DN8S03LTEB [KOA]
Diode Termination Array, 1-Line, PDSO3, PLASTIC, SOT23, 3 PIN;
| 型号： | DN8S03LTEB |
| 厂家： | 
KOA SPEER ELECTRONICS, INC. |
| 描述： | Diode Termination Array, 1-Line, PDSO3, PLASTIC, SOT23, 3 PIN 光电二极管 接口集成电路 |
| 文件： | 总2页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DN(X)
diode terminator network
features
• Fast reverse recovery time
• Fast turn on time
• Low capacitance
• SMD packages
• 16 kV IEC61000-4-2 capable
applications
• Singal termination
• Signal conditioning
• ESD suppression
• Transient suppression
dimensions and construction
Dimensions inches (mm)
S03
S14
Package Total
L
L
Pins
3
Pkg Ht
Code Power
p
L
0.2
W
0.2
p
0.1
d 0.05
0.2
p
Bonding
Bonding
Wire
Wire
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S03 225mw
Lead
Die
Pad
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S14 225mw
S06 225mw
N08 400mw
W20 1200mw
Q20 1000mw
Q24 1000mw
4
d
W
Lead
W
Si
Die
Wafer
.115
(2.92)
.110
(2.80)
.075
(1.91)
.037
(0.95)
.017
(0.43)
Pad
d
Si
6
Wafer
Molded
Resin
Molded
Resin
.190
(4.83)
.236
(5.99)
.050
(1.27)
.063
(1.60)
.016
(0.41)
8
N08, W20,
Q20, Q24
S06
.500
(12.7)
.408
(10.36)
.050
(1.27)
.084
(2.40)
.016
(0.41)
L
p
L
20
20
24
Bonding
Wire
Bonding
Wire
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
d
p
Lead
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
Lead
W
W
Die
Pad
Wafer
Die
d
Si
Pad
Si
Molded
Resin
Wafer
Molded
Resin
circuit schematic
1
1
1
1
DN3: 6 pins
DN4: 4 pins
DN2: 20 pins
DN2: 20 pins
1
1
1
1
DN6: 8 pins
DN5: 24 pins
DN8
DN7: 24 pins
For further information on packaging, please refer to Appendix C.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1/12/05
154
KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
DN(X)
diode terminator network
ordering information
New Part #
DNA
Q20
T
TEB
Package
Symbol
Termination
Material
Type
Packaging
DNA
DN2
DN3
DN4
DN5
DN6
DN7
DN8
Package type symbol + number of pins
S03: 3 pin SOT23
S14: 4 pin SOT23
T: Sn
L: SnPb
TE: 7" embossed plastic
TEB: 13" embossed
plastic tape
S06: 6 pin SOT23
N08: 8 pin Narrow SOIC
W20: 20 pin Wide SOIC
Q20: 20 pin QSOP
Q24: 24 pin QSOP
application schematic
ESD Suppression
Signal Conditioning
Transient
Transient
Signal
Ringing
Ringing
Eliminate
+ Rail
Suppressed
+ Rail
Driver
Receiver
Driver
Receiver
– Rail or GND
– Rail or GND
applications and ratings
Reverse
ESD
Forward
Leakage
Current
@7V
Operating
Temperature
Range
Continuous
Forward
Current*
Part
Designation
Breakdown
Voltage
Capacitance
@1Mhz
Voltage
Voltage
Capability
IEC 61000-4-2
1F=50ma
1R=1ma
-40°C
to +85°C
DN(X)
0.4 to 1.2V
7.2V
1uA
1 to 5pF
16kV
50mA
* One diode conducting
environmental applications
Performance Characteristics
Parameter
Maximum
Test Method
Resistance to Soldering Heat
+0.25%
MIL-R-55342 4.7.7
MIL-R-55342 4.7.5
Short Time Overload
Moisture Resistance
Thermal Shock
H.A.S.T.
+0.50%
+0.50%
+0.50%
+1%
MIL-STD-202 method 103
MIL-STD-202 method 107
2 Atm., 121°C, 96 hrs
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
6/10/05
155
KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
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