KC2ALTE120P6N5L [KOA]

Noise Filters; 噪声滤波器
KC2ALTE120P6N5L
型号: KC2ALTE120P6N5L
厂家: KOA SPEER ELECTRONICS, INC.    KOA SPEER ELECTRONICS, INC.
描述:

Noise Filters
噪声滤波器

文件: 总8页 (文件大小:116K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
AHA 8/05/05  
CERTIFIED  
Noise Filters  
CERTIFIED  
KC Series  
1. Features  
Compact physical dimensions  
Excellent wave reflection control  
Exceptional EMI attenuation  
Excellent as impedance matching for signal lines  
Marking: Brown and black body color with no marking (1J & 2AF)  
White and black body color with no marking (2A)  
2. Applications  
Clock output signal line  
In/out video signal line for super high resolution  
High speed signal line  
Noise reduction for various signal circuits  
3. Ordering & Specifying Information  
Type designation shall be as the following form.  
KC  
Type  
2AF  
Size  
T
TE  
120  
N
6N5  
L
Capacitance Capacitance Inductance  
Inductance  
Tolerance  
Packaging  
Termination  
Material  
Value (pF)  
Tolerance  
Value (nH)  
1J  
2AF  
2A  
2 significant  
digits + num.  
of zeros  
T: Sn  
L: SnPb  
N: 30ꢀ  
P: 25ꢀ  
TD: 7" paper tape  
(1J & 2AF only -  
4,000 pieces/reel)  
6.5nH  
L: 15ꢀ  
TE: 7" embossed  
plastic  
(2A only -  
2,000 pcs/reel)  
4. Circuit Schematic  
1J & 2AF  
2A  
PAGE 1 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
5. Rating  
Item  
Specification  
Operating temperature range  
-25°C ~ +85°C (1J & 2AF) -40°C ~ +85°C (2A)  
-40°C ~ +85°C (After soldering)  
Storage temperature range  
Measuring condition (Standard)  
Temperature  
15 ~ 35°C  
20 ~ 90ꢀ  
Relative humidity  
Measuring condition (Precision)  
Temperature  
20°C 1°C  
60 ~ 67ꢀ  
Relative humidity  
6. Dimension  
L
Dimensions inches (mm)  
f
Size  
1J  
L
W
t
g
e
f
W
.062 .008 .031 .008 .024 .008 .016 .012 .008 .006  
(1.6 0.2) (0.8 0.2) (0.6 0.2) (0.4 0.3) (0.2 0.15)  
1J &  
2AF  
N/A  
t
.079 .008 .049 .008 .031 .008 .016 .012 .012 .008  
(2.0 0.2) (1.25 0.2) (0.8 0.2) (0.4 0.3) (0.3 0.2)  
N/A  
2AF  
2A  
e
g
e
.079 .008 .049 .008 .063 .008 .016 .008 .004 Min. .02 .006  
(2.0 0.2) (1.25 0.2) (1.6 0.2) (0.4 0.2) (0.1 Min.) (0.25 0.15)  
L
W
2A  
f
2A  
1J & 2AF  
t
e
g
e
PAGE 2 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
7. Applications and Ratings  
Item  
Specification  
Operating Temperature Range  
Storage Temperature Range  
-25°C to +85°C (1J & 2AF) -40°C to +85°C (2A)  
-40°C to +85°C (after soldering)  
Measuring Condition (Standard)  
Temperature  
Relative Humidity  
15°C to 35°C  
20 - 90ꢀ  
Measuring Condition (Precision)  
Temperature  
Relative Humidity  
20°C 1°C  
60 - 67ꢀ  
Insulation  
Resistance  
Minimum  
(M)  
Typical  
Cut-off  
Frequency  
(Att = 3dB)  
Capacitance  
Inductance  
Rated  
Voltage  
DC (V)  
Rated  
Current  
DC (A)  
Operating  
Temperature  
Range  
Part  
Designation  
(pF)  
%
(nH)  
%
KC1JTTD220P8N0L  
KC1JTTD350P8N0L  
KC1JTTD550P8N0L  
KC2AFLTD151N16N5L  
KC2AFLTD700N8N50L  
KC2ALTE120N6N5L  
KC2ALTE180N13NL  
KC2ALTE350N15NL  
22 25ꢀ  
35 25ꢀ  
55 25ꢀ  
150 30ꢀ  
70 30ꢀ  
12 30ꢀ  
18 30ꢀ  
35 30ꢀ  
8.0 15ꢀ  
8.0 15ꢀ  
8.0 15ꢀ  
16.5 15ꢀ  
8.5 15ꢀ  
6.5 15ꢀ  
13 15ꢀ  
15 15ꢀ  
200 MHz  
100 MHz  
50 MHz  
16  
25  
25  
200  
200  
200  
1000  
1000  
1000  
-25°C to +85°C  
-25°C to +85°C  
-40°C to +85°C  
50 MHz  
100 MHz  
530 MHz  
360 MHz  
180 MHz  
8. Pattern design  
The land pattern is recommended as follows.  
Chip Mounting Side  
Back Side  
Connect to  
ground pattern of  
mounting side  
1J & 2AF  
2A  
Resist  
Resist  
Ground  
Pattern  
Through Hole  
Through Hole  
(unit: mm)  
PAGE 3 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
9. Characteristics  
Item  
Requirement  
Conditions  
Insulation Resistance  
Within the tolerance  
Within the tolerance  
Voltage: DC25V  
Test Time: 60 sec  
Capacitance  
Inductance  
Frequency: 1MHz  
Voltage: 1V  
Equipment: HP4192A  
Fixture: HP16034E  
Within the tolerance  
Within the tolerance  
Frequency: 1MHz  
Current: 10mA  
Equipment: HP4192A  
Fixture: HP16034E  
Resistance  
(2A only)  
Frequency: 1MHz  
Current: 10mA  
Equipment: HP4192A  
Fixture: HP16034E  
Capacitance vs.  
Temperature  
Characteristics  
Variation rate of capacitance in operate  
temperature are shown in below.  
The capacitance shall be measured at each  
stage below. The rate shall be calculated  
against the capacitance measured at 20°C  
Step Temperature  
Part  
Rate  
10ꢀ  
KC2AL120N6NSL  
KC2AL180N13NL  
KC2AL350N15NL  
10ꢀ  
10ꢀ  
1
2
3
4
20°C  
-40°C 3°C  
20°C  
85°C 3°C  
Terminal Adhesion  
Strength  
No physical damage  
Solder a chip to a test  
substrate and then  
laterally apply a load  
(5N, 500gf) in the  
arrow direction.  
Force  
Direction  
Substrate  
Chip  
Resistance to  
Soldering Heat  
Appearance: No physical damage  
Capacitance: Within tolerance  
Flux: 25ꢀ rosin  
Pre-heating: 120 to 180 sec  
Dielectric Loss: Within tolerance  
Insulation Resistance: Within tolerance  
Withstand Voltage: No abnormality  
Pre-heating Temp: 150°C to 200°C (1J & 2AF)  
Solder: H60A  
Solder Temp: 260°C 5°C  
Dip Time: 5 0.5 sec  
PAGE 4 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
9. Characteristics Cont.  
Item  
Requirement  
Conditions  
Solderablility  
More than 95ꢀ of the terminal electrode  
shall be covered with new solder.  
Flux: 25ꢀ rosin  
Solder: H60A  
Solder Temp: 235°C 5°C  
Dip Time: 2 0.5 sec  
Temperature Cycle*  
Appearance: No physical damage  
Capacitance: Within tolerance  
Repeat the following heat cycle 10 times:  
Step Temperature  
Time  
Dielectric Loss: Within tolerance  
Insulation Resistance: Within tolerance  
Withstand Voltage: No abnormality  
1
2
3
4
-40°C 3°C  
Room Temp.  
85°C 2°C  
30 min 3 min  
15 min max.  
30 min 3 min  
15 min max.  
Room Temp.  
High Temperature  
Resistance*  
Appearance: No physical damage  
Capacitance: Within tolerance  
Temp: 70°C 2°C  
Bias: DC25V  
Dielectric Loss: Within tolerance  
Insulation Resistance: Within tolerance  
Withstand Voltage: No abnormality  
Bias: DC200mA  
Test Time: 500 hours  
Humidity Resistance  
(unload)*  
Appearance: No physical damage  
Capacitance: Within tolerance  
Dielectric Loss: Within tolerance  
Insulation Resistance: Within tolerance  
Temp: 85°C 2°C  
Humidity: 85ꢀ 5ꢀ  
Test Time: 500 hours  
Substrate Bending  
Test  
Appearance: No physical damage  
Capacitance: Within tolerance  
After soldering a chip to a test substrate,  
bend the substrate by 1 mm and then measure.  
The substrate is GE4 or based on GE4.  
20  
Substrate  
Weight  
Displacement  
45  
2
45  
2
Humidity Resistance  
(load)*  
Appearance: No physical damage  
Capacitance: Within tolerance  
Dielectric Loss: Within tolerance  
Insulation Resistance: Within tolerance  
Temp: 40°C 2°C  
Humidity: 90ꢀ ~ 95ꢀ  
Bias: DC25V  
Bias: DC200mA  
Test Time: 500 hours  
* After Temperature cycle test, High temperature resistance test, Humidity resistance test or  
Low temperature resistance test, the tested sample should be measured after having left in  
temperature from 15° to 35°C and relative humidity from 20ꢀ to 90ꢀ for 24 hours.  
PAGE 5 OF 8  
www.koaspeer.com  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
10. Packaging Specifications  
10.1 Taping  
Packaging of components on continuous tape is complete with  
carrier tape for putting components and cover tape for sealing.  
Feeding Hole  
Chip Pocket  
D0  
t1  
E
F
B
W
A
P1 P2  
P0  
t2  
Chip Component  
(1) Dimensions of Carrier Tape  
Dimensions in inches (mm)  
P1  
0.068 0.003 0.157 0.003  
(1.75 0.1) (4.0 0.1)  
Series  
A
B
W
F
E
KC1J  
Series  
0.043 0.002 0.075 0.002 0.314 0.003  
(1.1 005) (1.9 0.05) (8.0 0.1)  
N/A  
KC2AF  
Series  
0.061 0.003 0.090 0.003 0.314 0.0078 0.137 0.001 0.068 0.003 0.157 0.003  
(1.55 01) (2.3 0.1) (8.0 0.2) (3.5 0.05) (1.75 0.1) (4.0 0.1)  
KC2A  
Series  
0.061 0.003 0.090 0.003 0.314 0.0078 0.137 0.001 0.068 0.003 0.157 0.003  
(1.55 0.1)  
(2.3 0.1)  
(8.0 0.2)  
(3.5 0.05)  
(1.75 0.1)  
(4.0 0.1)  
Dimensions in inches (mm)  
Series  
P2  
P0  
D0  
t1  
t2  
+ 0.003  
KC1J  
Series  
0.078 0.001 0.157 0.003  
(2.0 0.05) (4.0 0.1)  
0.059... ....  
0.037 0.001  
(0.95 0.05)  
-0  
0.030 0.002  
(0.75 0.04)  
(1.5 + 0.1  
)
-0  
+ 0.003  
0.059... ....  
-0  
KC2AF  
Series  
0.078 0.001 0.157 0.003  
(2.0 0.05) (4.0 0.1)  
0.037 0.001  
(0.95 0.05)  
N/A  
+ 0.1  
(1.5  
)
-0  
+ 0.003  
KC2A  
Series  
0.078 0.001 0.157 0.003  
0.059... ....  
(1.5  
0.009 0.001  
(0.25 0.05)  
0.074 0.003  
(1.9 0.1)  
-0  
+ 0.1  
(2.0 0.05)  
(4.0 0.1)  
)
-0  
PAGE 6 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
(1) Dimensions of Carrier Tape Cont.  
15.75 (400)  
6.30 (160)  
6.30 (160)  
Empty  
Top tape  
Empty  
Tape running direction  
(2) Reel dimensions  
.079  
(2.0 0.5)  
øD  
A
øB  
Embossed  
cavity  
øC  
2A Embossed carrier  
(2AF size: Paper tape)  
W
Dimensions in inches (mm)  
A
B
C
D
E
W (min)  
W (max)  
KC  
Series  
7.00 0.78  
(178 2)  
2.36  
0.511 0.02  
(13 0.5)  
0.83 0.03  
(21 0.8)  
0.079 0.02 0.311 0.059 0.429 0.059  
min)  
(60  
(2 0.5)  
(7.9 1.5)  
(10.9 1.5)  
10.2 Construction of Packaging on Continuous Tapes (2AF only)  
Packaging of components on continuous tape is complete with  
carrier tape for putting components and cover tape for sealing.  
Materials  
Reel:  
Carrier Tape:  
Top Cover Tape:  
Polystyrene  
Paper  
Polyester base  
Bottom Cover Tape: Paper  
PAGE 7 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
KOA SPEER ELECTRONICS, INC.  
SS-229 R4  
11. General Information  
12. Recommended Soldering Conditions  
(1) Storage  
Recommended Condition  
for Reflow Soldering  
The products must be stored from 10° to 35°C  
and from 30ꢀ to 70ꢀ RH before soldering.  
Preheat 180  
Seconds Max.  
Soldering  
10 Seconds Max.  
Natural  
Cooling  
(2) Soldering  
In general, ceramics are very sensitive to  
thermal shocks. Therefore the parts shall not  
be exposed to a sudden temperature increase,  
decrease or partial heating.  
Products shall be pre-heated prior to soldering.  
The temperature difference between the solder  
temperature and product temperature does  
not exceed 130°C.  
250°C  
150°C  
120 Seconds Min.  
230°C - 250°C  
It is desirable that the soldering temperature  
be kept 240° - 250°C and that soldering time  
be less than 4 seconds.  
Recommended Condition  
for Flow Soldering  
Flux shall be rosin type. Do not use strong  
acid type flux.  
Preheat 120  
Seconds Max.  
Soldering  
3-4 Seconds Max.  
Natural  
Cooling  
The tip of the soldering iron shall be 20 W or  
less, 3ƒ or less, and 220° - 250° C.  
Recommended soldering thermal and time  
conditions are shown Appendix 2.  
250°C  
150°C  
120 Seconds Min.  
(3) Mounting  
After mounting components on the printed  
circuit board, do not apply stress through  
board bending or mishandling.  
230°C - 250°C  
Recommended Condition  
for Iron Soldering  
Preheat 120  
Seconds Max.  
Soldering  
4 Seconds Max.  
Natural  
Cooling  
250°C  
150°C  
120 Seconds Min.  
220°C - 250°C  
PAGE 8 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  

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