1812Y1K00100JAT [KNOWLES]

CAP CER 10PF 1KV C0G/NP0 1812;
1812Y1K00100JAT
型号: 1812Y1K00100JAT
厂家: KNOWLES ELECTRONICS    KNOWLES ELECTRONICS
描述:

CAP CER 10PF 1KV C0G/NP0 1812

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中文:  中文翻译
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AEC-Q200  
Automotive Grade  
Capacitors  
AEC-Q200  
Automotive Grade Capacitors  
At Knowles Precision Devices (KPD), we manufacture Single Layer, Multilayer, High Reliability and Precision  
Variable Capacitors; EMI Filters and Thin Film Devices. One of our fields of expertise is the design and  
manufacture of components important to engineers in the automotive industry. Today’s vehicles have  
many electronic control units that enable absolute precision and control.  
The Automotive Electronics Council (AEC) Component Technical Committee is the standardization body  
for establishing standards for reliable, high-quality electronic components. Components meeting these  
specifications are suitable for use in the harsh automotive environment without additional component-level  
qualification testing.  
The Component Technical Committee established AEC-Q200 “Stress Test Qualification for Passive  
Components” to define the minimum stress test driven qualification requirements for electrical devices,  
including ceramic capacitors. KPD’s Syfer brand has developed a range of MLC capacitors and surface mount  
EMI filters qualified to AEC-Q200 rev D to meet the needs of high reliability and automotive manufacturers.  
Knowles Suzhou (China), Norwich (England) and Penang (Malaysia) facilities are accredited to IATF  
16949:2016 for the design, manufacture and supply of AEC-Q200 qualified MLCC components. Please  
refer to the following pages for details of the product ranges offered.  
2
Table of Contents  
GENERAL AND TECHNICAL INTRODUCTION  
Dielectric Characteristics ....................................................................................... 4-6  
FlexiCap™ Overview ................................................................................................ 7  
IECQ-CECC and AEC-Q200 Periodic Tests .......................................................... 8  
Manufacturing Process ........................................................................................... 9  
Testing ....................................................................................................................... 10  
Regulations and Compliance ................................................................................. 11  
Explanation of Aging of MLC ................................................................................. 12  
Mounting, Soldering, Storage and Mechanical Precautions .............................. 13-14  
Ceramic Chip Capacitors Packaging Information ........................................... 15-16  
Chip Dimensions ...................................................................................................... 17  
MLC CAPACITORS  
C0G/NP0 (1B) AEC-Q200 and Standard Ranges ............................................. 18-20  
X7R (2R1) AEC-Q200 and Standard Ranges ..................................................... 21-23  
Ordering Information AEC-Q200 and Standard Ranges ................................. 24  
StackiCap™ Capacitors ............................................................................................ 25  
Safety Certified AC Capacitors ............................................................................... 26  
Enhanced 250Vac and 305Vac Safety Certified AC Capacitors......................... 27-31  
Legacy 250Vac Safety Certified AC Capacitors .................................................. 32-34  
Open Mode Capacitors C0G/NP0 (1B) and X7R (2R1) ..................................... 35  
Tandem Capacitors X7R (2R1) ............................................................................ 36  
X8R High Temperature Capacitors up to 150ºC .............................................. 37  
Ultra-Low ESR HiQ MLCCs X8G Range ............................................................ 38-39  
SM EMI FILTERS  
Surface Mount EMI Filters E01 and E07 Ranges .............................................. 40-41  
Surface Mount EMI Filters E03 X2Y IPCs ......................................................... 42-44  
Other Products Available That Are Not AEC-Q200 Qualified ............................ 45-46  
Our Other Products ................................................................................................. 47  
3
Dielectric Characteristics  
CLASS I DIELECTRICS  
Multilayer Ceramic Capacitors are generally divided into classes,  
which are defined by the capacitance temperature characteristics  
over specified temperature ranges. These are designated by alpha-  
numeric codes. Code definitions are summarized below and are also  
available in the relevant national and international specifications.  
dielectric characteristics with negligible dependence of  
capacitance and dissipation factor with time, voltage and  
frequency. They exhibit the following characteristics:  
a) Time does not significantly affect capacitance and dissipation  
factor (Tan δ) – no aging.  
Capacitors within this class have a dielectric constant range from 10  
to 100. They are used in applications that require ultra stable  
b) Capacitance and dissipation factor are not affected by voltage.  
c) Linear temperature coefficient.  
CLASS I DIELECTRICS  
C0G/NP0 (1B) (Porcelain)  
P90 (Porcelain)  
C0G/NP0 (1B)  
X8G  
Class I High Temperature  
-
Ultra Stable  
Ultra Stable  
Ultra Stable  
1B/CG  
Ultra Stable  
Ultra Stable  
IECQ-CECC  
EIA  
-
-
-
-
-
-
-
-
-
Dielectric  
classifications  
C0G/NP0 (1B)  
P90  
C0G/NP0 (1B)  
X8G  
MIL  
-
-
CG (BP)  
-
DLI  
Novacap  
Syfer  
CF  
AH  
-
-
-
N, RN  
C
-
-
-
F
-
-
D, RD  
G
-
-
-
-
Ordering code  
Q, U  
H
Voltronics  
-
F
H
Q
-
-
-
-
Rated  
temperature range  
-55ºC to +125ºC  
-55ºC to +125ºC  
-55ºC to +125ºC  
-55ºC to +125ºC  
-55ºC to +150ºC  
-55ºC to +160ºC  
-55ºC to +200ºC  
No DC  
voltage applied  
Maximum  
capacitance  
change over  
0
15 ppm/ºC  
+90 20 ppm/ºC  
0
30 ppm/ºC  
0
30 ppm/ºC  
-
0
30 ppm/ºC  
0
30 ppm/ºC  
0
30 ppm/ºC  
Rated DC  
voltage applied  
temperature range  
>50pF ≤0.0015  
≤50pF  
0.0015 (15/Cr + 0.7)  
Tangent of loss  
angle (tan ð)  
-
≤0.0005 @1MHz  
≤0.0005 @1MHz  
≤0.0005 @1MHz  
≤0.001  
@25ºC = 100GΩ or 1000ΩF  
@160ºC & 200ºC = 1GΩ or  
10ΩF (whichever is the least)  
Insulation  
resistance (Ri)  
Time constant  
(Ri x Cr)  
@25ºC = 106 MΩ min  
@125ºC = 105 MΩ min  
100GΩ or 1000s  
(whichever is the least)  
Cr <4.7pF  
Cr≥ 4.7 to <10pF  
Cr ≥ 10pF  
0.05pF, 0.10pF, 0.25pF, 0.5pF  
0.10pF, 0.25pF, 0.5pF  
1ꢀ, 2ꢀ, 5ꢀ, 10ꢀ  
Capacitance  
tolerance  
≤200V  
2.5 times  
Dielectric strength.  
Voltage applied  
for 5 seconds.  
Charging  
>200V to <500V  
500V to ≤ 1kV  
2.5 times  
Rated voltage +250V  
1.5 times  
2.5 times  
current limited  
to 50mA maximum.  
>1kV to ≤ 1.2kV  
>1.2kV  
1.25 times  
1.2 times  
-
N/A  
Chip  
-
-
-
-
-
-
55/125/56  
-
-
-
Climatic  
category (IEC)  
Dipped  
-
-
55/125/21  
55/125/56  
-
-
Discoidal  
Aging  
characteristic  
(Typical)  
-
Zero  
Approvals  
Syfer Chip  
-
-
-
QC-32100  
-
-
4
Dielectric Characteristics  
CLASS II DIELECTRICS  
Capacitors of this type have a dielectric constant range of 1000-  
4000 and also have a nonlinear temperature characteristic that  
exhibits a dielectric constant variation of less than 15ꢀ (2R1)  
from its room temperature value, over the specified temperature  
range. Generally used for bypassing (decoupling), coupling,  
filtering, frequency discrimination, DC blocking and voltage transient  
suppression with greater volumetric efficiency than Class I units,  
while maintaining stability within defined limits.  
Capacitance and dissipation factors are affected by:  
a) Time (Aging)  
b) Voltage (AC or DC)  
c) Frequency  
CLASS II DIELECTRICS  
X5R  
X7R (2R1)  
X8R  
Class II High Temperature  
Stable  
Stable  
Stable  
Stable  
-
Dielectric  
classifications  
-
2C1  
-
2R1  
2X1  
-
-
-
-
-
-
IECQ-CECC  
EIA  
X5R  
X7R (2R1)  
X8R  
-
-
BZ  
-
BX  
-
-
MIL  
-
DLI  
BW  
P
-
R
-
B, RB  
X
B
-
S
N
-
G
-
E, RE  
Novacap  
Syfer  
Ordering code  
X
X
X
-
-
-
Voltronics  
Rated  
temperature range  
-55ºC to +85ºC  
-55ºC to +125ºC  
-55ºC to +150ºC  
-55ºC to +160ºC  
+15 -40ꢀ  
-55ºC to +200ºC  
+15 -65ꢀ  
-
15ꢀ  
-
15ꢀ  
15ꢀ  
-
15ꢀ  
15ꢀ  
-
No DC voltage applied  
Maximum capacitance  
change over  
temperature range  
Rated DC  
voltage applied  
+15 -45ꢀ  
+15 -25ꢀ  
-
>25V ≤0.025  
≤25V ≤0.035  
Tangent of loss  
angle (tan ð)  
≤ 0.025 Typical*  
≤0.025  
≤0.025  
-
100GΩ or 1000s (whichever is the least)  
5ꢀ, 10ꢀ, 20ꢀ  
Time constant (Ri x Cr)  
-
Insulation resistance (Ri)  
Capacitance tolerance  
2.5 times  
≤200V  
Dielectric strength.  
Voltage applied  
for 5 seconds.  
Rated voltage +250V  
>200V to <500V  
1.5 times  
1.2 times  
500V to <1kV  
≥1kV  
Charging current limited  
to 50mA  
maximum.  
55/85/56  
55/125/56  
55/150/56  
-
-
-
Chip  
-
-
55/125/21  
55/125/56  
-
-
Dipped  
Discoidal  
Climatic category (IEC)  
Aging  
characteristic (Typical)  
5ꢀ Typical  
-
<2ꢀ per time decade  
-
QC-32100  
-
-
QC-32100  
-
Syfer chip  
Approvals  
* Refer to the MLC Capacitors catalog for details of Dissipation Factor.  
5
Dielectric Characteristics  
TYPICAL DIELECTRIC  
TEMPERATURE CHARACTERISTICS  
IMPEDANCE vs. FREQUENCY  
Ultra Stable C0G/NP0 (1B) Dielectric  
100,000,000  
10,000,000  
Porcelain C0G/NP0 & P90  
10pF  
100pF  
1nF  
1,000,000  
100,000  
10,000  
1.25  
1
10nF  
C0G/NP0 (1B) Porcelain  
1,000  
100  
P90 Porcelain  
0.75  
10  
1
0.5  
0.1  
0.25  
0
0.01  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
10,000  
Frequency (MHz)  
Stable X7R (2R1) Dielectric  
-0.25  
-0.5  
1,000,000  
100,000  
10,000  
1nF  
10nF  
100nF  
1μF  
-0.75  
-1  
1,000  
100  
-55 -40  
-20  
0
20  
40  
60  
80  
100  
125  
10  
1
Temperature °C  
0.1  
0.01  
C0G/NP0  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
10,000  
Frequency (MHz)  
50  
25  
0
Upper Limit  
Stable X7R (2R1) Dielectric 10nF  
1,000,000  
Typical Limit  
100,000  
1808  
0805  
1206  
1210  
10,000  
1,000  
100  
10  
1
0.1  
-25  
-50  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
10,000  
Lower Limit  
Frequency (MHz)  
ESR vs. FREQUENCY CHIPS  
-55  
-25  
0
25  
50  
75  
100  
125  
Temperature °C  
Ultra Stable C0G/NP0 (1B) Dielectric  
1,000  
100pF  
1nF  
10nF  
100  
10  
1
X7R (2R1)  
20  
15  
Typical specification limit  
0.1  
Typical capacitance change curves will  
lie within the band shown  
10  
0.01  
5
0.001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
10,000  
Frequency (MHz)  
0
Stable X7R (2R1) Dielectric  
-5  
10,000  
1,000  
100  
1nF  
-10  
10nF  
100nF  
1μF  
-15  
10  
1
Typical specification limit  
-20  
0.1  
-55  
-35  
-15  
5
25  
45  
65  
85  
105  
125  
0.01  
Temperature °C  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
10,000  
Frequency (MHz)  
6
FlexiCap™ Overview  
FLEXICAP™ BENEFITS  
FLEXICAP™ TERMINATION  
With traditional termination materials and assembly, the  
MLCCs are widely used in electronic circuit design for a multitude of  
applications. Their small package size, technical performance and suitability  
for automated assembly make them the component of choice for the  
specifier. However, despite the technical benefits, ceramic components  
are brittle and need careful handling on the production floor. In some  
circumstances they may be prone to mechanical stress damage if not used in  
an appropriate manner. Board flexing, depanelization, mounting through hole  
components, poor storage and automatic testing may all result in cracking.  
Careful process control is important at all stages of circuit board assembly  
and transportation — from component placement to test and packaging. Any  
significant board flexing may result in stress fractures in ceramic devices that  
may not always be evident during the board assembly process. Sometimes it  
may be the end customer who finds out — when equipment fails!  
chain of materials from bare PCB to soldered termination  
provides no flexibility. In circumstances where excessive stress  
is applied, the weakest link fails. This means the ceramic itself may  
fail or short circuit. The benefit to the user is to facilitate a wider  
process window giving a greater safety margin and substantially  
reducing the typical root causes of mechanical stress cracking. FlexiCap™  
may be soldered using your traditional wave or reflow solder techniques,  
including lead free, and needs no adjustment to equipment or current  
processes. Knowles has delivered millions of FlexiCap™ components  
and during that time has collected substantial test and reliability data,  
working in partnership with customers worldwide to eliminate mechanical  
cracking. An additional benefit of FlexiCap™ is that MLCCs can withstand  
temperature cycling -55ºC to +125ºC in excess of 1,000 times without  
cracking. FlexiCap™ termination has no adverse effect on any electrical  
parameters, nor affects the operation of the MLCC in any way.  
KNOWLES HAS THE SOLUTION FLEXICAP™  
FlexiCap™ has been developed as a result of listening to customers’  
experiences of stress damage to MLCCs from many manufacturers, often  
caused by variations in production processes. Our answer is a proprietary  
flexible epoxy polymer termination material that is applied to the device under  
the usual nickel barrier finish. FlexiCap™ will accommodate a greater degree of  
board bending than conventional capacitors.  
Picture taken at  
1,000x magnification  
using an SEM to  
demonstrate the fibrous  
nature of the FlexiCap  
TM  
termination that absorbs  
increased levels of  
mechanical stress.  
KNOWLES FLEXICAP™ TERMINATION  
Ranges are available with FlexiCap™ termination material offering increased  
reliability and superior mechanical performance (board flex and temperature  
cycling) when compared with standard termination materials. Refer to Knowles  
application note reference AN0001. FlexiCap™ capacitors enable the board to  
be bent almost twice as much before mechanical cracking occurs. Refer to  
application note AN0002. FlexiCap™ is also suitable for space applications,  
having passed thermal vacuum outgassing tests. Refer to Syfer application  
note reference AN0026.  
AVAILABLE ON THE FOLLOWING RANGES:  
All High Reliability Ranges  
Standard and High Voltage  
Capacitors  
Non-Magnetic Capacitors  
3-Terminal EMI Chips  
X2Y Integrated Passive  
Components  
Open Mode and Tandem  
Capacitors  
X8R High Temperature  
Safety Certified Capacitors  
Capacitors  
SUMMARY OF PCB BEND TEST RESULTS  
The bend tests conducted on X7R (2R1) have proven that the FlexiCap™  
termination withstands a greater level of mechanical stress before  
mechanical cracking occurs. The AEC-Q200 test for X7R (2R1) requires a  
bend level of 2mm minimum and a cap change of less than 10ꢀ. Knowles  
test to a minimum bend of 5mm for X7R with FlexiCap termination, and  
for COG with either FlexiCap or standard termination.  
Product X7R (2R1)  
Standard termination  
FlexiCap™  
Typical bend performance under AEC-Q200 test conditions  
2mm to 3mm  
Typically 8mm to 10mm  
APPLICATION NOTES  
FlexiCap™ may be handled, stored and transported in the same manner as standard terminated capacitors. The requirements  
for mounting and soldering FlexiCap™ are the same as for standard SMD capacitors. For customers currently using standard  
terminated capacitors there should be no requirement to change the assembly process when converting to FlexiCap™.  
Based upon board bend tests in accordance with IEC 60384-1, the amount of board bending required to mechanically crack a FlexiCap™ terminated capacitor  
is significantly increased compared with standard terminated capacitors. It must be stressed, however, that capacitor users must not assume that the use of  
FlexiCap™ terminated capacitors will totally eliminate mechanical cracking. Good process controls are still required for this objective to be achieved.  
7
IECQ-CECC and AEC-Q200 Tests  
PERIODIC TESTS CONDUCTED FOR IECQꢁCECC AND AECꢁQ200  
Sample acceptance  
Test ref  
Test  
Termination type  
Additional requirements  
Reference  
P
N
C
High temperature  
exposure (storage)  
Un-powered. 1,000 hours @ T=150ºC.  
Measurement at 24 2 hours after test conclusion.  
MIL-STD-202  
Method 108  
P1  
All types  
12  
77  
0
C0G/NP0 (1B):  
All types X7R (2R1):  
Y and H only  
1,000 cycles -55ºC to +125ºC  
Measurement at 24 2 hours after test conclusion.  
JESD22  
Method JA-104  
P2  
P3  
Temperature cycling  
Moisture resistance  
12  
12  
77  
77  
0
0
T = 24 hours/cycle. Note: Steps 7a and 7b not required.  
Unpowered.  
MIL-STD-202  
Method 106  
All types  
All types  
Measurement at 24 2 hours after test conclusion.  
1,000 hours 85ºC/85ꢀRH. Rated voltage or 50V  
whichever is the least and 1.5V.  
Measurement at 24 2 hours after test conclusion.  
MIL-STD-202  
Method 103  
P4  
Biased humidity  
12  
77  
0
Condition D steady state TA=125ºC at full rated.  
Measurement at 24 2 hours after test conclusion.  
MIL-STD-202  
Method 108  
P5  
P6  
Operational life  
All types  
All types  
12  
12  
77  
5
0
0
Note: Add aqueous wash chemical.  
Do not use banned solvents.  
MIL-STD-202  
Method 215  
Resistance to solvents  
C0G/NP0 (1B):  
All types X7R (2R1):  
Y and H only  
MIL-STD-202  
Method 213  
P7  
P8  
Mechanical shock  
Vibration  
Figure 1 of Method 213. Condition F  
12  
12  
30  
30  
0
0
5g’s for 20 minutes, 12 cycles each of 3 orientations.  
C0G/NP0 (1B):  
All types X7R (2R1):  
Y and H only  
Note: Use 8" x 5" PCB 0.031" thick 7 secure points on one  
long side and 2 secure points at corners of opposite sides.  
Parts mounted within 2" from any secure point. Test from  
10-2,000Hz.  
MIL-STD-202  
Method 204  
Condition B, no pre-heat of samples:  
Single wave solder - Procedure 2  
MIL-STD-202  
Method 210  
P9  
Resistance to soldering heat  
Thermal shock  
All types  
3
12  
0
0
C0G/NP0 (1B):  
All types X7R (2R1):  
Y and H only  
-55ºC/+125ºC. Number of cycles 300.  
Maximum transfer time - 20 seconds,  
dwell time - 15 minutes. Air-Air.  
MIL-STD-202  
Method 107  
P10  
12  
30  
BS EN132100  
Clause 4.8, 4.12  
and 4.13  
Adhesion, rapid temp change and  
climatic sequence  
X7R (2R1):  
A, F and J only  
5N force applied for 10s, -55ºC/+125ºC for 5 cycles,  
damp heat cycles  
P11  
12  
12  
27  
30  
0
0
C0G/NP0 (1B):  
All types X7R (2R1):  
Y and H only  
3mm deflection Class I  
2mm deflection Class II  
P12  
Board flex  
AEC-Q200-005  
BS EN132100  
Clause 4.9  
P13  
P14  
P15  
P16  
Board flex  
Terminal strength  
Beam load test  
X7R (2R1): A, F and J only  
All types  
1mm deflection  
12  
12  
12  
12  
12  
30  
30  
45  
0
0
0
0
Force of 1.8kg for 60 seconds  
AEC-Q200-006  
AEC-Q200-003  
All types  
-
56 days, 40ºC/93ꢀ RH 15x no volts, 15x 5Vdc,  
15x rated voltage or 50V whichever is the least  
BS EN132100  
Clause 4.14  
Damp heat steady state  
All types  
Test results are available on request.  
P = Period in months. N = Sample size. C = Acceptance criteria.  
8
Manufacturing Process  
KNOWLES RELIABILITY GRADES  
PRODUCTION PROCESS FLOWCHART  
High reliability (space quality)  
Electrode ink material  
Ceramic powder  
preparation  
Space  
Grade  
ESCC 3009(1)  
MIL Grade  
Multilayer build  
Fire  
IECQ-CECC(2)  
AEC-Q200(3)  
Standard components  
Standard reliability  
Notes:  
Rumble  
1) Space grade tested in accordance with ESCC3009 (refer to Knowles Spec S02A  
0100) or MIL Grade (in accordance with MIL-PRF-123, MILPRF-55681).  
2) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality Assessment  
System for Electronic Components. This is an internationally recognized product  
quality certification that provides customers with assurance that the product  
supplied meets high-quality standards. View Knowles IECQ-CECC approvals at  
iecq.org or at knowlescapacitors.com  
DPA inspection  
Termination  
3) AEC-Q200. Automotive Electronics Council Stress Test Qualification For Passive  
Components. Refer to Knowles application note AN0009.  
Plating (if specified)  
Printing (if specified)  
KNOWLES RELIABILITY SURFACE MOUNT  
PRODUCT GROUPS  
High reliability  
Electrical test  
Tandem  
FlexiCapTM  
capacitors(1)  
Test verification  
Open Mode  
FlexiCapTM capacitors(2)  
Additional sample Rel  
tests (if specified)  
Standard FlexiCapTM capacitors(3)  
Standard components  
Standard reliability  
QC inspection  
Notes:  
1) “Tandem” construction capacitors, i.e., internally having the equivalent of two series  
capacitors. If one of these should fail or short circuit, there is still capacitance end to  
end and the chip will still function as a capacitor, although capacitance may be  
affected. Refer to application note AN0021. Also available qualified to AEC-Q200.  
Additional Hi Rel activities  
(S02A 100ꢀ burn-in, QC insp)  
2) “Open Mode” capacitors with FlexiCapTM termination also reduce the possibility of a  
short circuit by utilizing inset electrode margins. Refer to application note AN0022.  
Also available qualified to AEC-Q200.  
Packaging  
TM  
3) Multilayer capacitors with Knowles FlexiCapTM termination. By using FlexiCap  
termination, there is a reduced possibility of the mechanical cracking occurring.  
Finished goods store  
TM  
4) “Standard” capacitors include MLCCs with tin finish over nickel but no FlexiCap .  
9
Other Products Available That Are Not  
AEC-Q200 Qualified  
HIGH TEMPERATURE HiT RANGE  
200°C - C0G/NP0 (1B) & X7R (2R1)  
The HiT range of multilayer ceramic capacitors is suitable for a  
Insulation Resistance (IR):  
25ºC >100GΩ or 1000secs (whichever is the least)  
variety of high temperature applications, including: oil exploration,  
geothermal, military, automotive under-hood and avionics. This range  
is manufactured to exacting standards using our unique screen  
printing process. This provides a high-quality component suitable for  
demanding applications.  
200ºC >1GΩ or 10secs (whichever is the least)  
Temperature Coefficient of Capacitance (TCC):  
C0G/NP0 (1B) 30ppm/ºC to +125°C  
• 200ºC operating temperature  
X7R (2R1) 15ꢀ to +125°C  
• 0603 to 2220 chip sizes  
• C0G/NP0 (1B) and X7R dielectric options  
• Capacitance range C0G/NP0 (1B) from 3.9pF up to 47nF  
• Capacitance range X7R (2R1) from 100pF up to 4.7µF  
• Voltage ratings from 10V to 630V  
• RoHS compliant/Pb free  
Aging Rate:  
C0G/NP0 (1B) Zero.  
X7R (2R1) typically less than 2ꢀ per time decade  
• Sn over Ni termination  
• Sample kits available  
HIGH TEMP. HiT250 RANGE  
250°C C0G/NP0 (1B) & X7R (2R1)  
The HiT250 range of multilayer ceramic capacitors is suitable for a  
variety of high temperature applications, including: oil exploration,  
geothermal, military, automotive under-hood and avionics.  
Insulation Resistance (IR):  
25ºC >100GΩ or 1000secs (whichever is the least)  
250ºC >100MΩ or 1secs (whichever is the least)  
This range is manufactured to exacting standards using our unique  
screen printing process. This provides a high-quality component  
suitable for demanding applications.  
Temperature Coefficient of Capacitance (TCC):  
C0G/NP0 (1B) 30ppm/ºC to +125°C  
250ºC operating temperature  
0603 to 2220 chip sizes  
X7R (2R1) 15ꢀ to +125°C  
C0G/NP0 (1B) and X7R dielectric options  
Capacitance range C0G/NP0 (1B) from 3.9pF up to 39nF  
Capacitance range X7R (2R1) from 1nF up to 2.2µF  
Voltage ratings from 10V to 630V  
RoHS compliant/Pb free  
Aging Rate:  
C0G/NP0 (1B) Zero  
X7R (2R1) typically less than 2ꢀ per time decade  
Au over Ni termination  
Sample kits available  
46  
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Safety Certified Capacitors  
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Solder in EMI Filters  
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StackiCap™ Capacitors  
Thin Film Products  
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43  
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Asian Sales Office  
O: +86 512 62588258  
F: +86 512 62589258  
KPD-Asia-sales@knowles.com  
European Sales Office  
O: +44 1603 723300  
F: +44 1603 723301  
KPD-Europe-sales@knowles.com  
North American Sales Office  
O: +1 661 295 5920  
F: +1 661 295 5928  
O: +1 315 655 8710  
F: +1 315 655 0445  
KPD-NA-sales@knowles.com  
080221 / R12  
©2021 Knowles Capacitors. All Rights Reserved.  

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