KT-2012SYS-J3 [KINGBRIGHT]

SINGLE COLOR LED, SUPER BRIGHT YELLOW, 1.5mm, 2 X 1.20 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN;


型号：	KT-2012SYS-J3
厂家：	KINGBRIGHT CORPORATION
描述：	SINGLE COLOR LED, SUPER BRIGHT YELLOW, 1.5mm, 2 X 1.20 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN 光电
文件：	总8页 (文件大小：354K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

2.0x1.2mm SMD LED WITH CERAMIC

SUBSTRATE

PRELIMINARY SPEC

Part Number: KT-2012SYS-J3

Super Bright Yellow

Features

z Dimensions:2.0mmX1.2mmX0.9mm.

z Ceramic package with silicone encapsulation.

z Ideal for backlight and indicator.

z Package : 2000pcs / reel.

z Moisture sensitivity level : level 2a.

z Soldering methods: IR reflow soldering.

z RoHS compliant.

Package Dimensions

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Specifications are subject to change without notice.

4. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 1 OF 8

CHECKED: Allen Liu

ERP: 1212000103

Selection Guide

Iv (mcd) [2]

@ 20mA

Φv (mlm) [2]

@ 20mA

Viewing

Angle [1]

Part No.

Dice

Lens Type

Min.

480

Typ.

2θ1/2

KT-2012SYS-J3 Super Bright Yellow (AlGaInP)

Notes:

WATER CLEAR

800

2500

120°

1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.

2. Luminous intensity/ luminous Flux: +/-15%.

Absolute Maximum Ratings at Ta=25°C

Parameter

Symbol

Value

Unit

Power dissipation

Reverse Voltage

120

Junction temperature

°C

Operating Temperature

Top

Tstg

-40 To +100

-40 To +120

°C

Storage Temperature

°C

DC Forward Current[1]

Peak Forward Current [2]

Electrostatic Discharge Threshold (HBM)

IFM

140

3000

350

Thermal Resistance (Junction/ambient) [1]

Rth j-a

°C/W

數位簽

署者：y

yalin

Notes:

1. Rth(j-a) Results from mounting on PC board FR4 .

2. 1/10 Duty Cycle, 0.1ms Pulse Width.

Electrical / Optical Characteristics at Ta=25°C

Parameter

Symbol

λ peak

λ dom [1]

Δλ

Value

Unit

Wavelength at peak emission IF=20mA

[Typ.]

590

589

Dominant Wavelength IF=20mA [Typ.]

Spectral bandwidth at 50%Φ REL MAX IF=20mA [Typ.]

Forward Voltage IF=20mA [Min.]

VF [2]

Forward Voltage IF=20mA [Typ.]

Forward Voltage IF=20mA [Max.]

Reverse Current (VR = 5V) [Max.]

Temperature coefficient of λ peak

2.0

2.5

TC λ peak

0.13

0.04

-1.9

nm/° C

IF=20mA, -10 ° C≤ T≤100 ° C

[Typ.]

Temperature coefficient of λ dom

TC λ dom

nm/° C

mV/° C

IF=20mA, -10 ° C≤ T≤100 ° C

[Typ.]

Temperature coefficient of VF

TCV

IF=20mA, -10 ° C≤ T≤100 ° C [Typ.]

Notes:

1.The dominant Wavelength (λ d) above is the setup value of the sorting machine. (Tolerance λ d : ±1nm. )

2. Forward Voltage: +/-0.1V.

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 2 OF 8

ERP: 1212000103

CHECKED: Allen Liu

Super Bright Yellow

KT-2012SYS-J3

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 3 OF 8

CHECKED: Allen Liu

ERP: 1212000103

KT-2012SYS-J3

Reflow soldering is recommended and the soldering profile is shown below.

Other soldering methods are not recommended as they might cause damage to the product.

Reel Dimension

Recommended Soldering Pattern

(Units : mm ; Tolerance: ± 0.1)

Tape Dimensions

(Units : mm)

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 4 OF 8

CHECKED: Allen Liu

ERP: 1212000103

PACKING & LABEL SPECIFICATIONS

KT-2012SYS-J3

Packaging:

1.The LEDs are packed in cardboard boxes after taping.

2.The label on the minimum packing unit shows: Part Number, Lot Number, Ranking, Quantity.

3.In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.

4.The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions

must be taken to prevent any damage.

5.The boxes are not water resistant and therefore must be kept away from water and moisture.

6.When the LEDs are transported, we recommend that you use the same packing methods as Kingbright’s.

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 5 OF 8

CHECKED: Allen Liu

ERP: 1212000103

JEDEC Moisture Sensitivity:

Soak Requirements

Accelerated Equivalent

Level

Floor Life

Standard

Time

Conditions

≤ 30 °C / 60% RH

Time (hours)

Conditions

Time (hours)

Conditions

696²

+ 5 / - 0

120

+ 1 / - 0

4 weeks

30 °C / 60% RH

60 °C / 60% RH

Notes:

1. CAUTION - The ‘‘accelerated equivalent’’ soak requirements shall not be used until correlation of damage response, including electrical, after

soak and reflow is established with the ‘‘standard’’ soak requirements or if the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated

soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for

determining the diffusion coefficient.

2. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and

includes the maximum time allowed out of the bag at the distributor’s facility.

If the actual MET is less than 24 hours the soak time may be reduced. For soak conditions of 30 °C/60% RH the soak time is reduced by one hour

For each hour the MET is less than 24 hours. For soak conditions of 60 °C/60% RH, the soak time is reduced by one hour for each five hours the

MET is less than 24 hours.

If the actual MET is greater than 24 hours the soak time must be increased. If soak conditions are 30 °C/60% RH, the soak time is increased one

Hour for each hour that the actual MET exceeds 24 hours. If soak conditions are 60 °C/60% RH, the soak time is increased one hour for each five

Hours that the actual MET exceeds 24 hours.

3. Supplier may extend the soak times at their own risk.

ESD Protection During Production

Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.

The following procedures may decrease the possibility of ESD damage:

1.Minimize friction between the product and surroundings to avoid static buildup.

2.All production machinery and test instruments must be electrically grounded.

3.Operators must wear anti-static bracelets.

4.Wear anti-static suit when entering work areas with conductive machinery.

5.Set up ESD protection areas using grounded metal plating for component handling.

6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.

7.Maintain a humidity level of 50% or higher in production areas.

8.Use anti-static packaging for transport and storage.

9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.

Heat Generation:

1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making

the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the

circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat

generation and operate within the maximum ratings given in this specification.

2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot

of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas

ures to remove heat from the area near the LED to improve the operational characteristics on the LED.

3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts

Tj = Ta + Rthj-a *W ………

Tj = Ts + Rthj-s *W ………

①

②

Tj = dice junction temperature: °C

Ta = ambient temperature:°C

Ts = solder point temperature:°C

Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C/ W

Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C/ W

W = inputting power (IFx VF) : W

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 6 OF 8

CHECKED: Allen Liu

ERP: 1212000103

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic

significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.

As a result, special handling precautions need to be observed during assembly using silicone encapsulated

LED products. Failure to comply might leads to damage and premature failure of the LED.

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or

damage the internal circuitry.

4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter

of the nozzle should be as large as possible.

5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup

and avoid damage during production.

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 7 OF 8

CHECKED: Allen Liu

ERP: 1212000103

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below

Lot Tolerance Percent Defective (LTPD) : 10%

Test Times /

Cycles

No.

Test Item

Test Conditions

Number of Damaged

T_a= 25 °C , I_F= 30 mA

Tested with standard circuit board ^﹡

Continuous Operating Test

1000 hrs

0/22

High Temperature Operating

Test

T_a= 100 °C , I_F= 5 mA (note)

T_a= -40 °C , I_F= 30 mA

Tested with standard circuit board ^﹡

Low Temperature Operating

Test

High Temperature and

Humidity Storage Operating

Test

T_a= 85 °C , RH = 85% , I_F= 20 mA

(note)

1000 hrs

0/22

High temp: +100 °C 30 mins

∫

R.T : 5 mins

∫

Temperature Cycling Test

10 cycles

0/22

Low temp : -40 °C 30 mins

∫

R.T : 5 mins

High temp : +100 °C 5 mins

∫

Thermal Shock Test

1000 cycles

10 secs

0/22

Low temp : -40 °C 5 mins

Soldering resistance Test

T_sld= 260 °C , 10 secs

Note : Thermal resistance of LED with Kingbright circuit board : Rthj-a = 350°C/W

Failure Criteria

Criteria for Judgement

Item

Symbol

Test Conditions

Min.

Max.

Forward Voltage

Intensity Value

IF = 20 mA

Initial Level x 1.1

Initial Level x 0.7

Note : The test is performed after the board is cooled down to the room temperature.

SPEC NO: DSAI9778

APPROVED: WYNEC

REV NO: V.2

DATE: JAN/09/2009

DRAWN: S.P.Chen

PAGE: 8 OF 8

CHECKED: Allen Liu

ERP: 1212000103

KT-2012SYS-J3 [KINGBRIGHT]

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