KL32TTE151 [KOA]

Chip Inductors; 片式电感
KL32TTE151
型号: KL32TTE151
厂家: KOA SPEER ELECTRONICS, INC.    KOA SPEER ELECTRONICS, INC.
描述:

Chip Inductors
片式电感

文件: 总8页 (文件大小:131K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TN-100 R3  
AHA 10/13/06  
CERTIFIED  
Chip Inductors  
CERTIFIED  
Type KL32 Series  
1. Scope  
This specification applies to Chip Inductors (KL32)  
produced by KOA Corporation.  
2. Type Designation  
The type designation shall be the following form:  
KL  
Type  
32  
Size  
T
TE  
101  
J
Termination  
Material  
Nominal  
Tolerance  
Packaging  
Inductance  
1210  
T: Sn  
TE: 7" embossed plastic  
(2,000 pieces/reel)  
Reference  
inductance  
marking chart  
J: 5%  
K: 10%  
M: 20%  
(Other termination  
styles available,  
contact factory  
for options)  
TED: 10" embossed plastic  
(4,000 pieces/reel)  
3. Dimensions and Construction  
Dimensions inches (mmꢀ  
Type  
KL32  
L
W1  
W2  
t
h
d
.126 .008 .098 .008 .067 .004 .087 .008 .075 .004 .02 nominal  
(3.2±±.2ꢀ (2.5±±.2ꢀ (1.7±±.1ꢀ (2.2±±.2ꢀ (1.9±±.1ꢀ (.5 nominalꢀ  
Inductance Marking  
L
W1  
Value  
0.005µH - 0.082µH  
Code  
005 - 082  
R10 - 8R2  
R indicates decimal point.  
100 - 331  
1st two figures are significant,  
the last figure indicates the  
number of zeros to follow.  
0.10µH - 8.2µH  
10µH - 330µH  
t
h
d
Magnet  
Wire  
Ferrite  
Core  
W2  
Molded  
Resin  
Electrode  
PAGE 1 OF 8  
www.koaspeer.com  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
4. Standard Applications  
Self Resonant  
Frequency  
Minimum  
(MHz)  
DC  
Resistance  
Maximum  
(Ω)  
Allowable  
DC Current  
Maximum  
(mA)  
Quality  
Factor  
Minimum  
Measured  
Frequency  
(MHz)  
Part  
Designation  
Inductance  
(µH)  
Inductance  
Tolerance  
KL32TTE005*  
KL32TTE010*  
KL32TTE012*  
KL32TTE015*  
KL32TTE018*  
KL32TTE022*  
KL32TTE027*  
KL32TTE033*  
KL32TTE039*  
KL32TTE047*  
KL32TTE056*  
KL32TTE068*  
KL32TTE082*  
KL32TTER10*  
KL32TTER12*  
KL32TTER15*  
KL32TTER18*  
KL32TTER22*  
KL32TTER27*  
KL32TTER33*  
KL32TTER39*  
KL32TTER47*  
KL32TTER56*  
KL32TTER68*  
KL32TTER82*  
KL32TTE1R0*  
KL32TTE1R2*  
KL32TTE1R5*  
KL32TTE1R8*  
KL32TTE2R2*  
KL32TTE2R7*  
KL32TTE3R3*  
KL32TTE3R9*  
KL32TTE4R7*  
KL32TTE5R6*  
KL32TTE6R8*  
KL32TTE8R2*  
KL32TTE100*  
KL32TTE120*  
KL32TTE150*  
KL32TTE180*  
KL32TTE220*  
KL32TTE270*  
KL32TTE330*  
KL32TTE390*  
KL32TTE470*  
KL32TTE560*  
KL32TTE680*  
KL32TTE820*  
KL32TTE101*  
KL32TTE121*  
KL32TTE151*  
KL32TTE181*  
KL32TTE221*  
KL32TTE271*  
KL32TTE331*  
0.005  
0.010  
0.012  
0.015  
0.018  
0.022  
0.027  
0.033  
0.039  
0.047  
0.056  
0.068  
0.082  
0.10  
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
0.82  
1.0  
1.2  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
5.6  
6.8  
8.2  
10  
12  
15  
18  
22  
M: 20%  
11  
15  
17  
19  
21  
2700  
2500  
2300  
2100  
1900  
1700  
1500  
1400  
1300  
1200  
1100  
1000  
900  
700  
500  
450  
400  
350  
320  
300  
250  
220  
180  
160  
140  
120  
100  
85  
80  
75  
70  
60  
55  
50  
47  
43  
40  
36  
33  
30  
27  
25  
20  
17  
0.12  
0.13  
0.14  
0.16  
0.18  
0.20  
0.22  
0.24  
0.27  
0.30  
0.33  
0.36  
0.40  
0.44  
0.22  
0.25  
0.28  
0.32  
0.36  
0.40  
0.45  
0.50  
0.55  
0.60  
0.65  
0.70  
0.75  
0.85  
0.90  
1.0  
1.1  
1.2  
1.3  
1.5  
1.6  
1.8  
2.0  
2.1  
2.5  
2.8  
3.3  
3.7  
5.0  
5.6  
6.4  
7.0  
K: 10%  
M: 20%  
23  
25  
26  
100  
27  
28  
450  
J: 5%  
K: 10%  
M: 20%  
25.2  
400  
390  
370  
350  
320  
290  
260  
250  
220  
200  
180  
170  
150  
140  
130  
120  
110  
80  
70  
65  
60  
55  
50  
45  
40  
70  
7.96  
30  
J: 5%  
K: 10%  
M: 20%  
27  
33  
39  
47  
56  
68  
82  
100  
120  
150  
180  
220  
270  
330  
2.52  
16  
15  
13  
12  
8.0  
9.0  
11  
10  
10  
8
11  
15  
17  
21  
28  
34  
65  
60  
20  
0.796  
7
6
5
50  
* Add tolerance character (J, K, M)  
PAGE 2 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
5. Measurement Method of L and Q  
Nominal Inductance  
Range (µH)  
Measurement  
Method  
Measuring  
Frequency (MHz)  
0.005 ~ 0.10  
0.12 ~ 0.82  
100  
Please see Method-1  
25.2  
1.0 ~ 8.2  
10 ~ 82  
7.96  
2.52  
Please see Method-2  
100 ~ 330  
0.796  
Method-1  
Test Equipment:  
Fixture:  
Electrical Length:  
Setting:  
Hewlett Packard RF Impedance analyzer 4191A  
Hewlett Packard Spring clip fixture 16092A  
2.10 cm  
Please see the following figure  
KL32  
Slide Clip Terminal  
Center Post  
0.087  
(2.2)  
Spacer (Unmagnetic Insulator)  
Method-2  
Test Equipment:  
Fixture:  
OSC Level:  
Hewlett Packard LF Impedance analyzer 4192  
Hewlett Packard Test fixture 16034E  
0.3 V  
6. Test Condition  
Unless otherwise specified, the test shall be performed in accordance  
with JIS-C-5202 specifying marking measurements as follows:  
Ambient temperature: 20 15°C  
Relative humidity:  
65 20%  
If there may be any doubt on results, measurements shall be made  
within the following limits:  
Ambient temperature: 20 2°C  
Relative humidity:  
65 5%  
PAGE 3 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
7. Reliability Data  
7-1 Electrical Characteristics  
Item  
Requirement  
Test Method  
DC Bias  
Characteristic  
Δ L/L: Within - 10%  
Measure inductance with application  
of rated current using LCR meter to  
compare it with the initial value.  
Dielectric  
Withstanding  
Voltage  
No fuming, flaming,  
or breakdown  
5 seconds at DC 1000V between  
terminal 1 (one electrode of inductor)  
and terminal 2 (the thin copper wire  
which is wound around the inductor  
more than twice).  
Insulation  
Resistance  
More than 1000MΩ  
Measure resistance immediately after  
1 minute passed since DC 500V was  
applied between terminal 1 and 2.  
7-2 Mechanical Characteristics  
Item  
Requirement  
No damage  
Test Method  
Terminal Pull  
Strength  
Terminals shall withstand a pull  
of 0.5kgf in a horizontal direction.  
Terminal Bending  
Strength  
No damage  
Specimen shall be soldered on PCB-A  
(see figure below) and support by  
applying strength so that the bending  
width becomes 10 mm.  
0.197 (5.0)  
Adhesive Agent Spreading Area  
Thickness: 1.6 mm  
Material: Paper Phenol  
0.039 (1.0)  
1.575 (40.0)  
ø 0.177  
(ø 4.5)  
(a) Board  
0.087 (2.2)  
0.079 (2.0)  
0.197 (5.0)  
3.937 (100.0)  
(b) Install  
Solder Resist  
0.063 (1.6)  
1.77 (45.0)  
Soldering  
1.77 (45.0)  
ø 0.394 x 1.969  
(ø 10 x 50) (Support Stick)  
Units: inches (mm)  
Chip Inductor  
PAGE 4 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
7-2 Mechanical Characteristics Continued  
Item  
Vibration  
Requirement  
Test Method  
No significant abnormality in  
appearance  
Δ L/L: Within 3%  
2 hours in each X, Y and Z directions  
on PCB-B (see figure below) at a  
frequency range of 10 to 55 to 10 Hz  
(1 min.) with 1.5 mm amplitude.  
Thickness: 1.6 mm  
Material: Glass Epoxy  
Adhesive Agent Spreading Area  
Solder Resist  
0.118 (3.0)  
0.110 (2.8)  
0.059 (1.5)  
0.039 (1.0)  
0.157 (4.0)  
0.118  
(3.0)  
0.984 (25.0)  
0.276  
(7.0)  
0.118  
(3.0)  
0.087  
(2.2)  
0.079  
(2.0)  
0.079 ~ 0.138 (2.0 ~ 3.5)  
0.098 (2.5)  
Terminal Connection  
0.082 (2.08)  
2.180 (55.38)  
2.436 or more (2.441 to 2.559)  
(61.88 or more) (62 to 65)  
Units: inches (mm)  
Resistance to  
Solder Heat  
No significant abnormality in  
appearance  
Δ L/L: Within 3%  
Immerse in the solder (H63A)  
of 260 5°C for 10 1 sec.  
Solderability  
Drop Test  
Over 95% of electrode surface  
shall be covered with solder  
Immerse in the solder (H63A)  
of 230 5°C for 3 0.5 sec.  
No significant abnormality in  
appearance  
Δ L/L: Within 3%  
Drop from a height of 1 m to the ground  
of concrete or tile 1 time.  
PAGE 5 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
7-3 Environmental Characteristics *  
Item  
Requirement  
Test Method  
Low Temperature  
Life Test  
Δ L/L: Within 5%  
Δ Q/Q: Within 20%  
Store at -55 2°C for 1000 hours.  
High Temperature  
Life Test  
Δ L/L: Within 5%  
Δ Q/Q: Within 30%  
Store at 100 2°C for 1000 hours.  
Thermal Shock  
Δ L/L: Within 5%  
Δ L/L: Within 10%  
100 cycles between -55 2°C /  
1 hour and +100 2°C / 1 hour.  
Temperature  
Characteristic  
Measure Δ L/L at the temperature of  
between -55°C and +100°C as based  
on the temperature of 20°C.  
Humidity  
Δ L/L: Within 5%  
Δ Q/Q: Within 30%  
Store at 40 2°C, 90 to 95% RH  
for 1000 hours.  
Humidity Loading  
Test  
Δ L/L: Within 5%  
Δ Q/Q: Within 30%  
Apply rated current continuously at  
40 2°C, 90 to 95% RH for 1000 hours.  
High Temperature  
Loading Test  
Δ L/L: Within 5%  
Δ Q/Q: Within 30%  
Apply rated current continuously at  
100 2°C for 1000 hours.  
Solvent  
Resistance  
No outstanding damage and  
markings can be easily judged  
According to MIL-STD-202  
Method 215 (1990).  
Storage  
-55°C to +100°C  
-55°C to +100°C  
–––  
–––  
Temperature Range  
Operating  
Temperature Range  
* Unless otherwise specified, at least one hour of recovery under the normal temperature and normal humidity after  
the test, followed by the measurement within two hours.  
PAGE 6 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
8. Packaging  
8-1 Taping  
The tapes for taping shall be embossed carrier tapes of .315" (8 mm) width and .157" (4 mm)  
pitch. The standard quantity per reel shall be 2,000 pieces.  
(1) Dimensions of carrier tape Dimensions in inches (mm)  
The top tape requires a peel-off force  
of 15 to 60 gf.  
A
B
W
E
.140 (3.55 0.10)  
.106 (2.70 0.10)  
.315 (8.00 0.10)  
.069 (1.75 0.10)  
.138 (3.50 0.05)  
.106 (2.70 0.15)  
T2  
P0  
.011 (0.28 0.05)  
.157 (4.00 0.10)  
.157 (4.00 0.10)  
.079 (2.00 0.05)  
P1  
P2  
0.1  
0.1  
0
F
øD*  
øD1  
.059 (1.50  
.039 (1.00  
)
0
* 20 pitches accumulation of sprocket  
holes shall be 80.00 0.15 mm.  
0.2  
0.2  
0
0
)
T1  
T2  
P0  
E
øD  
P2  
øD1  
F
W
Direction of mark  
A
T1  
B
P1  
Tape running direction  
Blank portions  
300 mm or more  
Blank portions  
230 mm or more  
Leader  
270 mm or more  
Chip cavity  
End  
Beginning  
Top tape  
Empty  
Empty  
Tape running direction  
(2) Reel dimensions  
Dimensions in inches (mm)  
7.087  
Marking  
place  
0
(180  
)
3
(Marking item)  
0.079  
(2.0 0.5)  
(1) Type designation  
(2) Nominal inductance and tolerance  
(3) Quantity  
0.512  
(13 0.2)  
2.362  
1
0
(60  
)
(4) Production lot number  
(5) Manufacturer's name  
0.354 (9.0 0.3)  
0.449 (11.4 1.0)  
0.413  
(R10.5 0.4)  
PAGE 7 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
TN-100 R3  
9. Recommended Soldering Condition  
9-1 Dimensions of Standard Land  
0.197 (5.0)  
0.087 (2.2)  
The following figure is recommended  
land dimensions.  
0.079  
(2.0)  
When two or more chip inductors are closely  
mounted, they must be separated by means  
of solder resists to prevent excessive solder.  
Dimensions in inches (mm)  
KL32  
0.055 (1.4)  
9-2 Soldering Condition  
Wave soldering should be done at 260°C  
for less than 10 seconds. Reflow soldering  
should be done at 240°C for less than 20  
seconds. (Please see the following figures.)  
When using a soldering iron, temperature shall  
not exceed 350°C and within three seconds.  
Soldering iron time shall be allowed only one  
time. After soldering, chip inductors shall not  
be stressed excessively.  
Recommended Temperature Profile  
for Wave Soldering  
Recommended Temperature Profile  
for Reflow Soldering  
Preheat 120  
Seconds Max.  
Soldering  
10 Seconds Max.  
Natural  
Cooling  
Preheat 120  
Seconds Max.  
Soldering  
20 Seconds Max.  
Natural  
Cooling  
260°C  
240°C  
150°C  
100°C  
150°C  
100°C  
10. Mounting  
Placement force should not be excessive.  
11. Recommended Washing Condition  
Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration.  
If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation before  
practical use since such cleaning units considerably differ in vibration level and mode. Although the conditions  
differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described  
below as examples:  
Ultrasonic power:  
Cleaning times:  
Within 20W/1  
Within 5 minutes  
12. Storage  
Chip inductors should not be stored under high temperature and high humidity conditions.  
In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise,  
the packing material may be deformed, causing problems during mounting.  
PAGE 8 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  

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