C17CF111J-4UN-X1T [KNOWLES]
CAP CER 1111;
| 型号： | C17CF111J-4UN-X1T |
| 厂家： | 
KNOWLES ELECTRONICS |
| 描述： | CAP CER 1111 |
| 文件： | 总72页 (文件大小：9457K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High-Q MLC Capacitors
Low ESR MLC Capacitors
Single Layer Capacitors
Broadband Blocking Capacitors
Thin Film Ceramic Filters
High-K Ceramic Substrates and Plates
Thin Film Resonators
Thin Film Gain Equalizers
Custom Ceramic Components
MLC & SLC Capacitors
Thin Film Components
www.dilabs.com
Introduction to Dielectric Laboratories Inc.
What makes DLI Unique?
DLI continues to introduce exciting new innovations in custom
DLI built its global reputation as a manufacturer of high frequency,
High Q capacitors. In recent years, DLI has emerged as a
comprehensive manufacturer of specialty ceramic components for
application specific microwave and millimeter wave components
serving customers in fiber optic, wireless, medical, transportation,
semiconductor, space, avionics and military markets.
ceramic resonator and filter technologies. These patent-protected
products leverage decades of ceramic and Thin Film experience,
creative and clever design expertise, and advanced prototyping
and testing capabilities. Please discuss your needs with our Sales
and Applications Engineering Team.
Heat Sinks and Resonator Components complete our portfolio.
With over four decades of material science formulation and
development, more than one hundred proprietary and/or patented
ceramic formulations, and multiple recent patent filings, DLI is the
pre-eminent ceramic component manufacturer in the industry. The
marriage of ceramic expertise, manufacturing know-how, product
quality, customer service, product customization, and clever
microwave and RF design engineering sets us apart from all others
in the industry.
RoHS Compliance Statement
DLI is a leading supplier to the electronic components market
and is fully committed to offering products supporting Restriction
of Hazardous Substances (RoHS) directive 2011/65/Eu. All of
our Dielectric formulations are RoHS compliant and we offer a
broad range of capacitors with RoHS compliant terminations. DLI
complies with the requirements of the individual customer and will
maintain product offerings that meet the demands of our industry.
DLI offers a broad range of Multi-Layer Capacitor products.
We have the most comprehensive array of Broadband Blocking
capacitors. We have expertise in customizing, tight tolerances and
meeting specific design targets.
Quality and Environmental Policy
DLI’s reputation for quality and environmental responsibility
is based on a commitment not only to meet our customers’
requirements, but to exceed their expectations. The entire
organization, beginning with top management, strives to achieve
excellence in designing, manufacturing and delivering High Q
capacitors and proprietary thin film components for niche high
frequency applications, while maintaining safe and healthy working
conditions. Furthermore, DLI commits to achieve these goals in
an environmentally responsible manner through our commitment
to comply with environmental regulations and implement pollution
prevention initiatives. DLI strives to continually improve the
effectiveness of our Quality and Environmental Management
System through the establishment and monitoring of objectives
and targets.
DLI is the preeminent global supplier of Single-Layer Capacitors.
We have the world’s broadest range of materials starting with
Class 1 dielectrics with ξr from 5.7 to 900 and Class 2 dielectrics
with ξr from 445 to 25,000. DLI specializes in high reliability and
space applications.
Our Build-to-Print services designed to facilitate thin film product
design, manufacturing and testing from prototype to high volume
production. Our custom ceramics offer significantly better thermal
performance than majority of industry standard ceramics and
have an added benefit of a sufficiently higher dielectric constant
(K) allowing miniaturization opportunities and temperature stable
performance.
ISO 14001
Environmental
www.dilabs.com
Contents
Introduction
About Us ............................................................................................. Inside front cover
What’s New at DLI ...........................................................................................................2
Simplified Frequency & Application Chart ...........................................................................3
Single Layer Capacitors
General Information ..................................................................................................... 4-6
Packaging........................................................................................................................7
Border Cap® 1 or 2-sided recessed metallization........................................................... 8-11
T-Cap® Transmission Line Capacitor.................................................................................12
Di-Cap® 1MHz to > 80GHz........................................................................................ 13-15
Bar Cap® Multiple arrays.................................................................................................16
Gap Cap® to eliminate wire bonding ..........................................................................17-19
Bi-Cap® Binary Capacitor ................................................................................................20
Heatsinks, Standoffs & Submounts ..................................................................................21
Multilayer Ceramic Capacitors
Material & Case Size Summary Sheets .......................................................................22-23
Application Notes .....................................................................................................24-25
General Information .................................................................................................26-27
Standard Part Number System ........................................................................................28
AH Series: P90 Porcelain Capacitors...........................................................................29-31
CF Series: Ultrastable Porcelain Capacitors.................................................................32-34
NA Series: N30 Porcelain Capacitors ................................................................................35
UL Series: Ultra Low ESR Ceramic Capacitors .............................................................36-38
High Q Capacitors - C04, C06, C11 & C17 Kits..................................................................39
Broadband Blocking Capacitors
C04/C06/C08 Broadband Blocking Capacitor.....................................................................40
Opti-Cap® Ultra Broadband DC Blocking.....................................................................41-43
Milli-Cap® Millimeter Wave Broadband Blocking Capacitor..................................................44
Miniature RF Blocking Network..................................................................................45-46
Thin Film Devices
RF Guru Ceramic Filter Request Form ..............................................................................47
Ceramic Filters product summary...............................................................................48-49
Filter Packaging, Shielding and Mounting ...................................................................50-51
Filter Temperature Stability .............................................................................................52
Surface Mount Lowpass Filter Series................................................................................53
2-18 GHz Bandpass Filter Series......................................................................................54
Wilkinson Power Divider..................................................................................................55
Symmetric Dual Mode Resonator Filter.............................................................................56
10GHz 4 Pole Band Pass with Bandstop Filter ...................................................................56
20GHz 8 Pole SMT Filter .................................................................................................56
36GHz Filter Repeatability...............................................................................................56
GPS Filters.....................................................................................................................57
High-K Ceramic Substrate and Plates...............................................................................58
Ceramic Cavity Resonators........................................................................................59-65
Self Bias Network.....................................................................................................63-64
Gain Equalizers ........................................................................................................65-67
Build to Print..................................................................................................................68
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1
What’s New at DLI
0402
Catalog Filters
0402 product line extension
Newly released Catalog
Lowpass and Bandpass
Filters for high
frequency applications.
This small, surface
mount filters have
temperature stable
performance from 2
GHz up to 50 GHz. The
filters integrate DLI’s
of Z type plating (Sn over
Ni) in the C04 (0402) case
size with its Ultra-Low
ESR UL dielectric material.
Previously the C04 product
line was only available in
“S” type plating (Au flash
over Ni).
S
Z
Plating Code
Layers
Applications
high dielectric, temperature stable ceramic materials to offer
high reliability in environmentally challenging conditions.
Continue to check our website for new additions.
• Au Flash (3-5µ”)
• Ni barrier Layer
• Ag Termination
• Specialty Solder & Epoxy
“S”
• Sn plated solder
• Ni barrier layer
• Ag Termination
• High Volume & Hand Solder
Cavity Filters
“Z”
Ceramic cavity resonator
technology can be
employed in conjunction
with DLI’s stable, high
Q ceramics to create
Both termination types are fully RoHS compliant
Dielectric Laboratories Inc. C04 case size meets the EIA
0402 footprint, which is perfectly suited for High Frequency
decoupling type of applications.
highly selective, small,
low loss band pass
filters. Using a multi-
port implementation, a
Milli-Caps®
Available in 0402, 0502
and 0602 footprints
with capacitance values
ranging from 0.3pF to
82pF. These capacitors
are perfect for testing
equipment, photonics,
SONET, digital radios
and matching filter
very small robust filter
can be created. Wide reject band performance without
spurious modes is possible. The small, shielded nature of
the ceramic filter implementation makes it an ideal choice
for integration in low noise receiver front ends with the
antenna and pre-amplifier.
High-order band pass filters are created by cascading single
cavity resonators to generate the required rejection.
applications. A usable frequency range up to 40GHz with
very low series inductance and ultra-high series resonance
makes this the ideal capacitor for your broadband blocking
needs.
Build to print
DLI offers Build
to Print services
designed to facilitate
thin film product
design, manufacturing
and testing from
prototype to high
volume production.
Our custom ceramics
offer significantly
50V UX material
The UX material space
qualified to MIL-
PRF-38534 Class K is
now available in a 50V
rating. DLI’s broad
range of standard
architectures, including
better thermal performance than the majority of the
industry standard ceramics and have an added benefit
of a sufficiently higher dielectric constant (K) allowing
miniaturization opportunities and temperature stable
performance.
Di-Caps®, Border Caps®,
Bar Caps® and Gap
Caps® can utilize the
new 50V rated high
K dielectric. UX has
the highest dielectric constant of any of DLI’s wide variety
of materials. The high dielectric constant (K) allows for
higher capacitance values in smaller case sizes. This means
smaller components on your boards without sacrificing
performance!
Gain Equalizers
Gain Equalizers are designed
as a small, low cost solution
to your gain slope challenges.
DLI’s EW series is designed to
address the issue from DC to
18 GHz in a package smaller
than an 0302 capacitor.
Components are designed for
surface mount pick and place
equipment or epoxy mount.
• Ultra-High Dielectric Constant K=25,000
•
•
•
•
X7R Temperature Stability
Highest Capacity Density SLC
Ideal for Epoxy & Wire Bond Assembly
Voltage Rating of 25V & 50V
• Rugged Ceramic & Thin Film Gold
•
Excellent Dimensional Tolerance
2
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Simplified Frequency & Product Application Chart
SLC and Thin Film
Di-Cap®
Bar-Cap®
Binary-Cap®
Bias Filter Networks
Self Bias Networks
1 Mhz
10 MHz
100 MHz
1 GHz
10 GHz
100 GHz
High Q Capacitors
C04
UL
C06
CF, UL
C07
UL
C08
UL
C11
AH, CF, UL
C17
AH, CF, UL
C18
AH, CF
C22
AH, CF
C40
AH, CF
1 Mhz
10 MHz
100 MHz
1 GHz
10 GHz
100 GHz
Broadband and DC Blocks
C04BL
C06BL
C08BL
C18BL
Opti-Cap®
Milli-Cap®
1 Mhz
10 MHz
100 MHz
1 GHz
10 GHz
100 GHz
DC Blocking
Low Noise Amplifiers
Power Amplifiers, High Power Amplifiers
Oscillators
Filters
www.dilabs.com | Phone: +1.315.655.8710 |
3
SLC - Dielectric Information
Single Layer Capacitors are available with any
of our proprietary dielectric materials in the
following configurations:
Border Cap®
Di-Cap®
Bar Cap®
Bi-Cap®
Gap Cap®
T-Cap®
Please consult the following pages for part
number identification.
DLI Class I Dielectric Materials
Temperature Coefficient
-55°C to 125°C (ppm/°C Max)
Dielectric Relative ξr
1 MHz Dissipation
Factor (% Maximum) Resistance (MΩ)
25°C Insulation
125°C Insulation
Resistance (MΩ)
Code
@ 1 MHz
PI
9.9
13
P105 ± 20
P22 ± 30
0.15
0.15
0.15
0.60
0.15
0.15
0.25
0.70
0.15
0.50
0.25
0.70
1.50
1.20
>106
>106
>106
>106
>106
>106
>106
>106
>106
>104
>106
>106
>106
>106
>105
>105
>105
>105
>105
>105
>105
>105
>105
>103
>105
>105
>105
>105
PG
AH
CF
20
P90 ± 20
24
0 ± 15
NA
CD
NG
CG
DB
NP
NR
NS
NU
NV
22
N30 ± 15
37
N20 ± 15
43
N220 ± 60
0 ± 30
70
72
N50 ± 30
85
N750 ± 200
N1500 ± 500
N2400 ± 500
N3700 ± 1000
N4700 ± 1000
160
300
600
900
DLI Class II Dielectric Materials
Temperature Coefficient
-55°C to 125°C (ppm/°C Max)
Dielectric Relative ξr
1 MHz Dissipation
Factor (% Maximum) Resistance (MΩ)
25°C Insulation
125°C Insulation
Resistance (MΩ)
No Bias,
No Bias,
Post Voltage
Conditioning
Code
@ 1 MHz
Pre Voltage
Conditioning
BF*
BD
BG*
BC
BE
445
700
±7.5
±10
±10
±10
±10
±15
±10
±15
±10
±15
±15
±15
±15
±25
±15
±25
2.5
2.5
2.5
2.5
2.5
2.5
3.0
3.0
>104
>104
>104
>104
>104
>105
>105
>105
>102
>103
>103
>103
>103
>104
>104
>104
900
1300
1250
2000
3300
4500
BL
BJ
BN
DLI Class III Dielectric Materials
+22, -56%
(-55°C to 105°C)
+22, -56%
(-55°C to 105°C)
BT*
4200
8500
3.0
3.0
>105
>105
>102
>104
+22, -82%
(10°C to 85°C)
+22, -82%
(10°C to 85°C)
BU
+22, -82%
(10°C to 85°C)
+22, -82%
(10°C to 85°C)
BV
13,500
25,000
3.0
2.5
>105
>103
>104
>102
UX
±15%
±25%
* Recommended for commercial use only. Please contact an inside sales representative for additional information.
4
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SLC - Dielectric Information
Dielectric Temperature Characteristics
0.3
0.2
0.1
0
1.2
1
0.8
0.6
0.4
0.2
0
-0.1
-0.2
-0.3
-0.4
-0.5
CF
NA
CG
DB
CD
-0.2
-0.4
-0.6
-0.8
-1
-60
-40
-20
0
20
40
60
80
100
120
140
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature C
Temperature C
5
2.5
0
50
40
30
20
-2.5
-5
10
0
-10
-20
-30
-40
-50
-7.5
-10
-12.5
-15
BF
BD
BG
BC
-60
-40
-20
0
20
40
60
80
100
120
140
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature C
Temperature C
15
10
0
12.5
10
-10
-20
-30
-40
-50
-60
-70
-80
7.5
5
2.5
0
-2.5
-5
BN
BT
BU
BV
-7.5
-10
-12.5
-15
-60
-40
-20
0
20
40
60
80
100
120
140
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature C
Temperature C
Dielectric Aging Characteristics
0
0
-2
-2
-4
-6
-8
-4
-6
-8
BD
BJ
BL
BF
BT
-10
-10
-12
-14
-16
NU,NV
BU,BV
UX
BG
BN
-12
-14
-16
0
0.1
1
10
100
1000
10000
100000
0
0.1
1
10
100
1000
10000
100000
Hours
Hours
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5
SLC - Specifications
Termination Codes
Code
Capacitor
Types
Description
(Layers in order from dielectric material to outermost)
S1 (Sputter Plated)
AU-100 (Wet Plated)
Di-Cap®,T-Cap®,
Bar Cap®, Binary Cap®, and Gap
Cap
1. 300 Angstroms Titanium-Tungsten
1. 75µ Inches min. Nickel
P
2. 50µ Inches min. Nickel-Vanadium
2. 100µ Inches min. Gold
3. 100µ Inches min. Gold
S2
1. 300 Angstroms Titanium-Tungsten
2. 50µ Inches min. Nickel-Vanadium
3. 300µ Inches min. Gold-Tin
Di-Cap®,
T-Cap®
T
S5
Di-Cap®,T-Cap®,
Bar Cap®, Binary Cap®, and Gap
Cap
M
1. 300 Angstroms Titanium-Tungsten
2. 100µ Inches min. Gold
B
S1
S1
AU-100
AU-100
Single Border Cap
Double Border Cap
E
Single beam lead
Axial beam lead
Standard lead material is silver (Ag) .002” thick.
Optional Gold (Au)
L
Di-Cap®
Di-Cap®
A
Standard lead material is Silver (Ag) .002” thick. Optional Gold (Au)
Z
Standard lead material is Tin-Copper (Sn,Cu) .002” thick. Optional Gold (Au)
Standard
axial beam
lead
Standard lead material is silver (Ag) .002” thick.
Optional Gold (Au)
S
Di-Cap®
Capacitance Tolerance Table
Tolerance Code
Tolerance
A
B
C
D
E
F
±.05pF
±.10pF
±.25pF
±.50pF
±.5%
±1%
G
H
I
J
K
L
M
X
V
Z
S
±2%
±3%
±4%
±5%
±10%
±15%
±20%
GMV
Test Level Codes
Code Description
Industrial / Commercial Options
Y
X
• 1% AQL 2 Side Visual Screening
• 100% 4 Side Visual Screening
• 1% AQL for the electrical parameters Capacitance, Dissipation
Factor, Insulation Resistance, and Dielectric Withstanding
Voltage
+100%, -0%
+80% ,-20%
Special
High Reliability Options
MIL-PRF-49464 Group A
• 100% Thermal Shock
Environmental & Physical Testing Procedures
MIL-STD-202
Parameter
• 100%, 100 +0/-4 Hours Voltage Conditioning
• 100% Electrical Screening
• 100% 6 Side Visual Screening
• Bond Strength
• Die Shear Strength
• Temperature Coefficient Limits
Method
107
Condition
A
B
Thermal Shock
Immersion
A, (modified), -55°C to +125°C.
104
B
Moisture Resistance
Resistance to Solder Heat
Life
106
-
MIL-PRF-49464 Group B
• MIL-PRF-49464, Group A
• Immersion
• Low Voltage Humidity
• Life
210
C, 260°C for 20 seconds.
A, 96 Hours @ +125°C.
B
108
Barometric Pressure
Shock, (Specified Pulse)
Vibration, High Frequency
105
213
I, 100g’s, 6ms.
Special agreed upon testing to customers’ formal specification.
Customer Drawing Required!
204
G, 30g’s peak, 10Hz to 2kHz.
(May include, but is not limited to, one or more of the following
common requests.)
MIL-STD-883
• MIL-PRF-38534 Class H Element Evaluation.
• MIL-PRF-38534 Class K Element Evaluation.
• 10(0) Destructive Bond Pull per MIL-STD-883, Method 2011.
• 10(0) Die Shear per MIL-STD-883, Method 2019.
Consult Factory for other alternatives or assistance in specifying
custom testing.
Parameter
D
Method
2011
Condition
Bond Strength
Die Shear Strength
Temperature Cycling
Mechanical Shock
D, 3 grams minimum with .001” dia wire
2019
Limit per MIL-STD-883, Figure 2019-4.
1010
C
2002
B,Y1,
E
6 Side Visual Screening per MIL-STD-883, Method 2032.
Constant Acceleration
2001
3,000g’s, Y1 direction
All Single Layer Capacitors are Lead Free and RoHS compliant.
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6
SLC - Packaging
SLC Waffle Packaging
DLI offers a wide variety of standard design waffle packs
in various materials depending on the application. Typical
material offerings are antistatic and gel pack, which
can contain up to 400 pieces depending on component
dimension. Custom waffle packs are available; please
consult the factory for details.
SLC Tape and Reel
DLI offers tape and reel packaging solutions for a variety
of our single layer capacitor case sizes. Utilizing the latest
technology and equipment to provide our customers the
highest quality products, our standard SMD tape and reel
packaging meets or exceeds EIA standards. Custom tape
and reel packaging available; consult the factory for options.
SLC Waffle Packaging
SLC on Tape Ring
DLI offers single layer capacitors re-populated on blue
membrane tape and photon ring assembly to maximize
efficiency and minimize product cost. Used in high volume
applications, the re-populated capacitors provide for more
efficient component placement and fewer “pick and place”
machine change outs. The re-populated capacitors meet
GMV capacitance value, are 100% visually acceptable and
can be re-populated in custom shapes and sizes on a 6 inch
photon tape ring.
SLC “Black Dotted” on Tape Ring
SLC Tape and Reel
DLI offers “black dotted” capacitors on membrane tape
and photon ring assembly. For high volume applications
utilizing visual recognition, a less expensive alternative is
the use of “black dotted” capacitors provided on saw dice
membrane tape. The non- “black dotted” capacitors meet
GMV capacitance value and a minimum of 75% visually
acceptable product is guaranteed.
Storage
Single layer capacitors with applicable terminations will
be solderable for a minimum of 1 year from date of
shipment if properly stored in their original packaging. For
extended periods, storage in a dry nitrogen environment
is recommended. Product supplied on membrane tape and
photon ring should be stored in the original container and in
an environmentally controlled area where temperature and
humidity are maintained. It is recommended not to store
the product in direct light as this can negatively impact the
adhesion properties of the tape.
SLC on Tape Ring
Handling
Single layer ceramic capacitors should be handled carefully
during component transfer or placement, preventing
damage to the gold and ceramic surfaces. The capacitors
should be handled with precision stainless steel tweezers or
a vacuum wand. Contacting the capacitor with bare hands
should be avoided as resulting contaminants will affect the
performance of the component.
SLC “Black Dotted” on Tape Ring
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7
SLC - Border Cap®
Description
SLC with recessed metallization available with border on one
or both sides.
• Recessed metallization minimizes the potential for shorting
during die attach
• Bordered area provides contrast for vision recognition
during automated placement and wire bonding
• Thin film technology
• ESD proof
Functional Applications
• DC Blocking
• RF Bypass
• Filtering
• Tuning and Submounts
Double Border Cap® Designer Kits 160 Capacitors, 10 Each of 16 Values
10 Capacitors of each value
Capacitor
Width
Part Number
Dielectric
pF
0.1
0.4
3.9
4.7
0.1
0.4
6.8
8.2
0.4
0.6
0.9
Tol.
B
pF
0.6
1.0
5.6
6.2
0.7
1.0
10
Tol.
C
pF
1.5
2.2
8.2
10
1.5
2.2
20
33
4
Tol.
C
pF
2.7
3.3
20
Tol.
D
Class I, see codes on
Page 4
B
C
D
D
D10XXKITA1EX
.010”
D
D
B
M
M
C
M
M
C
M
M
D
Class II, see codes on
Page 4
33
3.3
6.4
50
Class I, see codes on
Page 4
B
C
C
D
D15XXKITA1EX
D20XXKITA1EX
.015”
.020”
K
K
M
M
D
M
M
K
Class II, see codes on
Page 4
K
15
K
100
8.2
10
B
1.7
1.9
2.7
C
Class I, see codes on
Page 4
C
C
5
D
K
D25XXKITA1EX
D30XXKITA1EX
.025”
.030”
C
C
5.6
D
20
K
Class II, see codes on
Page 4
33
M
50
M
100
M
180
M
DLI reserves the right to substitute values as required.
Customer may request particular cap value and material for sample kit to prove out designs.
Part Number Identification
D
10
BN
100
K
1
E
X
Product
D = Border
Cap®
Case
Size
10
12
15
20
25
30
35
Capacitance
(pF)
Material
See material
tables on Page 4.
Tolerance
A = ± 0.05pF
B = ± 0.10pF
C = ± 0.25pF
D = ± 0.5pF
F = ± 1%
G = ± 2%
J = ± 5%
K = ± 10%
L = ± 15%
M = ± 20%
Z = +80% -20%
Voltage
2 = 25V*
1 = 100V
Termination
P = Ni / Au
B = Single
Border
E = Double
Border
Test Level
Y, X, A, B,
D and E.
Packaging
D = Black Dotted
E = Repopulated
T = Tape and
Reel
R02 = 0.02 pF
0R5 = 0.5 pF
1R0 = 1.0 pF
5R1 = 5.1 pF
100 = 10 pF
101 = 100 pF
152 = 1500 pF
See test level
definitions on
Page 6.
*For
Capacitors with
UX material
only
Leave blank
for generic
waffle pack.
M =Au
See packaging
definitions
on Page 7.
40
50
Refer to
Capacitance
range tables for
available values.
Consult an inside
sales rep. for
custom solutions.
8
| Phone: +1.315.655.8710 | www.dilabs.com
SLC - Border Cap®
Border Cap®
W
Border Cap®
T
L
P
Double Border Cap®
B
B
Border Cap® Dimensions
L&W
Length & Width
P
B
T
Standard
Capacitance
Range pF
Pad Size
Border
Thickness
Style
Inches
mm
Inches
mm
Inches
mm
Inches
mm
(±.001) (±.025) (Nom.) (Nom.)
D10
D12
D15
D20
D25
D30
D35
D40
D50
0.02 - 100
0.03 - 100
0.03 - 200
0.06 - 430
0.10 - 700
0.15 - 1000
0.20 - 1300
0.25 - 1800
0.40 - 3000
0.010
0.012
0.015
0.020
0.025
0.030
0.035
0.040
0.050
0.254
0.305
0.381
0.508
0.635
0.762
0.889
1.016
1.270
0.008
0.010
0.011
0.016
0.021
0.026
0.031
0.036
0.046
0.203
0.254
0.279
0.406
0.533
0.660
0.787
0.914
1.168
0.001
0.025
(+.001,-.0005) (+.025,-.013)
0.0035
( +0, -0.008)
0.089
(+0, -0.203)
0.002
0.051
(+.002,-.0015) (+.005, -.038)
www.dilabs.com | Phone: +1.315.655.8710 |
9
SLC - Border Cap®
Ultra High K, UX Dielectric
25 Volt Single Border Cap® Cap. Ranges (pF)
25 Volt Double Border Cap® Cap. Ranges (pF)
Available Thicknesses
Case Size
Available Thicknesses
Case Size
0.006”
0.010”
0.006”
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
82
100
120
140
160
200
300
370
490
590
710
860
1000
1200
1300
1600
2000
2400
—
—
—
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
75
91
D10
D12
D15
D20
D25
D30
D35
D40
D50
D10
D12
D15
D20
D25
D30
D35
D40
D50
110
130
140
170
270
320
440
540
650
800
900
1100
1200
1500
2000
2400
—
100
140
200
240
300
370
450
540
600
750
800
950
1300
1500
UX material restricted to “M” termination only. Consult a DLI Application Engineer for additional values.
100 Volt Single Border Cap® Capacitance Ranges (pF)
DLI Class I Dielectrics
Case
Size
pF
PI
PG
AH
CF
NA
CD
NG
CG
DB
NP
NR
NS
NU
NV
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.03
0.05
0.05
0.07
0.06
0.09
0.15
0.15
0.20
0.30
0.30
0.45
0.35
0.60
0.50
0.70
0.8
0.04
0.06
0.06
0.09
0.08
0.10
0.15
0.20
0.25
0.40
0.35
0.55
0.50
0.80
0.65
0.95
1.0
0.06
0.10
0.09
0.10
0.15
0.20
0.25
0.35
0.40
0.60
0.55
0.90
0.75
1.2
0.07
0.10
0.10
0.15
0.15
0.20
0.25
0.40
0.40
0.65
0.60
1.0
0.07
0.10
0.15
0.15
0.15
0.20
0.25
0.45
0.45
0.70
0.65
1.0
0.15
0.15
0.20
0.25
0.25
0.35
0.45
0.70
0.70
1.1
0.15
0.20
0.20
0.30
0.30
0.40
0.50
0.80
0.80
1.3
0.25
0.35
0.30
0.50
0.45
0.70
0.80
1.3
0.25
0.35
0.35
0.50
0.45
0.70
0.80
1.3
0.25
0.40
0.40
0.60
0.55
0.85
0.95
1.6
0.50
0.80
0.70
1.1
1.00
1.6
1.8
3.0
3.0
4.7
4.3
6.8
6.2
10
0.90
1.5
1.3
2.2
1.9
3.0
3.6
5.6
5.6
9.1
8.2
13
1.8
3.0
2.7
4.3
3.9
5.6
6.8
11
2.7
4.3
3.9
6.2
5.6
8.2
10
D10
D12
D15
D20
D25
D30
D35
D40
D50
16
1.3
1.3
1.5
11
16
2.0
2.2
2.4
18
27
0.95
1.6
1.2
1.8
1.9
2.2
16
24
1.9
3.0
3.0
3.6
27
39
0.80
1.3
0.85
1.5
1.4
1.6
2.7
2.7
3.0
11
22
33
2.2
2.7
4.3
4.3
5.1
18
36
56
1.0
1.1
1.2
1.8
2.0
3.3
3.6
4.3
7.5
11
12
15
30
43
1.4
1.5
2.2
1.6
1.7
2.7
3.0
5.1
5.1
6.2
22
43
62
1.7
1.8
2.7
3.3
5.1
5.6
6.2
22
47
68
1.1
1.5
2.4
2.7
4.3
4.7
8.2
8.2
10
18
33
68
100
*Recommended for commercial use only. Please contact an inside sales representative for additional information.
100 Volt Double Border Cap® Capacitance Ranges (pF)
DLI Class I Dielectrics
Case
Size
pF
PI
PG
AH
CF
NA
CD
NG
CG
DB
NP
NR
NS
NU
NV
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.03
0.04
0.04
0.06
0.06
0.08
0.10
0.15
0.20
0.25
0.25
0.40
0.35
0.55
0.45
0.65
0.70
1.1
0.04
0.06
0.06
0.08
0.07
0.10
0.15
0.20
0.25
0.35
0.35
0.50
0.45
0.70
0.60
0.90
0.95
1.4
0.06
0.09
0.09
0.10
0.15
0.15
0.20
0.30
0.35
0.50
0.50
0.80
0.70
1.1
0.07
0.10
0.10
0.15
0.15
0.15
0.25
0.35
0.40
0.65
0.60
0.95
0.80
1.3
0.07
0.10
0.09
0.15
0.15
0.15
0.25
0.35
0.40
0.60
0.55
0.90
0.75
1.2
0.15
0.15
0.15
0.25
0.20
0.30
0.40
0.60
0.60
1.0
0.15
0.15
0.20
0.25
0.25
0.35
0.45
0.70
0.70
1.1
0.20
0.30
0.30
0.45
0.40
0.55
0.70
1.1
0.23
0.34
0.33
0.51
0.48
0.68
0.87
1.3
0.27
0.41
0.39
0.60
0.56
0.80
1.03
1.5
0.45
0.70
0.65
1.1
0.85
1.3
1.6
2.4
2.7
4.3
3.9
6.2
5.6
9.1
7.5
0.85
1.3
1.3
2.0
1.6
2.4
3.0
4.7
5.1
8.2
7.5
12
1.7
2.7
2.7
3.9
3.3
4.7
6.2
9.1
10
2.7
3.9
3.9
6.2
5.1
6.8
9.1
13
D10
D12
D15
D20
D25
D30
D35
D40
D50
1.2
1.4
1.7
15
1.9
2.1
2.5
16
24
0.90
1.5
1.1
1.7
2.0
2.4
15
22
1.7
2.7
3.1
3.7
24
36
1.3
1.5
2.4
2.8
3.3
10
20
30
2.0
2.4
3.9
4.3
5.1
16
33
51
0.90
1.3
1.4
2.2
1.1
1.0
1.7
1.9
3.3
3.6
4.3
15
27
43
1.6
1.5
2.4
2.7
4.7
5.7
6.8
11
20
39
62
1.7
1.6
2.7
3.0
5.1
5.7
6.8
12
16
22
43
68
2.4
2.4
3.9
4.7
7.5
9.1
10
33
62
100
*Recommended for commercial use only. Please contact an inside sales representative for additional information.
10 | Phone: +1.315.655.8710 | www.dilabs.com
SLC - Border Cap®
Ultra High K, UX Dielectric
50 Volt Single Border Cap® Cap. Ranges (pF)
50 Volt Double Border Cap® Cap. Ranges (pF)
Available Thicknesses
Available Thicknesses
Case Size
Case Size
0.010”
0.010”
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
—
—
—
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
-
-
-
-
D10
D12
D15
D20
D25
D30
D35
D40
D50
D10
D12
D15
D20
D25
D30
D35
D40
D50
—
100
140
200
240
300
370
450
540
600
750
800
1000
1200
1500
91
110
170
210
280
340
410
500
560
700
750
900
1200
1500
UX material restricted to “M” termination only. Consult a DLI Application Engineer for additional values.
DLI Class II Dielectrics
DLI Class III Dielectrics
Case
Size
pF
BF*
BD
BG*
BC
BE
BL
BJ
BN
BT*
BU
BV
1.3
2.2
1.9
3.3
2.7
4.3
5.1
8.2
8.2
13
2.2
3.3
3.0
5.1
4.3
6.8
8.2
13
2.7
4.3
3.9
6.2
5.6
8.2
10
3.9
6.2
5.6
9.1
8.2
13
3.6
6.2
5.6
9.1
8.2
12
6.2
10
10
16
13
22
13
22
27
43
39
68
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
D10
D12
D15
D20
D25
D30
D35
D40
D50
9.1
13
15
20
20
36
62
24
33
33
62
100
82
13
20
30
30
56
20
33
43
43
82
130
150
240
240
390
360
560
510
820
680
1000
1000
1500
15
15
24
39
51
51
100
160
150
240
220
360
300
510
430
620
620
1000
16
24
22
36
62
82
82
13
16
24
24
36
62
82
82
20
27
39
36
56
100
91
130
120
200
160
270
220
330
330
510
130
120
200
160
270
220
330
330
510
12
18
24
36
33
56
20
30
39
56
56
91
150
120
200
160
240
270
390
16
27
33
47
47
75
27
43
56
75
75
120
100
130
150
220
22
33
43
62
62
33
51
62
91
91
33
51
68
100
150
91
51
82
100
130
DLI Class II Dielectrics
DLI Class III Dielectrics
Case
Size
pF
BF*
BD
BG*
BC
BE
BL
BJ
BN
BT*
BU
BV
1.3
2.0
1.8
3.0
2.4
3.6
4.7
6.8
7.5
12
2.0
3.0
3.0
4.7
3.9
5.6
7.5
11
2.7
3.9
3.9
6.2
5.1
6.8
9.1
13
3.6
5.6
5.6
8.2
6.8
10
3.6
5.6
5.1
8.2
6.8
10
5.6
9.1
8.2
13
9.1
15
13
20
13
20
24
39
39
62
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
D10
D12
D15
D20
D25
D30
D35
D40
D50
15
20
20
36
56
22
30
30
56
91
75
11
18
24
24
47
16
27
36
36
68
110
150
220
220
360
330
510
470
750
620
910
1000
1500
13
13
20
33
47
47
91
20
20
30
51
68
68
130
150
220
220
330
300
470
390
560
620
910
12
15
22
22
33
56
75
75
18
24
33
33
51
82
120
110
180
150
240
200
300
330
470
120
110
180
150
240
200
300
330
470
11
18
22
33
30
51
82
18
27
36
51
51
82
130
110
180
150
220
240
360
15
24
30
43
43
68
24
39
51
68
68
110
91
20
33
43
62
56
30
47
62
82
82
130
150
220
33
51
68
91
91
47
75
100
130
130
www.dilabs.com | Phone: +1.315.655.8710 | 11
SLC - T-Cap®
T-Cap® “Transmission Line” capacitors are designed
as a reliable solution in DC Blocking and RF Bypassing
applications. The T-Cap® products utilize the same Single-
Layer processing technology of the Di-Cap® product line,
with one difference, this device offers a more constant
physical size and resonance behavior where dimensional
consistency is more desirable than a specified capacitance
value.
Description
Transmission Line Single Layer Capacitors
• Consistant electrical resonance performance at microwave
frequencies
• Repeatable performance from lot to lot
• Thin Film technology
Functional Applications
• Filtering • DC Blocking • RF Bypassing • Tuning
• Insulation • Submounts • Stand-Offs
Microstrip
L
W
T
Part Number Identification
T
30
BV
30
X
45
P
X
Product
Width
Two digit
number
representing
the Width in
.001”
Material
See material
tables on
Page 4.
Length
Two digit
number
representing
the Length in
.001”
Tolerance
X=
Length and
Width:
± .001”,
Thickness:
-.0005”
Thickness
“35” – “99”
Represents
thickness in
.0001”
Termination
P = Ni / Au
T = Ni / AuSn
M =Au
Test Level
Y or X
Packaging
D = Black Dotted
E = Repopulated
T = Tape and
Reel
T = T-Cap®
See test level
definitions on
Page 6.
Leave blank
for generic
waffle pack.
See packaging
definitions
K0 = .010”
M0 = .020”
For Widths
>.099”, Consult
an inside sales
rep.
For Lengths
>.099”, Consult
an inside sales
rep.
S=
Special
Examples:
55 = .0055”
K2 = .012”
M5 = .025”
on Page 7.
12 | Phone: +1.315.655.8710 | www.dilabs.com
SLC - Di-Cap®
High Performance Single Layer Capacitors for RF, Microwave
and Millimeter-Wave Applications.
• Gold metallization for wire bonding • Rugged construction
• Custom sizes at commercial prices
• Thin film technology • ESD proof
Functional Applications
• DC Blocking • RF Bypass • Filtering • Tuning
Di-Cap®
Microstrip
L
W
T
Dimensions Maximum thickness does not apply for capacitance values below 0.5pF. For thickness of 25 Volt product refer to table on page 14.
W
Width
L
T
T
Std. Capacitor
Length (Max)
Thickness (50 Volts) Thickness (100 Volts)
Range
Style
Inches
mm
Inches
mm
Inches
mm
Inches
mm
pF
+.000 -.003
+.000 -.076
D10
D12
D15
D20
D25
D30
D35
D50
D70
D90
.010
.012
.015
.020
.025
.030
.254
.305
.381
.508
.635
.762
.010
.015
.020
.020
.030
.030
.040
.060
.080
.100
.254
.381
.004 ±.001 .102 ±.025
.004 ±.001 .102 ±.025
.004 ±.001 .102 ±.025 .006 ±.001 .152 ±.025
.004 ±.001 .102 ±.025 .006 ±.001 .152 ±.025
.004 ±.001 .102 ±.025 .006 ±.001 .152 ±.025
.004 ±.001 .102 ±.025 .006 ±.001 .152 ±.025
.004 ±.001 .102 ±.025 .007 ±.002 .178 ±.051
-
-
-
-
.02 - 100
.03 - 200
.04 - 300
.06 - 400
.10 - 780
.15 - 950
.20 -1600
.30 - 3700
.55 - 6800
.65 -10,000
+.002 -.003
+.000 -.003
+.000 -.003
+.000 -.003
+.000 -.003
+.051 -.076
+.000 -.076
+.000 -.076
+.000 -.076
+.000 -.076
.508
.508
.762
.762
.035 ±.005
.050 ±.010
.070 ±.010
.090 ±.010
.889 ±.127
1.270 ±.254
1.778 ±.254
2.286 ±.254
1.016
1.524
1.778
2.540
-
-
-
-
-
-
.007 ±.002 .178 ±.051
.008 ±.002 .203 ±.051
.010 ±.004 .254 ±.102
Leaded Di-Cap®
Dimensions
L
W
W
L
Lead Width (Min) Lead Width (Max) Lead Length (Min)
Style
W
W
Inches
mm
Inches
mm
Inches
mm
Axial Beam Lead
‘A’
D10
D12
D15
D20
D25
D30
D35
D50
D70
D90
.0035
.0045
.0065
.0085
.011
.0889
.1143
.1651
.2159
.2794
.3429
.381
.007
.009
.013
.017
.022
.027
.030
.040
.060
.080
.1778
.2286
.3302
.2159
.5588
.6858
.762
1.016
1.524
2.032
.250
.250
.250
.250
.250
.250
.250
.250
.250
.250
6.350
6.350
6.350
6.350
6.350
6.350
6.350
6.350
6.350
6.350
L
W
L
Single Beam Lead
‘L’ or ‘Z’
Standing Axial Beam Lead
‘S’
.0135
.015
Notes: • See Di-Cap®Termination Code Table for available lead configurations. • Lead
material is 0.002” pure silver, (Ag), 0.002”±.0005” thick. • Leads are attached with AuSn,
80%/20% eutectic alloy. Re-flow temperature is 280°C minimum. • Pure Gold, (Au) leads
are available. Consult factory for details. • Chip dimensions per Di-Cap® dimensions table.
• Custom lead dimensions are available. Consult factory for details.
.020
.508
.030
.762
1.016
.040
Part Number Identification
D
10
CF
0R1
B
5
P
X
Product
Case
Size
10
12
15
20
25
30
35
Capacitance
(pF)
Material
See material
tables on Page 4.
Tolerance
A = ± 0.05pF
B = ± 0.10pF
C = ± 0.25pF
D = ± 0.5pF
F = ± 1%
G = ± 2%
J = ± 5%
K = ± 10%
L = ± 15%
M = ± 20%
Z = +80% -20%
Voltage
2 = 25V
5 = 50V
1 = 100V
Termination
P = Ni / Au
T = Ni / AuSn
M =Au
L = Single
Beam Lead
A = Axial
Beam Lead
S = Standing
Axial Beam
Lead
D = Special
Z = Tin Copper
Ribbon
Test Level
Y, X, A, B,
D and E.
Packaging
D = Black Dotted
E = Repopulated
T = Tape and
Reel
D = Di-Cap®
R02 = 0.02pF
0R5 = 0.5pF
1R0 = 1.0pF
5R1 = 5.1pF
100 = 10pF
101 = 100pF
432 = 4300pF
See test level
definitions on
Page 6.
Leave blank
for generic
waffle pack.
See packaging
definitions
50
70
90
Refer to
Capacitance
range tables for
available values.
Consult an inside
sales rep. for
on Page 7.
custom solutions.
www.dilabs.com | Phone: +1.315.655.8710 | 13
SLC - Di-Cap®
Ultra High K, UX* Dielectric Di-Cap®
50 Volt Capacitance Ranges (pF)
25 Volt Capacitance Ranges (pF)
Available Thicknesses
Available Thicknesses
Case Size
D10
Case Size
D10
0.010”
—
—
—
—
0.006”
0.010”
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
51
75
—
—
75
—
D12
D12
180
—
82
110
—
D15
D15
150
100
200
170
390
240
470
360
850
940
2000
2100
3500
3700
5500
250
—
170
340
280
650
390
800
620
1400
1600
3200
3500
5900
6200
10000
100
200
170
390
240
470
360
850
940
2000
2100
3500
3700
5500
D20
D20
D25
D25
D30
D30
D35
D35
D50
D50
D70
D70
D90
D90
*UX material restricted to “M” termination only.
50 Volt Di-Cap® Capacitance Ranges (pF)
DLI Class I Dielectrics
Case
pF
Size
PI
PG
AH
CF
NA
CD
NG
CG
DB
NP
NR
NS
NU
NV
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.03
0.05
0.04
0.10
0.06
0.15
0.09
0.20
0.20
0.40
0.25
0.45
0.35
0.85
0.04
0.06
0.06
0.10
0.08
0.20
0.15
0.25
0.25
0.50
0.30
0.60
0.50
1.1
0.06
0.10
0.08
0.20
0.15
0.30
0.20
0.40
0.35
0.80
0.45
0.95
0.70
1.8
0.07
0.10
0.10
0.25
0.15
0.35
0.20
0.50
0.45
0.95
0.55
1.1
0.06
0.10
0.09
0.20
0.15
0.30
0.20
0.45
0.40
0.90
0.50
1.0
0.10
0.15
0.15
0.35
0.25
0.55
0.35
0.75
0.65
1.5
0.15
0.20
0.20
0.45
0.25
0.65
0.40
0.90
0.75
1.7
0.20
0.35
0.30
0.75
0.45
1.1
0.20
0.35
0.30
0.75
0.45
1.1
0.25
0.40
0.35
0.90
0.50
1.3
0.45
0.80
0.65
1.7
1.0
2.4
1.5
3.3
2.7
6.2
3.6
7.5
0.80
1.5
1.2
3.0
1.8
4.7
2.7
6.2
5.1
12
1.6
3.0
2.4
6.2
3.6
9.1
5.6
12
2.4
4.3
3.6
9.1
5.6
13
D10
D12
D15
D20
D25
D30
D35
0.65
1.4
0.65
1.5
0.75
1.8
8.2
18
1.2
1.3
1.5
11
16
2.7
2.7
3.3
24
36
0.85
1.8
1.3
0.95
2.0
1.5
1.6
1.6
1.9
6.8
13
11
15
20
3.3
3.3
3.9
27
43
0.85
2.0
0.80
1.9
2.7
2.7
3.0
5.6
13
22
33
3.3
3.6
6.2
6.2
7.5
27
51
75
*Recommended for commercial use only. Please contact an inside sales representative for additional information.
100 Volt Di-Cap® Capacitance Ranges (pF)
DLI Class I Dielectrics
Case
Size
pF
NV
PI
PG
AH
CF
NA
CD
NG
CG
DB
NP
NR
NS
NU
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.04
0.10
0.06
0.10
0.15
0.25
0.15
0.30
0.20
0.55
0.50
1.3
0.06
0.10
0.08
0.15
0.20
0.35
0.20
0.40
0.25
0.75
0.60
1.7
0.08
0.20
0.15
0.25
0.25
0.50
0.35
0.65
0.40
1.2
0.1
0.25
0.15
0.30
0.30
0.65
0.40
0.75
0.45
1.4
0.09
0.20
0.15
0.30
0.30
0.60
0.35
0.70
0.45
1.3
0.15
0.35
0.25
0.50
0.45
1.0
0.20
0.45
0.30
0.60
0.50
1.1
0.30
0.70
0.45
0.95
0.85
1.9
1.1
2.2
1.3
3.9
3.3
9.1
6.8
13
0.30
0.75
0.45
1.0
0.85
1.9
1.1
2.2
1.4
4.3
3.3
9.1
6.8
15
0.35
0.85
0.55
1.2
1.0
2.2
1.3
2.7
1.6
5.1
3.9
11
0.65
1.6
1.0
2.2
1.9
4.3
2.7
5.1
3.0
9.1
7.5
20
1.2
3.0
1.9
3.9
3.6
8.2
4.7
9.1
5.6
18
2.4
6.2
3.9
8.2
7.5
16
3.6
9.1
5.6
12
D15
D20
D25
D30
D35
D50
D70
D90
11
24
0.60
1.2
0.65
1.4
9.1
18
15
27
0.70
2.2
0.80
2.4
12
18
36
51
0.95
2.7
1.1
1.1
1.7
2.0
15
30
43
3.0
3.0
4.7
5.6
39
82
120
91
0.95
2.0
1.2
1.2
1.9
2.4
2.2
3.6
4.3
8
15
30
56
2.7
1.5
3.9
3.9
4.7
4.3
7.5
8.2
16
10
27
33
20
51
62
120
68
180
110
270
2.4
3.0
2.7
4.3
5.1
8.2
22
8.2
22
36
3.0
6.2
7.5
6.8
12
13
91
180
*Recommended for commercial use only. Please contact an inside sales representative for additional information.
14 | Phone: +1.315.655.8710 | www.dilabs.com
SLC - Di-Cap®
Di-Cap® Designer Kits 160 Capacitors, 10 Each of 16 Values
10 Capacitors of each value
Capacitor
Width
Part Number
Dielectric
pF
0.1
0.4
3.9
4.7
0.1
0.4
6.8
8.2
0.4
0.6
1.0
Tol.
B
pF
0.6
1
Tol.
C
pF
1.5
2.2
8.2
10
Tol.
C
pF
2.7
3.3
20
Tol.
D
Class I, see codes on
Page 4
B
C
D
D
D10XXKITA5PX
.010”
D
D
B
5.6
6.2
0.6
1.0
10
M
M
C
M
M
C
M
M
D
Class II, see codes on
Page 4
33
1.5
2.2
20
3.3
5.6
50
Class I, see codes on
Page 4
B
C
C
D
D15XXKITA5PX
D20XXKITA5PX
.015”
.020”
K
K
M
M
D
M
M
K
Class II, see codes on
Page 4
K
15
K
33
100
8.2
10
B
1.5
2.2
2.7
C
3.3
4.76
5.6
Class I, see codes on
Page 4
C
C
D
K
D25XXKITA5PX
D30XXKITA5PX
.025”
.030”
C
C
D
20
K
Class II, see codes on
Page 4
33
M
50
M
100
M
180
M
DLI reserves the right to substitute values as required.
Customer may request particular cap value and material for sample kits.
DLI Class II Dielectrics
DLI Class III Dielectrics
Case
Size
pF
BF*
BD
BG*
BC
BE
BL
BJ
BN
BT*
BU
BV
1.2
2.2
1.8
4.7
2.7
6.8
4.3
9.1
8
1.8
3.6
3.0
7.5
4.3
11
2.4
4.3
3.6
9.1
5.6
13
3.6
6.2
5.1
13
3.3
6.2
5.1
13
5.6
10
8.2
20
12
30
18
39
36
82
47
91
75
180
9.1
16
12
22
12
22
22
43
36
68
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
D10
D12
D15
D20
D25
D30
D35
13
18
18
36
56
33
47
47
91
51
130
75
180
150
330
200
390
300
750
130
82
7.5
20
7.5
18
20
27
27
51
68
68
200
120
270
240
510
300
620
510
1200
6.2
13
8.2
18
12
12
30
43
43
27
24
68
91
91
12
16
22
22
56
82
82
18
27
36
51
51
130
75
180
100
220
160
390
180
100
220
160
390
10
16
20
30
30
22
33
43
62
62
160
120
270
16
27
33
47
47
39
62
75
110
110
DLI Class II Dielectrics
DLI Class III Dielectrics
Case
Size
pF
BF*
BD
BG*
BC
BE
BL
BJ
BN
BT*
BU
BV
1.8
4.3
2.7
6.2
5.6
12
3.0
6.8
4.3
9
3.6
9.1
5.6
12
5.6
13
5.1
13
8.2
20
13
33
18
47
18
47
36
82
56
130
82
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
D15
D20
D25
D30
D35
D50
D70
D90
8
8
13
20
30
30
56
18
16
27
47
62
56
120
68
130
91
270
220
560
430
910
510
1300
62
56
120
68
130
91
270
220
560
430
910
510
1300
120
100
220
130
270
160
510
390
1100
820
1600
1000
2700
180
160
360
220
430
270
750
620
1800
1300
2700
1600
4300
8
11
16
15
24
39
18
11
22
13
39
33
91
68
130
82
220
24
33
33
51
82
6.8
13
15
20
20
33
51
27
43
39
62
100
62
9.1
24
18
24
24
39
51
75
75
120
100
270
200
390
240
620
180
160
430
330
680
390
1000
22
43
62
62
56
120
91
160
120
270
150
390
160
120
240
150
390
43
91
180
110
270
51
130
www.dilabs.com | Phone: +1.315.655.8710 | 15
SLC - Bar Cap®
Bar Caps are specifically designed for MMIC circuits
requiring multiple capacitor applications, such as Multiple
Decoupling or RF Bypassing Networks. Multiple capacitor
array devices have become an integral circuit component
due to their High Q and low inductance.
Description
Multiple Decoupling/Blocking Capacitors in a Single Array
• Can be integrated into IC package to reduce bond wire
lengths and improve performance
• Single insertion reduces complexity and costs
• Simplified assembly
Functional Applications
• RF Bypass • DC Blocking for GaAs IC’s • Decoupling
Bar Cap® Dimensions
W Width
L Length
Nom Pad Size
Inches mm
Case
size
No.
Caps
Inches mm Inches mm
(± 0.003) (± 0.076) (±0.005) (±0.127)
3
4
6
3
4
6
3
4
6
3
4
6
0.065
0.085
0.125
0.065
0.085
0.125
0.065
0.085
0.125
0.065
0.085
0.125
1.651
2.159
3.175
1.651
E20
E25
E30
E40
0.02
0.025
0.03
0.508
0.635
0.762
1.016
0.02
0.508
W
2.159 0.025 0.635
T
3.175
1.651
2.159
3.175
1.651
2.159
3.175
L
0.03
0.04
0.762
1.016
0.04
Ultra High K, UX Dielectric
Class lll, BU Dielectric
25 Volt Bar Cap® Capacaitance Ranges (pF)
100 Volt Bar Cap® Capacaitance Ranges (pF)
Each Cap (pF)
T Thickness
Each Cap (pF)
T Thickness
Case Size
No. Caps
Case Size
No. Caps
0.007” (0.178mm)
0.006”
0.010”
3
4
6
3
4
6
3
4
6
3
4
6
3
4
6
3
4
6
3
4
6
3
4
6
E20
E25
E30
E40
80
E20
E25
E30
E40
340
-
100
120
150
420
500
690
270
320
430
Part Number Identification
E
40
BU
151
Z
1
P
X
4
Product
E = Bar
Capacitors
Case
Size
20
25
30
Capacitance
(pF)
800 = 80 pF
101 = 100 pF
121 = 120 pF
151 = 150 pF
Test
Level
Y or X
Capacitor
Quantity
In mils
3
4
Material
See material
tables on
Page 4.
Tolerance
Z = +80% -20%
Voltage Termination
Packaging
D = Black Dotted
E = Repopulated
T = Tape and
Reel
2 = 25V
5 = 50V
P = Ni / Au
M =Au
See test
level
definitions
on Page 6.
6
Etc.
40
Leave blank
for generic
waffle pack.
Consult an inside
sales rep. for
custom solutions.
See packaging
definitions
on Page 7.
*Custom Solutions are available; however additional tooling costs may apply. Please contact the sales office for more information.
16 | Phone: +1.315.655.8710 | www.dilabs.com
SLC - Gap Cap®
Series Configured Capacitors for Microwave Applications.
Gap Caps are designed for DC Blocking and RF Bypassing.
The low insertion loss and high resonant frequencies make
it an ideal device for this type of application. This product’s
unique configuration eliminates the need for wirebonding,
therefore reducing performance variations.
Description
• Consistent performance
• Coplannar waveguide
• Gap Cap configuration eliminates wirebonding
Functional Applications
• DC Blocking
• RF Bypass
• Elimination of wirebond
C
EFF
L
C1
C2
Microstrip
C1
C2
W
C
EFF
= SERIES EQUIVALENT
common
C1 = C2
C
= C1 ÷ 2
EFF
T
All Gap Cap values are listed as C
EFF
Gap
C
EFF
Gap Cap Designer Kits 160 Capacitors, 10 Each of 16 Values
10 Capacitors of each value
Capacitor
Width
Part Number
Dielectric
pF
0.05
0.14
1
Tol.
A
pF
0.2
0.3
2.2
4.7
0.4
0.5
5.6
6.8
0.77
1
Tol.
A
pF
0.4
0.5
5.6
8.2
0.6
1
Tol.
pF
Tol.
A
B
0.6
0.8
10
C
C
Class I, see codes on
Page 4
A
A
G10XXKITAPX05
.010”
C
D
M
M
B
M
M
D
D
M
M
D
D
M
M
Class II, see codes on
Page 4
1.5
0.08
0.2
3.3
4.7
0.4
0.5
5.6
6.8
C
M
A
15
A
1.5
2.2
15
Class I, see codes on
Page 4
A
B
C
G15XXKITAPX08
G20XXKITAPX10
.015”
.020”
D
M
A
M
M
B
8.2
10
M
M
C
Class II, see codes on
Page 4
20
1.5
2.2
15
3.3
4.7
33
Class I, see codes on
Page 4
B
C
D
M
M
G25XXKITAPX10
.025”
M
M
8.2
10
M
M
Class II, see codes on
Page 4
20
51
DLI reserves the right to substitute values as required.
Customer may request particular cap value and material for sample kits.
Part Number Identification
G
10
BU
100
K
5
P
X
10
Product
G = GAP
Cap®
Case
Size
10
15
20
25
30
35
50
Capacitance
(pF)
Test
Level
Y, X, A,
B, D and
E.
Gap
Width
In mils
5
8
Material
See material
tables on Page 4.
Tolerance
A = ± 0.05pF
B = ± 0.10pF
C = ± 0.25pF
D = ± 0.5pF
F = ± 1%
G = ± 2%
J = ± 5%
K = ± 10%
L = ± 15%
M = ± 20%
Z = +80% -20%
Voltage Termination
Packaging
D = Black Dotted
E = Repopulated
T = Tape and
Reel
2 = 25V
5 = 50V
P = Ni / Au
M =Au
R01 = 0.01 pF
0R5 = 0.5 pF
1R0 = 1.0 pF
5R1 = 5.1 pF
100 = 10 pF
511 = 510 pF
10
15
Leave blank
for generic
waffle pack.
See test
level
definitions
on page 6.
Refer to
Capacitance
range tables for
available values.
Consult an inside
sales rep. for
See packaging
definitions
on Page 7.
custom solutions.
www.dilabs.com | Phone: +1.315.655.8710 | 17
SLC - Gap Cap®
Ultra High K, UX Dielectric
25 Volt Single Gap Cap® Cap. Ranges (pF)
L
Available Thicknesses
Case Size
Microstrip
0.006”
0.010”
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
40
60
90
—
—
60
70
W
G10
G15
G20
G25
G30
G35
G50
T
120
150
200
190
250
265
300
310
350
500
800
90
Gap
C
120
140
160
180
190
200
250
380
550
EFF
25 Volt Gap Cap® Capacitance Ranges (pF)
DLI Class I Dielectrics
Case
Size
Std.
Gap
pF
PI
PG
AH
CF
NA
CD
NG
CG
DB
NP
NR
NS
NU
NV
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.02
0.03
0.03
0.07
0.04
0.10
0.05
0.15
0.06
0.15
0.07
0.20
0.02
0.05
0.04
0.10
0.05
0.15
0.07
0.20
0.08
0.25
0.09
0.25
0.04
0.08
0.06
0.15
0.08
0.25
0.10
0.30
0.15
0.35
0.15
0.45
0.04
0.09
0.08
0.15
0.10
0.30
0.15
0.35
0.15
0.45
0.20
0.50
0.04
0.08
0.07
0.15
0.09
0.25
0.15
0.35
0.15
0.40
0.15
0.50
0.06
0.10
0.15
0.25
0.15
0.45
0.20
0.60
0.25
0.70
0.30
0.80
0.07
0.15
0.15
0.30
0.20
0.55
0.20
0.65
0.30
0.80
0.30
0.95
0.15
0.25
0.25
0.50
0.30
0.90
0.35
1.1
0.45
1.3
0.50
1.6
0.15
0.25
0.25
0.55
0.30
0.90
0.35
1.1
0.45
1.4
0.50
1.6
0.15
0.30
0.30
0.65
0.35
1.1
0.40
1.3
0.55
1.6
0.25
0.60
0.50
1.2
0.65
2.0
0.75
2.4
0.95
3.0
0.50
1.2
0.90
2.2
1.2
3.9
1.4
4.7
1.8
5.6
2.2
6.8
0.95
2.4
1.8
4.3
2.4
7.5
3.0
9.1
3.6
11
1.4
3.6
2.7
6.8
3.6
11
4.3
13
5.6
16
G10
G15
G20
G25
G30
G35
.005”
.008”
.010”
.020”
.020”
.020”
0.60
1.9
1.1
3.6
4.3
13
6.2
20
50 Volt Gap Cap® Capacitance Ranges (pF)
DLI Class I Dielectrics
CD NG CG
Case
Size
Std.
Gap
pF
LA
PI
PG
AH
CF
NA
DB
NP
NR
NS
NU
NV
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0.02 0.02 0.03 0.03 0.03 0.04 0.05 0.08 0.08 0.09 0.20 0.35 0.65 0.95
0.01
0.01
0.02
0.02
0.02
0.04
0.03
0.09
0.03
0.10
G10
G15
G20
G25
G30
D35
G50
.005”
.008”
.010”
.020”
.020”
.020”
.020”
0.02 0.03 0.05 0.06 0.05 0.09 0.10 0.15 0.15 0.20 0.40 0.80
0.03 0.03 0.05 0.06 0.05 0.08 0.10 0.15 0.20 0.20 0.35 0.65
1.6
1.3
3.0
1.7
5.1
2.2
9.1
3.0
11
2.4
2.0
4.7
2.7
7.5
3.3
13
0.05 0.06 0.10 0.10 0.10 0.15 0.20 0.35 0.35 0.40 0.80
1.5
0.03 0.04 0.06 0.07 0.07 0.15 0.15 0.20 0.25 0.25 0.45 0.85
0.08 0.10 0.15 0.20 0.15 0.30 0.35 0.60 0.60 0.70
0.04 0.05 0.08 0.09 0.08 0.15 0.20 0.30 0.30 0.35 0.60
0.15 0.20 0.30 0.35 0.35 0.55 0.65 1.1 1.1 1.3 2.4
0.05 0.07 0.10 0.15 0.15 0.20 0.20 0.35 0.35 0.40 0.75
0.15 0.25 0.35 0.45 0.40 0.70 0.80 1.3 1.3 1.6 3.0
1.3
2.4
1.1
4.7
1.4
5.6
1.6
6.2
2.2
11
4.3
16
0.04 0.06 0.07 0.15 0.15 0.15 0.20 0.25 0.40 0.40 0.50 0.90
3.3
13
4.3
22
5.1
20
6.2
33
0.10 0.20 0.25 0.45
0.04 0.07 0.09 0.15 0.20 0.20 0.30 0.30 0.50 0.50 0.60
0.20 0.35 0.50 0.75 0.90 0.85 1.4 1.6 2.7 2.7 3.3
0.5
0.45 0.80 0.95
1.5
1.6
1.9
3.6
1.2
6.2
*Recommended for commercial use only. Please contact an inside sales representative for additional information.
18 | Phone: +1.315.655.8710 | www.dilabs.com
SLC - Gap Cap®
25 Volt Gap Cap® Dimensions
G
W
Width
L
T
Gap (Nom.)
Length (Max)
Thickness Range*
Style
Inches
(±0.001)
mm
(± 0.025)
Inches
mm
Inches
mm
Inches
mm
G10
G15
G20
G25
G30
G35
G50
0.005
0.008
0.010
0.020
0.020
0.020
0.020
0.127
0.203
0.254
0.508
0.508
0.508
.0508
0.010 +0 -0.003
0.015 +0 -0.003
0.020 +0 -0.003
0.025 +0 -0.003
0.030 +0 -0.003
0.035 ±0.005
0.254 +0 -0.076
0.381 +0 -0.076
0.508 +0 -0.076
0.635 +0 -0.076
0.762 +0 -0.076
0.889 ±0.127
0.030
0.040
0.050
0.060
0.060
0.060
0.080
0.762
1.016
1.270
1.524
1.524
1.524
2.032
0.004
0.004
0.004
0.004
0.004
0.004
0.006
0.102
0.102
0.102
0.102
0.102
0.102
0.152
0.05 ±0.010
1.270 ±0.254
*UX thickness only available in .006” and .010”.
50 Volt Gap Cap® Dimensions
G
W
Width
L
T
Gap (Nom.)
Length (Max)
Thickness Range
Style
Inches
(±0.001)
mm
(± 0.025)
Inches
mm
Inches
mm
Inches
mm
G10
G15
G20
G25
G30
G35
G50
0.005
0.008
0.010
0.020
0.020
0.020
0.020
0.127
0.203
0.254
0.508
0.508
0.508
.0508
0.010 +0 -0.003
0.015 +0 -0.003
0.020 +0 -0.003
0.025 +0 -0.003
0.030 +0 -0.003
0.035 ±0.005
0.254 +0 -0.076
0.381 +0 -0.076
0.508 +0 -0.076
0.635 +0 -0.076
0.762 +0 -0.076
0.889 ±0.127
0.030
0.040
0.050
0.080
0.080
0.080
0.080
0.762
1.016
1.270
2.032
2.032
2.032
2.032
0.006
0.006
0.006
0.006
0.006
0.006
0.006
0.152
0.152
0.152
0.152
0.152
0.152
0.152
0.05 ±0.010
1.270 ±0.254
DLI Class II Dielectrics
DLI Class III Dielectrics
Std.
Gap
Case
Size
pF
BF*
BD
BG*
BC
BE
BL
BJ
BN
BT*
BU
BV
0.70
1.7
1.4
3.3
1.7
5.6
2.2
6.8
2.7
8.2
3.3
10
1.1
2.7
2.2
5.1
2.7
9.1
3.3
11
4.3
13
5.1
16
1.4
3.6
2.7
6.8
3.6
11
4.3
13
5.6
16
2.0
5.1
3.9
10
5.1
16
6.2
20
8.2
24
2.0
4.7
3.9
9.1
5.1
16
6.2
20
7.5
24
3.3
7.5
6.2
15
8.2
24
10
30
12
39
15
43
5.1
13
10
24
13
43
16
51
20
62
24
75
7.5
18
15
33
18
56
22
68
27
82
33
100
7.5
18
15
33
18
56
22
68
27
82
33
100
15
33
22
51
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
.005”
G10
G15
G20
G25
G30
G35
27
43
.008”
.010”
.020”
.020”
.020”
62
33
110
43
130
51
160
62
180
100
51
160
68
200
82
240
100
300
6.2
20
9.1
27
9.1
27
DLI Class II Dielectrics
DLI Class III Dielectrics
Std.
Gap
Case
Size
pF
BF*
BD
BG*
BC
BE
BL
BJ
BN
BT*
BU
BV
0.50
1.1
0.95
2.2
1.3
3.6
1.7
6.8
2.2
8.2
2.4
10
0.75
1.8
1.5
3.6
2.0
5.6
2.7
11
3.3
13
3.9
15
0.95
2.4
2.0
4.7
2.7
7.5
3.3
13
4.3
16
5.1
20
1.4
3.3
3.0
6.8
3.9
11
4.7
20
6.2
24
7.5
27
9.1
51
1.4
3.3
2.7
6.2
3.6
10
4.7
20
6.2
24
6.8
27
9.1
47
2.2
5.1
4.3
10
6.2
16
7.5
30
10
36
11
43
15
75
3.6
8.2
7.5
16
10
27
12
51
16
62
18
68
24
120
5.1
12
10
22
13
39
18
68
22
82
24
100
33
160
5.1
12
10
22
13
39
18
68
22
82
24
100
33
160
9.1
22
15
36
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
.005”
.008”
.010”
.020”
.020”
.020”
.020”
G10
G15
G20
G25
G30
G35
G50
20
30
43
68
39
110
51
200
68
240
75
300
100
510
24
68
33
130
43
160
47
180
62
330
3.3
16
5.1
27
6.2
33
www.dilabs.com | Phone: +1.315.655.8710 | 19
SLC - Bi-Cap®
Description
Binary Tunable Caps for SLC Hybrids.
• Small size is compatible with microwave geometries
• Ideal for prototype circuits
Functional Applications
• Matching Networks
• Tank Cicuits
• Dielectric resonator tuning/coupling
C
1
C
2
C
3
C1 = 1
C2 = 2 x C1
C3 = 4 x C1
T
C
3
(4 pad - C4 = 8 x C1 )
Pads may be used singularly or
in combination to tune circuit.
C
C
1
2
L
W
Bi-Cap® Dimensions and Part Numbers
L & W
Length & Width
T
B
Voltage
Rating
(Volts)
Thickness
Border
No.
Caps
Each Cap
(pF)
Part Number
Inches
mm
(± .025)
Inches
(± .001)
mm
(± .025)
Inches
(± .002)
mm
(± .051)
(± .001)
F15CGR08M5PX3
F15NR0R1M1PX3
F20CG0R1M1PX3
F20NR0R2M1PX3
F25CFR08M5PX3
F25CG0R2M1PX3
F25NR0R4M1PX3
F35CF0R1M1PX3
F35CG0R4M1PX3
F40NR0R5M1PX4
3
3
3
3
3
3
3
3
3
4
.080, .15, .3
.1, .2, .4
0.015
0.015
0.020
0.020
0.025
0.025
0.025
0.035
0.035
0.040
0.381
0.381
0.508
0.508
0.635
0.635
0.635
0.889
0.889
1.016
0.004
0.006
0.006
0.006
0.004
0.006
0.006
0.006
0.006
0.0075
0.102
0.152
0.152
0.152
0.102
0.152
0.152
0.152
0.152
0.191
0.002
0.002
0.002
0.002
0.002
0.002
0.002
0.002
0.002
0.002
0.0051
0.0051
0.0051
0.0051
0.0051
0.0051
0.0051
0.0051
0.0051
0.0051
50
100
100
100
50
.1, .2, .4
.2, .4, .8
.080, .15, .3
.2, .4, .8
.4, .8, 1.6
.1, .2, .4
.1, .2, .4
.5, 1, 2, 4
100
100
100
100
100
*Custom Solutions are available; however additional tooling costs may apply. Please contact an inside sales representative for more
information.
Part Number Identification
F
15
NR
0R1
M
1
P
X
3
Product
F =
Binary
Case
Size
15
20
25
Capacitance
(pF)
Lowest Value
in Series is Part
Number
R08 = .080 pF
0R1 = .1 pF
0R2 = .2 pF
0R4 = .4 pF
0R5 = .5 pF
Test
Level
Y or X
Pad
Quantity
Material
See material
tables on
Page 4.
Tolerance
M = ±20%
Voltage Termination
Packaging
D = Black Dotted
E = Repopulated
T = Tape and
Reel
2 = 25V
5 = 50V
1 = 100V
P = Ni / Au
M =Au
3
4
Capacitors
See test
level
definitions
on Page 6.
35
40
Leave blank
for generic
waffle pack.
See packaging
definitions
on Page 7.
Consult an inside
sales rep. for
custom solutions.
20 | Phone: +1.315.655.8710 | www.dilabs.com
SLC - Heatsinks, Standoffs & Submounts
Aluminum Nitride
Heat Sink
Heatsinks
LED or Laser Diode
Metalized 6 Sides
(i.e. DC Short)
• Heatsinks are fully metallized on all sides and are used to
dissipate and absorb heat
• Heatsinks allow for high thermal conductivity and are
electrically conductive (DC short)
Pkg Floor
• Typically used with LED’s or laser diodes
Standoff
Standoffs
Photo-Diode
(Metalization Top
& Bottom Only
i.e. DC Isolated)
• A Standoff is much like a Heatsink however it is typically
metallized on only the top and bottom surfaces
Wire Bonds
For Signal
& Bias
Pkg Floor
• Each device is custom tailored to the customer’s
specifications and is typically used with LED’s or Photo
Diodes (works as a photo detector, light is allowed in
through fibers)
{
Submounts
• Submounts are ceramic LED package bases which
minimize thermal resistance between LED junctions and
adjacent components
• By reducing junction temperatures, an LED will produce
increased efficiency, brightness, color and reliability
• Each device is custom tailored to the customer’s
specifications
Material Specifications
Thermal
Thermal Expansion
ppm/°K
Relative ξr*
@ 5 GHz
TCC†Loss
ppm/°C
Coefficient of
Tangent* % Max
Conductivity
W/m-°K
Material Code
AG
PI
8.85 ± 0.35 (@ 1MHz)
9.9 ± 0.15 (@ 1MHz)
Aluminum Nitride
Alumina 99.6%
0.10
0.01
4.6
6.5 - 7.5
140-180
27
*Unless otherwise specified K dielectric measurement at approximately 5 GHz. †For the temperature range -55 to 125°C. **Material only provided metalized.
Surface Finish
Metallization
Code
Roughness Ra
>50 µ in.
20 µ in.
Material Process
As-Fired
Machined
Polished
Drawing required
Code Description
X
Y
Z
S
M
P
300 Angstroms TiW, 100 µ in. min. Au
75 µ in. min. Nickel, 100 µ in. min. Au
<5 µ in.
Special
E
Metallized and etched per Customer drawing
T
D
300 Angstroms min. TiW, 50 µ in. min. NiV, 300 µ in. min. Au-Sn
SPECIAL, DLI Design per Customer Requirements
www.dilabs.com | Phone: +1.315.655.8710 | 21
MLC - Dielectric Material & Case Sizes
Case Size
Footprint
in. (mm)
Cap Value
Range
(pF)
Series
Resonance
(MHz)
Working
Voltage
(Max)
Cap
(pF)
Typical ESR
DLI Series
AH
150 MHz 500 MHz
1 GHz
0.136
0.104
0.086
0.114
0.085
0.074
0.138
0.109
–
1
0.067
0.044
0.032
0.059
0.039
0.024
0.059
0.028
0.023
0.074
0.048
0.028
0.027
0.08
0.071
0.055
0.063
0.06
9200
3000
1000
9064
3100
1290
3100
1290
400
.055 x .055
(1.40 x 1.40)
C11AH
0.1 to 100
0.1 to 1000
0.1 to 1000
10
250
1000
1000
100
1
.110 x .110
(2.79 x 2.79)
C17AH
10
1000
10
0.05
0.094
0.069
0.063
0.207
0.116
0.14
TCC (ppm/°C)
(-55° to
+125°C)
Porcelain
(P90)
.110 x .110
(2.79 x 2.79)
C18AH
100
1000
10
0.249
0.19
–
2480
1000
320
100
1000
2700
.220 x .250
(5.84 x 6.35)
C22AH
C40AH
1 to 2700
1 to 5100
2500
7200
+90 ±20
–
–
214
10MHz
30MHz
100MHz
15
0.066
0.018
0.009
0.008
0.033
0.026
0.017
0.016
0.027
0.052
0.033
0.033
2100
680
210
95
100
.380 x .380
(9.65 x 9.65)
1000
5100
Case Size
Footprint
in. (mm)
Cap Value
Range
(pF)
Series
Resonance
(MHz)
Working
Voltage
max
Cap
(pF)
Typical ESR
DLI Series
C06CF
CF
150 MHz 500 MHz
1 GHz
0.428
0.243
0.173
0.146
0.107
0.111
0.124
0.136
0.102
–
1
10
0.182
0.095
0.081
0.073
0.049
0.040
0.073
0.065
0.041
0.034
0.068
0.058
0.041
0.072
0.047
0.036
0.035
10MHz
0.121
0.044
0.032
0.011
0.276
0.159
0.127
0.089
0.075
0.073
0.082
0.098
0.070
0.073
0.086
0.087
0.068
0.113
0.079
0.067
–
10300
3200
1400
9900
3100
970
.063 x .030
(1.60 x 0.80)
0.1 to 47
250
250
47
1
.055 x .055
(1.40 x 1.40)
C11CF
0.1 to 100
10
100
1
9060
3100
1300
400
10
.110 x .110
(2.79 x 2.79)
C17CF
C18CF
C22CF
0.1 to 1000
0.1 to 1000
1 to 2700
1000
1000
2500
100
1000
1
TCC (ppm/°C)
(-55° to
+125°C)
Porcelain
(NP0)
0.158
0.118
–
9060
3100
1000
2480
1000
320
.110 x .110
(2.79 x 2.79)
10
1000
10
0 ±15
0.164
0.119
–
100
1000
2700
.220 x .250
(5.84 x 6.35)
–
214
30MHz
0.054
0.038
0.036
0.016
100MHz
0.037
0.045
0.038
0.040
10
2100
680
210
95
100
.380 x .380
(9.65 x 9.65)
C40CF
1 to 5100
7200
1000
5100
Case Size
Footprint
in. (mm)
Cap Value
Range
(pF)
Series
Resonance
(MHz)
Working
Voltage
max
Cap
(pF)
DLI Series
Typical ESR
NA
150 MHz 500 MHz
1 GHz
0.235
0.166
0.117
0.121
0.085
0.060
0.043
1
10
0.091
0.064
0.046
0.047
0.033
0.024
0.017
0.166
0.117
0.083
0.086
0.061
0.043
0.030
8796
2994
1019
10360
3238
1012
316
.055 x .055
(1.40 x 1.40)
TCC (ppm/°C)
(-55° to
C11NA
0.1 to 100
250
100
1
+125°C)
Ceramic
(NP0)
10
.110 x .110
(2.79 x 2.79)
C17NA
0.1 to 1000
1000
100
1000
N30 ±15
22 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - Dielectric Material & Case Sizes
Case Size
Footprint
in. (mm)
Cap Value
Range
(pF)
Series
Resonance
(MHz)
Working
Voltage
max
Cap
(pF)
DLI Series
Typical ESR
UL
150 MHz 500 MHz
1 GHz
0.148
0.088
0.087
0.107
0.064
0.070
0.129
0.066
0.036
0.126
0.094
0.103
0.125
0.086
0.081
0.082
0.057
–
1
0.081
0.038
0.036
0.052
0.028
0.023
0.053
0.029
0.017
0.051
0.041
0.041
0.066
0.037
0.022
0.040
0.021
0.016
0.095
0.057
0.058
0.072
0.041
0.043
0.086
0.041
0.023
0.078
0.060
0.064
0.084
0.057
0.042
0.056
0.035
0.029
9820
3930
2650
1750
1010
570
.040 x .020
(1.0 x 0.5)
C04UL
0.1 to 10
0.1 to 47
5
200
250
250
250
250
1000
10
5
.060 x .030
(1.60 x 0.80)
C06UL
15
47
5.6
10
5000
3960
2540
6000
4620
4340
7530
3800
1430
2940
910
TCC (ppm/°C)
(-55° to
+125°C)
Ceramic
(NP0)
.110 x .070
(2.79 x 1.72)
C07UL
0.1 to 100
0.1 to 100
0.1 to 100
0.1 to 1000
30
100
9.5
11
.080 x .050
(2.0 x 1.27)
C08UL
0 ±30
100
10
.055 x .055
(1.40 x 1.40)
C11UL
100
10
.110 x .110
(2.79 x 2.79)
C17UL
100
470
420
DLI MLC Dielectric Materials
Dissipation
Factor @ 1 MHz
(% Maximum)
Insulation Resistance (MΩ)
Temperature Coefficient
-55°C to +125°C
Dielectric Code
@ +25°C
@ +125°C
AH
P90 ± 20 ppm/°C
0 ± 15 ppm/°C
0 ± 30 ppm/°C
± 15%
0.05
0.05
0.05
2.50
0.05
CF
See Notes below
See Notes below
UL
BL*
NA
>104
>106
>103
>105
N30 ± 15 ppm/°C
*Broadband Blocks only.
Notes: Insulation Resistance (Per MIL-PRF-55681 & MIL-PRF-55681/4)
High Frequency Capacitors (C11, C17 & C18)
All other Case sizes (C04, C06, C07, C08, C22, C40)
@ +25°C: 105 MΩ
@ +25°C: 106 MΩ (0.1pF to 470pF) / 105 MΩ (510pF to 1000pF)
@ +125°C: 105 MΩ (0.1pF to 470pF) / 104 MΩ (510pF to 1000pF)
@ +125°C: 104 MΩ
ESR and Resonance data is of typical performance and can vary from lot to lot. Consult factory for additional case size data.
Temperature Coefficient of Capacitance
CF
UL
AH
NA
1.25
1
0.75
0.5
0.25
0
-0.25
-0.5
-0.75
-1
-55
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
www.dilabs.com | Phone: +1.315.655.8710 | 23
MLC – Application Notes
Attachment Methods
Chip Selection
Bonding of capacitors to substrates can be categorized into two
methods, those involving solder, which are prevalent, and those
using other materials, such as epoxies and thermo-compression
or ultrasonic bonding with wire. Please see DLI application note
“Recommended Solder Attachment Techniques for MLC Chip and
Pre-Thinned Capacitors” located on our website:
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature, or “temperature coefficient”, as
these devices vary in behavior over temperature. The choice
of component is thus largely determined by the temperature
stability required of the device, i.e. type of dielectric, and the
size necessary for a given capacitance and voltage rating. The
following items are pertinent to chip selection:
www.dilabs.com.
Soldering
Dielectric Type
Soldering methods commonly used in the industry and
recommended are Reflow Soldering, Wave Soldering, and to a
lesser extent, Vapor Phase Soldering. All these methods involve
thermal cycling of the components and therefore the rate of heating
and cooling must be controlled to preclude thermal shocking of the
devices. In general, rates which do not exceed 120°C per minute
and a temperature spike of 100°C maximum for any soldering
process on sizes C18 and smaller is advisable. Other precautions
include post soldering handling, primarily avoidance of rapid
cooling with contact with heat sinks, such as conveyors or cleaning
solutions.
CF: Ultra stable Class I dielectric exceeds EIA COG requirements
with negligible dependence of electrical properties on temperature,
voltage, frequency and time, used in circuitry requiring very stable
performance.
AH: EIA Class I dielectric with a dielectric constant that
increases with temperature (90ppm/°C). Useful for temperature
compensation where other board components may be losing
capacitance with temperature.
NA: EIA Class I dielectric with a negative TCC. Useful in situations
where other board components are gaining capacitance with
temperature.
Large chips are more prone to thermal shock as their greater bulk
will result in sharper thermal gradients within the device during
thermal cycling. Units larger than C18 experience excessive stress
if processed through the fast cycles typical of solder wave or vapor
phase operations. Solder reflow is most applicable to the larger
chips as the rates of heating and cooling can be slowed within safe
limits. In general, rates that do not exceed 60°C per minute and a
temperature spike of 50°C maximum for any soldering process on
sizes larger than C18 is advisable.
UL: EIA Stable Class I dielectric, with extremely low ESR. Useful in
any application where heat generation or signal loss are concerns.
BL: EIA Stable Class II dielectric (X7R), with predictable change
in properties with temperature, voltage, frequency and time. Used
as blocking, de-coupling, bypassing and frequency discriminating
elements. This dielectric is ferroelectric, and provides higher
capacitance than Class I.
Capacitor Size
Attachment using a soldering iron requires extra care, particularly
with large components, as thermal gradients are not easily
controlled and may cause cracking of the chip. Precautions include
preheating of the assembly to within 100°C of the solder flow
temperature, the use of a fine tip iron which does not exceed 30
watts, and limitation of contact of the iron to the circuit pad areas
only.
Size selection is based primarily on capacitance value, voltage
rating, and resonance frequency. Smaller units are generally less
expensive; 0603 is the most economical size. Because mass affects
the thermal shock behavior of chips, size selection must consider
the soldering method used to attach the chip to the board. C18 and
smaller can be wave, vapor phase or reflow soldered. Larger units
require reflow soldering.
Bonding
Termination Material
Hybrid assembly using conductive epoxy or wire bonding requires
the use of silver palladium or gold terminations. Nickel barrier
termination is not practical in these applications, as intermetallics
will form between the dissimilar metals. The ESR will increase
over time and may eventually break contact when exposed to
temperature cycling.
Nickel barrier termination, with exceptional solder leach resistance
is recommended for all applications involving solder. DLI offers two
versions of the nickel barrier termination. The “Z” termination is
a nickel barrier with 100% matte tin for a lead free capacitor. The
“U” termination is a nickel barrier with 90/10 tin/lead for military
applications. Non-magnetic versions of these termination finishes
are also available.
Cleaning
Chip capacitors can withstand common agents such as water,
alcohol and degreaser solvents used for cleaning boards. Ascertain
that no flux residues are left on the chip surfaces as these diminish
electrical performance.
Solder Leaching
DLI’s termination finishes are designed to withstand RoHS
attachment methods. During soldering, time above 230°C
should be minimized to reduce thinning of the barrier layer and
subsequent bond failure. DLI offers enhanced magnetic and non-
magnetic termination finishes for applications requiring extended
soldering time or repeated reflow cycles. Please consult your Sales
Representative when ordering.
DLI Shelf Life / Storage
Capacitors are solderable for a maximum of one year from the
date of shipment if properly stored in the original packaging. Dry
nitrogen storage is preferable for longer periods.
Packaging
Units are available in bulk, reeled or in waffle pack.
24 | Phone: +1.315.655.8710 | www.dilabs.com
MLC – Application Notes
Board Design Considerations
Temperature Precautions
The amount of solder applied to the chip capacitor will influence
the reliability of the device. Excessive solder can create thermal and
tensile stresses on the component which could lead to fracturing
of the chip or the solder joint itself. Insufficient or uneven solder
application can result in weak bonds, rotation of the device off line
or lifting of one terminal off the pad (tombstoning). The volume of
solder is process and board pad size dependent. WAVE SOLDERING
exposes the devices to a large solder volume, hence the pad size
area must be restricted to accept an amount of solder which is not
detrimental to the chip size utilized. Typically the pad width is 66%
of the component width, and the length is .030" (.760 mm) longer
than the termination band on the chip. An 0805 chip which is .050"
wide and has a .020" termination band therefore requires a pad
.033" wide by .050" in length. Opposing pads should be identical
in size to preclude uneven solder fillets and mismatched surface
tension forces which can misalign the device. It is preferred that the
pad layout results in alignment of the long axis of the chips at right
angles to the solder wave, to promote
even wetting of all terminals. Orientation of components in line
with the board travel direction may require dual waves with solder
turbulence to preclude cold solder joints on the trailing terminals of
the devices, as these are blocked from full exposure to the solder
by the body of the capacitor. Restrictions in chip alignment do not
apply to SOLDER REFLOW or VAPOR PHASE processes, where the
solder volume is controlled by the solder paste deposition on the
circuit pads There are practical limitations on capacitor sizes that
prohibit reliable direct mounting of chip capacitors larger than
2225 to a substrate. Without mechanical restriction, thermally
induced stresses are released once the capacitor attains a steady
state condition, at any given temperature. Capacitors bonded to
substrates, however, will retain some stress, due primarily to the
mismatch of expansion of the component to the substrate; the
residual stress on the chip is also influenced by the ductility and
hence the ability of the bonding medium to relieve the stress.
Unfortunately, the thermal expansions of chip capacitors differ
significantly from those of substrate materials.
The rate of heating and cooling must be controlled to preclude
thermal cracking of ceramic capacitors. Soldering temperatures
should not exceed 200°C per minute, temperature variation must
not exceed 100°C maximum for any solder operation. Avoid
forced cooling or contact with heat sinks, such as conveyor belts,
metal tables or cleaning solutions, before the chips reach ambient
temperatures.
MLC Orientation - Horizontal and Vertical
Mounting
The orientation of the MLC relative to the ground plane affects
the devices’ impedance. When the internal electrodes are parallel
to the ground plane (Horizontal mounting) the impedance of the
MLC resembles a folded transmission line driven from one end.
The below graph shows the modeled insertion loss and parallel
resonances of C17AH101K-7UN-X0T with horizontal mounting.
When the internal electrodes are perpendicular to the ground plane
(Vertical mounting, bottom graph) the MLC impedance resembles a
folded transmission line driven from the center reducing resonance
effects. C11,17 are available with vertical or horizontal orientation in
tape and reel packaging. Modeling can be done in CapCad. HP/EEs
of series 4 contains models for C11 and C17 in the element libraries
under Dielectric Laboratories MLC.
Horizontal Orientation
C17AH101K-7UN-X0T 100.0pF Temp = 25°C
0
-1
-2
-3
-4
-5
-6
Recommended Printed Wire Board Land
Patterns
0
1
2
3
4
5
6
7
8
9
10
Printed Wire Board land pattern design for chip components is
critical to ensure a reliable solder fillet, and to reduce nuisance
type manufacturing problems such as component swimming and
tombstoning. The land pattern suggested can be used for reflow
and wave solder operations as noted. Land patterns constructed
with these dimensions will yield optimized solder fillet formation and
thus reduce the possibility of early failure.1
Frequency (GHz)
Vertical Orientation
C17AH101K-7UN-X0T 100.0pF Temp = 25°C
0
-1
-2
-3
-4
-5
-6
A = (Max Length) + 0.030” (.762mm)*
B = (Max Width) + 0.010” (.254mm)**
C = (Min Length) – 2 (Nominal Band)***
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
* Add 0.030” for Wave Solder operations.
** Replace “Max Width” with “Max Thickness” for vertical mounting.
*** ”C” to be no less than 0.02”, change “A” to (Max Length) + 0.020”.
For CO4 ”C” to be no less than 0.01”.
1. Frances Classon, James Root, Martin Marietta Orlando Aerospace,
“Electronics Packaging and Interconnection Handbook”.
www.dilabs.com | Phone: +1.315.655.8710 | 25
MLC – General Information
Case Size Definitions
Width
Length
Inches mm
Gap Min
(Between
Bands)
Thickness(1)
(Max)
Band Min(2) Band Max(2)
(Plated) (Plated)
Case Case
Size Code
Termination
Inches
mm
Min.
Max.
.026
.026
.038
.038
.041
.131
.061
.061
.074
.074
.131
.137
.133
.142
.278
.410
Min.
Max.
.667
.667
.960
.960
1.040
Min.
Max.
Min.
.869
.869
Max. Inches mm Inches mm Inches mm Inches mm
.014
.014
.023
.023
.022
.090
.040
.040
.038
.038
.090
.090
.108
.090
.223
.352
.362
.362
.579
.579
.555
.034
.034
.051
.051
.051
.052
.065
.065
.043
.043
.095
.095
.100
.095
.200
.049
.049
.069
.069
.076
.089
.097
.097
.074
.084
.137
.152
.120
.152
.252
.415
1.245
1.245
.025
.025
.032
.032
.033
.105
.054
.054
.053
.053
.105
.105
.100
.105
.137
.640
.640
.008
.008
.010
.010
.014
.019
.010
.010
.014
.014
.038
.038
.040
.043
.124
.276
.193
.193
.241
.241
.362
.483
.241
.241
.362
.362
.965
.965
1.016
1.086
3.137
6.998
.004
.004
.007
.007
.007
.008
.014
.014
.008
NA
.097
.097
.169
.169
.169
.193
.362
.362
.193
NA
.017
.017
.027
.027
.027
.047
.041
.041
.029
NA
.427
.427
.680
.680
.680
1.200
1.040
1.040
.733
NA
04BL 0402
04UL 0402
06BL 0603
06CF 0603
06UL 0603
07UL 0711
08BL 0805
08UL 0805
U,S
S,Z
1.303 1.760
1.303 1.760
1.303 1.920
1.327 2.267
1.641 2.454
1.641 2.454
1.086 1.867
1.086 2.134
2.413 3.467
2.413 3.867
2.540 3.048
2.413 3.867
5.067 6.401
.800
U,S,Z
.800
U,S,Z,E,P,W,H,V,R
.827
U,S,Z
2.292 3.334
1.013 1.547
1.013 1.547
2.667
1.360
1.360
1.334
1.334
2.667
2.667
2.540
2.667
3.467
3.467
S,Z
U,S,Z
U,S,Z
U,S,Z,E,P,Q,Y,M,W,H,V,R
T
.965
.965
1.867
1.867
11
11
17
17
0505
0505
1111
1111
2.292 3.334
2.292 3.467
2.743 3.378
2.292 3.600
5.671 7.068
.008
NA
.193
NA
.047
NA
1.200
NA
U,S,Z,E,P,Q,Y,M,W,H,V,R
T
.010
.008
NA
2.540
.193
NA
.040
.047
NA
1.016
1.200
NA
18BL 1111
U,S,Z
18
22
40
1111
2222
3838
U,Z,E,W,H,V
U,S,Z,E,P,Q,Y,M,W,H,V,R
U,S,Z,E,P,Q,Y,M,W,H,V,R
6.928 10.401 .352
8.928 10.535 .137
NA
NA
NA
NA
(1) Dimensions listed include the termination, not just ceramic.
(2) Band widths are from corner to corner of part.
*C22-Bands must not have more than an .017 difference from the measured band on one end to the band on the other.
Recommended Pad Spacing Dimensions (inches)
Internal
Electrode
Horizontal
Vertical
Horizontal
Vertical
Horizontal
Vertical
Horizontal
Vertical
Horizontal
Vertical
Horizontal
Vertical
Horizontal
Vertical
Horizontal
Vertical
Reflow Soldering
Wave Soldering
Case Size
C04
A
0.076
B
0.036
Not Recommended
0.051
Not Recommended
0.141
C
0.010
A
0.106
B
0.036
Not Recommended
0.051
Not Recommended
0.141
C
0.020
0.106
0.119
0.020
0.020
0.136
0.149
0.020
0.020
C06
C07
Not Recommended
0.071
Not Recommended
0.071
0.127
0.127
0.114
0.114
0.182
0.182
0.182
0.182
0.282
0.020
0.020
0.020
0.020
0.040
0.040
0.070
0.070
0.110
0.157
0.157
0.144
0.144
0.212
0.212
0.212
0.212
0.312
0.020
0.020
0.020
0.020
0.040
0.040
0.070
0.070
0.110
C08
0.064
0.084
0.063
0.147
0.115
0.152
0.115
0.288
0.064
0.084
0.063
0.147
0.115
0.152
0.115
0.288
C11
C17
C18
C22
Not Recommended
0.420
Not Recommended
Not Recommended
0.420
Not Recommended
Horizontal
Vertical
0.445
0.290
0.475
0.290
C40
26 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - General Information
Termination Systems
Code Termination System
Application
Code Termination System
Application
Ag Termination
Ni Barrier Layer
Heavy SnPb Plated
Solder
Ag Termination
Ni Barrier Layer
SnPb Plated Solder
• Resistant to Cracking
• High Reliability Applications
• High Volume & Hand Solder
Assembly
Polymer Termination
Ni Barrier Layer
Sn/Pb Plated Solder
• High Reliability Applications
• Hand Soldering
T
Y
• High Reliability Applications
• High Volume & Hand Solder
Assembly
• Resistant to Cracking
• Non-Magnetic Application
• High Volume & Hand Solder
Assembly
U
Polymer Termination
Cu Barrier Layer
Sn Plated Solder
M
RoHS
Ag Termination
Ni Barrier Layer
Gold Flash
• Specialty Solder,
Epoxy Applications
• Standard for 0402
S
RoHS
Ag Termination
Cu Barrier Layer
Sn Plated Solder
W
RoHS
• Non-Magnetic Application
• High Volume
Ag Termination
Ni Barrier Layer
Sn Plated Solder
Z
• High Volume & Hand Solder
Assembly
RoHS
Ag Termination
Enhanced Cu Barrier
Sn Plated Solder
• Non-Magnetic Applications
H
RoHS
•
High Vol. & Hand Solder Assembly
Ag Termination
Enhanced Ni Barrier
Sn Plated Solder
• High Volume & Hand Solder
Assembly
• Ultra Leach Resistant
• Ultra Leach Resistant
E
RoHS
• Non-Magnetic Applications
• High Reliability Applications
• High Volume & Hand Solder
Assembly
Ag Termination
Cu Barrier Layer
SnPb Plated Solder
V
R
P
AgPd Termination
• Non-Magnetic Applications
RoHS
Ag Termination
Cu Barrier Layer
Heavy SnPb Plated
Solder
• Non-Magnetic Applications
• High Reliability Applications
• Hand Soldering
Polymer Termination
Ni Barrier Layer
Sn Plated Solder
• Resistant to Cracking
• High Volume & Hand Solder
Assembly
Q
RoHS
Lead Termination Codes Leads are attached with high melting point solder (HMP) at 296°C.
Axial Ribbon
Code A
Radial Ribbon
Code B
Center Ribbon
Code C
Axial Wire Lead
Radial Wire Lead
Code F
Code E
Packaging Configurations
Test Level Codes
7" Reel, 13" Reel,
Inspection Description -
see individual part pages
for additional detail
7" Reel, 8mm Tape
16mm
Tape
16mm
Tape
Test code
2" x 2"
Waffle
Pack
Size
L x W
Case
Style
Horizontal
Vertical
Horizontal
Orientation
100% IR, 1% AQL visual,
1% AQL Electrical (DWV, Cap., DF)
Y
X
A
Orientation Orientation
100% IR, 1 % visual,
1% AQL Electrical (DWV, Cap., DF)
0.040" x
0.020"
C04
C06
C07
C08
C11
C17
C18
C22
C40
5000
Group A testing per
MIL – PRF – 55681
0.060" x
0.030"
4000
2000
108
Group C testing per
MIL – PRF – 55681
0.110” x
0.070”
C
D
Customer Defined
0.080" x
0.050"
5000
3500
2350
2350
500
3100
3100
750
108
108
49
0.055" x
0.055"
0.110" x
0.110"
0.110" x
0.110"
750
49
Typically a minimum 500 piece order for tape and
reel packaging.
0.220" x
0.245"
Standard Packaging: Bulk in plastic bags.
0.380" x
0.380"
250
250
1300
Consult factory for custom packaging solutions.
www.dilabs.com | Phone: +1.315.655.8710 | 27
MLC - Standard P/N System
C 17 CF 620 J- 7 U N- X 0 T
MLC
Capacitor
Case Size
Material
System
Capacitance Code
Tolerance
Level
Voltage Termination Leading Code Test Level Marking Packaging
Code
Code
Code
Case Size 17 Material
CF Capacitance 620 Tolerance J
Code Value
First two
digits
Significant figures in
capacitance
Case Dimensions
04 0.040" x 0.020"
06 0.060" x 0.030"
07 0.110" x 0.070"
08 0.080" x 0.050"
11 0.055" x 0.055"
17 0.110" x 0.110"
18 0.110" x 0.110"
22 0.220" x 0.250"
40 0.380" x 0.380"
Material Characteristics
AH
CF
UL
BL
NA
P90 High-Q
NPO High-Q
A
B
C
D
F
± 0.05pF
Additional number
of zeros
Represents a
decimal point
620 = 62pF
152 = 1500pF
± 0.1pF
± 0.25pF
± 0.5pF
± 1%
± 2%
± 5%
Third digit
R
Ultra Low ESR-NPO
DC Blocking Ultra
N30 High-Q
Examples:
G
J
K
M
X
S
± 10%
± 20%
GMV
SPECIAL
Termination
U
<10pF A, B, C, D
>10pF F, G, J, K, M
Code Termination System
Voltage
Code Value
7
T
U
S
Z
E
Ag Termination, Ni Barrier Layer, Heavy SnPb Plated Solder
Ag Termination, Ni Barrier Layer, SnPb Plated Solder
Ag Termination, Ni Barrier Layer, Gold Flash
Ag Termination, Ni Barrier Layer, Sn Plated Solder
Ag Termination, Enhanced Ni Barrier, Sn Plated Solder
RoHS
RoHS
RoHS
RoHS
RoHS
5
1
8
6
9
3
4
7
A
G
B
D
F
50V
100V
150V
200V
250V
300V
500V
1000V
1500V
2000V
2500V
3600V
5000V
7200V
SPECIAL
Leading
Code Lead Type
N
A
B
C
Axial Ribbon
Radial Ribbon
Center Ribbon
P** AgPd Termination
Q
Y
Polymer Termination, Ni Barrier Layer, Sn Plated Solder
Polymer Termination, Ni Barrier Layer, SnPb Plated Solder
Specialty
Customer
Defined
Axial Wire
Radial Wire
NONE
M** Polymer Termination, Cu Barrier Layer, Sn Plated Solder
W** Ag Termination, Cu Barrier Layer, Sn Plated Solder
H** Ag Termination, Enhanced Cu Barrier, Sn Plated Solder
V** Ag Termination, Cu Barrier Layer, SnPb Plated Solder
R** Ag Termination, Cu Barrier Layer, Heavy SnPb Plated Solder
RoHS
RoHS
RoHS
D
E
F
N
NOTE: All fields are required. Any specials, please consult factory.
** Nonmagnetic
NOTE: Consult Sales
Representative for
RoHS compliant leaded
devices
H
S
Test Level
Code Testing
X
Laser Mark
Code Laser Marking
0
Packaging
Code Packaging
T
X
Y
A
C
D
Commercial or Industrial
Reduced Visual
MIL-PRF-55681 Group A
MIL-PRF-55681 Group C
Customer Specified
0
No marking
T
V
W
B
P
Tape & Reel – Horizontal
Tape & Reel – Vertical
Waffle Pack
Bulk
Plastic Box
1* Single-side marked
2* Double-side marked
3* Large single-side marked
4* Large double-side marked
5* Vertical edge marked
R
S
Tube (Rail)
Customer Specified
9
Customer Specified
*Reduces DWV Rating.
28 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - AH Series: P90 Porcelain Capacitors
Capacitance and Voltage Table
Case Size
Cap Cap
Code (PF)
C11
0505
C17
1111
C18
C22
2225
C40
3838
1111
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
122
152
182
222
272
332
392
472
512
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
Description
• High Q Porcelain Capacitors • SMD Compatibility
• Positive TC “P90” • Low ESR, High Q
• Capacitance range 0.1 - 5100 pF
• Operating Range -55° to +125°C • High Voltage
• High Self-resonance • Low Noise • Established Reliability
Functional Applications
8.2
9.1
10
• Impedance Matching • Power Handling • DC Blocking
• Bypass • Coupling • Tuning and Feedback
• Amplifier Matching Networks • VCO Frequency Stabilization
• Filtering, Diplexers and Antenna Matching
• High RF Power Circuits • Oscillators • Timing Circuits
• Filters • RF Power Amplifiers and Delay Lines
11
12
13
15
16
18
20
22
24
27
30
Dielectric characteristics
33
36
39
Dielectric Material (Code)
P90 (AH)
+90 ± 20
0.05
43
47
51
Temperature Coefficient (ppm/°C )
Dissipation Factor (% @ 1MHz Maximum)
56
62
68
75
82
Voltage Rating (Volts) Refer to table
91
Dielectric
Withstanding Voltage
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1200
1500
1800
2200
2700
3300
3900
4700
5100
DWV (Volts)
@ +25°C
250% of rated
106 MΩ min
105 MΩ min
None
Insulation
Resistance
(MΩ Minimum)
@ +125°C
Ageing
Piezoelectric Effects
Dielectric Absorption
None
None
Note: Refer to table on page 28 for ordering information.
Reel QTY
Horizontal
3500
2350
2350
500
250
Special capacitance values available upon request.
www.dilabs.com | Phone: +1.315.655.8710 | 29
MLC - AH Series: P90 Porcelain Capacitors
This information represents typical device performance.
30 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - AH Series: P90 Porcelain Capacitors
This information represents typical device performance.
Part Number See Page 28 for complete part number system.
C 17 AH 620 J- 7 U A- X 0 T
MLC
Capacitor
Case Size
Material
System
Capacitance Code
Tolerance
Level
Voltage Termination Leading Code Test Level Marking Packaging
Code
Code
Code
Terminations
Lead Types*
Test Level - All Case Sizes
Laser Marking
Packaging
T, U, S, Z, E, P, Q, Y, M, W, H, V, R
T, U, S, Z, E, P, Q, Y, M, W, H, V, R
U, Z, E, Y, W, H
A, B, D
T, V, W, B, P, S
C11
C17
C18
C22
C40
C11
C17
C18
C22
C40
0, 1, 2, 5
0, 1, 2, 3, 4, 5
0, 1, 2, 5
0, 1
C11
C17
C18
C22
C40
X
Y
A
C
D
Standard
C11
C17
C18
C22
C40
A, B, C, D, E, F
A, B, C, D, E, F
A, B, C, D, E, F
A, B, C, D, E, F
T, V, W, B, P, S
T, V, W, B, P, S
T, B, P, S
Reduced Visual
MIL-PRF-55681 Group A
MIL-PRF-55681 Group C
Customer Specified
U, S, Z, E, P, Q, Y, M, W, H, V, R
T, U, S, Z, E, P, Q, Y, M, W, H, V, R
T, B, P, S, R
0, 1
*Special leading requirements available.
www.dilabs.com | Phone: +1.315.655.8710 | 31
MLC - CF Series - Ultrastable Porcelain Capacitors
Capacitance and Voltage Table
Case Size
Cap Cap
Code (PF)
C06
0603
C11
0505
C17
C18
C22
2225
C40
3838
1111
1111
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
122
152
182
222
272
332
392
472
512
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
Description
• High Q Porcelain Capacitors • SMD Compatibility
• Ultra Temperature Stable • Low ESR, High Q
• Capacitance range 0.1 - 5100 pF
• Operating Range -55° to +125°C • High Voltage
• High Self-resonance • Low Noise • Established Reliability
Functional Applications
8.2
9.1
10
• Impedance Matching • Power Handling • DC Blocking
• Bypass • Coupling • Tuning and Feedback
• Amplifier Matching Networks • VCO Frequency Stabilization
• Filtering, Diplexers and Antenna Matching
• High RF Power Circuits • Oscillators • Timing Circuits
• Filters • RF Power Amplifiers and Delay Lines
11
12
13
15
16
18
20
22
24
27
30
Dielectric characteristics
33
36
39
Dielectric Material (Code)
C0G/NP0 (CF)
0 ± 15
43
47
Temperature Coefficient (ppm/°C )
Dissipation Factor (% @ 1MHz Maximum)
51
56
62
0.05
68
75
Voltage Rating (Volts)
Dielectric
Withstanding Voltage
Refer to table
250% of rated
106 MΩ min
105 MΩ min
None
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1200
1500
1800
2200
2700
3300
3900
4700
5100
DWV (Volts)
Insulation
Resistance
(MΩ Minimum)
@ +25°C
@ +125°C
Ageing
Piezoelectric Effects
Dielectric Absorption
None
None
Note: Refer to table on page 28 for ordering information.
Reel QTY
4000
3500
2350
2350
500
250
Special capacitance values available upon request.
32 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - CF Series - Ultrastable Porcelain Capacitors
The information above represents typical device performance.
www.dilabs.com | Phone: +1.315.655.8710 | 33
MLC - CF Series: Ultrastable Porcelain Capacitors
This information represents typical device performance.
Part Number See Page 28 for complete part number system.
C 17 CF 620 J- 7 U N- X 0 T
MLC
Capacitor
Case Size
Material
System
Capacitance Code
Tolerance
Level
Voltage Termination Leading Code Test Level Marking Packaging
Code
Code
Code
Terminations
Lead Types
Test Level - All Case Sizes
Laser Marking
Packaging
U, S, Z, E, P, Q, Y, W, H, V, R
A, B, D
T, W, B, S
C06
C11/17
C18
C11
C17
C18
C22
C40
0, 1, 2, 5
0
C06
C11/17
C18
X
Y
A
C
D
Standard
C06
C11
T, U, S, Z, E, P, Q, Y, W, H, V, R
U, Q, Y, V, W, H, Z
A, B, C, D, E, F
A, B, C, D, E, F
A, B, C, D, E, F
A, B, C, D, E, F
T, V, W, B, P, S
T, V, W, B, P, S
T, B, P, S
Reduced Visual
0, 1, 2, 5
0, 1
MIL-PRF-55681 Group A
MIL-PRF-55681 Group C
Customer Specified
C17
U, S, Z, E, P, Q, Y, W, H, V, R
T, U, S, P, Q, Y, W, H, V, R
C22
C22
C18
C40
T, B, P, S, R
0, 1
C40
C22/40
*Special leading requirements available.
34 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - NA Series: N30 Porcelain Capacitors
Capacitance and Voltage Table
Case Size
Cap Cap
Code (PF)
C11
0505
C17
1111
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
122
152
182
222
272
332
392
472
512
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
Description
• Porcelain Capacitors • SMD Compatibility
• N30 ±15 ppm/°C • Low ESR, High Q
• Capacitance Range 0.1 - 1000 pF
• Operating Range -55° to +125°C • High Voltage
• High Self-resonance • Low Noise • Established Reliability
Functional Applications
• Impedance Matching • DC Blocking • Bypass • Coupling
• Tuning & Feedback • Amplifier Matching Networks
• VCO Frequency Stabilization
• Filtering, Diplexers & Antenna Matching
• High RF Power Circuits • Oscillators • Timing Circuits
• Filters • RF Power Amplifiers & Delay Lines
• Power Handling
8.2
9.1
10
11
12
13
15
16
18
20
22
24
Dielectric Characteristics
27
30
Dielectric Material Code
NA
33
36
Temperature Coefficient (ppm/°C)
Dissipation Factor (% @ 1MHz Maximum)
-30 ±15
0.05
39
43
47
51
56
Voltage Rating (Volts)
Dielectric
Withstanding Voltage
See Page 28
62
68
250% of WVDC
for 5 sec unless
specified in table
106
105
75
DWV (Volts)
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1200
1500
1800
2200
2700
3300
3900
4700
5100
Insulation
Resistance
(MΩ Minimum)
@ +25°C
@ +125°C
Aging
None
None
None
Piezoelectric Effects
Dielectric Absorption
Part Number See Page 52 for complete part number system.
Laser Marking
Terminations
0
C04
C04
S
0, 1, 2
0, 1,
0, 1, 2
C06
C06/07/08/11/17 U, S, Z
C07
Lead Types
C08/11/17
C04/06/07/08
N
A, B, D
C11
C17
Test Level - All Case Sizes
A, B, C, D, E, F
X
Y
A
C
D
Standard
Reduced Visual
Packaging
C04/06
MIL-PRF-55681 Group A
MIL-PRF-55681 Group C
Customer Specified
T, W, B, P, S
W, B, P, S
Reel QTY
Horizontal
C07
3500
2350
T, V, W, B, P, S
C08/11/17
Special capacitance values available upon request.
www.dilabs.com | Phone: +1.315.655.8710 | 35
MLC - UL Series: Ultra Low ESR Ceramic Capacitors
Capacitance and Voltage Table
Case Size
Cap Cap
Code (PF)
C04
0402
C06
0603
C07
C08
C11
0505
C17
1111
0711
0805
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
151
181
221
271
331
391
471
511
561
621
681
821
911
102
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
Description
• Ceramic Capacitors • SMD Compatibility • Stable TC NP0
• Low ESR, High Q • Capacitance range 0.2 - 2200 pF
• Operating Range -55° to +125°C • High Voltage
• Low Noise • EIA 0603 & 0805 Case Size
Functional Applications
• DC Blocking • Bypass • Coupling • Tuning & Feedback
• Amplifier Matching Networks • VCO Frequency Stabilization
• Filtering, Diplexers & Antenna Matching
• High RF Power Circuits • Oscillators • Timing Circuits
• Filters • Broadcast Power Amps
11
12
13
• RF Power Amplifiers & Delay Lines
15
16
18
20
22
24
Dielectric Characteristics
27
30
Dielectric Material Code
UL
33
36
Temperature Coefficient (ppm/°C )
Dissipation Factor (% @ 1MHz Maximum)
0 ± 30
39
43
47
0.05
51
56
Voltage Rating (Volts)
DWV (Volts)
Refer to table
250% of rated
**
Dielectric
Withstanding Voltage
62
68
75
82
Insulation
Resistance
(MΩ Minimum)
@ +25°C
91
100
110
120
150
180
220
270
330
390
470
510
560
620
680
820
910
1000
@ +125°C
**
Aging
None
None
None
Piezoelectric Effects
Dielectric Absorption
** Refer to table and statement provided on Page 28.
Reel QTY
Horizontal
5000
4000
2350
5000
3500
2350
Special capacitance values available upon request.
36 | Phone: +1.315.655.8710 | www.dilabs.com
MLC - UL Series: Ultra Low ESR Ceramic Capacitors
The information above represents typical device performance.
www.dilabs.com | Phone: +1.315.655.8710 | 37
MLC - UL Series: Ultra Low ESR Ceramic Capacitors
The information above represents typical device performance.
Part Number See Page 28 for complete part number system.
C 17 UL 620 J- 7 U N- X 0 T
MLC
Capacitor
Case Size
Material
System
Capacitance Code
Tolerance
Level
Voltage Termination Leading Code Test Level Marking Packaging
Code
Code
Code
Terminations
Lead Types
Test Level - All Case Sizes Laser Marking
Packaging
N
T, W, B, P, S
W, B, P, S
S
C04/6/7/8
C11
0
C04/6
C07
C04
X
Y
A
C
D
Standard
C04
C06
C07
A, B, D
U, S, Z,
0, 1, 2
0, 1
C06
C07
Reduced Visual
MIL-PRF-55681 Group A
A, B, C, D, E, F
S, Z,
C17
T, V, W, B, P, S
C08/11/17
*Special leading
requirements available.
U, S, Z,
C08/11/17
0, 1, 2
MIL-PRF-55681 Group C C08/11/17
Customer Specified
38 | Phone: +1.315.655.8710 | www.dilabs.com
High Q Capacitors - C04, C06, C11 and C17 Kits
C04 Engineering Kit
10 Pieces Each of 15 Values
C06 Engineering Kit
10 Pieces Each of 21 Values
C11 Engineering Kit
10 Pieces Each of 28 Values
C17 Engineering Kit
10 Pieces Each of 35 Values
Code
0R3
0R5
1R0
1R2
1R5
1R8
2R0
2R2
2R7
3R3
3R9
4R7
5R6
6R8
100
Cap
Code
0R3
0R5
1R0
1R2
1R5
1R8
2R0
2R2
2R7
3R3
3R9
4R7
5R6
6R8
100
150
180
220
270
330
470
Cap
Code
0R3
0R5
0R7
1R0
1R2
1R5
1R8
2R0
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
270
330
390
470
560
680
820
101
Cap
Code
0R3
0R5
0R7
1R0
1R2
1R5
1R8
2R0
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
151
221
331
471
681
102
Cap
0.3pF
0.5pF
1.0pF
1.2pF
1.5pF
1.8pF
2.0pF
2.2pF
2.7pF
3.3pF
3.9pF
4.7pF
5.6pF
6.8pF
10pF
0.3pF
0.5pF
1.0pF
1.2pF
1.5pF
1.8pF
2.0pF
2.2pF
2.7pF
3.3pF
3.9pF
4.7pF
5.6pF
6.8pF
10pF
15pF
18pF
22pF
27pF
33pF
47pF
0.3pF
0.5pF
0.7pF
1.0pF
1.2pF
1.5pF
1.8pF
2.0pF
2.2pF
2.7pF
3.3pF
3.9pF
4.7pF
5.6pF
6.8pF
8.2pF
10pF
12pF
15pF
18pF
27pF
33pF
39pF
47pF
56pF
68pF
82pF
100pF
0.3pF
0.5pF
0.7pF
1.0pF
1.2pF
1.5pF
1.8pF
2.0pF
2.2pF
2.7pF
3.3pF
3.9pF
4.7pF
5.6pF
6.8pF
8.2pF
10pF
12pF
15pF
18pF
22pF
27pF
33pF
39pF
47pF
C04 Broadband
Block
120pF
C04 Designer Kit
10 Pieces Each of 8 Values
Kit C
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
Kit D
0R9
1R0
1R2
1R5
1R8
2R2
2R7
3R3
Kit E
3R9
4R7
5R1
5R6
6R8
8R2
9R1
100
C06 Broadband
Block
850pF
C06 Designer Kit
10 Pieces Each of 10 Values
56pF
68pF
82pF
100pF
150pF
220pF
330pF
470pF
680pF
1000pF
Kit C
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
Kit D
1R2
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R1
5R6
Kit E
6R8
8R2
9R1
100
120
150
220
270
330
470
C08 Broadband
Block
2400pF
C11 Designer Kit
10 Pieces Each of 10 Values
Kit C Kit D Kit E Kit F
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R0 5R6 270
1R2 6R8 330
1R5 8R2 390
1R8 100 470
2R2 120 510
2R7 150 560
3R3 180 620
3R9 220 680
4R7 270 820
5R1 330 101
C08 Broadband
Block
2400pF
C17 Designer Kit
10 Pieces Each of 10 Values
Kit C Kit D Kit E Kit F
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R0 5R6 390
1R2 6R8 470
1R5 8R2 560
1R8 100 680
2R2 120 820
2R7 150 101
3R3 180 221
3R9 220 471
4R7 270 681
5R1 330 102
DLI reserves the right to substitute values as required. Customers
may request particular cap value and material for sample kit to
prove out designs. Custom kits available upon request.
www.dilabs.com | Phone: +1.315.655.8710 | 39
Broadband Blocks - C04/C06/C08
Description
• Resonance free DC Blocking / Decoupling
• Less than 0.25 db loss @ 4 GHz (typical)
• Surface mountable
Functional Applications
• Fiber Optic Links • High Isolation Decoupling
• LAN’s, VCO Frequency Stabilization • Diplexers
• RF/Microwave Modules • Instruments • Test Equipments
Mechanical Specification
Band Dimensions
Body Dimensions
(B)
Product
Code
Length
(L)
Width
(W)
Thickness
(T)
Min
Max
0.019"
0.03"
0.040"
0.020"
C04BL
C06 BL
C08 BL
C18BL
0.028" Max
0.036" Max
0.061" Max
0.100” Max
0.003"
0.006"
0.012"
0.008”
L
± 0.008" ± 0.006"
0.060" 0.031"
± 0.012" ± 0.009"
0.081" 0.051"
W
T
0.0468"
0.045”
± 0.020" ± 0.013"
0.1200” 0.1100”
± 0.925” ± 0.010”
B
Part Characteristics
Capacitance
Guaranteed Voltage Coefficient
Minimum
Value
Temperature
Insulation
Resistance
(MΩ
Maximum
Dissipation
Factor
Aging
Rate
Frequency
Range
Part Number
Termination
Rating
-55°C to
125°C
Minimum)
120pF @
1KHz,.2Vrms
10MHz –
40GHz
C04BL121X-5UN-X0T
C06BL851X-1UN-X0T
C08BL242X-5UN-X0T
50 Vdc
“U” & “S”
850pF @
1KHz,.2Vrms
100 Vdc
50 Vdc
2MHz – 30GHz “U”, “S” & “Z”
1MHz – 20GHz “U”, “S” & “Z”
3.0%@
1KHz,
.2Vrms
<=1.5%/
decade
hours
2400pF @
1KHz,.2Vrms
± 15%
104
50 Vdc
100 Vdc
500 Vdc
1000pF @
1KHz,.2Vrms
C08BL102X-1UN-X0T
C18BL103X-4GN-XOT
Performance
1MHz – 20GHz “U”, “S” & “Z”
1MHz – 6GHz “U”, “S” & “Z”
10,000pF @
1KHz,.2Vrms
C06BL851X-1UN-X0T Insertion Loss (S21)
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
-1.4
-1.6
-1.8
-2
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
The information above represents typical device performance.
40 | Phone: +1.315.655.8710 | www.dilabs.com
Broadband Blocks - Opti-Cap®
Description
• Resonance Free DC Blocking to >40GHz
• Surface Mountable by Solder or Epoxy Bonding
• Available in Tape & Reel or Waffle Pack Format
• Low Frequency Stability over Temperature
• Very Low Series Inductance
• 0201, 0402 or 0603 footprints
Functional Applications
• Improved Low Frequency Stability over Temperature
• Very Low Series Inductance
• X7R Temperature and Voltage Stability
Case Sizes
®
Milli-Cap
MLC
Case Size
Length (L)
Width (W)
Thickness (T)
Length (L)
Width (W)
Thickness (T)
P21 (0201)
P42 (0402)
P62 (0603)
0.022” ± 0.006”
0.012” ± 0.002”
0.012” ± 0.002”
0.022” ± 0.002”
0.011” ± 0.001”
0.020” ± 0.002”
0.031” ± 0.004”
0.011” ± 0.003”
0.038” ± 0.004”
0.058” ± 0.003”
0.020” ± 0.002”
0.020” ± 0.002”
0.020” ± 0.002”
0.020” ± 0.002”
0.040” ± 0.002”
0.067” ± 0.004”
0.020” ± 0.002”
0.031” ± 0.005”
T
W
L
Part Numbers
Capacitance
Aging Rate
%/Decade Hr
Freq. Range
3dB (TYP)
Voltage
Rating
IR
@ +20°C
DF
@ 1KHz
Part Number
TCC
®
MLC
Milli-Cap
P21BN300MA03976
P21BN300MA04282
P21BN300MA04572
P21BN300MA04678
P21BN300MA04733
P42BN820MA03152
P42BN820MA04679
P62BN820MA02636
10nF
22nF
30pF
10V
X5R
X5R
X5R
X5R
X5R
X5R
X7R
X7R
>102 MΩ
>102 MΩ
>102 MΩ
>102 MΩ
>102 MΩ
>102 MΩ
>102 MΩ
>102 MΩ
3.5%
3.5%
3.5%
3.5%
3.5%
3.5%
3.5%
3.5%
1.0%
30pF
30pF
30pF
30pF
82pF
82pF
82pF
10V
1.0%
22nF
10V
1.0%
1.5nF
100nF
220nF
22nF
10V
1.0%
16KHz-
>40GHz
10V
1.0%
10V
1.0%
50V
10V
1.0%
100nf
1.0%
Notes:
•
•
•
•
•
•
X5R: -55°C to +85°C ∆C ±15%
X7R: -55°C to +125°C ∆C ±15%
Termination Metallization 7.5µ” Au over 50µ” Ni
Recommended attachment is solder or conductive epoxy
Maximum assembly process temperature 250°C
For best high frequency performance attach Milli-Cap® side
to transmission line
•
Recommended microstrip gap length is 0.015”
www.dilabs.com | Phone: +1.315.655.8710 | 41
Broadband Blocks - Opti-Cap®
Attachment Methods
EPOXY
SOLDER
DIAMETER
.010”–.015”
THICKNESS
.003”–.005”
DIAMETER
.020”–.025”
THICKNESS
.004”–.006”
DISTANCE
FROM
TRACE EDGE
.003”–.004”
DISTANCE
FROM
TRACE EDGE
.001”–.002”
IDEAL
MICRO STRIP
WIDTH .020”–.025”
IDEAL
MICRO STRIP
WIDTH .020”–.025”
GAP
.015”–.020”
GAP
.015”–.020”
Recommended Attachment to Soft or Hard Substrate
Recommended Attachment to Soft or Hard Substrate
Using Conductive Epoxy:
Using Solder:
1. Place a single drop of conductive epoxy onto each micro
strip
1. Place a single drop of solder paste onto each micro strip
as illustrated; the edge of the solder shall be at least
.001”- .002” back from the edge of the trace to prevent
filling the gap with solder.
as illustrated; the edge of the epoxy shall be at least
.003”- .004” back from the edge of the trace to prevent
filling the gap with epoxy.
2. Centering the termination gap of the capacitor within the
gap in the micro strip, press with careful, even pressure
onto the micro strip ensuring the terminations make good
contact with the drops of solder paste.
2. Centering the termination gap of the capacitor within the
gap in the micro strip, press with careful, even pressure
onto the micro strip ensuring the terminations make good
contact with the epoxy drops.
3. Reflow according to the solder manufacturer’s preferred
profile, ensuring the reflow temperature does not exceed
250°C.
3. Cure according to the epoxy manufacturer’s preferred
schedule,
typically 125°C to 150°C max.
4. After the reflow step is completed, inspect joint for voids
or excess flux and non-reflowed solder balls that can
degrade performance or cause shorts across the gaps.
Proper cleaning after the reflow process is crucial to
avoiding performance degradation and discovering poor
solder joints.
4. After curing, inspect joint for epoxy shorts across the
termination and micro strip gaps that would cause a short
across the cap.
Isopropanol, and Methanol are both safe to use to pre clean
Opti-Caps®.
Isopropanol, and Methanol are both safe to use with
soldered Opti-Caps®.
Isopropanol, and Methanol are not to be used after
mounting with conductive epoxy as they act as a
solvent!
42 | Phone: +1.315.655.8710 | www.dilabs.com
Broadband Blocks - Opti-Cap®
www.dilabs.com | Phone: +1.315.655.8710 | 43
Broadband Blocks - Milli-Cap® SMD Millimeter Wave Capacitor
Description
• 0402, 0502 & 0602 Footprints • Low Loss High Q part
• Very Low Series Inductance • Ultra High Series Resonance
• Matches typical 50Ω Line Widths • Preserves Board Space
• Behaves Like An Ideal Capacitor • More Usable Bandwidth
.020” ± .002”
(.508 ± .05 mm)
.020” ± .002”
(.508 ± .05 mm)
Functional Applications
• Ideal for Test Equipment, Photonics, SONET, Digital
radios, and Matching Filter applications
Mechanical Specification
• Terminations: Gold
• Assembly temperatures not to exceed 260°C.
Electrical Characteristics
Temperature
Coefficient
-55°C to 125°C
Maximum
Insulation
Resistance
Voltage
Rating
Part Number Cap.
Dissipation
Aging Rate
Frequency Range
Factor @25°C (MΩ Minimum)
105 MΩ @ 25°C
P_2BN820Z5ST 82 pF
± 10%
3.0% @1MHz
<=1.5%/decade hrs
20MHz– 40GHz
at rated voltage
P_2NR3R0K5ST 3.0 pF
P_2CG1R5C5ST 1.5 pF
P_2CG1R0C5ST 1.0 pF
P_2CD0R7B5ST 0.7 pF
P_2CF0R5B5ST 0.5 pF
P_2CF0R3B5ST 0.3 pF
N1500 ±500PPM / °C 0.25% @1MHz
4–20GHz
8–32GHz
0 ± 30PPM
N20 ±15PPM / °C
0 ±15PPM / °C
0.7% @1KHz
0.15% @1MHz
0.6% @1KHz
50 Vdc
106 MΩ @ 25°C
at rated voltage
18–40GHz
20–46GHz
28–40GHz
35–50GHz
N / A*
Dimensions Key: P42 = 0402; P02 = 0502; P62 = 0602
Electrical Performance The information below represents typical device performance.
44 | Phone: +1.315.655.8710 | www.dilabs.com
Broadband Blocks - Miniature RF Blocking Network
Description
For RF Noise Suppression in high speed mixed signal
semiconductor devices
• Eliminates Noise at I/O Pins
• Replaces Large Decoupling Capacitor
• with Superior Performance
• Clean DC Lines Beyond 18 GHz
Functional Applications
• High Speed Digital • Mixed Signal IC’s
• Suppression of Noise on DC Supply Lines
• MCM and Hybrid Modules
• X7R Temperature and Voltage Stability
Layout and Dimensions
Segment Equivalent
Schematic Representation
Part Number Identification
J
30
XX
BA01
2
L
X
4
Product
J = Blocking
Network
Width
(Mils)
Internal
Drawing
Reference
Number
of RC
Segments
Material
BL or BJ
Voltage
2 = 25 Vdc
Metallization
100µ” Gold
Finish
Test Level
Commercial
Material and Electrical Characteristics
Capacitance
(typical)
Resistance
(pad to pad)
Material Code
DF
TCC
Rated Voltage
BL
BJ
30 pF
45 pF
10Ω Nom.
10Ω Nom.
3.0% Max.
3.0% Max.
X7R
X7R
25 Vdc
25 Vdc
www.dilabs.com | Phone: +1.315.655.8710 | 45
Thin Film - Miniature RF Blocking Network
Metallization:
Top: 50•/Square TaN, 300Å TiW, 100 • Inch minimum Au.
Bottom: 300Å TiW, 100 • Inch minimum Au.
Screening Options
Test Code
Test/Inspection
Sample Size
Description
Bond Strength
IR
2 Pcs/Plate
1% AQL
100%
2 bonding pads on each sample
21/2 times rated voltage of 25 volts
X
Visual Inspection
Pad to pad resistance check
4 Side visual screening
1% AQL
Ensure isolation between segments and boarder
Performance
Segment Bonding for Measurement
For additional data of multi-segment devices please contact
an inside sales representative.
Typical Application
46 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - RF Guru Ceramic Filter Request Form
This is an example of the form you’ll find on the DLI website
(http://dliextra.net/DLIFilterGuru/RFGuru.aspx)
It was developed as a template to make it easy for our
customers to enter the information DLI needs for an initial
assessment of filter performance, size and cost.
Fill out the “RF Guru” filter request form and your
requirement will be automatically sent to DLI engineering.
After submitting this form DLI Applications Engineering
will contact you. From these discussions DLI will provide
you with further information about possible topologies and
predicted filter performance. Then you can decide if a filter
on a high-k dielectric is the right option for you.
Please note: This is not an order form. There is no
obligation until you are confident in our capabilities and
actually decide to place an order.
If you’re looking for a catalog off the shelf solution you
might find our EAR99 classified catalog filters on the
following pages helpful.
www.dilabs.com | Phone: +1.315.655.8710 | 47
Thin Film - Ceramic Filters
Typical Filter Types:
Typical Weight: <0.3 grams
Typical Area: <0.1 in2
• Bandpass Filters from 500MHz - 67GHz
• Lowpass Filters from 500MHzz - 67GHz
• Highpass Filters from 500MHz - 67GHz
• Notch Filters from 500MHz - 67GHz
• Duplexers and Diplexers from 1GHz - 30GHz
• Cavity Filters from 6GHz - 25GHz
Typical Volume: <0.01in3
Typical Characteristics:
• RF power handling up to 20 watts
(function of topology, BW and other variables)
• Steep selectivity (number of poles) “n” - 2 to 20 poles
• Fractional bandwidths up to 80%
• Low insertion loss
• Flat amplitude ripple and group delay
• Solder-surface mount designs
• Chip and wire designs
Interdigital
Dual Mode
Combline
Hairpin
Typical Filter Topologies:
• Interdigital
• End Coupled
• Edge Coupled
• Hair Pin
• Edge - End Coupled
• Combline and Pseudocombline
• Dual Mode
• Quasi-lumped
Advantages of DLI High K Ceramics
and Thin Film Processing:
• Size reduction over Alumina and PWB materials
• Extremely temperature stable from -60°C to +125°C
• Thin Film Precision - Tight geometry tolerance
• High repeatability and no tuning required
• Improved field confinement
• Lower CTE mismatch in SMT appicaltions:
Smaller size and low CTE ----> Less stress, and
higher reliability
Note: 67GHz is an artificially imposed limit currently set by the test
equipment at DLI.
Mounting Information
PCB ground pattern length and width can be 0.002-0.003
inches larger than filter footprint. Dimensions of filter launch
and PCB launch pattern should be closely matched. It is
suggested that PCB ground metal be pulled back from RF
I/O trace to account for component alignment tolerance.
Ground via depth and spacing should be set so as not to
create any resonances at the frequency of operation.
Reference SMT Filter Mounting application note for
additional mounting information.
Individual footprint diagrams of all Filters are available upon
request from the DLI Sales Office.
48 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Ceramic Filters
DLI has expanded its filter capability beyond microstrip
bandpass designs. Notch filters, lowpass and highpass
filters, ceramic cavity filters, and various other filter types
are now available. All filters employ DLI’s high-K ceramics
which allow for great size reduction and unbelievable
temperature stability compared to alumina and PWB
materials. Solder surface mount and chip and wire filters are
all possible.
4GHz Notch Filter
>20dB attenuation at 4GHz
>Low loss in passband regions: 1.5dB
>Small size: .25 x .196 x .02 inches
>Solder surface mount device
>Picture below
Typical Lowpass Filter
>Low loss in passband: 1.0dB
>40dB attenuation in stopband
>Typical size: .4 x .25 x .015 inches
>Chip and wire filter [mounted
on PCB with epoxy]
>Devices scalable from L to Ka band
NOTE: See our website for more details.
Typical Cavity Filter
>Ceramic cavity filter design on CF
ceramic
>Low loss in passband: 3.5dB typical
>Typical size: .75 x .18 x .03 inches
>Devices scalable from X to Ku band
>Bandwidth 1 to 3%
www.dilabs.com | Phone: +1.315.655.8710 | 49
Thin Film - Ceramic Filter Packaging and Shielding
Exceptional performance demands rigorous engineering,
both of the component and of its interaction with the
system. The design of the filter’s shielding is a crucial
element for achieving laboratory-grade performance outside
of the laboratory and assuring smooth integration with the
system. Shielding protects the filter from interference and
creates a precisely controlled micro-environment for optimal
performance. There are three packaging options available
for RF shielding:
Filter with
sheet metal
cover
These covers are attached using epoxy; the cured
assemblies offer a small and sturdy surface mount package
that can integrate multiple filters in one pc. The overall
height of the package is typically 0.1 inch. A second option
for shielding is the attachment of an integral metal cover
to the filter. Sheet metal covers are compatible with both
solder surface mount and chip and wire filter applications.
Typically, this style of cover has tabs that fit into the ground
vias along the perimeter of the part and a high-temperature
solder is used for the assembly. Covers can be recessed
to expose the I/O contact pad for chip and wire filters to
allow wire-bonding. The I/O contact pad is not plated with a
solderable metal scheme to facilitate reliable wire bonding.
The overall assembly height can vary from 0.07 to 0.1
inches.
Filter with
printed wire
board cover
Printed wire board (PWB) covers are one solution offered
by DLI. This style of cover offers excellent RF shielding
for solder surface mount applications. Additionally, PWB
covered components are extremely resistant to high shock
and vibration environments.
The third option leaves packaging up to the customer.
Either the next level of assembly provides the RF
shielding for the filter or the customer can have their own
cover integrated. DLI’s engineering team can provide
recommendations for housing dimensions, leveraging years
of expertise to ensure successful design integration.
0
-10
-20
-30
If the customer provides their own shielding for the filter, it
is very important that DLI engineering knows the channel
width and cover height that will enclose the device. These
dimensions will be taken into account during design and
test to ensure that the part will work in its next level of
assembly.
No Cover
-40
Cover
-50
-60
-70
-80
-90
Housing
-100
6000
7000
8000
9000
Frequency MHz
10000
11000
12000
dimensions
critically affect
performance
High K substrate provides Higher Field
Confinement – 9 GHz Filter (30 mil CF with and
without cover).
Solder Stop
Prevents solder from wicking through vias onto critical features during SMT processing
50 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Ceramic Filter Mounting
DLI offers metallization schemes compatible for both chip and wire filters, and solder-surface mount filters. The correct
metal scheme will be employed to ensure reliable connectivity depending on the desired mounting method. Custom
metallization schemes are also available. Please consult the factory for more details.
Ribbon or Wirebound
RF (I/)O)
Top Metallization Options
Filter
RF (I/)O)
PC Board
Housing Floor
Bottom Metalization
Options
The above illustration demonstrates the mounting of a typical chip and wire filter. The circuit is relieved to accommodate the
filter. The bottom surface of the part is attached directly to the system ground plane using conductive epoxy. Wire or ribbon
bonds are launched from the circuit to the filter I/O pad. In a typical application a channelized housing would sit over the
filter to provide adequate RF shielding.
Surface mounting techniques typically rely on a solder
PC Board
SMT Filter
bond between the bottom conductor of the component
and the ground conductor of the circuit board. The
I/O connection is realized through edge castellations
on the filter which mate with contact pads when the
component is mounted on the board. Note the use of
multiple ground vias between the component
and the system ground plane to ensure optimal
performance. Solder surface mount designs are
custom matched to the specific board material
on which they will be placed. In a
RF (I/O)
Top Metallization Options
Ground Plane
RF (I/O)
Solder
PC Board
typical application, a channelized
RF (I/O)
housing would be placed
over the filter to provide RF
Board Trace
shielding.
Housing Floor
Ground Via
www.dilabs.com | Phone: +1.315.655.8710 | 51
Thin Film - Ceramic Filter Temperature Stability
The primary ceramics used in DLI filter designs are CF
[K=23] and CG [K=67]. Both of these materials exhibit
extreme temperature stability across a wide range of
frequencies. So regardless of the filter operating frequency,
no guard band needs to be designed into the device to
meet a demanding temperature requirement. CF and CG
also do not out gas, do not exhibit signs of aging, and have
been exposed to a mega-rad of total radiation dosage with
no degradation in performance. The filters will perform the
same from outer space to the desert. The graphs below
demonstrate the extreme stability of DLI custom ceramic
devices.
Thermal Data (-55C to +125C) - 3.5GHz Filter; CG Ceramic
Temperature Data [-20C to +85C] - 12.8GHz Filter; CF Ceramic
0
0
-10
-20
-30
-40
-50
-60
-10
-20
-30
-40
-50
2000
2250
2500
2750
3000
3250
3500
3750
4000
4250
4500
4750
5000
11700
11900
12100
12300
12500
12700
12900
13100
13300
13500
13700
13900
Frequency (MHz)
Frequency (MHz)
Stability Over Temperature -60° to +125° C
(
)
Filter (-60 +125c) Filter on Alumina
5
0
-60.s2p_S11_Mag(dB)
0.s2p_S11_Mag(dB)
20.s2p_S11_Mag(dB)
40.s2p_S11_Mag(dB)
60.s2p_S11_Mag(dB)
80.s2p_S11_Mag(dB)
100.s2p_S11_Mag(dB)
125.s2p_S11_Mag(dB)
-20.s2p_S11_Mag(dB)
-40.s2p_S11_Mag(dB)
-60.s2p_S21_Mag(dB)
0.s2p_S21_Mag(dB)
20.s2p_S21_Mag(dB)
40.s2p_S21_Mag(dB)
60.s2p_S21_Mag(dB)
80.s2p_S21_Mag(dB)
100.s2p_S21_Mag(dB)
125.s2p_S21_Mag(dB)
-20.s2p_S21_Mag(dB)
-40.s2p_S21_Mag(dB)
Alumina
-5
-10
-15
-20
-25
-30
-35
-40
16000
16500
17000
17500
Frequency (MHz)
18000
18500
19000
(freq. vs. temp.)
0
-1
-2
-3
-4
-5
-6
-7
-8
125.s2p_S11_Mag(dB)
100.s2p_S11_Mag(dB)
80.s2p_S11_Mag(dB)
60.s2p_S11_Mag(dB)
40.s2p_S11_Mag(dB)
20.s2p_S11_Mag(dB)
0.s2p_S11_Mag(dB)
-20.s2p_S11_Mag(dB)
-40.s2p_S11_Mag(dB)
-60.s2p_S21_Mag(dB)
125.s2p_S21_Mag(dB)
100.s2p_S21_Mag(dB)
80.s2p_S21_Mag(dB)
60.s2p_S21_Mag(dB)
40.s2p_S21_Mag(dB)
20.s2p_S21_Mag(dB)
0.s2p_S21_Mag(dB)
-20.s2p_S21_Mag(dB)
-40.s2p_S21_Mag(dB)
-60.s2p_S11_Mag(dB)
CF Material
CG Material
-9
-10
-11
-12
-13
-14
-15
-16
-17
-18
-19
-20
2000
2500
3000
3500
4000
4500
5000
5500
Frequency (MHz)
52 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Surface Mount Lowpass Filter Series
Description
DLI introduces its new high frequency surface mountable
catalog lowpass filters. These LPF’s incorporate DLI’s
high dielectric ceramic materials which provide small size
and minimal performance variation over temperature.
The catalog LPF’s are offered in a variety of frequency
bands, which offers a drop in solution for high frequency
attenuation.
Features
• Small Size • SMD device • Fully Shielded Component
• Frequency Stable over Temp. • Excellent Repeatability
• Operating Temp: -55˚C to +125˚C
• Characteristic Impedance: 50Ω
• 100% Tested and Inspected
Part Number
Specification
L065XG9S
6.5 GHz
L095XG9S
9.5 GHz
L117XH4S
11.7 GHz
L128XH4S
12.8 GHz
L157XG3S
15.7 GHz
L204XF4S
20.4 GHz
L254XF3S
25.4 GHz
3 dB Cutoff
Passband
DC - 6 GHz
DC - 9 GHz
DC - 11 GHz
DC - 12 GHz
DC - 15 GHz
DC - 20 GHz
DC - 25 GHz
Max Insertion Loss
in Passband
Min VSWR in Passband
1.3 dB
1.22:1
1.3 dB
1.12:1
1 dB
1.2 dB
1.38:1
2.2 dB
1.3:1
1.8 dB
1.43:1
1.4 dB
1.3:1
1.43:1
7.9 - 22.4
GHz (35 dB)
11.5 - 32 GHz 17.6 - 30 GHz 18.8 - 32 GHz
19.9 - 32.2
GHz (40 dB)
23 - 43 GHz
(30 dB)
29 - 50 GHz
(30 dB)
Min Rejection
(30 dB)
(40 dB)
(40 dB)
Usable temp. Range
Length - Inches (mm)
Width - Inches (mm)
Height - Inches (mm)
-55 to +125ºC
0.220 (5.58) 0.220 (5.58) 0.220 (5.58) 0.220 (5.58) 0.220 (5.58) 0.220 (5.58) 0.220 (5.58)
0.180 (4.57) 0.140 (3.56) 0.140 (3.56) 0.140 (3.56) 0.140 (3.56) 0.140 (3.56) 0.140 (3.56)
0.103 (2.62) 0.103 (2.62) 0.103 (2.62) 0.103 (2.62) 0.103 (2.62) 0.078 (1.98) 0.078 (1.98)
Typical Measured Performance
L065XG9S - 6.5 GHz
L095XG9S - 9.5 GHz
L157XG3S - 15.7 GHz
L254XF3S - 25.4 GHz
L117XH4S - 11.7 GHz
L128XH4S - 12.8 GHz
L204XF4S - 20.4 GHz
www.dilabs.com | Phone: +1.315.655.8710 | 53
Thin Film - 2 to 18 GHz Bandpass Filter Series
Description
Utilizing DLI’s high permittivity, NP0 ceramics allow for small
size, temperature stable performance over frequency and
high reliability in environmentally challenging conditions. This
series of bandpass filters was designed to span the popular
2-18 GHz frequency range. The compact size and surface
mount attachment allow for low cost of manufacturing
without sacrificing performance and repeatability. Designed
for use on PCB 8-12 mils thick with a permittivity of 3.0-3.8.
Features
• Small Size • Fully Shielded Component
• Frequency Stable over Temperature
Applications
• C, X and Ku Band • Satellite communications • Satellite TV
• Weather and Radar • Radar and Military communications
Part number
Specification
B028RF2S
B033ND5S
B056RC4S
B096QC2S
B148QF0S
Center Frequency
Passband
3 GHz
2 to 4 GHz
2.5 dB
3.5 GHz
3.1 to 3.5 GHz
2.0 dB
6 GHz
4 to 8 GHz
3.0 dB
10 GHz
8 to 12 GHz
2.5 dB
15 GHz
12 to 18 GHz
3.1 dB
@ 25ºC
-40 to +85ºC
Insertion
Loss (@Fc)
3.0 dB
3.2 dB
3.5 dB
3.0 dB
3.6 dB
1.63:1
2.00:1
1.5:1
2.0:1
1.63:1
VSWR - 50W System
Rejection
2 to 4 GHz
3.1 to 3.5 GHz
4 to 8 GHz
8 to 12 GHz
12 to 18 GHz
dc to 1.25 GHz (40 dB) dc to 2.6 GHz (30 dB)
4.85 to 6 GHz (40 dB)
dc to 3 GHz (40 dB)
9.5 to 12 GHz (40 dB) 14 to 18 GHz (40 dB) 22.5 to 25 GHz (30 dB)
-55 to +125ºC
dc to 6 GHz (40 dB)
dc to 7.6 GHz (40 dB)
4 to 6 GHz (40 dB)
Usable Temperature Range
Length - Inches (mm)
Width - Inches (mm)
0.450 (11.43)
0.400 (10.16)
0.113 (2.87)
0.393 (9.98)
0.353 (8.97)
0.128 (3.25)
0.450 (11.43)
0.230 (5.84)
0.100 (2.54)
0.400 (10.86)
0.180 (4.57)
0.100 (2.54)
0.550 (13.97)
0.150 (3.81)
0.098 (2.49)
Height - Inches (mm)
Typical Performance
B028RF2S - 2 to 4 GHz
B033ND5S - 3.1 to 3.5 GHz
B056RC4S - 4 to 8 GHz
B096QC2S - 8 to 12 GHz
B148QF0S - 12 to 18 GHz
54 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Wilkinson Power Divider
Description - Part number PDW05758
DLI introduces its new high frequency surface mountable
Wilkinson Power Divider. The power divider utilizes DLI’s
high dielectric ceramic material which provides small size
and minimal performance variation over temperature.
The compact size, broad band performance and ease
of integration make this power divider ideal anywhere
board space is of a premium and quality signal splitting or
combining is required.
Features
• Broad Band 6 to 18 GHz Performance
• 0.7dB Typical Insertion Loss
• 20dB Typical Isolation and Return Loss
• Excellent Phase and Amplitude Balance
• Compact Solder Surface Mount Package
Electrical Specification
Physical Dimensions
0.160
(4.06)
0.020
(0.51)
unit = in (mm)
Frequency Range (GHz)
Nominal Power Splitting (dB)
Nominal Phase Shift (degrees)
Amplitude Balance (dB)
Phase Balance (degrees)
Excess Insertion Loss (dB)
Return Loss (dB)
6 to 18
3.0 (typical)
0.0 (typical)
±0.025 max.
±3.0 (max.)
0.7 (typical)
20 (typical)
20 (typical)
5 (max.)
0.015
(0.38)
Output
Output
0.185
(4.70)
0.145
(3.69)
Y
X
0.021
(0.53)
0.080
(2.03)
Common port
Isolation (dB)
Input Power as a Splitter (W)2
Shaded areas are solderable metal
1) Electrical Specifications at 25ºC; Over Temperature Performance TBD.
2) Load VSWR not to Exceed 1.20 : 1.00; Base
Temperature not to Exceed 85ºC.
Typical Measured Return Loss
Recommended PCB Layout Dimensions
R0.026
(R0.67)
R0.010
(R0.24)
Output
Output
Typical Measured Isolation and Insertion Loss
0.015
(0.38)
Common port
0.019
(0.48)
www.dilabs.com | Phone: +1.315.655.8710 | 55
Thin Film - Symmetric Dual Mode Resonator Filter
6.5 GHz Symmetric Dual Mode Bandpass Filter
Description
• High seectivity, (>-60 dB rejection in 1% bandwidth
distance from center • High Q (low loss) • Low loss
• Temperature stable
0
10
5
-10
• 16 pole design with integrated trap to surpress harmonics
-20
-30
-40
-50
-60
-70
-80
0
-5
-10
-15
-20
-25
-30
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
Frequency (GHz)
Thin Film - 10GHz 4 Pole Band Pass with Bandstop Filter
0
Size: 0.9 x 0.2 x .02 Inches
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
-85
-90
2000
4000
6000
8000
10000
12000
14000
16000
18000
20000
22000
Frequency in MHz
Thin Film - 20 GHz 8 Pole SMT Filter
Size: 420 x 90 x 15 mils
Thin Film - 36 GHz Filter Repeatability
70 Samples from Multiple Substrates and
Material Lots
10 mil CF (K23) Material
• Highly repeatable performance
• Excellent temperature stability
Frequency in MHz
56 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - GPS Filters
DLI introduced a family of GPS components that includes
two bandpass filters, two diplexers, and a notch filter. The
bandpass filters and diplexer pass both L1 and L2 frequency
bands. The notch filter attenuates the L1 frequency band.
The notch filter incorporates an integral metal cover for RF
shielding.
All components are solder surface mount compatible and
would make a nice temperature stable drop-in for any GPS
application.
Two different versions of the diplexer have been designed
and manufactured. The first version has higher insertion
loss but better rejection due to a narrow bandwidth. The
bandwidth was widened on the second version to reduce
the insertion loss at the cost of eroding the rejection skirts.
Data for the second version is presented below.
The data here represents typical performance for all of the
devices.
The bandpass filters and diplexer incorporate DLI’s new
printed wire board cover technology. The PWB cover
provides RF shielding and reduces the possibility of energy
coupling from the filters to other components in the circuit.
Thin Film - 9.7 GHz End Coupled Filter
Features
0
15
• 7-Pole End Coupled Filter
• 4% Bandwidth (400 MHz)
• Insertion Loss <2.7 dB
• Size (1.1” x 0.1” x 0.03”) but…
-10
10
5
-20
• Typical cover height is 6X material thickness –
• between 75 and 100 mils
-30
-40
-50
0
-5
-10
-60
-70
-15
-20
-80
-25
10.7
8.7
9.2
9.7
10.2
Frequency (GHz)
www.dilabs.com | Phone: +1.315.655.8710 | 57
Thin Film - High-K Ceramic Substrates and Plates
High K substrates are used for circuit miniaturization.
DLI offers complete fabrication services!
Case Sizes and Tolerances
For custom sizes please contact the sales office.
Tolerance
Case
Size
(Inches)
Length
(Inches) (Inches)
Width
Plates (H) Substrates (S)
± (Inches)
Substrates Only
.050
± (Inches)
10
15
20
25
30
40
1.000
1.000
2.000
2.500
3.000
4.000
1.000
1.500
2.000
2.500
3.000
4.000
.002
.002
.002
.002
.002
.002
.050
.050
.050
.050
Material Specifications
Thermal
Thermal Expansion
ppm/°K
Relative ξr*
@ 5 GHz
TCC†Loss
ppm/°C
Coefficient of
Tangent* % Max
Conductivity
W/m-°K
Material Code
0.0015 (@ 1MHz)
0.033 (@ 24 GHz)
0.10
QZ
3.82 (@ 1MHz)
Fused Quartz
0.55
1.28
AG
PI
8.85 ± 0.35 (@ 1MHz)
9.9 ± 0.15 (@ 1MHz)
12.5 ± 0.5
20 ± 0.5
Aluminum Nitride
Alumina 99.6%
P22 ± 30
P90 ± 20
N30 ± 15
0 ± 15
N20 ± 15
0 ±30
N1500 ± 500
4.6
6.5 - 7.5
7.6
9.6
10.1
9.0
5.8
9.0
10.0
140-180
27
0.01
0.02
0.02
0.03
0.15
0.04
0.10
0.06
PG
AH
NA
CF
CD
CG
NR
—
1.56
1.56
1.56
1.59
1.59
2.72
23 ± 1
25 ± 2
38 ± 1
67 ± 3
152 ± 5
*Unless otherwise specified K dielectric measurement at approximately 5 GHz. †For the temperature range -55 to 125°C.
Surface Finish
Metallization
Code
Roughness Ra
>50 µ in.
20 µ in.
Material Process
As-Fired
Code Description
X
Y
Z
S
X
M
N
P
No Metallization
300 Angstroms TiW, 100 µ in. min. Au
300 Angstroms TiW, 50 µ in. min. NiV, 100 µ in. min. Au
75 µ in. min. Nickel, 100 µ in. min. Au
Machined
Polished
<5 µ in.
Special - Drawing req’d
Top 50 Ohms/sq. TaN, 300 Angstroms TiW, 100 µ in. min Au.
Bottom Side 300 Angstroms TiW, 100 µ in. min. Au
Metallized and etched per Customer drawing
300 Angstroms min. TiW, 50 µ in. min. NiV, 300 µ in. min. Au-Sn
SPECIAL, Customer Drawing Required!
L
E
T
D
Screening Options
Test Code Test/Inspection
Sample Size Description
X
K
D
Visual Mechanical
Visual Mechanical
Kent Test
100%
100%
10% of lot
Verify that the required area is available and continuous (Broken corners allowable).
Verify that the required area is available and continuous (Broken corners allowable).
K and Loss.
Customer Defined
Customer Drawing Required!
Part Number Identification
S
20
CG
250
D
Z
N
X
Product
S = Substrate
H = Plate
Case Size
Thickness
100 = .010”
155 = .0155”
250 = .025
Thickness
Tolerance
D = ± .0005
E = ± .001
Surface
Finish
Metallization
Test Level
Material
See material
table above.
See table above.
10
15
20
25
30
40
X
K
D
X
Y
Z
S
Thickness Code. A three digit code representing the thickness in mils.
Examples: Code 100 = .010”, Code 155 = .0155”, Code 250 = .025”
Please consult with an applications engineer for thicknesses < .010”
Thickness Tolerance Codes
D = ± .0005 – Machined or Polished
E = ± .001 – Standard
58 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Ceramic Resonators
DLI has a family of patent pending high-Q ceramic
cavity resonators. They provide an ideal solution for high
performance, low-cost microwave, or millimeter wave
oscillators. The devices are fully shielded and designed on
our temperature stable, high dielectric constant ceramics.
DLI resonators are direct in frequency. So in addition to all
of the other benefits no multiplication is required as there
would be in other technologies. As a solid block of ceramic
they are also non microphonic
.......Imagine the possibilities!
Frequencies of resonator designs range from <1.0 to
>67GHz. Designs can be customized for either solder-
surface mount or chip and wire applications. High reliability
thin film gold metallization is employed and frequency
tolerances as low as 0.1% are attainable.
Types of Applications
Systems
6.8GHz oscillator
INSTRUMENTATION
AUTOMOTIVE
DLI has developed an equivalent circuit modeling tool for
cavity resonators. The tool enables optimization of resonator
based oscillator designs and constrains circuit element
values to realizable combinations. Three models are shown
below, at 8GHz, using CF ceramic, one using FS, and one
using CG.
RADAR • Ground-based • Avionics/Missile • Shipboard
COMMUNICATIONS • Base Stations • WLAN, WLL • SONET/SDH
MILITARY • RFID • ECM/ECCM/EW • Tx/Rx • Man Pack Radio
• Aerospace • Intelligent Munitions
Circuits
• Microwave and Millimeter-Wave Oscillators
Please consult DLI Applications Engineering for a copy of
the modeling tool.
• Fundamental Fixed Frequency Oscillators - Ultra-low Phase Noise
(former solution: expensive DRO’s and multiplied-up crystal or
SAW based device with decreased performance)
CF (design1)
• Narrow-Band Tunable VCO or Phase Locked Oscillators
(typically ± 3% tuning) (former solution: varactor tuned expensive
DRO)
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
• Integration of high performance Oscillators directly on the system
motherboard without the expense and complexity of subassemblies,
housing and labor intensive operations typical of former solutions.
• Narrow bandwidth low loss filters
(former solution: low loss SAW devices with frequency limitation
and poor performance)
7.70
7.80
7.90
8.00
8.10
8.20
8.30
Freq(GHz)
CG
Two port resonators can also be realized for varactor-tuned oscillator
and feedback oscillator applications. The devices can also be
implemented as one-pole bandpass filters. These are fully shielded
and designed on temperature stable ceramics like the one port
resonators. Below is required information for a two port resonator
design and measured test data of a two port resonator at 24GHz.
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
-7.0
-8.0
-9.0
Electrical Specification
General Information
7.70
7.80
7.90
8.00
8.10
8.20
8.30
Varactor - Tuned OSC
Resonator
Resonant
Frequency__
Fc =______GHz
Tolerance:___%
Freq(GHz)
CF (design2)
Feedback OSC
Application
Filter
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
-7.0
Max width:______
Size
Doubly
Loaded Q
QL =______
IL =_____dB
Max length:______
Restriction
Max thickness:_____
Maximum
Insertion
Loss At Fc
Solder Surface Mount
Epoxy Attach
Assembly
Type
-8.0
7.70
7.80
7.90
8.00
8.10
8.20
8.30
Freq(GHz)
FS
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
-7.0
-8.0
7.70
7.80
7.90
8.00
8.10
8.20
8.30
Freq(GHz)
www.dilabs.com | Phone: +1.315.655.8710 | 59
Thin Film - Single Frequency Cavity Resonator
The table summarizes the characteristics of selected
standard resonators to illustrate the primary resonator
design variables. The primary variables are frequency of
resonance, cavity material dielectric constant and length-
by-width dimensions. The interaction of these variables
is illustrated in the resonator size charts on Page 62. The
loaded Q of the resonators is effected by the coupling
coefficient (denoted in the tables in terms of return loss),
the material choice (dielectric constant), and by material
thickness. Generally, resonators made from thick, low
dielectric constant materials are capable of the highest
loaded Q’s. For reference, when a resonator has a coupling
coefficient of 1.0, it will exhibit an excellent return loss
at the resonant frequency and the unloaded Q will be 2
times the loaded Q value. The desired level of resonator
coupling varies with individual circuit requirements such as
varactor frequency tuning or transistor negative resistance
value. The unloaded Q’s of the cases shown range up to
2,000, clearly a new standard for a component compatible
with automated assembly. In contrast to other “high Q”
microwave resonators, DLI’s cavity resonator is completely
self contained. Large, expensive housings are not needed.
Its loaded Q and resonant frequency can be directly
measured using RF coplanar probe technology. Thus,
ambiguities of special test fixtures and components which
are not appropriate to the product realization are eliminated
from part evaluation.
Representative Sampling of Resonator Characteristics
Temperature
Coefficient of
Frequency *2
Dimensions
L x W x T
Resonant
Frequency
(GHz) *1
Return Loss @
Resonance
Typical (dB)
Loaded Q
Typical
(50 OHMS)
Material
mm
Inches
(Typical 9PPM/°C)
3.2
5.0
CG
CF
CG
FS
FS
CF
CF
CF
FS
CF
FS
FS
FS
FS
FS
+8.8
-2.3
+8.8
-7.3
-7.3
-2.13
-2.3
-2.3
-7.3
-2.3
-7.3
-7.3
-7.3
-7.3
-7.3
-22
-12
-12
-12
-9
290
550
360
1000
1050
250
300
350
400
480
1000
325
445
400
600
8.1 x 8.1 x 3.0
8.1 x 8.1 x 3.0
5.1 x 5.1 x 3.0
21.8 x 21.8 x 3.8
15.7 x 15.7 x 3.0
5.3 x 5.3 x 0.8
5.6 x 4.3 x 0.8
3.8 x 3.6 x 0.8
6.1 x 5.6 x 1.0
21.8 x 21.8 x 3.8
4.6 x 4.6 x 3.0
4.2 x 4.2 x 0.5
2.7 x 2.7 x 0.5
2.2 x 2.2 x 0.5
1.6 x 1.6 x 1.0
0.32 x 0.32 x 0.12
0.36 x 0.36 x 0.12
0.20 x 0.20 x 0.12
0.86 x 0.86 x 0.15
0.62 x 0.62 x 0.12
0.21 x 0.21 x 0.03
0.22 x 0.17 x 0.03
0.15 x 0.14 x 0.03
0.24 x 0.22 x 0.04
0.86 x 0.86 x 0.15
0.18 x 0.18 x 0.12
0.16 x 0.16 x 0.02
0.10 x 0.10 x 0.02
0.08 x 0.08 x 0.02
0.06 x 0.06 x 0.04
5.0
5.0
6.8
8.2
-25
-11
-7
9.95
12.8
18.65
24.0
24.0
26.5
40
-25
-12
-12
-20
-18
-17
-12
50
67
*1 Frequency Tolerance 0.1~ 1% *2 Over the range -60°C to + 125°C
The equivalent circuit of the Single Frequency Cavity
Resonator (SFCR) near its lowest resonant frequency
is shown below. The lowest resonant mode is typically
employed in oscillator and filter designs. The element values
are shown for a 9.95 GHz SFCR. The resonant frequency is
set by the parallel combination of Cp and Lp, and the finite
unloaded Q by R. The series capacitance Cs connects the
resonator L-C to the input pad, thus setting the coupling
between the external circuit and the frequency controlling
L-C resonator. The capacitance Csh is a stray capacitance
between the input pad and ground. All of these network
elements have excellent repeatability providing tight control
over resonant frequency, coupling and input impedance.
The structure also provides an integrated DC blocking
function, thus eliminating a tolerance sensitive element from
the bill of materials. For wide bandwidth circuit modeling,
S-Parameters are recommended. S-Parameters are available
for downloading from our website (www.dilabs.com). The
resonators are readily customized for frequency, coupling,
Q, tunability and assembly requirements.
The Graph below depicts typical Single Frequency Cavity
Resonator frequency stability versus temperature for DLI
standard dielectric materials.
Equivalent Circuit of a 9.95 GHz SFCR
Input
Csh
0.132pF
Cs
0.0084pF
R
0.13ohm
Cp
Lp
0.194pF
1.264nH
60 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Single Frequency Cavity Resonator
Standard Frequencies for SFCR
DLI has established a series of standard specific frequency resonators (EAR 99) which have the ability to be laser trimmed
down in frequency by approximately 2% of the actual resonant frequency. The resonators incorporate lithography defined
‘snake eyes’ that the laser can recognize as a starting point to trim through the gold. Frequencies above and below this
range of standard frequencies are obtainable. Please contact DLI Applications Engineering for more details.
Estimating Resonator Size
The size of the cavity resonator is determined by the desired
resonant frequency and the ceramic material selected.
At the same resonant frequency, a higher dielectric
constant material will offer reduced size compared to a
lower dielectric constant material. Resonators are typically
designed on
thick ceramics
due to Q
Resonant Tunable Resonant Tunable Resonant Tunable
Frequency Range Frequency Range Frequency Range
(MHz)
3000
3100
3200
3300
3400
3500
3600
3700
3800
3900
4000
4100
4200
4300
4400
4500
4600
4700
4800
4900
5000
5200
5400
5600
5800
6000
6200
6400
6600
6800
7000
7200
7400
7600
7800
8000
8200
8400
8600
8800
9000
9200
9400
9600
9800
10000
10200
10400
10600
10800
11000
11200
11400
(MHz)
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
(MHz)
11600
11800
12000
12200
12400
12600
12800
13000
13200
13400
13600
13800
14000
14200
14400
14600
14800
15000
15300
15600
15900
16200
16500
16800
17100
17400
17700
18000
18300
18600
18900
19200
19500
19800
20000
20400
20800
21200
21600
22000
22400
22800
23200
23600
24000
24400
24800
25000
25500
26000
26500
27000
27500
(MHz)
232
236
240
244
248
252
256
260
264
268
272
276
280
284
288
292
296
300
306
312
318
324
330
336
342
348
354
360
366
372
378
384
390
396
400
408
416
424
432
440
448
456
464
472
480
488
496
500
510
520
530
540
550
(MHz)
28000
28500
29000
29500
30000
30600
31200
31800
32400
33000
33600
34200
34800
35000
35700
36400
37100
37800
38500
39200
39900
40000
40800
41600
42400
43200
44000
44800
45000
45900
46800
47700
48600
49500
50000
51000
52000
53000
54000
55000
56100
57200
58300
59400
60000
61200
62400
63600
64800
66000
67000
(MHz)
560
570
580
590
600
612
624
636
648
660
672
684
696
700
714
728
742
756
770
784
798
800
816
832
848
864
880
896
900
918
936
increasing
with material
thickness.
These graphs
can be used
as a guide for
estimating
resonator sizes
on typical DLI
materials.
90
92
94
96
98
100
104
108
112
116
120
124
128
132
136
140
144
148
152
156
160
164
168
172
176
180
184
188
192
196
200
204
208
212
216
220
224
228
Designs
are slightly
rectangular in
shape. Length
to width aspect
ratios are usually
less than 1.2:1.
For additional
information
954
972
990
consult the
factory.
1000
1020
1040
1060
1080
1100
1122
1144
1166
1188
1200
1224
1248
1272
1296
1320
1340
9.9GHz Resonator - Before & After Laser
0
-1
-2
-3
*1 Frequency Tolerance 0.1~ 1% *2 Over the range -60°C to + 125°C
The graph to the left shows a 9.9GHz resonator tuned
down in frequency by laser trimming slots through the
gold metallization. In this particular example the part was
lasered approximately 96MHz lower than its true resonant
frequency. Tuning resonators up in frequency is possible by
using photolithography to define slots on the top side of the
resonator circuit. Wirebonding across the slots will tune the
device up in frequency.
-4
-5
-6
-7
-8
-9
9750 9765 9780 9795 9810 9825 9840 9855 9870 9885 9900 9915 9930 9945 9960 9975 9990
Frequency (MHz)
www.dilabs.com | Phone: +1.315.655.8710 | 61
Thin Film - Single Frequency Cavity Resonator
Mounting Alternatives
The illustrations demonstrate a surface mounting technique.
The first resonator is positioned with the I/O pad in view
to demonstrate the alignment with the printed wire board
geometry [1]. The second illustration shows the resonator
mounted in position [2]. The third illustration shows the
printed wire board geometry [3a-c]. A solder mask is used
to control the flow of solder during assembly and insulate
the input line from shorting to the resonator ground
metallization. A solderable metal scheme with a nickel
barrier will be employed on the resonators.
A thin outer layer of gold will prevent oxidation of the nickel.
1) Resonator mounting surface shown
facing up (contact pad is visable)
2) SMT resonator shown in normal
mounted orientation
3) Typical circuit board layout forSMT
resonator mounting:
a) Solder mask, insulates input line
from shorting to ground
b) Input line
c) Ground vias in board
Microstrip Mount
This picture illustrates a microstrip
mounting technique. Shown is an
implementation where the active device
and power supply bypass capacitors are
assembled onto the resonator. The wirebond
signal leads are kept as short as possible. In a typical
application conductive epoxy would be used to attach the
resonator to the circuit.
62 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Self Bias Network
Description
• Wireless communication modules
• MIC broadband high gain RF/Microwave module
• Bias line voltage divider and integrated decoupling capacitor
• Simplifies assembly with 1 component
• Improves gain flatness and stability in GaAs FET
• Miniature size: .020 x .034 (.5mm x .86mm)
Physical Characteristics
Equivalent Schematic Representation
User wire bond to Ground to select resistance
To FET
source
R1
R2
WB
R4
R3
Resistor Values:
R1 - 200W
Nominal Capacitance:
50pF
R2 - 100W
R3 - 50W
R4 - 20W
Typical application requires 2 networks
Recommended Mounting: The self Bias Network should
be mounted with fully metalized side down directly on the
RF ground plane for best performance.
Part Number Identification
B
28
BL
SBN01
Product
B = Bias Network
Width
28
Network Type
Material
BL ±25% TC
Physical Characteristics
Typical Application
Custom Networks can be designed per customer specification. Please consult factory for additional information or special requirements.
www.dilabs.com | Phone: +1.315.655.8710 | 63
Thin Film - Bias Filter Network
Description
• Wireless communication modules • Ideal varactor
decoupling element • High gain RF/Microwave modules
• Ideal GaAs FET gate biasing device • MMIC multichip
modules
Functional Applications
• Filters noise and RF from Supplies
• Reduces RF feedback through bias supplies
• Simplifies assembly - one component replaces many
• Designed with large 4 mil wirebond pads for assembly
ease
Equivalent Schematic Representation
Total Series Resistance:
DC Rating: Volts Max: 50V
Total Shunt Capacitance:
I(ma) Max: 10Ma
Recommended Mounting: The Bias Filter Network should
be mounted with fully metallized side down directly on RF
ground plane for maximum isolation performance.
Typical
Application
Physical
Characteristics
Part Number Identification
B
28
BT
BFN01
Product
B = Bias Network
Width
28
Network Type
Material
BT +22, -56%
BJ +/- 15% TC
Isolation vs. Frequency
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5
10
15
20
25
30
35
40
Frequency (GHz)
Frequency (GHz)
Custom Networks can be designed per customer specification. Please consult factory for additional information or special requirements.
64 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Gain Equalizer
Description
• Equalizer compensates for module Gain Slope
• Broadband communications, radar, phased arrays
• SONET modules to 40+ GHz
• RADAR applications to >67 GHz
• Superior microwave performance
• Excellent repeatability
• Ease of assembly, reduced size and cost
• Designed with large 4 mil wirebond pads for assembly ease
Physical Characteristics
Performance
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
AEQ3042
AEQ3055
AEQ2199
AEQ2050
AEQ2234
Mounting attachment material:
Epoxy or Solder
5
10
15
20
25
30
35
40
0
Frequency in GHz
Excellent, repeatable microwave performance is achieved
• Metallization - Epoxy mount:
by application of precision thin film fabrication and DLI Hi-K
Ceramic materials. DLI’s unique design solution provides
near Ideal R-C frequency response, far superior to “Stacked
R-C chip” Assemblies.
Top: 100 µ inch Au min over 300 Angstroms TiW min.
Bottom: 100 µ inch Au min over 300 Angstroms TiW min
over TaN resistor
• Metallization - Solder mount:
Equivalent Schematic Representation
Top side: 100 µ inch min. over 50 µ inch NiV min. over 300
Angstroms TiW min.
Bottom side: 25 µ inch min. over 50 µ inch NiV min. over
300 Angstroms TiW min. over TaN resistor
Die attachment recommendations:
The gap in the microstrip line should nominally be equal to
dimension “S” (see equalizer outline on Page 64).
Mounting
Attachment
Material:
S=solder
E=epoxy
Low Frequency
Equivalent
Resistor Insertion Loss,
(R)
F0
(GHz)
Part #
Capacitance
(pF)
L
W
T
50 ohm system
(dB)
0.030” ± .002”
(.762 ± .051mm)
0.018” ± .002”
(.457 ± .051mm)
0.005” ± .001”
(.127 ± .025mm)
AEQ 2050
AEQ 2199
AEQ 2234
AEQ 3042
AEQ 3055
30 Ω
43 Ω
50 Ω
9 Ω
-2.2
-3.0
-3.5
-0.8
-1.6
0.33
1.15
0.31
12.5
9.0
34
16
32
7
E
E
E
S
S
0.028” ± .002”
(.711 ± .051mm)
0.016” ± .002”
(.406 ± .051mm)
0.007” ± .001”
(.178 ± .025mm)
0.032” ± .002”
(.813 ± .051mm)
0.016” ± .002”
(.406 ± .051mm)
0.005” ± .001”
(.127 ± .025mm)
0.040” ± .002”
(1.02 ± .051mm)
0.020” ± .002”
(.508 ± .051mm)
0.006” ± .001”
(.152 ± .025mm)
0.040” ± .002”
(1.02 ± .051mm)
0.020” ± .002”
(.508 ± .051mm)
0.006” ± .001”
(.152 ± .025mm)
20 Ω
7
www.dilabs.com | Phone: +1.315.655.8710 | 65
Thin Film - DC to 18 GHz EW Series Gain Equalizers
Description
DLI’s Gain Equalizers are designed as a small, low cost
solution to your gain slope challenges. DLI’s EW Series
is designed to address this issue from DC to 18 GHz in a
package smaller than an 0302 capacitor. Components are
designed for surface mount pick and place equipment or
epoxy mount.
Available in tape and reel packaging for high volume
applications.
Applications
• Broadband Microwave Modules; EW, ECM, ECCM
• Equalizer is utilized as a compensation circuit to correct
for loss slope created by other circuit elements such as
amplifiers
Equivalent Schematic Representation
Benefits
• Footprint interchangeable part series, gain slopes from
1 to 3.5 dB
• Superior, repeatable microwave performance
• Ease of assembly; terminations are compatible with
solder SMT and conductive epoxy assembly
• Package optimized for typical 50 W transmission line width
• No ground connection required
Part Numbers - DC to 18 GHz EW Series Gain Equalizers
Attach
method
Nominal
Part Number
L
W
T
Lp
Wp
G
Slope
1.0 dB
1.5 dB
2.0 dB
2.5 dB
3.0 dB
3.5 dB
AEQ05467
AEQ05468
28 ± 1
28 ± 1
28 ± 1
28 ± 1
28 ± 1
28 ± 1
16 ± 1
16 ± 1
16 ± 1
16 ± 1
16 ± 1
16 ± 1
7 ± 1
7 ± 1
7 ± 1
7 ± 1
7 ± 1
7 ± 1
7 min.
7 min.
7 min.
7 min.
7 min.
7 min.
14 ± 1
14 ± 1
14 ± 1
14 ± 1
14 ± 1
14 ± 1
10
10
10
10
10
10
Solder/Epoxy
Solder/Epoxy
Solder/Epoxy
Solder/Epoxy
Solder/Epoxy
Solder/Epoxy
AEQ05469
AEQ05470
AEQ05471
AEQ05472
All dimensions in mils
Typical Performance
Die Attach Recommendations
0
-0.5
-1
AEQ05467
AEQ05468
AEQ05469
AEQ05470
AEQ05471
AEQ05472
-1.5
-2
-2.5
1) Equalizer width should be approximately as wide as 50 W line trace
on PCB.
-3
2) The gap in the microstrip line should be nominally equal to
dimension G.
-3.5
100
2100
4100
6100
8100
10100
12100
14100
16100
18100
3) Vacuum pick-up tool recommended for component handling. If
pressure is to be applied during component placement, it should
be done uniformly across the part.
Frequency in MHz
4) Thin, unmounted circuit boards are prone to warpage during
reflow. This can cause solder attach defects and cracking of
components during handling or subsequent housing installation.
66 | Phone: +1.315.655.8710 | www.dilabs.com
Thin Film - Gain Equalizer
DLI’s miniature Thin Film Gain Equalizers have a microwave
frequency response which is so close to ideal that it can
be modeled by the simple parallel R-C circuit shown
below. This is a convenient model for Spice (time domain)
simulations. Other common equalizer implementations
using stacked R-C chips are not accurately modeled by this
circuit. For highest accuracy frequency domain simulations,
S-parameters are recommended.
DLI’s gain equalizer frequency response is compared with
that of an ideal R-C, and stacked R-C chips in the figure
below. The stacked R-C chip model utilizes the same
Rchip and Cchip values as in the ideal R-C model. The key
point is that the chip component R and C values used in
a stacked chip equalizer are generally not the ideal values
for specifying the DLI single chip gain equalizer. The
next section
0
discusses
The “stacked R-C chip” implementation, illustrated in
the figure below has many issues in both design and
manufacturing which lead to lower performance and higher
product cost. The equivalent circuit model below more
accurately predicts the frequency response of the stacked
chips. At microwave frequencies, the additional parasitic
circuit elements are required. The effect of ESL, the
equivalent inductance of the chip capacitor is particularly
important as it causes a more peaked response as seen in
the graph (right).
-0.5
specifying
Measured
Response of
AEQ2199
-1
-1.5
-2
Ideal RC
the part by
frequency
response
parameters,
or in terms of
the ideal R-C
values.
“Stacked R-C chips”
ESL causes high
frequency roll-off
-2.5
-3
Parasitics.DB[S21]
IdealRC.DB[S21]
AEQ2199.DB[S21]
-3.5
-4
-4.5
-5
100
4080
8060
12040
16020
20000
Frequency in MHz
Custom Equalizer Design Inputs:
• Low frequency loss or resistance value
• Fo - minimum loss frequency or capacitance determined
using equivalent circuit model on Page 64
• Case size restrictions - 50 ohm microstrip line width is a
typical maximum case width objective
Case Size (inches)
Preferred:________ Maximum Length: ________ Maximum Width ________
Fo________GHz
Minimum Loss Frequency (GHz)
Low Frequency Loss (dB), 50 ohm
system
Design Resistance (ohms): ________ Loss(dB): _______
Operating Temperature Range (C˚) Minimum Temperature: _______ Maximum Temperature: ________
Power Dissipation (mw)
Assembly Method (SMT or Epoxy) Conductive Epoxy attach: _______ Solder attach: _______ Solder type: ________
Board Material Material: ________ Dielectric constant: ________ Thickness: ________
www.dilabs.com | Phone: +1.315.655.8710 | 67
What makes DLI BTP
services unique?
DLI is a premier manufacturer of custom designed thin
film filters. DLI combines its RF design knowledge,
testing capabilities, materials characterization expertise
with our precision manufacturing capabilities to provide
our customers with repeatable designs. Customers
may provide designs on 99.6% alumina or are free to
design filters using DLI’s high K, high Q, temperature
stable dielectrics to receive a smaller, lighter and higher
performing filter. We can deliver these filters tested with
known good yield.
Dielectric Laboratories, Inc. (DLI) has built its reputation
as a manufacturer of High frequency, High Q Capacitors
and is your
global partner
for application
specific
microwave and
millimeterwave
Build-to-Print Reference Guide
Metal Coatings
l
l
l
l
l
l
Gold (Au) Nickel (Ni) Titanium Tungsten (TiW) Platinum (Pt)
l
l
Titanium (Ti) Copper (Cu) Nickel Vanadium (NiV)
Gold Tin (AuSn) Tantalum Nitride (TaN) (Resistive Layer)
l
Lithography
l
Conductor Thickness Line width and Spacing
Gold ≤150 μ”
≤0.5 ± 0.1 mil
1.0 ± 0.2 mil
3.0 ± 0.4 mil
3
Gold 150 - 300 μ”
Copper 50 - 600 μ”
Nickel 50 - 125 μ”
components
serving customers
in fiber optic,
wireless, medical,
transportation, semiconductor, space, avionics and
military markets.
Laser Drilling
l
Features as small
as 0.003” dia.
l
Drill features in
high K dielectrics
The marriage of ceramic expertise, manufacturing know-
how, product quality, customer
Other Options
l
l
l
service, product customization, and
clever microwave and RF design
engineering sets us apart from all
others in the industry.
Edge-wrap Metallization Castelated Vias Gold Filled Vias
l
l
l
l
l
l
l
Reinforced Vias Spiral Inductors Interdigitated Capacitors
Lange Coupler Resistors - Notched, Flush, Top-Hat Polyimide
Solder Dam RF test capabilities up to 67 GHz
Contoured Surfaces - (non-rectangular shapes)
l
l
l
Selective Metallization - Different top and bottom substrate metal
scheme. Different metal schemes on the same side of substrate
Packaging - Photon Ring packaging, repopulation, Tape and Reel
Anti-Static Waffle packaging up to 4” square
With over three decades of
material science formulation
l
and development, more than
one hundred proprietary and/or patented ceramic
formulations, and multiple recent patent filings, DLI is
the pre-eminent ceramic component manufacturer in the
industry. You can turn to DLI with confidence for your
high frequency Single-
TF Coupon
Resistors can be incorporated directly
into the circuit design with the advantage
of reducing assembly steps, improving
thermal dissipation and improving
reliability through the reduction of
interconnections.
Layer Capacitors, Multi-
Layer Capacitors that are
DLI’s resistor technology utilizes TaN. This material
has higher maximum exposure temperature and superior
resistance to harsh environments (soldering and processing).
difficult to build and tight
tolerance; Heat Sinks,
DLI has the capability to manufacture custom designs
utilizing Polyimide materials to extend low frequency
while miniaturizing overall size.
Resonators, Filters, and
Build-To-Print or Custom
Thin Film Components.
Under most circumstances DLI can tune a resistor in to
tolerance of 10% without trimming. When tighter tolerance is
required laser trimming is available.
DLI also has the RF expertise to model high
performance filters to your specific needs including
multi-layer technology. Please see DLI’s Custom
Thin Film Product Line Catalog.
DLI offers reinforced vias when higher current is required
which gives better mechanical strength and lower resistance
to the via hole.
Typical Applications
Filled vias provide improved performance and reliability over
plated vias but have a higher processing cost. Filled vias
increase current carrying capacity and have higher thermal
conductivity to the ground plane. When mounting active die,
use of filled vias effectively conducts heat away from the die.
l
Heat Sinks and Standoff
l
Integrated Passive Components
l
Custom Resistor Capacitor Networks
l
Lange Couplers, Power Combiners
DLI offers gold fill (copper or silver can diffuse into other
layers of the metallization leading to reliability issues).
l
EMI Filters
The precision of conductor line width and line spacing can
be critical to achieving the performance required. Control
of metal geometries is key to repeatable performance
in microwave structures. Characteristic impedance of
transmission lines is governed by line widths. DLI has
extensive experience and can assist in tailoring ceramic/
metallization systems to your design to achieve maximum
performance. DLI is capable of meeting as small as 0.0005”
line width and spacing with 0.0001” tolerance.
l
High Frequency Filters
l
Microwave Integrated Circuits (MIC)
l
Bias Decoupling and Filtering
l
Lumped Element Impedance Matching Network
l
PA Stabilization
l
Impedance Matching and Power Combining Network
68 | Phone: +1.315.655.8710 | www.dilabs.com
Coefficient of
Thermal
Expansion
(ppm/°K)
Temperature
Coefficient of
Capacitance
(ppm/°C)
Dielectric
Constant
(Tolerance)
Standard substrate thicknesses
are in 5 and 10mil thick
Substrate
Material
Typical Loss
Tangent
Surface Finish
(µ-inch)
Application
increments but can be custom
to 0.1mil. Polished and lapped
surfaces are available to ±0.0005”
tolerance where As-Fired
0.000015 @ 1MHz
0.00033 @ 24GHz
Suitable for microwave and millimeter wave frequency applications. Low loss.
Thermal Conductivity: 1.38 W/m-K.
Fused Quartz (SiO2) QZ
3.82 @ 1MHz
8.6 (±0.35) @ 1MHz
9.5 (±1) @ 1MHz
9.9 (±0.15) @1MHz
13.3 (±0.5)
20 (±0.5)
0.55
4.6
—
<0.1
As Fired <20
Polished <2
Suitable for circuits requiring high power dissipation. RF and microwave circuit applications.
Thermal Conductivity: 170 W/m-K or 200 W/m-K
Aluminum Nitride (AlN) AG
0.005 @ 8GHz
0.0004
0.0001
0.0005
0.0002
0.0003
0.0003
0.0005
0.0009
0.0003
0.0006
0.005
—
materials are accurate to ±0.001”.
Alternative surface finishes may
also be available, please consult
As Fired <4
Polished <1
General circ uit applications. Compatible with Si and GaAs chip technology.
Thermal Conductivity: 26 W/m-K.
96% Alumina (Al2O3) PJ
6.4 - 8.2
6.5 - 7.5
7.6
—
As Fired ≤3
Polished <5
General circuit applications. Compatible with Si and GaAs chip technology.
Thermal Conductivity: 27 W/m-K.
99.6% Alumina (Al2O3) PI
P120 ± 30
P22 ± 30
P90 ± 20
N30 ± 15
0 ± 15
PG
AH
NA
CF
Polished <5
Polished <5
Polished <5
Polished <5
Polished <5
Replacement for Alumina - improved temperature stability.
9.6
Suitable for circuit miniaturization. RF and microwave circuit applications.
23 (±0.5)
10.1
9.0
Suitable for circuit miniaturization. RF and microwave circuit applications.
25 (±0.5)
Excellent temperature stability. Suitable for circuit miniaturization. RF and microwave circuit applications.
Suitable for circuit miniaturization. RF and microwave circuit applications.
CD
CG
NP
NR
NS
NU
38 (±1)
5.8
N20 ± 15
0 ± 30
Polished <5
Lapped <20
67 (±1)
9.0
Excellent temperature stability. Suitable for circuit miniaturization. RF and microwave circuit applications.
85 (±5%)
—
N750 ± 200
N1500 ± 500
N2400 ± 500
N3700 ± 1000
Polished <5
Polished <5
Polished <5
Polished <5
152 (±5%)
10.0
—
Suitable for circuit miniaturization. RF and microwave circuit applications.
Microwave power transistor matching; eg. GaN, SiC
300 (±10%)
600 (±10%)
0.015
—
Maximum Use
Temperature °C
The metal system utilized is
typically chosen based on the
the following requirements:
current carrying requirement,
chip and component mounting
strategies, line width and spacing
requirements and if utilizing an
integrated resistor.
Metalization System
Application
Component Attachment Method
Typical Thickness Range
Comments
TaN: 12 to 200 Ω /
TiW: 300 to 500 Å
Au: 5 to 300 μ”
Tantalum Nitride (TaN)
Titanium Tungsten (TiW)
Gold (Au)
Standard Thin Film Metal System for
Conductors with Resistor Layer
Au/Sn, Au/Si,
Au/Ge - Eutectic, Epoxy
380
Not recommended for Tin/Lead Solder Attach -
Maintain Gold 5-20 μ” for Solder Attach.
Compatible with Wire bonding -
Maintain Gold ≥100 μ” for Wire bonding.
Titanium Tungsten (TiW)
Gold (Au)
Standard Thin Film Metal System for
Conductors
Au/Sn, Au/Si,
Au/Ge - Eutectic, Sn/Pb, Epoxy
TiW: 300 to 500 Å
Au: 5 to 300 μ”
425
350
TaN: 12 to 200 Ω /
TiW: 300 to 500 Å
Au: 5 to 10 μ”
Cu:150 to 600 μ”
NiV: 40 to 100 μ”
Au:5 to 300 μ”
Tantalum Nitride (TaN)
Titanium Tungsten (TiW)
Gold (Au)
Copper (Cu)
Nickel (Ni)
Higher current requirements can
employ thicker gold or copper
metal but that limits the ability
for fine line geometries. Wire
bonding to the surface of a circuit
generally requires 100 μ” of gold.
High Current & Low Loss with or without
TaN Resistor Layer
Au/Sn, Au/Si,
Au/Ge - Eutectic, Sn/Pb, Epoxy
Compatible with Tin/Lead Solder Attach
- Maintain exposed surface Gold 5-20 μ” for Sn/Pb Solder Attach when
repeated soldering is required for repairs.
Gold (Au)
TaN: 12 to 200 Ω /
TiW: 300 to 500 Å
Au: 5 to 300 μ”
NiV: 40 to 100 μ”
Au: 5 to 70 μ”
Tantalum Nitride (TaN)
Titanium Tungsten (TiW)
Gold (Au)
Nickel (Ni)
Gold (Au)
Compatible with Wire bonding
- Maintain Gold ≥100 μ” for Wire bonding.
High Current & Low Loss with or without
TaN Resistor Layer
Au/Sn, Au/Si,
Au/Ge - Eutectic, Sn/Pb, Epoxy
350
When tin/lead soldering is
required, gold thickness
TaN: 12 to 200 Ω /
TiW: 300 to 500 Å
Au: 5 to 10 μ”
NiV: 40 to 100 μ”
Au:5 to 300 μ”
Tantalum Nitride (TaN)
Titanium Tungsten (TiW)
Gold (Au)
Nickel (Ni)
Gold Tin (AuSn)
With or without TaN Resistor Layer for
selective Gold/Tin attach and wire bond
locations
is decreased to reduce
Au/Sn
Au/Sn
280
embrittlement and a nickel/
platinum barrier layer is utilized.
Eliminates solder preform.
Direct die attach to pad (Au/Sn).
Selective Areas available for Wire bonding.
TiW: 300 to 500 Å
NiV: 40 to 100 μ”
AuSn: 100 to 350 μ”
DLI also has the capability to
selectively apply gold/tin solder
for attachment of descrete die.
Titanium Tungsten (TiW)
Nickel (Ni)
Gold Tin (AuSn)
For Gold/Tin Solder Systems without TaN
Resistor Layer
280
>400
350
TiW: 300 to 500 Å
Pt: 6-10 μ”
Au: 5 to 300 μ”
Titanium Tungsten (TiW)
Platinum (Pt)
Gold (Au)
Au/Sn, Au/Si,
Au/Ge - Eutectic, Sn/Pb, Epoxy
Compatible with Tin/Lead Solder Attach -
Maintain Gold 5-20 μ” for Solder Attach when repeated soldering is
required for repairs.
Heat sink applications
Note: For lower frequency filter (<4
GHz) designs, DLI suggests using a
minimum gold thickness of 150µ”.
Higher frequency designs should use
the standard 100µ” gold thickness.
TiW: 300 to 500 Å
NiV: 40 to 100 μ”
Au: 5 to 300 μ”
Titanium Tungsten (TiW)
Nickel (Ni)
Gold (Au)
Compatible with Wire bonding
- Maintain Gold ≥100 μ” for Wire bonding.
Standard Thin Film metal system for
conductors
Sn/Pb, Au/Sn, Au/Si,
Au/Ge - Eutectic, Epoxy
Note: Titanium can be substituted depending on substrate composition. Custom Metalizations and thicknesses are available upon request. Nickel Vanadium may be substituted for Nickel in some applications; contact applications engineering for details.
69
www.knowlescapacitors.com
Knowles Capacitors designs, manufactures and
sells special electronic components. Our products
are used in military, space, telecom infrastructure,
medical and industrial applications where function
and reliability are crucial.
Knowles (Cazenovia)
2777 Route 20 East, Cazenovia,
NY 13035 USA
Phone: +1 315 655 8710
Fax: +1 315 655 0445
KCCSales@knowles.com
Knowles (Valencia)
25111 Anza Drive, Valencia,
CA 91355 USA
Phone: +1 661 295 5920
Fax: +1 661 295 5928
NovacapSales@knowles.com
Knowles (UK) Ltd
Hethel Engineering Centre, Chapman Way,
Hethel, Norwich, Norfolk NR14 8FB
Phone: +44 1603 723300
Fax: +44 1603 723301
SyferSales@knowles.com
Knowles (Cazenovia)
2777 Route 20 East, Cazenovia,
NY 13035 USA
Phone: +1 315 655 8710
Fax: +1 315 655 0445
VoltronicsSales@knowles.com
10021/17
© Copyright Knowles Capacitors, 2017
- design: creations@panpublicity.co.uk
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