C1210V683KBRAC_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield™ Technology, High Voltage, X7R Dielectric,

500 – 1,000 VDC (Commercial & Automotive Grade)

Overview

KEMET ”ArcShield” high voltage surface mount capacitors in

X7R Dielectric are designed for use in high voltage applications

susceptible to surface arcing (arc-over discharge).

For added reliability, KEMET's Flexible Termination technology is

an available option that provides superior ﬂex performance over

standard termination systems. This technology was developed to

address ﬂex cracks, which are the primary failure mode of MLCCs

and typically the result of excessive tensile and shear stresses

produced during board ﬂexure and thermal cycling. Flexible

Termination technology inhibits the transfer of board stress to the

rigid body of the MLCC, therefore mitigating ﬂex cracks which can

result in low IR or short circuit failures.

The phenomenon of surface arcing is caused by a high voltage

gradient between the two termination surfaces or between one

of the termination surfaces and the counter internal electrode

structure within the ceramic body. It occurs most frequently at

application voltages that meet or exceed 300 V, in high humidity

environments, and in chip sizes with minimal bandwidth

separation (creepage distance). This phenomenon can either

damage surrounding components or lead to a breakdown of the

dielectric material, ultimately resulting in a short-circuit condition

(catastrophic failure mode).

KEMET’s “ArcShield” high voltage surface mount MLCCs are

available in automotive grade, which undergo stricter testing

protocol and inspection criteria. Whether under-hood or in-

cabin, these devices are designed for mission and safety-critical

automotive circuits or applications requiring proven, reliable

performance in harsh environments. Automotive grade devices

meet the demanding Automotive Electronics Council’s AEC–Q200

qualiﬁcation requirements.

“ArcShield” Technology (Patent Pending) features KEMET’s

highly reliable base metal dielectric system combined with

a unique internal shield electrode structure that is designed

to suppress an arc-over event while increasing available

capacitance. Developed on the principle of a partial Faraday

cage, this internal system offers unrivaled performance

and reliability when compared to external surface coating

technologies.

Ordering Information

C

1812

V

334

K

C

R

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

(C-Spec)²

Ceramic

Voltage

Dielectric

Termination Finish¹

(L" x W")

Series

0805

1206

1210

1808

1812

V = ArcShield

W = ArcShield

with Flexible

Termination

2 Signiﬁcant

Digits + Number

of Zeros

J = ±5%

K = ±10%

M = ±20%

C = 500 V

B = 630 V

D = 1,000 V

R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

L = SnPb (5%

minimum)

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

AUTO = Automotive

Grade 7" Reel

Unmarked

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

^{1, 2}SnPb termination ﬁnish option is not available on Automotive Grade product.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1034_X7R_HV_ARC_SMD • 6/3/2013

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches) – Standard Termination

L

W

B

T

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0805

1206

1210

1808

1812

2012

3216

3225

4520

4532

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.35 (.014)

0.75 (.030)

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

Dimensions – Millimeters (Inches) – Flexible Termination

L

W

B

T

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0805

1206

1210

1808

1812

2012

3216

3225

4520

4532

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)

4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)

4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.25 (.010)

0.70 (.028) ± 0.35 (.014)

0.75 (.030)

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

C1034_X7R_HV_ARC_SMD • 6/3/2013

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Beneﬁts

• ArcShield (patent pending) technology

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Base metal electrode (BME) dielectric system

• Industry leading CV values

• -55°C to +125°C operating temperature range

• Exceptional performance at high frequencies

• Pb-Free and RoHS Compliant

• EIA 0805, 1206, 1210, 1808, and 1812 case sizes

• DC voltage ratings of 500 V, 630 V, and 1 KV

• Capacitance offerings ranging from 2,200 pF to 0.33 μF

• Low ESR and ESL

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• SnPb plated termination ﬁnish option available upon request

(5% minimum)

• Flexible Termination option available upon request

Applications

Typical applications include switch mode power supplies (input ﬁlters, resonators, tank circuits, snubber circuits, output ﬁlters), high

voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in Ćuk

converters. Markets include power supply, LCD ﬂuorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical

equipment/control, LAN/WAN interface, analog and digital modems, and automotive (electric and hybrid vehicles, charging stations and

lighting) applications.

Application Notes

X7R dielectric is not recommended for AC line ﬁltering or pulse applications.

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Pb-Free and RoHS Compliant (excluding SnPb termination ﬁnish option).

C1034_X7R_HV_ARC_SMD • 6/3/2013

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

-55°C to +125°C

±15%

3.0%

150% of rated voltage for voltage rating of < 1,000 V

120% of rated voltage for voltage rating of ≥ 1,000 V

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

Dielectric Withstanding Voltage (DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

2.5%

100 megohm microfarads or 10 GΩ

(500 VDC applied for 120 ±5 seconds @ 25°C)

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF

Note: When measuring capacitance, it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Shift

Insulation

Resistance

Dielectric

X7R

> 25

16/25

< 16

3.0

5.0

7.5

All

±20%

10% of Initial Limit

C1034_X7R_HV_ARC_SMD • 6/3/2013

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 1 – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)

Series

Voltage Code

Voltage DC

C0805

C1206

C1210

C1808

C1812

C

B

D

C

B

D

C

B

D

C

B

D

C

B

D

Capacitance

Code

Capacitance

500

630

1000

500

630

1000

500

630

1000

500

630

1000

500

630

1000

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

2,000 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

62,000 pF

68,000 pF

82,000 pF

0.10 uF

202

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

623

683

823

104

124

154

184

224

274

334

394

474

J

K

M

DG

EJ

LE

LA

LB

LE

LA

LC

LE

LA

LB

LC

FG

FH

FK

FG

FH

FK

FS

FG

FH

FK

FS

GB

GE

GB

GE

GF

GJ

GB

GE

GH

GK

GN

GB

GE

GK

GJ

0.12 uF

0.15 uF

0.18 uF

0.22 uF

0.27 uF

0.33 uF

0.39 uF

0.47 uF

GL

GS

Voltage DC

Voltage Code

Series

500

C

630

B

1000

D

500

C

630

B

1000

D

500

C

630

B

1000

D

500

C

630

B

1000

D

500

C

630

B

1000

D

Capacitance

Code

Capacitance

C0805

C1206

C1210

C1808

C1812

UD = Under development

Patent pending technology

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conﬁguration and dimensions).

C

1812

V

334

K

C

R

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

(C-Spec)²

Ceramic

Voltage

Dielectric

Termination Finish¹

(L" x W")

Series

0805

1206

1210

1808

1812

V = ArcShield

W = ArcShield Digits + Number K = ±10%

with Flexible

Termination

2 Signiﬁcant

J = ±5%

C = 500 V R = X7R A = N/A

B = 630 V

D = 1,000 V

C = 100% Matte Sn Blank = Bulk

L = SnPb (5% min) TU = 7" Reel

Unmarked

of Zeros

M = ±20%

TM = 7" Reel Marked

AUTO = Automotive

Grade 7" Reel

Unmarked

C1034_X7R_HV_ARC_SMD • 6/3/2013

5

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

DG

EJ

FG

FH

FK

LE

0805

1206

1210

1808

1812

1.25 ± 0.15

1.70 ± 0.20

1.25 ± 0.15

1.55 ± 0.15

2.10 ± 0.20

1.00 ± 0.10

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.00 ± 0.10

1.30 ± 0.10

1.40 ± 0.15

1.50 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

1.90 ± 0.20

2.10 ± 0.20

0

2,500

2,000

2,500

2,000

2,500

1,000

500

10,000

8,000

10,000

8,000

10,000

4,000

2,000

0

LA

LB

LC

GB

GE

GH

GF

GK

GJ

GN

GL

GS

500

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1210¹

1808

1812

2012

3216

3225

4520

4532

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1.60

1.50

2.30

2.15

1.35

1.60

1.75

1.60

1.90

2.80

2.90

2.30

3.60

5.60

5.65

5.60

7.40

6.90

2.90

3.80

3.90

3.30

4.60

1.50

1.40

2.20

2.05

1.15

1.40

1.55

1.40

1.80

2.70

2.80

2.20

3.50

4.70

6.50

6.00

2.30

3.20

3.30

2.70

4.00

1.40

1.30

2.10

1.95

0.95

1.20

1.35

1.20

1.70

2.60

2.70

2.10

3.40

4.00

5.80

5.30

2.00

2.90

3.00

2.40

3.70

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

C1034_X7R_HV_ARC_SMD • 6/3/2013

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1808

1812

2012

3216

3225

4520

4532

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.80

0.95

1.35

2.80

1.70

1.60

2.25

2.10

1.65

1.85

1.80

1.90

2.80

2.30

3.60

5.90

7.40

7.00

2.90

3.80

3.30

4.60

1.50

2.15

2.00

1.45

1.65

1.60

1.80

2.70

2.20

3.50

5.00

6.50

6.10

2.30

3.20

2.70

4.00

1.40

2.05

1.90

1.25

1.45

1.40

1.70

2.60

2.10

3.40

4.30

5.80

5.40

2.00

2.90

2.40

3.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

C1034_X7R_HV_ARC_SMD • 6/3/2013

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

1,000 cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

MIL–STD–202 Method 103

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at

24 hours +/- 2 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours

after test conclusion.

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

-55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell

time – 15 minutes. Air – Air.

High Temperature Life MIL–STD–202 Method 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with rated voltage applied.

Storage Life

Vibration

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

C1034_X7R_HV_ARC_SMD • 6/3/2013

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Construction – Standard Termination

Reference

Item

Material

A

B

D

E

F

Finish

100% Matte Sn SnPb (5% min)

Termination

System

Barrier Layer

Ni

Cu

Base Metal

Inner Electrode

Dielectric Material

Ni

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

Construction – Flexible Termination

Reference

Item

Material

A

B

C

D

E

F

Finish

100% Matte Sn SnPb (5% min)

Barrier Layer

Epoxy Layer

Base Metal

Ni

Ag

Termination

System

Cu

Inner Electrode

Dielectric Material

Ni

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

C1034_X7R_HV_ARC_SMD • 6/3/2013

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be marked

as an extra cost option. Marking is available on most KEMET

devices but must be requested using the correct ordering

code identiﬁer(s). If this option is requested, two sides of the

ceramic body will be laser marked with a “K” to identify KEMET,

followed by two characters (per EIA–198 - see table below) to

identify the capacitance value. EIA 0603 case size devices are

limited to the “K” character only.

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

_

KA8

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive Grade stacked devices.

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

G

H

J

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000 1,000,000

110,000 1,100,000

120,000 1,200,000

130,000 1,300,000

150,000 1,500,000

160,000 1,600,000

180,000 1,800,000

200,000 2,000,000

220,000 2,200,000

240,000 2,400,000

270,000 2,700,000

300,000 3,000,000

330,000 3,300,000

360,000 3,600,000

390,000 3,900,000

430,000 4,300,000

470,000 4,700,000

510,000 5,100,000

560,000 5,600,000

620,000 6,200,000

680,000 6,800,000

750,000 7,500,000

820,000 8,200,000

910,000 9,100,000

250,000 2,500,000

350,000 3,500,000

400,000 4,000,000

450,000 4,500,000

500,000 5,000,000

600,000 6,000,000

700,000 7,000,000

800,000 8,000,000

900,000 9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

0.22

0.24

0.27

0.3

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1034_X7R_HV_ARC_SMD • 6/3/2013 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1034_X7R_HV_ARC_SMD • 6/3/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1034_X7R_HV_ARC_SMD • 6/3/2013 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

0.10

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1034_X7R_HV_ARC_SMD • 6/3/2013 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1034_X7R_HV_ARC_SMD • 6/3/2013 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1034_X7R_HV_ARC_SMD • 6/3/2013 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1034_X7R_HV_ARC_SMD • 6/3/2013 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

Lake Mary, FL

Tel: 407-855-8886

Espoo, Finland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1034_X7R_HV_ARC_SMD • 6/3/2013 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

Search Our FAQs: KnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use. The Information is intended for use only

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

C1034_X7R_HV_ARC_SMD • 6/3/2013 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications,

cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.06.10 12:10:38 -04'00'

C1034_X7R_HV_ARC_SMD • 6/3/2013 19


型号：	C1210V683KBRAC
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.068uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT 电容器
文件：	总19页 (文件大小：757K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1210V683KBRAC [KEMET]

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