KT-2117SYL1Z1S-VFS [KINGBRIGHT]

SINGLE COLOR LED, SUPER BRIGHT YELLOW, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN;
KT-2117SYL1Z1S-VFS
型号: KT-2117SYL1Z1S-VFS
厂家: KINGBRIGHT CORPORATION    KINGBRIGHT CORPORATION
描述:

SINGLE COLOR LED, SUPER BRIGHT YELLOW, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN

光电
文件: 总9页 (文件大小:348K)
中文:  中文翻译
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2.15X1.7mm SMD LED WITH CERAMIC  
SUBSTRATE  
Part Number: KT-2117SYL1Z1S-VFS  
Super Bright Yellow  
ATTENTION  
OBSERVE PRECAUTIONS  
FOR HANDLING  
ELECTROSTATIC  
DISCHARGE  
SENSITIVE  
DEVICES  
Features  
z Dimension: 2.15mmX 1.7mm X 0.8mm.  
z Low thermal resistance.  
Application Note  
z Ceramic package with silicone resin.  
z Small package with high efficiency.  
z Surface mount technology.  
z ESD protection.  
Static electricity and surge damage the LEDs.  
It is recommended to use a wrist band or anti-electrostatic  
glove when handling the LEDs.  
All devices, equipment and machinery must be electrically  
grounded.  
z Package : 2000pcs / reel.  
z Moisture sensitivity level : level 2a.  
z Soldering methods: IR reflow soldering.  
z RoHS compliant.  
Typical Applications  
Room lighting  
Architectural lighting  
Decorative/pathway lighting  
Front panel backlight  
Package Dimensions  
Notes:  
1. All dimensions are in millimeters (inches).  
2. Tolerance is ±0.25(0.01") unless otherwise noted.  
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.  
4. The device has a single mounting surface. The device must be mounted according to the specifications.  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 1 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
Absolute Maximum Ratings at TA=25°C  
Parameter  
Symbol  
Top  
Tstg  
TJ  
Value  
-40 To +100  
-40 To +110  
110  
Unit  
°C  
Operating Temperature  
Storage Temperature  
°C  
Junction temperature[1]  
°C  
DC Forward Current [1]  
IF  
150  
mA  
mA  
V
Peak Forward Current [2]  
IFM  
270  
Reverse Voltage  
VR  
5
Power dissipation  
PD  
0.525  
8000  
W
Electrostatic Discharge Threshold (HBM)  
Thermal resistance [1] (Junction/ambient)  
Thermal resistance [1] (Junction/solder point)  
V
Rth j-a  
Rth j-s  
178  
°C/W  
°C/W  
78  
Notes:  
1. Results from mounting on PC board FR4,mounted on pc board-metal core PCB is recommend  
for lowest thermal resistance.  
2. 1/10 Duty Cycle, 0.1ms Pulse Width.  
Electrical / Optical Characteristics at TA=25°C  
Parameter  
Symbol  
λ peak  
λ dom [1]  
Δλ  
Value  
590  
Unit  
Wavelength at peak emission IF=140mA  
[Typ.]  
nm  
nm  
nm  
Dominant Wavelength IF=140mA [Typ.]  
590  
Spectral Line Half-width IF=140mA [Typ.]  
Forward Voltage IF=140mA [Min.]  
Forward Voltage IF=140mA [Typ.]  
Forward Voltage IF=140mA [Max.]  
Allowable Reverse Current [Max.]  
20  
2.5  
2.97  
3.5  
85  
VF [2]  
V
IR  
mA  
Optical efficiency  
19.24  
0.13  
lm/W  
η
opt  
Temperature coefficient of λ peak  
TC λ peak  
TC λ dom  
TCV  
nm/° C  
nm/° C  
mV/° C  
IF=140mA, -10 ° CT100 ° C  
[Typ.]  
Temperature coefficient of λ dom  
0.10  
-3.3  
IF=140mA, -10 ° CT100 ° C  
[Typ.]  
Temperature coefficient of VF  
IF=140mA, -10 ° CT100 ° C [Typ.]  
Notes:  
1.Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.  
2.Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 2 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
Selection Guide  
Viewing  
Luminous Intensity [2] Φv (lm) [3]  
Angle [1]  
Iv(cd)@ 140mA  
@ 140mA  
Dice  
Lens Type  
Part No.  
Min.  
1.6  
Typ.  
Typ.  
2 θ 1/2  
120 °  
KT-2117SYL1Z1S-VFS Super Bright Yellow (AlGaInP) Water Clear  
2.3  
8
Brightness codes  
luminous Intensity [2]  
Iv(cd) @ 140mA  
Φv (lm) [3]  
@ 140mA  
Code.  
Min.  
1.6  
1.9  
2.3  
2.7  
Max.  
1.9  
Typ.  
6
W
X
Y
Z
2.3  
7.5  
9.5  
11  
2.7  
3.1  
Notes:  
1.θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.  
2.Luminous intensity is measured by a current pulse of 10ms at a tolerance of ±15%.  
3.The typical data of Luminous Flux can only reflect statistical figures, actual parameters of individual product could differ from the typical data.  
For the purpose of product enhancement, the typical data is subject to change without prior notice.  
Shipment may contain more than one of the light intensity groups.  
Orders for single light intensity group are generally not accepted.  
Forward Voltage Groups  
Forward Voltage  
Unit  
Min.  
2.5  
Max.  
2.7  
V
V
V
2.7  
2.9  
2.9  
3.1  
3.1  
3.3  
3.3  
3.5  
V
V
Notes:  
Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.  
Shipment may contain more than one of the forward voltage groups.  
Orders for single forward voltage group are generally not accepted.  
Wavelength Groups  
Wavelength  
Unit  
Code.  
Min.  
584  
586  
588  
590  
592  
594  
Max.  
586  
588  
590  
592  
594  
597  
2
3
4
5
6
7
nm  
nm  
nm  
nm  
nm  
nm  
Note:  
Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.  
Shipment may contain more than one of the wavelength groups.  
Orders for single wavelength group are generally not accepted.  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 3 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
KT-2117SYL1Z1S-VFS  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 4 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 5 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
KT-2117SYL1Z1S-VFS  
Reflow soldering is recommended and the soldering profile is shown below.  
Other soldering methods are not recommended as they might cause damage to the product.  
Heat Generation:  
1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making  
the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the  
circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat gen-  
eration and operate within the maximum ratings given in this specification.  
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot  
of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas-  
ures to remove heat from the area near the LED to improve the operational characteristics on the LED.  
3.The equation indicates correlation between Tj and Ta ,and the equation indicates correlation between Tj and Ts  
Tj = Ta + Rthj-a *W ………  
Tj = Ts + Rthj-s *W ………  
Tj = dice junction temperature: °C  
Ta = ambient temperature:°C  
Ts = solder point temperature:°C  
Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C / W  
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C / W  
W = inputting power (IFx VF) : W  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 6 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
Recommended Soldering Pattern  
(Units : mm; Tolerance: ± 0.1)  
Tape Specifications (Units : mm)  
Reel Dimension  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 7 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
PACKING & LABEL SPECIFICATIONS  
KT-2117SYL1Z1S-VFS  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 8 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  
數位簽署  
者:yalin  
DNcn=yalin,o,  
ou=SPEC 用,  
email=yalin@ yal  
in.com,c=<>  
日期 2011.01.13  
yal  
Handling Precautions  
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic  
in  
09:34:06+08'00'  
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.  
As a result, special handling precautions need to be observed during assembly using silicone encapsulated  
LED products. Failure to comply might lead to damage and premature failure of the LED.  
1. Handle the component along the side surfaces by using forceps or appropriate tools.  
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.  
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or  
damage the internal circuitry.  
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame-  
ter of the nozzle should be as large as possible.  
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.  
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup  
and avoid damage during production.  
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of  
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.  
SPEC NO: DSAJ7055  
APPROVED: WYNEC  
REV NO: V.3  
DATE: JAN/06/2011  
DRAWN: C.H.HAN  
PAGE: 9 OF 9  
CHECKED: Allen Liu  
ERP: 1212000068  

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