C1210C106M1R2CTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors

KPS Series – Commercial Grade (X7R Dielectric)

Overview

A two chip stack offers up to double the capacitance in the same

or smaller design footprint when compared to traditional surface

mount MLCC devices.

Providing up to 10mm of board ﬂex capability, KPS Series

capacitors are environmentally friendly and in compliance with

RoHS legislation. Available in X7R dielectric, these devices are

capable of Pb-free reﬂow proﬁles and provide lower ESR, ESL

and higher ripple current capability when compared to other

dielectric solutions.

KEMET’s KPS Series (KEMET Power Solutions) utilizes

proprietary lead-frame technology to vertically stack one or two

multilayer ceramic chip capacitors (MLCCs) into a single compact

surface mount package. The attached lead-frame mechanically

isolates the capacitor/s from the printed circuit board, therefore

offering advanced mechanical and thermal stress performance.

Isolation also addresses concerns for audible, microphonic noise

that may occur when a bias voltage is applied.

Beneﬁts

• Higher capacitance in the same footprint

• Potential board space savings.

Applications

• Industrial, Automotive, Military, Telecom

• Smoothing circuits

• Advanced protection against thermal and mechanical stress

• Provides up to 10mm of board ﬂex capability

• Reduces audible, microphonic noise

• Extremely low ESR and ESL

• DC-to-DC converters

• Power supplies (input/output ﬁlters)

• Noise Reduction (piezoelectric / mechanical)

• Circuits with a direct battery or power source connection.

• Critical and safety relevant circuits without (integrated) current

limitation.

• Pb-Free and RoHS compliant

• Capable of Pb-Free reﬂow proﬁles

• Non-polar device, minimizing installation concerns

• Automotive grade (AEC-Q200) under development.

• Any application that is subject to high levels of board ﬂexure or

temperature cycling

Ordering Information

C

2220

C

106

M

5

R

2

C

TU

Case Size Speciﬁcation/ Capacitance Capacitance

End

Metallization²

Packaging/Grade

(C-Spec)³

Ceramic

Voltage Dielectric

Failure Rate/Design

(L" x W")

Series

Code (pF)

Tolerance¹

1210

1812

2220

C = Standard

2 Sig. Digits

+ Number of

Zeros

K = ±10%

M = ±20% 4 = 16V

3 = 25V

8 = 10V

R = X7R 1 = KPS Single Chip Stack

2 = KPS Double Chip Stack

C = 100%

Matte Sn

TU = 7" Reel

Unmarked

7289 = 13" Reel

Unmarked

5 = 50V

1 = 100V

A = 250V

¹Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance. Single chip stacks ("1" in

the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.

²Additional termination options may be available. Contact KEMET for details.

³Additional reeling or packaging options may be available. Contact KEMET for details.

One WORLD

One Brand

One Strategy

One Focus

One Team

One KEMET

C1020-4 • 6/22/2010

1

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Top View

Single or Double

Proﬁle View

Dimensions – Millimeters (Inches)

Double Chip Stack

Single Chip Stack

Chip Stack

EIA

Size

Code

1210

1812

Metric

Size

Code

3225

Chip

Stack

Mounting

Technique

L Length

W Width

T Thickness

LW Lead Width

3.50 (.138) ± 0.30 (.012) 2.60 (.102) ± 0.30 (.012) 3.35 (.132) ± 0.10 (.004) 0.80 (.032) ± 0.15 (.006)

5.00 (.197) ± 0.50 (.020) 3.50 (.138) ± 0.50 (.020) 2.65 (.104) ± 0.35 (.014) 1.10 (.043) ± 0.30 (.012)

6.00 (.236) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 3.50 (.138) ± 0.30 (.012) 1.60 (.063) ± 0.30 (.012)

3.50 (.138) ± 0.30 (.012) 2.60 (.102) ± 0.30 (.012) 6.15 (.242) ± 0.15 (.006) 0.80 (.031) ± 0.15 (.006)

5.00 (.197) ± 0.50 (.020) 3.50 (.138) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 1.10 (.043) ± 0.30 (.012)

6.00 (.236) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 1.60 (.063) ± 0.30 (.012)

Single

4532

2220

1210

1812

5650

Solder Reﬂow

3225

Double

4532

2220

5650

Outline Drawing

Ref

Name

Material

A

B

C

D

E

F

Leadframe

Phosphor Bronze - Alloy 510

Leadframe Attach

High Temp Solder

Cu

Ni

Sn

Ni

Termination

Electrode

Dielectric

G

BaTiO

3

Qualiﬁcation/Certiﬁcation

Commercial grade products meet or exceed the performance and reliability standards outlined in Table 4 - Performance and Reliability

of this speciﬁcation.

Environmental Compliance

RoHS PRC ( Peoples Republic of China) compliant

Electrical Parameters/Characteristics

Operating Temperature Range:

Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC):

Aging Rate (Max % Cap Loss/Decade Hour):

-55°C to +125°C

±15%

3.5%

250% of rated voltage

(5 ± 1 seconds and charge/discharge not exceeding 50mA)

Dielectric Withstanding Voltage:

Dissipation Factor (DF) Maximum Limits @ 25ºC:

Insulation Resistance (IR) Limit @ 25°C:

5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 200V)

See Insulation Resistance Limit Table page 3

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and Dissipation Factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

C1020-4 • 6/22/2010

2

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Insulation Resistance Limit Table

1000 megohm microfarads

500 megohm microfarads

EIA Case Size

or 100GΩ

< 0.39µF

< 2.2µF

or 10GΩ

≥ 0.39µF

≥ 2.2µF

≥ 10µF

1210

1812

2220

< 10µF

Electrical Characteristics

Z and ESR C1210C475M5R1C

Z and ESR C2220C225MAR2C

10³

10²

10¹

10⁰

10^-1

10^-2

10^-3

10⁴

10³

10²

10¹

10⁰

10^-1

10^-2

10^-3

ESR

Z

10⁰

10²

10⁴

10⁶

10⁸

10¹⁰

10⁰

10²

10⁴

10⁶

10⁸

10¹⁰

Frequency (Hz)

Z and ESR C2220C476M3R2C

10⁴

ESR

Z

10²

10⁰

10^-2

10^-4

10^-6

10⁰

10²

10⁴

10⁶

10⁸

10¹⁰

Frequency (Hz)

C1020-4 • 6/22/2010

3

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Electrical Characteristics con't

Impedance - 1812, .10µF, 50V X7R

ESR - 1812, .10µF, 50V X7R

Impedance vs. Frequency

ESR vs. Frequency

10000

1000

100

10

1

C1812C104K5R2C (2 Chip Stack)

C1812C104K5R1C (1 Chip Stack)

C1812C104K5R2C (2 Chip Stack)

C1812C104K5R1C (1 Chip Stack)

1

0.1

0.01

1.E+03

1.E+04

1.E+05

Frequency (Hz)

1.E+06

1.E+07

1.E+08

1.E+03

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

Frequency (Hz)

ESR - 1210, .22µF, 50V X7R

Impedance - 1210, .22µF, 50V X7R

ESR vs. Frequency

Impedance vs. Frequency

10

1

1000

100

10

C1210C224K5R2C (2 Chip Stack)

C1210C224K5R1C (1 Chip Stack)

C1210C224K5R2C (2 Chip Stack)

C1210C224K5R1C (1 Chip Stack)

1

0.1

0.01

0.1

0.01

1.E+03

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

Frequency (Hz)

C1020-4 • 6/22/2010

4

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Electrical Characteristics con't

Microphonics - 2220, 22µF, 50V, X7R

Microphonics - 1210, 4.7µF, 50V, X7R

60

50

40

30

20

10

0

50

40

30

20

10

0

Standard SMD MLCC

KPS - 2 Chip Stack

Standard SMD MLCC

KPS - 1 Chip Stack

0

5

10

15

0

2

4

6

Vp-p

Microphonics - 2220, 47µF, 25V, X7R

Microphonics - 1210, 22µF, 25V, X7R

50

40

30

20

10

0

50

40

30

20

10

0

Standard SMD MLCC

KPS - 2 Chip Stack

Standard SMD MLCC

KPS - 2 Chip Stack

0

5

10

Vp-p

15

20

0

2

4

6

Vp-p

Competitive Comparision

Microphonics - 1210, 4.7µF, 50V, X7R

Ripple Current (Arms) 2220, 22µF, 50V

120

60

50

40

30

20

10

0

100

80

60

40

20

0

KEMET KPS, 2220, 22µF, 50V rated (2 Chip Stack)

Competitor 2220, 22µF, 50V rated (2 Chip Stack)

Competitor

KEMET - KPS

0

10

20

30

0

5

10

15

Ripple Current (Arms)

Vp-p

Note: Refer to Table 4 for test method.

C1020-4 • 6/22/2010

5

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Electrical Characteristics con't

Board Flex vs. Termination Type

Weibull

X7R 1210 10 uF – (22uF KPS Stacked)

X7R 2220 22uF 25V – (47uF KPS Stacked)

2

90

Standard Termination

KPS – 2 Chip Stack

Standard Termination

KPS – 2 Chip Stack

90

80

70

60

50

80

70

60

50

40

30

20

10

20

10

0

5

0

.

0

.

1

2

3

4

5

6

7

8

9

1

Board Flexture (mm)

Board Flexure to 10mm

Weibull

X7R 1812 47uF 16V

2

Weibull

X7R 1210 4.7 uF 50V

2

90

80

70

60

50

40

80

70

60

50

40

30

20

10

1

10

Board Flexture (mm)

C1020-4 • 6/22/2010

6

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Table 1 – (1210 - 2220 Case Sizes)

Series

Voltage Code

Voltage

C1210

C1812

5

C2220

Cap

Code

8

4

3

5

1

A

4

3

1

A

4

3

5

1

A

Cap pF

10

16

25

50

100

250

16

25

50

100

250

16

25

50

100

250

Cap Tolerance

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

Single Chip Stack

0.10 uF

0.22 uF

0.47 uF

1.0 uF

2.2 uF

3.3 uF

4.7 uF

10 uF

15 uF

22 uF

33 uF

47 uF

104

224

474

105

225

335

475

106

156

226

336

476

107

K

M

FV

GP

JS

K

100 uF

Double Chip Stack

0.10 uF

0.22 uF

0.47 uF

1.0 uF

2.2 uF

3.3 uF

4.7 uF

10 uF

22 uF

33 uF

47 uF

100 uF

220 uF

104

224

474

105

225

335

475

106

226

336

476

107

227

M

FW

GR

JR

FW

Voltage

10

8

16

4

25

3

50

5

100

1

250

A

16

4

25

3

50

5

100

1

250

A

16

4

25

3

50

5

100

1

250

A

Cap

Code

Voltage Code

Cap pF

Series

C1210

C1812

C2220

C

2220

C

M

5

R

2

C

TU

Table 2 – Chip Thickness / P¹a⁰c⁶kaging Quantities

Case Size Speciﬁcation/ Capacitance Capacitance

(L" x W")

End

Metallization²

Packaging/Grade

(C-Spec)³

Ceramic

Voltage Dielectric

Failure Rate/Design

Series

Chip

Code (pF)

Tolerance¹

Thickness

Thickness ± Qty per Reel Qty per Reel

Code

FV

Size

Range (mm)

7" Plastic

13" Plastic

1210

1812

2220

C = Standard

2 Sig. Digits

+ Number of

K = ±10%

M = ±20% 4 = 16V

8 = 10V R = X7R 1 = KPS Single Chip Stack

C = 100%

Matte Sn

TU = 7” Reel

Unmarked

7289 = 13” Reel

Unmarked

2 = KPS Double Chip Stack

2000

1210

1812

2220

3.35 ± 0.10

600

Zeros

3 = 25V

300

FW

GP

6.15 ± 0.15

1000

2000

1700

1300

800

5 = 50V

1 = 100V

A = 250V

2.65 ± 0.35

5.00 ± 0.50

3.50 ± 0.30

5.00 ± 0.50

500

400

300

200

GR

JS

JR

Package Quantity Based on Finished Chip Thickness Speciﬁcations

C1020-4 • 6/22/2010

7

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Soldering Process

Recommended Soldering Technique:

• Mounting technique is limited to solder reﬂow only.

Recommended Soldering Proﬁle

• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351

EIA Size

Code

Metric Size

Code

Median (Nominal) Land

Protrusion (mm)

X

Y

C

1210

1812

2220

3225

4532

5650

1.75

2.87

4.78

1.14

1.35

2.08

3.00

4.39

5.38

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Heat Generation

∆T : 20ºC max.

Reﬂow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve.

(Ripple voltage must be < rated voltage)

Ripple Current

Terminal Strength

Board Flex

JIS-C-6429

Appendix 1, Note:Force of 1.8kg for 60 seconds.

Appendix 2, Note:2mm (min) for all except 3mm for C0G.

Magniﬁcation 50X. Conditions:

JIS-C-6429

a) Method B, 4 hrs @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J-STD-002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA-104

MIL-STD-202 Method 103

1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion.

Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement

at 24 hrs. +/- 2 hrs after test conclusion.

Low Volt Humidity:1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor.

Measurement at 24 hrs. +/- 2 hrs after test conclusion.

t = 24 hours/cycle.Steps 7a & 7b not required.Unpowered.

Measurement at 24 hrs. +/- 2 hrs after test conclusion.

-55°C/+125°C.Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell

Moisture Resistance

Thermal Shock

MIL-STD-202 Method 106

MIL-STD-202 Method 107

time-15 minutes.Air-Air.

High Temperature Life

Storage Life

MIL-STD-202 Method 108

MIL-STD-202 Method 213

MIL-STD-202 Method 215

1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied.

150°C, 0VDC, for 1000 Hours.

Mechanical Shock

Resistance to Solvents

Figure 1 of Method 213, Condition F.

Add Aqueous wash chemical - OKEM Clean or equivalent.

C1020-4 • 6/22/2010

8

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Tape & Reel Packaging Information

KEMET offers Multilayer Ceramic Chip Capacitors packaged in

8mm, 12mm and 16mm tape on 7" and 13" reels in accordance

with EIA standard 481. This packaging system is compatible with

all tape fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8mm, 12mm

or 16mm Carrier Tape

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

178mm (7.00")

or

330mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 - Carrier Tape Conﬁguration (mm)

EIA Case Size

Tape size (W)*

Pitch (P₁)*

01005 - 0402

0603 - 1210

8

2

4

1805 - 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figure 1 for W and P₁carrier tape reference locations.

*Refer to Table 4 for tolerance speciﬁcations.

C1020-4 • 6/22/2010

9

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Figure 1: Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ±0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 6

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 - Embossed (Plastic) Carrier Tape Dimensions

(Metric will govern)

Constant Dimensions — Millimeters (Inches)

D₁Min.

Note 1

1.0

R Ref.

Note 2

25.0

S₁Min.

Note 3

Tape Size

8mm

D₀

E₁

P₀

P₂

T Max. T₁Max.

(0.039)

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ± 0.10

4.0 ± 0.10

2.0 ± 0.05

0.600

(0.024)

0.600

(0.024) (0.004)

0.100

12mm

(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)

1.5

30

(0.059)

(1.181)

16mm

Variable Dimensions — Millimeters (Inches)

B₁Max.

Note 4

4.35

(0.171)

8.2

(0.323)

12.1

(0.476)

Tape Size

8mm

Pitch

E₂Min.

F

P₁

T₂Max

W Max

A₀,B₀& K₀

Note 5

6.25

(0.246)

10.25

(0.404)

14.25

3.5 ± 0.05

4.0 ± 0.10

2.5

(0.098)

4.6

(0.181)

4.6

8.3

(0.327)

12.3

(0.484)

16.3

Single (4mm)

(0.138 ± 0.002) (0.157 ± 0.004)

5.5 ± 0.05 8.0 ± 0.10

(0.217 ± 0.002) (0.315 ± 0.004)

5.5 ± 0.05 8.0 ± 0.10

(0.217 ± 0.002) (0.315 ± 0.004)

Single (4mm) &

Double (8mm)

12mm

16mm

Triple (12mm)

(0.561)

(0.181)

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 5).

3. If S₁<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4)

(e) For KPS Series product A₀and B₀are measured on a plane 0.3mm above the bottom of the pocket.

(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

C1020-4 • 6/22/2010

10

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ±0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 - Punched (Paper) Carrier Tape Dimensions

(Metric will govern)

Constant Dimensions — Millimeters (Inches)

R Ref.

Note 2

25

Tape Size

8mm

D₀

E₁

P₀

P₂

T₁Max

G Min

1.5 +0.10-0.0

(0.059 +0.004, -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(.004) Max.

0.75

(.030)

(.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8mm

Pitch

E2 Min

F

P₁

T Max

W Max

A₀B₀

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.10

8.3

(0.327)

8.3

Half (2mm)

6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

1.1

(0.098)

Note 5

8mm

Single (4mm)

(0.157 ± 0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 5).

C1020-4 • 6/22/2010

11

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

Peel Strength

8mm

0.1 Newton to 1.0 Newton (10g to 100g)

0.1 Newton to 1.3 Newton (10g to 130g)

12mm & 16mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the

carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.

Figure 3 – Maximum component rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16-200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16-56

72-200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum lateral movement

8mm & 12mm Tape

16mm Tape

0.5 mm maximum

1.0 mm maximum

0.5 mm maximum

Figure 5 – Bending radius

Embossed

Carrier

Punched

Carrier

R

Bending

Radius

R

C1020-4 • 6/22/2010

12

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm min.)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm min. width x

10.0 mm min. depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

(Metric Dimensions Will Govern)

Constant Dimensions — Millimeters (Inches)

Tape Size

8mm

A

B Min

C

D Min

178 ± 0.20

(7.008 ± 0.008)

or

330 ± 0.20

(13.000 ± 0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12mm

16mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8mm

N Min

W₁

W₂Max

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

12.4 +2.0/-0.0

(0.488 +0.078/-0.0)

16.4 +2.0/-0.0

14.4

(0.567)

18.4

(0.724)

22.4

50

(1.969)

Shall Accommodate Tape

Width Without Interference

12mm

16mm

(0.646 +0.078/-0.0)

(0.882)

C1020-4 • 6/22/2010

13

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Figure 7 – Tape leader & trailer dimensions

Embossed Carrier

Carrier Tape

Punched Carrier

8 mm & 12 mm only

Round Sprocket Holes

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm Min.

Leader

Trailer

160 mm minimum,

Components

400 mm Minimum,

Top Cover Tape

Figure 8 – Maximum camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

C1020-4 • 6/22/2010

14

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

Search Our FAQs: KnowledgeEdge

Product Information

Resource

Products

Location

http://www.kemet.com/products

Technical Resources (Including Soldering

Techniques)

http://www.kemet.com/technicalpapers

RoHS Statement

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

Sample Request

Engineering Kit Request

http://www.kemet.com/sample

http://www.kemet.com/kits

Contact

Resource

Website

Location

www.kemet.com

Contact Us

Investor Relations

Call Us

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

C1020-4 • 6/22/2010

15

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Zac Paris Rive Gauche

118-122 avenue de France

75013 Paris, France

Tel: 33-1-4646-1009

Fax: 33-1-4646-1599

KEMET Corporation World

Asia

Northeast Asia

Headquarters

30 Canton Road, Room 1512

Silvercord Tower II

Tsimshatshui, Kowloon, Hong Kong

Tel: 852-2305-1168

P.O. Box 5928

Greenville, SC 29606

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Via San Lorenzo 19

Sasso Marconi, BO

40037 Italy

Tel: 39-051-939111

Fax: 39-051-840684

Fax: 852-2759-0345

Room 1411, 14/F New China Insurance Ediﬁce

Mintian Road, CBD Futian District

Shenzhen 518001, China

Tel: 1-867-55-25181306

Fax: 1-867-55-25181307

North America

Corporate Ofﬁces

101 NE Third Avenue

Tower 101, Suite 1700

Fort Lauderdale, FL 33301

Tel: 954-766-2800

Via Milanoﬁori Palazzo

A/2 Scala 2

Milano 20090 Italy

Tel: 39-02-57518176

Fax: 39-02-57512093

Floor 17, Tower B, Ping An IFC

No.1-3 Xin Yuan South Road

Chao Yang District

Fax: 954-766-2805

Beijing 100027, China

Tel: 86-10-5829-1711

Fax: 86-10-5829-1963

Southeast

Central Europe

Hermann-Koehl-Str. 2

Landsberg am Lech

86899 Germany

Tel: 49-8191-3350800

Fax: 49-8191-3350990

801 International Parkway, Suite 500

Lake Mary, FL 32746

Tel: 407-855-8886

Room 2602, Grand Gateway Tower 1

No.1 Hong Qiao Road

Shanghai 200030, China

Tel: 86-21-6447-0707

Northeast

340-X Fordham Road

Wilmington, MA 01887

Phone: 978-658-1663

Fax: 978-658-1790

Ruhrallee 9

Dortmund

44139 Germany

Tel: 49-2307-3619672

Fax: 49-2307-961527

Fax: 86-21-6447-0070

Room 305, Floor 3, #142

Sec. 4, Chung Hsiao East Road

Taipei 106, Taiwan ROC

Tel: 886-2-27528585

Central

1900 North Roselle Road, Suite 405

Schaumburg, IL 60195

Tel: 847-882-3590

Northern Europe

Unit 1, Ducketts Wharf

South Street

Bishops Stortford

Hertfordshire CM23 3AL

United Kingdom

Fax: 886-2-27213129

Fax: 847-882-3046

Southeast Asia

73 Bukit Timah Road

#05-01 Rex House

229832 Singapore

Tel: 65-6586-1900

Fax: 65-6586-1901

West

1551 McCarthy Boulevard, Suite 117

Milpitas, CA 95035

Tel: 408-433-9946

Fax: 408-433-9946

Phone: 44-1279-757201

Fax: 44-1279-465237

20 Cumberland Drive

Granby Industrial Estate

Weymouth, Dorset DT4 9TE

United Kingdom

Tel: 44-1305-830747

Fax: 44-1305-760670

1-5-20 Krystal Point 2

Lebuh Bukit Kecil 6

11900 Bayan Baru

Penang, Malaysia

Tel: 6- 04-6430200

Fax: 6 -04-6444220

Mexico

Tezozomoc No. 47

Col. Ciudad del Sol

Zapopan, Jalisco C.P. 45050

Mexico

Tel: 52-33-3123-2141

Fax: 52-33-3123-2144

Thörnblads Väg 6

Färjestaden 386 90

Sweden

Tel: 46-485-563934

Fax: 46-485-563938

Ofﬁce No. 605, 6th Floor

Barton Centre M.G. Road

Bangalore 560 001 India

Tel: 91-80-653-76817

Europe

Southern Europe

15bis chemin des Mines

1202 Geneva

Switzerland

Tel: 41-22-715-0100

Fax: 41-22-715-0170

Fax: 91-80-2532-0160

Stella Business Park

Lars Sonckin kaari 16

Espoo 02600, Finland

Tel: 358-9-5406-5000

Fax: 358-9-5406-5010

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1020-4 • 6/22/2010

16


型号：	C1210C106M1R2CTU
厂家：	KEMET CORPORATION
描述：	Surface Mount Multilayer Ceramic Chip Capacitors 表面贴装多层陶瓷片式电容器电容器
文件：	总16页 (文件大小：2335K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1210C106M1R2CTU [KEMET]

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