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.  
Figure 3 – Maximum Component Rotation  
°
T
Maximum Component Rotation  
Top View  
Maximum Component Rotation  
Side View  
Typical Pocket Centerline  
Tape  
Maximum  
°
°
T
s
Width (mm) Rotation (  
)
8,12  
16-200  
20  
10  
Bo  
Tape  
Maximum  
°
S
Width (mm) Rotation (  
)
8,12  
16-56  
72-200  
20  
10  
5
Typical Component Centerline  
Ao  
Figure 4 – Maximum Lateral Movement  
8mm & 12mm Tape  
16mm Tape  
0.5 mm maximum  
1.0 mm maximum  
1.0 mm maximum  
0.5 mm maximum  
Figure 5 – Bending Radius  
Embossed  
Carrier  
Punched  
Carrier  
R
Bending  
Radius  
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
11  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Figure 6 – Reel Dimensions  
Full Radius,  
See Note  
W3 (Includes  
flange distortion  
at outer edge)  
Access Hole at  
Slot Location  
(Ø 40 mm min.)  
W
2 (Measured at hub)  
D
(See Note)  
A
N
C
(Arbor hole  
W
1 (Measured at hub)  
diameter)  
If present,  
tape slot in core  
for tape start:  
2.5 mm min. width x  
10.0 mm min. depth  
B
(see Note)  
Note: Drive spokes optional; if used, dimensions B and D shall apply.  
Table 8 – Reel Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
Tape Size  
8mm  
A
B Min  
C
D Min  
178 ± 0.20  
(7.008 ± 0.008)  
or  
330 ± 0.20  
(13.000 ± 0.008)  
1.5  
(0.059)  
13.0 +0.5/-0.2  
(0.521 +0.02/-0.008)  
20.2  
(0.795)  
12mm  
16mm  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
8mm  
N Min  
W1  
W2 Max  
W3  
8.4 +1.5/-0.0  
(0.331 +0.059/-0.0)  
14.4  
(0.567)  
50  
(1.969)  
12.4 +2.0/-0.0  
18.4  
Shall accommodate tape width  
without interference  
12mm  
16mm  
(0.488 +0.078/-0.0)  
(0.724)  
16.4 +2.0/-0.0  
(0.646 +0.078/-0.0)  
22.4  
(0.882)  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
12  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Figure 7 – Tape Leader & Trailer Dimensions  
Embossed Carrier  
Carrier Tape  
Punched Carrier  
8 mm & 12 mm only  
Round Sprocket Holes  
START  
END  
Top Cover Tape  
Elongated Sprocket Holes  
(32 mm tape and wider)  
100 mm Min.  
Leader  
Trailer  
160 mm minimum,  
Components  
400 mm Minimum,  
Top Cover Tape  
Figure 8 – Maximum Camber  
Elongated sprocket holes  
(32 mm & wider tapes)  
Carrier Tape  
Round Sprocket Holes  
1 mm maximum, either direction  
Straight Edge  
250 mm  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
13  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)  
Meets Dimensional Requirements IEC-286 and EIAJ 7201  
Unit mm *Reference  
53 3*  
10*  
1.5 ± 00.1  
2.0 ± 00.1  
3.0 ± 00.2  
5 0*  
110 ± 0.7  
Table 9 – Capacitor Dimensions for Bulk Cassette  
Cassette Packaging – Millimeters  
EIA Size Metric Size  
S Separation  
minimum  
0.3  
Number of  
Pcs/Cassette  
L Length  
W Width  
B Bandwidth  
T Thickness  
Code  
Code  
0402  
1005  
1.0 ± 0.05  
1.6 ± 0.07  
0.5 ± 0.05  
0.8 ± 0.07  
0.2 to 0.4  
0.2 to 0.5  
0.5 ± .05  
0.8 ± .07  
50,000  
0603  
1608  
0.7  
15,000  
Table 10 – Capacitor Marking  
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to  
identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any  
Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)  
N u m e r a l  
Alpha  
Character  
Capacitance (pF) For Various Numeral Identifiers  
9
0
1
2
3
4
5
6
7
A
B
C
D
E
F
G
H
J
0.1  
1
10  
11  
12  
13  
15  
16  
18  
20  
22  
24  
27  
30  
33  
36  
39  
43  
47  
51  
56  
62  
68  
75  
82  
91  
25  
35  
40  
45  
50  
60  
70  
80  
90  
100  
110  
120  
130  
150  
160  
180  
200  
220  
240  
270  
300  
330  
360  
390  
430  
470  
510  
560  
620  
680  
750  
820  
910  
250  
350  
400  
450  
500  
600  
700  
800  
900  
1000  
1100  
1200  
1300  
1500  
1600  
1800  
2000  
2200  
2400  
2700  
3000  
3300  
3600  
3900  
4300  
4700  
5100  
5600  
6200  
6800  
7500  
8200  
9100  
2500  
3500  
4000  
4500  
5000  
6000  
7000  
8000  
9000  
10000  
11000  
12000  
13000  
15000  
16000  
18000  
20000  
22000  
24000  
27000  
30000  
33000  
36000  
39000  
43000  
47000  
51000  
56000  
62000  
68000  
75000  
82000  
91000  
25000  
35000  
40000  
45000  
50000  
60000  
70000  
80000  
90000  
100000  
110000  
120000  
130000  
150000  
160000  
180000  
200000  
220000  
240000  
270000  
300000  
330000  
360000  
390000  
430000  
470000  
510000  
560000  
620000  
680000  
750000  
820000  
910000  
250000  
350000  
400000  
450000  
500000  
600000  
700000  
800000  
900000  
1000000  
1100000  
1200000  
1300000  
1500000  
1600000  
1800000  
2000000  
2200000  
2400000  
2700000  
3000000  
3300000  
3600000  
3900000  
4300000  
4700000  
5100000  
5600000  
6200000  
6800000  
7500000  
8200000  
9100000  
2500000  
3500000  
4000000  
4500000  
5000000  
6000000  
7000000  
8000000  
9000000  
10000000  
11000000  
12000000  
13000000  
15000000  
16000000  
18000000  
20000000  
22000000  
24000000  
27000000  
30000000  
33000000  
36000000  
39000000  
43000000  
47000000  
51000000  
56000000  
62000000  
68000000  
75000000  
82000000  
91000000  
25000000  
35000000  
40000000  
45000000  
50000000  
60000000  
70000000  
80000000  
90000000  
0.11  
0.12  
0.13  
0.15  
0.16  
0.18  
0.2  
0.22  
0.24  
0.27  
0.3  
0.33  
0.36  
0.39  
0.43  
0.47  
0.51  
0.56  
0.62  
0.68  
0.75  
0.82  
0.91  
0.25  
0.35  
0.4  
1.1  
1.2  
1.3  
1.5  
1.6  
1.8  
2
2.2  
2.4  
2.7  
3
3.3  
3.6  
3.9  
4.3  
4.7  
5.1  
5.6  
6.2  
6.8  
7.5  
8.2  
9.1  
2.5  
3.5  
4
Example shown is 1,000 pF capacitor  
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
0.45  
0.5  
0.6  
0.7  
0.8  
4.5  
5
6
7
8
y
0.9  
9
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
14  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
KEMET Corporation  
World Headquarters  
Europe  
Asia  
Southern Europe  
Geneva, Switzerland  
Tel: 41-22-715-0100  
Northeast Asia  
Hong Kong  
Tel: 852-2305-1168  
2835 KEMET Way  
Simpsonville, SC 29681  
Paris, France  
Tel: 33-1-4646-1009  
Shenzhen, China  
Tel: 86-755-2518-1306  
Mailing Address:  
P.O. Box 5928  
Greenville, SC 29606  
Sasso Marconi, Italy  
Tel: 39-051-939111  
Beijing, China  
Tel: 86-10-5829-1711  
www.kemet.com  
Tel: 864-963-6300  
Fax: 864-963-6521  
Milan, Italy  
Tel: 39-02-57518176  
Shanghai, China  
Tel: 86-21-6447-0707  
Corporate Offices  
Fort Lauderdale, FL  
Tel: 954-766-2800  
Rome, Italy  
Tel: 39-06-23231718  
Taipei, Taiwan  
Tel: 886-2-27528585  
Madrid, Spain  
Tel: 34-91-804-4303  
North America  
Southeast Asia  
Singapore  
Tel: 65-6586-1900  
Southeast  
Lake Mary, FL  
Tel: 407-855-8886  
Central Europe  
Landsberg, Germany  
Tel: 49-8191-3350800  
Penang, Malaysia  
Tel: 60-4-6430200  
Northeast  
Wilmington, MA  
Tel: 978-658-1663  
Bangalore, India  
Tel: 91-806-53-76817  
Dortmund, Germany  
Tel: 49-2307-3619672  
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Tel: 610-692-4642  
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Tel: 48-55-279-7025  
Central  
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Tel: 847-882-3590  
Northern Europe  
Bishop’s Stortford, United Kingdom  
Tel: 44-1279-757201  
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Tel: 317-706-6742  
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Tel: 44-1305-830747  
West  
Milpitas, CA  
Tel: 408-433-9950  
Coatbridge, Scotland  
Tel: 44-1236-434455  
Mexico  
Zapopan, Jalisco  
Tel: 52-33-3123-2141  
Färjestaden, Sweden  
Tel: 46-485-563934  
Espoo, Finland  
Tel: 358-9-5406-5000  
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not  
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of  
KEMET Electronics Corporation.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
15  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Other KEMET Resources  
Tools  
Resource  
Location  
Configure A Part: CapEdge  
SPICE & FIT Software  
http://capacitoredge.kemet.com  
http://www.kemet.com/spice  
http://www.kemet.com/keask  
Search Our FAQs: KnowledgeEdge  
Product Information  
Resource  
Products  
Location  
http://www.kemet.com/products  
Technical Resources (Including Soldering  
Techniques)  
http://www.kemet.com/technicalpapers  
RoHS Statement  
http://www.kemet.com/rohs  
Quality Documents  
http://www.kemet.com/qualitydocuments  
Product Request  
Resource  
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Sample Request  
Engineering Kit Request  
http://www.kemet.com/sample  
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Contact Us  
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Call Us  
http://www.kemet.com/contact  
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1-877-MyKEMET  
Twitter  
http://twitter.com/kemetcapacitors  
Disclaimer  
All product specifications, statements, information and data (collectively, the “Information”) are subject to change without notice.  
All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.  
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we  
specifically disclaim – any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite  
experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the  
use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.  
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.  
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or  
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.  
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not  
be required.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
16  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3VDC-50VDC (Commercial Grade)  
Digitally signed by Marcy Brand  
DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corporation, ou=Marketing Communications, cn=Marcy Brand,  
email=marcybrand@kemet.com  
Date: 2011.08.12 13:45:25 -04'00'  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com  
C1005_Y5V • 8/10/2011  
17  

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