C1210C100CCGAC [KEMET]

CERAMIC CHIP / HIGH VOLTAGE; 陶瓷片/高压


型号：	C1210C100CCGAC
厂家：	KEMET CORPORATION
描述：	CERAMIC CHIP / HIGH VOLTAGE 陶瓷片/高压高压
文件：	总9页 (文件大小：1651K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CERAMIC CHIP / HIGH VOLTAGE

KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They

offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin

(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering

applications. An insulating coating may be required to prevent surface arcing. These components are RoHS

compliant.

MARKETS

Markets

APPLICATIONS

Applications

• Switch Mode Power Supply • Power Supply

• Input Filter

• High Voltage Power Supply

• Resonators

• DC-DC Converter

• Tank Circuit

• Snubber Circuit

• LCD Fluorescent Backlight Ballast

• HID Lighting

• Output Filter

• Telecommunications Equipment

• Industrial Equipment/Control

• Medical Equipment/Control

• Computer (LAN/WAN Interface)

• Analog and Digital Modems

• Automotive

• High Voltage Coupling

• High Voltage DC Blocking

• Lighting Ballast

• Voltage Multiplier Circuits

• Coupling Capacitor/CUK

OUTLINE DRAWING

Outline Drawing

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

ELECTRODES

TABLE 1 - DIMENSIONS - MILLIMETERS (in.)

Metric

Code

EIA Size

Code

Band

Separation

L - Length

W - Width

B - Bandwidth

2.0 (0.079)

0.2 (0.008)

1.2 (0.049)

0.2 (0.008)

0.5 (0.02

0.25 (0.010)

2012

3216

3225

4520

4532

4564

5650

5664

0805

1206

1210

1808

1812

1825

2220

2225

0.75 (0.030)

N/A

3.2 (0.126)

0.2 (0.008)

1.6 (0.063)

0.2 (0.008)

0.5 (0.02)

0.25 (0.010)

3.2 (0.126)

0.2 (0.008)

2.5 (0.098)

0.2 (0.008)

0.5 (0.02)

0.25 (0.010)

N/A

4.5 (0.177)

0.3 (0.012)

2.0 (0.079

0.2 (0.008)

0.6 (0.024)

0.35 (0.014)

N/A

4.5 (0.177)

0.3 (0.012)

3.2 (0.126)

0.3 (0.012)

0.6 (0.024)

0.35 (0.014)

N/A

4.5 (0.177)

0.3 (0.012)

6.4 (0.250)

0.4 (0.016)

0.6 (0.024)

0.35 (0.014)

N/A

5.6 (0.224)

0.4 (0.016)

5.0 (0.197)

0.4 (0.016)

0.6 (0.024)

0.35 (0.014)

N/A

5.6 (0.224)

0.4 (0.016)

6.4 (0.250)

0.4 (0.016)

0.6 (0.024)

0.35 (0.014)

N/A

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)

0805

1206

1210

1808

1812

1825

2220

2225

Series

Max

Thickness

(in)

Capacitance

Tolerance

Cap

Cap Code/

Voltage

1.0-2.4 C,D

2.7-5.1 C,D

5.6-9.1 C,D

10 C,D

109-249

K,M 279-519

J,K,M 569-919

J,K,M

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

11 C,D

12 C,D

13 C,D

15 C,D G,J,K,M

16 C,D G,J,K,M

18 C,D G,J,K,M

20 C,D G,J,K,M

22 C,D G,J,K,M

24 C,D G,J,K,M

D,F,G,J,K,M

F,G,J,K,M

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

1000

1100

1200

1300

1500

1600

1800

2000

2200

2400

2700

3000

3300

3600

3900

4300

4700

5100

5600

6200

6800

7500

8200

9100

10,000

* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.

Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)

1808

0805

1206

1210

1812

1825

2220

2225

Series

Max

Thickness

(in)

Cap

Capacitance

Tolerance

Cap Code/

Voltage

100

110

120

130

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

J,K,M

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

181

221

271

331

391

471

561

681

821

102

122

152

182

202

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

623

683

823

104

124

154

184

224

1800

2000

2200

2700

3300

3900

4700

5600

6800

8200

10,000

12,000

15,000

18,000

22,000

27,000

33,000

39,000

47,000

56,000

62,000

68,000

82,000

100,000

120,000

150,000

180,000

220,000

Note: Actual thickness dimensions may be less than stated maximum.

Check the KEMET website, www.kemet.com, for additional values and chip sizes available.

KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)

THICKNESS AND REELING QUANTITIES

Chip size

EIA

Max.

Tape Width Qty per Reel Qty per Reel

Thickness (in)

Thickness (mm)

(mm)

7" Plastic

2,500

2,000

1,000

13" Plastic

10,000

8,000

Metric

2012

3216

3225

4520

4532

4564

5650

5664

0805

1206

0.055

0.065

0.101

0.080

0.067

1.27

1.65

2.57

2.03

1.70

1210

8,000

1808

4,000

1812/1813

1825

4,000

2220

4,000

2225

4,000

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

CAPACITOR ORDERING INFORMATION

Capacitor Ordering Information

0805

102

SSttyyllee

C - Ceramic

Chip Size

0805; 1206; 1210; 1808;

1812; 1825; 2220; 2225

EEnndd MMeettaalllliizzaattiioonn

C = Standard

FFaaiilluurree RRaattee LLeevveell

Specification

A = Not Applicable

C - Standard

Capacitance Code, pF

Temperature Characteristic

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

Designated by Capacitance

Change over Temperature Range

G – (C0G) ( 30ppm/C) (-55°C +125°C)

R – X7R ( 15ꢀ) (-55°C +125°C)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

Voltage

C = 0.25pF*

D = 0.5pF*

F = 1ꢀ*

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

C = 500V

D = 1000V

F = 1500V

G = 2000V

Z = 2500V

H = 3000V

G = 2ꢀ*

* Contact KEMET Sales for availability.

ELECTRICAL PARAMETERS

Electrical Parameters

Property

Specification

C0G: 1 pF to 0.010 µF

X7R: 10ppFf to 0.22 µF

Capacitance

25°C, 1.0 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)

C0G: C*, D*, F*, G*, J, K, M

X7R: J, K, M

C0G: 0.1ꢀ Max

* Contact KEMET Sales for availability.

Cap Tolerance

X7R: 2.5ꢀ Max

Voltage Ratings

500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V

Operating Temperature Range

25ºC IR @ 500V

From -55C to +125C

From -55ºC to +125ºC

100 GΩ or 1000 MΩ-µF, whichever is less

10 GΩ or 100 MΩ-µF, whichever is less

125ºC IR @ 500V

-55ºC TCC

X7R: + 15ꢀ

+125ºC TCC

C0G: + 30 ppm / ºC

150ꢀ of Rated Voltage for Rated Voltage <1000 V

120ꢀ of Rated Voltage for Rated Voltage >=1000V

Dielectric Strength

Ripple Current

Consult KEMET Sales Representative

MARKING

Marking

These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.

Details on the marking format is located on page 97.

Packaging

PACKAGING

KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk

bag as outlined on page 83. Please consult factory for waffle packaging options.

SOLDERING PROCESS

Soldering Process

The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and

larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of

pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of

the termination.

Recommended Solder Pad Dimensions

RECOMMENDED SOLDER PAD DIMENSIONS

T (Total Length)

S (Separation

W (Pad Width)

L (Pad Length)

Chip Size

3.30

4.50

5.90

7.00

in.

0.70

1.50

2.30

3.30

in.

1.30

1.50

1.80

1.85

in.

0805

1206

1210

1808

1812

1825

2220

2225

0.130

0.177

0.232

0.276

0.028

0.059

0.091

0.130

1.60

2.00

2.90

2.40

3.70

6.90

5.50

6.80

0.063

0.079

0.114

0.094

0.146

0.272

0.217

0.268

0.051

0.059

0.071

0.073

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

Anti-Static Reel

Embossed Carrier*

Chip Orientation

0402 and 0603 case sizes

in Pocket

KEMET

available on punched paper only.

(except 1825 Commercial, and 1825 & 2225 Military)

Embossment

8mm ± .30

(.315 ± .012")

Anti-Static Cover Tape

178mm (7.00")

330mm (13.00")

(.10mm (.004") Max Thickness)

12mm ± .30

(.472 ± .012")

* Punched paper carrier used for 0402 and 0603 case size.

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

Grid

Reflow Solder

Wave Solder

Y(ref) Smin

Grid

placement

courtyard

Placement

Dimension

0402

Y(ref) C(ref)

Not Recommended

2.14 0.28 0.74 0.93 1.21

2.78 0.68 1.08 1.05 1.73

3.30 0.70 1.60 1.30 2.00

4.50 1.50 2.00 1.50 3.00

4.50 1.50 2.90 1.50 3.00

5.90 2.30 3.70 1.80 4.10

5.90 2.30 6.90 1.80 4.10

7.00 3.30 5.50 1.85 5.15

7.00 3.30 6.80 1.85 5.15

Courtyard

0603

3.18 0.68 0.80 1.25 1.93

3.70 0.70 1.10 1.50 2.20

4.90 1.50 1.40 1.70 3.20

4.90 1.50 2.00 1.70 3.20

0805

1206

1210

1812

1825

Not Recommended

2220

2225

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 Newton to 1.0 Newton (10g to 100g)

12 mm

0.1 Newton to 1.3 Newton (10g to 130g)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier

tape shall be 165ꢀ to 180ꢀ from the plane of the carrier tape. During peeling, the carrier and/or cover tape

shall be pulled at a velocity of 300 10 mm/minute.

3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")

reels (with C-7280). Note that 13” reels are preferred.

4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.

Refer to EIA-556.

Embossed Carrier Tape Configuration: Figure 1

Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)

Constant Dimensions — Millimeters (Inches)

Tape Size

D₀

P₀

P₂

T Max

T₁Max

8 mm

and

12 mm

1.5

+0.10 -0.0

(0.059

1.75 0.10

4.0 0.10

2.0 0.05

0.600

0.100

(0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024)

(0.004)

+0.004, -0.0)

Variable Dimensions — Millimeters (Inches)

Tape Size

Pitch

B₁Max.

Note 1

D₁Min.

Note 2

P₁

R Min. T₂Max

Note 3

A₀B₀K₀

Note 4

8 mm

Single

4.4

1.0

3.5 0.05

4.0 0.10

25.0

2.5

8.0 0.30

(4 mm)

(0.173)

(0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012)

12 mm

Double

(8 mm)

8.2

(0.323)

1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30

(0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012)

NOTES

1. B1 dimension is a reference dimension for tape feeder clearance only.

2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of

embossment location and hole location shall be applied independent of each other.

3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require

additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)

4. The cavity defined by A₀, B₀, and K₀shall be configured to surround the part with sufficient clearance such that the chip does not pro-

trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical

restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm

maximum in the pocket (not applicable to vertical clearance.)

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Embossed Carrier Tape Configuration (cont.)

20°

Sketch D: Tape Camber (Top View)

1mm (0.039) Max.

250mm (9.843)

Allowable camber to be 1 mm/250 mm.

400mm (15.75) Min.

Figure 2:

Tape Leader

& Trailer

Dimensions

(Metric

Dimensions

Will Govern)

Figure 3: Reel Dimensions (Metric Dimensions will govern)

Table 2 – REEL DIMENSIONS (Metric will govern)

Tape Size

A Max

B* Min

D* Min

N Min

W₁

W₂Max

W₃

8 mm

330.0

(12.992)

1.5

13.0 0.20

20.2

(0.795)

50.0

(1.969)

See

8.4

+1.5, -0.0

(0.331

14.4

(0.567)

7.9 Min

(0.311)

10.9 Max

(0.429)

(0.059) (0.512 0.008)

Note 3

+0.059, -0.0)

12 mm

330.0

(12.992)

1.5

13.0 0.20

20.2

(0.795)

Table 1

12.4

+2.0, -0.0

(0.488

18.4

(0.724)

11.9 Min

(0.469)

15.4 Max

(0.606)

(0.059) (0.512 0.008)

+0.078, -0.0)

CERAMIC CHIP CAPACITORS

Packaging Information

Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):

10 pitches cumulative

P₀

tolerance on tape

± 0.2 (± 0.008)

D₀

P₂

Top

Tape

Cover

A₀

Bottom

Tape

Cover

B₀

G₂

T₁

P₁

Center lines

of cavity

Max. Cavity Size

See Note 1

Table 1

User Direction of Feed

Table 1: 8 & 12mm PunchedTape

(Metric Dimensions Will Govern)

Constant Dimensions - Millimeters (Inches)

Tape

Size

R Min.

8mm

and

12mm

1.5

1.75 ± 0.10

4.0 ± 0.10

2.0 ± 0.05

0.10 0.75 0.75 25 (.984)

(.004) (.030) (.030) See Note 2

+0.10, -0.0

(.059

(.069 ± 0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min.

Table 1

+0.004, -0.0)

Table 1: 8 & 12mm PunchedTape

(Metric Dimensions Will Govern)

Variable Dimensions - Millimeters (Inches)

Tape

Size

A B

0 0

8mm

1/2

2.0 ± 0.10

1.1mm (.043)

Max. for Paper

Base Tape and

1.6mm (.063)

Max. for Non-

Paper Base

(.079 ± .004)

3.5 ± 0.05

8.0 ± ±0.3

See Note 1

Table 1

Pitch See Require-

ments

(.138 ± .002)

(.315 ± ±0.012)

Section 3.3 (d)

8mm

4.0 ± 0.10

(0.157 ± .004)

Compositions.

See Note 3.

12mm

4.0 ± 0.10

5.5 ± 0.05

12.0 ± 0.3

(0.157 ± .004)

8.0 ± 0.10

(.217 ± .002)

(.472 ± .012)

Double (0.315 ± .004)

Pitch

Note:

1. A , B and T determined by the maximum dimensions to the ends of the terminals extending from the

body and/or the body dimensions of the component. The clearance between the ends of the terminals or

body of the component to the sides and depth of the cavity (A , B and T) must be within 0.05mm (.002)

minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component

within the cavity of not more than 20 degrees (see sketches A and B).

2. Tape with components shall pass around radius "R" without damage.

3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.

Sketch C:

Component Rotation - Top View

Maximum

Sketch B:

(Min.)

Max. Component

Rotation - Front

component rotation.

Sketch A:

Bending Radius

See Note 2

Table 1

20°

Cross Sectional View

Typical

component

center line

20°

CERAMIC CHIP CAPACITORS

Packaging Information

Table 2 – Capacitance Values Available

In Bulk Cassette Packaging

Bulk Cassette Packaging (Ceramic Chips only)

(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)

Min. Max.

Cap Cap

Size Dielectric Voltage Value Value

Case

53.3*

Unit: mm

* Reference

0402

0603

0805

All

0.1

10*

1.5 ±

2.0 ±

3.0 ±

0.1

0.2

C0G

200

100

109 181

109 331

109 102

X7R

Y5V

200

100

221 392

221 103

221 273

221 104

104 224

5.0*

110 ± 0.7

Table 1 – Capacitor Dimensions for Bulk

Cassette Packaging – Millimeters

Metric EIA

Size Size

Code Code

Minimum

Length

Width

Thickness Bandwidth Separation

Number of

Pcs/Cassette

1005 0402 1.0 ± 0.05 0.5 ± 0.05

1608 0603 1.6 ± 0.07 0.8 ± 0.07

0.5 ± .05

0.8 ± .07

0.2 to 0.4

0.2 to 0.5

0.5 to 0.75

0.3

50,000

15,000

10,000

0.7

2012 0805 2.0 ± 0.10 1.25 ± 0.10 0.6 ± .10

0.75

Terminations: KEMET nickel barrier layer with a tin overplate.

CAPACITOR MARKING TABLE

(Marking Optional - Not Available

for 0402 Size or Y5V Dielectric)

Capacitance (pF) For Various Numeral Identifiers

Numeral

Laser marking is available as an extra-cost option for

most KEMET ceramic chips. Such marking is two

sided, and includes a K to identify KEMET, followed by

two characters (per EIA-198 - see table below) to

identify the capacitance value. Note that marking is

not available for size 0402 nor for any Y5V chip. In

addition, the 0603 marking option is limited to the K

only.

Alpha

Character

0.10 1.0 10 100 1000 10,000 100,000 1,000,000 10,000,000

0.11 1.1 11 110 1100 11,000 110,000 1,100,000 11,000,000

0.12 1.2 12 120 1200 12,000 120,000 1,200,000 12,000,000

0.13 1.3 13 130 1300 13,000 130,000 1,300,000 13,000,000

0.15 1.5 15 150 1500 15,000 150,000 1,500,000 15,000,000

0.16 1.6 16 160 1600 16,000 160,000 1,600,000 16,000,000

0.18 1.8 18 180 1800 18,000 180,000 1,800,000 18,000,000

0.20 2.0 20 200 2000 20,000 200,000 2,000,000 20,000,000

0.22 2.2 22 220 2200 22,000 220,000 2,200,000 22,000,000

0.24 2.4 24 240 2400 24,000 240,000 2,400,000 24,000,000

0.27 2.7 27 270 2700 27,000 270,000 2,700,000 27,000,000

0.30 3.0 30 300 3000 30,000 300,000 3,000,000 30,000,000

0.33 3.3 33 330 3300 33,000 330,000 3,300,000 33,000,000

0.36 3.6 36 360 3600 36,000 360,000 3,600,000 36,000,000

0.39 3.9 39 390 3900 39,000 390,000 3,900,000 39,000,000

0.43 4.3 43 430 4300 43,000 430,000 4,300,000 43,000,000

0.47 4.7 47 470 4700 47,000 470,000 4,700,000 47,000,000

0.51 5.1 51 510 5100 51,000 510,000 5,100,000 51,000,000

0.56 5.6 56 560 5600 56,000 560,000 5,600,000 56,000,000

0.62 6.2 62 620 6200 62,000 620,000 6,200,000 62,000,000

0.68 6.8 68 680 6800 68,000 680,000 6,800,000 68,000,000

0.75 7.5 75 750 7500 75,000 750,000 7,500,000 75,000,000

0.82 8.2 82 820 8200 82,000 820,000 8,200,000 82,000,000

0.91 9.1 91 910 9100 91,000 910,000 9,100,000 91,000,000

0.25 2.5 25 250 2500 25,000 250,000 2,500,000 25,000,000

0.35 3.5 35 350 3500 35,000 350,000 3,500,000 35,000,000

0.40 4.0 40 400 4000 40,000 400,000 4,000,000 40,000,000

0.45 4.5 45 450 4500 45,000 450,000 4,500,000 45,000,000

0.50 5.0 50 500 5000 50,000 500,000 5,000,000 50,000,000

0.60 6.0 60 600 6000 60,000 600,000 6,000,000 60,000,000

0.70 7.0 70 700 7000 70,000 700,000 7,000,000 70,000,000

0.80 8.0 80 800 8000 80,000 800,000 8,000,000 80,000,000

0.90 9.0 90 900 9000 90,000 900,000 9,000,000 90,000,000

Example shown is 1,000 pF capacitor.

KA3

C1210C100CCGAC [KEMET]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E