C1825C226KARALTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric

6.3V – 250 VDC (Commercial Grade)

Overview

KEMET’s Commercial “L” Series with Tin/Lead Termination

surface mount capacitors in X7R dielectric are designed to meet

KEMET’s X7R dielectric features a 125°C maximum operating

temperature and is considered “temperature stable.” The

the needs of critical applications where tin/lead end metallization Electronics Components, Assemblies & Materials Association (EIA)

is required. KEMET’s tin/lead electroplating process is designed

to meet a 5% minimum lead content and address concerns for

a more robust and reliable lead containing termination system.

As the bulk of the electronics industry moves towards RoHS

compliance, KEMET continues to provide tin/lead terminated

products for military, aerospace and industrial applications and

will ensure customers have a stable and long-term source of

supply.

characterizes X7R dielectric as a Class II material. Components of

this classiﬁcation are ﬁxed, ceramic dielectric capacitors suited for

bypass and decoupling applications or for frequency discriminating

circuits where Q and stability of capacitance characteristics are

not critical. X7R exhibits a predictable change in capacitance

with respect to time and voltage and boasts a minimal change in

capacitance with reference to ambient temperature. Capacitance

change is limited to ±15% from −55°C to +125°C.

Beneﬁts

• −55°C to +125°C operating temperature range

• Temperature stable dielectric

• Reliable and robust termination system

• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825,

2220, and 2225 case sizes

• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

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Ordering Information

C

8

R

C

1210

226

K

A

L

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance Rated Voltage

Failure Rate/

Design

Packaging/Grade

(C-Spec)

Ceramic

Dielectric

R = X7R

Termination Finish¹

(L" x W")

Series

Tolerance

(VDC)

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

C = Standard

Two Signiﬁcant

Digits + Number K = ±10%

of Zeros M = ±20%

J = ±5%

9 = 6.3

A = N/A

L = SnPb (5% Pb

minimum)

See “Packaging

C-Spec Ordering

Options Table”

below

8 = 10

4 = 16

3 = 25

6 = 35

5 = 50

1 = 100

2 = 200

A = 250

¹Additional termination ﬁnish options may be available. Contact KEMET for details

One world. One KEMET

C1018_X7R_SnPb_SMD • 2/29/2016

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)

Bulk Bag / Unmarked

7" Reel / Unmarked

Not required (Blank)

TU

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel / Unmarked

7" Reel / Marked

TM

7040 (EIA 0603 and smaller case sizes)

7215 (EIA 0805 and larger case sizes)

13" Reel / Marked

7" Reel / Unmarked / 2mm pitch²

13" Reel / Unmarked / 2mm pitch²

7081

7082

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have

not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size

devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Beneﬁts cont'd

• Capacitance offerings ranging from 10 pF to 22 μF

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Non-polar device, minimizing installation concerns

• SnPb plated termination ﬁnish (5% Pb minimum)

• Flexible termination option available upon request

• Available for other surface mount products, additional dielectrics and higher voltage ratings upon request

Applications

Typical applications include military, aerospace and other high reliability applications.

C1018_X7R_SnPb_SMD • 2/29/2016

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Dimensions – Millimeters (Inches)

L

W

T

B

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0402

0603

0805

1206

1210¹

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)

1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)

4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)

5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)

5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)

0.30 (.012) ± 0.10 (.004)

0.35 (.014) ± 0.15 (.006)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.35 (.014)

0.30 (.012)

0.70 (.028)

0.75 (.030)

Solder Reﬂow Only

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

¹For capacitance values ≥ 12 µF add 0.02 (0.001) to the width tolerance dimension

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Environmental Compliance

These devices do not meet RoHS criteria due to the concentration of Lead (Pb) in the termination ﬁnish

C1018_X7R_SnPb_SMD • 2/29/2016

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC)

¹Aging Rate (Maximum % Capacitance Loss/Decade Hour)

−55°C to +125°C

±15%

3.0%

250% of rated voltage

(5 ± 1 seconds and charge/discharge not exceeding 50mA)

²Dielectric Withstanding Voltage (DWV)

³Dissipation Factor (DF) Maximum Limit @ 25°C

5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120 ± 5 secs @ 25°C)

⁴Insulation Resistance (IR) Minimum Limit @ 25°C

¹Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Shift

Insulation

Resistance

Dielectric

X7R

> 25

16/25

< 16

3.0

5.0

7.5

All

±20%

10% of Initial Limit

Insulation Resistance Limit Table (X7R Dielectric)

1,000 Megohm

EIA Case Size

500 Megohm

Microfarads or 10 GΩ

Microfarads or 100 GΩ

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

< 0.012 µF

< 0.047 µF

< 0.15 µF

< 0.47 µF

< 0.39 µF

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.15 µF

≥ 0.47 µF

≥ 0.39 µF

N/A

< 2.2 µF

ALL

≥ 2.2 µF

N/A

< 10 µF

ALL

≥ 10 µF

N/A

C1018_X7R_SnPb_SMD • 2/29/2016

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

Cap

Code

Voltage Code

9

8

4

3

5

9

8

4

3

5

1

2

9

8

4

3

6

5

1

2

A

9

8

4

3

6

5

1

2

A

Cap

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

10 – 91 pF*

100 – 150 pF** 101 – 151**

180 – 820 pF** 181 – 821**

100 – 910*

J

K

M

BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN

BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB

EB EB EB EB EB EB EB EB

1000pF

1200 pF

1500 pF

1800 pF

2200 pF

2700 pF

3300 pF

3900 pF

4700 pF

5600 pF

6800 pF

8200 pF

10000 pF

12000 pF

15000 pF

18000 pF

22000 pF

27000 pF

33000 pF

39000 pF

47000 pF

56000 pF

68000 pF

82000 pF

0.1 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1 µF

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

565

685

825

106

BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB EB

BB BB BB BB BB CF CF CF CF CF CF

DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB EB

BB BB BB BB

BB BB BB

CF CF CF CF CF CF

CF CF CF CF CF

CF CF CF CF

DN DN DN DN DN DN DP DE

DN DN DN DN DN DN DE DG

DP DP DP DP DP DP DE DG

DP DP DP DP DP DP DE

DN DN DN DN DN DN DE

DN DN DN DN DP DP DG

DN DN DN DN DG DG DG

DP DP DP DP DP DP

DG DG DG DG DP DP

DG DG DG DG DE DE

DP DP DP DG DH DH

DP DP DP DG

EB EB EB EB EB EB EB EB EB

EB EB EB EB EB EB EC EB EB

EB EB EB EB EB EB EC ED ED

EB EB EB EB EB EB EB ED ED

EB EB EB EB EB EB EB EM EM

EC EC EC EC EC EC EC EG

EC EC EC EC EC EC EC

EB EB EB EB EC EC EM

EB EB EB EB EC EC EG

EC EC EC EC EC EC EG

ED ED ED ED EC EC

EE EE EE EE ED ED

EF EF EF EF ED ED

EF EF EF EH ED ED

ED ED ED EG EH EH

ED ED ED EF EH EH

EN EN EN EH

CF CF CF CF

CF CF CF

DP DP DP DG

DE DE DE

DG DG DG

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

5.6 µF

6.8 µF

8.2 µF

10 µF

DG DG DG

ED ED ED EH

EF EF EF EH

EH EH EH

Rated Voltage

(VDC)

Cap

Code

Cap

Voltage Code

9

8

4

3

5

9

8

4

3

5

1

2

9

8

4

3

6

5

1

2

A

9

8

4

3

6

5

1

2

A

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)

C1018_X7R_SnPb_SMD • 2/29/2016

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)

Case Size/

C1210C

C1808C

C1812C

C1825C

C2220C

C2225C

Series

5

1

2

3

5

1

2

A

3

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

A

5

1

2

A

5

1

2

A

Cap

Rated Voltage

(VDC)

Code

Capacitance

Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

10 – 91 pF*

100 – 270 pF** 101 – 271**

100 – 910*

J

K

M

FB FB FB FB FB FB FB

FB FB FB FB FB FB FE

FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB

FB FB FB FB FB FB FB FB LF LF

330 pF

390 pF

331

391

LF LF LF

LF LF LF GB GB GB GB

470 – 1,200 pF** 471 – 122**

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1.0 µF

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

565

685

825

GB GB GB GB

HB HB HB

FB FB FB FB FB FB FB FB LD LD LD GB GB GB GD

FB FB FB FB FB FB FB FB LD LD LD GB GB GB GH

KE KE KE

KE KE

FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB HB

FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB HE

FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB

FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HE

FB FB FB FB FB FB FB FB LD LD

FB FB FB FB FB FB FC FC LD LD

FB FB FB FB FB FB FC FC LD

FB FB FB FB FB FC FF FF LD

FB FB FB FB FB FD FG FG LD

FB FB FB FB FB FD FH FH LD

FC FC FC FC FC FD FM FM LD

FC FC FC FC FC FD FK FK LD

FC FC FC FC FC FD FK FK

FC FC FC FC FC FD

FD FD FD FD FD FD

FD FD FD FD FD FF

FD FD FD FD FD FG

FF FF FF FF FF FL

FH FH FH FH FH FM

FH FH FH FH FG

FJ FJ FJ FJ FG

FE FE FE FG FH

FF FF FF FM FM

FG FG FG FG FK

FC FC FC FG FS

FF FF FF FH

JE JE JE

GB GB GB GB GB HB HB HB HB JE JE JE

GB GB GB GB GB HB HB HB HB JB JB JB

GB GB GB GB GB HB HB HB HB JC JC JC JC JC

GB GB GB GB GB HB HB HB HB JC JC JC JC JC KC KC KC KC

GB GB GB GE GE HB HB HB HB JC JC JC JC JC KC KC KC KC

GB GB GB GG GG HB HB HB HB JC JC JC JC JC KC KC KC KC

GB GB GG GG GG HB HB HB HB JC JC JC JC JC KB KC KC KC

GB GB GG GG GG HB HB HD HD JC JC JC JC JC KB KC KC KC

GB GB GG GJ GJ HB HB HD HD JC JC JC JC JC KB KC KD KD

KE KE

KE

GC GC GG

GE GE GG

HB HD HD HD JC JC JC JD JD KB KC KD KD

HB HD HD HD JC JC JD JD JD KB KC KD KD

HB HF HF HF JC JC JF JF JF KB KC KE KE

HB HF HF HF JC JC JF JF JF KB KD KE KE

HB

HC

HD

HF

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

JC JC

JD JD

JF JF

KB KE KE KE

KC

KD

GO GO

GK GK

JF JF

5.6 µF

6.8 µF

8.2 µF

FG FG FG FM

FH FH FH FK

Rated Voltage

(VDC)

Cap

Code

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Case Size/

Series

C1210C

C1808C

C1812C

C1825C

C2220C

C2225C

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)

C1018_X7R_SnPb_SMD • 2/29/2016

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd

Case Size/

C1210C

C1808C

C1812C

C1825C

C2220C

C2225C

Series

5

1

2

3

5

1

2

A

3

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

A

5

1

2

A

5

1

2

A

Cap

Rated Voltage

(VDC)

Code

Capacitance

Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

10 µF

12 µF

15 µF

18 µF

22 µF

106

126

156

186

226

J

K

M

FH¹ FH¹ FH¹ FS

GK

JF JO

JO JO

JO

FM FM

FS FS

Rated Voltage

(VDC)

Cap

Code

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Case Size/

Series

C1210C

C1808C

C1812C

C1825C

C2220C

C2225C

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹

Range (mm)

7" Reel

13" Reel

BB

CF

DN

DP

DE

DG

DH

EB

EC

EN

ED

EE

EF

EM

EG

EH

FB

FC

FD

FE

FF

0402

0603

0805

1206

1210

0.50 ± 0.05

0.80 ± 0.07

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.25 ± 0.15

1.25 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

1.25 ± 0.15

1.60 ± 0.15

1.60 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.55 ± 0.15

10,000

4,000

0

50,000

15,000

0

2,500

4,000

2,500

2,000

4,000

2,500

2,000

10,000

8,000

10,000

8,000

4,000

10,000

0

FG

FL

FH

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric)

case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.

C1018_X7R_SnPb_SMD • 2/29/2016

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities cont'd

Paper Quantity¹

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹

Range (mm)

FM

FJ

1210

1706

1808

1812

1825

2220

2225

1.70 ± 0.20

1.85 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

0.90 ± 0.10

1.00 ± 0.15

0.90 ± 0.10

1.00 ± 0.15

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.30 ± 0.10

1.40 ± 0.15

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

2.50 ± 0.20

1.10 ± 0.15

1.15 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

2.40 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

0

2,000

8,000

0

2,000

1,000

4,000

2,500

1,000

500

1,000

500

8,000

4,000

10,000

4,000

2,000

4,000

2,000

4,000

FK

FS

NA

NC

LD

LF

GB

GC

GD

GE

GH

GG

GK

GJ

GO

HB

HC

HD

HE

HF

JB

JC

JD

JE

JF

JO

KB

KC

KD

KE

1,000

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric)

case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.

C1018_X7R_SnPb_SMD • 2/29/2016

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

Packaging C-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be included in the 15th

through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without

a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through

22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "Bulk Bag" packaging.

C1018_X7R_SnPb_SMD • 2/29/2016

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0402

0603

0805

1206

1210

1210¹

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.50

0.72

2.20

1.20

0.45

0.62

1.90

1.00

0.40

0.52

1.60

0.80

0.90

1.00

1.60

1.50

2.30

2.15

2.75

2.70

1.15

1.35

1.60

1.75

1.60

1.70

1.10

1.55

1.90

2.80

2.90

2.30

3.60

6.90

5.50

6.90

4.00

4.40

5.60

5.65

5.60

7.40

6.90

8.20

8.10

2.10

2.60

2.90

3.80

3.90

3.30

4.60

7.90

6.50

7.90

0.80

0.90

1.50

1.40

2.20

2.05

2.65

2.60

0.95

1.15

1.40

1.55

1.40

1.50

1.00

1.45

1.80

2.70

2.80

2.20

3.50

6.80

5.40

6.80

3.10

3.50

4.70

6.50

6.00

7.30

7.20

1.50

2.00

2.30

3.20

3.30

2.70

4.00

7.30

5.90

7.30

0.60

0.75

1.40

1.30

2.10

1.95

2.55

2.50

0.75

0.95

1.20

1.35

1.20

1.30

0.90

1.35

1.70

2.60

2.70

2.10

3.40

6.70

5.30

6.70

2.40

2.80

4.00

5.80

5.30

6.60

6.50

1.20

1.70

2.00

2.90

3.00

2.40

3.70

7.00

5.60

7.00

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1018_X7R_SnPb_SMD • 2/29/2016 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,

IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s

recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-STD-020 standard for moisture

sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at these conditions.

T_P

T_L

Termination Finish

t_P

Maximum Ramp Up Rate = 3°C/sec

Maximum Ramp Down Rate = 6°C/sec

Proﬁle Feature

SnPb

100% Matte Sn

t_L

Preheat/Soak

T_smax

T_smin

Temperature Minimum (T_Smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

100°C

150°C

200°C

)

t_S

60 – 120 seconds

Ramp-Up Rate (T_Lto T_P)

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

3°C/second maximum 3°C/second maximum

25

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

25° C to Peak

Time

Time Within 5°C of Maximum

Peak Temperature (t_P)

20 seconds maximum 30 seconds maximum

Ramp-Down Rate (T_Pto T_L) 6°C/second maximum 6°C/second maximum

Time 25°C to Peak

6 minutes maximum

8 minutes maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1018_X7R_SnPb_SMD • 2/29/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

MIL–STD–202 Method 103

1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/- 4 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement

at 24 hours +/- 4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/- 4 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required.

Measurement at 24 hours +/- 4 hours after test conclusion.

−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell

time – 15 minutes. Air – Air.

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

MIL–STD–202 Method 108

/EIA–198

High Temperature Life

Storage Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

Vibration

MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

C1018_X7R_SnPb_SMD • 2/29/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Construction

Detailed Cross Section

Dielectric Material

(BaTiO₃)

Dielectric Material

(BaTiO₃)

Barrier Layer

(Ni)

Termination Finish

(SnPb - 5% Pb min)

End Termination/

External Electrode

(Cu)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(SnPb - 5% Pb min)

Inner Electrodes

(Ni)

C1018_X7R_SnPb_SMD • 2/29/2016 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be marked

as an extra cost option. Marking is available on most KEMET

devices but must be requested using the correct ordering

code identiﬁer(s). If this option is requested, two sides of the

ceramic body will be laser marked with a “K” to identify KEMET,

followed by two characters (per EIA–198 - see table below) to

identify the capacitance value. EIA 0603 case size devices are

limited to the “K” character only.

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

2-Digit

KEMET

Capacitance

ID

Code

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive Grade stacked devices.

• X7R dielectric products in capacitance values outlined below

EIA Case Size

0603

Metric Size Code

Capacitance

≤ 170 pF

1608

2012

3216

3225

4520

4532

4564

5650

5664

0805

≤ 150 pF

1206

≤ 910 pF

1210

≤ 2,000 pF

≤ 3,900 pF

≤ 6,700 pF

≤ 0.018 µF

≤ 0.027 µF

≤ 0.033 µF

1808

1812

1825

2220

2225

C1018_X7R_SnPb_SMD • 2/29/2016 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

G

H

J

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000 1,000,000

110,000 1,100,000

120,000 1,200,000

130,000 1,300,000

150,000 1,500,000

160,000 1,600,000

180,000 1,800,000

200,000 2,000,000

220,000 2,200,000

240,000 2,400,000

270,000 2,700,000

300,000 3,000,000

330,000 3,300,000

360,000 3,600,000

390,000 3,900,000

430,000 4,300,000

470,000 4,700,000

510,000 5,100,000

560,000 5,600,000

620,000 6,200,000

680,000 6,800,000

750,000 7,500,000

820,000 8,200,000

910,000 9,100,000

250,000 2,500,000

350,000 3,500,000

400,000 4,000,000

450,000 4,500,000

500,000 5,000,000

600,000 6,000,000

700,000 7,000,000

800,000 8,000,000

900,000 9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

0.22

0.24

0.27

0.3

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1018_X7R_SnPb_SMD • 2/29/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel

13" Reel

7" Reel

13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs

• Double the parts on each reel results in fewer reel

changes and increased efﬁciency

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1018_X7R_SnPb_SMD • 2/29/2016 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1018_X7R_SnPb_SMD • 2/29/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

Note 2

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1018_X7R_SnPb_SMD • 2/29/2016 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 5 – Bending Radius

Figure 4 – Maximum Lateral Movement

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1018_X7R_SnPb_SMD • 2/29/2016 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1018_X7R_SnPb_SMD • 2/29/2016 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1018_X7R_SnPb_SMD • 2/29/2016 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Sasso Marconi, Italy

Tel: 39-051-939111

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Skopje, Macedonia

Tel: 389-2-55-14-623

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5877-1075

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Seoul, South Korea

Tel: 82-2-6294-0550

Northern Europe

Wyboston, United Kingdom

Tel: 44-1480-273082

Taipei, Taiwan

Tel: 886-2-27528585

North America

Northeast

Wilmington, MA

Tel: 978-658-1663

Espoo, Finland

Tel: 358-9-5406-5000

Southeast Asia

Singapore

Tel: 65-6701-8033

Southeast

Lake Mary, FL

Tel: 407-855-8886

Penang, Malaysia

Tel: 60-4-6430200

Central

Novi, MI

Tel: 248-994-1030

Bangalore, India

Tel: 91-806-53-76817

Irving, TX

Tel: 972-915-6041

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1018_X7R_SnPb_SMD • 2/29/2016 22

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use. The Information is intended for use only

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

C1018_X7R_SnPb_SMD • 2/29/2016 23


型号：	C1825C226KARALTU
厂家：	KEMET CORPORATION
描述：	Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
文件：	总23页 (文件大小：1435K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1825C226KARALTU [KEMET]

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