KT-2117SY9ZS-VFS [KINGBRIGHT]

SINGLE COLOR LED, SUPER BRIGHT YELLOW, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC PACKAGE-2;


型号：	KT-2117SY9ZS-VFS
厂家：	KINGBRIGHT CORPORATION
描述：	SINGLE COLOR LED, SUPER BRIGHT YELLOW, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC PACKAGE-2 光电
文件：	总8页 (文件大小：339K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

2.15X1.7mm SMD LED WITH CERAMIC

SUBSTRATE

Part Number: KT-2117SY9ZS-VFS

Super Bright Yellow

PRELIMINARY SPEC

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

DISCHARGE

SENSITIVE

DEVICES

Features

z Dimension: 2.15mmX 1.7mm X 0.8mm.

z Low thermal resistance.

z Ceramic package with silicone resin.

z Small package with high efficiency.

z Surface mount technology.

z ESD protection.

Application Note

Static electricity and surge damage the LEDs.

It is recommended to use a wrist band or anti-electrostatic

glove when handling the LEDs.

z Package : 2000pcs / reel.

z Moisture sensitivity level : level 2a.

z Soldering methods: IR reflow soldering.

z RoHS compliant.

All devices, equipment and machinery must be electrically

grounded.

Typical Applications

Room lighting

Architectural lighting

Decorative/pathway lighting

Front panel backlight

Package Dimensions

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Specifications are subject to change without notice.

4. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 1 OF 8

CHECKED: Allen Liu

ERP: 1212000039

Absolute Maximum Ratings at TA=25°C

Parameter

Symbol

Top

Tstg

Value

-40 To +100

-40 To +120

120

Unit

°C

Operating Temperature

Storage Temperature

°C

Junction temperature[1]

DC Forward Current [1]

Peak Forward Current [2]

°C

350

IFM

500

not designed for

reverse operation

Reverse Voltage

Power dissipation

0.98

8000

105

Electrostatic Discharge Threshold (HBM)

Thermal resistance [1] (Junction/ambient)

Rth j-a

°C/W

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Thermal resistance [1] (Junction/solder point)

Notes:

Rth j-semai

yalin

08'00'

1. Results from mounting on metal core PCB,mounted on pc board-metal core PCB is recommend.for lowest thermal resistance.

2. 1/10 Duty Cycle, 0.1ms Pulse Width.

Electrical / Optical Characteristics at T^A=25°C

Parameter

Symbol

λ peak

λ dom [1]

Δλ

Value

598

Unit

Wavelength at peak emission IF=350mA

[Typ.]

Dominant Wavelength IF=350mA [Typ.]

591

Spectral Line Half-width IF=350mA [Typ.]

Forward Voltage IF = 350mA [Min.]

Forward Voltage IF = 350mA [Typ.]

Forward Voltage IF = 350mA [Max.]

1.8

2.3

2.8

VF [2]

not designed for

reverse operation

Reverse Current

μ A

Optical efficiency

19.87

0.12

lm/W

opt

Temperature coefficient of λ peak

TC λ peak

TC λ dom

TCV

nm/° C

mV/° C

IF=350mA, -10 ° C≤ T≤100 ° C

[Typ.]

Temperature coefficient of λ dom

0.07

-3.0

IF=350mA, -10 ° C≤ T≤100 ° C

[Typ.]

Temperature coefficient of VF

IF=350mA, -10 ° C≤ T≤100 ° C [Typ.]

Notes:

1.Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.

2.Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 2 OF 8

CHECKED: Allen Liu

ERP: 1212000039

Selection Guide

Viewing

Luminous Intensity [2] Φv (lm) [3]

Angle [1]

Iv(cd)@ 350mA

@ 350mA

Dice

Lens Type

Part No.

Min.

2.5

Typ.

2 θ 1/2

120 °

KT-2117SY9ZS-VFS Super Bright Yellow (InGaAlP) WATER CLEAR

4.5

Brightness codes

luminous Intensity [2]

Iv(cd) @ 350mA

Φv (lm) [3]

@ 350mA

Code.

Min.

2.5

2.8

3.3

3.8

4.7

Max.

3.3

3.8

4.5

5.5

6.5

Typ.

11.5

15.5

18.5

Notes:

1.θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.

2.Luminous intensity is measured by a current pulse of 10ms at a tolerance of ±15%.

3.The typical data of Luminous Flux can only reflect statistical figures, actual parameters of individual product could differ from the typical data.

For the purpose of product enhancement, the typical data is subject to change without prior notice.

Shipment may contain more than one of the light intensity groups.

Orders for single light intensity group are generally not accepted.

Forward Voltage Groups

Forward Voltage

Unit

Min.

1.8

Max.

2.0

2.2

2.4

2.6

2.8

Notes:

Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.

Shipment may contain more than one of the forward voltage groups.

Orders for single forward voltage group are generally not accepted.

Wavelength Groups

Wavelength

Unit

Code.

Min.

584

586

588

590

592

594

Max.

586

588

590

592

594

597

Note:

Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.

Shipment may contain more than one of the wavelength groups.

Orders for single wavelength group are generally not accepted.

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 3 OF 8

CHECKED: Allen Liu

ERP: 1212000039

KT-2117SY9ZS-VFS

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 4 OF 8

CHECKED: Allen Liu

ERP: 1212000039

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 5 OF 8

CHECKED: Allen Liu

ERP: 1212000039

KT-2117SY9ZS-VFS

Reflow soldering is recommended and the soldering profile is shown below.

Other soldering methods are not recommended as they might cause damage to the product.

Recommended Soldering Pattern

(Units : mm; Tolerance: ± 0.1)

Heat Generation:

1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making

the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the

circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat gen-

eration and operate within the maximum ratings given in this specification.

2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot

of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas-

ures to remove heat from the area near the LED to improve the operational characteristics on the LED.

3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts

Tj = Ta + Rthj-a *W ………

Tj = Ts + Rthj-s *W ………

①

②

Tj = dice junction temperature: °C

Ta = ambient temperature:°C

Ts = solder point temperature:°C

Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C / W

Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C / W

W = inputting power (IFx VF) : W

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 6 OF 8

CHECKED: Allen Liu

ERP: 1212000039

Tape Specifications (Units : mm)

PACKING & LABEL SPECIFICATIONS

KT-2117SY9ZS-VFS

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 7 OF 8

CHECKED: Allen Liu

ERP: 1212000039

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic

significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.

As a result, special handling precautions need to be observed during assembly using silicone encapsulated

LED products. Failure to comply might leads to damage and premature failure of the LED.

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or

damage the internal circuitry.

4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter

of the nozzle should be as large as possible.

5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup

and avoid damage during production.

SPEC NO: DSAI9963

APPROVED: WYNEC

REV NO: V.2

DATE: DEC/25/2008

DRAWN: Y.F.Lu

PAGE: 8 OF 8

CHECKED: Allen Liu

ERP: 1212000039

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