DN8S14TTE [KOA]

Diode Termination Array, ROHS COMPLIANT, PLASTIC, SOT23, 4 PIN;


型号：	DN8S14TTE
厂家：	KOA SPEER ELECTRONICS, INC.
描述：	Diode Termination Array, ROHS COMPLIANT, PLASTIC, SOT23, 4 PIN 接口集成电路
文件：	总2页 (文件大小：111K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DN(X)

diode terminator network

features

• Fast reverse recovery time

• Low capacitance

• Fast turn on time

• SMD packages

• 16 kV IEC61000-4-2 capable

• Products with lead-free terminations meet EU RoHS

and China RoHS requirements

applications

• Signal termination

• Signal conditioning

• ESD suppression

• Transient suppression

dimensions and construction

Dimensions inches (mm)

S03

S14

Package Total

Code Power

Pins

Pkg Ht

L ±0.2 W ±0.2 p ±0.1

d ±0.05

±0.2

Bonding

Wire

.115

.091

(2.30)

.075

(1.91)

.037

(0.95)

.017

(0.43)

S03 225mw

(2.92)

Lead

Die

Pad

.115

(2.92)

.091

(2.30)

.075

(1.91)

.037

(0.95)

.017

(0.43)

S14 225mw

S06 225mw

N08 400mw

W20 1200mw

Q20 1000mw

Q24 1000mw

Lead

Die

Pad

Wafer

.115

(2.92)

.110

(2.80)

.037

(0.95)

.037

(0.95)

.017

(0.43)

Wafer

Molded

Resin

Molded

Resin

.190

(4.83)

.236

(5.99)

.050

(1.27)

.063

(1.60)

.016

(0.41)

N08, W20,

Q20, Q24

S06

.500

(12.7)

.408

(10.36)

.050

(1.27)

.084

(2.40)

.016

(0.41)

Bonding

Wire

Bonding

Wire

.341

(8.66)

.236

(5.99)

.025

(0.635)

.063

(1.60)

.010

(0.25)

Lead

.341

(8.66)

.236

(5.99)

.025

(0.635)

.063

(1.60)

.010

(0.25)

Lead

Die

Pad

Wafer

Die

Pad

Wafer

Molded

Resin

Molded

Resin

circuit schematic

DN3: 6 pins

DN4: 4 pins

DN2: 20 pins

DNA: 20 pins

DN6: 8 pins

DN5: 24 pins

DN8

DN7: 24 pins

For further information on packaging, please refer to Appendix A.

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

3/03/08

208

KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com

DN(X)

diode terminator network

ordering information

New Part #

DNA

Q20

TEB

Package

Symbol

Termination

Material

Type

Packaging

DNA

DN2

DN3

DN4

DN5

DN6

DN7

DN8

Package type symbol + number of pins

S03: 3 pin SOT23

T: Sn

TE: 7" embossed plastic

(Other termination

styles available,

contact factory

for options)

TEB: 13" embossed

plastic tape

S14: 4 pin SOT23

S06: 6 pin SOT23

N08: 8 pin Narrow SOIC

W20: 20 pin Wide SOIC

Q20: 20 pin QSOP

Q24: 24 pin QSOP

application schematic

ESD Suppression

Signal Conditioning

Transient

Signal

Ringing

Eliminate

+ Rail

Suppressed

+ Rail

Driver

Receiver

Driver

Receiver

– Rail or GND

applications and ratings

Reverse

Breakdown

Voltage

ESD

Voltage

Capability

IEC 61000-4-2

Forward

Voltage

1_F=50ma

Leakage

Current

@7V

Operating

Temperature

Range

Continuous

Forward

Current*

Part

Designation

Capacitance

@1Mhz

_R=1ma

-55°C

to +125°C

DN(X)

0.4 to 1.2V

7.2V

1uA

2pF

16kV

50mA

* One diode conducting

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

2/27/06

209

KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com

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