KL32056K [KOA]
General Purpose Inductor, 0.056uH, 10%, 1 Element, Ferrite-Core, SMD;
| 型号： | KL32056K |
| 厂家： | 
KOA SPEER ELECTRONICS, INC. |
| 描述： | General Purpose Inductor, 0.056uH, 10%, 1 Element, Ferrite-Core, SMD 测试 射频感应器 电感器 |
| 文件： | 总12页 (文件大小：140K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TN-100
CERTIFIED
Chip Inductors
Typ e KL3 2 S e rie s
1. Scope
This specification applies to Chip Inductors (KL32)
produced by KOA Corporation.
2. Type Designation
The type designation shall be the following form:
KL
32
TE
K
221
Type
Chip Size
Packaging
Nominal
Inductance
Tolerance
J: ± 5%
K: ±10%
M: ±20%
0.126 X .098 X 0.087 in.
(3.2 X 2.5 X 2.2 mm)
TE: Embossed Taping
No Designation: Bulk
Winding Form
3. Rating
Item
Ratings
0.005 µH ~ 330 µH (E-12 series)
Nominal Inductance Range (µH)
Nominal Inductance Tolerance
Quality Factor (typ.)
Self Resonant Frequency (typ.) (MHz)
DC Resistance (typ.) (Ω)
The rating shall be shown in the Table-1.
Allowable Current (max.) (mA)
Measuring Frequency (MHz)
Operating Temperature Range (°C)
Storage Temperature Range (°C)
-25°C ~ +100°C
-40°C ~ +100°C
PAGE 1 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
Rating Table-1
Nominal
Inductance
(µH)
Quality Self Resonant
Factor Frequency Resistance DC Current Frequency
(typ.) (typ.) (MHz)
DC
Allowable Measuring
Ordering
Code*
Inductance
Tolerance
(typ.) (Ω)
(typ.) (mA)
(MHz)
KL32TE005M
KL32TE010
KL32TE012
KL32TE015
KL32TE018
KL32TE022
KL32TE027
KL32TE033
KL32TE039
KL32TE047
KL32TE056
KL32TE068
KL32TE082
KL32TER10
KL32TER12
KL32TER15
KL32TER18
KL32TER22
KL32TER27
KL32TER33
KL32TER39
KL32TER47
KL32TER56
KL32TER68
KL32TER82
KL32TE1R0
KL32TE1R2
KL32TE1R5
KL32TE1R8
KL32TE2R2
KL32TE2R7
KL32TE3R3
KL32TE3R9
KL32TE4R7
KL32TE5R6
KL32TE6R8
KL32TE8R2
KL32TE100
0.005
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
M (± 20%)
11
15
17
19
21
2700
2500
2300
2100
1900
1700
1500
1400
1300
1200
1100
1000
900
700
500
450
400
350
320
300
250
220
180
160
140
120
100
85
0.12
0.13
0.14
0.16
0.18
0.20
0.22
0.24
0.27
0.30
0.33
0.36
0.40
0.44
0.22
0.25
0.28
0.32
0.36
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.85
0.90
1.0
K (± 10%)
M (± 20%)
23
25
26
100
27
28
450
25.2
J (± 5%)
K (± 10%)
M (± 20%)
400
390
370
350
320
290
260
250
220
200
180
170
150
30
1.2
1.5
1.8
80
2.2
75
2.7
70
1.1
3.3
60
1.2
7.96
2.52
3.9
55
1.3
4.7
50
1.5
5.6
47
1.6
6.8
43
1.8
8.2
40
2.0
10
36
2.1
: Inductance tolerance (J, K or M)
PAGE 2 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
Rating Table-1 Continued
Nominal
Inductance
(µH)
Quality Self Resonant
Factor Frequency Resistance DC Current Frequency
(typ.) (typ.) (MHz)
DC
Allowable Measuring
Ordering
Code*
Inductance
Tolerance
(typ.) (Ω)
(typ.) (mA)
(MHz)
KL32TE120
12
15
33
30
27
25
2.5
2.8
3.3
3.7
5.0
5.6
6.4
7.0
8.0
9.0
140
130
120
110
80
KL32TE150
KL32TE180
KL32TE220
KL32TE270
KL32TE330
KL32TE390
KL32TE470
KL32TE560
KL32TE680
KL32TE820
KL32TE101
KL32TE121
KL32TE151
KL32TE181
KL32TE221
KL32TE271
KL32TE331
18
22
27
20
30
17
33
70
2.52
39
16
15
13
12
11
65
47
60
J (± 5%)
K (± 10%)
M (± 20%)
56
55
68
50
82
45
10
100
120
150
180
220
270
330
40
10
8
11
15
17
21
28
34
70
65
20
60
0.796
7
6
5
50
: Inductance tolerance (J, K or M)
4. Dimensions
Dimensions: Inches (mm)
Weight: Approximately 50 mg
221
0.126
0.098
(2.5 ± 0.2)
(3.2 ± .02)
0.20
(0.5)
0.067
(1.7 ± 0.1)
PAGE 3 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
5. Marking
Marking Method
10 to 330µH
The first two figures are significant
figures while the last figure shall show
the number zero.
The nominal inductance shall be expressed
in “µH” and consist of a number of three
figures. No tolerance of inductance shall
be indicated.
(Example of marking)
005
1R0
010
100
R10
101
0.005µH
1.0µH
0.010µH
10µH
0.10µH
100µH
0.005 to 0.082µH
The three figures express three
decimal places.
0.10 to 8.2µH
A decimal point replaced by an alphabetical
letter “R” shall be significant figures.
6. Construction
1
No.
1
Name
Material
Magnetic Core
High stability ferrite core
2
3
4
Winding Material
Polyurethane
copper wire
4
3
Electrode Terminal Solder plated high cond.
heat resistant copper alloys
Mold Enclosure
Low stress epoxy resin
system (UL94-VO)
7. Measurement Method of L and Q
Nominal Inductance
Range (µH)
Measurement
Method
Measuring
Frequency (MHz)
0.005 ~ 0.10
0.12 ~ 0.82
100
Please see Method-1
Please see Method-2
25.2
1.0 ~ 8.2
10 ~ 82
7.96
2.52
100 ~ 330
0.796
PAGE 4 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
TN-100
7. Measurement Method of L and Q Continued
Method-1
Test Equipment:
Fixture:
Electrical Length:
Setting:
Hewlett Packard RF Impedance analyzer 4191A
Hewlett Packard Spring clip fixture 16092A
2.10 cm
Please see the following figure
KL32
Slide Clip Terminal
Center Post
0.087
(2.2)
Spacer (Unmagnetic Insulator)
Method-2
Test Equipment:
Fixture:
OSC Level:
Hewlett Packard LF Impedance analyzer 4192
Hewlett Packard Test fixture 16034E
0.3 V
8. Test Condition
Unless otherwise specified, the test shall be performed in accordance
with JIS-C-5202 specifying marking measurements as follows:
Ambient temperature: 20 ± 15°C
Relative humidity:
65 ± 20%
If there may be any doubt on results, measurements shall be made
within the following limits:
Ambient temperature: 20 ± 2°C
Relative humidity:
65 ± 5%
PAGE 5 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
9. Reliability Data
9-1 Electrical Characteristics
Item
Requirement
Test Method
DC Bias
Characteristic
∆ L/L: Within - 10%
Measure inductance with application
of rated current using LCR meter to
compare it with the initial value.
Dielectric
Withstanding
Voltage
No fuming, flaming,
or breakdown
5 seconds at DC 1000V between
terminal 1 (one electrode of inductor)
and terminal 2 (the thin copper wire
which is wound around the inductor
more than twice).
Insulation
Resistance
More than 1000MΩ
Measure resistance immediately after
1 minute passed since DC 500V was
applied between terminal 1 and 2.
9-2 Mechanical Characteristics
Item
Requirement
No damage
Test Method
Terminal Pull
Strength
Terminals shall withstand a pull
of 0.5kgf in a horizontal direction.
Terminal Bending
Strength
No damage
Specimen shall be soldered on PCB-A
(see figure below) and support by
applying strength so that the bending
width becomes 10 mm.
0.197 (5.0)
Adhesive Agent Spreading Area
Thickness: 1.6 mm
Material: Paper Phenol
0.039 (1.0)
1.575 (40.0)
ø 0.177
(ø 4.5)
(a) Board
0.087 (2.2)
0.079 (2.0)
0.197 (5.0)
3.937 (100.0)
(b) Install
Solder Resist
0.063 (1.6)
1.77 (45.0)
Soldering
1.77 (45.0)
ø 0.394 x 1.969
(ø 10 x 50) (Support Stick)
Units: inches (mm)
Chip Inductor
PAGE 6 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
9-2 Mechanical Characteristics Continued
Item
Vibration
Requirement
Test Method
No significant abnormality in
appearance
∆ L/L: Within ± 3%
2 hours in each X, Y and Z directions
on PCB-B (see figure below) at a
frequency range of 10 to 55 to 10 Hz
(1 min.) with 1.5 mm amplitude.
Thickness: 1.6 mm
Material: Glass Epoxy
Adhesive Agent Spreading Area
Solder Resist
0.118 (3.0)
0.110 (2.8)
0.059 (1.5)
0.039 (1.0)
0.157 (4.0)
0.118
(3.0)
0.984 (25.0)
0.276
(7.0)
0.118
(3.0)
0.087
(2.2)
0.079
(2.0)
0.079 ~ 0.138 (2.0 ~ 3.5)
0.098 (2.5)
Terminal Connection
0.082 (2.08)
2.180 (55.38)
2.436 or more (2.441 to 2.559)
(61.88 or more) (62 to 65)
Units: inches (mm)
Resistance to
Solder Heat
No significant abnormality in
appearance
∆ L/L: Within ± 3%
Immerse in the solder (H63A)
of 260 ± 5°C for 10 ± 1 sec.
Solderability
Drop Test
Over 95% of electrode surface
shall be covered with solder
Immerse in the solder (H63A)
of 230 ± 5°C for 3 ± 0.5 sec.
No significant abnormality in
appearance
Drop from a height of 1 m to the ground
of concrete or tile 1 time.
∆ L/L: Within ± 3%
PAGE 7 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
9-3 Environmental Characteristics *
Item
Requirement
Test Method
Low Temperature
Life Test
∆ L/L: Within ± 5%
∆ Q/Q: Within ± 20%
Store at -40 ± 2°C for 1000 hours.
High Temperature
Life Test
∆ L/L: Within ± 5%
∆ Q/Q: Within ± 30%
Store at 100 ± 2°C for 1000 hours.
Thermal Shock
∆ L/L: Within ± 5%
∆ L/L: Within ± 10%
100 cycles between -25 ± 2°C /
1 hour and +100 ± 2°C.
Temperature
Characteristic
Measure ∆ L/L at the temperature of
between -25°C and +100°C as based
on the temperature of 20°C.
Humidity
∆ L/L: Within ± 5%
∆ Q/Q: Within ± 30%
Store at 40 ± 2°C, 90 to 95% RH
for 1000 hours.
Humidity Loading
Test
∆ L/L: Within ± 5%
∆ Q/Q: Within ± 30%
Apply rated current continuously at
40 ± 2°C, 90 to 95% RH for 1000 hours.
High Temperature
Loading Test
∆ L/L: Within ± 5%
∆ Q/Q: Within ± 30%
Apply rated current continuously at
100 ± 2°C for 1000 hours.
Solvent
Resistance
No outstanding damage and
markings can be easily judged
According to MIL-STD-202F Method
215 (1990).
* Unless otherwise specified, at least one hour of recovery under the normal temperature and normal humidity after
the test, followed by the measurement within two hours.
PAGE 8 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
10. Packaging
10-1Bulk Packaging
Bulk products shall be packed 1,000 pieces in a poly bag.
Marking item for bag shall be following form.
(Marking item)
(1) Type designation
(3) Quantity
(5) Manufacturer's name
(2) Nominal inductance
(4) Production lot number (6) Tolerance
10-2 Taping
The tapes for taping shall be embossed carrier tapes of .315" (8 mm) width and .157" (4 mm)
pitch. The standard quantity per reel shall be 2,000 pieces.
(1) Dimensions of carrier tape Dimensions in inches (mm)
The top tape requires a peel-off force
of 15 to 60 gf.
A
B
W
E
.140 (3.55 ± 0.10)
.106 (2.70 ± 0.10)
.315 (8.00 ± 0.10)
.069 (1.75 ± 0.10)
.138 (3.50 ± 0.05)
.106 (2.70 ± 0.15)
T2
P0
.011 (0.28 ± 0.05)
.157 (4.00 ± 0.10)
.157 (4.00 ± 0.10)
.079 (2.00 ± 0.05)
P1
P2
0.1
0
F
øD*
øD1
.059 (1.50 ±
.039 (1.00 ±
)
0
0.2
0.2
0
0
T1
)
* 20 pitches accumulation of sprocket
holes shall be 80.00 ± 0.15 mm.
T2
P0
E
øD
P2
øD1
F
W
Direction of mark
A
T1
B
P1
Tape running direction
Blank portions
300 mm or more
Blank portions
230 mm or more
Leader
270 mm or more
Chip cavity
End
Beginning
Top tape
Empty
Empty
Tape running direction
PAGE 9 OF 12
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Bolivar Drive
P.O. Box 547
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USA
814-362-5536
Fax 814-362-8883
TN-100
(2) Reel dimensions
Dimensions in inches (mm)
7.087
Marking
place
(180 ± 30 )
(Marking item)
0.079
(2.0 ± 0.5)
(1) Type designation
(2) Nominal inductance and tolerance
(3) Quantity
0.512
(13 ± 0.2)
2.362
(60 ± 01 )
(4) Production lot number
(5) Manufacturer's name
0.354 (9.0 ± 0.3)
0.449 (11.4 ± 1.0)
0.413
(R10.5 ± 0.4)
11.
Recommended Soldering Condition
0.197 (5.0)
0.087 (2.2)
11-1 Dimensions of Standard Land
The following figure is recommended
land dimensions.
When two or more chip inductors are closely
mounted, they must be separated by means
of solder resists to prevent excessive solder.
0.079
(2.0)
Dimensions in inches (mm)
KL32
0.055 (1.4)
11-2 Soldering Condition
Wave soldering should be done at 260°C
for less than 10 seconds. Reflow soldering
should be done at 240°C for less than 20
seconds. (Please see the following figures.)
When using a soldering iron, temperature
shall not exceed 350°C and within three
seconds. Soldering iron time shall be
allowed only one time. After soldering, chip
inductors shall not be stressed excessively.
Recommended Temperature Profile
for Wave Soldering
Recommended Temperature Profile
for Reflow Soldering
Preheat 120
Seconds Max.
Soldering
10 Seconds Max.
Natural
Cooling
Preheat 120
Seconds Max.
Soldering
20 Seconds Max.
Natural
Cooling
260°C
240°C
150°C
100°C
150°C
100°C
PAGE 10 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
12. Mounting
Placement force should not be excessive.
13. Recommended Washing Condition
Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration.
If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation
before practical use since such cleaning units considerably differ in vibration level and mode.
Although the conditions differ depending on the printed board size, ultrasonic cleaning is generally
used in the conditions described below as examples:
Ultrasonic power: Within 20W/1
Cleaning times: Within 5 minutes
14. Storage
Chip inductors should not be stored under high temperature and high humidity conditions.
In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise,
the packing material may be deformed, causing problems during mounting.
PAGE 11 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
TN-100
PAGE 12 OF 12
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Bolivar Drive
P.O. Box 547
Bradford, PA 16701
USA
814-362-5536
Fax 814-362-8883
www.koaspeer.com
AHA 10/99
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