C1206S103M2RAL7411 [KEMET]

Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.01uF, 1206,;


型号：	C1206S103M2RAL7411
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.01uF, 1206,
文件：	总3页 (文件大小：62K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Product Bulletin

Fail-Safe Floating Electrode MLCC / FE-CAP / X7R Dielectric

Outline Drawing

TIN PLATE

NICKEL PLATE

CONDUCTIVE METALLIZATION

ELECTRODES

Product Description

The FE-CAP is a SMD MLCC which utilizes a floating internal electrode design, wherein the electrodes are

configured to form multiple capacitors in series within a single MLCC package. This not only yields

improved voltage and ESD performance over standard designs, but also mitigates the risk of low-IR or

short-circuit failures that can occur due to board flex. Combined with the stability of an X7R dielectric, the

FE-CAP complements KEMET's Open Mode Devices by providing a fail-safe design optimized for low- to

mid-range capacitance values.

FE-CAP Internal Design

Flex Crack

Unique electrode

design allows for

a fail-open during

a flex condition.

Dimensions – Millimeters (Inches)

EIA Size Metric Size

Code

0402

0603

0805

1206

1210

1812

Code

1005

1608

2012

3216

3225

4532

Length

Width

Bandwidth

Separation

1.0 (.04) ± 0.05 (.002)

0.5 (.02) ± 0.05 (.002)

0.20 (.008) -0.40 (.016) 0.30 (.012)

1.6 (.063) ± 0.15 (.006) 0.8 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028)

2.0 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.05 (.02) ± 0.25 (.010) 0.75 (.030)

3.2 (.126) ± 0.20 (.008) 1.6 (.063) ± 0.20 (.008)

3.2 (.126) ± 0.20 (.008) 2.5 (.098) ± 0.20 (.008)

0.50 (.02) ± .25 (.010)

N/A

4.5 (.177) ± 0.30 (.012) 3.2 (.126 ) ± 0.30 (.012) 0.60 (.024) ± .35 (.014)

Refer to standard thickness dimensions and table located in the F3102 SMT catalog on pages 73, 74, and 77.

F3280C 2/08

X7R Capacitance Range

0402

0603

0805

1206

1210

1812

CAP

(pF)

CAP CAP

(nF) CODE _6.3

10 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 25 50 100 200 250

150

180

0.15 151

0.18 181

0.22 221

0.27 271

0.33 331

0.39 391

0.47 471

0.56 561

0.68 681

0.82 821

1.00 102

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

10000

12000

15000

18000

22000

27000

33000

39000

47000

56000

68000

82000

100000

120000

150000

180000

220000

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

100

120

150

180

220

Ordering Information

0805

103

Style

C - Ceramic

Size Code

0402, 0603, 0805, 1206, 1210, 1812

End Metallization

C = 100% Tin Plated

Specification

S - Floating Electrode

L = 70Sn/30Pb Plated

Failure Rate Level

Capacitance Code, pF

A = Not Applicable

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

Temperature Characteristic

Designated by Capacitance

Change over Temperature Range

R – X7R (±15%) (-55°C +125°C)

Capacitance Tolerance

K = ±10%; M = ±20%; J = ±5%

Voltage

9 = 6.3V, 8 = 10V, 4 = 16V, 3 = 25V

5 = 50V, 1 = 100V, 2 = 200V, A = 250V

Electrical Parameters

As detailed in the KEMET Surface Mount Catalog F3102 for X7R, with following specific requirements

based on room temperature (25°C) parameters:

•

Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 15% over that range.

Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1,000

megohm microfarads or 100 gigohm, whichever is less.

•

Capacitance and Dissipation Factor (DF) measured at 1kHz and 1 Vrms.

DF Limits are:

50 - 250 Volts

16 - 25 Volts

6.3 - 10 Volts

2.5%

3.5%

5.0%

Soldering Process

These components are suitable for reflow and wave soldering. All parts incorporate the standard KEMET

barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resist-

ance to leaching.

Marking

These chips will be supplied unmarked. If required, they can be laser-marked as an extra option.

Details on the marking format are included in KEMET Surface Mount catalog F3102.

Qualification/Certification

AEC-Q200 Rev. C - Automotive

RoHS 6 - 100% tin termination

In general, the information in the KEMET Surface Mount catalog F3102 applies to these

capacitors. The information in this bulletin supplements that in the catalog.

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