T510X687M004ATE0307280

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors

T510 Multiple Anode Low ESR MnO₂Series

Overview

The low ESR, surge-robust T510 Series is designed for

demanding applications that require high surge current and

high ripple current capability. This series builds upon the proven

capabilities of our industrial grade tantalum chip capacitors to

offer several advantages such as low ESR, high ripple current

capability, excellent capacitance stability, and improved resistance

toꢀhighꢀin-rushꢀcurrents.ꢀTheseꢀbeneﬁtsꢀareꢀachievedꢀthoughꢀtheꢀ

utilization of multiple anodes as well as high-stress, low impedance

electrical conditioning performed prior to screening.

Applications

Beneﬁts

• Meets or exceeds EIA Standard 535BAAC

• Taped and reeled per EIA 481–1

• High surge current capability

• Optional gold-plated terminations

• High ripple current capability

Typicalꢀapplicationsꢀincludeꢀdecouplingꢀandꢀﬁlteringꢀinꢀindustrialꢀ

and automotive end applications, such as DC/DC converters,

portable electronics, telecommunications, and control units

requiring high ripple current capability.

• 100% surge current test

• 100% steady-state accelerated aging

•ꢀ Capacitanceꢀvaluesꢀofꢀ10ꢀμFꢀtoꢀ1,000ꢀμF

• Tolerances of ±10% and ±20%

• Voltage rating of 4 to 50 VDC

• Case sizes E and X

•ꢀ ESRꢀasꢀlowꢀasꢀ10ꢀmΩ

• RoHS Compliant and lead-free terminations

•ꢀ Operatingꢀtemperatureꢀrangeꢀofꢀ-55˚Cꢀtoꢀ+125˚C

Environmental Compliance

RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder.

SPICE

Forꢀaꢀdetailedꢀanalysisꢀofꢀspeciﬁcꢀpartꢀnumbers,ꢀpleaseꢀvisitꢀwww.kemet.comꢀforꢀaꢀfreeꢀdownloadꢀofꢀKEMET'sꢀSPICEꢀsoftware.ꢀ

The KEMET SPICE program is freeware intended to aid design engineers in analyzing the performance of these capacitors over

frequency, temperature, ripple, and DC bias conditions.

One world. One KEMET

T2014_T510 • 10/3/2013

1

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Ordering Information

T

510

X

477

M

006

A

T

E800

Capacitor

Class

Capacitance

Codeꢀ(pF)

Capacitance

Tolerance

FailureꢀRate/

Design

Packaging

(C-Spec)

Series

Case Size

E, X

Voltage

Lead Material

ESR

T =

Tantalum

Multiple

Anode

Low ESR

Firstꢀtwoꢀdigitsꢀ

K = ±10%

004 = 4 V

A = N/A

006 = 6.3 V Z = N/A

010 = 10 V

T = 100% Matte Tin Last three

(Sn) Plated

H = Standard Solder ESR in mΩ.

Coated (SnPb 5%

Pb minimum)

Blank = 7" Reel

digits specify 7280 = 13" Reel

representꢀsigniﬁcantꢀ M = ±20%

ﬁgures.ꢀThirdꢀdigitꢀ

speciﬁesꢀnumberꢀofꢀ

zeros.

016 = 16 V

020 = 20 V

(800 = 800

mΩ)

025 = 25 V

035 = 35 V

G = Gold Plated (A,

B, C, D, X only)

050 = 50 V

Performance Characteristics

Item

Performance Characteristics

Operating Temperature

Rated Capacitance Range

Capacitance Tolerance

Rated Voltage Range

DFꢀ(120ꢀHz)

-55°C to 125°C

10ꢀ–ꢀ1,000ꢀµFꢀ@ꢀ120ꢀHz/25°C

K Tolerance (10%), M Tolerance (20%)

4 – 50 V

ReferꢀtoꢀPartꢀNumberꢀElectricalꢀSpeciﬁcationꢀTableꢀ

≤ꢀ0.01ꢀCVꢀ(µA)ꢀatꢀratedꢀvoltageꢀafterꢀ5ꢀminutes

ESR (100 kHz)

Leakage Current

T2014_T510 • 10/3/2013

2

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Qualiﬁcation

Test

Condition

Characteristics

Within ±10% of initial value

Within initial limits

ΔC/C

DF

85°Cꢀ@ꢀratedꢀvoltage,ꢀ2,000ꢀhours

125°Cꢀ@ꢀ2/3ꢀratedꢀvoltage,ꢀ2,000ꢀhours

Endurance

DCL

ESR

ΔC/C

DF

Within 1.25 x initial limit

Within initial limits

Within ±10% of initial value

Within initial limits

Storage Life

125°Cꢀ@ꢀ0ꢀvolts,ꢀ2,000ꢀhours

DCL

ESR

ΔC/C

DF

Within 1.25 x initial limit

Within initial limits

Within ±5% of initial value

Within initial limits

MIL–STD–202, Method 107, Condition B, mounted, -55C° to

125° C, 1,000 cycles

Thermal Shock

DCL

ESR

+25°C

IL*

Within 1.25 x initial limit

Within initial limits

-55°C

±10%

IL

+85°C

±10%

+125°C

±20%

Extreme temperature exposure at a

successionꢀofꢀcontinuousꢀstepsꢀatꢀ+25ºC,ꢀ

-55ºC,ꢀ+25ºC,ꢀ+85ºC,ꢀ+125ºC,ꢀ+25ºC

ΔC/C

Temperature Stability

DF

IL

1.5 x IL

10 x IL

1.5 x IL

12 x IL

DCL

IL

n/a

ΔC/C

DF

Within ±5% of initial value

Within initial limits

25°C and 85°C, 1.32 x rated voltage 1,000 cycles

(125°C, 1.2 x rated voltage)

Surge Voltage

DCL

ESR

ΔC/C

DF

Within initial limits

Within ±10% of initial value

Within initial limits

MIL–STD–202, Method 213, Condition I, 100 G peak

MIL–STD–202, Method 204, Condition D, 10 Hz to 2,000 Hz,

20 G peak

Mechanical Shock/Vibration

DCL

Within initial limits

*IL = Initial limit

T2014_T510 • 10/3/2013

3

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Electrical Characteristics

Capacitanceꢀvs.ꢀFrequency

Impedance,ꢀESRꢀvs.ꢀFrequency

100

10

1

T510X226M035ATE100_IMP

T510X336M035ATE065_IMP

T510E476M035ATE050_IMP

T510X226M035ATE100_ESR

T510X336M035ATE065_ESR

T510E476M035ATE050_ESR

10

1

T510X226M035ATE100

T510X336M035ATE065

T510E476M035ATE050

0.1

0.01

100

1,000

10,000

100,000

1,000,000

10,000,000

100

1,000

10,000

100,000

1,000,000

10,000,000

Frequency (Hz)

Dimensions – Millimeters (Inches)

Metric will govern

Termination

cutout at

KEMET’s

option,

either end

Case Size

Component

F*ꢀ±0.1ꢀ S* ±0.3 B* ±0.15

±(.004) ±(.012) (Ref) ±.006

KEMET EIA

L*

W*

H*

X (Ref)

P (Ref) R (Ref) T (Ref) A (Min) G (Ref) E (Ref)

7.3 ±0.3

4.3 ±0.3

4.0 ±0.3

0.10 ± 0.10

(.004 ± .004)

0.10 ± 0.10

7343–43

2.4 (.094) 1.3 (.051)

4.1 (.161) 1.3 (.051)

0.5 (.020)

1.7 (.067)

n/a

1.0 (.039) 0.13 (.005) 3.8 (.150) 3.5 (.138) 3.5 (.138)

n/a 0.13 (.005) 3.8 (.150) 3.5 (.138) 3.5 (.138)

X

(0.287 ±0.012) (0.169 ±0.012) (0.157 ±0.012)

7.3 ±0.3 6.0±0.3 3.6 ±0.2

(0.287 ±0.012) (0.236 ±0.012) (0.142 ±0.008)

7360–38

E

(.004 ± .004)

Notes: (Ref) – Dimensions provided for reference only. No dimensions are provided for B, P or R because low proﬁle cases do not have a bevel or a notch.

* MIL–PRF–55365/8 speciﬁed dimensions

T2014_T510 • 10/3/2013

4

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Table 1 – Ratings & Part Number Reference

Rated Rated Case Code/

KEMET Part

Number

DC

Leakage

Maximum Allowable

Ripple Current

Moisture

Sensitivity

Reﬂow Temp

≤ 260ºC

DF

ESR

Voltage Cap

Case Size

(See below for

µAmps +20ºC % @ +20ºC mΩ @ 20ºC (mA) 100 kHz (mA) 100 kHz (mA) 100 kHz

VDC

µF

KEMET/EIA

part options)

Max/5 Min

27.2

40.0

29.6

42.8

33.0

24.0

35.2

20.0

17.0

25.0

7.7

120 Hz Max 100 kHz Max

25ºC

3000

3873

3426

3979

5339

3000

3426

2449

3520

4873

2777

3000

2598

3286

2777

2598

2449

2387

1643

1837

2121

2038

2324

2216

2038

2387

1500

1732

1643

+85ºC

2700

3486

3083

3581

4805

2700

3083

2204

3168

4386

2499

2700

2338

2957

2499

2338

2204

2148

1479

1653

1909

1834

2092

1994

1834

2148

1350

1559

1479

+125ºC

1200

1549

1370

1592

2136

1200

1370

980

1408

1949

1111

1200

1039

1314

1111

1039

980

955

657

735

848

815

930

886

4

680

1000

470

680

330

150

220

100

68

100

22

33

47

X/7343-43

E/7360-38

X/7343-43

E/7360-38

X/7343-43

E/7360-38

X/7343-43

E/7360-38

X/7343-43

T510X687(1)004A(2)E030

T510X108(1)004A(2)E018

T510X108(1)004A(2)E023

T510E108(1)004A(2)E018

T510E108(1)004A(2)E010

T510X477(1)006A(2)E030

T510X687(1)006A(2)E023

T510X687(1)006A(2)E045

T510E687(1)006A(2)E023

T510E687(1)006A(2)E012

T510X337(1)010A(2)E035

T510X157(1)016A(2)E030

T510X157(1)016A(2)E040

T510X227(1)016A(2)E040

T510X227(1)016A(2)E025

T510X107(1)020A(2)E035

T510X107(1)020A(2)E040

T510X107(1)020A(2)E045

T510X686(1)025A(2)E045

T510E107(1)025A(2)E050

T510X226(1)035A(2)E100

T510X226(1)035A(2)E080

T510X226(1)035A(2)E060

T510X336(1)035A(2)E065

T510X336(1)035A(2)E050

T510X476(1)035A(2)E055

T510X476(1)035A(2)E065

T510E476(1)035A(2)E050

T510X106(1)050A(2)E120

T510X106(1)050A(2)E090

T510X226(1)050A(2)E100

6.0

12.0

6.0

10.0

8.0

6.0

8.0

6.0

8.0

30

18

23

18

10

30

23

45

23

12

35

30

40

25

35

40

45

50

100

80

60

65

50

55

65

50

120

90

100

1

4

6.3

10

16

20

25

35

50

7.7

11.6

16.5

5.0

815

955

600

693

10

22

5.0

11.0

657

(See below for

part options)

µAmps +20ºC % @ +20ºC mΩ @ 20ºC (mA) 100 kHz (mA) 100 kHz (mA) 100 kHz

Reﬂow Temp

≤ 260ºC

VDC

µF

KEMET/EIA

Max/5 Min

120 Hz Max 100 kHz Max

25ºC

+85ºC

+125ºC

Rated

Voltage

Rated

Cap

Case Code/

Case Size

KEMET Part

Number

DC

Leakage

Maximum Allowable

Ripple Current

Moisture

Sensitivity

DF

ESR

(1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates Capacitance tolerance.

(2) To complete KEMET part number, insert T = 100% Matte Tin (Sn) Plated, G = Gold Plated, H = Standard Solder coated (SnPb 5% Pb minimum).

Designates Termination Finish.

Refer to Ordering Information for additional detail.

Higher voltage ratings and tighter tolerance product including ESR may be substituted within the same size at KEMET's option. Voltage substitution will be marked

with the higher voltage rating. Substitutions can include better than series.

T

510

X

477

M

006

A

T

E800

Capacitor

Class

Capacitance

Codeꢀ(pF)

Capacitance

Tolerance

FailureꢀRate/

Design

Packaging

(C-Spec)

Series

Case Size

E, X

Voltage

Lead Material

ESR

T =

Tantalum

Multiple

Anode

Low ESR

Firstꢀtwoꢀdigitsꢀ

K = ±10%

004 = 4 V

A = N/A

006 = 6.3 V Z = N/A

010 = 10 V

T = 100% Matte Tin Last three

(Sn) Plated

H = Standard Solder ESR in mΩ.

Coated (SnPb 5%

Pb minimum)

Blank = 7" Reel

digits specify 7280 = 13" Reel

representꢀsigni ꢀcantꢀ M = ±20%

ꢀgures.ꢀThirdꢀdigitꢀ

speci ꢀesꢀnumberꢀofꢀ

zeros.

016 = 16 V

020 = 20 V

(800 = 800

mΩ)

025 = 25 V

035 = 35 V

G = Gold Plated (A,

B, C, D, X only)

050 = 50 V

T2014_T510 • 10/3/2013

5

Roll Over for

Order Info.

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Recommended Voltage Derating Guidelines

120%

-55°C to 85°C

V_R

85°C to 125°C

67% of V_R

% Change in Working DC

Voltage with Temperature

Recommended Maximum

Application Voltage

100%

80%

60%

40%

20%

0%

50% of V_R

33% of V_R

% Change in Working DC Voltage

with Temperature

67%

33%

Recommended Maximum

Application Voltage (As %

of Rated Voltage)

-55

25

85

125

Temperature (ºC)

Ripple Current/Ripple Voltage

Permissible AC ripple voltage and current are related to equivalent

series resistance (ESR) and the power dissipation capabilities of

the device. Permissible AC ripple voltage which may be applied is

limited by two criteria:

1. The positive peak AC voltage plus the DC bias voltage, if any,

must not exceed the DC voltage rating of the capacitor.

2. The negative peak AC voltage in combination with bias

voltage,ꢀifꢀany,ꢀmustꢀnotꢀexceedꢀtheꢀallowableꢀlimitsꢀspeciﬁedꢀforꢀ

reverse voltage. See the Reverse Voltage section for allowable

limits.

The maximum power dissipation by case size can be determined

using the table at right. The maximum power dissipation rating

stated in the table must be reduced with increasing environmental

operating temperatures. Refer to the table below for temperature

compensation requirements.

Maximum Power

Dissipation (P max)

mWatts @ 25°C

w/+20°C Rise

KEMET

Case Code

EIA

Case Code

A

3216–18

3528–21

6032–28

7343–31

7343–43

7360–38

3216–12

3528–12

6032–15

7343–20

7343–43

7360–38

75

B

85

C

110

150

165

200

60

D

X

E

S

T

70

U

90

V

125

270

285

T510X

T510E

The maximum power dissipation rating must be reduced with increasing

environmental operating temperatures. Refer to the Temperature

Compensation Multiplier table for details.

Temperature Compensation Multipliers

for Maximum Power Dissipation

Tꢀ≤ꢀ25°C

Tꢀ≤ꢀ85°C

Tꢀ≤ꢀ125°C

1.00

0.90

0.40

T= Environmental Temperature

Using the P max of the device, the maximum allowable rms ripple

current or voltage may be determined.

I(max) = √P max/R

E(max) = Z √P max/R

I = rms ripple current (amperes)

E = rms ripple voltage (volts)

R = ESR at speciﬁed frequency (ohms)

Z = Impedance at speciﬁed frequency (ohms)

P max = maximum power dissipation (watts)

T2014_T510 • 10/3/2013

6

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Reverse Voltage

Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The

positiveꢀterminalꢀisꢀidentiﬁedꢀonꢀtheꢀcapacitorꢀbodyꢀbyꢀaꢀstripeꢀplusꢀinꢀsomeꢀcasesꢀaꢀbeveledꢀedge.ꢀAꢀsmallꢀdegreeꢀofꢀtransientꢀreverseꢀ

voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within

these limits.

Temperature

Permissible Transient Reverse Voltage

25°C

85°C

15% of Rated Voltage

5% of Rated Voltage

1% of Rated Voltage

125°C

Table 2 – Land Dimensions/Courtyard

Metric

Size

Code

Density Level A:

Maximum (Most) Land

Protrusion (mm)

Density Level B:

Median (Nominal) Land

Protrusion (mm)

Density Level C:

Minimum (Least) Land

Protrusion (mm)

KEMET

Case

A

EIA

W

L

S

V1

V2

W

L

S

V1

V2

W

L

S

V1

V2

3216–18

3528–21

6032–25

7343–31

6032-19

3528-15

7360-20

7360–38

7343-12

2012-12

3216–12

3528–12

6032–15

7343–20

7343–15

1.35

2.35

2.55

2.35

4.25

2.55

1.05

1.35

2.35

2.55

2.20

2.21

2.77

2.20

2.77

1.83

2.20

2.77

0.62

0.92

2.37

3.67

2.37

0.92

3.67

0.15

0.62

0.92

2.37

3.67

6.02

2.80

4.00

4.50

5.60

4.50

4.00

7.30

5.60

2.50

2.80

4.00

4.50

5.60

1.23

2.23

2.43

2.23

4.13

2.43

0.93

1.23

2.23

2.43

1.80

2.37

1.80

2.37

1.50

1.80

2.37

0.82

1.12

2.57

3.87

2.57

1.12

3.87

0.22

0.82

1.12

2.57

3.87

4.92

5.22

7.82

9.12

7.82

5.22

9.12

3.72

4.92

5.22

7.82

9.12

2.30

3.50

4.00

5.10

4.00

3.50

6.80

5.10

2.00

2.30

3.50

4.00

5.10

1.13

2.13

2.33

2.13

4.03

2.33

0.83

1.13

2.13

2.33

1.42

1.99

1.42

1.99

1.12

1.42

1.99

0.98

1.28

2.73

4.03

2.73

1.28

4.03

0.38

0.98

1.28

2.73

4.03

4.06

4.36

6.96

8.26

6.96

4.36

8.26

2.86

4.06

4.36

6.96

8.26

2.04

3.24

3.74

4.84

3.74

3.24

6.54

4.84

1.74

2.04

3.24

3.74

4.84

B

6.32

C

8.92

10.22

8.92

6.32

D

L

M

H

10.22

4.82

1

E

Q

R²

S²

T

6.02

6.32

U

8.92

10.22

V

W

X¹

Y¹

7343–43

7343–40

2.55

2.77

3.67

10.22

5.60

2.43

2.37

3.87

9.12

5.10

2.33

1.99

4.03

8.26

4.84

Density Level A: For low-density product applications. Recommended for wave solder applications and

provides a wider process window for reﬂow solder processes.

Density Level B: For products with a moderate level of component density. Provides a robust solder

attachment condition for reﬂow solder processes.

Density Level C: For high component desity product applications. Before adapting the minimum land

pattern variations the user should perform qualiﬁcation testing based on the conditions outlined in IPC

standard 7351 (IPC–7351).

¹ Height of these chips may create problems in wave soldering.

²Land pattern geometry is too small for silkscreen outline.

T2014_T510 • 10/3/2013

7

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Soldering Process

KEMET’s families of surface mount capacitors are compatible

Proﬁle Feature

SnPb Assembly Pb-Free Assembly

withꢀwaveꢀ(singleꢀorꢀdual),ꢀconvection,ꢀIR,ꢀorꢀvaporꢀphaseꢀreﬂowꢀ

Preheat/Soak

techniques. Preheating of these components is recommended

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

toꢀavoidꢀextremeꢀthermalꢀstress.ꢀKEMET'sꢀrecommendedꢀproﬁleꢀ

conditionsꢀforꢀconvectionꢀandꢀIRꢀreﬂowꢀreﬂectꢀtheꢀproﬁleꢀconditionsꢀ

of the IPC/J–STD–020D standard for moisture sensitivity testing.

Theꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreﬂowꢀ

passes at these conditions.

Temperature Maximum (T_Smax

)

Time (t_s) from T_sminto T_smax

Ramp-up Rate (T_Lto T_P)

)

60 – 120 seconds

3°C/seconds maximum

183°C

60 – 120 seconds

3°C/seconds maximum

217°C

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

60 – 150 seconds

220°C*

235°C**

250°C*

260°C**

Peak Temperature (T_P)

Please note that although the X/7343–43 case size can withstand

waveꢀsoldering,ꢀtheꢀtallꢀproﬁleꢀ(4.3ꢀmmꢀmaximum)ꢀdictatesꢀcareꢀinꢀ

wave process development.

Time within 5°C of Maximum

Peak Temperature (t_P)

20 seconds maximum

6°C/seconds maximum

6 minutes maximum

30 seconds maximum

6°C/seconds maximum

8 minutes maximum

Ramp-down Rate (T_Pto T_L)

Time 25°C to Peak Temperature

Handꢀsolderingꢀshouldꢀbeꢀperformedꢀwithꢀcareꢀdueꢀtoꢀtheꢀdifﬁcultyꢀ

in process control. If performed, care should be taken to avoid

contact of the soldering iron to the molded case. The iron should

be used to heat the solder pad, applying solder between the pad

andꢀtheꢀtermination,ꢀuntilꢀreﬂowꢀoccurs.ꢀOnceꢀreﬂowꢀoccurs,ꢀtheꢀ

iron should be removed immediately. “Wiping” the edges of a chip

and heating the top surface is not recommended.

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reﬂow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

T_P

t_P

Maximum Ramp Up Rate = 3ºC/seconds

Maximum Ramp Down Rate = 6ºC/seconds

T_L

t_L

Duringꢀtypicalꢀreﬂowꢀoperations,ꢀaꢀslightꢀdarkeningꢀofꢀtheꢀgold-

colored epoxy may be observed. This slight darkening is normal

and not harmful to the product. Marking permanency is not

affected by this change.

T

smax

T

smin

t_S

25

25ºC to Peak

Time

Construction

MnO₂/Ta₂O₅/Ta

Silver Paint

Silver Adhesive

Washer

Leadframe

(-Cathode)

Leadframe

(+Anode)

Carbon

Tantalum Wire

Weld

T2014_T510 • 10/3/2013

8

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Capacitor Marking

KEMET

Multiple

Anode

MnO₂

KEMET

Multiple

Anode

MnO₂

Polarity

Indicator (+)

Polarity

Indicator (+)

M+

KEMET ID

Picofarad Code

KEMET ID

337

10 ^K

230

Rated

Voltage

Rated

Voltage

Picofarad

Code

Date

Code*

Internal

Code

Date

Code*

C6

49

* 230 = 30^thweek of 2012

Date Code *

Date Code*

1^stdigit = Last number of Year

9 = 2009

Year

Month

0 = 2010

1 = 2011

2 = 2012

3 = 2013

4 = 2014

X = 2009

A = 2010

B = 2011

C = 2012

D = 2013

E = 2014

1 = Jan

2ꢀ=ꢀFeb

3 = Mar

4 = Apr

5 = May

6 = Jun

7 = Jul

8 = Aug

9 = Spt

O = Oct

N = Nov

D = Dec

2^ndand 3^rddigit = Week of the Year

01 = 1^stweek of the Year to

52 = 52^ndweek of the Year

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀstorageꢀhumidityꢀnotꢀexceedꢀ60%ꢀ

relativeꢀhumidity.ꢀTemperatureꢀﬂuctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀtheꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀ

chlorineꢀandꢀsulphurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀshouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀthreeꢀyearsꢀ

of receipt.

T2014_T510 • 10/3/2013

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Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Tape & Reel Packaging Information

KEMET’s molded tantalum and aluminum chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in

accordance with EIA Standard 481–1: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging

system is compatible with all tape-fed automatic pick-and-place systems.

8 mm (0.315")

or

12 mm (0.472")

180 mm (7.0")

Top Tape Thickness

or

0.10 mm (0.004")

330 mm (13.0")

Maximum Thickness

Table 3 – Packaging Quantity

Tape Width

Case Code

7" Reel*

13" Reel*

(mm)

KEMET

EIA

I

S

T

M

U

L

W

Z

V

A

B

C

D

Y

3216-10

3216-12

3528-12

3528-15

6032-15

6032-19

7343-15

7343-17

7343-20

3216-18

3528-21

6032-28

7343-31

7343-40

7343-43

7360-38

7360-20

8

12

8

3,000

2,500

2,000

1,000

2,000

500

12,000

10,000

8,000

5,000

3,000

9,000

8,000

3,000

2,500

2,000

2,500

8

12

500

X

E/T428P

H

1,000

* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.

T2014_T510 • 10/3/2013 10

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 4 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

R Reference S₁Minimum

Tape Size

8 mm

D₀

E₁

P₀

P₂

T Maximum T₁Maximum

Note 2

25.0

Note 3

(0.039)

(0.984)

1.5ꢀ+0.10/-0.0ꢀ

(0.059ꢀ+0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

0.100

12 mm

16 mm

1.5

(0.059)

30

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

(0.024)

(0.004)

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

8.2

(0.323)

12.1

(0.476)

Tape Size

8 mm

Pitch

E₂Minimum

Fꢀ

P₁

T₂Maximum W Maximum

A₀, B₀& K₀

6.25

(0.246)

10.25

(0.404)

14.25

(0.561)

3.5 ±0.05

4.0 ±0.10

2.5

(0.098)

4.6

8.3

(0.327)

12.3

Single (4 mm)

(0.138 ±0.002) (0.157 ±0.004)

5.5 ±0.05 8.0 ±0.10

(0.217 ±0.002) (0.315 ±0.004)

5.5 ±0.05 8.0 ±0.10

(0.217 ±0.002) (0.315 ±0.004)

Single (4 mm) &

Double (8 mm)

12 mm

16 mm

Note 5

(0.181)

4.6

(0.484)

16.3

Triple (12 mm)

(0.181)

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape, with or without components, shall pass around R without damage (see Figure 5).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).

(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.

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Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Bending Radius

Figure 3 – Maximum Lateral Movement

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

T2014_T510 • 10/3/2013 12

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Figure 5 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 5 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0ꢀ+0.5/-0.2ꢀ

(0.521ꢀ+0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4ꢀ+1.5/-0.0

(0.331ꢀ+0.059/-0.0)

12.4ꢀ+2.0/-0.0

(0.488ꢀ+0.078/-0.0)ꢀꢀ

16.4ꢀ+2.0/-0.0

14.4

(0.567)

18.4

(0.724)

22.4

50

(1.969)

Shall accommodate tape width

without interference

12 mm

16 mm

(0.646ꢀ+0.078/-0.0)

(0.882)

T2014_T510 • 10/3/2013 13

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Figure 6 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 7 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

T2014_T510 • 10/3/2013 14

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris,ꢀFrance

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax:ꢀ864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

FortꢀLauderdale,ꢀFL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

LakeꢀMary,ꢀFL

Tel: 407-855-8886

Espoo,ꢀFinland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

T2014_T510 • 10/3/2013 15

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

Other KEMET Resources

Tools

Resource

Location

Con ꢀgureꢀAꢀPart:ꢀCapEdge

SPICEꢀ&ꢀFITꢀSoftware

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

SearchꢀOurꢀFAQs:ꢀKnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀcheckingꢀandꢀ

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

notꢀintendedꢀtoꢀconstituteꢀ–ꢀandꢀKEMETꢀspeci ꢀcallyꢀdisclaimsꢀ–ꢀanyꢀwarrantyꢀconcerningꢀsuitabilityꢀforꢀaꢀspeci ꢀcꢀcustomerꢀapplicationꢀorꢀuse.ꢀTheꢀInformationꢀisꢀintendedꢀforꢀuseꢀonlyꢀ

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

T2014_T510 • 10/3/2013 16

Tantalum Surface Mount Capacitors

Low ESR MnO₂Tantalum & Aluminum Surface Mount Capacitors – T510 Multiple Anode Low ESR MnO₂Series

T2014_T510 • 10/3/2013 17


型号：	T510X687M004ATE0307280
厂家：	KEMET CORPORATION
描述：	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 4V, 20% +Tol, 20% -Tol, 680uF, Surface Mount, 2917, CHIP, ROHS COMPLIANT 电容器
文件：	总17页 (文件大小：1099K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

T510X687M004ATE0307280 [KEMET]

相关型号：

T510X687M004ATE030C-7280

T510X687M004ZTE0357280

T510X687M006AGE023

T510X687M006AGE023C-7280

T510X687M006AGE030

T510X687M006AHE030

T510X687M006ASE030

T510X687M006ATE023

T510X687M006ATE030

T510X687M010AGE030

T510X687M010AHE030

T510X687M010ASE030